FCC ID: XMR2022SC262RWF Smart Module

 

SC200R&SC262R Series Hardware Design Smart Module Series Version: 1.2 Date: 2022-05-23 Status: Released Smart Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to support@quectel.com. General Notes Quectel offers the information as a service to its customers. The information provided is based upon customers requirements. Quectel makes every effort to ensure the quality of the information it makes available. Quectel does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. All information supplied herein is subject to change without prior notice. Disclaimer While Quectel has made efforts to ensure that the functions and features under development are free from errors, it is possible that these functions and features could contain errors, inaccuracies and omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind, implied or express, with respect to the use of features and functions under development. To the maximum extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of the functions and features under development, regardless of whether such loss or damage may have been foreseeable. Copyright The information contained here is proprietary technical information of Quectel. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. SC200R&SC262R_Series_Hardware_Design 1 / 124 Smart Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. SC200R&SC262R_Series_Hardware_Design 2 / 124 Smart Module Series About the Document Revision History Version Date Author Description 1.0 2019-12-30 Arsene TONG Initial 1.1 2020-09-09 Jasper LAI/

Jamie SHI

(Chapter 4.2.1). 6. Added GNSS performance data (Chapter 5.1). 7. Added current consumption of SC200R-CE/-NA 1. Updated SC200R-EM frequency bands (Chapter 2.1/6.1):

Added B4 in LTE-FDD Deleted B39 in LTE-TDD Added B4 in WCDMA 2. Added Galileo 2.1/2.2/5/6.3). in supported GNSS

(Chapter 3. Added a note for the wakeup of LDO6_1V8 during sleep mode (Chapter 3.3). 4. Updated Wi-Fi output power and added Wi-Fi receiving sensitivity (Chapter 4.1.1). 5. Added BT transmitting and receiving performance 8. Added RF output power of SC200R-NA (Chapter 9. Added RF receiving sensitivity of SC200R-CE/-NA

(Chapter 7.4). 7.5).

(Chapter 7.6). 10. Updated the maintenance clearance between the module and other components to at least 5 mm

(Chapter 8.2). 11. Updated general description of storage, manufacturing and soldering (Chapter 9.1/9.2). 12. Added package weight of the module (Chapter 9.3). 1.2 2021-06-02 Kevin ZHOU/

Jamie SHI 1. Chapter 4.1.1: Updated Wi-Fi receiving sensitivity. 2. Chapter 7.4: Updated current consumption of SC200R&SC262R_Series_Hardware_Design 3 / 124 Smart Module Series 3. Chapter 7.5: Added RF output power of 4. Chapter 7.6: Updated RF receiving sensitivity of SC200R-CE/-EM/-NA. SC200R-EM. SC200R-CE/-EM/-NA. conditions. 5. Chapter 9.1: Updated notes for the storage 6. Chapter 9.2: Updated the recommended reflow soldering thermal profile parameters. 1.3 2022-5-23 Winston 1. Add SC262R-WF SC200R&SC262R_Series_Hardware_Design 4 / 124 Smart Module Series Contents Safety Information ....................................................................................................................................... 2 About the Document ................................................................................................................................... 3 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 8 Figure Index ............................................................................................................................................... 10 1 Introduction ........................................................................................................................................ 12 Special Mark ............................................................................................................................ 16 1.1. 2 Product Concept ................................................................................................................................ 17 2.1. General Description ................................................................................................................. 17 Key Features ........................................................................................................................... 20 2.2. Functional Diagram ................................................................................................................. 23 2.3. Evaluation Board ..................................................................................................................... 23 2.4. 3.5. 3 Application Interfaces ....................................................................................................................... 24 3.1. General Description ................................................................................................................. 24 Pin Assignment ........................................................................................................................ 25 3.2. Pin Description ......................................................................................................................... 26 3.3. Power Supply ........................................................................................................................... 40 3.4. 3.4.1. Power Supply Pins ......................................................................................................... 40 3.4.2. Decrease Voltage Drop .................................................................................................. 40 3.4.3. Reference Design for Power Supply .............................................................................. 41 Turn on and off Scenarios ....................................................................................................... 42 3.5.1. Turn on the Module Using PWRKEY ............................................................................. 42 3.5.2. Turn off the Module ........................................................................................................ 44 VRTC Interface ........................................................................................................................ 44 3.6. Power Output ........................................................................................................................... 45 3.7. 3.8. Battery Charging and Management ........................................................................................ 46 3.9. USB Interface .......................................................................................................................... 48 3.10. UART Interfaces ...................................................................................................................... 50 3.11.

(U)SIM Interfaces..................................................................................................................... 51 3.12. SD Card Interface .................................................................................................................... 54 3.13. GPIO Interfaces ....................................................................................................................... 56 3.14. I2C Interfaces .......................................................................................................................... 59 3.15. SPI Interfaces .......................................................................................................................... 59 3.16. ADC Interface .......................................................................................................................... 60 3.17. Motor Drive Interface ............................................................................................................... 60 3.18. LCM Interface .......................................................................................................................... 61 3.19. Touch Panel Interface .............................................................................................................. 63 3.20. Camera Interfaces ................................................................................................................... 65 3.20.1. Design Considerations ................................................................................................... 68 3.21. Sensor Interfaces..................................................................................................................... 70 SC200R&SC262R_Series_Hardware_Design 5 / 124 Smart Module Series 3.22. Audio Interfaces ....................................................................................................................... 70 3.22.1. Reference Circuit Design for Microphone Interfaces ..................................................... 71 3.22.2. Reference Circuit Design for Earpiece Interface ........................................................... 72 3.22.3. Reference Circuit Design for Headset Interface ............................................................ 73 3.22.4. Reference Circuit Design for Loudspeaker Interface..................................................... 73 3.22.5. Design Considerations for Audio Interfaces .................................................................. 73 3.23. Emergency Download Interface .............................................................................................. 74 4 Wi-Fi and Bluetooth ........................................................................................................................... 75 4.1. Wi-Fi Overview ........................................................................................................................ 75 4.1.1. Wi-Fi Performance ......................................................................................................... 75 Bluetooth Overview ................................................................................................................. 77 4.2.1. Bluetooth Performance .................................................................................................. 78 4.2. 5 GNSS ................................................................................................................................................... 79 5.1. GNSS Performance ................................................................................................................. 79 5.2. GNSS RF Design Guidelines .................................................................................................. 80 6 Antenna Interfaces ............................................................................................................................. 81 6.1. Main/Rx-diversity Antenna Interfaces ...................................................................................... 81 6.1.1. Operating Frequencies................................................................................................... 81 6.1.2. Reference Design for Main and Rx-diversity Antenna Interfaces .................................. 84 6.2. Wi-Fi/Bluetooth Antenna Interface ........................................................................................... 85 6.3. GNSS Antenna Interface ......................................................................................................... 86 6.3.1. Recommended Circuit for Passive Antenna .................................................................. 87 6.3.2. Recommended Circuit for Active Antenna ..................................................................... 87 6.4. Reference Design for RF Layout ............................................................................................. 88 Antenna Installation ................................................................................................................. 90 6.5. 6.5.1. Antenna Requirements .................................................................................................. 90 6.5.2. Recommended RF Connector for Antenna Installation ................................................. 91 7 Electrical, Reliability and Radio Characteristics ............................................................................ 93 Absolute Maximum Ratings ..................................................................................................... 93 7.1. 7.2. Power Supply Ratings ............................................................................................................. 93 7.3. Operating and Storage Temperatures ..................................................................................... 94 7.4. Current Consumption .............................................................................................................. 94 7.5. RF Output Power ................................................................................................................... 103 7.6. RF Receiving Sensitivity ........................................................................................................ 106 Electrostatic Discharge .......................................................................................................... 110 7.7. 8 Mechanical Dimensions .................................................................................................................. 111 8.1. Mechanical Dimensions of the Module...................................................................................111 8.2. Recommended Footprint ....................................................................................................... 113 Top and Bottom Views of the Module .................................................................................... 114 8.3. 9 Storage, Manufacturing and Packaging ........................................................................................ 115 Storage .................................................................................................................................. 115 9.1. SC200R&SC262R_Series_Hardware_Design 6 / 124 9.2. Manufacturing and Soldering ................................................................................................ 116 Packaging .............................................................................................................................. 118 9.3. 10 Appendix References ...................................................................................................................... 120 Smart Module Series SC200R&SC262R_Series_Hardware_Design 7 / 124 Smart Module Series Table Index Table 1: Special Mark ................................................................................................................................. 16 Table 2: SC200R-CE Frequency Bands .................................................................................................... 17 Table 3: SC200R-EM Frequency Bands .................................................................................................... 18 Table 4: SC200R-NA Frequency Bands..................................................................................................... 18 Table 5: SC200R-JP* Frequency Bands .................................................................................................... 19 Table 6: SC200R-WF Frequency Bands .................................................................................................... 19 Table 7: Key Features ................................................................................................................................ 20 Table 8: I/O Parameters Definition ............................................................................................................. 26 Table 9: Pin Description ............................................................................................................................. 26 Table 10: Power Description ...................................................................................................................... 45 Table 11: Pin Definition of Charging Interface ............................................................................................ 46 Table 12: Pin Definition of USB Interface ................................................................................................... 48 Table 13: USB Trace Length Inside the Module ........................................................................................ 49 Table 14: Pin Definition of UART Interfaces ............................................................................................... 50 Table 15: Pin Definition of (U)SIM Interfaces ............................................................................................. 51 Table 16: Pin Definition of SD Card Interface ............................................................................................ 54 Table 17: SD Card Trace Length Inside the Module .................................................................................. 55 Table 18: Pin Definition of GPIO Interfaces ............................................................................................... 56 Table 19: Pin Definition of I2C Interfaces ................................................................................................... 59 Table 20: Pin Definition of SPI Interfaces .................................................................................................. 59 Table 21: Pin Definition of ADC Interface ................................................................................................... 60 Table 22: Pin Definition of Motor Drive Interface ....................................................................................... 60 Table 23: Pin Definition of LCM Interface .................................................................................................. 61 Table 24: Pin Definition of Touch Panel Interface ...................................................................................... 63 Table 25: Pin Definition of Camera Interface ............................................................................................. 65 Table 26: MIPI Trace Length Inside the Module ........................................................................................ 68 Table 27: Pin Definition of Sensor Interfaces ............................................................................................. 70 Table 28: Pin Definition of Audio Interfaces ............................................................................................... 70 Table 29: Wi-Fi Transmitting Performance ................................................................................................. 75 Table 30: Wi-Fi Receiving Performance ..................................................................................................... 76 Table 31: Bluetooth Data Rate and Version ............................................................................................... 77 Table 32: Bluetooth Transmitting and Receiving Performance .................................................................. 78 Table 33: GNSS Performance .................................................................................................................... 79 Table 34: Pin Definition of Main/Rx-diversity Antenna Interfaces .............................................................. 81 Table 35: SC200R-CE Operating Frequencies .......................................................................................... 81 Table 36: SC200R-EM Operating Frequencies ......................................................................................... 82 Table 37: SC200R-NA Operating Frequencies .......................................................................................... 83 Table 38: SC200R-JP* Operating Frequencies ......................................................................................... 84 Table 39: Pin Definition of Wi-Fi/Bluetooth Antenna Interface ................................................................... 85 Table 40: Wi-Fi/Bluetooth Frequency ......................................................................................................... 85 Table 41: Pin Definition of GNSS Antenna Interface ................................................................................. 86 SC200R&SC262R_Series_Hardware_Design 8 / 124 Smart Module Series Table 42: GNSS Frequency ....................................................................................................................... 86 Table 43: Antenna Requirements ............................................................................................................... 90 Table 44: Absolute Maximum Ratings ........................................................................................................ 93 Table 45: Power Supply Ratings ................................................................................................................ 93 Table 46: Operating and Storage Temperatures ........................................................................................ 94 Table 47: SC200R-CE Current Consumption ............................................................................................ 94 Table 48: SC200R-EM Current Consumption ............................................................................................ 97 Table 49: SC200R-NA Current Consumption .......................................................................................... 100 Table 50: SC200R-JP* Current Consumption .......................................................................................... 102 Table 51: SC200R-CE RF Output Power ................................................................................................. 103 Table 52: SC200R-EM RF Output Power ................................................................................................ 104 Table 53: SC200R-NA RF Output Power ................................................................................................. 105 Table 54: SC200R-JP* RF Output Power ................................................................................................ 106 Table 55: SC200R-CE RF Receiving Sensitivity ...................................................................................... 107 Table 56: SC200R-EM RF Receiving Sensitivity ..................................................................................... 107 Table 57: SC200R-NA RF Receiving Sensitivity ...................................................................................... 108 Table 58: SC200R-JP* RF Receiving Sensitivity ..................................................................................... 109 Table 59: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) .................................................... 110 Table 60: Recommended Thermal Profile Parameters ............................................................................ 117 Table 61: Reel Packaging ........................................................................................................................ 119 Table 62: Related Documents .................................................................................................................. 120 Table 63: Terms and Abbreviations .......................................................................................................... 120 SC200R&SC262R_Series_Hardware_Design 9 / 124 Smart Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 23 Figure 2: Pin Assignment (Top View) ......................................................................................................... 25 Figure 3: Voltage Drop Sample .................................................................................................................. 40 Figure 4: Star Structure of the Power Supply ............................................................................................ 41 Figure 5: Reference Circuit of Power Supply ............................................................................................. 41 Figure 6: Turn on the Module Using Driving Circuit ................................................................................... 42 Figure 7: Turn on the Module Using Keystroke ......................................................................................... 43 Figure 8: Timing of Turning on the Module ................................................................................................ 43 Figure 9: Timing of Turning off the Module ................................................................................................ 44 Figure 10: RTC Powered by Coin Cell ....................................................................................................... 45 Figure 11: Reference Design for Battery Charging Circuit ........................................................................ 47 Figure 12: USB Interface Reference Design (OTG Not Supported) .......................................................... 48 Figure 13: USB Interface Reference Design (OTG Supported) ................................................................ 49 Figure 14: Reference Circuit with Level Translator Chip (for UART5) ....................................................... 50 Figure 15: RS-232 Level Match Circuit (for UART5) ................................................................................. 51 Figure 16: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector ........................ 52 Figure 17: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector .......................... 53 Figure 18: Reference Circuit for SD Card Interface ................................................................................... 54 Figure 19: Reference Circuit for Motor Connection ................................................................................... 61 Figure 20: Reference Circuit Design for LCM Interface ............................................................................. 62 Figure 21: Reference Design for External Backlight Driving Circuit .......................................................... 63 Figure 22: Reference Circuit Design for TP Interface ................................................................................ 64 Figure 23: Reference Circuit Design for 3-Camera Applications ............................................................... 67 Figure 24: Reference Circuit Design for ECM Microphone Interface ........................................................ 71 Figure 25: Reference Circuit Design for MEMS Microphone Interface ..................................................... 72 Figure 26: Reference Circuit Design for Earpiece Interface ...................................................................... 72 Figure 27: Reference Circuit Design for Headphone Interface ................................................................. 73 Figure 28: Reference Circuit Design for Loudspeaker Interface ............................................................... 73 Figure 29: Reference Circuit Design for Emergency Download Interface ................................................. 74 Figure 30: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces ................................. 85 Figure 31: Reference Circuit Design for Wi-Fi/Bluetooth Antenna ............................................................ 86 Figure 32: Reference Circuit Design for GNSS Passive Antenna ............................................................. 87 Figure 33: Reference Circuit Design for GNSS Active Antenna ................................................................ 87 Figure 34: Microstrip Design on a 2-layer PCB ......................................................................................... 88 Figure 35: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 88 Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 89 Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 89 Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 91 Figure 39: Mechanicals of U.FL-LP Connectors ........................................................................................ 92 Figure 40: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 92 Figure 41: Top and Side Dimensions ........................................................................................................ 111 SC200R&SC262R_Series_Hardware_Design 10 / 124 Smart Module Series Figure 42: Bottom Dimensions (Bottom View) ......................................................................................... 112 Figure 43: Recommended Footprint (Top View) ...................................................................................... 113 Figure 44: Top and Bottom Views of the Module ..................................................................................... 114 Figure 45: Recommended Reflow Soldering Thermal Profile ................................................................. 117 Figure 46: Tape Dimensions (Unit: mm) .................................................................................................. 118 Figure 47: Reel Dimensions (Unit: mm) ................................................................................................... 119 SC200R&SC262R_Series_Hardware_Design 11 / 124 Smart Module Series 1 Introduction This document, describing SC200R series module and its air and hardware interfaces connected to your applications, informs you of the interface specifications, electrical and mechanical details, as well as other related information of the module. With the application notes and user guides provided separately, you can easily use the module to design and set up mobile applications. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-- Reorient or relocate the receiving antenna.

