FCC ID: XMR2022SC200EWF Smart Module

 

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6270280.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case SC200E&SC206E Series Hardware Design Smart Module Series Version: 1.1 Date: 2022-09-23 Status: Released Smart Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-

exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. SC200E&SC206E_Series_Hardware_Design 1 / 126 Smart Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-

party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. SC200E&SC206E_Series_Hardware_Design 2 / 126 Smart Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. SC200E&SC206E_Series_Hardware_Design 3 / 126 Smart Module Series About the Document Revision History Version Date Author Description

2021-11-25 1.0 2022-04-22 Dorian MENG/

Waller GUO Dorian MENG/

Waller GUO Creation of the document First official release 1.1 2022-09-23 Dorian MENG/

Vasile WANG/

Elliot LI 1. Added SC206E series and SC200E-JP. 2. Updated the minimum supply voltage of SC200E series from 3.5 V to 3.55 V. 3. Updated the lower limit of supply voltage related to voltage drop from 3.4 V to 3.1 V (Chapter 3.4.2). 4. Updated Wi-Fi receiving sensitivity data (Chapter 4.1.1). 5. Updated Bluetooth receiving sensitivity data

(Chapter 4.2.1). 6. Updated the accuracy of GNSS under CEP-50 from 1.95 m to 2.5 m (Chapter 5.1). 7. Updated power consumption data (Chapter 7.5). 8. Updated RF receiving sensitivity data (Chapter 7.7). 9. Updated the document name of document [2]

(Chapter 10). SC200E&SC206E_Series_Hardware_Design 4 / 126 Smart Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 8 Figure Index ............................................................................................................................................... 10 1 Introduction ........................................................................................................................................ 12 2 Product Overview .............................................................................................................................. 17 Frequency Bands and Functions ............................................................................................. 17 Key Features ........................................................................................................................... 20 EVB Kit..................................................................................................................................... 24 2.1. 2.2. 2.3. 3.5. 3.5.1. 3.5.2. 3 Application Interfaces ....................................................................................................................... 25 3.1. General Description ................................................................................................................. 25 Pin Assignment ........................................................................................................................ 26 3.2. Pin Description ......................................................................................................................... 27 3.3. Power Supply ........................................................................................................................... 38 3.4. 3.4.1. Power Supply Pins ......................................................................................................... 38 3.4.2. Voltage Stability Requirements ...................................................................................... 38 3.4.3. Reference Design for Power Supply .............................................................................. 40 Turn On/Off .............................................................................................................................. 41 Turn On with PWRKEY .................................................................................................. 41 Turn Off .......................................................................................................................... 43 VRTC ....................................................................................................................................... 43 3.6. Power Output ........................................................................................................................... 44 3.7. Charging Interface ................................................................................................................... 44 3.8. 3.9. USB Interface (Type-C) ........................................................................................................... 46 3.10. UART Interfaces ...................................................................................................................... 48 3.11.

(U)SIM Interfaces..................................................................................................................... 50 3.12. SD Card Interface .................................................................................................................... 52 3.13. GPIO Interfaces ....................................................................................................................... 54 3.14. I2C Interfaces .......................................................................................................................... 55 3.15. ADC Interface .......................................................................................................................... 56 3.16. Vibration Motor Drive Interface ................................................................................................ 57 3.17. LCM Interface .......................................................................................................................... 57 3.18. Flash Interface ......................................................................................................................... 60 3.19. Touch Panel Interface .............................................................................................................. 60 3.20. Camera Interfaces ................................................................................................................... 61 3.20.1. MIPI Design Considerations .......................................................................................... 65 3.21. Sensor Interface ...................................................................................................................... 67 SC200E&SC206E_Series_Hardware_Design 5 / 126 Smart Module Series 3.22. Audio Interfaces ....................................................................................................................... 67 3.22.1. Reference Circuit Design for Microphone Interfaces ..................................................... 68 3.22.2. Reference Circuit Design for Earpiece Interface ........................................................... 69 3.22.3. Reference Circuit Design for Headset Interface ............................................................ 70 3.22.4. Reference Circuit Design for Lineout Interface .............................................................. 70 3.22.5. Audio Signal Design Considerations ............................................................................. 71 3.23. USB_BOOT Control Interface ................................................................................................. 71 4 Wi-Fi/Bluetooth ................................................................................................................................... 73 4.1. Wi-Fi ......................................................................................................................................... 73 4.1.1. Wi-Fi Performance ......................................................................................................... 73 Bluetooth .................................................................................................................................. 75 4.2.1. Bluetooth Performance .................................................................................................. 76 4.2. 5 GNSS ................................................................................................................................................... 77 5.1. GNSS Performance ................................................................................................................. 77 Reference Design .................................................................................................................... 78 5.2. 6 Antenna Interfaces ............................................................................................................................. 79 6.1. Main Antenna and Rx-diversity Antenna Interfaces ................................................................ 79 6.1.1. Operating Frequency ..................................................................................................... 79 6.1.2. Reference Design .......................................................................................................... 82 6.2. Wi-Fi/Bluetooth Antenna Interface ........................................................................................... 83 6.3. GNSS Antenna Interface ......................................................................................................... 84 6.3.1. Reference Circuit Design for Passive GNSS Antenna .................................................. 85 6.3.2. Reference Circuit Design for Active GNSS Antenna ..................................................... 85 RF Routing Guidelines ............................................................................................................ 86 Antenna Installation ................................................................................................................. 88 6.5.1. Antenna Design Requirements ...................................................................................... 88 6.5.2. RF Connector Recommendation ................................................................................... 89 6.4. 6.5. 7 Electrical Characteristics and Reliability ........................................................................................ 91 Absolute Maximum Ratings ..................................................................................................... 91 7.1. Power Supply Ratings ............................................................................................................. 91 7.2. Digital I/O Characteristics ........................................................................................................ 92 7.3. 7.4. Operating and Storage Temperatures ..................................................................................... 93 Power Consumption ................................................................................................................ 94 7.5. Tx Power ................................................................................................................................ 102 7.6. Rx Sensitivity ......................................................................................................................... 105 7.7. ESD Protection ...................................................................................................................... 108 7.8. 8 Mechanical Information ................................................................................................................... 110 8.1. Mechanical Dimensions ......................................................................................................... 110 Recommended Footprint ....................................................................................................... 112 8.2. Top and Bottom Views ........................................................................................................... 113 8.3. 9 Storage, Manufacturing & Packaging ............................................................................................ 114 SC200E&SC206E_Series_Hardware_Design 6 / 126 Smart Module Series Storage Conditions ................................................................................................................ 114 9.1. 9.2. Manufacturing and Soldering ................................................................................................ 115 Packaging Specification ......................................................................................................... 117 9.3. 9.3.1. Carrier Tape .................................................................................................................. 117 9.3.2. Plastic Reel .................................................................................................................. 118 9.3.3. Packaging Process ...................................................................................................... 118 10 Appendix References ...................................................................................................................... 120 SC200E&SC206E_Series_Hardware_Design 7 / 126 Smart Module Series Table Index Table 1: Applicable Modules ....................................................................................................................... 17 Table 2: SC200E-CE Frequency Bands and GNSS Functions ................................................................. 18 Table 3: SC200E-EM&SC206E-EM Frequency Bands and GNSS Functions .......................................... 18 Table 4: SC200E-NA&SC206E-NA Frequency Bands and GNSS Functions ........................................... 19 Table 5: SC200E-WF&SC206E-WF Frequency Bands ............................................................................. 19 Table 6: SC200E-JP Frequency Bands and GNSS Functions .................................................................. 20 Table 7: Key Features ................................................................................................................................ 20 Table 8: I/O Parameter Definition ............................................................................................................... 27 Table 9: Pin Description ............................................................................................................................. 27 Table 10: Power Description ...................................................................................................................... 44 Table 11: Pin Definition of Charging Interface ............................................................................................ 45 Table 12: Pin Definition of USB Interface ................................................................................................... 46 Table 13: USB Trace Length Inside the Module ........................................................................................ 48 Table 14: Pin Definition of UART Interfaces ............................................................................................... 48 Table 15: Pin Definition of (U)SIM Interfaces ............................................................................................. 50 Table 16: Pin Definition of SD Card Interface ............................................................................................ 52 Table 17: SD Card Trace Length Inside the Module .................................................................................. 53 Table 18: Pin Definition of GPIO Interfaces ............................................................................................... 54 Table 19: Pin Definition of I2C Interfaces ................................................................................................... 56 Table 20: Pin Definition of ADC Interface ................................................................................................... 56 Table 21: Pin Definition of Vibration Motor Drive Interface ........................................................................ 57 Table 22: Pin Definition of LCM Interface .................................................................................................. 57 Table 23: Pin Definition of Flash Interface ................................................................................................. 60 Table 24: Pin Definition of Touch Panel Interface ...................................................................................... 61 Table 25: Pin Definition of Camera Interfaces ........................................................................................... 61 Table 26: MIPI Trace Length Inside the Module ........................................................................................ 65 Table 27: Pin Definition of Sensor Interface ............................................................................................... 67 Table 28: Pin Definition of Audio Interfaces ............................................................................................... 67 Table 29: Pin Definition of USB_BOOT Control Interface .......................................................................... 71 Table 30: Wi-Fi Transmitting Performance ................................................................................................. 73 Table 31: Wi-Fi Receiving Performance ..................................................................................................... 74 Table 32: Bluetooth Data Rate and Version ............................................................................................... 76 Table 33: Bluetooth Transmitting and Receiving Performance .................................................................. 76 Table 34: GNSS Performance .................................................................................................................... 77 Table 35: Pin Definition of Main/Rx-diversity Antenna Interfaces .............................................................. 79 Table 36: SC200E-CE Operating Frequency ............................................................................................. 79 Table 37: SC200E-EM&SC206E-EM Operating Frequency ...................................................................... 80 Table 38: SC200E-NA&SC206E-NA Operating Frequency ....................................................................... 81 Table 39: SC200E-JP Operating Frequency .............................................................................................. 82 Table 40: Pin Definition of Wi-Fi/Bluetooth Antenna Interface ................................................................... 83 Table 41: Wi-Fi/Bluetooth Frequency ......................................................................................................... 83 SC200E&SC206E_Series_Hardware_Design 8 / 126 Smart Module Series Table 42: Pin Definition of GNSS Antenna Interface ................................................................................. 84 Table 43: GNSS Frequency ....................................................................................................................... 84 Table 44: Antenna Requirements ............................................................................................................... 88 Table 45: Absolute Maximum Ratings ........................................................................................................ 91 Table 46: Power Supply Ratings ................................................................................................................ 91 Table 47: 1.8 V Digital I/O Requirements ................................................................................................... 92 Table 48: (U)SIM 1.8 V I/O Requirements ................................................................................................. 92 Table 49: (U)SIM 2.95 V I/O Requirements ............................................................................................... 92 Table 50: SD Card 1.8 V I/O Requirements ............................................................................................... 93 Table 51: SD Card 2.95 V I/O Requirements ............................................................................................. 93 Table 52: Operating and Storage Temperatures ........................................................................................ 93 Table 53: SC200E-CE Power Consumption .............................................................................................. 94 Table 54: SC200E-EM&SC206E-EM Power Consumption ....................................................................... 96 Table 55: SC200E-NA&SC206E-NA Power Consumption ...................................................................... 100 Table 56: SC200E-JP Power Consumption ............................................................................................. 101 Table 57: SC200E-CE RF Tx Power ........................................................................................................ 102 Table 58: SC200E-EM&SC206E-EM RF Tx Power ................................................................................. 103 Table 59: SC200E-NA&SC206E-NA RF Tx Power .................................................................................. 104 Table 60: SC200E-JP RF Tx Power ......................................................................................................... 104 Table 61: SC200E-CE RF Rx Sensitivity (Unit: dBm) .............................................................................. 105 Table 62: SC200E-EM&SC206E-EM RF Rx Sensitivity (Unit: dBm) ....................................................... 106 Table 63: SC200E-NA&SC206E-NA RF Rx Sensitivity (Unit: dBm) ........................................................ 107 Table 64: SC200E-JP RF Rx Sensitivity (Unit: dBm) ............................................................................... 107 Table 65: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 45 %) ...................... 108 Table 66: Recommended Thermal Profile Parameters ............................................................................ 116 Table 67: Carrier Tape Dimension Table (Unit: mm) ................................................................................ 117 Table 68: Plastic Reel Dimension Table (Unit: mm) ................................................................................. 118 Table 69: Related Documents .................................................................................................................. 120 Table 70: Terms and Abbreviations .......................................................................................................... 120 SC200E&SC206E_Series_Hardware_Design 9 / 126 Smart Module Series Figure Index Figure 1: Functional Diagram ........................................................................................... !

Figure 2: Pin Assignment (Top View) ......................................................................................................... 26 Figure 3: Power Supply Limits During Burst Transmission ........................................................................ 39 Figure 4: Reference Circuit for Power Supply ........................................................................................... 39 Figure 5: Reference Circuit of Power Supply ............................................................................................. 40 Figure 6: Turn On Module with Open Collector Driver ............................................................................... 41 Figure 7: Turn On Module Using Button .................................................................................................... 41 Figure 8: Turn-on Timing ............................................................................................................................ 42 Figure 9: Forced Turn-off Timing ................................................................................................................ 43 Figure 10: RTC Powered by Coin Cell ....................................................................................................... 43 Figure 11: Reference Design for Battery Charging Circuit ........................................................................ 45 Figure 12: USB Interface Reference Design (OTG Supported) ................................................................ 47 Figure 13: Reference Circuit with Voltage-level Translator Chip for UART0 ............................................. 49 Figure 14: RS-232 Level Match Circuit for UART0 .................................................................................... 49 Figure 15: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector ........................ 51 Figure 16: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector .......................... 51 Figure 17: Reference Circuit for the SD Card Interface ............................................................................. 53 Figure 18: Reference Circuit for Motor Connection ................................................................................... 57 Figure 19: Reference Circuit Design for LCM Interface ............................................................................. 59 Figure 20: Reference Design for LCM External Backlight Driving Circuit ................................................. 60 Figure 21: Reference Circuit Design for the Touch Panel Interface .......................................................... 61 Figure 22: Reference Circuit Design for 3-Camera Applications ............................................................... 64 Figure 23: Reference Circuit Design for ECM Microphone Interface ........................................................ 68 Figure 24: Reference Circuit Design for MEMS Microphone Interface ..................................................... 69 Figure 25: Reference Circuit Design for Earpiece Interface ...................................................................... 69 Figure 26: Reference Circuit Design for Headset Interface ....................................................................... 70 Figure 27: Reference Circuit Design for Lineout Interface ........................................................................ 70 Figure 28: Reference Circuit Design for USB_BOOT Control Interface .................................................... 72 Figure 29: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces ................................. 83 Figure 30: Reference Circuit Design for Wi-Fi/Bluetooth Antenna ............................................................ 84 Figure 31: Reference Circuit Design for Passive GNSS Antenna ............................................................. 85 Figure 32: Reference Circuit Design for Active GNSS Antenna ................................................................ 86 Figure 33: Microstrip Design on a 2-layer PCB ......................................................................................... 86 Figure 34: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 87 Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 87 Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 87 Figure 37: Dimensions of the Receptacle (Unit: mm) ................................................................................ 89 Figure 38: Specifications of Mated Plugs ................................................................................................... 90 Figure 39: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 90 Figure 40: Module Top and Side Dimensions .......................................................................................... 110 Figure 41: Module Bottom Dimensions (Bottom View) ............................................................................. 111 SC200E&SC206E_Series_Hardware_Design 10 / 126 Smart Module Series Figure 42: Recommended Footprint (Top View) ...................................................................................... 112 Figure 43: Top and Bottom Views of SC200E Series .............................................................................. 113 Figure 44: Top and Bottom Views of SC206E Series .............................................................................. 113 Figure 45: Recommended Reflow Soldering Thermal Profile ................................................................. 115 Figure 46: Carrier Tape Dimension Drawing ............................................................................................ 117 Figure 47: Plastic Reel Dimension Drawing ............................................................................................ 118 Figure 48: Packaging Process ................................................................................................................. 119 SC200E&SC206E_Series_Hardware_Design 11 / 126 Smart Module Series 1 Introduction This document defines SC200E series and SC206E series modules and describes their air interface and hardware interfaces which are connected to your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-- Reorient or relocate the receiving antenna.

-- Increase the separation between the equipment and receiver.

