FCC ID: XMR202201SC20AX Smart LTE Module with Wi-Fi & Bluetooth

 

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/5694588.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case SC20 Series Hardware Design Smart Module Series Version: 3.0.0 Date: 2021-07-30 Status: Preliminary Smart Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to support@quectel.com. General Notes Quectel offers the information as a service to its customers. The information provided is based upon customers requirements. Quectel makes every effort to ensure the quality of the information it makes available. Quectel does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. All information supplied herein is subject to change without prior notice. Disclaimer While Quectel has made efforts to ensure that the functions and features under development are free from errors, it is possible that these functions and features could contain errors, inaccuracies and omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind, implied or express, with respect to the use of features and functions under development. To the maximum extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of the functions and features under development, regardless of whether such loss or damage may have been foreseeable. Duty of Confidentiality The Receiving Party shall keep confidential all documentation and information provided by Quectel, except when the specific permission has been granted by Quectel. The Receiving Party shall not access or use Quectels documentation and information for any purpose except as expressly provided herein. Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information to any third party without the prior written consent by Quectel. For any noncompliance to the above requirements, unauthorized use, or other illegal or malicious use of the documentation and information, Quectel will reserve the right to take legal action. SC20_Series_Hardware_Design 1 / 133 Smart Module Series Copyright The information contained here is proprietary technical information of Quectel. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. SC20_Series_Hardware_Design 2 / 133 Smart Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. SC20_Series_Hardware_Design 3 / 133 Smart Module Series About the Document Revision History Version Date Author Description 1.0 1.1 1.2 1.3 2016-04-12 Tony GAO Initial 2016-05-04 Mark ZHANG 1. Updated RF Receiving Sensitivity 2. Updated Operation Temperature 2016-07-22 Sea BAI Added Chapters 2.4, 3.63.22, 4, 5 and 9 2016-08-19 Sea BAI Updated Charging Parameters in Table 41 1. Modified the name of SC20-CE to SC20-CE R1.1 2. Added the frequency bands of SC20-E, SC20-A, SC20-AU and SC20-J modules

(Tables 2, 3, 4 and 5) 3. Added descriptions of Wi-Fi 5GHz frequency band (Tables 27, 28 and 35) 4. Updated SC20 series operating frequencies

(Table 33) 5. Updated reference circuit design for GNSS passive antenna (Figure 37) 6. Updated antenna requirements (Table 38) 7. Added the current consumption of SC20-E, SC20-A, SC20-AU and SC20-J (Tables 44, 45, 46 and 47) 8. Updated RF output power (Table 48) 9. Added the RF receiving sensitivity of SC20-E, SC20-A, SC20-AU and SC20-J (Tables 50, 51, 52 and 53) 1. Added the frequency bands of SC20-EU in Table 6. 2. Added a comment for RESET_N in Table 9. 1.4 2017-10-17 Sea BAI/

Beny ZHU/

Jenson WU 1.5 2018-09-27 Camphor DUAN/

Ted ZHOU SC20_Series_Hardware_Design 4 / 133 Smart Module Series 3. Added the description that the GPIO_68 and GPIO_88 cannot be pulled up during start-up in Table 9 and Chapter 3.14. 4. Updated the turning on timing of the module

(Figure 8). 5. Added the description for SPI interface in Chapter 3.14. 6. Added the description that the effective resolution of ADC interfaces is 12 bits in Chapter 3.16. 7. Added the current consumption of SC20-EU in Table 55. 8. Updated the RF receiving sensitivity of SC20-A, SC20-AU and SC20-J in Table 59, 60 and 61. 9. Added the RF receiving sensitivity of SC20-EU in Table 62. 10. Updated the reflow soldering thermal profile and the related parameters in Chapter 9.2. 1.6 2019-01-10 Pat ZHANG Updated the GNSS sensitivity in Table 33. 2.0 2020-01-19 Arsene TONG 2.1 2020-11-13 Arsene TONG/

Ted ZHOU 3.0.0 2021-07-30 Ming CHEN/

Downey YANG/

Kevin ZHOU 1. Added the information of Linux-version modules SC20-CEL R1.1, SC20-EL, SC20-AL, SC20-AUL and SC20-JL. 2. Deleted SC20-EU and its related information. 1. Added SC20-EU and its related information. 2. Updated the operating temperature range in Chapter 2.2/7.4. 3. Updated general description of storage, manufacturing and soldering in Chapter 9.1/9.2. Preliminary:

1. Added SC20-AX/EX and the related information. 2. Added the notes of coating and cleaning in Chapter 9.2. SC20_Series_Hardware_Design 5 / 133 Smart Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 6 Table Index ................................................................................................................................................... 9 Figure Index ............................................................................................................................................... 11 1 Introduction ........................................................................................................................................ 13 2 Product Overview .............................................................................................................................. 14 2.1. General Description ................................................................................................................. 14 Key Features ........................................................................................................................... 17 2.2. Functional Diagram ................................................................................................................. 20 2.3. EVB .......................................................................................................................................... 21 2.4. 3.5. 3 Application Interfaces ....................................................................................................................... 22 3.1. General Description ................................................................................................................. 22 Pin Assignment ........................................................................................................................ 23 3.2. Pin Description ......................................................................................................................... 24 3.3. Power Supply ........................................................................................................................... 34 3.4. 3.4.1. Power Supply Pins ......................................................................................................... 34 3.4.2. Voltage Stability Requirements ...................................................................................... 34 3.4.3. Reference Design for Power Supply .............................................................................. 36 Turn on and off Scenarios ....................................................................................................... 36 3.5.1. Turn on with PWRKEY ................................................................................................... 36 3.5.2. Turn off ........................................................................................................................... 38 VRTC Interface ........................................................................................................................ 39 3.6. Power Output ........................................................................................................................... 40 3.7. Battery Charging and Management ........................................................................................ 40 3.8. 3.9. USB Interface .......................................................................................................................... 42 3.10. UART Interfaces ...................................................................................................................... 44

(U)SIM Interfaces..................................................................................................................... 46 3.11. 3.12. SD Card Interface .................................................................................................................... 48 3.13. GPIO Interfaces ....................................................................................................................... 50 3.14. SPI Interface ............................................................................................................................ 52 3.15. I2C Interfaces .......................................................................................................................... 53 3.16. ADC Interfaces ........................................................................................................................ 54 3.17. Motor Drive Interface ............................................................................................................... 54 3.18. LCM Interface .......................................................................................................................... 55 3.19. Touch Panel Interface .............................................................................................................. 58 3.20. Camera Interfaces ................................................................................................................... 59 3.20.1. Rear Camera Interface................................................................................................... 59 3.20.2. Front Camera Interface .................................................................................................. 60 3.20.3. Design Considerations ................................................................................................... 62 SC20_Series_Hardware_Design 6 / 133 Smart Module Series 3.21. Sensor Interfaces..................................................................................................................... 63 3.22. Audio Interfaces ....................................................................................................................... 64 3.22.1. Reference Circuit Design for Microphone Interface ....................................................... 65 3.22.2. Reference Circuit Design for Earpiece Interface ........................................................... 66 3.22.3. Reference Circuit Design for Headphone Interface ....................................................... 66 3.22.4. Reference Circuit Design for Loudspeaker Interface..................................................... 67 3.22.5. Audio Interfaces Design Considerations........................................................................ 67 3.23. Emergency Download Interface .............................................................................................. 68 4 Wi-Fi and Bluetooth ........................................................................................................................... 69 4.1. Wi-Fi Overview ........................................................................................................................ 69 4.1.1. Wi-Fi Performance ......................................................................................................... 69 Bluetooth Overview ................................................................................................................. 71 4.2.1. Bluetooth Performance .................................................................................................. 72 4.2. 5 GNSS ................................................................................................................................................... 73 5.1. GNSS Performance ................................................................................................................. 73 5.2. GNSS RF Design Guidelines .................................................................................................. 74 6 Antenna Interfaces ............................................................................................................................. 75 6.1. Main/Rx-diversity Antenna Interfaces ...................................................................................... 75 6.1.1. Operating Frequency ..................................................................................................... 75 6.1.2. Main and Rx-diversity Antenna Interfaces Reference Design ....................................... 80 6.2. Wi-Fi/Bluetooth Antenna Interface ........................................................................................... 80 6.3. GNSS Antenna Interface ......................................................................................................... 81 6.3.1. Recommended Circuit for Passive Antenna .................................................................. 82 6.3.2. Recommended Circuit for Active Antenna ..................................................................... 82 6.4. Reference Design for RF Layout ............................................................................................. 83 Antenna Installation ................................................................................................................. 85 6.5. 6.5.1. Antenna Requirements .................................................................................................. 85 6.5.2. Recommended RF Connector for Antenna Installation ................................................. 86 7 Reliability, Radio and Electrical Characteristics ............................................................................ 89 Absolute Maximum Ratings ..................................................................................................... 89 7.1. Power Supply Ratings ............................................................................................................. 89 7.2. 7.3. Charging Performance Specifications ..................................................................................... 90 7.4. Operating and Storage Temperatures ..................................................................................... 91 Power Consumption ................................................................................................................ 91 7.5. 7.6. Tx Power ................................................................................................................................ 114 7.7. Rx Sensitivity ......................................................................................................................... 115 ESD ........................................................................................................................................ 122 7.8. 8 Mechanical Information ................................................................................................................... 123 8.1. Mechanical Dimensions ......................................................................................................... 123 8.2. Recommended Footprint ....................................................................................................... 125 Top and Bottom Views ........................................................................................................... 126 8.3. SC20_Series_Hardware_Design 7 / 133 Smart Module Series 9 Storage, Manufacturing and Packaging ........................................................................................ 127 9.1. Storage Conditions ................................................................................................................ 127 9.2. Manufacturing and Soldering ................................................................................................ 128 Packaging Specification ......................................................................................................... 129 9.3. 10 Appendix References ...................................................................................................................... 131 SC20_Series_Hardware_Design 8 / 133 Smart Module Series Table Index Table 1: SC20-CE R1.1/-CEL R1.1 Frequency Bands .............................................................................. 14 Table 2: SC20-E/-EL/-EX Frequency Bands .............................................................................................. 15 Table 3: SC20-A/-AL/-AX Frequency Bands .............................................................................................. 15 Table 4: SC20-AU/-AUL Frequency Bands ................................................................................................ 16 Table 5: SC20-J/-JL Frequency Bands ...................................................................................................... 16 Table 6: SC20-EU Frequency Bands ......................................................................................................... 17 Table 7: Key Features ................................................................................................................................ 17 Table 8: I/O Parameters Definition ............................................................................................................. 24 Table 9: Pin Description ............................................................................................................................. 24 Table 10: Power Description ...................................................................................................................... 40 Table 11: Pin Definition of USB Interface ................................................................................................... 42 Table 12: USB Trace Length Inside the Module ........................................................................................ 44 Table 13: Pin Definition of UART Interfaces ............................................................................................... 44 Table 14: Pin Definition of (U)SIM Interfaces ............................................................................................. 46 Table 15: Pin Definition of SD Card Interface ............................................................................................ 48 Table 16: SD Card Trace Length Inside the Module .................................................................................. 49 Table 17: Pin Definition of GPIO Interfaces ............................................................................................... 50 Table 18: Pin Definition of SPI Interface .................................................................................................... 53 Table 19: Pin Definition of I2C Interfaces ................................................................................................... 53 Table 20: Pin Definition of ADC Interfaces ................................................................................................. 54 Table 21: Pin Definition of Motor Drive Interface ....................................................................................... 55 Table 22: Pin Definition of LCM Interface .................................................................................................. 55 Table 23: Pin Definition of Touch Panel Interface ...................................................................................... 58 Table 24: Pin Definition of Rear Camera Interface .................................................................................... 59 Table 25: Pin Definition of Front Camera Interface .................................................................................... 61 Table 26: MIPI Trace Length Inside the Module ........................................................................................ 63 Table 27: Pin Definition of Sensor Interfaces ............................................................................................. 64 Table 28: Pin Definition of Audio Interfaces ............................................................................................... 64 Table 29: Wi-Fi Transmitting Performance ................................................................................................. 69 Table 30: Wi-Fi Receiving Performance ..................................................................................................... 70 Table 31: Bluetooth Data Rate and Version ............................................................................................... 71 Table 32: Bluetooth Transmitting and Receiving Performance .................................................................. 72 Table 33: GNSS Performance .................................................................................................................... 73 Table 34: Pin Definition of Main/Rx-diversity Antenna Interfaces .............................................................. 75 Table 35: SC20-CE R1.1/-CEL R1.1 Operating Frequencies .................................................................... 75 Table 36: SC20-E/-EL/-EX Operating Frequencies ................................................................................... 76 Table 37: SC20-A/-AL/-AX Operating Frequencies ................................................................................... 77 Table 38: SC20-AU/-AUL Operating Frequencies ..................................................................................... 78 Table 39: SC20-J/-JL Operating Frequencies ............................................................................................ 78 Table 40: SC20-EU Module Operating Frequencies ................................................................................. 79 Table 41: Pin Definition of Wi-Fi/Bluetooth Antenna Interface ................................................................... 80 SC20_Series_Hardware_Design 9 / 133 Smart Module Series Table 42: Wi-Fi/Bluetooth Frequency ......................................................................................................... 80 Table 43: Pin Definition of GNSS Antenna Interface ................................................................................. 81 Table 44: GNSS Frequency ....................................................................................................................... 82 Table 45: Antenna Requirements ............................................................................................................... 85 Table 46: Absolute Maximum Ratings ........................................................................................................ 89 Table 47: Module Power Supply Ratings ................................................................................................... 89 Table 48: Charging Performance Specifications ........................................................................................ 90 Table 49: Operating and Storage Temperatures ........................................................................................ 91 Table 50: SC20-CE R1.1/-CEL R1.1 Current Consumption ...................................................................... 91 Table 51: SC20-E/-EL Current Consumption ............................................................................................. 93 Table 52: SC20-EX Current Consumption ................................................................................................. 97 Table 53: SC20-A/-AL Current Consumption ........................................................................................... 100 Table 54: SC20-AX Current Consumption ............................................................................................... 103 Table 55: SC20-AU/-AUL Current Consumption ...................................................................................... 105 Table 56: SC20-J/-JL Current Consumption ............................................................................................ 109 Table 57: SC20-EU Current Consumption ............................................................................................... 110 Table 58: RF Output Power ...................................................................................................................... 114 Table 59: SC20-CE R1.1/-CEL R1.1 RF Receiving Sensitivity ................................................................ 115 Table 60: SC20-E/-EL RF Receiving Sensitivity ...................................................................................... 116 Table 61: SC20-EX RF Receiving Sensitivity .......................................................................................... 117 Table 62: SC20-A/-AL RF Receiving Sensitivity ...................................................................................... 118 Table 63: SC20-AX RF Receiving Sensitivity .......................................................................................... 119 Table 64: SC20-AU/-AUL RF Receiving Sensitivity ................................................................................. 119 Table 65: SC20-J/-JL RF Receiving Sensitivity ........................................................................................ 120 Table 66: SC20-EU RF Receiving Sensitivity .......................................................................................... 121 Table 67: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) .................................................... 122 Table 68: Recommended Thermal Profile Parameters ............................................................................ 129 Table 69: Reel Packaging ........................................................................................................................ 130 Table 70: Related Documents .................................................................................................................. 131 Table 71: Terms and Abbreviations .......................................................................................................... 131 SC20_Series_Hardware_Design 10 / 133 Smart Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 21 Figure 2: Pin Assignment (Top View) ......................................................................................................... 23 Figure 3: Voltage Drop Sample .................................................................................................................. 35 Figure 4: Star Structure of the Power Supply ............................................................................................. 35 Figure 5: Reference Circuit of Power Supply ............................................................................................. 36 Figure 6: Turn on the Module Using Driving Circuit ................................................................................... 37 Figure 7: Turn on the Module Using Keystroke ......................................................................................... 37 Figure 8: Timing of Turning on Module ...................................................................................................... 38 Figure 9: Timing of Turning off Module ...................................................................................................... 39 Figure 10: RTC Powered by Coin Cell ....................................................................................................... 39 Figure 11: RTC Powered by Capacitor ...................................................................................................... 39 Figure 12: Reference Design for Battery Charging Circuit ........................................................................ 41 Figure 13: USB Interface Reference Design (OTG is not Supported) ....................................................... 43 Figure 14: USB Interface Reference Design (OTG is Supported) ............................................................. 43 Figure 15: Reference Circuit with Level Translator Chip (for UART1) ....................................................... 45 Figure 16: RS-232 Level Match Circuit (for UART1) ................................................................................. 45 Figure 17: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector ........................ 47 Figure 18: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector .......................... 47 Figure 19: Reference Circuit for SD Card Interface ................................................................................... 49 Figure 20: Reference Circuit for Motor Connection ................................................................................... 55 Figure 21: Reference Circuit Design for LCM Interface ............................................................................. 57 Figure 22: Reference Design for External Backlight Driving Circuit .......................................................... 57 Figure 23: Reference Circuit Design for TP Interface ................................................................................ 58 Figure 24: Reference Circuit Design for Rear Camera Interface .............................................................. 60 Figure 25: Reference Circuit Design for Front Camera Interface .............................................................. 62 Figure 26: Reference Circuit Design for Microphone Interface ................................................................. 65 Figure 27: Reference Circuit Design for Earpiece Interface ...................................................................... 66 Figure 28: Reference Circuit Design for Headphone Interface .................................................................. 66 Figure 29: Reference Circuit Design for Loudspeaker Interface ............................................................... 67 Figure 30: Reference Circuit Design for Emergency Download Interface ................................................. 68 Figure 31: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces ................................. 80 Figure 32: Reference Circuit Design for Wi-Fi/Bluetooth Antenna ............................................................ 81 Figure 33: Reference Circuit Design for GNSS Passive Antenna ............................................................. 82 Figure 34: Reference Circuit Design for GNSS Active Antenna ................................................................ 83 Figure 35: Microstrip Design on a 2-layer PCB ......................................................................................... 83 Figure 36: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 84 Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 84 Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 84 Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 87 Figure 40: Mechanicals of U.FL-LP Connectors ........................................................................................ 87 Figure 41: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 88 SC20_Series_Hardware_Design 11 / 133 Smart Module Series Figure 42: Module Top and Side Dimensions .......................................................................................... 123 Figure 43: Module Bottom Dimensions (Top View) .................................................................................. 124 Figure 44: Recommended Footprint (Top View) ...................................................................................... 125 Figure 45: Top and Bottom Views of the Module ..................................................................................... 126 Figure 46: Recommended Reflow Soldering Thermal Profile ................................................................. 128 Figure 47: Tape Dimensions .................................................................................................................... 130 Figure 48: Reel Dimensions ..................................................................................................................... 130 SC20_Series_Hardware_Design 12 / 133 Smart Module Series 1 Introduction This document defines SC20 series module and its air interfaces and hardware interfaces which are related to your application. This document helps you quickly understand module interface specifications, electrical and mechanical details as well as other related information of the module. Associated with application notes and user guides, you can use the module to design and set up mobile applications easily.