-- Increase the separation between the equipment and receiver.

-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-- Consult the dealer or an experienced radio/TV technician for help. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations SC200R&SC262R_Series_Hardware_Design 12 / 124 Smart Module Series 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2022SC262RWF The FCC ID can be used only when all FCC compliance requirements are met. Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

(4) The max allowed antenna gain for 2.4G Hz is 0.47 dBi with external antenna. The max allowed antenna gain for 5GHz is 1.28 dBi with external antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device complies with ISEDs licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. SC200R&SC262R_Series_Hardware_Design 13 / 124 Smart Module Series Le prsent appareil est conforme aux CNR d ISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et (2) ce dispositif doit accepter tout brouillage reu, y compris un brouillage susceptible de provoquer un fonctionnement indsirable. Radiation Exposure Statement:

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co- location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, SC200R&SC262R_Series_Hardware_Design 14 / 124 Smart Module Series l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following:

End Product Labeling Contains IC: 10224A-2022SC262R. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-2022SG865W ". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz) The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology. Caution:

i) The device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

ii) where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated. L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations transmettre ou de panne oprationnelle. Notez que ceci n'est pas destin interdire la transmission d'informations de contrle ou de signalisation ou l'utilisation de codes rptitifs lorsque cela est requis par la technologie. Avertissement:

i) Le dispositif utilis dans la bande 5150-5250 MHz est rserv une utilisation en intrieur afin de rduire le risque de brouillage prjudiciable aux systmes mobiles par satellite dans le mme canal;

ii) lorsquil y a lieu, les types dantennes (sil y en a plusieurs), les numros de modle de lantenne et les pires angles SC200R&SC262R_Series_Hardware_Design 15 / 124 Smart Module Series dinclinaison ncessaires pour rester conforme lexigence de la p.i.r.e. applicable au masque dlvation, nonce la section 6.2.2.3, doivent tre clairement indiqus. i. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;

and iii. where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated.

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk

(*) after a model indicates that the sample of such model is currently unavailable. 1.1. Special Mark Table 1: Special Mark Mark Definition SC200R&SC262R_Series_Hardware_Design 16 / 124 Smart Module Series 2 Product Concept 2.1. General Description SC200R is a series of 4G Smart LTE module based on Android operating system, and provides industrial grade performance. Its general features are listed below:

Supports worldwide LTE-FDD, LTE-TDD, DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA, EVDO/CDMA, EDGE and GPRS coverage. Supports short-range wireless communication via Wi-Fi 802.11a/b/g/n and Bluetooth 4.2 LE. Integrates GPS/GLONASS/BeiDou or GPS/Galileo/Beidou satellite positioning systems. Supports multiple audio and video codecs. Built-in high performance AdrenoTM 308 graphics processing unit. Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces. SC200R series module is available in below variants: SC200R-CE, SC200R-EM, SC200R-NA, SC200R-JP*, SC200R-WF, SC262RWF. The following tables show the supported frequency bands and network standards of SC200R series modules. Table 2: SC200R-CE Frequency Bands Mode LTE-FDD LTE-TDD WCDMA EVDO/CDMA GSM Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE Frequency B1/B3/B5/B8 B34/B38/B39/B40/B41 B1/B8 BC0 900/1800 MHz 24122472 MHz 51805825 MHz 24022480 MHz SC200R&SC262R_Series_Hardware_Design 17 / 124 Smart Module Series Table 3: SC200R-EM Frequency Bands GNSS Mode LTE-FDD LTE-TDD WCDMA GSM Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE GNSS Mode LTE-FDD LTE-TDD WCDMA Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE GNSS GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1575.42 1.023 MHz Frequency B1/B2/B3/B4/B5/B7/B8/B20/B28 850/900/1800/1900 MHz B38/B40/B41 B1/B2/B4/B5/B8 24122472 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1575.42 1.023 MHz Frequency B41 B2/B4/B5 24122472 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1575.42 1.023 MHz Table 4: SC200R-NA Frequency Bands B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 SC200R&SC262R_Series_Hardware_Design 18 / 124 Table 5: SC200R-JP* Frequency Bands Smart Module Series B1/B3/B5/B8/B11/B18/B19/B21/B26/B28 GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1575.42 1.023 MHz Frequency B41 B1/B6/B8/B19 24022482 MHz 51805825 MHz 24022480 MHz Frequency 24122472 MHz 51805825 MHz 24022480 MHz

Frequency 24122462 MHz 51805825 MHz 24022480 MHz Mode LTE-FDD LTE-TDD WCDMA Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE GNSS Mode Wi-Fi 802.11a/b/g/n Bluetooth 4.2 LE GNSS Wi-Fi 802.11a/b/g/n/ac Bluetooth 4.2 LE Mode GNSS NOTE Table 6: SC200R-WF Frequency Bands Table 7: SC262R-WF Frequency Bands SC200R-JP supports 802.11b channel 14. SC200R&SC262R_Series_Hardware_Design 19 / 124 Smart Module Series SC200R is a series of SMD type modules, which can be embedded into applications through its 274 pins, including 146 LCC pins and 128 LGA pins. With a compact profile of 40.5 mm 40.5 mm 2.8 mm, the module can meet almost all requirements for M2M applications such as edge device, edge computing, CPE, wireless POS, smart metering, router, data card, automotive, smart phone, digital signage, alarm panel, security and industry PDA, etc. 2.2. Key Features The following table describes the detailed features of SC200R series module. Table 7: Key Features Feature Details Application Processor 64-bit quad-core ARM Cortex-A53 microprocessor, up to 1.3 GHz 512 KB L2 cache Modem DSP GPU Memory Hexagon DSP v56 core, up to 691 MHz 768 KB L2 cache AdrenoTM 308 GPU with 64-bit addressing, up to 485 MHz 8 GB eMMC + 1 GB LPDDR3 (default) 16 GB eMMC + 2 GB LPDDR3 (optional) Operating System Android 10 Power Supply Supply voltage: 3.554.2 V Typical supply voltage: 3.8 V Transmitting Power Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (30 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (24 dBm +1/-3 dB) for WCDMA bands Class 3 (24 dBm +3/-1 dB) for EVDO/CDMA BC0 Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands SC200R&SC262R_Series_Hardware_Design 20 / 124 Smart Module Series LTE Features UMTS Features CDMA2000 Features Supports 3GPP R10 Cat 4 FDD and TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth FDD: Max. 150 Mbps (DL)/Max. 50 Mbps (UL) TDD: Max. 130 Mbps (DL)/Max. 30 Mbps (UL) Supports 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA Supports 16-QAM, 64-QAM and QPSK modulations DC-HSDPA: Max. 42 Mbps DC-HSUPA: Max. 11.2 Mbps WCDMA: Max. 384 kbps (DL)/Max. 384 kbps (UL) Supports 3GPP2 CDMA2000 1X Advanced, CDMA2000 1xEV-DO Rev.A EVDO: Max. 3.1 Mbps (DL)/Max. 1.8 Mbps (UL) 1X Advanced: Max. 307.2 kbps (DL)/Max. 307.2 kbps (UL) GSM Features R99:

CSD: 9.6 kbps, 14.4 kbps GPRS:

Supports GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max. 107 kbps (DL)/Max. 85.6 kbps (UL) EDGE:

Supports EDGE multi-slot class 33 (33 by default) Supports GMSK and 8-PSK for different MCS Downlink coding schemes: MCS 19 Uplink coding schemes: MCS 19 Max. 296 kbps (DL)/Max. 236.8 kbps (UL) Supports AP and STA mode 2.4 GHz, 5 GHz, 802.11a/b/g/n, up to 150 Mbps WLAN Features Bluetooth Feature Bluetooth 4.2 LE GNSS Features1) GPS/GLONASS/BeiDou or GPS/Galileo/BeiDou SMS Text and PDU mode Point-to-point MO and MT SMS cell broadcast LCM Interface Supports one 4-lane MIPI_DSI Supports HD+ (1440 720) @ 60 fps Supports two 4-lane MIPI_CSI, up to 2.1 Gbps/lane Supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane Camera Interfaces

+ 1-lane) Up to 13 MP Video Codec Video encoding + decoding: 720P @ 30 fps + 1080P @ 30 fps Encoding: up to 1080P @ 30 fps; Decoding: up to 1080P @ 30 fps SC200R&SC262R_Series_Hardware_Design 21 / 124 Smart Module Series Audio inputs:

Three single-ended microphone inputs Audio outputs:

Class AB stereo headphone output Class AB earpiece differential output Class D speaker differential amplifier output EVRC, EVRC-B, EVRC-WB;

G.711, G.729A, and G.729AB;

GSM-FR, GSM-EFR, GSM-HR;

AMR-NB, AMR-WB, eAMR, BeAMR Compliant with USB 2.0 specification Supports up to 480 Mbps Supports USB OTG Used for AT command communication, data transmission, software debugging and firmware upgrade Three UART interfaces: UART5, UART2 (debug UART) and UART1, baud rate up to 4 Mbps UART5: 4-wire UART interface, and hardware flow control is supported UART2 (debug UART): 2-wire UART interface, used for debugging by default UART1: 2-wire UART interface Supports SD 3.0 Supports SD card hot-plug Two (U)SIM interfaces Supports USIM/SIM card: 1.8 V or 2.95 V Supports Dual SIM Dual Standby (supported by default) Audio Interfaces Audio Codec USB Interface UART Interfaces SD Card Interface

(U)SIM Interfaces I2C Interfaces Four I2C interfaces Used for peripherals such as camera, sensor, touch panel, etc. ADC Interface One generic ADC interface, up to 15-bit resolution Real Time Clock Supported Antenna Interfaces Main antenna, Rx-diversity antenna, GNSS antenna 1) and Wi-Fi/Bluetooth antenna Physical Characteristics Size: (40.5 0.15) mm (40.5 0.15) mm (2.8 0.2) mm Package: LCC + LGA Weight: Approx. 10.2 g Temperature Range Operating temperature range: -35 C to +75 C 2) Storage temperature range: -40 C to +90 C Firmware Upgrade Over USB interface or OTA RoHS All hardware components are fully compliant with EU RoHS directive. SC200R&SC262R_Series_Hardware_Design 22 / 124 Smart Module Series 1. 2. 1) SC200R-WF/SC262R-WF does not support GNSS. 2) Within the operating temperature range, the module is 3GPP compliant. NOTES 2.3. Functional Diagram The following figure shows a block diagram of SC200R series module and illustrates the major functional parts. Power management Radio frequency Baseband LPDDR3 + eMMC flash Peripheral interfaces

-- USB interface

-- UART interfaces

-- (U)SIM interfaces

-- SD card interface

-- GPIO interfaces

-- I2C interfaces

-- SPI interfaces

-- ADC interface

-- Motor drive interface

-- LCM interface

-- Touch panel interface

-- Camera interfaces

-- Audio interfaces 2.4. Evaluation Board To help you design and test applications with the module, Quectel supplies an evaluation kit, which includes an evaluation board, a USB to RS-232 converter cable, a USB data cable, a power adapter, an earphone and antennas. For details, see document [1]. SC200R&SC262R_Series_Hardware_Design 23 / 124 Smart Module Series 3 Application Interfaces 3.1. General Description SC200R is a series of SMD type modules with 146 LCC pins and 128 LGA pins. The following chapters provide the detailed description of pins/interfaces listed below. Power supply VRTC interface USB interface Power output Battery charging and management UART interfaces