-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-- Consult the dealer or an experienced radio/TV technician for help. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations SC200E&SC206E_Series_Hardware_Design 12 / 126 Smart Module Series 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2022SC200EWF The FCC ID can be used only when all FCC compliance requirements are met. Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

(4) The max allowed antenna gain is 0.47 dBi for 2.4G WIFI,1.28dBi for 5G WIFI for external antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-

location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device complies with ISEDs licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference SC200E&SC206E_Series_Hardware_Design 13 / 126 Smart Module Series received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d ISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et (2) ce dispositif doit accepter tout brouillage reu, y compris un brouillage susceptible de provoquer un fonctionnement indsirable. Radiation Exposure Statement:

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co- location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-

evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est SC200E&SC206E_Series_Hardware_Design 14 / 126 Smart Module Series plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following:

Contains IC: 10224A-22SC200EWF. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-22SC200EWF ". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. SC200E&SC206E_Series_Hardware_Design 15 / 126 RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz) Smart Module Series The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology. Caution:

i) The device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

ii) where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated. L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations transmettre ou de panne oprationnelle. Notez que ceci n'est pas destin interdire la transmission d'informations de contrle ou de signalisation ou l'utilisation de codes rptitifs lorsque cela est requis par la technologie. Avertissement:

i) Le dispositif utilis dans la bande 5150-5250 MHz est rserv une utilisation en intrieur afin de rduire le risque de brouillage prjudiciable aux systmes mobiles par satellite dans le mme canal;

ii) lorsquil y a lieu, les types dantennes (sil y en a plusieurs), les numros de modle de lantenne et les pires angles dinclinaison ncessaires pour rester conforme lexigence de la SC200E&SC206E_Series_Hardware_Design 16 / 126 Smart Module Series p.i.r.e. applicable au masque dlvation, nonce la section 6.2.2.3, doivent tre clairement indiqus. i. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate; and iii. where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated. 2 Product Overview 2.1. Frequency Bands and Functions SC200E series and SC206E series are Smart LTE modules based on Android and Linux operating systems, respectively, and provide industrial grade performance. The modules' general features are listed below:

Supports worldwide LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EVDO/CDMA, EDGE, GSM and GPRS coverage. Supports short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0 1. Integrates GPS/GLONASS/BDS/Galileo/QZSS/SBAS/NavIC satellite positioning systems. Supports multiple audio and video codecs. Built-in high performance AdrenoTM 702 graphics processing unit. Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces. Table 1: Applicable Modules Module Series Models SC200E SC200E-CE SC200E-EM 1 The module is compliant with all mandatory Bluetooth 5.0 features, but does not support Bluetooth 5.0 optional features like 2 Mbps BLE, Advanced Advertising Extension, etc. SC200E&SC206E_Series_Hardware_Design 17 / 126 Smart Module Series SC200E-NA SC200E-WF SC200E-JP SC206E-EM SC206E-NA SC206E-WF SC206E Table 2: SC200E-CE Frequency Bands and GNSS Functions Mode LTE-FDD LTE-TDD WCDMA EVDO/CDMA GSM Wi-Fi 802.11a/b/g/n/ac Bluetooth 5.0 GNSS Frequency Bands B1/B3/B5/B8 B34/B38/B39/B40/B41 B1/B8 BC0 EGSM900/DCS1800 24122462 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz (L1) GLONASS: 1597.51605.8 MHz (L1) BDS: 1561.098 2.046 MHz (B1I) Galileo: 1575.42 2.046 MHz (E1) QZSS: 1575.42 1.023 MHz (L1) SBAS: 1575.42 1.023 MHz (L1) Table 3: SC200E-EM&SC206E-EM Frequency Bands and GNSS Functions Mode LTE-FDD LTE-TDD WCDMA Frequency Bands B1/B2/B3/B4/B5/B7/B8/B20/B28 B38/B40/B41 B1/B2/B4/B5/B8 SC200E&SC206E_Series_Hardware_Design 18 / 126 GSM GSM850/EGSM900/DCS1800/PCS1900 Smart Module Series Wi-Fi 802.11a/b/g/n/ac Bluetooth 5.0 GNSS 24122462 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz (L1) GLONASS: 1597.51605.8 MHz (L1) BDS: 1561.098 2.046 MHz (B1I) Galileo: 1575.42 2.046 MHz (E1) QZSS: 1575.42 1.023 MHz (L1) SBAS: 1575.42 1.023 MHz (L1) Table 4: SC200E-NA&SC206E-NA Frequency Bands and GNSS Functions Mode LTE-FDD LTE-TDD Wi-Fi 802.11a/b/g/n/ac Bluetooth 5.0 GNSS Frequency Bands B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 B41 24122462 MHz 51805825 MHz 24022480 MHz GPS:

1575.42 1.023 MHz (L1) 1176.45 10.23 MHz (L5) GLONASS: 1597.51605.8 MHz (L1) BDS: 1561.098 2.046 MHz (B1I) Galileo:

1575.42 2.046 MHz (E1) 1176.45 10.23 MHz (E5a) QZSS:

1575.42 1.023 MHz (L1) 1176.45 10.23 MHz (L5) SBAS:

1575.42 1.023 MHz (L1) 1176.45 10.23 MHz (L5) NavIC: 1176.45 10.23 MHz (L5) Table 5: SC200E-WF&SC206E-WF Frequency Bands Mode Frequency Bands Wi-Fi 802.11a/b/g/n/ac 24122462 MHz SC200E&SC206E_Series_Hardware_Design 19 / 126 Smart Module Series Bluetooth 5.0 24022480 MHz 51805825 MHz Table 6: SC200E-JP Frequency Bands and GNSS Functions Mode LTE-FDD LTE-TDD WCDMA Wi-Fi 802.11a/b/g/n/ac Bluetooth 5.0 GNSS Frequency Bands B1/B3/B5/B8/B11/B18/B19/B21/B26/B28 B41 B1/B6/B8/B19 24122462 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz (L1) GLONASS: 1597.51605.8 MHz (L1) BDS: 1561.098 2.046 MHz (B1I) Galileo: 1575.42 2.046 MHz (E1) QZSS: 1575.42 1.023 MHz (L1) SBAS: 1575.42 1.023 MHz (L1) SC200E series and SC206E series are SMD type modules, which can be embedded into applications through their 274 pins, including 146 LCC pins and 128 LGA pins. With a compact profile of 40.5 mm 40.5 mm 2.85 mm, the module can meet most of the requirements for M2M applications such as edge device, edge computing, CPE, wireless POS, smart metering, router, data card, automotive, smart phone, digital signage, alarm panel, security and industry PDA, etc. 2.2. Key Features The following table describes the detailed features of the module. Table 7: Key Features Feature Application Processor Details 64-bit quad-core ARM Cortex-A53 microprocessor, up to 2.0 GHz 512 KB L2 cache SC200E&SC206E_Series_Hardware_Design 20 / 126 Smart Module Series Modem DSP Hexagon DSP v66k core 512 KB L2 cache GPU AdrenoTM 702 GPU with 64-bit addressing, up to 845 MHz Memory (Optional) Operating System Power Supply SC200E series:

32 GB eMMC + 2 GB LPDDR4X 32 GB eMMC + 3 GB LPDDR4X SC206E series:

32 GB eMMC + 2 GB LPDDR4X SC200E series: Android 12 SC206E series: Linux Supply voltage: 3.554.4 V Typical supply voltage: 3.8 V Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (30 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (24 dBm +3/-1 dB) for EVDO/CDMA BC0 Class 3 (23 dBm 2 dB) for WCDMA bands Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands SC200E-CE/-EM/-NA/-JP and SC206E-EM/-NA:

Supports 3GPP Rel-10 Cat 4 Supports 1.4/3/5/10/15/20 MHz RF bandwidth Supports Multiuser MIMO in DL direction Data rate (Max.):

Cat 4 FDD: 150 Mbps (DL)/50 Mbps (UL) Cat 4 TDD: 130 Mbps (DL)/30 Mbps (UL) Transmitting Power LTE Features SC200E-CE/-EM/-JP and SC206E-EM:

Supports 3GPP Rel-9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Supports QPSK, 16QAM and 64QAM modulations Data rate (Max.):

UMTS Features DC-HSDPA: 42 Mbps (DL) HSUPA: 5.76 Mbps (UL) WCDMA: 384 kbps (DL)/384 kbps (UL) CDMA2000 Features SC200E-CE:

Supports 3GPP2 CDMA2000 1X Advanced and 1xEVDO Rev.A EVDO: Max 3.1 Mbps (DL)/Max 1.8 Mbps (UL) 1X Advanced: Max 307.2 kbps (DL)/Max 307.2 kbps (UL) GSM Features SC200E-CE/-EM and SC206E-EM:

SC200E&SC206E_Series_Hardware_Design 21 / 126 Smart Module Series R99 CSD: 9.6 kbps, 14.4 kbps GPRS Supports GPRS multi-slot class 33 (33 by default) Coding scheme: CS 14 Max. 107 kbps (DL), 85.6 kbps (UL) EDGE Supports EDGE multi-slot class 33 (33 by default) Supports GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 19 Uplink coding schemes: MCS 19 Max. 296 kbps (DL), 236.8 kbps (UL) 2.4 GHz, 802.11b/g/n, up to 150 Mbps 5 GHz, 802.11a/n/ac, up to 433 Mbps Supports AP mode and STA mode WLAN Features Bluetooth Feature 2 Bluetooth 5.0 GNSS Features 3 SMS SC200E-CE/-EM/-JP and SC206E-EM:

GPS/GLONASS/BDS/Galileo/QZSS/SBAS, L1 SC200E-NA and SC206E-NA:

GPS/GLONASS/BDS/Galileo/QZSS/SBAS/NavIC, L1 + L5 Text and PDU mode Point-to-point MO and MT SMS cell broadcast LCM Interface Supports one group of 4-lane MIPI DSI Supports up to HD+ (1680 720) @ 60 fps Camera Interfaces Support two groups of 4-lane MIPI CSI, up to 2.5 Gbps/lane Support two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane +

1-lane) Support up to 25 MP or 13 MP + 13 MP with dual ISPs Video Codec Video encoding + decoding: 720P @ 30 fps + 1080P @ 30 fps Encoding: up to 1080P @ 30 fps; Decoding: up to 1080P @ 30 fps Audio inputs:

Two differential microphone inputs One single-ended microphone input Audio outputs:

Class AB stereo headphone output Class AB earpiece differential output Class AB line out differential output EVS, EVRC, EVRC-B, EVRC-WB G.711, G.729A, and G.729AB Audio Interfaces Audio Codec 2 The module is compliant with all mandatory Bluetooth 5.0 features, but does not support Bluetooth 5.0 optional features like 2 Mbps BLE, Advanced Advertising Extension, etc. 3 SC200E-WF and SC206E-WF do not support GNSS. SC200E&SC206E_Series_Hardware_Design 22 / 126 Smart Module Series GSM-FR, GSM-EFR, GSM-HR AMR-NB, AMR-WB Type-C interface type:

Complies with both USB 3.1 Gen 1 or USB 2.0 specifications, with transmission rates up to 5 Gbps on USB 3.1 Gen 1 and 480 Mbps on USB 2.0 Supports USB OTG Used for AT command communication, data transmission, software debugging, and firmware upgrade Three UART interfaces: UART0, UART1, and UART4 (debug UART) UART0: four-wire UART interface supporting RTS and CTS hardware flow USB Interface UART Interfaces control UART1: two-wire UART interface UART4 (debug UART): two-wire UART interface dedicated for debugging SD Card Interface Supports SD 3.0 Supports SD card hot-plug

(U)SIM Interfaces Two (U)SIM interfaces Support (U)SIM cards: 1.8/2.95 V Support Dual SIM Dual Standby (supported by default) I2C Interfaces Four I2C interfaces Used for peripherals such as camera, sensor, touch panel, etc. ADC Interface One generic ADC interface, up to 15-bit resolution Real Time Clock Supported Antenna Interfaces SC200E-CE/-EM/-NA/-JP and SC206E-EM/-NA:

Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/Bluetooth antenna interfaces SC200E-WF and SC206E-WF:

Wi-Fi/Bluetooth antenna interface Physical Characteristics Temperature Range Size: (40.5 0.15) mm (40.5 0.15) mm (2.85 0.2) mm Package: LCC + LGA Weight: Approx. 10.3 g Operating temperature range 4: -35 C to +75 C Storage temperature range: -40 C to +90 C Firmware Upgrade USB interface OTA RoHS All hardware components are fully compliant with EU RoHS directive. 4 Within the operating temperature range, the module meets 3GPP specifications. SC200E&SC206E_Series_Hardware_Design 23 / 126 Smart Module Series 2.3. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (Smart EVB G2) with accessories to control or test the module. For more details, see document [1]. SC200E&SC206E_Series_Hardware_Design 24 / 126 Smart Module Series 3 Application Interfaces 3.1. General Description SC200E and SC206E series are SMD type modules with 146 LCC pins and 128 LGA pins. The following interfaces and functions are described in detail in these subsequent chapters:

Power supply VRTC Power output Charging interface USB interface UART interfaces

(U)SIM interfaces SD card interface GPIO interfaces I2C interfaces ADC interface Motor drive interface LCM interface Flash interface Touch panel interface Camera interfaces Sensor interface Audio interfaces USB_BOOT interface SC200E&SC206E_Series_Hardware_Design 25 / 126 Smart Module Series 3.2. Pin Assignment The following figure shows the pin assignment of the module. Figure 1: Pin Assignment (Top View) SC200E&SC206E_Series_Hardware_Design 26 / 126 24146VBAT145VBAT144GND143GND142USB_VBUS141USB_VBUS140GND139HS_DET138HPH_L137HPH_GND136HPH_R135GND134BAT_THERM133BAT_P132GND131ANT_DRX130GND129VDD_2V8128ADC127PMU_GPIO08126VRTC125LDO_IOVDD124PMU_GPIO03123GPIO_60122GND121ANT_GNSS120GND119GPIO_15118GPIO_14117GPIO_17116GPIO_16115PMU_GPIO04114PWRKEY113GPIO_58112GPIO_57111LDO15A_1V81VBAT2VBAT3GND4MIC1_P5MIC1_M6MIC2_P7GND8EAR_P9EAR_M10LINEOUT_P11LINEOUT_M12GND13USB_DM14USB_DP15GND16RESERVED17USIM2_DET18USIM2_RST19USIM2_CLK20USIM2_DATA21USIM2_VDD22USIM1_DET23USIM1_RST24USIM1_CLK25USIM1_DATA26USIM1_VDD27GND28VIB_DRV_P29PWM30TP_INT31TP_RST32 SD_LDO433GPIO_2834UART0_TXD35UART0_RXD36UART0_CTS37UART0_RTS110GPIO_36109GPIO_34108GPIO_33107GPIO_35106GPIO_56105GPIO_99104GPIO_102103GPIO_103102GPIO_105101GPIO_104100GPIO_5599GPIO_3298GPIO_10797GPIO_3196VOL_DOWN95VOL_UP94DBG_TXD93DBG_RXD92SENSOR_I2C_SDA91SENSOR_I2C_SCL90GPIO_10689GND88GND87ANT_MAIN86GND85GND84CAM0_I2C_SDA83CAM0_I2C_SCL82CAM1_PWDN81CAM1_RST80CAM0_PWDN79CAM0_RST78GND77ANT_WIFI/BT76GND75CAM1_MCLK74CAM0_MCLK38SD_LDO2139SD_CLK40SD_CMD41SD_DATA042SD_DATA143SD_DATA244SD_DATA345SD_DET46USB_BOOT47TP_I2C_SCL48TP_I2C_SDA49LCD_RST50LCD_TE51GND52DSI_CLK_N53DSI_CLK_P54DSI_LN0_N55DSI_LN0_P56DSI_LN1_N57DSI_LN1_P58DSI_LN2_N59DSI_LN2_P60DSI_LN3_N61DSI_LN3_P62GND63CSI1_CLK_N64CSI1_CLK_P65CSI1_LN0_N66CSI1_LN0_P67CSI1_LN1_N68CSI1_LN1_P69GND70CSI1_LN3_N71CSI1_LN3_P72CSI1_LN2_N73CSI1_LN2_P186CBL_PWR_N185BAT_ID184VPH_PWR183BAT_M182GPIO_86181NFC_CLK180FLASH_LED179RESERVED178RESERVED177GPIO_112147MIC_BIAS1187GND222GND221GND220GND219GND218GND217GND216GND215GND214GND176GND148MIC3_P188GND223GND250GND249USB_CC1248GND247GND246USB_CC2245GND244GND213GND175RESERVED149MIC3_M189GND224GND251GND270USB_SS1_RX_M269GND268GND267GPIO_111266GND243GND212GND174RESERVED150USB_SS2_TX_P190GND225RESET_N252USB_SS1_RX_P265GPIO_98242RESERVED211GND173GRFC_13151USB_SS2_TX_M191GND226GND253USB_SS1_TX_M264GPIO_100241GND210GND172GND152USB_SS2_RX_P192USB_SS2_RX_M227GND254263RESERVED240GND209GND171GND153UART1_RXD193RESERVED228GND255GND262GRFC_15239GPIO_101208GND170RESERVED154UART1_TXD194GNSS_LNA_EN229GND256GND257RESERVED258GND259GND260GRFC_14261GND238GND207GND169RESERVED155MIC_BIAS3195CHG_LED230GND231GND232RESERVED233GND234GND235GND236GND237GND206GND168RESERVED156LDO17A_3V0196CSI0_CLK_P197CSI0_LN0_P198CSI0_LN1_P199CSI0_LN2_P200CSI0_LN3_P201PMU_GPIO07202GND203GND204GND205CAM1_I2C_SDA167RESERVED157CSI0_CLK_N158CSI0_LN0_N159CSI0_LN1_N160CSI0_LN2_N161CSI0_LN3_N162GND163CAM2_PWDN164CAM2_RST165CAM2_MCLK166CAM1_I2C_SCL272GND271GND273GND274GND254USB_SS1_TX_PPOWER pinsGND pinsAUDIO pinsUSB pins(U)SIM pinsUART pinsGPIO pinsANT pinsTP pinsLCM pinsCAMERA pinsOTHERSRESERVED pinsSD card pins Smart Module Series 3.3. Pin Description Table 8: I/O Parameter Definition Type AI AO AIO DI DO DIO OD PI PO PIO Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Power Input/Output I/O Description DC Characteristics Comment Table 9: Pin Description Power Supply Pin Name VBAT Pin No. 1, 2, 145, 146 PIO Power supply for the module VPH_PWR 184 PO Power supply for peripherals LDO15A_1V8 111 PO 1.8 V output Vmin = 3.55 V Vnom = 3.8 V Vmax = 4.4 V Vmin = 3.55 V Vnom = 3.8 V Vmax = 4.4 V Vnom = 1.8 V IOmax = 200 mA Provide sufficient current up to 3 A. It is suggested to use a TVS for surge protection. This pin is used to power peripheral devices. Maximum output current is 1 A. The power supply for LCM, sensor, cameras and I2C pull-up circuits. SC200E&SC206E_Series_Hardware_Design 27 / 126 LDO17A_3V0 156 PO 3.0 V output LDO_IOVDD 125 PO 1.8 V output VRTC 126 PIO Power supply for RTC VDD_2V8 129 PO 2.8 V output Vnom = 3.0 V IOmax = 192 mA Vnom = 1.8 V IOmax = 300 mA VOmax = 3.2 V VImin = 2.5 V VImax = 3.2 V Vnom = 2.8 V IOmax = 500 mA Smart Module Series The power supply for TP and sensor. The power is reserved for LCM and camera's IOVDD. This voltage is not adjustable. If unused, keep it open. The power supply for cameras AVDD. This voltage is not adjustable. Audio Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment MIC_BIAS1 147 PO Bias voltage 1 output for microphone VOmin = 1.6 V VOmax = 2.85 V The rated output current is 3 mA. MIC1_P MIC1_M MIC2_P 4 5 6 AI AI AI MIC3_P 148 AI MIC3_M 149 AI Microphone input for channel 1 (+) Microphone input for channel 1 (-) Microphone input for headset (+) Microphone input for channel 3 (+) Microphone input for channel 3 (-) MIC_BIAS3 155 PO Bias voltage 3 output for microphone Vnom = 1.8 V EAR_P EAR_M 8 9 AO Earpiece output (+) AO Earpiece output (-) LINEOUT_P 10 AO LINEOUT_M 11 AO HPH_R 136 AO Audio line differential output (+) Audio line differential output (-) Headphone right channel output The rated output current is 3 mA. The output voltage is fixed at 1.8 V and cannot be adjusted. The typical output voltage is 2 Vrms. SC200E&SC206E_Series_Hardware_Design 28 / 126 Smart Module Series HPH_GND 137 AO HPH_L 138 AO Headphone reference ground Headphone left channel output HS_DET 139 AI Headset hot-plug detect High level by default. USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 141, 142 PIO Charging power input. Power supply output for OTG device. USB/adaptor insertion detection Vmax = 6.0 V Vmin = 4.0 V Vnom = 5.0 V USB_DM 13 AIO USB differential data (-) USB_DP 14 AIO USB differential data (+) USB_SS1_RX_P 252 AI USB_SS1_RX_M 270 AI USB_SS1_TX_P 254 AO USB_SS1_TX_M 253 AO USB_SS2_RX_P 152 AI USB_SS2_RX_M 192 AI USB_SS2_TX_P 150 AO USB_SS2_TX_M 151 AO USB 3.1 channel 1 super-