[Quectel Wireless Solutions Co., Ltd.] declares Hereby, type

[SC20-E/SC20-EL/SC20-EX] is in compliance with Directive 2014/53/EU. As well as the UK Radio Equipment Regulations SI 2017 No. 1206. The full text of the EU/UK declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm radio equipment that the The device could be used with a separation distance of 20cm to the human body. The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range. SC20_Series_Hardware_Design 13 / 133 Smart Module Series 2 Product Overview 2.1. General Description SC20 is a series of Smart LTE modules based on Android/Linux operating systems, which provide industrial grade performance. Its general features are listed below:

Supports worldwide LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, TD-SCDMA, EVDO/CDMA, EDGE and GPRS coverage. Supports short-range wireless communication via Wi-Fi 802.11a/b/g/n and Bluetooth 4.2 LE. Integrates GPS/BeiDou/GLONASS or GPS/BeiDou/Galileo satellite positioning systems. Supports multiple audio and video codecs. Enables smooth play of 720P videos. Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces. Integrates built-in high performance AdrenoTM 304 graphics processing unit. SC20 series is composed of Android version and Linux version. Android version includes SC20-CE R1.1, SC20-E, SC20-A, SC20-AU, SC20-J, SC20-EU. Linux version includes SC20-CEL R1.1, SC20-EL, SC20-AL, SC20-AUL, SC20-JL, SC20-AX, SC20-EX. The following tables show the supported frequency bands and network standards of SC20 series. Table 1: SC20-CE R1.1/-CEL R1.1 Frequency Bands Mode LTE-FDD LTE-TDD WCDMA TD-SCDMA EVDO/CDMA Frequency B1/B3/B5/B8 B38/B39/B40/B41 B1/B8 B34/B39 BC0 SC20_Series_Hardware_Design 14 / 133 Smart Module Series GSM Wi-Fi 802.11a/b/g/n Bluetooth GNSS Table 2: SC20-E/-EL/-EX Frequency Bands Mode LTE-FDD LTE-TDD WCDMA GSM Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE GNSS Table 3: SC20-A/-AL/-AX Frequency Bands Mode LTE-FDD WCDMA GSM Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE GNSS 900/1800 MHz 24002482 MHz 51805825 MHz 24022480 MHz GPS/Galileo: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Frequency B1/B3/B5/B7/B8/B20 B38/B40/B41 B1/B5/B8 850/900/1800/1900 MHz 24002482 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Frequency B2/B4/B5/B7/B12/B13/B25/B26 B1/B2/B4/B5/B8 850/1900 MHz 24002482 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz SC20_Series_Hardware_Design 15 / 133 Smart Module Series BeiDou: 1561.098 2.046 MHz Table 4: SC20-AU/-AUL Frequency Bands Mode LTE-FDD LTE-TDD WCDMA GSM Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE GNSS Table 5: SC20-J/-JL Frequency Bands Mode LTE-FDD LTE-TDD WCDMA Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE GNSS Frequency B1/B3/B5/B7/B8/B28 B40 B1/B2/B5/B8 850/900/1800/1900 MHz 24002482 MHz 51805825 MHz 24022480 MHz GPS/Galileo: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Frequency B1/B3/B8/B18/B19/B26 B41 B1/B6/B8/B19 24002496 MHz 51805825 MHz 24022480 MHz GPS/Galileo: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz SC20_Series_Hardware_Design 16 / 133 Table 6: SC20-EU Frequency Bands Smart Module Series Type LTE-FDD LTE-TDD WCDMA GSM Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE GNSS Frequency B1/B2/B3/B5/B7/B8/B20/B28A B38 B1/B2/B5/B8 850/900/1800/1900 MHz 24002482 MHz 51805825 MHz 24022480 MHz GPS/Galileo: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz SC20 is a series of SMD type modules, which can be embedded into applications through its 210-pin pads including 146 LCC pads and 64 LGA pads. With a compact profile of 40.5 mm 40.5 mm 2.8 mm, SC20 series can meet almost all requirements for M2M applications such as CPE, wireless POS, smart metering, router, data card, automotive, smart phone, digital signage, alarm panel, security and industry PDA, etc. 2.2. Key Features The following table describes the detailed features of the module. Table 7: Key Features Feature Details Application Processor ARM Cortex-A7 microprocessor cores (quad-core) up to 1.1 GHz 512 KB L2 cache Modem DSP QDSP6 v5 core up to 691.2 MHz 768 KB L2 cache SC20_Series_Hardware_Design 17 / 133 Smart Module Series Memory SC20-CE R1.1/-CEL R1.1, SC20-E/-EL, SC20-A/-AL, SC20-AU/-AUL, SC20-J/-JL, SC20-EU:

8 GB eMMC + 1 GB LPDDR3 (default) 16 GB eMMC + 2 GB LPDDR3 (optional) SC20-AX, SC20-EX:

4 Gb NAND + 4 Gb LPDDR2 Operating System Android/Linux Power Supply Supply voltage: 3.54.2 V Typical supply voltage: 3.8 V Transmitting Power LTE Features UMTS Features Class 4 (33 dBm 2 dB) for GSM850 and EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 and PCS1900 Class E2 (27 dBm 3 dB) for GSM850 and EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 and PCS1900 8-PSK Class 3 (24 dBm +1/-3 dB) for WCDMA bands Class 3 (24 dBm +3/-1 dB) for EVDO/CDMA BC0 Class 2 (24 dBm +1/-3 dB) for TD-SCDMA bands Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Supports 3GPP R10 Cat 4 FDD and TDD Supports 1.4/3/5/10/20 MHz RF bandwidth Supports DL 2 2 MIMO FDD: Max. 150 Mbps (DL)/Max. 50 Mbps (UL) TDD: Max. 130 Mbps (DL)/Max. 30 Mbps (UL) Supports 3GPP R8 DC-HSDPA/HSPA+/HSDPA/HSUPA/WCDMA Supports 16QAM, 64QAM and QPSK modulation DC-HSDPA: Max. 42 Mbps HSUPA: Max. 5.76 Mbps WCDMA: Max. 384 kbps (DL)/Max. 384 kbps (UL) TD-SCDMA Features Supports CCSA Release 3 TD-SCDMA Max. 4.2 Mbps (DL)/Max. 2.2 Mbps (UL) CDMA2000 Features Supports 3GPP2 CDMA2000 1X Advanced, CDMA2000 1xEV-DO Rev.A EVDO: Max. 3.1 Mbps (DL)/Max. 1.8 Mbps (UL) 1X Advanced: Max. 307.2 kbps (DL)/Max. 307.2 kbps (UL) GSM Features R99:

CSD: 9.6 kbps, 14.4 kbps GPRS:

Supports GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max. 107 kbps (DL)/Max. 85.6 kbps (UL) EDGE:

Supports EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS SC20_Series_Hardware_Design 18 / 133 Smart Module Series Downlink coding schemes: MCS 19 Uplink coding schemes: MCS 19 Max. 296 kbps (DL)/Max. 236.8 kbps (UL) Supports 2.4 GHz and 5 GHz frequency bands Supports 802.11a/b/g/n, maximally up to 150 Mbps Supports AP and STA modes WLAN Features Bluetooth Feature Bluetooth 4.2 LE GNSS Features GPS/BeiDou/GLONASS or GPS/BeiDou/Galileo SMS LCM Interface Camera Interfaces Video Codec Audio Interfaces Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default Supports one 4-lane MIPI_DSI, up to 1.5 Gbps/lane Supports WVGA (2-lane MIPI_DSI), up to 720P (4-lane MIPI_DSI) 24-bit color depth Supports two MIPI_CSI (2-lane + 1-lane), up to 1.5 Gbps/lane Supports two cameras:

2-lane MIPI_CSI for rear camera, maximum pixel up to 8 MP 1-lane MIPI_CSI for front camera, maximum pixel up to 2 MP Video encoding:

720P (H.264) @ 30 fps; WVGA (MPEG-4/VP8) @ 30 fps Video decoding:

1080P (H.264/MPEG-4/VP8/H.265/DivX4/5/6) @ 30 fps; WVGA (H.263)

@ 30 fps Audio inputs:

Two analog microphone inputs, integrating internal bias voltage Audio outputs:

Class AB stereo headphone output Class AB earpiece differential output Class D speaker differential amplifier output Audio Codec HR, FR, EFR, AMR, AMR-WB USB Interface

(U)SIM Interfaces UART Interfaces Compliant with USB 2.0 specification Supports up to 480 Mbps Supports USB OTG (an external 5 V power supply is needed) Used for AT command communication, data transmission, software debugging and firmware upgrade Two (U)SIM interfaces Supports USIM/SIM card: 1.8 V or 2.95 V Supports Dual SIM Dual Standby (supported by default) Two UART interfaces: UART1 and UART2 UART1: 4-wire UART interface with RTS/CTS hardware flow control;

SC20_Series_Hardware_Design 19 / 133 Smart Module Series baud rate up to 4 Mbps UART2: 2-wire UART interface used for debugging Motor Drive Interface Drives ERM motor SD Card Interface I2C Interfaces ADC Interfaces Supports SD 3.0, 4-bit SDIO Supports SD card hot-plug Three I2C interfaces Used for peripherals such as camera, sensor, touch panel, etc. Three ADC interfaces Used for battery voltage detection, battery temperature detection and general-purpose ADC Real Time Clock Supported Antenna Interfaces Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/Bluetooth antenna Physical Characteristics Temperature Range Size: (40.5 0.15) mm (40.5 0.15) mm (2.8 0.2) mm Package: LCC + LGA Weight: approx. 9.8 g Operating temperature range: -35 to +75 C 1 Storage temperature range: -40 to +90 C Firmware Upgrade Over USB interface RoHS All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a block diagram of SC20 series and illustrates the major functional parts. Power management Radio frequency Baseband LPDDR3 + eMMC flash (SC20-CE R1.1/-CEL R1.1, SC20-E/-EL, SC20-A/-AL, SC20-AU/-AUL, SC20-J/-JL, SC20-EU) LPDDR2 + NAND flash (SC20-AX, SC20-EX) Peripheral interfaces

-- USB interface

-- UART interfaces

-- (U)SIM interfaces

-- SD card interface

-- GPIO interfaces 1 Within the operating temperature range, the module is 3GPP compliant. SC20_Series_Hardware_Design 20 / 133 Smart Module Series

-- I2C interfaces

-- ADC interfaces

-- LCM (MIPI) interface

-- Touch panel (TP) interface

-- Camera (MIPI) interfaces

-- Audio interfaces Figure 1: Functional Diagram 2.4. EVB To help you develop applications with the module, Quectel supplies the evaluation board (Smart EVB), USB to RS-232 converter cable, USB data cable, power adapter, earphone, antenna and other peripherals to control or test the module. For more details, see document [1]. SC20_Series_Hardware_Design 21 / 133 Smart Module Series 3 Application Interfaces 3.1. General Description SC20 is a series of SMD type modules with 146 LCC pads and 64 LGA pads. The following chapters provide the detailed description of pins/interfaces listed below. Power supply VRTC interface USB interface UART interfaces

(U)SIM interfaces SD card interface GPIO interfaces SPI interface I2C interfaces ADC interfaces Motor drive interface LCM interface Touch panel interface Camera interfaces Sensor interfaces Audio interfaces Emergency download interface SC20_Series_Hardware_Design 22 / 133 Smart Module Series 3.2. Pin Assignment The following figure shows the pin assignment of SC20 series. Figure 2: Pin Assignment (Top View) NOTE As for SC20-AX/EX, pins 105, 116, 117, 118, 119 are GPIO_15, GPIO_3, GPIO_2, GPIO_1 and GPIO_0 respectively. SC20_Series_Hardware_Design 23 / 133 Smart Module Series 3.3. Pin Description Table 8: I/O Parameters Definition Type Description AI AO AIO DI DO DIO OD PI PO PIO Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open drain Power Input Power Output Power Input/Output The following table shows the pin definition and electrical characteristics of SC20 series. Table 9: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 1, 2 PI Power supply for modules baseband part Vmax = 4.2 V Vmin = 3.5 V Vnom = 3.8 V VBAT_RF 145, 146 PI Power supply for modules RF part Vmax = 4.2 V Vmin = 3.5 V Vnom = 3.8 V You must provide them with sufficient current of up to 3.0 A. It is suggested to add a TVS for surge protection. VRTC 126 PIO Power supply for internal RTC circuit VOmax = 3.2 V VI = 2.03.25 V If unused, keep this pin open. SC20_Series_Hardware_Design 24 / 133 LDO5_1V8 111 PO 1.8 V output Vnom = 1.8 V IOmax = 20 mA LDO6_1V8 125 PO 1.8 V output Vnom = 1.8 V IOmax = 100 mA LDO17_2V85 129 PO 2.85 V output Vnom = 2.85 V IOmax = 300 mA Smart Module Series Power supply for external GPIOs pull-up and level shift circuits. Power supply for peripherals. If it is used, connect an external 2.24.7 F capacitor to this pin in parallel. If it is not used, keep it open. Power supply for peripherals. If it is used, connect an external 2.24.7 F capacitor to this pin in parallel. If it is not used, keep it open. GND Pin Name Pin No. GND Audio Interfaces Pin Name MIC1P MIC_GND MIC2P EARP EARN 3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89, 120, 122, 130, 132, 135, 140, 143, 144, 147150, 160178, 180182, 184186, 188, 189, 192, 193, 198, 200, 201, 208, 209 Pin No. 4 5 6 8 9 I/O Description DC Characteristics Comment AI AI AO AO Microphone input for channel 1 (+) Microphone reference ground Microphone input for headset (+) Earpiece output

(+) Earpiece output

(-) SC20_Series_Hardware_Design 25 / 133 SPKP SPKN 10 11 AO Speaker output

(+) AO Speaker output (-) HPH_R 136 AO HPH_GND 137 AI HPH_L 138 AO HS_DET 139 AI Headphone right channel output Headphone reference ground Headphone left channel output Headset hot-plug detect Smart Module Series High level by default. USB Interface Pin Name USB_VBUS Pin No. 141, 142 I/O Description DC Characteristics Comment PI USB 5 V power input and USB insertion detection Vmax = 6.3 V Vmin = 4.35 V Vnom = 5.0 V USB_DM 13 AIO USB_DP 14 AIO USB 2.0 differential data (-) USB 2.0 differential data

(+) USB_ID 16 AI USB ID detect Compliant with USB 2.0 standard. Require differential impedance of 90 . High level by default.

(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM2_DETECT 17 DI

(U)SIM2 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM2_RST 18 DO USIM2_CLK 19 DO

(U)SIM2 card reset

(U)SIM2 card clock VOLmax = 0.4 V VOHmin =

0.8 USIM2_VDD Active low. Externally pull it up to 1.8 V. If unused, keep this pin open. SC20_Series_Hardware_Design 26 / 133 Smart Module Series USIM2_DATA 20 DIO

(U)SIM2 card data USIM2_VDD 21 PO

(U)SIM2 card power supply VILmax =

0.2 USIM2_VDD VIHmin =

0.7 USIM2_VDD VOLmax = 0.4 V VOHmin =

0.8 USIM2_VDD For 1.8 V (U)SIM:

Vmax = 1.85 V Vmin = 1.75 V For 2.95 V (U)SIM:

Vmax = 3.1V Vmin = 2.8 V USIM1_DETECT 22 DI

(U)SIM1 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM1_RST 23 DO USIM1_CLK 24 DO

(U)SIM1 card reset

(U)SIM1 card clock USIM1_DATA 25 DIO

(U)SIM1 card data USIM1_VDD 26 PO

(U)SIM1 card power supply VOLmax = 0.4 V VOHmin =

0.8 USIM1_VDD VILmax =

0.2 USIM1_VDD VIHmin =

0.7 USIM1_VDD VOLmax = 0.4 V VOHmin =

0.8 USIM1_VDD For 1.8 V (U)SIM:

Vmax = 1.85 V Vmin = 1.75 V For 2.95 V (U)SIM:

Vmax = 3.1V Vmin = 2.8 V Externally pull it up to USIM2_VDD with a 10 k resistor. Either 1.8 V or 2.95 V (U)SIM card is supported by the module automatically. Active low. Externally pull it up to 1.8 V. If unused, keep this pin open. Externally pull it up to USIM1_VDD with a 10 k resistor. Either 1.8 V or 2.95 V (U)SIM card is supported by the module automatically. UART Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment UART1_TX 34 DO UART1 transmit VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. SC20_Series_Hardware_Design 27 / 133 UART1_RX 35 DI UART1 receive VILmax = 0.63 V VIHmin = 1.17 V UART1_CTS 36 DI DTE clear to send signal from DCE VILmax = 0.63 V VIHmin = 1.17 V UART1_RTS 37 DO UART2_RX 93 DI UART2_TX 94 DO DTE request to send signal to DCE VOLmax = 0.45 V VOHmin = 1.35 V UART2 receive;

Debug port by default UART2 transmit;

Debug port by default VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V Smart Module Series If unused, keep these pins open. Connect to DTES CTS;

1.8 V power domain. If unused, keep these pins open. Connect to DTES RTS;

1.8 V power domain. If unused, keep these pins open. 1.8 V power domain. If unused, keep these pins open. SD Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment SD_LDO11 38 PO SD card power supply Vnom = 2.95 V IOmax = 600 mA SD_LDO12 32 PO 1.8/2.95 V output power for SD card pull-up circuits SD_CLK 39 DO SD card clock SD_CMD 40 DIO SD card command SD_DATA0 41 DIO SDIO data bit 0 SD_DATA1 42 DIO SDIO data bit 1 Vnom = 1.8/2.95 V IOmax = 50 mA 1.8 V SD card:

VOLmax = 0.45 V VOHmin = 1.4 V 2.95 V SD card:

VOLmax = 0.37 V VOHmin = 2.2 V 1.8 V SD card:

VILmax = 0.58 V VIHmin = 1.27 V VOLmax = 0.45 V VOHmin = 1.4 V Control characteristic impedance as 50

. SC20_Series_Hardware_Design 28 / 133 Smart Module Series SD_DATA2 43 DIO SDIO data bit 2 SD_DATA3 44 DIO SDIO data bit 3 2.95 V SD card:

VILmax = 0.73 V VIHmin = 1.84 V VOLmax = 0.37 V VOHmin = 2.2 V SD_DET 45 DI SD card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V Active low. Touch Panel (TP) Interface Pin Name Pin No. I/O Description DC Characteristics Comment TP_INT 30 DI TP interrupt TP_RST 31 DO TP reset VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V TP_I2C_SCL 47 OD TP I2C clock TP_I2C_SDA 48 OD TP I2C data 1.8 V power domain. 1.8 V power domain. Active low. 1.8 V power domain. 1.8 V power domain. LCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment PWM 29 DO PWM output LCD_RST 49 DO LCD reset LCD_TE 50 DI LCD tearing effect VOLmax = 0.45 V VOHmax =