(U)SIM interfaces SD card interface GPIO interfaces I2C interfaces SPI interfaces ADC interface Motor drive interface LCM interface Touch panel interface Camera interfaces Sensor interfaces Audio interfaces Emergency download interface SC200R&SC262R_Series_Hardware_Design 24 / 124 Smart Module Series 3.2. Pin Assignment The following figure shows the pin assignment of SC200R series module. Figure 1: Pin Assignment (Top View) SC200R&SC262R_Series_Hardware_Design 25 / 124 146145144143142141140139138137136135134133132131130129128127126125124123122121120119118117116115114113112111123456789101112131415161718192021222324252627282930313233343536371101091081071061051041031021011009998979695949392919089888786858483828180797877767574383940414243444546474849505152535455565758596061626364656667686970717273186185184183182181180179178177147187222221220219218217216215214176148188223250249248247246245244213175149189224251270269268267266243212174150190225252265242211173151191226253264241210172152192227254263240209171153193228255262239208170154194229256257258259260261238207169155195230231232233234235236237206168156196197198199200201202203204205167157158159160161162163164165166272271273274POWER PinsGND PinsAUDIO PinsUSB Pins(U)SIM PinsUART PinsGPIO PinsANT PinsTP PinsLCM PinsCAMERA PinsOTHERS PinsRESERVED Pins24SDCARD Pins254VBAT_BBVBAT_BBGNDMIC1_PMIC_GNDMIC2_PGNDEAR_PEAR_NSPK_PSPK_NGNDUSB_DMUSB_DPGNDUSB_IDUSIM2_DETUSIM2_RSTUSIM2_CLKUSIM2_DATAUSIM2_VDDUSIM1_DETUSIM1_RSTUSIM1_CLKUSIM1_DATAUSIM1_VDDGNDVIB_DRV_NPWMTP_INTTP_RSTSD_LDO12GPIO_33UART5_TXDUART5_RXDUART5_CTSUART5_RTSSD_LDO11SD_CLKSD_CMDSD_DATA0SD_DATA1SD_DATA2SD_DATA3SD_DETUSB_BOOTTP_I2C_SCLTP_I2C_SDALCD_RSTLCD_TEGNDDSI_CLK_NDSI_CLK_PDSI_LN0_NDSI_LN0_PDSI_LN1_NDSI_LN1_PDSI_LN2_NDSI_LN2_PDSI_LN3_NDSI_LN3_PGNDCSI1_CLK_NCSI1_CLK_PCSI1_LN0_NCSI1_LN0_PCSI1_LN1_NCSI1_LN1_PCSI1_LN3_NCSI1_LN3_PCSI1_LN2_NCSI1_LN2_PGNDCAM0_MCLKCAM1_MCLKGNDGNDANT_WIFI/BTCAM0_RSTCAM0_PWDNCAM1_RSTCAM1_PWDNCAM_I2C_SCLCAM_I2C_SDAGNDGNDANT_MAINGNDGNDGPIO_25SENSOR_I2C_SCLSENSOR_I2C_SDADBG_RXDDBG_TXDVOL_UPVOL_DOWNGPIO_130GPIO_45GPIO_48GPIO_59GPIO_12GPIO_95GPIO_94GPIO_87GPIO_66GPIO_43GPIO_63GPIO_44GPIO_42GPIO_13LDO5_1V8GPIO_93GPIO_46PWRKEYGPIO_23GPIO_22GPIO_21GPIO_20GNDANT_GNSSGNDGPIO_62GPIO_89GPIO_47LDO6_1V8VRTCCHG_SELADCLDO17_2V85GNDANT_DRXGNDBAT_SNSBAT_THERMGNDHPH_RHPH_REFHPH_LHS_DETGNDUSB_VBUSUSB_VBUSGNDGNDVBAT_RFVBAT_RF Smart Module Series 3.3. Pin Description Table 8: I/O Parameters Definition Type AI AO AIO DI DO DIO OD PI PO PIO Description Analog input Analog output Analog input/output Digital input Digital output Digital input/output Open drain Power input Power output Power input/output The following table shows the pin definition and electrical characteristics of the module. Table 9: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 1, 2 PIO Power supply for the modules baseband part Vmax = 4.2 V Vmin = 3.55 V Vnom = 3.8 V VBAT_RF 145, 146 PI Power supply for the modules RF part Vmax = 4.2 V Vmin = 3.55 V Vnom = 3.8 V You must provide them with sufficient current of up to 3 A. It is suggested to add a TVS for surge protection. VRTC 126 PIO Power supply for RTC VOmax = 3.2 V VI = 2.03.25 V If it is not used, keep this pin open. SC200R&SC262R_Series_Hardware_Design 26 / 124 LDO5_1V8 111 PO 1.8 V output power supply Vnom = 1.8 V IOmax = 20 mA LDO6_1V8 1) 125 PO 1.8 V output power supply Vnom = 1.8 V IOmax = 150 mA LDO10_2V85 156 PO 2.85 V output power supply Vnom = 2.85 V IOmax = 150 mA LDO17_2V85 129 PO 2.85 V output power supply Vnom = 2.85 V IOmax = 450 mA Smart Module Series Power supply for external GPIOs pull-up and level shift circuits. Power supply for sensors, cameras, and I2C pull-up circuit. If it is used, connect an external 1.04.7 F capacitor to this pin in parallel. If it is not used, keep it open. Reserved power supply. If it is used, add a 1.02.2 F bypass capacitor. If it is not used, keep it open. Power supply for AVDD of LCM, TP, sensors and cameras. If it is used, connect an external 2.24.7 F capacitor to this pin in parallel. If it is not used, keep it open. Reserved power supply. If it is used, add a 1.02.2 F bypass capacitor. If it is not used, keep it open. LDO16_2V8 193 PO 2.8 V output power supply Vnom = 2.8 V IOmax = 55 mA GND Pin Name Pin No. SC200R&SC262R_Series_Hardware_Design 27 / 124 Smart Module Series If it is not used, connect it to the ground. 3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89, 120, 122, 130, 132, 135, 140, 143, 144, 149, 162, 171, 172, 176, 187191, 202204, 206224, 226231, 233238, 240, 241, 243245, 247, 248, 250, 251, 255, 256, 258, 259, 261, 266, 268, 269, 271274 GND Audio Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment MIC1_P MIC_GND MIC2_P EAR_P EAR_N SPK_P SPK_N 4 5 6 8 9 10 11 AI AI AI Microphone input for channel 1 (+) Microphone reference ground Microphone input for headset (+) AO Earpiece output

(+) AO Earpiece output (-) AO Speaker output (+) AO Speaker output (-) HPH_R 136 AO HPH_REF 137 AO HPH_L 138 AO HS_DET 139 AI MIC3_P 148 AI USB Interface Headphone right channel output Headphone reference ground Headphone left channel output Headset hot-plug detect Microphone bias voltage 1 Microphone input for channel 2 (+) Microphone bias voltage 2 MIC_BIAS1 147 AO VO = 1.62.85 V High level by default. MIC_BIAS2 155 AO VO = 1.62.85 V Pin Name Pin No. I/O Description DC Characteristics Comment SC200R&SC262R_Series_Hardware_Design 28 / 124 Smart Module Series Vmax = 6.2 V Vmin = 4.35 V Vnom = 5.0 V Charging power input; USB 5 V power input;

USB/adaptor insertion detection USB 2.0 differential data (-) USB 2.0 differential data (+) DI USB ID detect USB_VBUS 141, 142 PI USB_DM USB_DP USB_ID AIO AIO 13 14 16

(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM2_DET 17 DI

(U)SIM2 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM2_RST DO

(U)SIM2 card reset VOLmax = 0.4 V USIM2_CLK DO

(U)SIM2 card clock 18 19 USIM2_DATA 20 DIO

(U)SIM2 card data VOHmin =

0.8 USIM2_VDD VILmax =

0.2 USIM2_VDD VIHmin =

0.7 USIM2_VDD VOLmax = 0.4 V VOHmin =

0.8 USIM2_VDD USB 2.0 standard compliant. 90 differential impedance. High level by default. Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. SC200R&SC262R_Series_Hardware_Design 29 / 124 USIM2_VDD 21 PO

(U)SIM2 card power supply USIM1_DET 22 DI

(U)SIM1 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM1_RST DO

(U)SIM1 card reset VOLmax = 0.4 V USIM1_CLK DO

(U)SIM1 card clock 23 24 USIM1_DATA 25 DIO

(U)SIM1 card data Smart Module Series Either 1.8 V or 2.95 V (U)SIM card is supported. Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. IOmax = 55 mA For 1.8 V (U)SIM:

Vmax = 1.85 V Vmin = 1.75 V For 2.95 V (U)SIM:

Vmax = 3.1 V Vmin = 2.8 V VOHmin =

0.8 USIM1_VDD VILmax =

0.2 USIM1_VDD VIHmin =

0.7 USIM1_VDD VOLmax = 0.4 V VOHmin =

0.8 USIM1_VDD IOmax = 55 mA For 1.8 V (U)SIM:

Vmax = 1.85 V Vmin = 1.75 V For 2.95 V (U)SIM:

Vmax = 3.1 V Vmin = 2.8 V USIM1_VDD 26 PO

(U)SIM1 card power supply Either 1.8 V or 2.95 V (U)SIM card is supported. UART Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment SC200R&SC262R_Series_Hardware_Design 30 / 124 UART5_TXD DO UART5 transmit UART5_RXD DI UART5 receive UART5_CTS UART5_RTS UART5 clear to send DI DO UART5 request to send VOLmax = 0.45 V VOHmin = 1.35 V 34 35 36 37 DBG_RXD 93 DI DBG_TXD 94 DO UART2 receive

(debug UART by default) UART2 transmit

(debug UART by default) UART1_RXD 153 DI UART1 receive UART1_TXD 154 DO UART1 transmit SD Card Interface SD_LDO11 38 PO SD_LDO12 32 PO 2.95 V output power supply for SD card 1.8/2.95 V output power supply for SD card pull-up circuits. SD_CLK 39 DO SD card clock Smart Module Series 1.8 V power domain. If not used, keep these pins open. VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V VILmax = 0.63 V VIHmin = 1.17 V VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V Vnom = 2.95 V IOmax = 800 mA Vnom = 1.8/2.95 V IOmax = 50 mA 1.8 V SD card:

VOLmax = 0.45 V VOHmin = 1.4 V 2.95 V SD card:

VOLmax = 0.37 V VOHmin = 2.2 V Pin Name Pin No. I/O Description DC Characteristics Comment SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 40 41 42 43 DIO SDIO data bit 0 DIO SD card command 1.8 V SD card:

VILmax = 0.58 V VIHmin = 1.27 V VOLmax = 0.45 V VOHmin = 1.4 V DIO SDIO data bit 1 DIO SDIO data bit 2 50 characteristic impedance. SC200R&SC262R_Series_Hardware_Design 31 / 124 Smart Module Series 2.95 V SD card:

VILmax = 0.73 V VIHmin = 1.84 V VOLmax = 0.37 V VOHmin = 2.2 V SD_DATA3 44 DIO SDIO data bit 3 SD_DET 45 DI SD card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V Active low. Touch Panel Interface Pin Name Pin No. I/O Description DC Characteristics Comment TP_INT 30 DI TP interrupt TP_RST 31 DO TP reset TP_I2C_SCL OD TP I2C clock TP_I2C_SDA OD TP I2C data LCM Interface VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. 1.8 V power domain. Active low. Externally pull them up to 1.8 V. Can be used for other I2C devices. Pin Name Pin No. I/O Description DC Characteristics Comment PWM DO PWM output LCD_RST DO LCD reset LCD_TE DI LCD tearing effect DSI_CLK_N AO LCD MIPI clock (-) DSI_CLK_P AO LCD MIPI clock (+) VOLmax = 0.45 V VOHmax = VBAT_BB Adjusts backlight brightness. VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N AO AO AO AO AO LCD MIPI data 0

(-) LCD MIPI data 0

(+) LCD MIPI data 1

(-) LCD MIPI data 1

(+) LCD MIPI data 2

(-) 47 48 29 49 50 52 53 54 55 56 57 58 SC200R&SC262R_Series_Hardware_Design 32 / 124 Smart Module Series Pin Name Pin No. I/O Description DC Characteristics Comment DSI_LN2_P DSI_LN3_N DSI_LN3_P Camera Interfaces AO AO AO LCD MIPI data 2

(+) LCD MIPI data 3

(-) LCD MIPI data 3

(+) 59 60 61 63 64 65 66 67 68 70 71 72 73 CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN3_N CSI1_LN3_P CSI1_LN2_N CSI1_LN2_P CSI0_CLK_N 157 CSI0_CLK_P 196 CSI0_LN0_N 158 CSI0_LN0_P 197 CSI0_LN1_N 159 CSI0_LN1_P 198 AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI Camera MIPI clock (-) Camera MIPI clock

(+) Camera MIPI data 0 (-) Camera MIPI data 0 (+) Camera MIPI data 1 (-) Camera MIPI data 1 (+) Camera MIPI data 3 (-) Camera MIPI data 3 (+) Camera MIPI data 2 (-) Camera MIPI data 2 (+) Camera MIPI clock (-) Camera MIPI data 0 (-) Camera MIPI data 0 (+) Camera MIPI data 1 (-) Camera MIPI data 1 (+) Camera MIPI clock