speed receive (+) USB 3.1 channel 1 super-

speed receive (-) USB 3.1 channel 1 super-

speed transmit (+) USB 3.1 channel 1 super-

speed transmit (-) USB 3.1 channel 2 super-

speed receive (+) USB 3.1 channel 2 super-

speed receive (-) USB 3.1 channel 2 super-

speed transmit (+) USB 3.1 channel 2 super-

speed transmit (-) USB_CC1 249 AI USB Type-C detect 1 USB_CC2 246 AI USB Type-C detect 2 The maximum output current is 500 mA. 90 differential impedance. USB 2.0 standard compliant. 90 differential impedance. USB 3.1 standard compliant.

(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM1_VDD 26 PO

(U)SIM1 card power supply IOmax = 67 mA 1.8 V (U)SIM:

Either 1.8 V or 2.95 V

(U)SIM card is supported and can SC200E&SC206E_Series_Hardware_Design 29 / 126 Vmax = 1.85 V Vmin = 1.75 V 2.95 V (U)SIM:

Vmax = 3.1 V Vmin = 2.8 V VILmax = 0.2 USIM1_VDD VIHmin = 0.7 USIM1_VDD VOLmax = 0.4 V VOHmin = 0.8 USIM1_VDD VOLmax = 0.4 V VOHmin = 0.8 USIM1_VDD USIM1_DATA 25 DIO (U)SIM1 card data USIM1_CLK 24 DO

(U)SIM1 card clock USIM1_RST 23 DO

(U)SIM1 card reset USIM1_DET 22 DI

(U)SIM1 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM2_VDD 21 PO

(U)SIM2 card power supply USIM2_DATA 20 DIO (U)SIM2 card data USIM2_CLK 19 DO

(U)SIM2 card clock USIM2_RST 18 DO

(U)SIM2 card reset IOmax = 67 mA 1.8 V (U)SIM:

Vmax = 1.85 V Vmin = 1.75 V 2.95 V (U)SIM:

Vmax = 3.1 V Vmin = 2.8 V VILmax = 0.2 USIM2_VDD VIHmin = 0.7 USIM2_VDD VOLmax = 0.4 V VOHmin = 0.8 USIM2_VDD VOLmax = 0.4 V VOHmin = 0.8 USIM2_VDD USIM2_DET 17 DI

(U)SIM2 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V Smart Module Series be identified automatically by the module. Externally pulled up to USIM1_VDD with a 10 K resistor. Active low. Externally pulled up to 1.8 V. If unused, keep it open. Either 1.8 V or 2.95 V

(U)SIM card is supported and can be identified automatically by the module. Externally pulled up to USIM2_VDD with a 10 K resistor. Active low. Externally pulled up to 1.8 V. If unused, keep it SC200E&SC206E_Series_Hardware_Design 30 / 126 Smart Module Series open. SD Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment SD_CLK 39 DO SD card clock SD_CMD 40 DIO SD card command SD_DATA0 41 DIO SDIO data bit 0 SD_DATA1 42 DIO SDIO data bit 1 SD_DATA2 43 DIO SDIO data bit 2 SD_DATA3 44 DIO SDIO data bit 3 SD_DET 45 DI SD card hot-plug detect 1.8 V SD card:

VOLmax = 0.45 V VOHmin = 1.4 V 2.95 V SD card:

VOLmax = 0.37 V VOHmin = 2.2 V 1.8 V SD card VILmax = 0.58 V VIHmin = 1.27 V VOLmax = 0.45 V VOHmin = 1.4 V 2.95 V SD card:

VILmax = 0.73 V VIHmin = 1.84 V VOLmax = 0.37 V VOHmin = 2.2 V VILmax = 0.63 V VIHmin = 1.17 V SD_LDO21 38 PO SD card power supply 2.95 V/ 841 mA SD_LDO4 32 PO 1.8/2.95 V output power for SD card pull-up circuits 1.8/2.95 V 22 mA 50 characteristic impedance. Active low.

Touch Panel Interface Pin Name Pin No. I/O Description DC Characteristics Comment TP_RST 31 DO TP reset TP_INT 30 DI TP interrupt TP_I2C_SCL 47 OD TP I2C clock TP_I2C_SDA 48 OD TP I2C data VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. Active low. 1.8 V power domain. Need to be pulled up to 1.8 V externally. Can be used for other I2C devices. LCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment LCD_RST 49 DO LCD reset VOLmax = 0.45 V 1.8 V power domain. SC200E&SC206E_Series_Hardware_Design 31 / 126 Smart Module Series VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V LCD_TE 50 DI LCD tearing effect DSI_CLK_N 52 AO LCD MIPI clock (-) DSI_CLK_P 53 AO LCD MIPI clock (+) DSI_LN0_N 54 AO LCD MIPI lane 0 data (-) DSI_LN0_P 55 AO LCD MIPI lane 0 data (+) DSI_LN1_N 56 AO LCD MIPI lane 1 data (-) DSI_LN1_P 57 AO LCD MIPI lane 1 data (+) DSI_LN2_N 58 AO LCD MIPI lane 2 data (-) DSI_LN2_P 59 AO LCD MIPI lane 2 data (+) DSI_LN3_N 60 AO LCD MIPI lane 3 data (-) DSI_LN3_P 61 AO LCD MIPI lane 3 data (+) PWM 29 DO PWM output 1.8 V power domain. Camera Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment CSI1_CLK_N 63 AI MIPI CSI1 clock (-) CSI1_CLK_P 64 AI MIPI CSI1 clock (+) CSI1_LN0_N 65 AI MIPI CSI1 lane 0 data (-) CSI1_LN0_P 66 AI MIPI CSI1 lane 0 data (+) CSI1_LN1_N 67 AI MIPI CSI1 lane 1 data (-) CSI1_LN1_P 68 AI MIPI CSI1 lane 1 data (+) CSI1_LN2_N 72 AI MIPI CSI1 lane 2 data (-) CSI1_LN2_P 73 AI MIPI CSI1 lane 2 data (+) CSI1_LN3_N 70 AI MIPI CSI1 lane 3 data (-) CSI1_LN3_P 71 AI MIPI CSI1 lane 3 data (+) CSI0_CLK_N 157 AI MIPI CSI0 clock (-) CSI0_CLK_P 196 AI MIPI CSI0 clock (+) CSI0_LN0_N 158 AI MIPI CSI0 lane 0 data (-) CSI0_LN0_P 197 AI MIPI CSI0 lane 0 data (+) SC200E&SC206E_Series_Hardware_Design 32 / 126 CSI0_LN1_N 159 AI MIPI CSI0 lane 1 data (-) CSI0_LN1_P 198 AI MIPI CSI0 lane 1 data (+) CSI0_LN2_N 160 AI MIPI CSI0 lane 2 data (-) CSI0_LN2_P 199 AI MIPI CSI0 lane 2 data (+) CSI0_LN3_N 161 AI MIPI CSI0 lane 3 data (-) CSI0_LN3_P 200 AI MIPI CSI0 lane 3 data (+) CAM0_I2C_ SCL CAM0_I2C_ SDA 83 OD I2C clock of camera 0 84 OD I2C data of camera 0 CAM0_PWDN 80 DO Power down of camera 0 CAM1_PWDN 82 DO Power down of camera 1 CAM2_PWDN 163 DO Power down of camera 2 CAM0_MCLK 74 DO Master clock of camera 0 CAM1_MCLK 75 DO Master clock of camera 1 CAM2_MCLK 165 DO Master clock of camera 2 CAM0_RST 79 DO Reset of camera 0 CAM1_RST 81 DO Reset of camera 1 CAM2_RST 164 DO Reset of camera 2 CAM1_I2C_ SCL CAM1_I2C_ SDA 166 OD I2C clock of camera 1 205 OD I2C data of camera 1 Smart Module Series Need to be pulled up to 1.8 V externally. Can only be used for camera. VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. Need to be pulled up to 1.8 V externally. Can only be used for camera. Flash & Torch Interface Pin Name Pin No. I/O Description DC Characteristics Comment FLASH_LED 180 AO Flash/torch driver output IOmax = 1 A Supports flash and torch modes. Indication Interface Pin Name Pin No. I/O Description DC Characteristics Comment CHG_LED 195 AI Indicate the module's charging status IImax = 5 mA Keypad Interfaces Pin Name Pin I/O Description DC Characteristics Comment SC200E&SC206E_Series_Hardware_Design 33 / 126 No. PWRKEY 114 DI Turn on/off the module VOL_UP 95 DI Volume up VOL_DOWN 96 DI Volume down VILmax = 0.63 V VIHmin = 1.17 V VILmax = 0.63 V VIHmin = 1.17 V RESET_N 225 DI Reset the module Smart Module Series Pulled up to 1.1 V internally. Active low. If unused, keep it open. Cannot be externally pulled up. 1.8 V power domain. Disabled by default and it can be enabled via software configuration. UART Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 94 DO Debug UART transmit DBG_RXD 93 DI Debug UART receive UART0_TXD 34 DO UART0 transmit UART0_RXD 35 DI UART0 receive UART0_RTS 37 DO UART0_CTS 36 DI DCE request to send signal to DTE DCE clear to send signal from DTE UART1_TXD 154 DO UART1 transmit UART1_RXD 153 DI UART1 receive Sensor I2C Interface VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. If unused, keep it open. Pin Name SENSOR_I2C_ SCL SENSOR_I2C_ SDA Pin No. I/O Description DC Characteristics Comment 91 OD 92 OD I2C clock for external sensor I2C data for external sensor Need to be pulled up to 1.8 V externally. Can only be used for sensors. RF Antenna Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment SC200E&SC206E_Series_Hardware_Design 34 / 126 ANT_MAIN 87 AIO Main antenna interface ANT_GNSS 121 AI GNSS antenna interface ANT_DRX 131 AI ANT_WIFI/BT 77 AIO Diversity antenna interface Wi-Fi/Bluetooth antenna interface Antenna Tuner Control Interfaces Smart Module Series 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment GRFC_13 173 DIO Generic RF controller GRFC_14 260 DIO Generic RF controller GRFC_15 262 DIO Generic RF controller Cannot be multiplexed into a generic GPIO. Cannot be pulled up when the module is turning on. Cannot be multiplexed into a generic GPIO. ADC Interface Pin Name Pin No. I/O Description DC Characteristics Comment ADC 128 AI General-purpose ADC interface The maximum input voltage is 1.875 V. Charging Interfaces Pin No. I/O Description DC Characteristics Comment Pin Name BAT_P BAT_M 133 AI Battery voltage detect (+) 183 AI Battery voltage detect (-) BAT_ID 185 AI Battery type detect VImin = 0 V VImax = 1.875 V BAT_THERM 134 AI Battery temperature detect Vibration Motor Driver Interface Cannot be kept open. Internally pulled down with a 100 k resistor. If unused, keep it open. Internally pull up by default. Supports 47 k NTC thermistor by default. If unused, connect it to GND with a 47 k resistor. SC200E&SC206E_Series_Hardware_Design 35 / 126 Smart Module Series Pin Name Pin No. I/O Description DC Characteristics Comment VIB_DRV_P 28 PO Vibration motor driver output control VOmin = 1.5 V VOmax = 3.3 V IOmax = 100 mA Connect it to the positive pole of the motor. Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USB_BOOT 46 DI Force the module into emergency download mode GNSS_LNA_ EN 194 DO GNSS LNA enable control NFC_CLK 181 DO NFC clock CBL_PWR_N 186 DI Cable power-on; Initiate power-on when grounded Force the module to enter emergency download mode by pulling this pin up to LDO15A_1V8 when the module is turning on. The default output frequency is 38.4 MHz. The module cannot be turned off when this pin is pulled down. If unused, keep it open. GPIO Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment GPIO_28 33 DIO GPIO_31 97 DIO GPIO_32 99 DIO GPIO_33 108 DIO GPIO_34 109 DIO GPIO_35 107 DIO GPIO_36 110 DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output SC200E&SC206E_Series_Hardware_Design 36 / 126 Smart Module Series Cannot be pulled up when the module is turning on. GPIO_55 100 DIO GPIO_56 106 DIO GPIO_57 112 DIO GPIO_58 113 DIO GPIO_60 123 DIO GPIO_86 182 DIO GPIO_112 177 DIO GPIO_111 267 DIO GPIO_98 265 DIO GPIO_99 105 DIO GPIO_100 264 DIO GPIO_101 239 DIO GPIO_102 104 DIO GPIO_103 103 DIO GPIO_104 101 DIO GPIO_105 102 DIO GPIO_106 90 DIO GPIO_107 98 DIO GPIO_14 118 DIO GPIO_15 119 DIO GPIO_16 116 DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output SC200E&SC206E_Series_Hardware_Design 37 / 126 Smart Module Series General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output GPIO_17 117 DIO PMU_GPIO03 124 DIO PMU_GPIO04 115 DIO PMU_GPIO08 127 DIO PMU_GPIO07 201 DIO GND Pin Name Pin No. 3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89, 120, 122, 130, 132, 135, 140, 143, 144, 162, 171, 172, 176, 187191, 202204, 206224, 226231, 233238, 240, 241, 243245, 247, 248, 250, 251, 255, 256, 258, 259, 261, 266, 268, 269, 271274 GND RESERVED Pin Name Pin No. RESERVED 16, 167, 168, 169, 170, 174, 175, 178, 179, 193, 232, 242, 257, 263 NOTE 1. Keep all RESERVED and unused pins unconnected. 2. Connect all GND pins to ground. 3.4. Power Supply 3.4.1. Power Supply Pins The module provides four VBAT pins for connection with external power supply. 3.4.2. Voltage Stability Requirements The power supply range of the module is 3.554.4 V, and the recommended value is 3.8 V. The power supply performance, such as load capacity, voltage ripple, etc. will directly influence the modules performance and stability. Under ultimate conditions, the transient peak current of the module may surge up to 3 A. If the power supply capacity is not sufficient, there will be a risk that the module may power off automatically if the voltage drops below 3.1 V. Therefore, make sure the input voltage never drops below 3.1 V. SC200E&SC206E_Series_Hardware_Design 38 / 126 Smart Module Series Figure 2: Power Supply Limits During Burst Transmission To decrease voltage drop, use a bypass capacitor of about 100 F with low ESR (ESR 0.7 ), and reserve a multi-layer ceramic chip capacitor (MLCC) array due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) to compose the MLCC array and place these capacitors close to VBAT pins. Additionally, add a 4.7 F capacitor in parallel. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT trace should be no less than 3 mm. In principle, the longer the VBAT trace is, the wider it should be. In addition, to guarantee the stability of the power source, please use a TVS and place it as close to the VBAT pins as possible to enhance surge protection. The following figure shows the star topology of the power supply. Figure 3: Reference Circuit for Power Supply SC200E&SC206E_Series_Hardware_Design 39 / 126 Power Supply (V)Burst TransmissionRippleDropBurst TransmissionLoad (A)ModuleVBATVBATC1100 F+C3100 nFC433 pFC510 pFD1C24.7 FGND Smart Module Series 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of 3 A at least. If the voltage difference between the input and output is not too big, use an LDO when supplying power to the module. If there is a big voltage difference between the input source and the desired output