VBAT_BB VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V Adjust the backlight brightness. 1.8 V power domain. Active low. 1.8 V power domain. MIPI_DSI_CLKN 52 AO LCD MIPI clock (-) MIPI_DSI_CLKP 53 AO MIPI_DSI_LN0N 54 AO MIPI_DSI_LN0P 55 AO MIPI_DSI_LN1N 56 AO LCD MIPI clock

(+) LCD MIPI data 0

(-) LCD MIPI data 0

(+) LCD MIPI data 1

(-) SC20_Series_Hardware_Design 29 / 133 Smart Module Series MIPI_DSI_LN1P 57 AO MIPI_DSI_LN2N 58 AO MIPI_DSI_LN2P 59 AO MIPI_DSI_LN3N 60 AO MIPI_DSI_LN3P 61 AO LCD MIPI data 1

(+) LCD MIPI data 2

(-) LCD MIPI data 2

(+) LCD MIPI data 3

(-) LCD MIPI data 3

(+) I/O Description DC Characteristics Comment Camera Interfaces Pin Name Pin No. MIPI_CSI0_CLKN 63 MIPI_CSI0_CLKP 64 MIPI_CSI0_LN0N 65 MIPI_CSI0_LN0P 66 MIPI_CSI0_LN1N 67 MIPI_CSI0_LN1P 68 MIPI_CSI1_CLKN 70 MIPI_CSI1_CLKP 71 MIPI_CSI1_LN0N 72 MIPI_CSI1_LN0P 73 AI AI AI AI AI AI AI AI AI AI CAM0_MCLK 74 DO CAM1_MCLK 75 DO CAM0_RST 79 DO CAM0_PWD 80 DO Rear camera MIPI clock (-) Rear camera MIPI clock (+) Rear camera MIPI data 0 (-) Rear camera MIPI data 0 (+) Rear camera MIPI data 1 (-) Rear camera MIPI data 1 (+) Front camera MIPI clock (-) Front camera MIPI clock (+) Front camera MIPI data (-) Front camera MIPI data (+) Clock of rear camera Clock of front camera Reset of rear camera Power down of rear camera VOLmax = 0.45 V VOHmin = 1.35 V SC20_Series_Hardware_Design 30 / 133 CAM1_RST 81 DO CAM1_PWD 82 DO CAM_I2C_SCL 83 OD CAM_I2C_SDA 84 OD Reset of front camera Power down of front camera I2C clock of camera I2C data of camera Smart Module Series 1.8 V power domain. 1.8 V power domain. Keypad Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 114 DI Turns on/off the module KEY_VOL_UP 95 DI Volume up KEY_VOL_DOWN 96 DI Volume down VILmax = 0.63 V VIHmin = 1.17 V Internally pulled up to 1.8 V. Active low. If unused, keep this pin open. If unused, keep this pin open. SENSOR_I2C Interface Pin Name SENSOR_I2C_ SCL SENSOR_I2C_ SDA ADC Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment 91 OD 92 OD I2C clock for external sensor I2C data for external sensor 1.8 V power domain. 1.8 V power domain. Pin No. I/O Description DC Characteristics Comment ADC 128 AI VBAT_SNS 133 AI General purpose ADC Battery voltage detect VBAT_THERM 134 AI Battery temperature detect Antenna Interfaces Maximum input voltage: 1.7 V. Maximum input voltage: 4.5 V. Internally pulled up. Externally connect it to the 47 k NTC thermistor. If it is not used, connect it to GND with a 47 k resistor. SC20_Series_Hardware_Design 31 / 133 Pin Name Pin No. I/O Description DC Characteristics Comment Smart Module Series ANT_MAIN 87 AIO ANT_DRX 131 AI ANT_GNSS 121 AI ANT_WIFI/BT 77 AIO Main antenna interface Rx-diversity antenna interface GNSS antenna interface Wi-Fi/Bluetooth antenna interface 50 impedance. GPIO Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment GPIO_23 33 DIO GPIO_32 90 DIO GPIO_31 97 DIO GPIO_92 98 DIO GPIO_88 2 99 DIO GPIO_89 100 DIO GPIO_69 101 DIO GPIO_68 2 102 DIO GPIO_97 103 DIO GPIO_110 104 DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.4 V 1.8 V power domain. GPIO_0 GPIO_15 105 3 DIO General-purpose input/output 2 GPIO_68 and GPIO_88 cannot be pulled up during start-up. 3 As for SC20-CE R1.1/-CEL R1.1, SC20-E/-EL, SC20-A/-AL, SC20-AU/-AUL, SC20-J/-JL, SC20-EU, pins 105, 116, 117, 118 and 119 are GPIO_0, GPIO_11, GPIO_10, GPIO_9 and GPIO_8 respectively; as for SC20-AX, SC20-EX, pins 105, 116, 117, 118 and 119 are GPIO_15, GPIO_3, GPIO_2, GPIO_1 and GPIO_0 respectively. SC20_Series_Hardware_Design 32 / 133 Smart Module Series GPIO_98 106 DIO GPIO_94 107 DIO GPIO_36 108 DIO GPIO_65 109 DIO GPIO_96 110 DIO GPIO_58 112 DIO GPIO_99 113 DIO GPIO_95 115 DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output GPIO_11 GPIO_3 GPIO_10 GPIO_2 GPIO_9 GPIO_1 GPIO_8 GPIO_0 116 3 DIO General-purpose input/output 117 3 DIO General-purpose input/output 118 3 DIO General-purpose input/output 119 3 DIO General-purpose input/output GPIO_16 123 DIO GPIO_17 124 DIO General-purpose input/output General-purpose input/output Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment VIB_DRV 28 PO Motor drive Vmin = 1.2 V Vmax=3.1 V IOmax = 175 mA Connect it to the negative pole of the motor. SC20_Series_Hardware_Design 33 / 133 RESET_N 179 DI Resets the module USB_BOOT 46 DI Forces the module to enter emergency download mode CHARGE_SEL 127 DI Charger select Reserved Pins Pin Name Pin No. RESERVED 151, 152, 153, 154, 155, 156, 157, 158, 159, 183, 187, 190, 191, 194, 195, 196, 197, 199, 202, 203, 204, 205, 206, 207, 210 Smart Module Series Disabled by default and can be enabled through software configuration. You can force the module to enter emergency download mode by pulling it up to LDO5_1V8 during power-up. If you use an internal charging chip, keep this pin open. If you use an external charging chip, connect it to GND. Comment Keep these pins open. 3.4. Power Supply 3.4.1. Power Supply Pins SC20 series provides two VBAT_RF pins and two VBAT_BB pins for connection with the external power supply. The VBAT_RF pins are used for the RF part of the module and the VBAT_BB pins are used for the baseband part of the module. 3.4.2. Voltage Stability Requirements The power supply range of the module is 3.54.2 V, and the recommended value is 3.8 V. The power supply performance, such as load capacity, voltage ripple, etc. directly influences the modules performance and stability. Under ultimate conditions, the transient peak current of the module may surge up to 3 A. If the supply voltage is not enough, there will be voltage drops, and if the voltage drops below 3.1 V, the module will be turned off automatically. Therefore, make sure the input voltage never drops SC20_Series_Hardware_Design 34 / 133 below 3.1 V. Smart Module Series Figure 3: Voltage Drop Sample To decrease voltage drop, a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ) should be used, and a multi-layer ceramic chip capacitor (MLCC) should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from the external application must be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1.5 mm, and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it should be. In addition, in order to get a stable power source, it is suggested to use a TVS diode and place it as close to the VBAT_BB/VBAT_RF pins as possible to increase voltage surge withstand capability. The following figure shows the star structure of the power supply. VBAT

D1 C1 C2 C3 C4 C5 C6 C7 C8

100 F 100 nF 33 pF 10 pF 100 F 100 nF 33 pF 10 pF VBAT_RF VBAT_BB Module Figure 4: Star Structure of the Power Supply SC20_Series_Hardware_Design 35 / 133 Smart Module Series 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of module largely depends on the power source. The power supply of SC20 series should be able to provide enough current of at least 3 A. If the voltage drop between the input and output is not too high, it is suggested to use an LDO to supply power for the module. If there is a big voltage difference between the input source and the desired output

(VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5 V input power source which adopts an LDO

(MIC29302WU) from MICREL. The typical output voltage is 3.8 V and the maximum load current is 3.0 A. Figure 5: Reference Circuit of Power Supply NOTE 1. It is recommended to switch off the power supply when the module is in abnormal state, and then switch on the power to restart the module. 2. The module supports battery charging by default. If the above power supply design is adopted, make sure the charging function is disabled by software, or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply chip. 3.5. Turn on and off Scenarios 3.5.1. Turn on with PWRKEY The module can be turned on by driving PWRKEY pin low for at least 1.6 s. PWRKEY pin is pulled to 1.8 V internally. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. SC20_Series_Hardware_Design 36 / 133 Smart Module Series Figure 6: Turn on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 7: Turn on the Module Using Keystroke The turning on scenario is illustrated in the following figure. SC20_Series_Hardware_Design 37 / 133 Smart Module Series Figure 8: Timing of Turning on Module NOTE 1. When the module is powered on for the first time, its timing of turning on will be 45 ms longer than that shown above. 2. Make sure that VBAT is stable before pulling down PWRKEY pin. The recommended time between them is no less than 30 ms. PWRKEY pin cannot be pulled down all the time. 3.5.2. Turn off Drive the PWRKEY pin low for at least 1 s, and then choose to turn off the module when the prompt window comes up. The other way to turn off the module is to drive PWRKEY low for at least 8 s. The module will execute forced shutdown. The forced power-down scenario is illustrated in the following figure. SC20_Series_Hardware_Design 38 / 133 Smart Module Series Figure 9: Timing of Turning off Module 3.6. VRTC Interface The RTC can be powered by an external power source through VRTC when the module is powered down and there is no power supply for the VBAT. The external power source can be a capacitor or rechargeable battery (such as coil cells) according to application demands. The following are some reference circuit designs when an external battery or capacitor is utilized for powering RTC. Figure 10: RTC Powered by Coin Cell Figure 11: RTC Powered by Capacitor SC20_Series_Hardware_Design 39 / 133 Smart Module Series If RTC is ineffective, it can be synchronized through network after the module is powered on. The input voltage range is 2.03.25 V and the typical value is 3.0 V for VRTC. When VBAT is disconnected, the average consumption is about 5 A. When powered by VBAT, the RTC error is 50 ppm. When powered by VRTC, the RTC error is 200 ppm. If a rechargeable battery is used, the ESR of the battery should be less than 2 k, and it is recommended to use the MS621FE-FL11E of SEIKO. If a large-capacitance capacitor is selected, it is recommended to use a 100 F capacitor with low ESR. The capacitor will be able to power the real-time clock for 45 seconds. 3.7. Power Output SC20 series supports output of regulated voltages for peripheral circuits. During application, it is recommended to add capacitors (33 pF and 10 pF) in parallel to suppress high frequency noise. Table 10: Power Description Pin Name Default Voltage (V) Driving Current (mA) Idle LDO5_1V8 LDO6_1V8 1.8 1.8 LDO17_2V85 2.85 SD_LDO12 1.8/2.95 SD_LDO11 2.95 USIM1_VDD 1.8/2.95 USIM2_VDD 1.8/2.95 20 100 300 50 600 50 50 Keep

3.8. Battery Charging and Management SC20 series can supports battery charging. The battery charger in the module supports trickle charging, constant current charging and constant voltage charging modes, which optimize the charging procedure for Li-ion batteries. SC20_Series_Hardware_Design 40 / 133 Smart Module Series Trickle charging: There are two steps in this mode. When the battery voltage is below 2.8 V, a 90 mA trickle charging current is applied to the battery. When the battery voltage is charged up and is between 2.8 V and 3.2 V, the charging current can be set to 450 mA maximally. Constant current mode (CC mode): When the battery is increased to between 3.2 V and 4.2 V, the system will switch to CC mode. The maximum charging current is 1.44 A when adapter is used for battery charging; and the maximum charging current is 450 mA during USB charging. Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.2 V, the system will switch to CV mode and the charging current will decrease gradually. When the battery level reaches 100 %, the charging is completed. The module supports battery temperature detection in the condition that the battery integrates a thermistor (47 k 1 % NTC thermistor with B-constant of 4050 K by default; SDNT1608X473F4050FTF of SUNLORD is recommended) and the thermistor is connected to VBAT_THERM pin. If VBAT_THERM pin is not connected, there will be malfunctions such as battery charging failure, battery level display error, etc. The default battery temperature range is -3.0 C to 48.5 C. A reference design for battery charging circuit is shown as below. Figure 12: Reference Design for Battery Charging Circuit Mobile devices such as mobile phones and handheld POS systems are powered by batteries. When different batteries are utilized, the charging and discharging curve must be modified correspondingly to achieve the best effect. If the thermistor is not available in the battery, or an adapter is utilized for powering module, you must connect VBAT_THERM to GND via a 47 k resistor. Otherwise, the system may mistakenly judge that the battery temperature is abnormal, and therefore cause battery charging failure. VBAT_SNS pin must be connected. Otherwise, the module will have abnormalities in voltage detection, as well as associated power-on/off and battery charging/discharging issues. SC20_Series_Hardware_Design 41 / 133 Smart Module Series 3.9. USB Interface SC20 series contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 11: Pin Definition of USB Interface Pin Name Pin No. I/O Description USB_VBUS 141, 142 PI USB 5 V power input and USB insertion detection USB_DM 13 AIO USB 2.0 differential data (-) USB_DP 14 AIO USB 2.0 differential data (+) Comment Vmax = 6.3 V Vmin = 4.35 V Vnom = 5.0 V Compliant with USB 2.0 standard. Require differential impedance of 90 . USB_ID 16 AI USB ID detect High level by default. USB_VBUS can be powered by the USB power or adapter. It can be used for USB connection detection, as well as for battery charging via the internal PMU. The input voltage of power supply ranges from 4.35 V to 6.3 V, and the typical value is 5.0 V. SC20 series supports charging management for a single Li-ion battery, but different charging parameters should be set for batteries with different models or capacities. The module is available with a built-in linear-charging circuit which supports maximally 1.44 A charging current. SC20_Series_Hardware_Design 42 / 133 The following are two USB interface reference designs for you to choose from. Smart Module Series 89 D N G D N G D N G D N G 6 7 Figure 13: USB Interface Reference Design (OTG is not Supported) Figure 14: USB Interface Reference Design (OTG is Supported) SC20 series supports OTG protocol. If OTG function is needed, see the above figure for the reference design. AW3605DNR is a high efficiency DC-DC chip manufactured by AWINIC, and you can also choose a suitable one according to your own demands. SC20_Series_Hardware_Design 43 / 133 Smart Module Series In order to ensure USB performance, comply with the following principles while designing USB interface. Route the USB signal traces as a differential pair with total grounding. The impedance of USB differential trace is 90 . Keep the ESD protection devices as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection devices on USB data lines. Typically, the capacitance value should be less than 2 pF. Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layer but also right and left sides. Make sure the trace length difference between USB_DM and USB_DP is not exceeding 6.6 mm. Table 12: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (DP-DM) 13 14 USB_DM USB_DP 29.43 29.36

-0.07 3.10. UART Interfaces The module provides two UART interfaces:

UART1: 4-wire UART interface with RTS/CTS hardware flow control; baud rate up to 4 Mbps UART2: 2-wire UART interface used for debugging Table 13: Pin Definition of UART Interfaces Pin Name Pin No. UART1_TX 34 UART1_RX 35 I/O DO DI UART1 transmit UART1 receive Description Comment UART1_CTS 36 DI DTE clear to send signal from DCE 1.8 V power domain. If it is unused, keep it open. Connect to DTES CTS;

1.8 V power domain. If unused, keep these pins open. UART1_RTS 37 DO DTE request to send signal to DCE Connect to DTES RTS;

1.8 V power domain. SC20_Series_Hardware_Design 44 / 133 UART2_RX 93 UART2_TX 94 DI DO UART2 receive;

Debug port by default UART2 transmit;

Debug port by default Smart Module Series If unused, keep these pins open. 1.8 V power domain. If it is unused, keep it open. UART1 provides 1.8 V logic level. A level translator should be used if your application is equipped with a 3.3 V UART interface. A level translator TXS0104PWR provided by Texas Instruments is recommended. The following figure shows the reference design. LDO5_1V8 C1 100 pF UART1_CTS UART1_RTS UART1_TX UART1_RX VCCA VCCB OE A1 A2 A3 A4 U1 GND TXS0104EPWR B1 B2 B3 B4 C2 100 pF VDD_3.3V CTS_3.3V RTS_3.3V TXD_3.3V RXD_3.3V Figure 15: Reference Circuit with Level Translator Chip (for UART1) The following figure is an example of connection between the module and PC. A voltage level translator and a RS-232 level translator chip are recommended to be added between the module and PC. Figure 16: RS-232 Level Match Circuit (for UART1) SC20_Series_Hardware_Design 45 / 133 Smart Module Series NOTE UART2 is similar to UART1. For the reference design, see that of UART1. 3.11. (U)SIM Interfaces SC20 series provides two (U)SIM interfaces which meet ETSI and IMT-2000 requirements. Dual SIM Card Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the

(U)SIM card is powered by the internal power supply of the module. Table 14: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM2_DETECT 17 DI

(U)SIM2 card hot-plug detect USIM2_RST USIM2_CLK 18 19 DO

(U)SIM2 card reset DO

(U)SIM2 card clock USIM2_DATA 20 DIO

(U)SIM2 card data USIM2_VDD 21 PO

(U)SIM2 card power supply USIM1_DETECT 22 DI

(U)SIM1 card hot-plug detect USIM1_RST USIM1_CLK 23 24 DO

(U)SIM1 card reset DO

(U)SIM1 card clock USIM1_DATA 25 DIO

(U)SIM1 card data USIM1_VDD 26 PO

(U)SIM1 card power supply Active low. Externally pull it up to 1.8 V. If unused, keep this pin open. Externally pull it up to USIM2_VDD with a 10 k resistor. Either 1.8 V or 2.95 V (U)SIM card is supported by the module automatically. Active low. Externally pull it up to 1.8 V. If unused, keep this pin open. Externally pull it up to USIM1_VDD with a 10 k resistor. Either 1.8 V or 2.95 V (U)SIM card is supported by the module automatically. SC20_Series_Hardware_Design 46 / 133 SC20 series supports (U)SIM card hot-plug via the USIM_DETECT pin. A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below. Smart Module Series Figure 17: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector If there is no need to use USIM_DETECT for (U)SIM card hot-plug, keep it open. The following is a reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector. Figure 18: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to ensure good performance and avoid damage to (U)SIM cards, follow the criteria below in

(U)SIM circuit design:

Keep placement of (U)SIM card connector as close to the module as possible. Keep the trace length of (U)SIM card signals as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. A filter capacitor shall be reserved for USIM_VDD, and its maximum capacitance should not exceed 1 F. The capacitor should be placed close to the (U)SIM card connector. SC20_Series_Hardware_Design 47 / 133 Smart Module Series To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground. USIM_RST also needs ground protection. In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 50 pF. 22 resistors should be added in series between the module and