(+) SC200R&SC262R_Series_Hardware_Design 33 / 124 CSI0_LN2_N 160 CSI0_LN2_P 199 CSI0_LN3_N 161 CSI0_LN3_P 200 AI AI AI AI Camera MIPI data 2 (-) Camera MIPI data 2 (+) Camera MIPI data 3 (-) Camera MIPI data 3 (+) 74 75 79 80 81 82 CAM0_MCLK DO Clock of camera CAM1_MCLK DO Clock of camera CAM0_RST DO Reset of camera CAM0_PWDN DO Power down of camera CAM1_RST DO Reset of camera CAM1_PWDN CAM_I2C_SCL 83 OD DO Power down of camera I2C clock of camera CAM_I2C_SDA 84 OD I2C data of camera CAM2_MCLK 165 DO Clock of camera CAM2_RST 164 DO Reset of camera CAM2_PWDN 163 DO DCAM_I2C_SCL 166 OD Power down of camera I2C clock of camera DCAM_I2C_SDA 205 OD I2C data of camera Keypad Interfaces VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. Smart Module Series Externally pull them up to 1.8 V. Externally pull them up to 1.8 V. Pulled up to 1.8 V internally. Active low. Disabled by default and can be enabled via software configuration. Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 114 DI Turns on/off the module VILmax = 0.63 V VIHmin = 1.17 V RESET_N 225 DI Resets the module SC200R&SC262R_Series_Hardware_Design 34 / 124 VOL_UP 95 DI Volume up VILmax = 0.63 V VIHmin = 1.17 V VOL_DOWN 96 DI Volume down VILmax = 0.63 V VIHmin = 1.17 V SENSOR_I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment SENSOR_I2C_ SCL 91 OD I2C clock of external sensor SENSOR_I2C_ SDA 92 OD I2C data of external sensor Charging Interface Pin Name Pin No. I/O Description DC Characteristics Comment BAT_SNS 133 AI Battery voltage detect BAT_THERM 134 AI Battery temperature detect Smart Module Series If it is not used, keep it open. Cannot be externally pulled up. 1.8 V power domain. If it is not used, keep it open. Cannot be externally pulled up. 1.8 V power domain. Dedicated for external sensors. Cannot be used for touch panel, NFC, I2C keyboard, etc. Externally pull them up to 1.8 V. The maximum input voltage is 4.2 V. Internally pulled up. Supports 47 k NTC thermistor by default - externally connect it to the 47 k NTC thermistor. If it is not used, connect it to GND with a 47 k resistor. Internally pulled down with a 100 k resistor. If it is not used, keep it open. BAT_ID 185 AI VI = 0.11.7 V Battery type detect SC200R&SC262R_Series_Hardware_Design 35 / 124 CHG_SEL 127 DI Charging select ADC Interface Antenna Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment ADC 128 AI General-purpose ADC interface The maximum input voltage is 1.7 V. Pin Name Pin No. I/O Description DC Characteristics Comment Smart Module Series If you use an internal charging chip, keep this pin open. If you use an external charging chip, connect it to GND. 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 87 AIO ANT_DRX 131 ANT_GNSS 2) 121 AI AI ANT_WIFI/BT 77 AIO GPIO Interfaces Main antenna interface Rx-diversity antenna interface GNSS antenna interface Wi-Fi/Bluetooth antenna interface GPIO_33 GPIO_25 GPIO_130 GPIO_45 GPIO_48 33 90 97 98 99 GPIO_59 100 DIO GPIO_12 101 DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.4 V 1.8 V power domain. SC200R&SC262R_Series_Hardware_Design 36 / 124 Smart Module Series GPIO_13 102 DIO GPIO_95 103 DIO GPIO_94 104 DIO GPIO_87 105 DIO GPIO_66 106 DIO GPIO_43 107 DIO GPIO_63 108 DIO GPIO_44 109 DIO GPIO_42 110 DIO GPIO_93 112 DIO GPIO_46 113 DIO GPIO_89 115 DIO GPIO_23 116 DIO GPIO_22 117 DIO GPIO_21 118 DIO GPIO_20 119 DIO GPIO_62 123 DIO GPIO_47 124 DIO GPIO_6 167 DIO GPIO_7 168 DIO GPIO_127 169 DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output SC200R&SC262R_Series_Hardware_Design 37 / 124 GPIO_34 170 DIO GPIO_90 177 DIO GPIO_39 201 DIO GPIO_86 239 DIO GPIO_88 264 DIO GPIO_85 265 DIO GPIO_61 267 DIO GNSS LNA Enable Interface General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output GNSS_LNA_EN 194 DIO External GNSS LNA enable GRFC Interfaces RFFE3_CLK 260 DIO RFFE3_DATA 262 DIO Emergency Download Interface GRFC used for RF tuner control GRFC used for RF tuner control USB_BOOT 46 DI Forces the module into emergency download mode Motor Drive Interface Pin Name Pin No. I/O Description DC Characteristics Comment Pin Name Pin No. I/O Description DC Characteristics Comment Pin Name Pin No. I/O Description DC Characteristics Comment Smart Module Series Cannot be pulled up during power-on. 1.8 V power domain. 1.8 V power domain. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. You can force the module to enter emergency download mode by pulling this pin up to LDO5_1V8 during power-on. SC200R&SC262R_Series_Hardware_Design 38 / 124 Smart Module Series Pin Name Pin No. I/O Description DC Characteristics Comment VIB_DRV_N 28 PO Indication Interface Vibration motor driver output control VO = 1.23.1 V IOmax = 175 mA Connect it to the negative pole of the motor. Pin Name Pin No. I/O Description DC Characteristics Comment CHG_LED 195 AO IOmax = 5 mA Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment NFC_CLK 181 DO NFC clock NFC_CLK_REQ 182 DI Indicates the module's charging status NFC clock request Initiates power-on when grounded The module cannot be turned off when this pin is pulled down. If it is not used, keep it open. CBL_PWR_N 186 DI Reserved Pins Pin Name Pin No. Comment RESERVED 150152, 173175, 178180, 183, 184, 192, 232, 242, 246, 249, 252254, 257, 263, 270 Keep these pins open. NOTE 1. 1) When the module is in sleep mode, LDO6_1V8 wakes up periodically or randomly. Considering the actual requirement for power consumption during sleep mode, you can use either LDO6_1V8 or an external LDO for power supply. For lower power consumption, use an external LDO instead. 2. 2) SC200R-WF/SC262R-WF does not support GNSS. SC200R&SC262R_Series_Hardware_Design 39 / 124 Smart Module Series 3.4. Power Supply 3.4.1. Power Supply Pins SC200R series module provides two VBAT_RF pins and two VBAT_BB pins for connection with the external power supply. The VBAT_RF pins are used for the RF part of the module and the VBAT_BB pins are used for the baseband part of the module. 3.4.2. Decrease Voltage Drop The power supply range of the module is 3.554.2 V, and the recommended value is 3.8 V. The power supply performance, such as load capacity, voltage ripple, etc. directly influences the modules performance and stability. Under ultimate conditions, the transient peak current of the module may surge up to 3 A. If the power supply capacity is not sufficient, there will be the risk that the voltage drops below 3.1 V and as a result the module powers off automatically. Therefore, make sure the input voltage never drops below 3.1 V. Figure 2: Voltage Drop Sample To decrease voltage drop, use a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ), and reserve a multi-layer ceramic chip capacitor (MLCC) array due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) to compose the MLCC array and place these capacitors close to VBAT_BB/VBAT_RF pins. Additionally, add a 4.7 F capacitor in parallel. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT trace should be no less than 3 mm. In principle, the longer the VBAT trace is, the wider it should be. In addition, in order to get a stable power source, it is suggested to use a TVS and place it as close to the VBAT_BB/VBAT_RF pins as possible to enhance surge protection. The following figure shows the star structure of the power supply. SC200R&SC262R_Series_Hardware_Design 40 / 124 3.1 VVoltage3.8 V3 AInput current Smart Module Series Figure 3: Star Structure of the Power Supply 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of SC200R series module should be able to provide sufficient current of at least 3 A. If the voltage drop between the input and output is not too high, it is suggested to use an LDO to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is recommended. The following figure shows a reference design for +5 V input power source. The typical output voltage is 3.8 V and the maximum load current is 5.0 A. Figure 4: Reference Circuit of Power Supply SC200R&SC262R_Series_Hardware_Design 41 / 124 ModuleVBAT_RFVBAT_BBVBATC1100 FC6100 nFC733 pFC810 pF+C3100 nFC433 pFC510 pFD1C9100 F+C24.7 FGNDD2DC_INC1C2U1INOUTENGNDADJ24135VBAT 100 nFC3470 FC4100 nFR2100K47KR3470 F470R51KR4R11%1%

Smart Module Series NOTES 1. It is recommended to switch off the power supply when the module is in abnormal state, and then switch on the power to restart the module. 2. The module supports battery charging by default. If the above power supply design is adopted, make sure the charging function is disabled by software, or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply chip. 3.5. Turn on and off Scenarios 3.5.1. Turn on the Module Using PWRKEY The module can be turned on by driving the PWRKEY pin low for at least 1.6 s. The PWRKEY pin is pulled up to 1.8 V internally. It is recommended to use an open drain/collector driver to control PWRKEY. A simple reference circuit is illustrated in the following figure. Figure 5: Turn on the Module Using Driving Circuit SC200R&SC262R_Series_Hardware_Design 42 / 124 Turn on pulsePWRKEY4.7K47K>1.6 sR1R2Q1R31K The other way to control PWRKEY is by using a button directly. You must place a TVS component nearby the button for ESD protection. A reference circuit is shown in the following figure. Smart Module Series Figure 6: Turn on the Module Using Keystroke The turning-on scenario is illustrated in the following figure. Figure 7: Timing of Turning on the Module SC200R&SC262R_Series_Hardware_Design 43 / 124 PWRKEYS1Close to S1TVS1KVBAT(Typ. 3.8 V)PWRKEY> 1.6 sOthersLDO5_1V838 sLDO6_1V847 msSoftware controlledLDO17_2V85ActiveNote2Software controlled Smart Module Series NOTES shown above. 1. When the module is powered on for the first time, its timing of turning on may be different from that 2. Make sure that VBAT is stable before pulling down PWRKEY. It is recommended to wait until VBAT to be stable at 3.8 V for at least 30 ms before pulling down PWRKEY. Additionally, PWRKEY cannot be kept pulled down all the time. 3.5.2. Turn off the Module Drive the PWRKEY pin low for at least 1 s, and then choose to turn off the module when the prompt window comes up. You can also force the module to power off by driving PWRKEY low for at least 8 s. The forced power-down scenario is illustrated in the following figure. Figure 8: Timing of Turning off the Module 3.6. VRTC Interface The RTC (Real Time Clock) can be powered by an external power source through VRTC when the module is powered down and there is no power supply for VBAT. The external power source can be a rechargeable battery (such as a coin cell) according to application demands. A reference circuit design is shown below. SC200R&SC262R_Series_Hardware_Design 44 / 124 VBATPWRKEYOthers> 8 sPower down Smart Module Series Keeps ON

Figure 9: RTC Powered by Coin Cell If RTC is ineffective, it can be synchronized through the network after the module is powered on. The recommended input voltage range for VRTC is 2.03.25 V and the recommended typical value is 3.0 V. 3.7. Power Output SC200R series module supports output of regulated voltages for peripheral circuits. During application, it is recommended to connect a 33 pF and a 10 pF capacitor in parallel in the circuit to suppress high-frequency noise. Pin Name Default Voltage (V) Driving Current (mA)

@ Idle State Table 10: Power Description LDO5_1V8 LDO6_1V8 1) LDO10_2V85 LDO17_2V85 LDO16_2V8 1.8 1.8 2.85 2.85 2.8 SD_LDO12 1.8/2.95 SD_LDO11 2.95 USIM1_VDD 1.8/2.95 USIM2_VDD 1.8/2.95 20 150 150 450 55 50 800 55 55 SC200R&SC262R_Series_Hardware_Design 45 / 124 Coin CellModuleRTC CoreVRTC Smart Module Series NOTE 1) When the module is in sleep mode, LDO6_1V8 wakes up periodically or randomly. Considering the actual requirement for power consumption during sleep mode, you can use either LDO6_1V8 or an external LDO for power supply. If you require lower power consumption during sleep mode, use an external LDO for power supply. 3.8. Battery Charging and Management SC200R series module supports battery charging. The battery charger IC in the module supports trickle charging, constant current charging and constant voltage charging modes, which optimize the charging procedure for Li-ion batteries. Trickle charging: There are two steps in this mode. When the battery voltage is below 2.8 V, a 90 mA trickle charging current is applied to the battery. When the battery voltage is charged up and is between 2.8 V and 3.2 V, the charging current can be set to 450 mA maximally. Constant current mode (CC mode): When the battery is increased to 3.24.2 V, the system will switch to CC mode. The maximum charging current is 1.44 A when an adapter is used for battery charging, and the maximum charging current is 450 mA for USB charging. Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.2 V, the system will switch to CV mode and the charging current will decrease gradually. When the battery level reaches 100 %, charging is completed. Table 11: Pin Definition of Charging Interface Pin Name Pin No. I/O Description Comment BAT_SNS 133 AI Battery voltage detect The maximum input voltage is 4.2 V. BAT_THERM 134 AI Battery temperature detect BAT_ID 185 AI Battery type detect Internally pulled up. Supports 47 k NTC thermistor by default - externally connect it to the 47 k NTC thermistor. If it is not used, connect it to GND with a 47 k resistor. Internally pulled down with a 100 k resistor. If it is not used, keep it open. SC200R&SC262R_Series_Hardware_Design 46 / 124 Smart Module Series If you use an internal charging chip, keep this pin open. If you use an external charging chip, connect it to GND. CHG_SEL 127 DI Charging select SC200R series module supports battery temperature detection in the condition that the battery integrates a thermistor (47 k 1 % NTC thermistor with a B-constant of 4050 K by default) and the thermistor is connected to BAT_THERM pin. If the BAT_THERM pin is not connected, there will be malfunctions such as battery charging failure, battery level display error, etc. The default battery temperature range is