(VBAT), a buck converter is recommended. The following figure shows a reference design for +5 V input power source. The typical output voltage is 3.8 V and the maximum load current is 5.0 A. Figure 4: Reference Circuit of Power Supply NOTE 1. In an abnormal state, it is recommended to restart the module by switching off and then switching back on the power supply. 2. The module supports battery charging by default. If the above power supply design is adopted, disable the charging function by software, or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply IC. SC200E&SC206E_Series_Hardware_Design 40 / 126 VCC_5VU1PGNDPGNDPGNDPVINPVINPVINENSS/TRSWSWSWVOSPGFBFSWDEFGND3V8_ENDC_3V8D1C1C3C2R1Q1R2R3L1R4R5R6C5C6C4 Smart Module Series 3.5. Turn On/Off 3.5.1. Turn On with PWRKEY The module can be turned on by driving the PWRKEY pin low for at least 1.6 s. The PWRKEY pin is pulled up to 1.1 V internally. It is recommended to use an open collector driver to control PWRKEY. A simple reference circuit is illustrated in the following figure. Figure 5: Turn On Module with Open Collector Driver Another way to control PWRKEY is by using a button directly. You must place a TVS nearby the button for ESD protection. A reference circuit is shown by the following figure. Figure 6: Turn On Module Using Button SC200E&SC206E_Series_Hardware_Design 41 / 126 Turn on pulsePWRKEY4.7K47K>1.6 sR1R2Q1R31KPWRKEYS1Close to S1TVS1K The turning-on scenario is illustrated in the following figure. Smart Module Series Figure 7: Turn-on Timing NOTE 1. When the module is turned on for the first time, the turn-on timing may be different from that shown above. 2. Make sure that VBAT is stable before pulling down PWRKEY. It is recommended to wait until VBAT is stable at 3.8 V for at least 30 ms before pulling down PWRKEY. Additionally, do not keep pulling PWRKEY down all the time. SC200E&SC206E_Series_Hardware_Design 42 / 126 VBAT(Typ. 3.8 V)PWRKEY> 1.6 sOthersLDO15A_1V847 s132 msSoftware controlledLDO17A_3V0ActiveNote2Software controlled Smart Module Series 3.5.2. Turn Off Drive the PWRKEY pin low for at least 1 s, and then choose to turn off the module when the prompt window comes up. You can also force the module to turn off by driving PWRKEY low for at least 8 s. The forced turn-off timing is illustrated by the following figure. Figure 8: Forced Turn-off Timing 3.6. VRTC The RTC (Real Time Clock) can be powered by an external power source through VRTC when the module is powered down and there is no power supplied to VBAT. The external power source can be a rechargeable battery (such as a coin cell) according to application demands. A reference circuit design is shown below. Figure 9: RTC Powered by Coin Cell If RTC is ineffective, it can be synchronized through the network after the module is turned on. The recommended input voltage range for VRTC is 2.53.2 V and the recommended typical value is 3.0 V. SC200E&SC206E_Series_Hardware_Design 43 / 126 VBATPWRKEYOthers> 8 sPower downCoin CellModuleRTC CoreVRTC Smart Module Series 3.7. Power Output The module supports output of regulated voltages for peripheral circuits. In applications, it is recommended to use a 33 pF and a 10 pF capacitor in parallel in the circuit to suppress high-frequency noise. Table 10: Power Description Pin Name Pin No. Default Voltage (V) Driving Current (mA) @ Idle State LDO15A_1V8 111 LDO_IOVDD 125 VDD_2V8 129 LDO17A_3V0 156 SD_LDO21 SD_LDO4 USIM1_VDD USIM2_VDD 38 32 26 21 1.8 1.8 2.8 3.0 2.95 1.8/2.95 1.8/2.95 1.8/2.95 3.8. Charging Interface 200 300 500 192 841 22 67 67 Keeps ON

The module supports battery charging. The battery charger IC in the module supports trickle charging, constant current charging and constant voltage charging modes, which optimize the charging procedure for Li-ion batteries. Trickle charging: There are two steps in this mode. When the battery voltage is below 2.1 V, a 90 mA trickle charging current is applied to the battery. When the battery voltage is charged up and is between 2.1 V and 3.4 V, the charging current can be set to 400 mA maximally. Constant current mode (CC mode): When the battery is increased to 3.4 to 4.35 V, the system will switch to CC mode. The maximum charging current is 1.85 A when an adapter is used for battery charging, and the maximum charging current is 450 mA for USB charging. Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.35 V, the system will switch to CV mode and the charging current will decrease gradually. When the battery level reaches 100 %, charging is completed. SC200E&SC206E_Series_Hardware_Design 44 / 126 Smart Module Series Table 11: Pin Definition of Charging Interface Pin Name Pin No. I/O Description Comment BAT_P BAT_M 133 183 AI Battery voltage detect (+) AI Battery voltage detect (-) Cannot be kept open. BAT_THERM 134 AI Battery temperature detect BAT_ID 185 AI Battery type detect Internally pulled up by default. Supports 47 k NTC thermistor by default. If unused, connect it to GND with a 47 k resistor. Internally pulled down with a 100 k resistor. If unused, keep it open. The module supports battery temperature detection in the condition that the battery integrates a thermistor (47 k 1 % NTC thermistor with a B-constant of 4050 K by default) and the thermistor is connected to BAT_THERM pin. If the BAT_THERM pin is not connected, there will be malfunctions such as battery charging failure, battery level display error, etc. The battery charge temperature range varies with different types of batteries. A reference design for the battery charging circuit is shown below. Figure 10: Reference Design for Battery Charging Circuit Mobile devices such as mobile phones or handheld POS systems are powered by batteries. For different batteries, you should modify the charging and discharging curve correspondingly to achieve the best performance. SC200E&SC206E_Series_Hardware_Design 45 / 126 GNDBAT_PBAT_THERMVBAT100 FNTCVBAT33 pF4.7 FESDESD123USB_VBUSAdapter or USBModuleBatteryBAT_MC1C2C3D1D2C2NM_1 nFC4GND Smart Module Series If the thermistor is not available in the battery, or an adapter is utilized to power the module, you must connect BAT_THERM to GND via a 47 k resistor. Otherwise, the system may mistakenly judge that the battery temperature is abnormal, and therefore cause battery charging failure. BAT_P and BAT_M must be connected. Otherwise, exceptions in voltage detection will be caused, with associated problems of turn-on/off and battery charging/discharging. 3.9. USB Interface (Type-C) The module provides one USB interface which complies with both USB 3.1 Gen 1 and USB 2.0 specifications and supports SuperSpeed (5 Gbps) and high-speed (480 Mbps), and full-speed (12 Mbps) modes. The USB interface supports USB OTG and is used for AT command transmission, data transmission, software debugging and firmware upgrade. The module only supports USB Type-C. The USB interface has one USB 2.0 compliant high-speed differential channel (USB_DP, USB_DM) and one USB 3.1 compliant SuperSpeed differential channel

(USB_SS1_RX_P/M, USB_SS1_TX_P/M and USB_SS2_RX_P/M, USB_SS2_TX_P/M). When Type-C is plugged in with one side up, the external device is detected by USB_CC1, and the data will be transmitted through USB_SS1; when it is plugged in with the other side up, the external device is detected by USB_CC2, and the data will be transmitted through USB_SS2. The following table shows the pin definition of USB interface. Table 12: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS USB_DM USB_DP 141, 142 13 14 PIO Charging power input. Power supply output for OTG device. USB/adaptor insertion detection AIO USB differential data (-) AIO USB differential data (+) Maximum output current is 500 mA. 90 differential impedance. USB 2.0 standard compliant. USB_SS1_RX_P 252 USB_SS1_RX_M 270 AI AI USB_SS1_TX_P 254 AO USB 3.1 channel 1 super-speed receive (+) USB 3.1 channel 1 super-speed receive (-) USB 3.1 channel 1 super-speed transmit

(+) 90 differential impedance. USB 3.1 standard compliant. USB_SS1_TX_M 253 AO USB 3.1 channel 1 super-speed transmit (-) SC200E&SC206E_Series_Hardware_Design 46 / 126 Smart Module Series USB_SS2_RX_P 152 USB_SS2_RX_M 192 AI AI USB_SS2_TX_P 150 AO USB 3.1 channel 2 super-speed receive (+) USB 3.1 channel 2 super-speed receive (-) USB 3.1 channel 2 super-speed transmit

(+) USB_SS2_TX_M 151 AO USB 3.1 channel 2 super-speed transmit (-) USB_CC1 USB_CC2 249 246 AI AI USB Type-C detect 1 USB Type-C detect 2 Figure 11: USB Interface Reference Design (OTG Supported) In order to ensure USB performance, comply with the following principles when designing the USB interface. Route the USB signal traces as a differential pair with total grounding. The impedance of USB differential trace should be controlled to 90 . Keep the ESD protection component as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection component on USB data lines. Typically, the capacitance value should be less than 2 pF for USB 2.0 and less than 0.5 pF for USB 3.1. Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Make sure the intra-pair length difference within USB 2.0 differential pair does not exceed 2 mm, and that within USB 3.1 Rx or Tx differential pair does not exceed 0.7 mm. The spacing between USB signals and all other signals should be at least 4 times the trace width while the spacing between Rx and Tx should be at least 3 times the trace width. SC200E&SC206E_Series_Hardware_Design 47 / 126 USB_DMModuleUSB_SS1_RX_PRX2+RX2-VBUSCC1D-D+TX2-TX2+CC2USB_CC1USB_CC2RX1+RX1-TX1+TX1-USB Type-CC3C4C7C8USB_DPUSB_VBUSUSB_SS1_RX_MUSB_SS1_TX_PUSB_SS1_TX_MUSB_SS2_RX_PUSB_SS2_RX_MUSB_SS2_TX_PUSB__TX_MSS2C1C2C5C6 For USB 3.1, it is suggested to do simulation after the design is completed. If the cable is too long or there are too many vias, a redriver can be added to ensure the quality of signal transmission if necessary. Smart Module Series Table 13: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (P - M) 0.24

-0.17

-0.07

-0.28 0.3 13 14 252 270 254 253 152 192 150 151 USB_DM USB_DP 24.13 24.37 USB_SS1_RX_P 16.33 USB_SS1_RX_M 16.50 USB_SS1_TX_P 10.07 USB_SS1_TX_M 10.14 USB_SS2_RX_P 17.74 USB_SS2_RX_M 18.02 USB_SS2_TX_P 20.84 USB_SS2_TX_M 20.54 3.10. UART Interfaces The module provides three UART interfaces:

UART0: four-wire UART interface, supports RTS and CTS hardware flow control UART4 (debug UART): two-wire UART interface, dedicated for debugging UART1: two-wire UART interface Table 14: Pin Definition of UART Interfaces Pin Name Pin No. I/O Description Comment UART0_TXD 34 DO UART0 transmit UART0_RXD 35 DI UART0 receive 1.8 V power domain. If unused, keep it open. SC200E&SC206E_Series_Hardware_Design 48 / 126 Smart Module Series UART0_RTS 37 DO DCE request to send signal to DTE UART0_CTS 36 DI DCE clear to send signal from DTE DBG_TXD DBG_RXD 94 93 DO Debug UART transmit DI Debug UART receive UART1_TXD 154 DO UART1 transmit UART1_RXD 153 DI UART1 receive UART0 is a four-wire UART interface with 1.8 V power domain. You should use a voltage-level translator if your application is equipped with a 3.3 V UART interface. The following figure shows a reference design. Figure 12: Reference Circuit with Voltage-level Translator Chip for UART0 The following figure presents an example of connection between the module and a PC. It is recommended to add a voltage-level translator and an RS-232 level translator chip between the module and the PC. Figure 13: RS-232 Level Match Circuit for UART0 SC200E&SC206E_Series_Hardware_Design 49 / 126 VCCAVCCBOEA1A2A3A4GNDB1B2B3B4LDO15A_1V8UART0_RTSUART0_RXDUART0_CTSUART0_TXDRTS_3.3VRXD_3.3VCTS_3.3VTXD_3.3VVDD_3.3VC1100 pFC2U1100 pFRTS_3.3VRXD_3.3VCTS_3.3VTXD_3.3VRTS_1.8VRXD_1.8VCTS_1.8VTXD_1.8VVCCAModuleGNDGND1.8 VVCCB3.3 VDIN1ROUT3ROUT2ROUT1DIN4DIN3DIN2DIN5R1OUTBFORCEON/FORCEOFF/INVALID3.3 VDOUT1DOUT2DOUT3DOUT4DOUT5RIN3RIN2RIN1VCCGNDOEDB-9RTSTXDCTSRXDGNDUART0_RXDUART0_TXDUART0_RTSUART0_CTS Smart Module Series NOTE UART4 (debug UART) and UART1 are similar to UART0. Please refer to the reference design of UART0 for the designs of the two UARTs. 3.11. (U)SIM Interfaces The module provides two (U)SIM interfaces that meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the (U)SIM card is powered by the internal power supply of the module. Table 15: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 26 PO

(U)SIM1 card power supply USIM1_DATA 25 DIO

(U)SIM1 card data USIM1_CLK USIM1_RST 24 23 DO

(U)SIM1 card clock DO

(U)SIM1 card reset USIM1_DET 22 DI

(U)SIM1 card hot-plug detect USIM2_VDD 21 PO

(U)SIM2 card power supply USIM2_DATA 20 DIO

(U)SIM2 card data Either 1.8 V or 2.95 V (U)SIM card is supported and can be identified automatically by the module. to Externally pulled up USIM1_VDD with a 10 K resistor. Active low. Externally pulled up to 1.8 V. If unused, keep it open. Either 1.8 V or 2.95 V (U)SIM card is supported and can be identified automatically by the module. Externally pulled up to USIM2_VDD with a 10 K resistor. USIM2_CLK USIM2_RST USIM2_DET 19 18 17 DO

(U)SIM2 card clock DO

(U)SIM2 card reset DI

(U)SIM2 card hot-plug detect Active low. Externally pulled SC200E&SC206E_Series_Hardware_Design 50 / 126 Smart Module Series up to 1.8 V. If unused, keep it open. The module supports (U)SIM card hot-plug via the USIM_DET pins. This function is disabled by default via software. To enable it, contact Quectel Technical Support to change the software configuration. A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below. Figure 14: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector If you do not need hot-plug detection, keep USIM1_DET and USIM2_DET pins open. The following is a reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector when hot-plug detection is not needed. Figure 15: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector SC200E&SC206E_Series_Hardware_Design 51 / 126 USIM_VDDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET22RLDO15A_1V8100K100 nF(U)SIM Card ConnectorTVS array22 pFVCCRSTCLKIOVPPGNDUSIM_VDD10KModuleR1R2C122 pF22 pFC2C3C4D122R22RR3R4R5ModuleUSIM_VDDUSIM_RSTUSIM_CLKUSIM_DATA22R22R22R100 nF(U)SIM card connectorTVS array22 pFVCCRSTCLKIOVPPGND10KUSIM_VDD22 pF22 pFR1C1D1R2R3R4C2C3C4 Smart Module Series To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design:

Place the (U)SIM card connector as close to the module as possible. Keep the trace length as short as possible, at most 200 mm. Keep (U)SIM card signals away from RF and VBAT traces. Reserve a filter capacitor for USIM_VDD, and its maximum capacitance should not exceed 1 F. Additionally, place the capacitor near the (U)SIM card connector. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground. USIM_RST also needs ground protection. To ensure better ESD protection, it is recommended to add a TVS array with a parasitic capacitance not exceeding 10 pF. Add 22 resistors in series between the module and (U)SIM card to suppress EMI such as spurious transmission and improve ESD protection. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. Add 22 pF capacitors in parallel on USIM_DATA, USIM_CLK and USIM_RST signal traces to filter RF interference, and place them as close to the (U)SIM card connector as possible. 3.12. SD Card Interface SD card interface of the module supports SD 3.0 protocol. The pin definition of SD card interface is shown below. Table 16: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 SD_DET SD_LDO21 SD_LDO4 39 40 41 42 43 44 45 38 32 DO SD card clock DIO SD card command DIO SDIO data bit 0 DIO SDIO data bit 1 DIO SDIO data bit 2 DIO SDIO data bit 3 50 characteristic impedance. DI SD card hot-plug detect Active low. PO SD card power supply PO 1.8/2.95 V output power for SD card pull-up circuits

SC200E&SC206E_Series_Hardware_Design 52 / 126 A reference circuit for the SD card interface is shown below. Smart Module Series Figure 16: Reference Circuit for the SD Card Interface SD_LDO21 is the power supply for the SD card and can provide up to 841 mA output current. Due to the high output current, it is recommended that the trace width should be at least 0.8 mm. To ensure output current stability, add a 4.7 F and a 33 pF capacitor in parallel near the SD card connector. SD_CMD, SD_CLK, SD_DATA0, SD_DATA1, SD_DATA2, and SD_DATA3 are all high-speed signal lines. In PCB design, control the characteristic impedance of them to 50 , and do not cross them with other traces. It is recommended to route the traces on the inner layer of the PCB and keep them of the same length. Additionally, SD_CLK needs ground shielding separately. Trace length requirements:

Control the impedance to 50 10 % and add ground shielding. Keep the trace length difference among SD_CLK, SD_CMD and SD_DATA less than 2 mm. Table 17: SD Card Trace Length Inside the Module Pin No. 39 40 41 42 Signal SD_CLK SD_CMD SD_DATA0 SD_DATA1 Length (mm) 35.01 35.12 34.98 35.04 SC200E&SC206E_Series_Hardware_Design 53 / 126 SD_CMD120KNM_51KSD_DATA3SD_DATA2SD_CLKSD_DATA0SD_DETSD_DATA1P1-DAT2P2-CD/DAT3P3-CMDP4-VDDP5-CLKP8-DAT1GNDP6-VSSP7-DAT0DETECTIVEGNDGNDGND12345678910111213SD_LDO2133R33R33R33R33R33R1K33 pF4.7 FSD_LDO4ModuleR1R2R3R4R5R6NM_51KNM_10KNM_51KNM_51KR7R8R9R10R11R12R13D1D2D3D4D5D6D7D8C1C2SD Card ConnectorLDO15A_1V8GNDR140R 43 44 SD_DATA2 SD_DATA3 34.98 35.10 Smart Module Series 3.13. GPIO Interfaces The module has abundant GPIO interfaces with a power domain of 1.8 V. The pin definition is listed below. Table 18: Pin Definition of GPIO Interfaces Pin Name Pin No. I/O Description Comment GPIO_28 GPIO_31 GPIO_32 GPIO_33 GPIO_34 GPIO_35 GPIO_36 GPIO_55 GPIO_56 33 97 99 108 109 107 110 100 106 DIO DIO DIO DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output GPIO_57 112 DIO General-purpose input/output Cannot be pulled up when the module is turning on. GPIO_58 GPIO_60 GPIO_86 GPIO_112 GPIO_111 GPIO_98 GPIO_99 GPIO_100 113 123 182 177 267 265 105 264 DIO DIO DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output SC200E&SC206E_Series_Hardware_Design 54 / 126 Smart Module Series DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output GPIO_101 GPIO_102 GPIO_103 GPIO_104 GPIO_105 GPIO_106 GPIO_107 GPIO_14 GPIO_15 GPIO_16 GPIO_17 239 104 103 101 102 90 98 118 119 116 117 PMU_GPIO03 124 PMU_GPIO04 115 PMU_GPIO08 127 PMU_GPIO07 201 NOTE For more details about GPIO configuration, see document [2]. 3.14. I2C Interfaces The module provides four I2C interfaces. All I2C interfaces are open drain signals and therefore you must pull them up externally. The reference power domain is 1.8 V. The sensor I2C interface only supports sensors of ADSP architecture. CAM0 I2C and CAM1 I2C signals are controlled by the Kernel code and support connection to radio-output-related devices. SC200E&SC206E_Series_Hardware_Design 55 / 126 Smart Module Series Table 19: Pin Definition of I2C Interfaces Pin Name Pin No. I/O Description Comment TP_I2C_SCL TP_I2C_SDA CAM0_I2C_SCL CAM0_I2C_SDA 47 48 83 84 OD TP I2C clock OD TP I2C data OD I2C clock of camera 0 OD I2C data of camera 0 CAM1_I2C_SCL 166 OD I2C clock of camera 1 CAM1_I2C_SDA 205 OD I2C data of camera 1 Need to be pulled up to 1.8 V externally. Can be used for other I2C devices. Can only be used for camera. SENSOR_I2C_SCL 91 OD I2C clock for external sensor SENSOR_I2C_SDA 92 OD I2C data for external sensor Can only be used for sensors. 3.15. ADC Interface The module supports one Analog-to-Digital Converter (ADC) interface. The ADC interface supports resolution of up to 15 bits. The pin definition is shown below. Table 20: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC 128 AI General-purpose ADC interface The maximum input voltage is 1.875 V. SC200E&SC206E_Series_Hardware_Design 56 / 126 Smart Module Series 3.16. Vibration Motor Drive Interface The pin definition of the vibration motor drive interface is listed below. Table 21: Pin Definition of Vibration Motor Drive Interface Pin Name Pin No. I/O Description Comment VIB_DRV_P 28 PO Vibration motor driver output control Connect it to the positive pole of the motor. The motor is driven by an exclusive circuit, and a reference circuit is shown below. Figure 17: Reference Circuit for Motor Connection When the motor stops working and the VIB_DRV_P is disconnected, the redundant electricity on the motor can be discharged from the circuit loop formed by diodes, thus avoiding damage to components. 3.17. LCM Interface The module provides one LCM interface, which is MIPI DSI standard compliant. The interface supports high-speed differential data transmission and supports HD+ display (1680 720 @ 60 fps). The pin definition of the LCM interface is shown below. Table 22: Pin Definition of LCM Interface Pin Name Pin No. I/O Description Comment LCD_RST LCD_TE 49 50 DO LCD reset DI LCD tearing effect 1.8 V power domain. SC200E&SC206E_Series_Hardware_Design 57 / 126 ModuleVIB+MotorVIB-C1VIB_DRV_PD133 pF Smart Module Series DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N DSI_LN3_P PWM 52 53 54 55 56 57 58 59 60 61 29 AO AO AO AO AO AO AO AO AO AO LCD MIPI clock (-) LCD MIPI clock (+) LCD MIPI lane 0 data (-) LCD MIPI lane 0 data (+) LCD MIPI lane 1 data (-) LCD MIPI lane 1 data (+) LCD MIPI lane 2 data (-) LCD MIPI lane 2 data (+) LCD MIPI lane 3 data (-) LCD MIPI lane 3 data (+)

DO PWM output 1.8 V power domain. SC200E&SC206E_Series_Hardware_Design 58 / 126 A reference circuit for the LCM interface is shown below. Smart Module Series Figure 18: Reference Circuit Design for LCM Interface MIPI are high-speed signal lines. It is recommended to add common-mode filters in series near the LCM connector, to improve protection against electromagnetic radiation interference. It is recommended to read the LCM ID register through MIPI when compatible design with other displays is required. If several LCMs share the same IC, it is recommended that the LCM factory should burn an OTP register to distinguish different screens. You can also connect the LCD_ID pin of LCM to the ADC pin of the module, but you need to make sure that the output voltage of LCD_ID should not exceed the voltage range of the ADC pin. SC200E&SC206E_Series_Hardware_Design 59 / 126 DSI_CLK_PLEDANCLEDKLPTENC (SDA-TP) VIO18NC (VTP-TP) DSI_LN3_PLCD_TELCD_RSTDSI_LN3_NDSI_LN2_P_CLK_NDSI_LN2_NRESETLCD_IDNC (SCL-TP) NC (RST-TP) NC (EINT-TP) GNDVCC28GNDMIPI_TDP3MIPI_TDN3GNDMIPI_TDP2MIPI_TDN2GNDMIPI_TDP1MIPI_TDN1GNDLDO15A_1V8LCM_LED+LCM_LED-1234567891012131415161718192021222324252627MIPI_TDP0MIPI_TDN0GNDMIPI_TCPMIPI_TCN2928303456345634563456DSI_LN1_NDSI_LN1_PDSI_LN0_NDSI_LN0_P1234561112121212100nF4.7F1FModuleLCMFL1FL2FL3FL4FL5EMI filterC3C2C1NCGNDGNDGNDGNDADC31323334DSIGNDLDO_IOVDDNMLCM_2V8OUTGNDINENLDOVPH_PWRGPIO1FC4 You can design the external backlight driving circuit for LCM according to actual requirements. A reference circuit design is shown in the following figure, in which the PWM pin is used to adjust the backlight brightness. Smart Module Series Figure 19: Reference Design for LCM External Backlight Driving Circuit 3.18. Flash Interface The module supports one flash LED driver, with maximum output current up to 1 A. Table 23: Pin Definition of Flash Interface Pin Name Pin No. I/O Description Comment FLASH_LED 180 AO Flash/torch driver output Supports flash and torch modes. NOTE Flash current is programmable in step 12.5 mA (max. 1 A) or 5 mA (max. 640 mA). 3.19. Touch Panel Interface The module provides one I2C interface for the connection to a Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The pin definition of TP interface is illustrated below. SC200E&SC206E_Series_Hardware_Design 60 / 126 LCM_LED+PWMModule2.2 FBacklight driverLCM_LED-VPH_PWRC1R110K Smart Module Series Table 24: Pin Definition of Touch Panel Interface Pin Name Pin No. I/O Description Comment TP_RST TP_INT 31 30 DO TP reset 1.8 V voltage domain. Active low. DI TP interrupt 1.8 V voltage domain. TP_I2C_SCL 47 OD TP I2C clock TP_I2C_SDA 48 OD TP I2C data Need to be pulled up to 1.8 V externally. Can be used for other I2C devices. A reference circuit for the TP interface is shown below. Figure 20: Reference Circuit Design for the Touch Panel Interface 3.20. Camera Interfaces Based on MIPI CSI standard, the module supports two cameras (4-lane + 4-lane) or three cameras (4-

lane + 2-lane + 1-lane), and the maximum pixel of the camera can be up to 25 MP. The video and photo quality are determined by various factors such as the camera sensor and camera lens specifications. Table 25: Pin Definition of Camera Interfaces Pin Name Pin No. I/O Description Comment CSI1_CLK_N 63 AI MIPI CSI1 clock (-)

SC200E&SC206E_Series_Hardware_Design 61 / 126 TP_RSTTP_I2C_SCLTP_I2C_SDATP_INT1234562.2K2.2KLDO15A_1V84.7 F100 nFModuleRESET SCLSDA INTGNDVDDTPR2R1C1C2D1D2D3D4D5LDO17A_3V0GND Smart Module Series CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN2_N CSI1_LN2_P CSI1_LN3_N CSI1_LN3_P 64 65 66 67 68 72 73 70 71 CSI0_CLK_N 157 CSI0_CLK_P 196 CSI0_LN0_N 158 CSI0_LN0_P 197 CSI0_LN1_N 159 CSI0_LN1_P 198 CSI0_LN2_N 160 CSI0_LN2_P 199 CSI0_LN3_N 161 CSI0_LN3_P 200 AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI MIPI CSI1 clock (+) MIPI CSI1 lane 0 data (-) MIPI CSI1 lane 0 data (+) MIPI CSI1 lane 1 data (-) MIPI CSI1 lane 1 data (+) MIPI CSI1 lane 2 data (-) MIPI CSI1 lane 2 data (+) MIPI CSI1 lane 3 data (-) MIPI CSI1 lane 3 data (+) MIPI CSI0 clock (-) MIPI CSI0 clock (+) MIPI CSI0 lane 0 data (-) MIPI CSI0 lane 0 data (+) MIPI CSI0 lane 1 data (-) MIPI CSI0 lane 1 data (+) MIPI CSI0 lane 2 data (-) MIPI CSI0 lane 2 data (+) MIPI CSI0 lane 3 data (-) MIPI CSI0 lane 3 data (+)

CAM0_I2C_SCL 83 OD I2C clock of camera 0 CAM0_I2C_SDA 84 OD I2C data of camera 0 Need to be pulled up to 1.8 V externally. Can only be used for camera. CAM0_PWDN 80 DO Power down of camera 0 CAM1_PWDN 82 DO Power down of camera 1 CAM2_PWDN 163 DO Power down of camera 2 CAM0_MCLK 74 DO Master clock of camera 0 1.8 V power domain. SC200E&SC206E_Series_Hardware_Design 62 / 126 Smart Module Series CAM1_MCLK 75 DO Master clock of camera 1 CAM2_MCLK 165 DO Master clock of camera 2 CAM0_RST CAM1_RST 79 81 DO Reset of camera 0 DO Reset of camera 1 CAM2_RST 164 DO Reset of camera 2 CAM1_I2C_SCL 166 OD I2C clock of camera 1 CAM1_I2C_SDA 205 OD I2C data of camera 1 Need to be pulled up to 1.8 V externally. Can only be used for camera. SC200E&SC206E_Series_Hardware_Design 63 / 126 The following is a reference circuit design for 3-camera applications. Smart Module Series Figure 21: Reference Circuit Design for 3-Camera Applications SC200E&SC206E_Series_Hardware_Design 64 / 126 camera0 connectorCAM0_PWDNCAM0_MCLKCAM0_I2C_SDACAM0_I2C_SCL_CSI0_LN3_PCSI0_LN3_NCSI0_LN2_PCSI0_LN2_NCSI0_LN1_PCSI0_LN1_NCSI0_LN0_PCSI0_LN0_NCAM1_RSTCAM1_PWDNCAM1_MCLKCSI1_LN3_PCSI1_LN3_NCSI1_LN2_PCSI1_LN2_NCSI1_LN1_PCSI1_LN1_NCSI1_LN0_PCSI1_LN0_NCSI0_CLK_PCSI0_CLK_NCSI1_CLK_PCSI1_CLK_NLDO15A_1V82.2K2.2K camera1 connector1 F4.7F1F1F4.7 FCAM0_RSTCAM2_PWDNCAM2_MCLKCAM1_I2C_SDA_CAM1_I2C_SCLCAM2_RSTcamera2 connector AVDDDVDDDOVDDEMIEMIEMIEMIEMIEMIEMIEMI1F2.2K2.2KDVDDEMIEMI4.71FFAVDDDOVDDOUTGNDINENLDOVPH_PWR1FAF_VDDOUTGNDINENLDOVPH_PWRGPIO1FVDD_2V8GPIOOUTGNDINENLDO1FGPIOVPH_PWR4.7 F Smart Module Series NOTE In 3-camera applications, CSI1_LN3_P and CSI1_LN3_N are used as MIPI clock signals of camera 2. CSI1_LN2_P and CSI1_LN2_N are used as MIPI data signals of camera 2. 3.20.1. MIPI Design Considerations Special attention should be paid to the pin definition of LCM and camera connectors. Make sure the module and the connectors are correctly connected. MIPI lines are high-speed signal lines for DSI-supported maximum data rate of up to 1.5 Gbps and CSI-supported maximum data rate of up to 2.5 Gbps. The differential impedance should be controlled to 100 . Additionally, it is recommended to route the trace on the inner layer of PCB, and do not cross it with other traces. For the same group of DSI or CSI signals, keep all the MIPI traces of the same length. In order to avoid crosstalk, keep a distance of 1.5 times the trace width among MIPI signal lines. During impedance matching, do not connect GND on different planes to ensure impedance consistency. It is recommended to select a low-capacitance TVS for ESD protection and the recommended parasitic capacitance should be below 1 pF. Route MIPI traces according to the following rules:

a) The total trace length should not exceed 240 mm;

b) Control the differential impedance to 100 10 %;

c) Control intra-lane length difference within 0.7 mm;

d) Control inter-lane length difference within 1.4 mm. Table 26: MIPI Trace Length Inside the Module Pin Name Pin No. Length (mm) Length Difference (P - N) DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N 52 53 54 55 56 57 58 59 60 38.53 38.30 38.59 38.43 38.22 38.47 38.84 38.56 38.74