(U)SIM card to suppress EMI spurious transmission and enhance ESD protection. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The 33 pF capacitors should be added in parallel on USIM_DATA, USIM_CLK and USIM_RST signal lines to filter RF interference, and they should be placed as close to the (U)SIM card connector as possible. 3.12. SD Card Interface The SD card interface of SC20 series supports SD 3.0 protocol and 4-bit SDIO. The pin definition is shown below. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description SD_LDO11 38 PO SD card power supply SD_LDO12 32 PO 1.8/2.95 V output power for SD card pull-up circuits SD_CLK SD_CMD 39 40 DO SD card clock DIO SD card command SD_DATA0 41 DIO SDIO data bit 0 SD_DATA1 42 DIO SDIO data bit 1 SD_DATA2 43 DIO SDIO data bit 2 SD_DATA3 44 DIO SDIO data bit 3 Comment Vnom = 2.95 V IOmax = 600 mA Vnom = 1.8/2.95 V IOmax = 50 mA Control characteristic impedance as 50 . SD_DET 45 DI SD card hot-plug detect Active low. SC20_Series_Hardware_Design 48 / 133 A reference circuit for SD card interface is shown below. Smart Module Series Figure 19: Reference Circuit for SD Card Interface SD_LDO11 is the power supply for the external SD card. The maximum drive current is about 600 mA. Because of the high drive current, it is recommended that the trace width is 0.6 mm or more. In order to ensure the stability of drive power, a 2.2 F capacitor should be added in parallel near the SD card connector. SD_CMD, SD_CLK, SD_DATA0, SD_DATA1, SD_DATA2 and SD_DATA3 are all high-speed signal lines. In PCB design, control the characteristic impedance of them as 50 , and do not cross them with other traces. It is recommended to route the traces on the inner layer of PCB, and keep the same trace length for them. Additionally, SD_CLK needs ground shielding. Layout guidelines:

Control impedance as 50 10 %, and ground shielding is required. The total trace length difference between SD_CLK and other signal traces should not exceed 1 mm. Table 16: SD Card Trace Length Inside the Module Pin No. 39 40 41 42 Signal SD_CLK SD_CMD SD_DATA0 SD_DATA1 Length (mm) 14.60 14.55 14.53 14.56 SC20_Series_Hardware_Design 49 / 133 43 44 SD_DATA2 SD_DATA3 14.53 14.57 Smart Module Series 3.13. GPIO Interfaces SC20 series has abundant GPIO interfaces with logic level of 1.8 V. The pin definition is listed below. Table 17: Pin Definition of GPIO Interfaces Pin No. Pin Name GPIO No. Default state Comment 30 31 33 34 35 36 37 45 47 48 49 50 74 75 TP_INT TP_RST GPIO_23 GPIO_13 B-PD: nppukp 4 Wakeup 5 GPIO_12 B-PD: nppukp Wakeup GPIO_23 B-PD: nppukp UART1_TX GPIO_20 B-PD: nppukp Wakeup UART1_RX GPIO_21 B-PD: nppukp Wakeup UART1_CTS GPIO_111 B-PD: nppukp Wakeup UART1_RTS GPIO_112 B-PD: nppukp Wakeup SD_DET GPIO_38 B-PD: nppukp Wakeup TP_I2C_SCL GPIO_19 B-PD: nppukp TP_I2C_SDA GPIO_18 B-PD: nppukp LCD_RST LCD_TE GPIO_25 B-PD: nppukp Wakeup GPIO_24 B-PD: nppukp CAM0_CLK GPIO_26 B-PD: nppukp CAM1_CLK GPIO_27 B-PD: nppukp 4 B: Bidirectional digital with CMOS input. PD: nppukp = default pull-down with programmable options following the colon

(:). 5 Wakeup: Interrupt pins that can wake up the system. SC20_Series_Hardware_Design 50 / 133 Smart Module Series 79 80 81 82 83 84 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 CAM0_RST GPIO_35 B-PD: nppukp Wakeup CAM0_PWD GPIO_34 B-PD: nppukp Wakeup CAM1_RST GPIO_28 B-PD: nppukp Wakeup CAM1_PWD GPIO_33 B-PD: nppukp CAM_I2C_SCL GPIO_30 B-PD: nppukp CAM_I2C_SDA GPIO_29 B-PD: nppukp GPIO_32 GPIO_32 B-PD: nppukp SENSOR_I2C_SCL GPIO_7 B-PD: nppukp SENSOR_I2C_SDA GPIO_6 B-PD: nppukp UART2_RX UART2_TX GPIO_5 B-PD: nppukp Wakeup GPIO_4 B-PD: nppukp KEY_VOL_UP GPIO_90 B-PD: nppukp Wakeup KEY_VOL_DOWN GPIO_91 B-PD: nppukp Wakeup GPIO_31 GPIO_92 GPIO_88 6 GPIO_89 GPIO_69 GPIO_68 6 GPIO_97 GPIO_110 GPIO_31 B-PD: nppukp Wakeup GPIO_92 B-PD: nppukp Wakeup GPIO_88 B-PD: nppukp GPIO_89 B-PD: nppukp GPIO_69 B-PD: nppukp GPIO_68 B-PD: nppukp GPIO_97 B-PD: nppukp Wakeup GPIO_110 B-PD: nppukp Wakeup 105 7 GPIO_0 GPIO_0 B-PD: nppukp 6 GPIO_68 and GPIO_88 cannot be pulled up during start-up. 7 As for SC20-CE R1.1/-CEL R1.1, SC20-E/-EL, SC20-A/-AL, SC20-AU/-AUL, SC20-J/-JL, SC20-EU, pins 105, 116, 117, 118 and 119 are GPIO_0, GPIO_11, GPIO_10, GPIO_9 and GPIO_8 respectively; as for SC20-AX, SC20-EX, pins 105, 116, 117, 118 and 119 are GPIO_15, GPIO_3, GPIO_2, GPIO_1 and GPIO_0 respectively. SC20_Series_Hardware_Design 51 / 133 Smart Module Series GPIO_15 GPIO_98 B-PD: nppukp Wakeup GPIO_94 B-PD: nppukp Wakeup GPIO_36 B-PD: nppukp Wakeup GPIO_65 B-PD: nppukp Wakeup GPIO_96 B-PD: nppukp Wakeup GPIO_58 B-PD: nppukp Wakeup GPIO_99 B-PD: nppukp GPIO_95 B-PD: nppukp Wakeup GPIO_11 GPIO_3 GPIO_10 GPIO_2 GPIO_9 GPIO_1 GPIO_8 GPIO_0 B-PD: nppukp Wakeup B-PD: nppukp B-PD: nppukp B-PD: nppukp GPIO_16 B-PD: nppukp GPIO_17 B-PD: nppukp GPIO_15 GPIO_98 GPIO_94 GPIO_36 GPIO_65 GPIO_96 GPIO_58 GPIO_99 GPIO_95 GPIO_11 GPIO_3 GPIO_10 GPIO_2 GPIO_9 GPIO_1 GPIO_8 GPIO_0 GPIO_16 GPIO_17 106 107 108 109 110 112 113 115 116 7 117 7 118 7 119 7 123 124 NOTE For more details about GPIO configuration, see document [2]. 3.14. SPI Interface SC20 series provides one SPI interface multiplexed from GPIO interfaces. The interface only supports SC20_Series_Hardware_Design 52 / 133 Smart Module Series master mode. Table 18: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment GPIO_8 GPIO_0 GPIO_9 GPIO_1 GPIO_10 GPIO_2 GPIO_11 GPIO_3 119 8 IO SPI master-out slave-in 118 8 IO SPI master-in slave-out 117 8 DO SPI chip select 116 8 DO SPI clock Can be multiplexed into SPI_MOSI. Can be multiplexed into SPI_MISO. Can be multiplexed into SPI_CS_N. Can be multiplexed into SPI_CLK. 3.15. I2C Interfaces SC20 series provides three I2C interfaces which only support the master mode. As an open drain output, each I2C interface needs to be pulled up externally, and the recommended logic level is 1.8 V. Table 19: Pin Definition of I2C Interfaces Pin Name Pin No. I/O Description Comment TP_I2C_SCL TP_I2C_SDA CAM_I2C_SCL CAM_I2C_SDA 47 48 83 84 OD I2C clock signal of touch panel OD I2C data signal of touch panel Used for touch panel OD I2C clock signal of camera OD I2C data signal of camera Used for camera 8 As for SC20-CE R1.1/-CEL R1.1, SC20-E/-EL, SC20-A/-AL, SC20-AU/-AUL, SC20-J/-JL, SC20-EU, pins 105, 116, 117, 118 and 119 are GPIO_0, GPIO_11, GPIO_10, GPIO_9 and GPIO_8 respectively; as for SC20-AX, SC20-EX, pins 105, 116, 117, 118 and 119 are GPIO_15, GPIO_3, GPIO_2, GPIO_1 and GPIO_0 respectively. SC20_Series_Hardware_Design 53 / 133 SENSOR_I2C_SCL 91 OD SENSOR_I2C_SDA 92 OD I2C clock signal for external sensor I2C data signal for external sensor Smart Module Series Used for external sensor 3.16. ADC Interfaces SC20 series provides three analog-to-digital converter (ADC) interfaces, and the pin definition is shown below. Table 20: Pin Definition of ADC Interfaces Pin Name Pin No. I/O Description Comment ADC 128 AI General purpose ADC Maximum input voltage: 1.7 V. VBAT_SNS 133 AI Battery voltage detect Maximum input voltage: 4.5 V. VBAT_THERM 134 AI Battery temperature detect Internally pulled up. Externally connect it to the 47 k NTC thermistor. If it is not used, connect it to GND with a 47 k resistor. The resolution of the ADC pin is up to 16 bits and the effective resolution is 12 bits. NOTE When the input voltage exceeds the maximum input voltage of the VBAT_SNS pin, apply the voltage division design via the ADC pin instead of VBAT_SNS. 3.17. Motor Drive Interface The pin definition of motor drive interface is listed below. SC20_Series_Hardware_Design 54 / 133 Smart Module Series Table 21: Pin Definition of Motor Drive Interface Pin Name Pin No. I/O Description Comment VIB_DRV 28 PO Motor drive Connect it to the negative pole of the motor. The motor is driven by an exclusive circuit, and the reference circuit design is shown below. Figure 20: Reference Circuit for Motor Connection When the motor stops, the redundant electricity can be discharged from the circuit loop formed by diodes, thus avoiding damage to components. 3.18. LCM Interface SC20 series provides one LCM interface, which is MIPI_DSI standard compliant. The interface supports high-speed differential data transmission with one 4-lane MIPI_DSI and a transmission rate of up to 1.5 Gbps/lane. It supports up to 720P resolution display. Table 22: Pin Definition of LCM Interface Pin Name Pin No. I/O Description Comment LDO6_1V8 125 PO LDO17_2V85 129 PO 1.8 V output power supply for LCM I/O ports Vnom = 1.8 V IOmax = 100 mA 2.85 V output power supply for LCM VCC Vnom = 2.85 V IOmax = 300 mA PWM 29 DO PWM output Adjust the backlight brightness. SC20_Series_Hardware_Design 55 / 133 LCD_RST LCD_TE MIPI_DSI_CLKN MIPI_DSI_CLKP MIPI_DSI_LN0N MIPI_DSI_LN0P MIPI_DSI_LN1N MIPI_DSI_LN1P MIPI_DSI_LN2N MIPI_DSI_LN2P MIPI_DSI_LN3N MIPI_DSI_LN3P 49 50 52 53 54 55 56 57 58 59 60 61 DO LCD reset Smart Module Series 1.8 V power domain. Active low. DI LCD tearing effect 1.8 V power domain. AO LCD MIPI clock (-) AO LCD MIPI clock (+) AO LCD MIPI data 0 (-) AO LCD MIPI data 0 (+) AO LCD MIPI data 1 (-) AO LCD MIPI data 1 (+) AO LCD MIPI data 2 (-) AO LCD MIPI data 2 (+) AO LCD MIPI data 3 (-) AO LCD MIPI data 3 (+) 4-lane MIPI_DSI is needed for connection with 720P display. The following shows a reference circuit design, which takes the connection with LCM interface of LHR050H41-00 (IC: ILI9881C) from HUARUI Lighting as an example. SC20_Series_Hardware_Design 56 / 133 Smart Module Series Figure 21: Reference Circuit Design for LCM Interface MIPI are high speed signal lines. It is recommended that common-mode filters should be added in series near the LCM connector, to improve protection against electromagnetic radiation interference. ICMEF112P900MFR from ICT is recommended. When compatible design with other displays is required, connect the LCD_ID pin of LCM to the modules ADC pin, and please note that the output voltage of LCD_ID cannot exceed the voltage range of ADC pin. External backlight driving circuit needs to be designed for LCM, and a reference circuit design is shown in the following figure. Backlight brightness adjustment can be realized by PWM pin of SC20 series by adjusting the duty ratio. VBAT Pin 29 PWM Module C1 2.2 F Backlight driving circuit LCM_LED+

LCM_LED-

Figure 22: Reference Design for External Backlight Driving Circuit SC20_Series_Hardware_Design 57 / 133 Smart Module Series 3.19. Touch Panel Interface SC20 series provides an I2C interface for connection with Touch Panel (TP), and it also provides the corresponding power supply and interrupt pins. The pin definition of TP interface is illustrated below. Table 23: Pin Definition of Touch Panel Interface Pin Name Pin No. I/O Description Comment LDO6_1V8 125 PO LDO17_2V85 129 PO 1.8 V output power supply for TP I/O power domain and I2C pull-up circuit Vnom = 1.8 V IOmax = 100 mA 2.85 V output power supply for TP VDD Vnom = 2.85 V IOmax = 300 mA TP_INT TP_RST TP_I2C_SCL TP_I2C_SDA 30 31 47 48 DI TP interrupt 1.8 V power domain. DO TP reset 1.8 V power domain. Active low. OD TP I2C clock 1.8 V power domain. OD TP I2C data 1.8 V power domain. The following illustrates a TP interface reference circuit, by taking the connection with TP interface of LHR050H41-00 (IC: GT9147) from HUARUI Lighting as an example. LDO6_1V8 LDO17_2V85 R1 2.2K R2 2.2K TP_I2C_SDA TP_I2C_SCL TP_RST TP_INT Module D1 D2 D3 D4 C1 C2 D5 4.7 F 100 nF 1 2 3 4 5 6 SDA 1.8 V SCL 1.8 V RESET 1.8 V INT 1.8 V GND VDD 2.8 V TP Figure 23: Reference Circuit Design for TP Interface SC20_Series_Hardware_Design 58 / 133 Smart Module Series 3.20. Camera Interfaces Based on standard MIPI_CSI video input interface, SC20 series supports two cameras (2-lane + 1-lane), and the maximum pixel of the rear camera can be up to 8 MP. The video and photo quality are determined by various factors such as the camera sensor, camera lens quality, etc. It is recommended to select a proper camera model, according to the specification of cameras verified and recommended by Quectel. The following models of camera sensors have been verified by Quectel:

For rear camera: Hi843 of SK Hynix, T4KA3 of TOSHIBA For front camera: Hi259 of SK Hynix, SP2508 of SuperPix 3.20.1. Rear Camera Interface The rear camera realizes transmission and control via its FPC and a connector which is connected to the module. The rear camera interface integrates a two-lane MIPI_CSI for differential data transmission, and it supports up to 8 MP camera. The pin definition of rear camera interface is shown below. Table 24: Pin Definition of Rear Camera Interface Pin Name Pin No. I/O Description Comment LDO6_1V8 125 PO LDO17_2V85 129 PO 1.8 V output power supply for DOVDD of camera 2.85 V output power supply for AVDD of camera Vnom = 1.8 V IOmax = 100 mA Vnom = 2.85 V IOmax = 300 mA MIPI_CSI0_CLKN 63 MIPI_CSI0_CLKP 64 MIPI_CSI0_LN0N 65 MIPI_CSI0_LN0P 66 MIPI_CSI0_LN1N 67 MIPI_CSI0_LN1P 68 AI AI AI AI AI AI Rear camera MIPI clock (-) Rear camera MIPI clock (+) Rear camera MIPI data 0 (-) Rear camera MIPI data 0 (+) Rear camera MIPI data 1 (-) Rear camera MIPI data 1 (+) CAM0_MCLK 74 DO Clock of rear camera SC20_Series_Hardware_Design 59 / 133 Smart Module Series CAM0_RST CAM0_PWD CAM_I2C_SCL CAM_I2C_SDA 79 80 83 84 DO Reset of rear camera DO Power down of rear camera OD I2C clock of camera OD I2C data of camera The following is a reference circuit design for rear camera interface, by taking the connection with T4KA3 camera as an example. 5 6 5 6 5 6 Figure 24: Reference Circuit Design for Rear Camera Interface NOTE DVDD_1V2 is used to power the rear camera core, and VDD_AF_2V8 is used to power the rear camera AF circuit. Both are powered by external LDOs. 3.20.2. Front Camera Interface The front camera interface integrates a one-lane MIPI_CSI for differential data transmission, and it supports up to 2 MP camera. SC20_Series_Hardware_Design 60 / 133 Smart Module Series The pin definition of front camera interface is shown below. Table 25: Pin Definition of Front Camera Interface Pin Name Pin No. I/O Description Comment LDO6_1V8 125 PO LDO17_2V85 129 PO 1.8 V output power supply for DOVDD of camera 2.85 V output power supply for AVDD of camera Vnom = 1.8 V IOmax = 100 mA Vnom = 2.85 V IOmax = 300 mA MIPI_CSI1_CLKN 70 MIPI_CSI1_CLKP 71 MIPI_CSI1_LN0N 72 MIPI_CSI1_LN0P 73 CAM1_MCLK CAM1_RST CAM1_PWD CAM_I2C_SCL CAM_I2C_SDA 75 81 82 83 84 AI AI AI AI Front camera MIPI clock (-) Front camera MIPI clock (+) Front camera MIPI data (-) Front camera MIPI data (+) DO Clock of front camera DO Reset of front camera DO Power down of front camera OD I2C clock of camera OD I2C data of camera The following is a reference circuit design for front camera interface, by taking the connection with SP2508 camera as an example. SC20_Series_Hardware_Design 61 / 133 Smart Module Series Figure 25: Reference Circuit Design for Front Camera Interface 3.20.3. Design Considerations Special attention should be paid to the definition of video device interfaces in schematic design. Different video devices will have varied definitions for their corresponding connectors. Ensure the device and the connectors are correctly connected. MIPI are high speed signal lines, supporting maximum data rate of up to 1.5 Gbps. The differential impedance should be controlled to 100 . Additionally, it is recommended to route the traces on the inner layer of PCB, and do not cross them with other traces. For the same video device, keep all the MIPI traces of the same length. In order to avoid crosstalk, 1.5 times of the trace width is recommended to be maintained among MIPI signal lines. During impedance matching, do not connect GND on different planes to ensure impedance consistency. It is recommended to select a low-capacitance TVS for ESD protection and the recommended parasitic capacitance is below 1 pF. Route MIPI traces according to the following rules:

a) The total trace length should not exceed 305 mm;

b) Control the differential impedance as 100 10 %;

c) Control intra-lane length difference within 0.67 mm;

d) Control inter-lane length difference within 1.3 mm. SC20_Series_Hardware_Design 62 / 133 Table 26: MIPI Trace Length Inside the Module Pin No. Pin Name Length (mm) Length Difference (P-N) Smart Module Series 52 53 54 55 56 57 58 59 60 61 63 64 65 66 67 68 70 71 72 73 MIPI_DSI_CLKN MIPI_DSI_CLKP MIPI_DSI_LN0N MIPI_DSI_LN0P MIPI_DSI_LN1N MIPI_DSI_LN1P MIPI_DSI_LN2N MIPI_DSI_LN2P MIPI_DSI_LN3N MIPI_DSI_LN3P MIPI_CSI0_CLKN MIPI_CSI0_CLKP MIPI_CSI0_LN0N MIPI_CSI0_LN0P MIPI_CSI0_LN1N MIPI_CSI0_LN1P MIPI_CSI1_CLKN MIPI_CSI1_CLKP MIPI_CSI1_LN0N MIPI_CSI1_LN0P 7.08 6.45 6.15 5.85 6.64 6.60 8.20 8.94 9.28 10.24 10.55 11.09 12.13 12.53 13.73 14.49 17.32 17.45 18.89 19.24