-3.0 C to 48.5 C. A reference design for the battery charging circuit is shown below. Figure 10: Reference Design for Battery Charging Circuit Mobile devices such as mobile phones or handheld POS systems are powered by batteries. For different batteries, you should modify the charging and discharging curve correspondingly to achieve the best performance. If the thermistor is not available in the battery, or an adapter is utilized to power the module, you must connect BAT_THERM to GND via a 47 k resistor. Otherwise, the system may mistakenly judge that the battery temperature is abnormal, and therefore cause battery charging failure. BAT_SNS must be connected. Otherwise, the module will have abnormalities in voltage detection, as well as associated problems with power-on/off and battery charging/discharging. SC200R&SC262R_Series_Hardware_Design 47 / 124 GNDBAT_SNSBAT_THERMVBAT0R100 FNTCVBAT33 pF1 FESDESD123USB_VBUSAdapter or USBModuleBatteryGNDC1C2C3R1D1D21 FC2NM_1 nFC4 Smart Module Series 3.9. USB Interface SC200R series module provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface supports USB OTG and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 12: Pin Definition of USB Interface Pin Name Pin No. I/O Description USB_VBUS 141, 142 PI Charging power input;

USB 5 V power input;

USB/adaptor insertion detection USB_DM 13 AIO USB 2.0 differential data (-) USB_DP 14 AIO USB 2.0 differential data (+) Comment Vmax = 6.2 V Vmin = 4.35 V Vnom = 5.0 V USB 2.0 standard compliant. 90 differential impedance. USB_ID 16 AI USB ID detect High level by default. For the design of USB 2.0 interface, it is recommended to connect USB_ID directly to the USB_ID pin of the external USB port for USB ID detection. When you insert a device into the external USB port, the USB_ID pin of the module will be pulled down to make the module enter host mode. You can choose either to support USB OTG or not. The following figures show the reference designs. Figure 11: USB Interface Reference Design (OTG Not Supported) SC200R&SC262R_Series_Hardware_Design 48 / 124 USB_DPUSB_DMUSB_VBUS12345USB_DPUSB_DMVUSBUSB_IDGNDGNDGNDGNDGND6789100 nFModuleC1D1D2D3ESDESDESDGND Smart Module Series Figure 12: USB Interface Reference Design (OTG Supported) In order to ensure USB performance, comply with the following principles when designing the USB interface. Route the USB signal traces as a differential pair with total grounding. The impedance of USB differential trace should be controlled to 90 . Keep the ESD protection devices as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection devices on USB data lines. Typically, the capacitance value should be less than 2 pF. Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. Route the USB differential traces in inner-layer with ground shielding on not only the upper and lower layers but also the right and left sides. Make sure the trace length difference between USB 2.0 differential data signals is less than 0.7 mm. Table 13: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (DP - DM) 13 14 USB_DM USB_DP 32.25 32.15

-0.10 SC200R&SC262R_Series_Hardware_Design 49 / 124 10 FENVINSWNCVOUTVOUT451786293AGNDPGNDPGND10K22 F/10 V1.0 H USB_DPUSB_DMUSB_VBUSUSB_ID12345USB_DPUSB_DMVUSBUSB_IDGNDGNDGNDGNDGND6789100 nFModuleVBATGPIOVBATC1C2L1U1R1C3D1D2D3D4ESDESDESDESDGND Smart Module Series 3.10. UART Interfaces SC200R series module provides three UART interfaces and supports up to 4 Mbps:

UART5: 4-wire UART interface, and hardware flow control is supported UART2 (debug UART): 2-wire UART interface, used for debugging by default UART1: 2-wire UART interface Table 14: Pin Definition of UART Interfaces Pin Name Pin No. I/O Description Comment UART5_TXD 34 DO UART5 transmit UART5_RXD 35 UART5 receive UART5_CTS 36 UART5 clear to send DI DI UART5_RTS 37 DO UART5 request to send DBG_RXD 93 DI DBG_TXD 94 DO UART2 receive

(debug UART by default) UART2 transmit

(debug UART by default) UART1_RXD 153 DI UART1 receive UART1_TXD 154 DO UART1 transmit 1.8 V power domain. If not used, keep these pins open. UART5 is a 4-wire UART interface with 1.8 V power domain. You should use a level translator if your application is equipped with a 3.3 V UART interface. The following figure shows the reference design. Figure 13: Reference Circuit with Level Translator Chip (for UART5) SC200R&SC262R_Series_Hardware_Design 50 / 124 VCCAVCCBOEA1A2A3A4GNDB1B2B3B4LDO5_1V8UART5_RTSUART5_RXDUART5_CTSUART5_TXDRTS_3.3VRXD_3.3VCTS_3.3VTXD_3.3VVDD_3.3VC1100 pFC2U1100 pF The following figure is an example of connection between the module and PC. It is recommended to add a level translator and an RS-232 level translator chip between the module and PC. The following figure shows the reference design. Smart Module Series Figure 14: RS-232 Level Match Circuit (for UART5) NOTE UART2 and UART1 are similar to UART5. For the reference design, refer to that of UART5. 3.11. (U)SIM Interfaces SC200R series module provides two (U)SIM interfaces that meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the

(U)SIM card is powered by the internal power supply of the module. Table 15: Pin Definition of (U)SIM Interfaces Pin Name I/O Pin No. Description Comment USIM2_DET 17 DI

(U)SIM2 card hot-plug detect Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. SC200R&SC262R_Series_Hardware_Design 51 / 124 RTS_3.3VRXD_3.3VCTS_3.3VTXD_3.3VRTS_1.8VRXD_1.8VCTS_1.8VTXD_1.8VVCCAModuleGNDGND1.8 VVCCB3.3 VDIN1ROUT3ROUT2ROUT1DIN4DIN3DIN2DIN5R1OUTBFORCEON/FORCEOFF/INVALID3.3 VDOUT1DOUT2DOUT3DOUT4DOUT5RIN3RIN2RIN1VCCGNDOEDB-9RTSTXDCTSRXDGNDUART5_RXDUART5_TXDUART5_RTSUART5_RXDUART5_CTS USIM2_RST DO

(U)SIM2 card reset USIM2_CLK DO

(U)SIM2 card clock USIM2_DATA DIO

(U)SIM2 card data USIM2_VDD PO

(U)SIM2 card power supply USIM1_DET 22 DI

(U)SIM1 card hot-plug detect USIM1_RST DO

(U)SIM1 card reset USIM1_CLK DO

(U)SIM1 card clock USIM1_DATA DIO

(U)SIM1 card data USIM1_VDD PO

(U)SIM1 card power supply 18 19 20 21 23 24 25 26 Smart Module Series Cannot be multiplexed into generic GPIOs. Either 1.8 V or 2.95 V (U)SIM card is supported. Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. Either 1.8 V or 2.95 V (U)SIM card is supported. SC200R series module supports (U)SIM card hot-plug via the USIM_DET pin. (This function is disabled by default via software. To enable it, contact Quectel Technical Supports to change the software configuration.) A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below. Figure 15: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector SC200R&SC262R_Series_Hardware_Design 52 / 124 USIM_VDDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET22RLDO5_1V8100K100nF(U)SIM Card ConnectorESD22pFVCCRSTCLKIOVPPGNDUSIM_VDD10KModuleR1R2C122pF22pFC2C3C4D122R22RR3R4R5USIM_VDDNMR6 If you do not need to use USIM_DET, keep this pin open. The following is a reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector. Smart Module Series Figure 16: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to ensure good performance and avoid damage of (U)SIM cards, follow the criteria listed below during (U)SIM circuit design:

Place the (U)SIM card connector as close to the module as possible. Keep the trace length of (U)SIM card signals as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Reserve a filter capacitor for USIM_VDD, and its maximum capacitance should not exceed 1 F. Additionally, place the capacitor near the (U)SIM card connector. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground. USIM_RST also needs ground protection. In order to ensure good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 50 pF. Add 22 resistors in series between the module and (U)SIM card to suppress EMI spurious transmission and enhance ESD protection. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. Add 22 pF capacitors in parallel on USIM_DATA, USIM_CLK and USIM_RST signal lines to filter RF interference, and place them as close to the (U)SIM card connector as possible. Place the reserved pull-up resistors R6 and R5 in Figure 16 and 17 close to the module. SC200R&SC262R_Series_Hardware_Design 53 / 124 ModuleUSIM_VDDUSIM_RSTUSIM_CLKUSIM_DATA22R22R22R100 nF(U)SIM card connectorESD22 pFVCCRSTCLKIOVPPGND10KUSIM_VDD22 pF22 pFR1C1D1R2R3R4C2C3C4USIM_VDDNMR5 Smart Module Series 3.12. SD Card Interface SD Card interface of SC200R series module supports SD 3.0 protocol. The pin definition of SD card interface is shown below. Table 16: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_CLK SD_CMD 39 40 DO SD card clock DIO SD card command SD_DATA0 41 DIO SDIO data bit 0 SD_DATA1 42 DIO SDIO data bit 1 SD_DATA2 43 DIO SDIO data bit 2 SD_DATA3 44 DIO SDIO data bit 3 50 characteristic impedance. SD_DET 45 DI SD card hot-plug detect Active low. SD_LDO11 38 PO 2.95 V output power supply for SD card Vnom = 2.95 V IOmax = 800 mA SD_LDO12 32 PO 1.8/2.95 V output power supply for SD card pull-up circuits. Vnom = 1.8/2.95 V IOmax = 50 mA A reference circuit for the SD card interface is shown below. Figure 17: Reference Circuit for SD Card Interface SC200R&SC262R_Series_Hardware_Design 54 / 124 SD_CMD120KNM_51KSD_DATA3SD_DATA2SD_CLKSD_DATA0SD_DETSD_DATA1P1-DAT2P2-CD/DAT3P3-CMDP4-VDDP5-CLKP8-DAT1GNDP6-VSSP7-DAT0DETECTIVEGNDGNDGND12345678910111213SD_LDO1133R33R33R33R33R33R1K33 pF4.7 FSD_LDO12ModuleR1R2R3R4R5R6NM_51KNM_10KNM_51KNM_51KR7R8R9R10R11R12R13D1D2D3D4D5D6D7D8C1C2SD Card ConnectorLDO5_1V8GNDR140R Smart Module Series SD_LDO11 is the power supply for the SD card and can provide up to 800 mA output current. Due to the high output current, it is recommended that the trace width should be at least 0.8 mm. In order to ensure stability of output current, add a 4.7 F and a 33 pF capacitor in parallel near the SD card connector. SD_CMD, SD_CLK, SD_DATA0, SD_DATA1, SD_DATA2, and SD_DATA3 are all high-speed signal lines. In PCB design, control the characteristic impedance of them to 50 , and do not cross them with other traces. It is recommended to route the traces on the inner layer of PCB and keep them of the same length. Additionally, SD_CLK needs ground shielding separately. Layout guidelines:

Control the impedance to 50 10 % and add ground shielding. The trace length difference between SD_CLK and other signal traces like SD_CMD and SD_DATA should not exceed 1 mm. Table 17: SD Card Trace Length Inside the Module Pin No. Length (mm) Signal SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 21.50 21.40 21.45 21.60 21.40 21.35 39 40 41 42 43 44 SC200R&SC262R_Series_Hardware_Design 55 / 124 Smart Module Series 3.13. GPIO Interfaces SC200R series module has abundant GPIO interfaces with a power domain of 1.8 V. The pin definition is listed below. Table 18: Pin Definition of GPIO Interfaces Pin Name Pin No. GPIO No. Default State Comment GPIO_6 GPIO_7 GPIO_12 GPIO_13 GPIO_20 GPIO_21 GPIO_22 GPIO_23 GPIO_25 GPIO_33 GPIO_34 GPIO_39 GPIO_42 GPIO_43 GPIO_44 GPIO_45 GPIO_46 GPIO_47 GPIO_48 167 168 101 102 119 118 117 116 90 33 170 201 110 107 109 98 113 124 99 GPIO_6 B-PD:nppukp 1) GPIO_7 B-PD:nppukp GPIO_12 B-PD:nppukp Wakeup 2) GPIO_13 B-PD:nppukp Wakeup GPIO_20 B-PD:nppukp GPIO_21 B-PD:nppukp Wakeup GPIO_22 B-PD:nppukp GPIO_23 B-PD:nppukp GPIO_25 B-PD:nppukp Wakeup GPIO_33 B-PD:nppukp GPIO_34 B-PD:nppukp Wakeup GPIO_39 B-PD:nppukp GPIO_42 B-PD:nppukp Wakeup GPIO_43 B-PD:nppukp Wakeup GPIO_44 B-PD:nppukp Wakeup GPIO_45 B-PD:nppukp Wakeup GPIO_46 B-PD:nppukp Wakeup GPIO_47 B-PD:nppukp GPIO_48 B-PD:nppukp Wakeup SC200R&SC262R_Series_Hardware_Design 56 / 124 Smart Module Series GPIO_59 GPIO_61 GPIO_62 GPIO_63 GPIO_66 GPIO_85 GPIO_86 GPIO_87 GPIO_88 GPIO_89 GPIO_90 GPIO_93 GPIO_94 GPIO_95 GPIO_127 GPIO_130 SD_DET TP_INT TP_RST TP_I2C_SCL TP_I2C_SDA LCD_RST LCD_TE CAM0_MCLK CAM1_MCLK 100 267 123 108 106 265 239 105 264 115 177 112 104 103 169 97 45 30 31 47 48 49 50 74 75 GPIO_59 B-PD:nppukp Wakeup GPIO_61 B-PD:nppukp Wakeup GPIO_62 B-PD:nppukp Wakeup GPIO_63 B-PD:nppukp Wakeup GPIO_86 B-PD:nppukp Wakeup GPIO_66 B-PD:nppukp GPIO_85 B-PD:nppukp GPIO_87 B-PD:nppukp GPIO_88 B-PD:nppukp GPIO_89 B-PD:nppukp GPIO_90 B-PD:nppukp Wakeup GPIO_93 B-PD:nppukp Wakeup GPIO_94 B-PD:nppukp GPIO_95 B-PD:nppukp GPIO_127 B-PD:nppukp Wakeup GPIO_130 B-PD:nppukp Wakeup GPIO_67 B-PD:nppukp Wakeup GPIO_65 B-PD:nppukp Wakeup GPIO_64 B-PD:nppukp GPIO_11 B-PD:nppukp GPIO_10 B-PD:nppukp GPIO_60 B-PD:nppukp GPIO_24 B-PD:nppukp GPIO_26 B-PD:nppukp GPIO_28 B-PD:nppukp Wakeup SC200R&SC262R_Series_Hardware_Design 57 / 124 CAM0_RST GPIO_128 B-PD:nppukp Wakeup CAM0_PWDN GPIO_126 B-PD:nppukp Wakeup Smart Module Series CAM2_PWDN GPIO_41 B-PD:nppukp Wakeup GPIO_38 B-PD:nppukp Wakeup 79 80 81 82 165 164 163 95 96 34 35 36 37 154 153 GPIO_129 B-PD:nppukp GPIO_125 B-PD:nppukp GPIO_27 B-PD:nppukp GPIO_91 B-PD:nppukp Wakeup GPIO_50 B-PD:nppukp Wakeup GPIO_16 B-PD:nppukp GPIO_17 B-PD:nppukp Wakeup GPIO_18 B-PD:nppukp GPIO_19 B-PD:nppukp GPIO_0 B-PD:nppukp GPIO_1 B-PD:nppukp Wakeup 1. 1) B: Bidirectional digital with CMOS input; PD:nppukp = default pull-down with programmable options following the colon (:). 2) Wakeup: Interrupt pins that can wake up the system. 2. 3. For more details about GPIO configuration, see document [2]. CAM1_RST CAM1_PWDN CAM2_MCLK CAM2_RST VOL_UP VOL_DOWN UART5_TXD UART5_RXD UART5_CTS UART5_RTS UART1_TXD UART1_RXD NOTES SC200R&SC262R_Series_Hardware_Design 58 / 124 Smart Module Series 3.14. I2C Interfaces SC200R series module provides four I2C interfaces. All I2C interfaces are open drain signals and therefore you must pull them up externally. The reference power domain is 1.8 V. The SENSOR_I2C interface only supports sensors of ADSP architecture. CAM_I2C and DCAM_I2C signals are controlled by Linux Kernel code and support connection with devices related to video output. Table 19: Pin Definition of I2C Interfaces Pin Name Pin No. I/O Description Comment 47 48 83 84 TP_I2C_SCL OD TP I2C clock TP_I2C_SDA OD TP I2C data CAM_I2C_SCL OD I2C clock of camera CAM_I2C_SDA OD I2C data of camera DCAM_I2C_SCL 166 OD I2C clock of camera DCAM_I2C_SDA 205 OD I2C data of camera SENSOR_I2C_SCL 91 OD I2C clock of external sensor SENSOR_I2C_SDA 92 OD I2C data of external sensor Used for touch panel Used for camera Used for camera Used for external sensor 3.15. SPI Interfaces SC200R series module provides three SPI interfaces, which are multiplexed from UART and GPIO interfaces. These interfaces can only support master mode and can be used for fingerprint recognition. Table 20: Pin Definition of SPI Interfaces Pin Name Pin No. I/O Description Comment UART5_RXD 35 DI SPI5 data input Can be multiplexed into SPI5_MISO UART5_TXD 34 DO SPI5 data output Can be multiplexed into SPI5_MOSI UART5_RTS 37 DO SPI5 clock Can be multiplexed into SPI5_CLK SC200R&SC262R_Series_Hardware_Design 59 / 124 Smart Module Series UART5_CTS 36 DO SPI5 chip select Can be multiplexed into SPI5_CS GPIO_22 GPIO_23 GPIO_20 GPIO_21 GPIO_87 GPIO_85 GPIO_88 GPIO_86 117 116 119 118 105 265 264 239 DO SPI6 chip select Can be multiplexed into SPI6_CS DO SPI6 clock Can be multiplexed into SPI6_CLK DO SPI6 data output Can be multiplexed into SPI6_MOSI DI SPI6 data input Can be multiplexed into SPI6_MISO DO SPI7 chip select Can be multiplexed into SPI7_CS DO SPI7 data output Can be multiplexed into SPI7_MOSI DO SPI7 clock Can be multiplexed into SPI7_CLK DI SPI7 data input Can be multiplexed into SPI7_MISO 3.16. ADC Interface SC200R series module supports one analog-to-digital converter (ADC) interface. The ADC interface supports resolution of up to 15 bits. The pin definition is shown below. Table 21: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC 128 AI The maximum input voltage is 1.7 V. General-purpose ADC interface 3.17. Motor Drive Interface The pin definition of the motor drive interface is listed below. Table 22: Pin Definition of Motor Drive Interface Pin Name Pin No. I/O Description Comment VIB_DRV_N 28 PO Connect it to the negative pole of the motor. Vibration motor driver output control SC200R&SC262R_Series_Hardware_Design 60 / 124 The motor is driven by an exclusive circuit, and a reference circuit is shown below. Smart Module Series Figure 18: Reference Circuit for Motor Connection When the motor stops working and the VIB_DRV_N is disconnected, the redundant electricity on the motor can be discharged from the circuit loop formed by diodes, thus avoiding damage to components. 3.18. LCM Interface SC200R series module provides one LCM interface, which is MIPI_DSI standard compliant. The interface supports high-speed differential data transmission and supports HD+ display (1440 720 @ 60 fps). The pin definition of the LCM interface is shown below. Table 23: Pin Definition of LCM Interface Pin Name Pin No. I/O Description Comment LDO17_2V85 129 PO 2.85 V output power supply for LCM VCC PWM LCD_RST LCD_TE DSI_CLK_N DSI_CLK_P 29 49 50 52 53 DO PWM output DO LCD reset DI AO AO LCD tearing effect LCD MIPI clock (-) LCD MIPI clock (+) Vnom = 2.85 V IOmax = 450 mA Adjusts backlight brightness 1.8 V power domain SC200R&SC262R_Series_Hardware_Design 61 / 124 VIB_DRV_N143V3ModuleVIB+MotorVIB-1 FNMD1C1C2 Smart Module Series DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N DSI_LN3_P 54 55 56 57 58 59 60 61 AO AO AO AO AO AO AO AO LCD MIPI data 0 (-) LCD MIPI data 0 (+) LCD MIPI data 1 (-) LCD MIPI data 1 (+) LCD MIPI data 2 (-) LCD MIPI data 2 (+) LCD MIPI data 3 (-) LCD MIPI data 3 (+) A reference circuit for the LCM interface is shown below. Figure 19: Reference Circuit Design for LCM Interface SC200R&SC262R_Series_Hardware_Design 62 / 124 DSI_CLK_PLEDANCLEDKLPTENC (SDA-TP) VIO18NC (VTP-TP) DSI_LN3_PLCD_TELCD_RSTDSI_LN3_NDSI_LN2_P_CLK_NDSI_LN2_NRESETLCD_IDNC (SCL-TP) NC (RST-TP) NC (EINT-TP) GNDVCC28GNDMIPI_TDP3MIPI_TDN3GNDMIPI_TDP2MIPI_TDN2GNDMIPI_TDP1MIPI_TDN1GNDLDO17_2V85LDO6_1V8LCM_LED+LCM_LED-1234567891012131415161718192021222324252627MIPI_TDP0MIPI_TDN0GNDMIPI_TCPMIPI_TCN2928303456345634563456DSI_LN1_NDSI_LN1_PDSI_LN0_NDSI_LN0_P1234561112121212100nF4.7F1FModuleLCMFL1FL2FL3FL4FL5EMI filterC3C2C1NCGNDGNDGNDGNDGPIO_6131323334DSIOUTGNDINEN1.8 VVBAT1F10KGND Smart Module Series MIPI are high-speed signal lines. It is recommended to add common-mode filters in series near the LCM connector, to improve protection against electromagnetic radiation interference. It is recommended to read the LCM ID register through MIPI when compatible design with other displays is required. If several LCMs share the same IC, it is recommended that the LCM factory should burn an OTP register to distinguish different screens. You can also connect the LCD_ID pin of LCM to the ADC pin of the module, but you need to make sure that the output voltage of LCD_ID should not exceed the voltage range of the ADC pin. You can design the external backlight driving circuit for LCM according to actual requirements. A reference circuit design is shown in the following figure, in which the PWM pin is used to adjust the backlight brightness. Figure 20: Reference Design for External Backlight Driving Circuit 3.19. Touch Panel Interface SC200R series module provides one I2C interface for connection with Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The definitions of TP interface pins are illustrated below. Table 24: Pin Definition of Touch Panel Interface Pin Name Pin No. I/O Description Comment LDO17_2V85 129 PO LDO6_1V8 125 PO 2.85 V output power supply for TP VDD Vnom = 2.85 V IOmax = 450 mA 1.8 V output power supply for TP I/O power domain and I2C pull-up circuit Vnom = 1.8 V IOmax = 150 mA SC200R&SC262R_Series_Hardware_Design 63 / 124 LCM_LED+PWMModule2.2 FBacklight driverLCM_LED-VBATC1 TP_INT TP_RST 30 31 DI TP interrupt DO TP reset TP_I2C_SCL 47 OD TP I2C clock TP_I2C_SDA 48 OD TP I2C data A reference circuit for the TP interface is shown below. Smart Module Series 1.8 V voltage domain. 1.8 V voltage domain. Active low. Externally pull them up to 1.8 V. Can be used for other I2C devices. Figure 21: Reference Circuit Design for TP Interface SC200R&SC262R_Series_Hardware_Design 64 / 124 TP_RSTTP_I2C_SCLTP_I2C_SDATP_INT1234562.2K2.2KLDO6_1V84.7 F100 nFModuleRESET 1.8 V SCL 1.8 VSDA 1.8 V INT 1.8 V GNDVDD 2.85 V TPR2R1C1C2D1D2D3D4D5LDO17_2V85GND Smart Module Series 3.20. Camera Interfaces Based on MIPI_CSI standard, SC200R series module supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane + 1-lane), and the maximum pixel of the camera can be up to 13 MP. The video and photo quality is determined by various factors such as the camera sensor, camera lens quality, etc. Table 25: Pin Definition of Camera Interface Pin Name Pin No. I/O Description Comment LDO6_1V8 125 PO LDO17_2V85 129 PO 1.8 V output power supply for DOVDD of camera Vnom = 1.8 V IOmax = 150 mA 2.85 V output power supply for AVDD of camera Vnom = 2.85 V IOmax = 450 mA CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN3_N CSI1_LN3_P CSI1_LN2_N CSI1_LN2_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P 63 64 65 66 67 68 70 71 72 73 157 196 158 197 159 198 AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI Camera MIPI clock (-) Camera MIPI clock (+) Camera MIPI data 0 (-) Camera MIPI data 0 (+) Camera MIPI data 1 (-) Camera MIPI data 1 (+) Camera MIPI data 3 (-) Camera MIPI data 3 (+) Camera MIPI data 2 (-) Camera MIPI data 2 (+) Camera MIPI clock (-) Camera MIPI clock (+) Camera MIPI data 0 (-) Camera MIPI data 0 (+) Camera MIPI data 1 (-) Camera MIPI data 1 (+) SC200R&SC262R_Series_Hardware_Design 65 / 124 Smart Module Series 1.8 V power domain. Externally pull them up to 1.8 V. CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P CAM0_MCLK CAM1_MCLK CAM0_RST CAM0_PWDN CAM1_RST CAM1_PWDN CAM_I2C_SCL CAM_I2C_SDA CAM2_MCLK CAM2_RST CAM2_PWDN 160 199 161 200 74 75 79 80 81 82 83 84 165 164 163 Camera MIPI data 2 (-) Camera MIPI data 2 (+) Camera MIPI data 3 (-) Camera MIPI data 3 (+) Clock of camera Clock of camera Reset of camera Power down of camera Reset of camera Power down of camera I2C clock of camera I2C data of camera Clock of camera Power down of camera AI AI AI AI DO DO DO DO DO DO OD OD DO DO DO OD OD Reset of camera 1.8 V power domain. DCAM_I2C_SDA 205 I2C data of camera DCAM_I2C_SCL 166 I2C clock of camera Externally pull them up to 1.8 V. SC200R&SC262R_Series_Hardware_Design 66 / 124 The following is a reference circuit design for 3-camera applications. Smart Module Series Figure 22: Reference Circuit Design for 3-Camera Applications SC200R&SC262R_Series_Hardware_Design 67 / 124 camera2 connectorCAM2_PWDNCAM2_MCLKDCAM_I2C_SDADCAM_I2C_SCL_CSI0_LN3_PCSI0_LN3_NCSI0_LN2_PCSI0_LN2_NCSI0_LN1_PCSI0_LN1_NCSI0_LN0_PCSI0_LN0_NCAM0_RSTCAM0_PWDNCAM0_MCLKCSI1_LN3_PCSI1_LN3_NCSI1_LN2_PCSI1_LN2_NCSI1_LN1_PCSI1_LN1_NCSI1_LN0_PCSI1_LN0_NCSI0_CLK_PCSI0_CLK_NCSI1_CLK_PCSI1_CLK_NLDO6_1V82.2K2.2K camera0 connector1 F4.7F4.7F1F1F4.7FCAM2_RSTCAM1_PWDNCAM1_MCLKCAM_I2C_SDA_CAM_I2C_SCLCAM1_RSTcamera1 connector AVDDDVDDDOVDDEMIEMIEMIEMIEMIEMIEMIEMI1F2.2K2.2KDVDDEMIEMI4.71FFAVDDDOVDDOUTGNDINENLDOVBAT1FAF_VDDOUTGNDINENLDOVBATGPIO1FLDO17_2V85GPIO Smart Module Series NOTE In 3-camera applications, CSI1_LN3_P and CSI1_LN3_N are used as CLK_P and CLK_N of camera1, CSI1_LN2_P and CSI1_LN2_N are used as the LN_P and LN_N of camera1. 3.20.1. Design Considerations Special attention should be paid to the pin definition of LCM/camera connectors. Make sure the module and the connectors are correctly connected. MIPI are high speed signal lines, supporting maximum data rate of up to 2.1 Gbps. The differential impedance should be controlled to 100 . Additionally, it is recommended to route the trace on the inner layer of PCB, and do not cross it with other traces. For the same group of DSI or CSI signals, keep all the MIPI traces of the same length. In order to avoid crosstalk, keep a distance of 1.5 times the trace width among MIPI signal lines. During impedance matching, do not connect GND on different planes to ensure impedance consistency. It is recommended to select a low-capacitance TVS for ESD protection and the recommended parasitic capacitance should be below 1 pF. Route MIPI traces according to the following rules:

a) The total trace length should not exceed 305 mm;

b) Control the differential impedance to 100 10 %;

c) Control intra-lane length difference within 0.67 mm;

d) Control inter-lane length difference within 1.3 mm. Table 26: MIPI Trace Length Inside the Module Pin Name Pin No. Length (mm) Length Difference (P - N) DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P 12.40 12.40 11.75 11.65 9.40 9.30 9.60 9.60 DSI_LN3_N 12.35 0.00