-0.23

-0.16 0.25

-0.28

-0.26 SC200E&SC206E_Series_Hardware_Design 65 / 126 Smart Module Series DSI_LN3_P CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN2_N CSI1_LN2_P CSI1_LN3_N CSI1_LN3_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P 61 63 64 65 66 67 68 72 73 70 71 157 196 158 197 159 198 160 199 161 200 38.48 18.87 18.84 19.42 19.18 19.02 19.28 19.53 19.23 18.93 18.82 20.94 20.73 18.74 18.40 17.18 17.37 8.28 8.15 4.97 4.70

-0.03

-0.24 0.26

-0.3

-0.11

-0.21

-0.34 0.19

-0.13

-0.27 SC200E&SC206E_Series_Hardware_Design 66 / 126 Smart Module Series 3.21. Sensor Interface The module supports communication with sensors via I2C interfaces, and it supports ALS/PS, BDS, accelerometer, gyroscope, etc. Table 27: Pin Definition of Sensor Interface Pin Name Pin No. I/O Description Comment SENSOR_I2C_SCL 91 OD I2C clock for external sensor SENSOR_I2C_SDA 92 OD I2C data for external sensor Need to be pulled up to 1.8 V externally. Can only be used to connect sensor devices. 3.22. Audio Interfaces The module provides three analog input channels and three analog output channels. The following table shows the pin definition. Table 28: Pin Definition of Audio Interfaces Pin Name Pin No. I/O Description Comment MIC_BIAS1 147 PO Bias voltage 1 output for microphone The rated output current is 3 mA. MIC1_P MIC1_M MIC2_P 4 5 6 AI Microphone input for channel 1 (+) -

AI Microphone input for channel 1 (-)

AI Microphone input for headset (+)

MIC3_P 148 AI Microphone input for channel 3 (+) -

MIC3_M 149 AI Microphone input for channel 3 (-)

MIC_BIAS3 155 PO Bias voltage 3 output for microphone The rated output current is 3 mA. The output voltage is fixed to 1.8 V and cannot be adjusted. EAR_P EAR_M 8 9 AO Earpiece output (+) AO Earpiece output (-)

SC200E&SC206E_Series_Hardware_Design 67 / 126 LINEOUT_P 10 AO Audio line differential output (+) The typical output voltage is 2 Vrms. Smart Module Series LINEOUT_M 11 AO Audio line differential output (-) HPH_R 136 AO Headphone right channel output HPH_GND 137 AO Headphone reference ground HPH_L 138 AO Headphone left channel output

HS_DET 139 AI Headset hot-plug detect High level by default. The module offers three audio input channels. The output voltage range of MIC_BIAS1 is programmable between 1.6 V and 2.85 V, and the maximum output current is 3 mA. MIC_BIAS3 supports 1.8 V pull-up output only and is not programmable. The earpiece interface uses differential output. The lineout interface uses differential output, lineout is used as audio PA input. The headphone interface features stereo left and right channel output, and supports headphone insertion detection. 3.22.1. Reference Circuit Design for Microphone Interfaces Figure 22: Reference Circuit Design for ECM Microphone Interface SC200E&SC206E_Series_Hardware_Design 68 / 126 MIC1_PECM MICModuleMIC1_MC2C3MIC_BIAS1R3R1C1R42.2K0R0RMIC1_PECM MICModuleMIC1_MC2C3MIC_BIAS1R3R1R2C1R42.2K0R0R0R100 nF33 pF33 pFD1 Smart Module Series Figure 23: Reference Circuit Design for MEMS Microphone Interface 3.22.2. Reference Circuit Design for Earpiece Interface Figure 24: Reference Circuit Design for Earpiece Interface SC200E&SC206E_Series_Hardware_Design 69 / 126 MIC3_PMEMS MICR2R1C2ModuleC1MIC_BIAS31234F1OUTGNDGNDVDDMIC3_MD1C3D233 pF100 nF0R0R33 pFEAR_PEAR_MR233 pF33 pF33 pFC2C3C1R1ModuleD1D20R0R 3.22.3. Reference Circuit Design for Headset Interface Smart Module Series Figure 25: Reference Circuit Design for Headset Interface 3.22.4. Reference Circuit Design for Lineout Interface Figure 26: Reference Circuit Design for Lineout Interface SC200E&SC206E_Series_Hardware_Design 70 / 126 20KESDMIC2_PHPH_LHS_DETHPH_RHPH_GND33 pFModule63452133 pF33 pFC3C4C5F3F2F1D1D2D3D4F4R2R30RENPA_ENC2D1D2NC+IN-INVO2GNDVDDVO1F2F1C1R2R3R1C3C4C5C7C6Audio PALINEOUT_PLINEOUT_MVPH_PWR10 F10 F100K100K10K22 F1 F33 pF33 pF100 pF Smart Module Series 3.22.5. Audio Signal Design Considerations It is recommended to use the ECM microphone with dual built-in capacitors (e.g., 10 pF and 33 pF) to filter out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied to filter out RF interference when the module is transmitting at EGSM900. The 10 pF capacitor is used to filter out RF interference at DCS1800. Without this capacitor, TDD noise could be heard during voice calls. Please note that the resonant frequency point of a capacitor largely depends on its material and manufacturing technique. Therefore, you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high-frequency noises. The severity of RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, you should select a suitable capacitor according to the test results. Sometimes, even no RF filtering capacitor is required. In order to decrease radio or other signal interference, place RF antennas away from audio interfaces and audio traces. Additionally, keep power traces far away from the audio traces and do not route them in parallel. Route the differential audio traces according to the differential signal layout rule. 3.23. USB_BOOT Control Interface USB_BOOT is an emergency download interface. You can force the module to enter emergency download mode by pulling it up to LDO15A_1V8 when the module is turning on. This is an emergency option when failures such as abnormal start-up or running occur. For firmware upgrade and debugging in the future, reserve the following reference design. Table 29: Pin Definition of USB_BOOT Control Interface Pin Name Pin No. I/O Description Comment USB_BOOT 46 DI Force the module into emergency download mode Force the module to enter emergency download mode by pulling this pin up to LDO15A_1V8 when the module is turning on. SC200E&SC206E_Series_Hardware_Design 71 / 126 Smart Module Series Figure 27: Reference Circuit Design for USB_BOOT Control Interface SC200E&SC206E_Series_Hardware_Design 72 / 126 LDO15A_1V8S1 ModuleUSB_BOOTR110K Smart Module Series 4 Wi-Fi/Bluetooth The module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth functions. The interface impedance should be controlled to 50 . You can connect external antennas such as PCB antenna, sucker antenna, and ceramic antenna to the module via the interface to achieve Wi-Fi and Bluetooth functions. Bluetooth and WLAN (both 5 GHz and 2.4 GHz) are operating in TDD under coex mode. 4.1. Wi-Fi The module supports 2.4 GHz and 5 GHz dual-band WLAN based on IEEE 802.11a/b/g/n/ac standard protocols. The maximum data rate is up to 150 Mbps in 2.4 GHz bands, and 433 Mbps in 5 GHz bands. The features are as below:

Supports Wake-on-WLAN (WoWLAN) Supports ad hoc mode Supports WAPI SMS4 hardware encryption Supports AP and STA mode Supports Wi-Fi Direct Supports MCS 07 for HT20 and HT40 Supports MCS 08 for VHT20 Supports MCS 09 for VHT40 and VHT80 4.1.1. Wi-Fi Performance The following table lists the Wi-Fi transmitting and receiving performance of the module. Table 30: Wi-Fi Transmitting Performance Frequency Bands Standard Rate 802.11b 1 Mbps 2.4 GHz 802.11b 11 Mbps 802.11g 6 Mbps SC200E&SC206E_Series_Hardware_Design 73 / 126 Smart Module Series 802.11g 54 Mbps 802.11n HT20 MCS0 802.11n HT20 MCS7 802.11n HT40 MCS0 802.11n HT40 MCS7 802.11a 802.11a 6 Mbps 54 Mbps 802.11n HT20 MCS0 802.11n HT20 MCS7 802.11n HT40 MCS0 802.11n HT40 MCS7 802.11ac VHT20 MCS0 802.11ac VHT20 MCS8 802.11ac VHT40 MCS0 802.11ac VHT40 MCS9 802.11ac VHT80 MCS0 802.11ac VHT80 MCS9 5 GHz Table 31: Wi-Fi Receiving Performance Frequency Bands Standard Rate Sensitivity 802.11b 802.11b 1 Mbps

-96 dBm 11 Mbps

-87 dBm 2.4 GHz 802.11g 6 Mbps

-90 dBm 802.11g 54 Mbps

-74 dBm 802.11n HT20 MCS0

-88 dBm SC200E&SC206E_Series_Hardware_Design 74 / 126 Smart Module Series 802.11n HT20 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11ac VHT20 802.11ac VHT20 802.11ac VHT40 802.11ac VHT40 802.11ac VHT80 802.11ac VHT80 MCS7 MCS0 MCS7 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 MCS0 MCS9 5 GHz

-68 dBm

-85 dBm

-66 dBm

-89 dBm

-72 dBm

-88 dBm

-68 dBm

-85 dBm

-66 dBm

-89 dBm

-66 dBm

-85 dBm

-61 dBm

-82 dBm

-58 dBm Reference specifications are listed below:

IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11a, IEEE Std 802.11b, IEEE Std 802.11g: IEEE 802.11-2007 WLAN MAC and PHY, June 2007 4.2. Bluetooth The module supports Bluetooth 5.0 (BR/EDR + BLE) specification, as well as GFSK, 8-DPSK, /4-

DQPSK modulation modes. Maximally supports up to 7 wireless connections. Maximally supports up to 3.5 piconets at the same time. Support one SCO or eSCO connection. SC200E&SC206E_Series_Hardware_Design 75 / 126 The BR/EDR channel bandwidth is 1 MHz, and can accommodate 79 channels. The BLE channel bandwidth is 2 MHz, and can accommodate 40 channels. Smart Module Series Table 32: Bluetooth Data Rate and Version Version 1.2 2.0 + EDR 3.0 + HS 4.0 5.0 Data Rate Maximum Application Throughput 1 Mbit/s 3 Mbit/s 24 Mbit/s 24 Mbit/s 24 Mbit/s

> 80 kbit/s

> 80 kbit/s Reference 3.0 + HS Reference 4.0 LE Reference 5.0 LE Reference specifications are listed below:

Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1 + EDR/3.0/3.0 +

HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 4.2.1. Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of the module. Table 33: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 2-DH5 3-DH5 Receiver Performance Packet Types DH5 2-DH5 Receiving Sensitivity

-93 dBm

-90 dBm 3-DH5

-85 dBm SC200E&SC206E_Series_Hardware_Design 76 / 126 Smart Module Series 5 GNSS The module integrates a IZat GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, Galileo, BDS, QZSS, SBAS and NavIC 5 . With an embedded LNA, the positioning accuracy of the module has been significantly improved. 5.1. GNSS Performance The following table lists the GNSS performance of the module in conduction mode. Table 34: GNSS Performance Parameter Description Acquisition Sensitivity Reacquisition Tracking Cold start TTFF Warm start Hot start CEP-50 Accuracy NOTE Typ.

-147

-159

-159 31.2 24.7 1.32 2.5 Unit dBm dBm dBm s s s m 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock

(keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 5 SC200E-WF and SC206E-WF do not support GNSS and NavIC is supported by SC200E-NA and SC206E-NA only. SC200E&SC206E_Series_Hardware_Design 77 / 126 Smart Module Series 5.2. Reference Design Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below:

Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference. In user systems, place GNSS RF signal lines and RF components far away from high-speed circuits, switch-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. For applications with harsh electromagnetic environment or high ESD protection requirements, it is recommended to add ESD protective diodes for the antenna interface. The junction capacitance of the diodes should be less than 0.5 pF. Otherwise, it will influence the impedance characteristic of RF circuit loop, or cause attenuation of bypass RF signals. Control the impedance of feeder lines and PCB traces to 50 , and keep the trace as short as possible. See Chapter 6.3 for reference circuit designs of GNSS antenna. SC200E&SC206E_Series_Hardware_Design 78 / 126 Smart Module Series 6 Antenna Interfaces SC200E-CE/-EM/-NA and SC206E-EM/-NA provide four antenna interfaces for the main, Rx-diversity, Wi-Fi/Bluetooth, and GNSS antennas respectively, while SC200E-WF and SC206E-WF provide one antenna interface for Wi-Fi/Bluetooth antenna only. The impedance of the antenna ports should be controlled to 50 . Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. 6.1. Main Antenna and Rx-diversity Antenna Interfaces Table 35: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_MAIN 87 AIO Main antenna interface ANT_DRX 131 AI Diversity antenna interface 50 impedance 6.1.1. Operating Frequency The operating frequencies of the modules are listed in the following tables. Table 36: SC200E-CE Operating Frequency 3GPP Bands EGSM900 DCS1800 Receive 925960 Transmit 880915 18051880 17101785 WCDMA B1 21102170 19201980 Unit MHz MHz MHz SC200E&SC206E_Series_Hardware_Design 79 / 126 Smart Module Series WCDMA B8 925960 EVDO/CDMA BC0 869894 880915 824849 LTE-FDD B1 21102170 19201980 LTE-FDD B3 18051880 17101785 LTE-FDD B5 LTE-FDD B8 869894 925960 824849 880915 LTE-TDD B34 20102025 20102025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 LTE-TDD B41 25352675 25352675 Table 37: SC200E-EM&SC206E-EM Operating Frequency 3GPP Bands GSM850 EGSM900 DCS1800 PCS1900 Receive 869894 925960 Transmit 824849 880915 18051880 17101785 19301990 18501910 WCDMA B1 21102170 19201980 WCDMA B2 19301990 18501910 WCDMA B4 21102155 17101755 WCDMA B5 WCDMA B8 869894 925960 824849 880915 LTE-FDD B1 21102170 19201980 LTE-FDD B2 19301990 18501910 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC200E&SC206E_Series_Hardware_Design 80 / 126 Smart Module Series LTE-FDD B3 18051880 17101785 LTE-FDD B4 21102155 17101755 LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 925960 791821 758803 880915 832862 703748 LTE-TDD B38 25702620 25702620 LTE-TDD B40 23002400 23002400 LTE-TDD B41 24962690 24962690 Table 38: SC200E-NA&SC206E-NA Operating Frequency 3GPP Bands Receive Transmit LTE-FDD B2 19301990 18501910 LTE-FDD B4 21102155 17101755 LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 729746 746756 758768 734746 699716 777787 788798 704716 LTE-FDD B25 19301995 18501915 LTE-FDD B26 859894 814849 LTE-FDD B66 21102180 17101780 LTE-FDD B71 617652 663698 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC200E&SC206E_Series_Hardware_Design 81 / 126 LTE-TDD B41 24962690 24962690 MHz Smart Module Series Table 39: SC200E-JP Operating Frequency 3GPP Bands Receive Transmit WCDMA B1 21102170 19201980 WCDMA B6 WCDMA B8 WCDMA B19 875885 925960 875885 830840 880915 830840 LTE-FDD B1 21102170 19201980 LTE-FDD B3 18051880 17101785 LTE-FDD B5 LTE-FDD B8 869894 925960 824849 880915 LTE-FDD B11 1475.91495.9 1427.91447.9 LTE-FDD B18 LTE-FDD B19 860875 875890 815830 830845 LTE-FDD B21 1495.91510.9 1447.91462.9 LTE-FDD B26 LTE-FDD B28 859894 758803 814849 703748 LTE-TDD B41 24962690 24962690 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 6.1.2. Reference Design A reference circuit design for the main and Rx-diversity antenna interfaces is shown below. Reserve a -

type matching circuit for each antenna to achieve better RF performance, and place the -type matching components (R1/C1/C2 and R2/C3/C4) as close to the antennas as possible. The capacitors are not mounted by default and the resistors are 0 . SC200E&SC206E_Series_Hardware_Design 82 / 126 Smart Module Series Figure 28: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces 6.2. Wi-Fi/Bluetooth Antenna Interface The following tables show the pin definition and frequency specification of the Wi-Fi/Bluetooth antenna interface. Table 40: Pin Definition of Wi-Fi/Bluetooth Antenna Interface Pin Name Pin No. I/O Description Comment ANT_WIFI/BT 77 AIO Wi-Fi/Bluetooth antenna interface 50 impedance Table 41: Wi-Fi/Bluetooth Frequency Type Wi-Fi (2.4 GHz) Wi-Fi (5 GHz) Bluetooth 5.0 Frequency 24122462 51805825 24022480 Unit MHz MHz MHz A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. C1 and C2 are not SC200E&SC206E_Series_Hardware_Design 83 / 126 ANT_MAINR1 0 C1ModuleNMC2NMMainAntennaANT_DIVR2 0 C3NMC4NMDiversityAntenna mounted by default and the resistor is 0 . Smart Module Series Figure 29: Reference Circuit Design for Wi-Fi/Bluetooth Antenna 6.3. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 42: Pin Definition of GNSS Antenna Interface Pin Name Pin No. ANT_GNSS 121 I/O AI Description Comment GNSS antenna interface 50 impedance Table 43: GNSS Frequency Type GPS L1 GPS L5 Frequency 1575.42 1.023 1176.45 10.23 GLONASS L1 1597.51605.8 BDS B1I Galileo E1 1561.098 2.046 1575.42 2.046 Galileo E5a 1176.45 10.23 Unit MHz MHz MHz MHz MHz MHz SC200E&SC206E_Series_Hardware_Design 84 / 126 ANT_WIFI/BTR1 0 C1ModuleNMC2NMWi-Fi/Bluetooth antenna Smart Module Series QZSS L1 QZSS L5 SBAS L1 SBAS L5 NavlC L5 1575.42 1.023 1176.45 10.23 1575.42 1.023 1176.45 10.23 1176.45 10.23 MHz MHz MHz MHz MHz 6.3.1. Reference Circuit Design for Passive GNSS Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Figure 30: Reference Circuit Design for Passive GNSS Antenna NOTE It is not recommended to add an external LNA when using a passive GNSS antenna. 6.3.2. Reference Circuit Design for Active GNSS Antenna In any case, it is recommended to use a passive antenna. If active antenna is indeed needed in your application, it is recommended to reserve a -type attenuation circuit provision and use high-

performance LDO as the power supply. The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Despite its low power consumption, the active antenna still requires stable and clean power supplies. Therefore, it is recommended to use high-performance LDO as the power supply. SC200E&SC206E_Series_Hardware_Design 85 / 126 Passive AntennaModuleANT_GNSSNMC1C2C3NMR10 A reference design for active GNSS antenna is shown below. Smart Module Series Figure 31: Reference Circuit Design for Active GNSS Antenna NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 6.4. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 32: Microstrip Design on a 2-layer PCB SC200E&SC206E_Series_Hardware_Design 86 / 126 Active Antenna3V3ModuleANT_GNSS56 nH10 1 F100 pFC1R1L1C3C2100 pFR3R4R50 NMNM Smart Module Series Figure 33: Coplanar Waveguide Design on a 2-layer PCB Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. SC200E&SC206E_Series_Hardware_Design 87 / 126 Smart Module Series The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces

(2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. 6.5. Antenna Installation 6.5.1. Antenna Design Requirements The following table shows the requirements for the main antenna, Rx-diversity antenna, Wi-Fi/Bluetooth antenna, and GNSS antenna. Table 44: Antenna Requirements Type Requirements GSM/WCDMA/LTE Wi-Fi/Bluetooth GNSS VSWR: 2 Gain: 1 dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable insertion loss:

< 1 dB: LB (< 1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: HB (> 2.3 GHz) VSWR: 2 Gain: 1 dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable Insertion Loss: < 1 dB Frequency range:

L1: 15591609 MHz L5: 11661187 MHz (only supported on SC200E-NA & SC206E-NA) Polarization: RHCP or linear VSWR: 2 (Typ.) For passive antenna usage:

Passive antenna gain: > 0 dBi SC200E&SC206E_Series_Hardware_Design 88 / 126 Smart Module Series For active antenna usage:

Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.5 dB (Typ.) Active antenna embedded LNA gain: < 17 dB (Typ.) 6.5.2. RF Connector Recommendation If you use an RF connector for antenna connection, it is recommended to use the U.FL-R-SMT receptacle provided by Hirose. Figure 36: Dimensions of the Receptacle (Unit: mm) SC200E&SC206E_Series_Hardware_Design 89 / 126 U.FL-LP series mated plugs listed in the following figure can be used to match U.FL-R-SMT. Smart Module Series Figure 37: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 38: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. SC200E&SC206E_Series_Hardware_Design 90 / 126 Smart Module Series 7 Electrical Characteristics and Reliability 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 45: Absolute Maximum Ratings Parameter VBAT USB_VBUS Peak Current of VBAT Voltage on Digital Pins Min.

-0.5

-0.5

-0.3 Max. Unit 6 16 3 2.16 V V A V 7.2. Power Supply Ratings Table 46: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT The actual input voltages must be kept between the minimum and maximum values 3.55 3.8 4.4 V Voltage drop during transmitting burst Maximum power control level at EGSM900

400 mV IVBAT Peak supply current Maximum power control level at -

1.8 3.0 A SC200E&SC206E_Series_Hardware_Design 91 / 126 Smart Module Series

(during transmission slot) EGSM900 USB_VBUS Charging power input VRTC Power supply voltage of the backup battery

4.0 5.0 6.0 V 2.5 3.0 3.2 V Min. 1.17

-0.3 Min. 1.75 1.26

-0.3 7.3. Digital I/O Characteristics Table 47: 1.8 V Digital I/O Requirements Parameter Description Input high voltage Input low voltage Output high voltage 1.35 Output low voltage 0 Table 48: (U)SIM 1.8 V I/O Requirements Parameter Description USIM_VDD Power supply Input high voltage Input low voltage Output high voltage 1.44 Output low voltage 0 Table 49: (U)SIM 2.95 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 2.8 VIH VIL VOH VOL VIH VIL VOH VOL Max. Unit 2.1 0.63 1.8 0.45 V V V V Max. Unit 1.85 2.1 0.36 1.8 0.4 Max. 3.1 V V V V V Unit V SC200E&SC206E_Series_Hardware_Design 92 / 126 VIH VIL VOH VOL Input high voltage 2.065 Input low voltage

-0.3 Output high voltage 2.36 Output low voltage 0 Table 50: SD Card 1.8 V I/O Requirements Parameter Description Input high voltage Input low voltage Output high voltage Output low voltage

Table 51: SD Card 2.95 V I/O Requirements Parameter Description Input high voltage Input low voltage Output high voltage 2.21 Output low voltage 0 Min. 1.27

-0.3 1.4 Min. 1.84

-0.3 VIH VIL VOH VOL VIH VIL VOH VOL Smart Module Series 3.25 0.59 2.95 0.4 Max. 2 0.58

0.45 Max. 3.25 0.74 2.95 0.37 V V V V Unit V V V V Unit V V V V 7.4. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 52: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit SC200E&SC206E_Series_Hardware_Design 93 / 126 Operating temperature range 6

-35 Storage Temperature Range

-40

+25

+75

+90 C C Smart Module Series 7.5. Power Consumption The values of current consumption are shown below. Table 53: SC200E-CE Power Consumption Description Conditions Typ. Unit OFF state Power off 42.0 Sleep state (USB disconnected) @ DRX = 2 4.93 GSM/GPRS supply current Sleep state (USB disconnected) @ DRX = 5 4.26 Sleep state (USB disconnected) @ DRX = 9 3.85 Sleep state (USB disconnected) @ DRX = 6 4.65 Sleep state (USB disconnected) @ DRX = 7 4.21 Sleep state (USB disconnected) @ DRX = 8 4.11 Sleep state (USB disconnected) @ DRX = 9 3.87 BC0 CH283 @ Slot Cycle Index = 1 BC0 CH283 @ Slot Cycle Index = 7 4.94 3.71 Sleep state (USB disconnected) @ DRX = 5 6.27 Sleep state (USB disconnected) @ DRX = 6 5.00 Sleep state (USB disconnected) @ DRX = 7 4.28 Sleep state (USB disconnected) @ DRX = 8 4.17 Sleep state (USB disconnected) @ DRX = 5 6.30 Sleep state (USB disconnected) @ DRX = 6 5.10 WCDMA supply current CDMA supply current LTE-FDD supply current LTE-TDD supply current A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 6 Within operating temperature range, the module meets 3GPP specifications. SC200E&SC206E_Series_Hardware_Design 94 / 126 Smart Module Series Sleep state (USB disconnected) @ DRX = 7 4.43 Sleep state (USB disconnected) @ DRX = 8 3.99 GSM voice call WCDMA voice call GPRS data transmission EGSM900 @ PCL 5 EGSM900 @ PCL 12 EGSM900 @ PCL 19 DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 B1 @ max. power B8 @ max. power EGSM900 (1UL/4DL) @ PCL 5 EGSM900 (2UL/3DL) @ PCL 5 EGSM900 (3UL/2DL) @ PCL 5 EGSM900 (4UL/1DL) @ PCL 5 DCS1800 (1UL/4DL) @ PCL 0 DCS1800 (2UL/3DL) @ PCL 0 DCS1800 (3UL/2DL) @ PCL 0 DCS1800 (4UL/1DL) @ PCL 0 EGSM900 (1UL/4DL) @ PCL 8 EGSM900 (2UL/3DL) @ PCL 8 EGSM900 (3UL/2DL) @ PCL 8 EDGE data transmission EGSM900 (4UL/1DL) @ PCL 8 DCS1800 (1UL/4DL) @ PCL 2 DCS1800 (2UL/3DL) @ PCL 2 DCS1800 (3UL/2DL) @ PCL 2 287 143 87 190 137 85 586 640 282 451 528 613 190 297 356 439 202 326 436 556 178 278 374 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC200E&SC206E_Series_Hardware_Design 95 / 126 Smart Module Series WCDMA data transmission EVDO/CDMA data transmission DCS1800 (4UL/1DL) @ PCL 2 B1 (HSDPA) @ max power B8 (HSDPA) @ max power B1 (HSUPA) @ max power B8 (HSUPA) @ max power BC0 @ max power LTE-FDD B1 @ max power LTE-FDD B3 @ max power LTE-FDD B5 @ max power LTE-FDD B8 @ max power LTE data transmission LTE-TDD B34 @ max power LTE-TDD B38 @ max power LTE-TDD B39 @ max power LTE-TDD B40 @ max power LTE-TDD B41 @ max power Table 54: SC200E-EM&SC206E-EM Power Consumption Description Conditions OFF state Power off 476 552 596 573 614 614 654 653 587 638 307 407 325 401 433 Typ. 39.0 Sleep state (USB disconnected) @ DRX = 2 4.99 GSM/GPRS supply current Sleep state (USB disconnected) @ DRX = 5 4.24 Sleep state (USB disconnected) @ DRX = 9 4.01 Sleep state (USB disconnected) @ DRX = 6 4.57 WCDMA supply current Sleep state (USB disconnected) @ DRX = 7 4.17 Sleep state (USB disconnected) @ DRX = 8 3.97 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit A mA mA mA mA mA mA SC200E&SC206E_Series_Hardware_Design 96 / 126 Smart Module Series LTE-FDD supply current LTE-TDD supply current Sleep state (USB disconnected) @ DRX = 9 3.85 Sleep state (USB disconnected) @ DRX = 5 6.26 Sleep state (USB disconnected) @ DRX = 6 4.98 Sleep state (USB disconnected) @ DRX = 7 4.31 Sleep state (USB disconnected) @ DRX = 8 4.01 Sleep state (USB disconnected) @ DRX = 5 6.36 Sleep state (USB disconnected) @ DRX = 6 5.03 Sleep state (USB disconnected) @ DRX = 7 4.38 Sleep state (USB disconnected) @ DRX = 8 4.02 GSM voice call GSM850 @ PCL 5 GSM850 @ PCL 12 GSM850 @ PCL 19 EGSM900 @ PCL 5 EGSM900 @ PCL 12 EGSM900 @ PCL 19 DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 PCS1900 @ PCL 0 PCS1900 @ PCL 7 PCS1900 @ PCL 15 B1 @ max power B2 @ max power WCDMA voice call B4 @ max power B5 @ max power B8 @ max power GPRS data transmission GSM850 (1UL/4DL) @ PCL 5 274 139 83 291 138 83 181 133 81 190 135 81 590 590 630 550 630 267 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC200E&SC206E_Series_Hardware_Design 97 / 126 GSM850 (2UL/3DL) @ PCL 5 GSM850 (3UL/2DL) @ PCL 5 GSM850 (4UL/1DL) @ PCL 5 EGSM900 (1UL/4DL) @ PCL 5 EGSM900 (2UL/3DL) @ PCL 5 EGSM900 (3UL/2DL) @ PCL 5 EGSM900 (4UL/1DL) @ PCL 5 DCS1800 (1UL/4DL) @ PCL 0 DCS1800 (2UL/3DL) @ PCL 0 DCS1800 (3UL/2DL) @ PCL 0 DCS1800 (4UL/1DL) @ PCL 0 PCS1900 (1UL/4DL) @ PCL 0 PCS1900 (2UL/3DL) @ PCL 0 PCS1900 (3UL/2DL) @ PCL 0 PCS1900 (4UL/1DL) @ PCL 0 GSM850 (1UL/4DL) @ PCL 8 GSM850 (2UL/3DL) @ PCL 8 GSM850 (3UL/2DL) @ PCL 8 GSM850 (4UL/1DL) @ PCL 8 EGSM900 (1UL/4DL) @ PCL 8 EGSM900 (2UL/3DL) @ PCL 8 EGSM900 (3UL/2DL) @ PCL 8 EGSM900 (4UL/1DL) @ PCL 8 DCS1800 (1UL/4DL) @ PCL 2 DCS1800 (2UL/3DL) @ PCL 2 DCS1800 (3UL/2DL) @ PCL 2 DCS1800 (4UL/1DL) @ PCL 2 Smart Module Series 417 490 579 287 451 524 617 188 277 344 426 193 291 352 435 194 318 430 550 200 325 438 554 173 275 376 491 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transmission SC200E&SC206E_Series_Hardware_Design 98 / 126 PCS1900 (1UL/4DL) @ PCL 2 PCS1900 (2UL/3DL) @ PCL 2 PCS1900 (3UL/2DL) @ PCL 2 PCS1900 (4UL/1DL) @ PCL 2 B1 (HSDPA) @ max power B2 (HSDPA) @ max power B4 (HSDPA) @ max power B5 (HSDPA) @ max power B8 (HSDPA) @ max power B1 (HSUPA) @ max power B2 (HSUPA) @ max power B4 (HSUPA) @ max power B5 (HSUPA) @ max power B8 (HSUPA) @ max power LTE-FDD B1 @ max power LTE-FDD B2 @ max power LTE-FDD B3 @ max power LTE-FDD B4 @ max power LTE-FDD B5 @ max power LTE-FDD B7 @ max power LTE-FDD B8 @ max power LTE-FDD B20 @ max power LTE-FDD B28 @ max power LTE-TDD B38 @ max power LTE-TDD B40 @ max power LTE-TDD B41 @ max power WCDMA data transmission LTE data transmission Smart Module Series 171 274 373 480 560 550 590 515 610 575 565 600 530 600 645 640 630 670 580 690 585 605 620 370 370 400 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC200E&SC206E_Series_Hardware_Design 99 / 126 Smart Module Series Table 55: SC200E-NA&SC206E-NA Power Consumption Description Conditions OFF state Power off Typ. 36.0 LTE-FDD supply current LTE-TDD supply current Sleep state (USB disconnected) @ DRX = 5 6.25 Sleep state (USB disconnected) @ DRX = 6 4.85 Sleep state (USB disconnected) @ DRX = 7 4.19 Sleep state (USB disconnected) @ DRX = 8 3.96 Sleep state (USB disconnected) @ DRX = 5 6.34 Sleep state (USB disconnected) @ DRX = 6 5.07 Sleep state (USB disconnected) @ DRX = 7 4.33 Sleep state (USB disconnected) @ DRX = 8 4.04 LTE data transmission LTE-FDD B2 @ max power LTE-FDD B4 @ max power LTE-FDD B5 @ max power LTE-FDD B7 @ max power LTE-FDD B12 @ max power LTE-FDD B13 @ max power LTE-FDD B14 @ max power LTE-FDD B17@ max power LTE-FDD B25 @ max power LTE-FDD B26 @ max power LTE-FDD B66 @ max power LTE-FDD B71 @ max power 671 649 670 822 722 742 639 705 707 660 673 634 Unit A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC200E&SC206E_Series_Hardware_Design 100 / 126 Smart Module Series LTE-TDD B41 @ max power 423 mA Table 56: SC200E-JP Power Consumption Description Conditions OFF state Power off Typ. TBD WCDMA supply current LTE-FDD supply current LTE-TDD supply current WCDMA voice call Sleep state (USB disconnected) @ DRX = 6 TBD Sleep state (USB disconnected) @ DRX = 7 TBD Sleep state (USB disconnected) @ DRX = 8 TBD Sleep state (USB disconnected) @ DRX = 9 TBD Sleep state (USB disconnected) @ DRX = 5 TBD Sleep state (USB disconnected) @ DRX = 6 TBD Sleep state (USB disconnected) @ DRX = 7 TBD Sleep state (USB disconnected) @ DRX = 8 TBD Sleep state (USB disconnected) @ DRX = 5 TBD Sleep state (USB disconnected) @ DRX = 6 TBD Sleep state (USB disconnected) @ DRX = 7 TBD Sleep state (USB disconnected) @ DRX = 8 TBD B1 @ max power B6 @ max power B8 @ max power B19 @ max power B1 (HSDPA) @ max power B6 (HSDPA) @ max power TBD TBD TBD TBD TBD TBD TBD TBD TBD Unit A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA data transmission B8 (HSDPA) @ max power B19 (HSDPA) @ max power B1 (HSUPA) @ max power SC200E&SC206E_Series_Hardware_Design 101 / 126 Smart Module Series TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA B6 (HSUPA) @ max power B8(HSUPA) @ max power B19 (HSUPA) @ max power LTE-FDD B1 @ max power LTE-FDD B3 @ max power LTE-FDD B5 @ max power LTE-FDD B8 @ max power LTE-FDD B11 @ max power LTE data transmission LTE-FDD B18 @ max power LTE-FDD B19 @ max power LTE-FDD B21 @ max power LTE-FDD B26 @ max power LTE-FDD B28 @ max power LTE-TDD B41 @ max power 7.6. Tx Power The following tables show the RF output power of the module. Table 57: SC200E-CE RF Tx Power Frequency Bands Max. RF Output Power Min. RF Output Power EGSM900 DCS1800 WCDMA B1 WCDMA B8 33 dBm 2 dB 30 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB EVDO/CDMA BC0 24 dBm +3/-1 dB LTE-FDD B1 23 dBm 2 dB 5 dBm 5 dB 0 dBm 5 dB