-0.63

-0.30

-0.04 0.74 0.96 0.54 0.40 0.76 0.13 0.35 3.21. Sensor Interfaces SC20 series supports communication with sensors via an I2C interface, and it supports ALS/PS, compass, SC20_Series_Hardware_Design 63 / 133 gravity sensor, and gyroscopic sensors. Verified sensor models by Quectel include: BST-BMA223, STK3311-WV, MPU-6881 and MMC35240PJ. Smart Module Series Table 27: Pin Definition of Sensor Interfaces Pin Name Pin No. I/O Description Comment SENSOR_I2C_SCL 91 OD I2C clock for external sensor 1.8 V power domain. SENSOR_I2C_SDA 92 OD I2C data for external sensor 1.8 V power domain. GPIO_88 GPIO_89 GPIO_94 GPIO_36 GPIO_65 GPIO_96 99 100 107 108 109 110 DI DI DI DI DI DI Gyroscope sensor interrupt 2 Gyroscope sensor interrupt 1 Proximity sensor interrupt Compass sensor interrupt Gravity sensor interrupt 2 Gravity sensor interrupt 1 Default configuration. Including but not limited to these GPIO pins. 3.22. Audio Interfaces SC20 series provides two analog input channels and three analog output channels. The following table shows the pin definition. Table 28: Pin Definition of Audio Interfaces Pin Name Pin No. I/O Description Comment MIC1P MIC_GND MIC2P EARP EARN 4 5 6 8 9 AI Microphone input for channel 1 (+) Microphone reference ground AI Microphone input for headset (+) AO Earpiece output (+) AO Earpiece output (-) SC20_Series_Hardware_Design 64 / 133 Smart Module Series SPKP SPKN HPH_R HPH_GND HPH_L HS_DET 10 11 136 137 138 139 AO Speaker output (+) AO Speaker output (-) AO Headphone right channel output AI Headphone reference ground AO Headphone left channel output AI Headset hot-plug detect High level by default. The module offers two audio input channels which are both single-ended channels. The earpiece interface uses differential output. The loudspeaker interface uses differential output as well. The output channel is available with a Class-D amplifier whose output power is 879 mW when VBAT is 4.2 V and load is 8 . The headphone interface features stereo left and right channel output, and supports headphone insertion detect. 3.22.1. Reference Circuit Design for Microphone Interface Figure 26: Reference Circuit Design for Microphone Interface SC20_Series_Hardware_Design 65 / 133 3.22.2. Reference Circuit Design for Earpiece Interface Smart Module Series EARP EARN Module C2 33 pF C1 33 pF C3 33 pF F1 0R F2 0R D1 D2 Figure 27: Reference Circuit Design for Earpiece Interface 3.22.3. Reference Circuit Design for Headphone Interface Figure 28: Reference Circuit Design for Headphone Interface SC20_Series_Hardware_Design 66 / 133 3.22.4. Reference Circuit Design for Loudspeaker Interface Smart Module Series Figure 29: Reference Circuit Design for Loudspeaker Interface 3.22.5. Audio Interfaces Design Considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) to filter out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied to filter out RF interference when the module is transmitting at EGSM900. Without this capacitor, TDD noise could be heard during voice calls. The 10 pF capacitor is used to filter out RF interference at DCS1800. Please note that the resonant frequency point of a capacitor largely depends on its material and manufacturing technique. Therefore, you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high-frequency noises. The severity of RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, you should select a suitable capacitor according to the test results. Sometimes, even no RF filtering capacitor is required. The capacitor which is used for filtering out RF noise should be close to the audio device or audio interface. The trace should be as short as possible, and it is recommended to route the trace for capacitors first and then for other points. In order to decrease radio or other signal interference, place RF antennas away from audio interfaces and audio traces. Additionally, keep power traces far away from the audio traces and do not route them in parallel. Route the differential audio traces according to the differential signal layout rule. SC20_Series_Hardware_Design 67 / 133 Smart Module Series 3.23. Emergency Download Interface USB_BOOT is an emergency download interface. You can force the module to enter emergency download mode by pulling it up to LDO5_1V8 during power-up. This is an emergency option when failures such as abnormal start-up or running occur. For firmware upgrade and debugging in the future, reserve the following reference design. Figure 30: Reference Circuit Design for Emergency Download Interface SC20_Series_Hardware_Design 68 / 133 Smart Module Series 4 Wi-Fi and Bluetooth SC20 series provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth functions. The interface impedance is 50 . External antennas such as PCB antenna, sucker antenna and ceramic antenna can be connected to the module via the interface to achieve Wi-Fi and Bluetooth functions. 4.1. Wi-Fi Overview SC20 series module supports 2.4 GHz and 5 GHz dual-band WLAN wireless communication based on IEEE 802.11a/b/g/n standard protocols. The maximum data rate is up to 150 Mbps. The features are as below:

Supports Wake-on-WLAN (WoWLAN) Supports ad hoc mode Supports WAPI SMS4 hardware encryption Supports AP mode Supports Wi-Fi Direct Supports MCS 07 for HT20 and HT40 4.1.1. Wi-Fi Performance The following table lists the Wi-Fi transmitting and receiving performance of SC20 series. Table 29: Wi-Fi Transmitting Performance Standard 802.11b 802.11b Rate 1 Mbps Output Power 16 dBm 2.5 dB 11 Mbps 16 dBm 2.5 dB 2.4 GHz 802.11g 6 Mbps 16 dBm 2.5 dB 802.11g 54 Mbps 14 dBm 2.5 dB 802.11n HT20 MCS0 15 dBm 2.5 dB SC20_Series_Hardware_Design 69 / 133 Smart Module Series 802.11n HT20 802.11n HT40 802.11n HT40 MCS7 MCS0 MCS7 Mode 802.11a WLAN 5.2GHz 802.11n-HT20 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB Output Power 11 dBm 2 dB 12 dBm 2 dB 802.11n-HT40 11 dBm 2.5 dB 802.11a 11 dBm 2.5 dB WLAN 5.3GHz 802.11n-HT20 12 dBm 2 dB 802.11n-HT40 11 dBm 2.5 dB 802.11a 11 dBm 2 dB WLAN 5.3GHz 802.11n-HT20 11 dBm 2.5 dB 802.11n-HT40 10 dBm 2.5 dB 802.11a 10 dBm 2.5 dB WLAN 5.8GHz 802.11n-HT20 802.11n-HT40 10 dBm 2 dB 9 dBm 2 dB Table 30: Wi-Fi Receiving Performance Standard 802.11b 802.11b 2.4 GHz 802.11g 802.11g Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps 802.11n HT20 MCS0 Sensitivity

-96 dBm

-87 dBm

-91 dBm

-74 dBm

-90 dBm SC20_Series_Hardware_Design 70 / 133 Smart Module Series 802.11n HT20 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 5 GHz MCS7 MCS0 MCS7 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7

-72 dBm

-87 dBm

-68 dBm

-90 dBm

-71 dBm

-88 dBm

-69 dBm

-86 dBm

-66 dBm Referenced specifications are listed below:

IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11a, IEEE Std 802.11b, IEEE Std 802.11g: IEEE 802.11-2007 WLAN MAC and PHY, June 2007 4.2. Bluetooth Overview SC20 series supports Bluetooth 4.2 (BR/EDR + BLE) specification, as well as GFSK, 8-DPSK,

/4-DQPSK modulation modes. Maximally supports up to 7 wireless connections. Maximally supports up to 3.5 piconets at the same time. Supports one SCO or eSCO connection. The BR/EDR channel bandwidth is 1 MHz, and can accommodate 79 channels. The BLE channel bandwidth is 2 MHz, and can accommodate 40 channels. Table 31: Bluetooth Data Rate and Version Version Data rate Maximum Application Throughput 1.2 1 Mbit/s

> 80 kbit/s SC20_Series_Hardware_Design 71 / 133 Smart Module Series 2.0 + EDR 3 Mbit/s

> 80 kbit/s 3.0 + HS 24 Mbit/s Reference 3.0 + HS 4.2 24 Mbit/s Reference 4.2 LE Referenced specifications are listed below:

Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 + HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.2.0, December 15, 2009 4.2.1. Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of SC20 series. Table 32: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 2-DH5 3-DH5 Transmitting Power 10 dBm 2.5 dB 8 dBm 2.5 dB 8 dBm 2.5 dB Receiver Performance Packet Types DH5 Receiving Sensitivity

-93 dBm 2-DH5

-92 dBm 3-DH5

-86 dBm SC20_Series_Hardware_Design 72 / 133 Smart Module Series 5 GNSS SC20 series integrates a IZat GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS/BeiDou/GLONASS or GPS/BeiDou/Galileo. With an embedded LNA, the module provides greatly improved positioning accuracy. 5.1. GNSS Performance The following table lists the GNSS performance of the SC20 series in conduction mode. Table 33: GNSS Performance Parameter Description Cold start Sensitivity Reacquisition Tracking Cold start TTFF Warm start Hot start Typ.

-146

-157

-157 32 30 2 Static Drift CEP-50 2.5 Unit dBm dBm dBm s s s m SC20_Series_Hardware_Design 73 / 133 Smart Module Series 5.2. GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below:

Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference. In user systems, place GNSS RF signal lines and RF components far away from high-speed circuits, switch-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. For applications with harsh electromagnetic environment or high ESD-protection requirements, it is recommended to add ESD protective diodes for the antenna interface. The junction capacitance of the diodes should be less than 0.5 pF. Otherwise, it will influence the impedance characteristic of RF circuit loop, or cause attenuation of bypass RF signals. Control the impedance of feeder lines and PCB traces to 50 , and keep the trace as short as possible. See Chapter 6.3 for reference circuit designs of GNSS antenna. SC20_Series_Hardware_Design 74 / 133 Smart Module Series 6 Antenna Interfaces SC20 series provides four antenna interfaces for the main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/Bluetooth antenna, respectively. The antenna ports have an impedance of 50 . 6.1. Main/Rx-diversity Antenna Interfaces The pin definition of main/Rx-diversity antenna interfaces is shown below. Table 34: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No. ANT_MAIN 87 ANT_DRX 131 I/O AIO AI Description Comment Main antenna interface Rx-diversity antenna interface 50 impedance 6.1.1. Operating Frequency Table 35: SC20-CE R1.1/-CEL R1.1 Operating Frequencies 3GPP Band EGSM900 DCS1800 Receive 925960 Transmit 880915 18051880 17101785 WCDMA B1 21102170 19201980 WCDMA B8 925960 EVDO/CDMA BC0 869894 880915 824849 TD-SCDMA B34 20102025 20102025 TD-SCDMA B39 18801920 18801920 Unit MHz MHz MHz MHz MHz MHz MHz SC20_Series_Hardware_Design 75 / 133 Smart Module Series LTE-FDD B1 21102170 19201980 LTE-FDD B3 18051880 17101785 LTE-FDD B5 LTE-FDD B8 869894 925960 824849 880915 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 LTE-TDD B41 9 25552655 25552655 Table 36: SC20-E/-EL/-EX Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 Receive 869894 925960 Transmit 824849 880915 18051880 17101785 19301990 18501910 WCDMA B1 21102170 19201980 WCDMA B5 WCDMA B8 869894 925960 824849 880915 LTE-FDD B1 21102170 19201980 LTE-FDD B3 18051880 17101785 LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B8 LTE-FDD B20 925960 791821 880915 832862 MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 9 The bandwidth of LTE-TDD B41 for SC20-CE R1.1/-CEL R1.1 and SC20-E/-EL is 100 MHz (25552655 MHz), and the corresponding channel range is 4024041240. SC20_Series_Hardware_Design 76 / 133 Smart Module Series LTE-TDD B38 25702620 25702620 LTE-TDD B40 23002400 23002400 LTE-TDD B41 10 25552655 25552655 Table 37: SC20-A/-AL/-AX Operating Frequencies 3GPP Band GSM850 PCS1900 WCDMA B1 WCDMA B2 Receive 869894 19301990 21102170 19301990 WCDMA B4 21102155 WCDMA B5 WCDMA B8 869894 925960 LTE-FDD B2 19301990 LTE-FDD B4 21102155 LTE-FDD B5 869894 Transmit 824849 18501910 19201980 18501910 17101755 824849 880915 18501910 17101755 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B12 LTE-FDD B13 729746 746756 699716 777787 LTE-FDD B25 19301995 18501915 LTE-FDD B26 859894 814849 MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 10 The bandwidth of LTE-TDD B41 for SC20-EX is 200 MHz (24962690 MHz), and the corresponding channel range is 3965041589. SC20_Series_Hardware_Design 77 / 133 Smart Module Series Table 38: SC20-AU/-AUL Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B5 WCDMA B8 Receive 869894 925960 18051880 19301990 21102170 19301990 869894 925960 LTE-FDD B1 21102170 LTE-FDD B3 18051880 LTE-FDD B5 869894 Transmit 824849 880915 17101785 18501910 19201980 18501910 824849 880915 19201980 17101785 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B8 LTE-FDD B28 925960 758803 880915 703748 LTE-TDD B40 23002400 23002400 Table 39: SC20-J/-JL Operating Frequencies 3GPP Band Receive Transmit WCDMA B1 21102170 19201980 WCDMA B6 WCDMA B8 WCDAM B19 875885 925960 875890 LTE-FDD B1 21102170 LTE-FDD B3 18051880 830840 880915 830845 19201980 17101785 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz SC20_Series_Hardware_Design 78 / 133 Smart Module Series LTE-FDD B8 LTE-FDD B18 LTE-FDD B19 LTE-FDD B26 925960 860875 875890 859894 880915 815830 830845 814849 LTE-TDD B41 11 25452655 25452655 Table 40: SC20-EU Module Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B5 WCDMA B8 Receive 869894 925960 18051880 19301990 21102170 19301990 869894 925960 LTE-FDD B1 21102170 LTE-FDD B2 19301990 LTE-FDD B3 18051880 LTE-FDD B5 869894 Transmit 824849 880915 17101785 18501910 19201980 18501910 824849 880915 19201980 18501910 17101785 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28A 925960 791821 758788 880915 832862 703733 LTE-TDD B38 25702620 25702620 MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 11 The bandwidth of LTE-TDD B41 for SC20-J/-JL is 110 MHz (25452655 MHz), and the corresponding channel range is 4014041240. SC20_Series_Hardware_Design 79 / 133 Smart Module Series 6.1.2. Main and Rx-diversity Antenna Interfaces Reference Design A reference circuit design for main and Rx-diversity antenna interfaces is shown below. Reserve a -type matching circuit for each antenna to achieve better RF performance, and place the -type matching components (R1/C1/C2, R2/C3/C4) as close to the antennas as possible. The capacitors are not mounted by default and the resistors are 0 . Figure 31: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces 6.2. Wi-Fi/Bluetooth Antenna Interface The following tables show the pin definition and frequency specification of the Wi-Fi/Bluetooth antenna interface. Table 41: Pin Definition of Wi-Fi/Bluetooth Antenna Interface Pin Name Pin No. I/O Description Comment ANT_WIFI/BT 77 AIO Wi-Fi/Bluetooth antenna interface 50 impedance Table 42: Wi-Fi/Bluetooth Frequency Type 802.11a/b/g/n Frequency 24002482 Unit MHz SC20_Series_Hardware_Design 80 / 133 51805825 Bluetooth 4.2 LE 24022480 MHz Smart Module Series NOTE The supported Wi-Fi frequencies of SC20-J/-JL are 24002496 MHz and 51805825 MHz. A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. A -type matching circuit should be reserved for better RF performance. The -type matching components (R1, C1, C2) should be placed as close to the antenna as possible and are mounted according to the actual debugging. C1 and C2 are not mounted by default and the resistor is 0 . Figure 32: Reference Circuit Design for Wi-Fi/Bluetooth Antenna 6.3. GNSS Antenna Interface The following tables show pin definition and frequency specification of the GNSS antenna interface. Table 43: Pin Definition of GNSS Antenna Interface Pin Name Pin No. ANT_GNSS 121 I/O AI Description Comment GNSS antenna interface 50 impedance SC20_Series_Hardware_Design 81 / 133 Smart Module Series Table 44: GNSS Frequency Type Frequency GPS/Galileo 1575.42 1.023 GLONASS 1597.51605.8 BeiDou 1561.098 2.046 Unit MHz MHz MHz 6.3.1. Recommended Circuit for Passive Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Figure 33: Reference Circuit Design for GNSS Passive Antenna NOTE When the passive antenna is placed far away from the module (that is, the antenna trace is long), it is recommended to add an external LNA circuit for better GNSS receiving performance, and the LNA should be placed close to the antenna. 6.3.2. Recommended Circuit for Active Antenna The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Despite its low power consumption, the active antenna still requires stable and clean power supplies. Therefore, it is recommended to use high-performance LDO as the power supply. A reference design for GNSS active antenna is shown below. SC20_Series_Hardware_Design 82 / 133 Smart Module Series Figure 34: Reference Circuit Design for GNSS Active Antenna 6.4. Reference Design for RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 35: Microstrip Design on a 2-layer PCB SC20_Series_Hardware_Design 83 / 133 Smart Module Series Figure 36: Coplanar Waveguide Design on a 2-layer PCB Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) SC20_Series_Hardware_Design 84 / 133 Smart Module Series In order to ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . Design the GND pins adjacent to RF pins as thermal relief pads, and fully connect them to ground. Keep the distance between the RF pins and the RF connector as short as possible. Change all the right-angle traces to curved ones and the recommended trace angle is 135. Reserve clearance under the signal pin of the antenna connector or solder joint. Keep the reference ground of RF traces complete. Meanwhile, add some ground vias around RF traces and the reference ground to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. 6.5. Antenna Installation 6.5.1. Antenna Requirements The following table shows the requirement on the main antenna, RX-diversity antenna, Wi-Fi/Bluetooth antenna and a GNSS antenna. Table 45: Antenna Requirements Type Requirements GSM/WCDMA/TD-SCDMA/

LTE VSWR: 2 Gain:

GSM900: 2.38dBi GSM1800: 1.33dBi WCDMA Band 1/LTE Band 1: 1.53dBi WCDMA Band 8/LTE Band 8: 2.98dBi LTE Band 3: 2.0dBi LTE Band 7: 3.0dBi LTE Band 20: 2.64dBi LTE Band 38: 2.3dBi LTE Band 40: 1.88dBi LTE Band 41: 3.6dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical SC20_Series_Hardware_Design 85 / 133 Smart Module Series Cable Insertion Loss: < 1 dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, EVDO/CDMA BC0, LTE-FDD B5/B8/B12/B13/B18/B19/B20/B26/B28) Cable Insertion Loss: < 1.5 dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, TD-SCDMA B34/B39, LTE-FDD B1/B2/B3/B4/B25, LTE-TDD B39) Cable Insertion Loss: < 2 dB

(LTE-FDD B7, LTE-TDD B38/B40/B41) VSWR: 2 Gain:

Bluetooth/WLAN 2.4G Antenna:0.47dBi WLAN 5.2G Antenna: -0.67 dBi WLAN 5.3G Antenna: -0.19 dBi WLAN 5.5G Antenna: 1.28 dBi WLAN 5.8G Antenna: 1.10 dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable Insertion Loss: < 1 dB Frequency range: 15591609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive Antenna Gain: > 0 dBi Active Antenna Noise Figure: < 1.5 dB (Typ.) Active Antenna Gain: > -2 dBi Active Antenna Embedded LNA Gain: < 17 dB (Typ.) Active Antenna Total Gain: < 17 dBi (Typ.) Wi-Fi/Bluetooth GNSS 12 6.5.2. Recommended RF Connector for Antenna Installation If an RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. 12 It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. SC20_Series_Hardware_Design 86 / 133 Smart Module Series Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of the mated connector. SC20_Series_Hardware_Design 87 / 133 Smart Module Series Figure 41: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. SC20_Series_Hardware_Design 88 / 133 Smart Module Series 7 Reliability, Radio and Electrical Characteristics 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 46: Absolute Maximum Ratings Parameter VBAT USB_VBUS Peak Current of VBAT Voltage on Digital Pins Min.

-0.5

-0.5 0

-0.3 Max. Unit 6 16 3 2.3 V V A V 7.2. Power Supply Ratings Table 47: Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT Voltage drop during transmitting burst The actual input voltages must stay between the minimum and maximum values. Maximum power control level at EGSM900. 3.5 3.8 4.2 V

400 mV SC20_Series_Hardware_Design 89 / 133 Smart Module Series IVBAT Peak supply current (during transmission slot) Maximum power control level at EGSM900.

1.8 3.0 A USB_VBUS USB detection 4.35 5.0 6.3 V VRTC Power supply voltage of the backup battery 2.0 3.0 3.25 V 7.3. Charging Performance Specifications Table 48: Charging Performance Specifications Parameter Min. Typ. Max. Unit Trickle charging-A current 81 90 99 mA Trickle charging-A threshold voltage range

(15.62 mV steps) Trickle charging-B threshold voltage range

(18.75 mV steps) Charge voltage range (25 mV steps) Charge voltage accuracy Charge current range (90 mA steps) Charge current accuracy Charge termination current:

when the charge current is from 90 mA to 450 mA Charge termination current:

when charge current is from 450 mA to 1440 mA 2.5 2.796 2.984 V 3.0 3.2 3.581 4.2 4.775 V V

2 1440 mA 10

4

90

7 7.4 SC20_Series_Hardware_Design 90 / 133 Smart Module Series 7.4. Operating and Storage Temperatures The operating temperature is listed in the following table. Table 49: Operating and Storage Temperatures Parameter Operating temperature range 13 Storage Temperature Range Min.

-35

-40 Typ.

+25

Max. Unit

+75

+90 C C 7.5. Power Consumption The values of current consumption are shown below. Table 50: SC20-CE R1.1/-CEL R1.1 Current Consumption Description Conditions Typ. Unit OFF state Power down GSM/GPRS supply current WCDMA supply current Sleep (USB disconnected)

@ DRX = 2 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 9 LTE-FDD Sleep (USB disconnected) 13 Within the operating temperature range, the module is 3GPP compliant. 20 3.85 3.01 2.91 3.30 2.79 2.49 2.33 5.60 A mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 91 / 133 supply current

@ DRX = 5 Smart Module Series Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 EGSM900 PCL = 5 @ 31.84 dBm EGSM900 PCL = 12 @ 18.49 dBm EGSM900 PCL = 19 @ 4.95 dBm DCS1800 PCL = 0 @ 28.91 dBm DCS1800 PCL = 7 @ 15.35 dBm DCS1800 PCL = 15 @ -0.21 dBm LTE-TDD supply current GSM voice call EVDO/CDMA voice call WCDMA voice call BC0 (max power) @ 23.91 dBm BC0 (min power) @ -60.28 dBm B1 (max power) @ 22.61 dBm B8 (max power) @ 22.74 dBm 3.83 3.02 2.65 5.49 3.87 3.05 2.67 290 150 104 220 150 120 560 190 560 580 EGSM900 (1UL/4DL) @ 26.29 dBm 220 EGSM900 (2UL/3DL) @ 26.15 dBm EDGE data transfer EGSM900 (3UL/2DL) @ 26.06 dBm EGSM900 (4UL/1DL) @ 25.92 dBm DCS1800 (1UL/4DL) @ 24.89 dBm 330 420 530 180 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 92 / 133 EVDO/CDMA data transfer WCDMA data transfer LTE data transfer DCS1800 (2UL/3DL) @ 24.74 dBm DCS1800 (3UL/2DL) @ 24.54 dBm DCS1800 (4UL/1DL) @ 24.44 dBm BC0 (max power) @ 23.68 dBm B1 (HSDPA) @ 21.64 dBm B8 (HSDPA) @ 21.61 dBm B1 (HSUPA) @ 21.36 dBm B8 (HSUPA) @ 21.56 dBm LTE-FDD B1 @ 22.96 dBm LTE-FDD B3 @ 22.95 dBm LTE-FDD B5 @ 22.90 dBm LTE-FDD B8 @ 23.17 dBm LTE-TDD B38 @ 22.02 dBm LTE-TDD B39 @ 22.13 dBm LTE-TDD B40 @ 22.01 dBm LTE-TDD B41 @ 22.31 dBm Smart Module Series 270 360 450 560 540 540 560 550 750 700 680 680 400 410 410 400 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Table 51: SC20-E/-EL Current Consumption Description Conditions Typ. Unit OFF state Power down GSM/GPRS supply current WCDMA supply current Sleep (USB disconnected)

@ DRX = 2 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 6 20 3.58 2.46 2.13 2.99 A mA mA mA mA SC20_Series_Hardware_Design 93 / 133 LTE-FDD supply current LTE-TDD supply current GSM voice call Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 GSM850 PCL = 5 @ 33.13 dBm GSM850 PCL = 12 @ 19.15 dBm GSM850 PCL = 19 @ 5.31 dBm EGSM900 PCL = 5 @ 33.07 dBm EGSM900 PCL = 12 @ 19.53 dBm EGSM900 PCL = 19 @ 5.59 dBm DCS1800 PCL = 0 @ 30.00 dBm DCS1800 PCL = 7 @ 16.45 dBm DCS1800 PCL = 15 @ 0.67 dBm PCS1900 PCL = 0 @ 29.72 dBm Smart Module Series 2.35 2.01 1.85 5.51 3.56 2.62 2.14 5.93 3.74 2.70 2.17 mA mA mA mA mA mA mA mA mA mA mA 263.8 mA 134.7 mA 109.2 mA 271.2 mA 137.3 mA 110.6 mA 203.0 mA 150.7 mA 130.8 mA 195.9 mA SC20_Series_Hardware_Design 94 / 133 PCS1900 PCL = 7 @ 16.72 dBm PCS1900 PCL = 15 @ 0.98 dBm B1 (max power) @ 23.18 dBm WCDMA voice call B5 (max power) @ 23.22 dBm B8 (max power) @ 23.29 dBm GSM850 (1UL/4DL) @ 33.12 dBm GSM850 (2UL/3DL) @ 33.02 dBm GSM850 (3UL/2DL) @ 30.50 dBm GSM850 (4UL/1DL) @ 29.49 dBm EGSM900 (1UL/4DL) @ 33.10 dBm EGSM900 (2UL/3DL) @ 33.00 dBm EGSM900 (3UL/2DL) @ 30.96 dBm EGSM900 (4UL/1DL) @ 29.93 dBm DCS1800 (1UL/4DL) @ 29.96 dBm DCS1800 (2UL/3DL) @ 29.86 dBm DCS1800 (3UL/2DL) @ 29.73 dBm DCS1800 (4UL/1DL) @ 29.63 dBm PCS1900 (1UL/4DL) @ 29.77 dBm PCS1900 (2UL/3DL) @ 29.64 dBm PCS1900 (3UL/2DL) @ 29.54 dBm PCS1900 (4UL/1DL) @ 29.34 dBm GSM850 (1UL/4DL) @ 26.75 dBm GSM850 (2UL/3DL) @ 27.13 dBm GSM850 (3UL/2DL) @ 26.63 dBm GSM850 (4UL/1DL) @ 26.54 dBm GPRS data transfer EDGE data transfer Smart Module Series 151.3 mA 130.0 mA 544.1 513.5 522.7 265.9 435.1 478.8 564.0 272.7 445.0 512.0 599.2 205.8 314.3 420.8 531.7 199.3 307.2 411.5 518.7 172.2 266.6 353.1 446.9 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 95 / 133 EGSM900 (1UL/4DL) @ 27.05 dBm EGSM900 (2UL/3DL) @ 27.13 dBm EGSM900 (3UL/2DL) @ 27.28 dBm EGSM900 (4UL/1DL) @ 27.19 dBm DCS1800 (1UL/4DL) @ 26.04 dBm DCS1800 (2UL/3DL) @ 25.98 dBm DCS1800 (3UL/2DL) @ 25.71 dBm DCS1800 (4UL/1DL) @ 25.46 dBm PCS1900 (1UL/4DL) @ 26.14 dBm PCS1900 (2UL/3DL) @ 26.11 dBm PCS1900 (3UL/2DL) @ 26.11 dBm PCS1900 (4UL/1DL) @ 25.70 dBm B1 (HSDPA) @ 22.43 dBm B5 (HSDPA) @ 22.23 dBm B8 (HSDPA) @ 22.24 dBm B1 (HSUPA) @ 22.30 dBm B5 (HSUPA) @ 21.93 dBm B8 (HSUPA) @ 21.90 dBm LTE-FDD B1 @ 23.29 dBm LTE-FDD B3 @ 23.29 dBm LTE-FDD B5 @ 23.44 dBm WCDMA data transfer LTE data transfer LTE-FDD B7 @ 23.28 dBm LTE-FDD B8 @ 23.44 dBm LTE-FDD B20 @ 23.36 dBm LTE-TDD B38 @ 23.19 dBm Smart Module Series 182 177.4 278.3 371.0 170.6 260.5 349.8 440.2 171.0 260.5 349.6 442.3 503.8 471.6 481.6 504.6 460.5 464.8 737 756 636 842 639 684 427 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 96 / 133 Smart Module Series LTE-TDD B40 @ 23.17 dBm LTE-TDD B41 @ 23.19 dBm 427 455 mA mA Table 52: SC20-EX Current Consumption Description Conditions OFF state Power down GSM/GPRS supply current WCDMA supply current LTE-FDD supply current LTE-TDD supply current GSM voice call Sleep (USB disconnected)

@ DRX = 2 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 GSM850 PCL = 5 @ 33.13 dBm Typ. Unit 7 A 4.524 mA 3.212 mA 2.873 mA 4.211 mA 3.195 mA 2.879 mA 2.63 mA 7.819 mA 5.036 mA 3.605 mA 2.956 mA 7.653 mA 5.1 mA 3.649 mA 2.975 mA 281.68 mA SC20_Series_Hardware_Design 97 / 133 GSM850 PCL = 12 @ 19.15 dBm GSM850 PCL = 19 @ 5.31 dBm EGSM900 PCL = 5 @ 33.07 dBm EGSM900 PCL = 12 @ 19.53 dBm EGSM900 PCL = 19 @ 5.59 dBm DCS1800 PCL = 0 @ 30.00 dBm DCS1800 PCL = 7 @ 16.45 dBm DCS1800 PCL = 15 @ 0.67 dBm PCS1900 PCL = 0 @ 29.72 dBm PCS1900 PCL = 7 @ 16.72 dBm PCS1900 PCL = 15 @ 0.98 dBm B1 (max power) @ 23.18 dBm WCDMA voice call B5 (max power) @ 23.22 dBm B8 (max power) @ 23.29 dBm GSM850 (1UL/4DL) @ 33.12 dBm GSM850 (2UL/3DL) @ 33.02 dBm GSM850 (3UL/2DL) @ 30.50 dBm GSM850 (4UL/1DL) @ 29.49 dBM GPRS data transfer EGSM900 (1UL/4DL) @ 33.10 dBm EGSM900 (2UL/3DL) @ 33.00 dBm EGSM900 (3UL/2DL) @ 30.96 dBm EGSM900 (4UL/1DL) @ 29.93 dBm DCS1800 (1UL/4DL) @ 29.96 dBm Smart Module Series 166.5 mA 114.67 mA 327.32 mA 168.33 mA 115.63 mA 235.97 mA 198.38 mA 181.44 mA 273.92 mA 232.21 mA 231.1 581.58 529.42 533.35 293.43 414.81 478.39 563.98 342.12 456.67 520.66 614.34 214.68 mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 98 / 133 Smart Module Series DCS1800 (2UL/3DL) @ 29.86 dBm DCS1800 (3UL/2DL) @ 29.73 dBm DCS1800 (4UL/1DL) @ 29.63 dBm 299.56 373.98 450.69 PCS1900 (1UL/4DL) @ 29.77 dBm 219 PCS1900 (2UL/3DL) @ 29.64 dBm PCS1900 (3UL/2DL) @ 29.54 dBm PCS1900 (4UL/1DL) @ 29.34 dBm GSM850 (1UL/4DL) @ 26.75 dBm GSM850 (2UL/3DL) @ 27.13 dBm GSM850 (3UL/2DL) @ 26.63 dBm GSM850 (4UL/1DL) @ 26.54 dBm 303.21 366.81 451.51 235.97 350.43 458.69 575.9 EGSM900 (1UL/4DL) @ 27.05 dBm 240.84 EGSM900 (2UL/3DL) @ 27.13 dBm 356.9 EDGE data transfer EGSM900 (3UL/2DL) @ 27.28 dBm EGSM900 (4UL/1DL) @ 27.19 dBm DCS1800 (1UL/4DL) @ 26.04 dBm DCS1800 (2UL/3DL) @ 25.98 dBm DCS1800 (3UL/2DL) @ 25.71 dBm DCS1800 (4UL/1DL) @ 25.46 dBm PCS1900 (1UL/4DL) @ 26.14 dBm PCS1900 (2UL/3DL) @ 26.11 dBm PCS1900 (3UL/2DL) @ 26.11 dBm PCS1900 (4UL/1DL) @ 25.70 dBm WCDMA data transfer B1 (HSDPA) @ 22.43 dBm B5 (HSDPA) @ 22.23 dBm 464.04 581.18 227.2 322.96 415.19 517.24 209.57 309.03 408.65 515.41 584.14 523.89 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 99 / 133 B8 (HSDPA) @ 22.24 dBm B1 (HSUPA) @ 22.30 dBm B5 (HSUPA) @ 21.93 dBm B8 (HSUPA) @ 21.90 dBm LTE-FDD B1 @ 23.29 dBm LTE-FDD B3 @ 23.29 dBm LTE-FDD B5 @ 23.44 dBm LTE-FDD B7 @ 23.28 dBm LTE data transfer LTE-FDD B8 @ 23.44 dBm LTE-FDD B20 @ 23.36 dBm LTE-TDD B38 @ 23.19 dBm LTE-TDD B40 @ 23.17 dBm LTE-TDD B41 @ 23.19 dBm Smart Module Series 533.04 593.77 535.61 542.95 778.16 808.09 622.64 862.03 621.15 824.42 504.64 440.76 492.68 mA mA mA mA mA mA mA mA mA mA mA mA mA Table 53: SC20-A/-AL Current Consumption Description Conditions Typ. Unit OFF state Power down GSM/GPRS supply current WCDMA supply current Sleep USB disconnected)

@ DRX = 2 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 9 20 4.08 3.10 2.77 3.86 2.90 2.55 2.43 A mA mA mA mA mA mA mA SC20_Series_Hardware_Design 100 / 133 LTE-FDD supply current GSM voice call Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 GSM850 PCL = 5 @ 32.23 dBm GSM850 PCL = 12 @ 18.34 dBm GSM850 PCL = 19 @ 4.87 dBm PCS1900 PCL = 0 @ 29.14 dBm PCS1900 PCL = 7 @ 16.23 dBm PCS1900 PCL = 15 @ 0.62 dBm B1 (max power) @ 23.24 dBm B2 (max power) @ 23.40 dBm WCDMA voice call B4 (max power) @ 23.20 dBm B5 (max power) @ 23.47 dBm B8 (max power) @ 23.5 dBm GSM850 (1UL/4DL) @ 32.18 dBm GSM850 (2UL/3DL) @ 32.00 dBm GSM850 (3UL/2DL) @ 30.43 dBm GSM850 (4UL/1DL) @ 29.37 dBm PCS1900 (1UL/4DL) @ 29.13 dBm PCS1900 (2UL/3DL) @ 29.19 dBm PCS1900 (3UL/2DL) @ 29.05 dBm PCS1900 (4UL/1DL) @ 28.84 dBm GPRS data transfer Smart Module Series 6.60 4.24 3.11 2.77 mA mA mA mA 254.60 mA 136.30 mA 111.30 mA 196.60 mA 158.40 mA 135.50 mA 548.13 575.70 561.35 558.00 557.10 254.50 410.70 496.10 573.90 198.70 306.50 408.90 514.60 mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 101 / 133 EDGE data transfer WCDMA data transfer GSM850 (1UL/4DL) @ 26.39 dBm GSM850 (2UL/3DL) @ 26.30 dBm GSM850 (3UL/2DL) @ 26.30 dBm GSM850 (4UL/1DL) @ 26.07 dBm PCS1900 (1UL/4DL) @ 25.70 dBm PCS1900 (2UL/3DL) @ 25.55 dBm PCS1900 (3UL/2DL) @ 25.39 dBm PCS1900 (4UL/1DL) @ 25.17 dBm B1 (HSDPA) @ 22.24 dBm B2 (HSDPA) @ 22.44 dBm B4 (HSDPA) @ 22.23 dBm B5 (HSDPA) @ 22.38 dBm B8 (HSDPA) @ 22.47 dBm B1 (HSUPA) @ 22.2 dBm B2 (HSUPA) @ 22.4 dBm B4 (HSUPA) @ 21.93 dBm B5 (HSUPA) @ 22.26 dBm B8 (HSUPA) @ 22 dBm LTE-FDD B2 @ 23.05 dBm LTE-FDD B4 @ 23.3 dBm LTE-FDD B5 @ 23.13 dBm LTE data transfer LTE-FDD B7 @ 22.75 dBm LTE-FDD B12 @ 22.74 dBm LTE-FDD B13 @ 23.3 dBm LTE-FDD B25 @ 23.2 dBm Smart Module Series 186.00 280.00 368.00 456.00 184.40 276.60 365.20 456.50 506.35 535.10 523.07 513.13 512.30 516.00 545.60 527.93 528.94 507.70 710.01 736.50 626.18 733.40 606.02 674.84 665.62 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 102 / 133 Smart Module Series LTE-FDD B26 @ 23.57 dBm 718.75 mA Table 54: SC20-AX Current Consumption Description Conditions Typ. Unit OFF state Power down GSM/GPRS supply current WCDMA supply current LTE-FDD supply current GSM voice call Sleep USB disconnected)