< -49 dBm

< -49 dBm

< -49 dBm

< -39 dBm SC200E&SC206E_Series_Hardware_Design 102 / 126 Smart Module Series LTE-FDD B3 LTE-FDD B5 LTE-FDD B8 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B41 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm Table 58: SC200E-EM&SC206E-EM RF Tx Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 33 dBm 2 dB 33 dBm 2 dB 30 dBm 2 dB 30 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 5 dBm 5 dB 5 dBm 5 dB 0 dBm 5 dB 0 dBm 5 dB

< -49 dBm

< -49 dBm

< -49 dBm

< -49 dBm

< -49 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm SC200E&SC206E_Series_Hardware_Design 103 / 126 Smart Module Series LTE-FDD B28 LTE-TDD B38 LTE-TDD B40 LTE-TDD B41 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm Table 59: SC200E-NA&SC206E-NA RF Tx Power Frequency Bands Max. RF Output Power Min. RF Output Power LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B25 LTE-FDD B26 LTE-FDD B66 LTE-FDD B71 LTE-TDD B41 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm Table 60: SC200E-JP RF Tx Power Frequency Bands Max. RF Output Power Min. RF Output Power WCDMA B1 WCDMA B6 WCDMA B8 WCDMA B19 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB

< -49 dBm

< -49 dBm

< -49 dBm

< -49 dBm SC200E&SC206E_Series_Hardware_Design 104 / 126 Smart Module Series LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 LTE-FDD B8 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB LTE-FDD B11 23 dBm 2 dB LTE-FDD B18 23 dBm 2 dB LTE-FDD B19 23 dBm 2 dB LTE-FDD B21 23 dBm 2 dB LTE-FDD B26 23 dBm 2 dB LTE-FDD B28 23 dBm 2 dB LTE-TDD B41 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm NOTE In GPRS and EDGE 4-slot Tx mode, the maximum output power is reduced by 4 dB. This design conforms to the GSM specification as described in 3GPP TS 51.010-1 subclause 13.16 and subclause 13.17. 7.7. Rx Sensitivity The following table shows the RF receiving sensitivity of the module. Table 61: SC200E-CE RF Rx Sensitivity (Unit: dBm) Frequency Bands 3GPP (SIMO) Receiving Sensitivity (Typ.) EGSM900 DCS1800 WCDMA B1 Primary Diversity SIMO

-109.5

-109.0

-110.5

-111.0

-113.0

-102.4

-102.4

-106.7 SC200E&SC206E_Series_Hardware_Design 105 / 126 Smart Module Series

-111.0

-112.5

-103.7 WCDMA B8 EVDO/CDMA BC0

-111.0

-108.5

LTE-FDD B1 (10 MHz)

-98.0

-100.0 LTE-FDD B3 (10 MHz)

-98.5 LTE-FDD B5 (10 MHz)

-99.5

-98.5

-99.5 LTE-FDD B8 (10 MHz)

-99.0

-100.0 LTE-TDD B34 (10 MHz)

-98.0 LTE-TDD B38 (10 MHz)

-97.0 LTE-TDD B39 (10 MHz)

-98.0 LTE-TDD B40 (10 MHz)

-97.5 LTE-TDD B41 (10 MHz)

-96.0

-99.0

-98.0

-99.0

-98.5

-98.0

-102.0

-101.5

-102.5

-102.5

-101.5

-99.5

-101.5

-101.0

-99.5

-104

-96.3

-93.3

-94.3

-93.3

-96.3

-96.3

-96.3

-96.3

-94.3 Table 62: SC200E-EM&SC206E-EM RF Rx Sensitivity (Unit: dBm) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8

-109.5

-108.5

-109.5

-108.5

-109.0

-109.0

-109.0

-110.0

-110.5 LTE-FDD B1 (10 MHz)

-97.5 LTE-FDD B2 (10 MHz)

-97.0 LTE-FDD B3 (10 MHz)

-98.5 LTE-FDD B4 (10 MHz)

-97.0

-111.0

-110.0

-110.0

-111.0

-111.0

-99.0

-98.0

-98.0

-99.0

-112.5

-112.5

-111.0

-112.5

-112.5

-101.5

-100.5

-101.5

-101.0

-102.4

-102.4

-102.4

-102.4

-106.7

-104.7

-106.7

-104.7

-103.7

-96.3

-94.3

-93.3

-96.3 SC200E&SC206E_Series_Hardware_Design 106 / 126 Smart Module Series LTE-FDD B5 (10 MHz)

-99.0 LTE-FDD B7 (10 MHz)

-97.0 LTE-FDD B8 (10 MHz)

-99.0

-99.0

-97.0

-99.5 LTE-FDD B20 (10 MHz)

-99.0

-100.0 LTE-FDD B28 (10 MHz)

-99.0 LTE-TDD B38 (10 MHz)

-97.0 LTE-TDD B40 (10 MHz)

-97.5 LTE-TDD B41 (10 MHz)

-96.0

-99.5

-97.0

-98.5

-97.0

-102.0

-100.0

-102.0

-102.5

-102.0

-99.5

-100.5

-99.5

-94.3

-94.3

-93.3

-93.3

-94.8

-96.3

-96.3

-94.3 Table 63: SC200E-NA&SC206E-NA RF Rx Sensitivity (Unit: dBm) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) LTE-FDD B2 (10 MHz)

-97.0 LTE-FDD B4 (10 MHz)

-97.0 LTE-FDD B5 (10 MHz)

-99.0 LTE-FDD B7 (10 MHz)

-96.0 LTE-FDD B12 (10 MHz)

-98.5 LTE-FDD B13 (10 MHz)

-98.0 LTE-FDD B14 (10 MHz)

-97.5 LTE-FDD B17 (10 MHz)

-97.0 LTE-FDD B25 (10 MHz)

-97.0 LTE-FDD B26 (10 MHz)

-98.5 LTE-FDD B66 (10 MHz)

-97.0 LTE-FDD B71 (10 MHz)

-99.0 LTE-TDD B41 (10 MHz)

-96.5

-98.5

-98.0

-98.5

-98.0

-98.0

-99.0

-98.5

-99.0

-98.5

-99.5

-97.5

-100.5

-96.5

-101.0

-100.5

-102.0

-100.0

-101.5

-101.5

-101.0

-101.0

-101.0

-102.0

-100.5

-103.0

-99.5

-94.3

-96.3

-94.3

-94.3

-93.3

-93.3

-93.3

-93.3

-92.8

-93.8

-95.8

-93.5

-94.3 Table 64: SC200E-JP RF Rx Sensitivity (Unit: dBm) Frequency Bands Receiving Sensitivity (Typ.) 3GPP (SIMO) SC200E&SC206E_Series_Hardware_Design 107 / 126 Smart Module Series Primary Diversity SIMO WCDMA B1 WCDMA B6 WCDMA B8 WCDMA B19 TBD TBD TBD TBD LTE-FDD B1 (10 MHz) TBD LTE-FDD B3 (10 MHz) TBD LTE-FDD B5 (10 MHz) TBD LTE-FDD B8 (10 MHz) TBD LTE-FDD B11 (10 MHz) TBD LTE-FDD B18 (10 MHz) TBD LTE-FDD B19 (10 MHz) TBD LTE-FDD B21 (10 MHz) TBD LTE-FDD B26 (10 MHz) TBD LTE-FDD B28 (10 MHz) TBD LTE-TDD B41 (10 MHz) TBD 7.8. ESD Protection TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-106.7

-106.7

-103.7

-106.7

-96.3

-93.3

-94.3

-93.3

-96.3

-96.3

-96.3

-96.3

-93.8

-94.8

-94.3 Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. The following table shows the electrostatic discharge characteristics of the module. Table 65: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 45 %) Tested Interfaces Contact Discharge Air Discharge Unit SC200E&SC206E_Series_Hardware_Design 108 / 126 Smart Module Series VBAT, GND Antenna Interfaces 5 5 Other Interfaces 0.5 10 10 1 kV kV kV SC200E&SC206E_Series_Hardware_Design 109 / 126 Smart Module Series 8 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 8.1. Mechanical Dimensions Figure 39: Module Top and Side Dimensions SC200E&SC206E_Series_Hardware_Design 110 / 126 Smart Module Series Figure 40: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. SC200E&SC206E_Series_Hardware_Design 111 / 126 8.2. Recommended Footprint Smart Module Series Figure 41: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. SC200E&SC206E_Series_Hardware_Design 112 / 126 8.3. Top and Bottom Views Smart Module Series Figure 42: Top and Bottom Views of SC200E Series Figure 43: Top and Bottom Views of SC206E Series NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC200E&SC206E_Series_Hardware_Design 113 / 126 Smart Module Series 9 Storage, Manufacturing & Packaging 9.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 7 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 7 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. SC200E&SC206E_Series_Hardware_Design 114 / 126 Smart Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 9.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 44: Recommended Reflow Soldering Thermal Profile SC200E&SC206E_Series_Hardware_Design 115 / 126 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 13 C/s Cooling down slope: -1.5 to -3 C/s Max slope: 13 C/s Smart Module Series Table 66: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 13 C/s 4070 s 235 C to 246 C

-1.5 to -3 C/s 1 1. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic soldering) that is not mentioned in document [4]. SC200E&SC206E_Series_Hardware_Design 116 / 126 Smart Module Series 9.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

9.3.1. Carrier Tape Dimension details are as follow:

Figure 45: Carrier Tape Dimension Drawing Table 67: Carrier Tape Dimension Table (Unit: mm) W 72 P 56 T A0 B0 0.4 41.2 41.2 K0 4 K1 4.6 F E 34.2 1.75 SC200E&SC206E_Series_Hardware_Design 117 / 126 9.3.2. Plastic Reel Smart Module Series Figure 46: Plastic Reel Dimension Drawing Table 68: Plastic Reel Dimension Table (Unit: mm) D1 380 D2 180 W 72.5 9.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 200 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, then vacuumize it. SC200E&SC206E_Series_Hardware_Design 118 / 126 Smart Module Series Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 800 modules. Figure 47: Packaging Process SC200E&SC206E_Series_Hardware_Design 119 / 126 Smart Module Series 10 Appendix References Table 69: Related Documents Document Name

[1] Quectel_Smart_EVB_G2_User_Guide

[2] Quectel_SC200E&SC206E_Series_GPIO_Configuration

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_Secondary_SMT_Application_Note Table 70: Terms and Abbreviations Abbreviation Description 3GPP ADC ADSP ALS 3rd Generation Partnership Project Analog-to-Digital Converter Audio Digital Signal Processor Ambient Light Sensor AMR-NB Adaptive Multi Rate-Narrow Band Speech Codec AMR-WB Adaptive Multi-Rate Wideband AP ARM BDS BLE bps BR Access Point/Application Processor Advanced RISC Machine BeiDou Navigation Satellite System Bluetooth Low Energy Bits per Second Basic Rate SC200E&SC206E_Series_Hardware_Design 120 / 126 Smart Module Series CDMA Code Division Multiple Access CEP CPE CS CSD CSI CTS DC Circular Error Probable Customer-Premise Equipment Coding Scheme Circuit Switched Data Camera Serial Interface Clear to Send Dual Carrier DC-HSPA+

Dual Carrier High Speed Packet Access Plus DCE DCS DL DPSK DQPSK DRX DSI DSP DTE ECM EDGE EDR EFR EGSM eMMC eSCO Data Communications Equipment/Data Circuit terminating Equipment Digital Cellular System Downlink Differential Phase Shift Keying Differential Quadrature Reference Phase Shift Keying Discontinuous Reception Display Serial Interface Digital Signal Processor Data Terminal Equipment Electret Condenser Microphone Enhanced Data Rate for GSM Evolution Enhanced Data Rate Enhanced Full Rate Extended GSM Embedded Multimedia Card Extended Synchronous Connection Oriented SC200E&SC206E_Series_Hardware_Design 121 / 126 Smart Module Series ESD ESR ETSI EVB EVDO EVRC FDD fps FR Galileo GFSK Electrostatic Discharge Equivalent Series Resistance European Telecommunications Standards Institute Evaluation Board Evolution-Data Optimized Enhanced Variable Rate Codec Frequency Division Duplex Frame per Second Full Rate Galileo Satellite Navigation System (EU) Gaussian Frequency Shift Keying GLONASS Global Navigation Satellite System (Russia) GMSK GND GNSS GPIO GPRS GPS GPU GRFC GSM G.W. HR HS Gaussian Minimum Shift Keying Ground Global Navigation Satellite System General Purpose Input/Output General Packet Radio Service Global Positioning System Graphics Processing Unit Generic RF control Global System for Mobile Communications Gross Weight Half Rate High Speed HSDPA High Speed Downlink Packet Access SC200E&SC206E_Series_Hardware_Design 122 / 126 Smart Module Series HSPA+

HSUPA HT I2C IC IEEE High-Speed Packet Access+

High Speed Uplink Packet Access High Throughput Inter-Integrated Circuit Integrated Circuit Institute of Electrical and Electronics Engineers IMT-2000 International Mobile Telecommunications for the year 2000 I/O IImax IOmax ISP LCC LCD LCM LDO LE LED LGA LNA Input/Output Maximum Input Load Current Maximum Output Load Current Image Signal Processor/Internet Service Provider Leadless Chip Carrier Liquid Crystal Display LCD Module Low Dropout Regulator Low Energy Light Emitting Diode Land Grid Array Low Noise Amplifier LPDDR Low-Power Double Data Rate LTE M2M MAC MCS Long-Term Evolution Machine to Machine Media Access Control Modulation and Coding Scheme MEMS Micro-Electro-Mechanical System SC200E&SC206E_Series_Hardware_Design 123 / 126 Smart Module Series MIC MIMO MIPI MP MO MOQ MSL MT Microphone Multi-Input Multi-Output / Multiple Input Multiple Output Mobile Industry Processor Interface Megapixel Mobile Originating/Originated Minimum Order Quantity Moisture Sensitivity Levels Mobile Terminating/Terminated NavIC Indian Regional Navigation Satellite System N.W. NFC NTC OTA OTG OTP PA PC PCB PCL PCS PDA PDU PHY PMU POS Net Weight Near Field Communication Negative Temperature Coefficient Over-the-Air Upgrade On-The-Go One Time Programable Power Amplifier Personal Computer Printed Circuit Board Power Control Level Personal Communication Service Personal Digital Assistant Protocol Data Unit Physical Layer Power Management Unit Point of Sale SC200E&SC206E_Series_Hardware_Design 124 / 126 Smart Module Series PWM PSK QAM QPSK QZSS RF RHCP RoHS RTC RTS SBAS SCO SD SIMO SMD SMS SMT STA TDD TP TTFF TVS UART UL UMTS Pulse Width Modulation Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Quasi-Zenith Satellite System Radio Frequency Right Hand Circular Polarization Restriction of Hazardous Substances Real Time Clock Request to Send Satellite-Based Augmentation System Synchronous Connection Oriented Secure Digital Single Input Multiple Output Surface Mounting Device Short Message Service Surface Mount Technology Station Time-Division Duplex Touch Panel Time to First Fix Transient Voltage Suppressor Universal Asynchronous Receiver & Transmitter Uplink Universal Mobile Telecommunications System SC200E&SC206E_Series_Hardware_Design 125 / 126 Smart Module Series USB

(U)SIM VBAT VHT Vmax Vmin Vnom VImax VImin VIHmin VILmax VOmax VOHmin VOLmax Vrms VSWR WAPI Universal Serial Bus

(Universal) Subscriber Identity Module Voltage at Battery (Pin) Very High Throughput Maximum Voltage Minimum Voltage Nominal Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Maximum Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Root Mean Square Voltage Voltage Standing Wave Ratio WLAN Authentication and Privacy Infrastructure WCDMA Wideband Code Division Multiple Access Wi-Fi WLAN Wireless Fidelity Wireless Local Area Network SC200E&SC206E_Series_Hardware_Design 126 / 126