@ DRX = 2 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 GSM850 PCL = 5 @ 33.1 dBm GSM850 PCL = 12 @ 19.04 dBm GSM850 PCL = 19 @ 5.11 dBm PCS1900 PCL = 0 @ 30.08 dBm PCS1900 PCL = 7 @ 16.09 dBm PCS1900 PCL = 15 @ 0.13 dBm 20 4 3.1 2.7 3.7 3.1 2.8 2.7 6.8 4.5 3.5 3 A mA mA mA mA mA mA mA mA mA mA mA 369.49 mA 205.485 mA 178.282 mA 270.83 mA 221.75 mA 204.162 mA SC20_Series_Hardware_Design 103 / 133 B1 (max power) @ 23.41 dBm B2 (max power) @ 23.27 dBm WCDMA voice call B4 (max power) @ 23.44 dBm GPRS data transfer B5 (max power) @ 23.4 dBm B8 (max power) @ 23.32 dBm GSM850 (1UL/4DL) @ 33.34 dBm GSM850 (2UL/3DL) @ 32.68 dBm GSM850 (3UL/2DL) @ 30.19 dBm GSM850 (4UL/1DL) @ 28.96 dBm PCS1900 (1UL/4DL) @ 30.49 dBm PCS1900 (2UL/3DL) @ 29.87 dBm PCS1900 (3UL/2DL) @ 27.54 dBm PCS1900 (4UL/1DL) @ 26.89dBm GSM850 (1UL/4DL) @ 27.22 dBm GSM850 (2UL/3DL) @ 25.95 dBm GSM850 (3UL/2DL) @ 24 dBm GSM850 (4UL/1DL) @ 22.92 dBm Smart Module Series 611.94 625.14 567.13 583.06 556.48 295.23 448.25 495.96 568.51 230.49 334.16 385.52 464.14 211.59 287.5 335.15 393.81 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transfer PCS1900 (1UL/4DL) @ 26.67 dBm 200.204 mA PCS1900 (2UL/3DL) @ 25.19 dBm PCS1900 (3UL/2DL) @ 23.61dBm PCS1900 (4UL/1DL) @ 22.74 dBm B1 (HSDPA) @ 23.1 dBm B2 (HSDPA) @ 23.03 dBm B4 (HSDPA) @ 23.19 dBm B5 (HSDPA) @ 23.09 dBm 289.62 363.04 436.22 599.17 626.91 599.46 574.8 mA mA mA mA mA mA mA WCDMA data transfer SC20_Series_Hardware_Design 104 / 133 Smart Module Series B8 (HSDPA) @ 23.1 dBm 540.98 mA B1 (HSUPA) @ 22.66 dBm B2 (HSUPA) @ 22.38 dBm B4 (HSUPA) @ 21.56 dBm B5 (HSUPA) @ 22.25 dBm B8 (HSUPA) @ 22.34 dBm LTE-FDD B2 @ 23.11 dBm LTE-FDD B4 @ 23.44 dBm LTE-FDD B5 @ 23.61 dBm LTE-FDD B7 @ 23.50 dBm LTE-FDD B12 @ 23.16 dBm LTE-FDD B13 @ 23.04 dBm LTE-FDD B25 @ 23.30 dBm LTE-FDD B26 @ 23.44 dBm 616.34 654.26 594.59 575.03 549.07 790.67 749.6 702.76 866.24 649.1 684.23 813.32 805.7 mA mA mA mA mA mA mA mA mA mA mA mA mA LTE data transfer Table 55: SC20-AU/-AUL Current Consumption Description Conditions Typ. Unit OFF state Power down GSM/GPRS supply current WCDMA supply current Sleep (USB disconnected)

@ DRX = 2 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 20 3.31 2.30 2.01 2.79 2.21 1.90 A mA mA mA mA mA mA SC20_Series_Hardware_Design 105 / 133 LTE-FDD supply current LTE-TDD supply current GSM voice call Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 GSM850 PCL = 5 @ 32.96 dBm GSM850 PCL = 12 @ 18.83 dBm GSM850 PCL = 19 @ 5.31 dBm EGSM900 PCL = 5 @ 32.96 dBm EGSM900 PCL = 12 @ 19.21 dBm EGSM900 PCL = 19 @ 5.60 dBm DCS1800 PCL = 0 @ 29.93 dBm DCS1800 PCL = 7 @ 16.29 dBm DCS1800 PCL = 15 @ 0.62 dBm PCS1900 PCL = 0 @ 29.67 dBm PCS1900 PCL = 7 @ 16.74 dBm PCS1900 PCL = 15 @ 1.09 dBm Smart Module Series 1.75 5.29 3.59 2.76 2.24 5.52 3.71 2.76 2.28 268 133 109 267 137 108 202 152 131 194 149 130 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 106 / 133 WCDMA voice call GPRS data transfer EDGE data transfer B1 (max power) @ 23.33 dBm B2 (max power) @ 23.51 dBm B5 (max power) @ 23.37 dBm B8 (max power) @ 23.38 dBm GSM850 (1UL/4DL) @ 32.91 dBm GSM850 (2UL/3DL) @ 32.26 dBm GSM850 (3UL/2DL) @ 30.72 dBm GSM850 (4UL/1DL) @ 29.38 dBm EGSM900 (1UL/4DL) @ 32.92 dBm EGSM900 (2UL/3DL) @ 32.74 dBm EGSM900 (3UL/2DL) @ 30.85 dBm EGSM900 (4UL/1DL) @ 29.58 dBm DCS1800 (1UL/4DL) @ 39.81 dBm DCS1800 (2UL/3DL) @ 39.70 dBm DCS1800 (3UL/2DL) @ 29.50 dBm DCS1800 (4UL/1DL) @ 29.34 dBm PCS1900 (1UL/4DL) @ 29.58 dBm PCS1900 (2UL/3DL) @ 29.48 dBm PCS1900 (3UL/2DL) @ 29.31 dBm PCS1900 (4UL/1DL) @ 29.40 dBm GSM850 (1UL/4DL) @ 26.70 dBm GSM850 (2UL/3DL) @ 27.02 dBm GSM850 (3UL/2DL) @ 26.60 dBm GSM850 (4UL/1DL) @ 26.33 dBm EGSM900 (1UL/4DL) @ 26.87 dBm Smart Module Series 561 521 551 478 267 388 503 574 266 396 509 583 205 316 398 530 182 285 385 498 166 300 389 457 178 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 107 / 133 EGSM900 (2UL/3DL) @ 27.27 dBm EGSM900 (3UL/2DL) @ 26.85 dBm EGSM900 (4UL/1DL) @ 26.53 dBm DCS1800 (1UL/4DL) @ 25.39 dBm DCS1800 (2UL/3DL) @ 25.40 dBm DCS1800 (3UL/2DL) @ 25.35 dBm DCS1800 (4UL/1DL) @ 25.05 dBm PCS1900 (1UL/4DL) @ 26.03 dBm PCS1900 (2UL/3DL) @ 26.07 dBm PCS1900 (3UL/2DL) @ 25.81 dBm PCS1900 (4UL/1DL) @ 25.70 dBm B1 (HSDPA) @ 23.02 dBm B2 (HSDPA) @ 23.11 dBm B5 (HSDPA) @ 22.68 dBm B8 (HSDPA) @ 22.72 dBm B1 (HSUPA) @ 22.39 dBm B2 (HSUPA) @ 23.19 dBm B5 (HSUPA) @ 22.44 dBm B8 (HSUPA) @ 22.25 dBm LTE-FDD B1 @ 23.37 dBm LTE-FDD B3 @ 23.06 dBm LTE-FDD B5 @ 23.25 dBm LTE-FDD B7 @ 22.82 dBm LTE-FDD B8 @ 23.47 dBm LTE-FDD B28 @ 23.13 dBm Smart Module Series 276 394 490 197 287 373 461 168 257 345 436 517 550 486 466 521 509 503 474 698 709 643 802 620 756 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA data transfer LTE data transfer SC20_Series_Hardware_Design 108 / 133 Smart Module Series LTE-TDD B40 @ 23.24 dBm 388 mA Table 56: SC20-J/-JL Current Consumption Description Conditions Typ. Unit OFF state Power down WCDMA supply current LTE-FDD supply current LTE-TDD supply current WCDMA voice call Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 B1 (max power) @ 22.80 dBm B6 (max power) @ 23.09 dBm B8 (max power) @ 23.02 dBm B19 (max power) @ 23.07 dBm WCDMA data transfer B1 (HSDPA) @ 22.13 dBm B6 (HSDPA) @ 22.05 dBm 20 3.07 2.41 2.11 1.95 5.17 3.50 2.60 2.16 5.40 3.53 2.62 2.17 460 505 504 505 482 477 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 109 / 133 B8 (HSDPA) @ 22.17 dBm B19 (HSDPA) @ 22.31 dBm B1 (HSUPA) @ 21.4 dBm B6 (HSUPA) @ 22.05 dBm B8 (HSUPA) @ 21.57 dBm B19 (HSUPA) @ 22.14 dBm LTE-FDD B1 @ 23.64 dBm LTE-FDD B3 @ 23.52 dBm LTE-FDD B8 @ 23.40 dBm LTE data transfer LTE-FDD B18 @ 23.45 dBm LTE-FDD B19 @ 23.42 dBm LTE-FDD B26 @ 23.36 dBm LTE-TDD B41 @ 23.23 dBm Table 57: SC20-EU Current Consumption Smart Module Series 471 500 494 499 472 496 636 673 637 650 642 645 451 mA mA mA mA mA mA mA mA mA mA mA mA mA Description Conditions Typ. Unit OFF state Power down GSM/GPRS supply current Sleep (USB disconnected) DRX = 2 Sleep (USB disconnected) DRX = 5 Sleep (USB disconnected) DRX = 9 Sleep (USB disconnected) DRX = 6 WCDMA supply current Sleep (USB disconnected) DRX = 7 Sleep (USB disconnected) DRX = 8 Sleep (USB disconnected) DRX = 9 LTE-FDD Sleep (USB disconnected) DRX = 5 20 3.58 2.46 2.13 2.99 2.35 2.01 1.85 5.51 A mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 110 / 133 supply current Sleep (USB disconnected) DRX = 6 Sleep (USB disconnected) DRX = 7 Sleep (USB disconnected) DRX = 8 Sleep (USB disconnected) DRX = 5 Sleep (USB disconnected) DRX = 6 Sleep (USB disconnected) DRX = 7 Sleep (USB disconnected) DRX = 8 LTE-TDD supply current GSM voice call GSM850 PCL = 5 @ 32.29 dBm GSM850 PCL = 12 @ 19.04 dBm GSM850 PCL = 19 @ 5.21 dBm EGSM900 PCL = 5 @ 32.44 dBm EGSM900 PCL = 12 @ 19.23 dBm EGSM900 PCL = 19 @ 5.64 dBm DCS1800 PCL = 0 @ 29.46 dBm DCS1800 PCL = 7 @ 16.31 dBm DCS1800 PCL = 15 @ 0.65 dBm PCS1900 PCL = 0 @ 29.69 dBm PCS1900 PCL = 7 @ 16.62 dBm PCS1900 PCL = 15 @ 1.03 dBm WCDMA voice call B1 (max power) @ 22.92 dBm B2 (max power) @ 22.93 dBm B5 (max power) @ 23.14 dBm B8 (max power) @ 23.1 dBm Smart Module Series 3.56 2.62 2.14 5.93 3.74 2.70 2.17 245 127 101 250 128 103 189 141 123 188 141 122 525 535 552 519 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 111 / 133 GSM850 (1UL/4DL) @ 32.45 dBm GSM850 (2UL/3DL) @ 32.27 dBm GSM850 (3UL/2DL) @ 30.12 dBm GSM850 (4UL/1DL) @ 29.17 dBm EGSM900 (1UL/4DL) @ 32.82 dBm EGSM900 (2UL/3DL) @ 32.63 dBm EGSM900 (3UL/2DL) @ 30.69 dBm EGSM900 (4UL/1DL) @ 29.72 dBm DCS1800 (1UL/4DL) @ 29.76 dBm DCS1800 (2UL/3DL) @ 29.62 dBm DCS1800 (3UL/2DL) @ 27.34 dBm DCS1800 (4UL/1DL) @ 26.50 dBm PCS1900 (1UL/4DL) @ 30.04 dBm PCS1900 (2UL/3DL) @ 29.92 dBm PCS1900 (3UL/2DL) @ 27.98 dBm PCS1900 (4UL/1DL) @ 26.80 dBm GSM850 (1UL/4DL) @ 26.39 dBm GSM850 (2UL/3DL) @ 26.32 dBm GSM850 (3UL/2DL) @ 24.39 dBm GSM850 (4UL/1DL) @ 23.58 dBm EGSM900 (1UL/4DL) @ 26.72 dBm EGSM900 (2UL/3DL) @ 26.63 dBm EGSM900 (3UL/2DL) @ 24.59 dBm EGSM900 (4UL/1DL) @ 23.76 dBm DCS1800 (1UL/4DL) @ 25.77 dBm Smart Module Series 249 408 468 551 252 415 481 569 195 305 357 432 191 298 356 425 171 257 310 372 172 263 315 379 178 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GPRS data transfer EDGE data transfer SC20_Series_Hardware_Design 112 / 133 DCS1800 (2UL/3DL) @ 25.64 dBm DCS1800 (3UL/2DL) @ 23.52 dBm DCS1800 (4UL/1DL) @ 22.37 dBm PCS1900 (1UL/4DL) @ 26.13 dBm PCS1900 (2UL/3DL) @ 25.95 dBm PCS1900 (3UL/2DL) @ 23.62 dBm PCS1900 (4UL/1DL) @ 22.46 dBm B1 (HSDPA) @ 22.48 dBm B2 (HSDPA) @ 22.45 dBm B5 (HSDPA) @ 22.41 dBm B8 (HSDPA) @ 22.41 dBm B1 (HSUPA) @ 21.85 dBm B2 (HSUPA) @ 21.86 dBm B5 (HSUPA) @ 21.46 dBm B8 (HSUPA) @ 21.52 dBm LTE-FDD B1 @ 22.87 dBm LTE-FDD B2 @ 22.97 dBm LTE-FDD B3 @ 22.79 dBm LTE-FDD B5 @ 23.03 dBm WCDMA data transfer LTE data transfer LTE-FDD B7 @ 22.41 dBm LTE-FDD B8 @ 23.22 dBm LTE-FDD B20 @ 23.08 dBm LTE-FDD B28A @ 22.92 dBm LTE-TDD B38 @ 22.67 dBm Smart Module Series 261 322 392 167 249 313 386 494 490 510 479 496 475 489 468 652 713 672 641 749 619 618 741 375 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC20_Series_Hardware_Design 113 / 133 Smart Module Series 7.6. Tx Power The following table shows the RF output power of the SC20 series. Table 58: RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 33 dBm 2 dB 5 dBm 5 dB 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm WCDMA B19 24 dBm +1/-3 dB

< -49 dBm EVDO-CDMA BC0 24 dBm +3/-1 dB

< -49 dBm TD-SCDMA B34 24 dBm +1/-3 dB

< -49 dBm TD-SCDMA B39 24 dBm +1/-3 dB

< -49 dBm LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm SC20_Series_Hardware_Design 114 / 133 Smart Module Series LTE-FDD B8 23 dBm 2 dB LTE-FDD B12 23 dBm 2 dB LTE-FDD B13 23 dBm 2 dB LTE-FDD B18 23 dBm 2 dB LTE-FDD B19 23 dBm 2 dB LTE-FDD B20 23 dBm 2 dB LTE-FDD B25 23 dBm 2 dB LTE-FDD B26 23 dBm 2 dB LTE-FDD B28 23 dBm 2 dB LTE-TDD B38 23 dBm 2 dB LTE-TDD B39 23 dBm 2 dB LTE-TDD B40 23 dBm 2 dB LTE-TDD B41 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm NOTE In GPRS 4-slot Tx mode, the maximum output power is reduced by 3 dB. This design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 7.7. Rx Sensitivity The following table shows the RF receiving sensitivity of the SC20 series. Table 59: SC20-CE R1.1/-CEL R1.1 RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) EGSM900

-109 dBm

-102 dBm SC20_Series_Hardware_Design 115 / 133 DCS1800

-109 dBm WCDMA B1

-110 dBm WCDMA B8

-110 dBm EVDO-CDMA BC0

-108 dBm TD-SCDMA B34

-113 dBm TD-SCDMA B39

-113 dBm

Smart Module Series

-102 dBm

-106.7 dBm

-103.7 dBm

-104 dBm

-108 dBm

-108 dBm

LTE-FDD B1 (10 MHz)

-98 dBm

-99.1 dBm

-100.6 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-98 dBm

-98.1 dBm

-101 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.3 dBm

-99.5 dBm

-101.7 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98.2 dBm

-99 dBm

-101 dBm

-93.3 dBm LTE-TDD B38 (10 MHz)

-98.3 dBm

-98 dBm

-99 dBm

-96.3 dBm LTE-TDD B39 (10 MHz)

-98.5 dBm

-98.8 dBm

-99.5 dBm

-96.3 dBm LTE-TDD B40 (10 MHz)

-98.8 dBm

-98.6 dBm

-101 dBm

-96.3 dBm LTE-TDD B41 (10 MHz)

-98.5 dBm

-98 dBm

-101 dBm

-94.3 dBm Table 60: SC20-E/-EL RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) GSM850

-109 dBm

EGSM900

-109 dBm

DCS1800 PCS1900

-109 dBm

-109 dBm WCDMA B1

-110 dBm WCDMA B5

-110 dBm WCDMA B8

-110 dBm

-102 dBm

-102 dBm

-102 dBm

-102 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm SC20_Series_Hardware_Design 116 / 133 Smart Module Series LTE-FDD B1 (10 MHz)

-98 dBm

-99 dBm

-102 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-97 dBm

-98 dBm

-101 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-99 dBm

-98 dBm

-102 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97 dBm

-97 dBm

-102 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98 dBm

-98 dBm

-101 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-98 dBm

-98 dBm

-101 dBm

-93.3 dBm LTE-TDD B38 (10 MHz)

-97 dBm

-98 dBm

-100 dBm

-96.3 dBm LTE-TDD B40 (10 MHz)

-97 dBm

-98 dBm

-100 dBm

-96.3 dBm LTE-TDD B41 (10 MHz)

-96 dBm

-98 dBm

-100 dBm

-94.3 dBm Table 61: SC20-EX RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) GSM850

-109.5 dBm EGSM900

-109.5 dBm DCS1800 PCS1900

-109 dBm

-109 dBm

WCDMA B1

-109.5 dBm

-109.5 dBm WCDMA B5

-110 dBm

-110 dBm WCDMA B8

-110 dBm

-110 dBm

-102 dBm

-102 dBm

-102 dBm

-102 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-97.5 dBm

-97.6 dBm

-100.6 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-97.7 dBm

-99.2 dBm

-101.5 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.9 dBm

-100.3 dBm

-102.6 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.3 dBm

-98.2 dBm

-100.8 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98.5 dBm

-97.6 dBm

-101.1 dBm

-93.3 dBm SC20_Series_Hardware_Design 117 / 133 Smart Module Series LTE-FDD B20 (10 MHz)

-98.1 dBm

-99.4 dBm

-101.7 dBm

-93.3 dBm LTE-TDD B38 (10 MHz)

-95.9 dBm

-96.8 dBm

-99.1 dBm

-96.3 dBm LTE-TDD B40 (10 MHz)

-96.5 dBm

-97.5 dBm

-99.8 dBm

-96.3 dBm LTE-TDD B41 (10 MHz)

-95.5 dBm

-95.1 dBm

-98.3 dBm

-94.3 dBm Table 62: SC20-A/-AL RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO GSM850 PCS1900

-109.5 dBm

-109 dBm

3GPP (SIMO)

-102 dBm

-102 dBm WCDMA B1

-110 dBm

-110 dBm

-113 dBm

-106.7 dBm WCDMA B2

-110 dBm

-110 dBm

-113 dBm

-104.7 dBm WCDMA B4

-110 dBm

-110 dBm

-113 dBm

-106.7 dBm WCDMA B5

-110 dBm

-111 dBm

-113 dBm

-104.7 dBm WCDMA B8

-110 dBm

-103.7 dBm LTE-FDD B2 (10 MHz)

-98 dBm

-99 dBm

-102 dBm

-94.3 dBm LTE-FDD B4 (10 MHz)

-97.5 dBm

-98 dBm

-101 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-99.5 dBm

-99.5 dBm

-102.5 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97 dBm

-99 dBm

-100 dBm

-94.3 dBm LTE-FDD B12 (10 MHz)

-98.5 dBm

-98.5 dBm

-101 dBm

-93.3 dBm LTE-FDD B13 (10 MHz)

-96.5 dBm

-99 dBm

-101 dBm

-93.3 dBm LTE-TDD B25 (10 MHz)

-99 dBm

-99 dBm

-102 dBm

-92.8 dBm LTE-TDD B26 (10 MHz)

-99 dBm

-100 dBm

-102.5 dBm

-93.8 dBm SC20_Series_Hardware_Design 118 / 133 Smart Module Series Table 63: SC20-AX RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO GSM850 PCS1900

-110.0dBm

-108.9 dBm

3GPP (SIMO)

-102 dBm

-102 dBm WCDMA B1

-109.5 dBm

-110.8 dBm

-112.8 dBm

-106.7 dBm WCDMA B2

-110.2 dBm

-110.7 dBm

-112.7 dBm

-104.7 dBm WCDMA B4

-109.2 dBm

-110.0 dBm

-112 dBm

-106.7 dBm WCDMA B5

-111.0 dBm

-112 dBm

--114 dBm

-104.7 dBm WCDMA B8

-110.0 dBm

-103.7 dBm LTE-FDD B2 (10 MHz)

-97 dBm

-99.2 dBm

-100.8 dBm

-94.3 dBm LTE-FDD B4 (10 MHz)

-97 dBm

-99.5 dBm

-101 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-99.5 dBm

-99.9 dBm

-102.6 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-96.5 dBm

-97.7 dBm

-100.7 dBm

-94.3 dBm LTE-FDD B12 (10 MHz)

-98.5 dBm

-98.5 dBm

-101.5 dBm

-93.3 dBm LTE-FDD B13 (10 MHz)

-96.8 dBm

-98.9 dBm

-101 dBm

-93.3 dBm LTE-TDD B25 (10 MHz)

-98.4 dBm

-98.8 dBm

-100.9 dBm

-92.8 dBm LTE-TDD B26 (10 MHz)

-99.3 dBm

-100.0 dBm

-102.6 dBm

-93.8 dBm Table 64: SC20-AU/-AUL RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO GSM850 EGSM900 DCS1800

-109 dBm

-109 dBm

-108 dBm

3GPP (SIMO)

-102 dBm

-102 dBm

-102 dBm SC20_Series_Hardware_Design 119 / 133 Smart Module Series PCS1900

-109 dBm

-102 dBm WCDMA B1

-110 dBm

-110 dBm

-113 dBm

-106.7 dBm WCDMA B2

-110 dBm

-104.7 dBm WCDMA B5

-110 dBm

-110 dBm

-113 dBm

-104.7 dBm WCDMA B8

-110 dBm

-110 dBm

-113 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98 dBm

-99 dBm

-101 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-97 dBm

-98 dBm

-101.8 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-99 dBm

-100 dBm

-103 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97 dBm

-99 dBm

-100.6 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98 dBm

-100 dBm

-102 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-97.5 dBm

-100 dBm

-101.8 dBm

-94.8 dBm LTE-TDD B40 (10 MHz)

-97 dBm

-98 dBm

-100.7 dBm

-96.3 dBm Table 65: SC20-J/-JL RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) WCDMA B1

-110 dBm

-110 dBm

-113 dBm

-106.7 dBm WCDMA B6

-110 dBm

-112 dBm

-113 dBm

-106.7 dBm WCDMA B8

-110 dBm

-110 dBm

-113 dBm

-103.7 dBm WCDMA B19

-110 dBm

-111 dBm

-113 dBm

-106.7 dBm LTE-FDD B1 (10 MHz)

-97 dBm

-97.5 dBm

-100 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-97 dBm

-98 dBm

-101.8 dBm

-93.3 dBm LTE-FDD B8 (10 MHz)

-97 dBm

-98 dBm

-100 dBm

-93.3 dBm LTE-FDD B18 (10 MHz)

-98 dBm

-99 dBm

-101.5 dBm

-96.3 dBm LTE-TDD B19 (10 MHz)

-98 dBm

-99 dBm

-101.5 dBm

-96.3 dBm SC20_Series_Hardware_Design 120 / 133 Smart Module Series LTE-TDD B26 (10 MHz)

-98 dBm

-99 dBm

-101.5 dBm

-93.8 dBm LTE-TDD B41 (10 MHz)

-96 dBm

-96.5 dBm

-100 dBm

-94.3 dBm Table 66: SC20-EU RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) GSM850 EGSM900 DCS1800 PCS1900

-109 dBm

-109 dBm

-108 dBm

-109 dBm

-102 dBm

-102 dBm

-102 dBm

-102 dBm WCDMA B1

-110 dBm

-110 dBm

-113 dBm

-106.7 dBm WCDMA B2

-110 dBm WCDMA B5

-110 dBm

-104.7 dBm

-104.7 dBm WCDMA B8

-110 dBm

-110 dBm

-113 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98 dBm

-99 dBm

-101 dBm

-96.3 dBm LTE-FDD B2 (10 MHz)

-98 dBm

-94.3 dBm LTE-FDD B3 (10 MHz)

-98 dBm

-99 dBm

-101 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-99 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-96 dBm

-98 dBm

-100 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98 dBm

-100 dBm

-102 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-96 dBm

-98 dBm

-100 dBm

-93.3 dBm LTE-FDD B28A (10 MHz)

-97 dBm

-99 dBm

-100.5 dBm

-94.8 dBm LTE-TDD B38 (10 MHz)

-96 dBm

-98 dBm

-100 dBm

-96.3 dBm SC20_Series_Hardware_Design 121 / 133 Smart Module Series 7.8. ESD The module is not protected against electrostatic discharge (ESD) in general. Consequently, it should be subject to ESD handling precautions that are typically applied to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the electrostatic discharge characteristics of the SC20 series. Table 67: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces USB Interface Other Interfaces 5 5 0.5 0.5 10 10 1 1 kV kV kV kV SC20_Series_Hardware_Design 122 / 133 Smart Module Series 8 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the tolerances for dimensions without tolerance values are 0.2 mm. 8.1. Mechanical Dimensions Figure 42: Module Top and Side Dimensions SC20_Series_Hardware_Design 123 / 133 Smart Module Series Figure 43: Module Bottom Dimensions (Top View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. SC20_Series_Hardware_Design 124 / 133 8.2. Recommended Footprint Smart Module Series Figure 44: Recommended Footprint (Top View) NOTE 1. For easy maintenance of the module, keep at least 5 mm between the module and other components on the host PCB. 2. All RESERVED pins should be kept open and MUST NOT be connected to ground. SC20_Series_Hardware_Design 125 / 133 8.3. Top and Bottom Views Smart Module Series Figure 45: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC20_Series_Hardware_Design 126 / 133 Smart Module Series 9 Storage, Manufacturing and Packaging 9.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 hours 14 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be 14 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. SC20_Series_Hardware_Design 127 / 133 put in a dry environment such as in a drying oven. Smart Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 9.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 46: Recommended Reflow Soldering Thermal Profile SC20_Series_Hardware_Design 128 / 133 Smart Module Series Table 68: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 23 C/s 4070 s 235 C to 246 C

-1.5 to -3 C/s 1 1. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 2. Avoid using ultrasonic technology for module cleaning and soldering since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering) that is not mentioned in document [4]. 9.3. Packaging Specification SC20 series is packaged in tape and reel carriers. Each reel is 12.32 meters long and contains 200 modules. The following figures show the package details, measured in mm. SC20_Series_Hardware_Design 129 / 133 Smart Module Series Figure 47: Tape Dimensions Figure 48: Reel Dimensions Table 69: Reel Packaging Model Name SC20 series MOQ for MP Minimum Package: 200 pcs Minimum Package 4 = 800 pcs 200 pcs Size: 370 mm 350 mm 85 mm N.W.: 1.92 kg G.W.: 3.17 kg Size: 380 mm 365 mm 365 mm N.W.: 7.68 kg G.W.: 13.63 kg SC20_Series_Hardware_Design 130 / 133 Smart Module Series 10 Appendix References Table 70: Related Documents Document Name

[1] Quectel_Smart_EVB_User_Guide

[2] Quectel_SC20_Series_GPIO_Configuration

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_Secondary_SMT_Application_Note

[5] Quectel_SC20_Series_Reference_Design Table 71: Terms and Abbreviations Abbreviation Description ADC AMR AP bps Analog-to-Digital Converter Adaptive Multi-rate Access Point Bits per Second CDMA Code Division Multiple Access CS CSD CSI CTS DC Coding Scheme Circuit Switched Data Camera Serial Interface Clear to Send Dual Carrier SC20_Series_Hardware_Design 131 / 133 Smart Module Series DRX DSI DSP EDGE EFR EGSM eSCO ESD ESR FDD FR GMSK GNSS GPIO GPRS GPS GPU GSM HR HSDPA HSPA HSPA+

HSUPA IC I/O Discontinuous Reception Display Serial Interface Digital Signal Processor Enhanced Data Rate for GSM Evolution Enhanced Full Rate Enhanced GSM Extended Synchronous Connection Oriented Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplex Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System General Purpose Input/Output General Packet Radio Service Global Positioning System Graphics Processing Unit Global System for Mobile Communications Half Rate High Speed Downlink Packet Access High Speed Packet Access High-Speed Packet Access+

High Speed Uplink Packet Access Integrated Circuit Input/Output SC20_Series_Hardware_Design 132 / 133 Smart Module Series I2C LCC LCD LCM LDO LE LED LGA LNA LTE MCS MIPI NTC PCB PDU PWM PSK QAM QPSK RF RTC RTS Rx SAW SCO Inter-Integrated Circuit Leadless Chip Carrier Liquid Crystal Display LCD Module Low Dropout Regulator Low Energy Light Emitting Diode Land Grid Array Low Noise Amplifier Long-Term Evolution Modulation and Coding Scheme Mobile Industry Processor Interface Negative Temperature Coefficient Printed Circuit Board Protocol Data Unit Pulse Width Modulation Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Real Time Clock Request to Send Receive Surface Acoustic Wave Synchronous Connection Oriented SC20_Series_Hardware_Design 133 / 133 SD Card Secure Digital Card Smart Module Series SMS SPI TDD TP TVS Tx UART UMTS USB

(U)SIM VBAT Vmax Vmin Vnom VI VIHmin VILmax VOHmax VOHmin VOLmax WCDMA WLAN Short Message Service Serial Peripheral Interface Time-Division Duplex Touch Panel Transient Voltage Suppressor Transmit Universal Asynchronous Receiver & Transmitter Universal Mobile Telecommunications System Universal Serial Bus

(Universal) Subscriber Identity Module Voltage at Battery (Pin) Maximum Voltage Minimum Voltage Nominal Voltage Voltage Input Minimum High-level Input Voltage Maximum Low-level Input Voltage Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Wideband Code Division Multiple Access Wireless Local Area Network SC20_Series_Hardware_Design 134 / 133 Smart Module Series FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202201SC20AX 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum External Antenna gain (including cable loss) must not exceed:

radiation, maximum antenna gain (including cable loss) must not exceed: Operating Band FCC Max Antenna FCC Max Antenna Gain GaindBi dBi SC20-AX SC20-AX without 2&3G version GSM850 GSM1900 WCDMA BAND II WCDMA BAND IV WCDMA BAND V LTE BAND 2 LTE BAND 4 LTE BAND 5 LTE BAND 7 LTE BAND 12 LTE BAND 13 LTE BAND 25 LTE BAND 26 WLAN 2.4G WLAN 5.2G WLAN 5.3G WLAN 5.5G WLAN 5.8G Bluetooth 3 1 8 5 9 8 5 9 8 8 8 8 9 0.47

-0.67

-0.19 1.28 1.10 0.47 NA NA NA NA NA 8 5 5.5 8 5 5 8 5.5 0.47

-0.67

-0.19 1.28 1.10 0.47 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 SC20_Series_Hardware_Design 135 / 133 Smart Module Series If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR202201SC20AX or Contains FCC ID: XMR202201SC20AX must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any SC20_Series_Hardware_Design 136 / 133 Smart Module Series interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-2022SC20AX or where: 10224A-2022SC20AX is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-2022SC20AX " ou "o: 10224A-2022SC20AX est le numro de certification du module". The device is restricted to indoor use only when operating in the 5150 to 5250 MHz frequency range. Lappareil est rserv lintrieur seulement lorsquil fonctionne dans la gamme de frquences 5150 5250 MHz SC20_Series_Hardware_Design 137 / 133

 

 

 

 

 

 

 

 

 

 

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Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Federal Communications Commission Office of Engineering and Technology Laboratory Division Date: February 28, 2022 7435 Oakland Mills Rd. Columbia, MD 21046 SUBJECT: Class II Permissive Change for FCC ID: XMR202201SC20AX Dear Examiner, This is to request a Class II Permissive Change for FCC ID: XMR202201SC20AX, Model: SC20-AX (approval date: 02/28/2022) The change filed under this application is:

Disable WCDMA, GSM and voice function via software Remove the duplexer of WCDMA and GSM Except for the change above, no other modification is performed If you have any questions regarding this application, please feel free to contact me. Sincerely, Contact Person: Jean Hu E-mail: jean.hu@quectel.com

 

 

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Date: February 28, 2022 Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: XMR202201SC20AX Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Schematics PartsList Tune up Procedure The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, ____ Contact Person: Jean Hu E-mail: jean.hu@quectel.com Rev. 1/1/03

 

 

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +8602150086326 Power of Attorney Date: February 28, 2022 To whom it may concern, Please be notified that I, Jean Hu, have designated Jim Tsai in Sporton International Inc. as the person being responsible for this project and to sign the form 731 and other documentation. Any and all acts carried out by Jim Tsai in Sporton International Inc., on the matters of relating to all processes required in the FCC approval and any communication needed with the national authority, shall have the same legal authority as acts on our own behalf. We further certifies that neither the applicant nor any party to this application, as defined in 47 CFR Ch. 1.2002 (b), is subject to a denial to Federal benefits, that include FCC benefits, pursuant to section 5301 of the Anti-Drug Abuse Act of 1998, 21 U.S.C 862. This authorization is limited to the product of as following:

FCC ID: XMR202201SC20AX If you have any acknowledgement and response, please send it to Sporton International Inc. Should you have any questions or comments regarding this matter, please have my best attention. directly. Sincerely yours, Contact Person: Jean Hu E-mail: jean.hu@quectel.com

 

 

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XMR202201SC20AX Section 15.212 Modular Transmitters Request for Modular Approval Request for Limited Modular Approval Requirements EUT Conditions Comply (Y/N) Single Modular Approval Requirements The radio portion of this module is shielded, please see exhibition external photos. Y The module has buffer modulation/data inputs. Y The module has its own power supply regulation. Please see the schem.pdf The requirements of antenna connector and spurious emission have been fulfilled. Please refer to the Test Report exhibition. Please refer to the Setup Photo exhibition for the stand-alone test configuration. Y Y Y 1 2 3 4 5 The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. The modular transmitter must have its own power supply regulation. The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with Part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting 6 7 equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available

(see Section 15.31(i)). The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(A) If using a permanently affixed label, the modular transmitter must be labeled with its own FCC identification number, and, if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID:

XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization.

(B) If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following:

Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. The Module will be labeled with its own FCC ID, and the instruction on the labeling rule of the end product has been stated in the User Manual of this module. Please refer to the Label and User Manual exhibition. Y The required FCC rule has been fulfilled and all the instructions for maintaining compliance have been clearly stated in the User Manual. Y 8 The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. Please refer exhibition RF Exposure for the compliance of MPE RF exposure rule. Y Contact Person: Jean Hu E-mail: jean.hu@quectel.com