-0.10

-0.10 0.00 0.00 52 53 54 55 56 57 58 59 60 SC200R&SC262R_Series_Hardware_Design 68 / 124 Smart Module Series DSI_LN3_P CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN3_N CSI1_LN3_P CSI1_LN2_N CSI1_LN2_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P 12.35 18.10 18.05 18.05 18.10 18.15 18.20 18.10 18.20 18.05 18.10 22.60 22.55 22.55 22.50 20.25 20.30 20.50 20.50 12.95 12.95

-0.05 0.05 0.05 0.10 0.05

-0.05

-0.05 0.05 0.00 0.00 61 63 64 65 66 67 68 70 71 72 73 157 196 158 197 159 198 160 199 161 200 SC200R&SC262R_Series_Hardware_Design 69 / 124 Smart Module Series Dedicated for external sensors. Cannot be used for touch panel, NFC, I2C keyboard, etc. Externally pull them up to 1.8 V. 3.21. Sensor Interfaces SC200R series module supports communication with sensors via I2C interfaces, and it supports ALS/PS, compass, accelerometer, gyroscope, etc. Table 27: Pin Definition of Sensor Interfaces Pin Name Pin No. I/O Description Comment SENSOR_I2C_SCL 91 OD I2C clock of external sensor SENSOR_I2C_SDA 92 OD I2C data of external sensor GPIO_43 GPIO_44 GPIO_42 GPIO_63 107 109 110 108 DI DI DI DI Light sensor interrupt Compass sensor interrupt Accelerometer sensor interrupt Gyroscope sensor interrupt 3.22. Audio Interfaces SC200R series module provides three analog input channels and three analog output channels. The following table shows the pin definition. Table 28: Pin Definition of Audio Interfaces Pin Name Pin No. I/O Description Comment MIC1_P MIC_GND MIC2_P 4 5 6 AI AI AI Microphone input for channel 1 (+) Microphone reference ground Microphone input for headset (+) If it is not used, connect it to the ground. MIC_BIAS2 155 AO Microphone bias voltage 2 VO = 1.62.85 V SC200R&SC262R_Series_Hardware_Design 70 / 124 MIC3_P AI Microphone input for channel 2 (+) MIC_BIAS1 AO Microphone bias voltage 1 VO = 1.62.85 V Smart Module Series AO Earpiece output (+) AO Earpiece output (-) AO Speaker output (+) AO Speaker output (-) 148 147 8 9 10 11 136 137 138 139 EAR_P EAR_N SPK_P SPK_N HPH_R HPH_L HS_DET AO Headphone right channel output HPH_REF AO Headphone reference ground AO Headphone left channel output AI Headset hot-plug detect High level by default. The module offers three audio input channels, including three single-ended channels. The output voltage range of the two MIC_BIAS is programmable between 1.6 V and 2.85 V, and the maximum output current is 3 mA. The earpiece interface uses differential output. The loudspeaker interface uses differential output as well. The output channel is available with a Class-D amplifier whose output power is 1362 mW when the load is 8 . The headphone interface features stereo left and right channel output, and supports headphone insertion detect. 3.22.1. Reference Circuit Design for Microphone Interfaces Figure 23: Reference Circuit Design for ECM Microphone Interface SC200R&SC262R_Series_Hardware_Design 71 / 124 MIC1_PECM MICR2R1ModuleD1MIC_GND33 pFC10R0RR30R Smart Module Series Figure 24: Reference Circuit Design for MEMS Microphone Interface 3.22.2. Reference Circuit Design for Earpiece Interface Figure 25: Reference Circuit Design for Earpiece Interface SC200R&SC262R_Series_Hardware_Design 72 / 124 MIC3_P33pFMEMS MICR2R1C2ModuleMIC_GND0RC1MIC_BIAS11234F1D1OUTGNDGNDVDD100nFC40R33pFEAR_PEAR_NR233 pF33 pF33 pFC2C3C1R1ModuleD1D20R0R 3.22.3. Reference Circuit Design for Headset Interface Smart Module Series Figure 26: Reference Circuit Design for Headphone Interface 3.22.4. Reference Circuit Design for Loudspeaker Interface Figure 27: Reference Circuit Design for Loudspeaker Interface 3.22.5. Design Considerations for Audio Interfaces It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) to filter out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied to filter out RF interference when the module is transmitting at EGSM900. Without this capacitor, TDD noise could be heard during voice calls. The 10 pF capacitor is used to filter out RF interference at DCS1800. Please note that the resonant frequency point of a capacitor largely depends on its material and manufacturing SC200R&SC262R_Series_Hardware_Design 73 / 124 20KESDMIC_GNDMIC2_PHPH_LHS_DETHPH_RHPH_REF33 pFModuleR10R63452133 pF33 pFC3C4C5F3F2F1D1D2D3D4F4R2R30REARPEARNF2SPK_PSPK_N33 pF33 pFC1C2F1ModuleD1D2 Smart Module Series technique. Therefore, you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high-frequency noises. The severity of RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, you should select a suitable capacitor according to the test results. Sometimes, even no RF filtering capacitor is required. In order to decrease radio or other signal interference, place RF antennas away from audio interfaces and audio traces. Additionally, keep power traces far away from the audio traces and do not route them in parallel. Route the differential audio traces according to the differential signal layout rule. 3.23. Emergency Download Interface USB_BOOT is an emergency download interface. You can force the module to enter emergency download mode by pulling it up to LDO5_1V8 during power-on. This is an emergency option when failures such as abnormal start-up or running occur. For firmware upgrade and debugging in the future, reserve the following reference design. Figure 28: Reference Circuit Design for Emergency Download Interface SC200R&SC262R_Series_Hardware_Design 74 / 124 LDO5_1V8S1 ModuleUSB_BOOTR110K Smart Module Series 4 Wi-Fi and Bluetooth SC200R series module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth functions. The interface impedance should be controlled to 50 . You can connect external antennas such as PCB antenna, sucker antenna, and ceramic antenna to the module via the interface to achieve Wi-Fi and Bluetooth functions. 4.1. Wi-Fi Overview SC200R series module supports 2.4 GHz and 5 GHz dual-band WLAN based on IEEE 802.11a/b/g/n standard protocols. The maximum data rate is up to 150 Mbps. The features are as below:

Supports Wake-on-WLAN (WoWLAN) Supports ad hoc mode Supports WAPI SMS4 hardware encryption Supports AP mode Supports Wi-Fi Direct Supports MCS 07 for HT20 and HT40 4.1.1. Wi-Fi Performance The following table lists the Wi-Fi transmitting and receiving performance of the module. Table 29: Wi-Fi Transmitting Performance Standard 802.11b 802.11b Rate 1 Mbps Output Power 16 dBm 2.5 dB 11 Mbps 16 dBm 2.5 dB 2.4 GHz 802.11g 6 Mbps 16 dBm 2.5 dB 802.11g 54 Mbps 14 dBm 2.5 dB 802.11n HT20 MCS0 15 dBm 2.5 dB SC200R&SC262R_Series_Hardware_Design 75 / 124 Smart Module Series 6 Mbps 15 dBm 2.5 dB 54 Mbps 13 dBm 2.5 dB Table 30: Wi-Fi Receiving Performance 5 GHz 2.4 GHz 802.11n HT20 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 Standard 802.11b 802.11b 802.11g 802.11g 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT40 5 GHz 802.11n HT20 MCS7 MCS0 MCS7 MCS0 MCS7 MCS0 MCS7 Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 6 Mbps 54 Mbps MCS0 MCS7 MCS0 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB Sensitivity

-96

-87

-90

-73

-89

-71

-89

-69

-92

-74

-91

-73

-88 SC200R&SC262R_Series_Hardware_Design 76 / 124 Smart Module Series 802.11n HT40 MCS7

-70 Reference specifications are listed below:

IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11a, IEEE Std 802.11b, IEEE Std 802.11g: IEEE 802.11-2007 WLAN MAC and PHY, June 2007 4.2. Bluetooth Overview SC200R series module supports Bluetooth 4.2 (BR/EDR + BLE) specification, as well as GFSK, 8-DPSK,

/4-DQPSK modulation modes. Maximally supports up to 7 wireless connections. Maximally supports up to 3.5 piconets at the same time. Support one SCO or eSCO connection. The BR/EDR channel bandwidth is 1 MHz, and can accommodate 79 channels. The BLE channel bandwidth is 2 MHz, and can accommodate 40 channels. Table 31: Bluetooth Data Rate and Version Version 1.2 2.0 + EDR 3.0 + HS 4.2 Data Rate Maximum Application Throughput 1 Mbit/s 3 Mbit/s 24 Mbit/s 24 Mbit/s

> 80 kbit/s

> 80 kbit/s Reference 3.0 + HS Reference 4.2 LE Reference specifications are listed below:

Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1 + EDR/3.0/3.0 + HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 SC200R&SC262R_Series_Hardware_Design 77 / 124 Smart Module Series 4.2.1. Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of SC200R series module. Table 32: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 Transmitting Power 10.0 Receiver Performance Packet Types DH5 Receiving Sensitivity

-91 2-DH5 10.0 2-DH5

-90 3-DH5 9.9 3-DH5

-90 SC200R&SC262R_Series_Hardware_Design 78 / 124 Smart Module Series 5 GNSS SC200R series module integrates a IZat GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, Galileo and BeiDou. With an embedded LNA, the module provides greatly improved positioning accuracy. 5.1. GNSS Performance The following table lists the GNSS performance of the module in conduction mode. Unit dBm dBm dBm s s s m Table 33: GNSS Performance Parameter Description Sensitivity Reacquisition TTFF Warm start Cold start Tracking Cold start Hot start CEP-50 Typ.

-146

-158

-158 30.8 21 3.3

< 2.5 SC200R-WF/SC262R-WF does not support GNSS. Static Drift NOTE SC200R&SC262R_Series_Hardware_Design 79 / 124 Smart Module Series 5.2. GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below:

Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference. In user systems, place GNSS RF signal lines and RF components far away from high-speed circuits, switch-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. For applications with harsh electromagnetic environment or high ESD-protection requirements, it is recommended to add ESD protective diodes for the antenna interface. The junction capacitance of the diodes should be less than 0.5 pF. Otherwise, it will influence the impedance characteristic of RF circuit loop, or cause attenuation of bypass RF signals. Control the impedance of feeder lines and PCB traces to 50 , and keep the trace as short as possible. See Chapter 6.3 for reference circuit designs of GNSS antenna. SC200R&SC262R_Series_Hardware_Design 80 / 124 Smart Module Series 6 Antenna Interfaces SC200R series module provides four antenna interfaces for the main antenna, Rx-diversity antenna, Wi-Fi/Bluetooth antenna and GNSS antenna respectively. The impedance of the antenna ports should be controlled to 50 . 6.1. Main/Rx-diversity Antenna Interfaces The pin definition of main/Rx-diversity antenna interfaces is shown below. Table 34: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_MAIN 87 AIO Main antenna interface 50 impedance ANT_DRX 131 AI Rx-diversity antenna interface The operating frequencies of SC200R series modules are listed in the following tables. 6.1.1. Operating Frequencies Table 35: SC200R-CE Operating Frequencies 3GPP Band EGSM900 DCS1800 Receive 925960 18051880 17101785 WCDMA B1 21102170 19201980 WCDMA B8 925960 EVDO/CDMA BC0 869894 Transmit 880915 880915 824849 Unit MHz MHz MHz MHz MHz SC200R&SC262R_Series_Hardware_Design 81 / 124 Smart Module Series LTE-FDD B1 21102170 19201980 LTE-FDD B3 18051880 17101785 LTE-FDD B5 LTE-FDD B8 869894 925960 824849 880915 LTE-TDD B34 20102025 20102025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 LTE-TDD B41 25352675 25352675 Table 36: SC200R-EM Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 Receive 869894 925960 Transmit 824849 880915 18051880 17101785 19301990 18501910 WCDMA B1 21102170 19201980 WCDMA B2 19301990 18501910 WCDMA B4 21102155 17101755 WCDMA B5 WCDMA B8 869894 925960 824849 880915 LTE-FDD B1 21102170 19201980 LTE-FDD B2 19301990 18501910 LTE-FDD B3 18051880 17101785 LTE-FDD B4 21102155 17101755 MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC200R&SC262R_Series_Hardware_Design 82 / 124 Smart Module Series LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B8 LTE-FDD B20 925960 791821 LTE-FDD B28 (A + B) 758803 880915 832862 703748 LTE-TDD B38 25702620 25702620 LTE-TDD B40 23002400 23002400 LTE-TDD B41 24962690 24962690 Table 37: SC200R-NA Operating Frequencies 3GPP Band Receive Transmit WCDMA B2 19301990 18501910 WCDMA B4 21102155 17101755 WCDMA B5 869894 824849 LTE-FDD B2 19301990 18501910 LTE-FDD B4 21102155 17101755 LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 729746 746756 758768 734746 699716 777787 788798 704716 LTE-FDD B25 19301995 18501915 LTE-FDD B26 859894 814849 LTE-FDD B66 21002200 17101780 MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC200R&SC262R_Series_Hardware_Design 83 / 124 LTE-FDD B71 663698 617652 LTE-TDD B41 24962690 24962690 Table 38: SC200R-JP* Operating Frequencies 3GPP Band Receive Transmit WCDMA B1 21102170 19201980 LTE-FDD B1 21102170 19201980 LTE-FDD B3 18051880 17101785 LTE-FDD B11 14281447 14751495 WCDMA B6 WCDMA B8 WCDAM B19 875885 925960 875890 LTE-FDD B5 869894 LTE-FDD B8 925960 LTE-FDD B18 LTE-FDD B19 LTE-FDD B26 LTE-FDD B28 860875 875890 859894 758803 830840 880915 830845 824849 880915 815830 830845 814849 703748 LTE-FDD B21 14961511 14481463 Smart Module Series MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz LTE-TDD B41 24962690 24962690 6.1.2. Reference Design for Main and Rx-diversity Antenna Interfaces A reference circuit design for main and Rx-diversity antenna interfaces is shown below. Reserve a -type matching circuit for each antenna to achieve better RF performance, and place the -type matching components (R1/C1/C2, R2/C3/C4) as close to the antennas as possible. The capacitors are not mounted by default and the resistors are 0 . SC200R&SC262R_Series_Hardware_Design 84 / 124 Smart Module Series Figure 29: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces 6.2. Wi-Fi/Bluetooth Antenna Interface The following tables show the pin definition and frequency specification of the Wi-Fi/Bluetooth antenna interface. Table 39: Pin Definition of Wi-Fi/Bluetooth Antenna Interface Pin Name Pin No. I/O Description Comment ANT_WIFI/BT 77 AIO 50 impedance Wi-Fi/Bluetooth antenna interface Table 40: Wi-Fi/Bluetooth Frequency Type Wi-Fi (2.4 GHz) Wi-Fi (5 GHz) Bluetooth 4.2 LE Frequency 24022482 51805825 24022480 Unit MHz MHz MHz SC200R&SC262R_Series_Hardware_Design 85 / 124 ANT_MAINR1 0RC1ModuleMainantennaNMC2NMR2 0RC3DRXantennaNMC4NMANT_DRX A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. C1 and C2 are not mounted by default and the resistor is 0 . Smart Module Series Figure 30: Reference Circuit Design for Wi-Fi/Bluetooth Antenna 6.3. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 41: Pin Definition of GNSS Antenna Interface Pin Name Pin No. Description Comment ANT_GNSS 121 GNSS antenna interface 50 impedance I/O AI Type GPS BeiDou Galileo NOTE Table 42: GNSS Frequency GLONASS 1597.51605.8 Frequency 1575.42 1.023 1561.098 2.046 1575.42 1.023 SC200R-WF/SC262R-WF does not support GNSS. Unit MHz MHz MHz MHz SC200R&SC262R_Series_Hardware_Design 86 / 124 ANT_WIFI/BTR1 0RC1ModuleNMC2NMWi-Fi/Bluetooth antenna Smart Module Series 6.3.1. Recommended Circuit for Passive Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Figure 31: Reference Circuit Design for GNSS Passive Antenna NOTE When the passive antenna is placed far away from the module (that is, the antenna trace is long) and the external loss is more than 2 dB, it is recommended to add an external LNA circuit for better GNSS receiving performance, and place the LNA close to the antenna. 6.3.2. Recommended Circuit for Active Antenna The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Despite its low power consumption, the active antenna still requires stable and clean power supplies. Therefore, it is recommended to use high-performance LDO as the power supply. A reference design for GNSS active antenna is shown below. Figure 32: Reference Circuit Design for GNSS Active Antenna SC200R&SC262R_Series_Hardware_Design 87 / 124 LNAPassive AntennaModuleANT_GNSSNMC1C2L1U1C3C4NMActive AntennaVCCModuleANT_GNSS56 nH10R1 F100 pFNMNMC4C1R1L1R20RC5C3C2100 pF Smart Module Series 6.4. Reference Design for RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 33: Microstrip Design on a 2-layer PCB Figure 34: Coplanar Waveguide Design on a 2-layer PCB SC200R&SC262R_Series_Hardware_Design 88 / 124 Smart Module Series Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . Design the GND pins adjacent to RF pins as thermal relief pads, and fully connect them to ground. Keep the distance between the RF pins and the RF connector as short as possible. Change all the right-angle traces to curved ones and the recommended trace angle is 135. Reserve clearance under the signal pin of the antenna connector or solder joint. Keep the reference ground of RF traces complete. Meanwhile, add some ground vias around RF traces and the reference ground to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. SC200R&SC262R_Series_Hardware_Design 89 / 124 Smart Module Series The following table shows the requirement on the main antenna, Rx-diversity antenna, Wi-Fi/Bluetooth antenna and GNSS antenna. 6.5. Antenna Installation 6.5.1. Antenna Requirements Table 43: Antenna Requirements Type Requirements GSM/WCDMA/LTE Wi-Fi/Bluetooth GNSS1) VSWR: 2 Gain: 1 dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable Insertion Loss: < 1 dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, EVDO/CDMA BC0, LTE-FDD B5/B8/B12/B13/B14/B17/B18/B19/B20/B26/B28A/B28B/B71) Cable Insertion Loss: < 1.5 dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B11/B21/

B25/B34/B39/B66) Cable Insertion Loss: < 2 dB

(LTE-FDD B7, LTE-TDD B38/B40/B41) 5G Hz Gain:1.28dBi VSWR: 2 2.4G HZ Gain: 0.47 dBi

Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable Insertion Loss: < 1 dB Frequency range: 15591609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive Antenna Gain: > 0 dBi Active Antenna Noise Figure: < 1.5 dB (Typ.) Active Antenna Gain: > -2 dBi Active Antenna Embedded LNA Gain: < 17 dB (Typ.) Active Antenna Total Gain: < 17 dBi (Typ.) SC200R&SC262R_Series_Hardware_Design 90 / 124 Smart Module Series NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 6.5.2. Recommended RF Connector for Antenna Installation If you use an RF connector for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 37: Dimensions of the U.FL-R-SMT Connector (Unit: mm) SC200R&SC262R_Series_Hardware_Design 91 / 124 U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Smart Module Series Figure 38: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connectors. Figure 39: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. SC200R&SC262R_Series_Hardware_Design 92 / 124 Smart Module Series 7 Electrical, Reliability and Radio Characteristics 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 44: Absolute Maximum Ratings Parameter VBAT USB_VBUS Peak Current of VBAT Voltage on Digital Pins Min.

-0.5

-0.5 0

-0.3 Max. Unit 6 16 3 2.16 V V A V 7.2. Power Supply Ratings Table 45: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT 3.55 3.8 4.2 V VBAT Voltage drop during transmitting burst The actual input voltages must stay between the minimum and maximum values Maximum power control level at EGSM900 400 mV SC200R&SC262R_Series_Hardware_Design 93 / 124 Smart Module Series Maximum power control level at EGSM900 1.8 3.0 A USB_VBUS USB power supply 4.35 5.0 6.2 V IVBAT VRTC Peak supply current (during transmission slot) Power supply voltage of the backup battery 2.0 3.0 3.25 V 7.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 46: Operating and Storage Temperatures Parameter Min. Max. Unit Operating temperature range 1) -35 Storage Temperature Range

-40

+75

+90 C C Typ.

+25

NOTE 1) Within the operating temperature range, the module is 3GPP compliant. 7.4. Current Consumption The values of current consumption are shown below. Table 47: SC200R-CE Current Consumption Description Conditions OFF state Power down GSM/GPRS Sleep (USB disconnected) @ DRX = 2 Typ. Unit 13 5.26 A mA SC200R&SC262R_Series_Hardware_Design 94 / 124 CDMA supply current BC0 CH283 @ Slot Cycle Index = 1 BC0 CH283 @ Slot Cycle Index = 7 supply current WCDMA supply current LTE-FDD supply current LTE-TDD supply current GSM voice call Sleep (USB disconnected) @ DRX = 5 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 7 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 5 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 7 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 5 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 7 Sleep (USB disconnected) @ DRX = 9 EGSM900 @ PCL 5 EGSM900 @ PCL 12 EGSM900 @ PCL 19 DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 B1 @ max. power B8 @ max. power Smart Module Series 4.82 4.55 4.60 4.55 3.70 3.60 4.80 5.80 7.03 4.95 4.20 3.90 6.78 5.11 4.34 3.93 255.7 145.9 98.68 185.8 143.2 97.06 611.1 536.6 246.2 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA voice call GPRS data transfer EGSM900 (1UL/4DL) @ PCL 5 SC200R&SC262R_Series_Hardware_Design 95 / 124 Smart Module Series 380.1 455 555.6 175.1 266.2 338.4 427.5 181.9 305.6 421.4 562.5 163.2 274.4 386.4 465.5 551.4 482.5 583.4 493.5 717.5 679.4 633.5 621.7 369.1 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EGSM900 (2UL/3DL) @ PCL 5 EGSM900 (3UL/2DL) @ PCL 5 EGSM900 (4UL/1DL) @ PCL 5 DCS1800 (1UL/4DL) @ PCL 0 DCS1800 (2UL/3DL) @ PCL 0 DCS1800 (3UL/2DL) @ PCL0 DCS1800 (4UL/1DL) @ PCL 0 EGSM900 (1UL/4DL) @ PCL 8 EGSM900 (2UL/3DL) @ PCL 8 EGSM900 (3UL/2DL) @ PCL 8 EGSM900 (4UL/1DL) @ PCL 8 DCS1800 (1UL/4DL) @ PCL 2 DCS1800 (2UL/3DL) @ PCL 2 DCS1800 (3UL/2DL) @ PCL 2 DCS1800 (4UL/1DL) @ PCL 2 B1 (HSDPA) @ max. power B8 (HSDPA) @ max. power B1 (HSUPA) @ max. power B8 (HSUPA) @ max. power LTE-FDD B1 @ max. power LTE-FDD B3 @ max. power LTE-FDD B8 @ max. power LTE-TDD B34 @ max. power EDGE data transfer WCDMA data transfer EVDO/CDMA data transfer BC0 @ max. power 526.0 mA LTE data transfer LTE-FDD B5 @ max. power SC200R&SC262R_Series_Hardware_Design 96 / 124 LTE-TDD B38 @ max. power LTE-TDD B39 @ max. power LTE-TDD B40 @ max. power LTE-TDD B41 @ max. power Table 48: SC200R-EM Current Consumption Description Conditions Typ. Unit OFF state Power down GSM/GPRS supply current WCDMA supply current LTE-FDD supply current LTE-TDD supply current Sleep (USB disconnected) @ DRX = 2 Sleep (USB disconnected) @ DRX = 5 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 GSM850 @ PCL 5 GSM850 @ PCL 12 EGSM900 @ PCL 5 EGSM900 @ PCL 12 GSM voice call GSM850 @ PCL 19 Smart Module Series 380.3 382.1 439.3 436.5 20 3.9 2.9 2.6 4.1 3.1 2.8 4.6 3.5 3.0 4.7 3.6 3.0 282.9 116.4 96.7 268.6 155.9 mA mA mA mA A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC200R&SC262R_Series_Hardware_Design 97 / 124 EGSM900 @ PCL 19 DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 PCS1900 @ PCL 0 PCS1900 @ PCL 7 PCS1900 @ PCL 15 B1 @ max. power B2 @ max. power B5 @ max. power B8 @ max. power GSM850 (1UL/4DL) @ PCL 5 GSM850 (2UL/3DL) @ PCL 5 GSM850 (3UL/2DL) @ PCL 5 GSM850 (4UL/1DL) @ PCL 5 EGSM900 (1UL/4DL) @ PCL 5 EGSM900 (2UL/3DL) @ PCL 5 EGSM900 (4UL/1DL) @ PCL 5 DCS1800 (1UL/4DL) @ PCL 0 DCS1800 (2UL/3DL) @ PCL 0 DCS1800 (3UL/2DL) @ PCL0 DCS1800 (4UL/1DL) @ PCL 0 PCS1900 (1UL/4DL) @ PCL 0 WCDMA voice call B4 @ max. power GPRS data transfer EGSM900 (3UL/2DL) @ PCL 5 Smart Module Series 94.6 201.7 155.4 150.3 200.3 155.4 151.1 559.4 583 587.6 511.9 558.7 278.8 414.2 495.3 598.1 262.4 397 469.3 566 195.5 289 366.5 456.7 186.8 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC200R&SC262R_Series_Hardware_Design 98 / 124 GSM850 (1UL/4DL) @ PCL 8 210.64 mA PCS1900 (2UL/3DL) @ PCL 0 PCS1900 (3UL/2DL) @ PCL0 PCS1900 (4UL/1DL) @ PCL 0 GSM850 (2UL/3DL) @ PCL 8 GSM850 (3UL/2DL) @ PCL 8 GSM850 (4UL/1DL) @ PCL 8 EGSM900 (1UL/4DL) @ PCL 8 EGSM900 (2UL/3DL) @ PCL 8 EGSM900 (3UL/2DL) @ PCL 8 EGSM900 (4UL/1DL) @ PCL 8 DCS1800 (1UL/4DL) @ PCL 2 DCS1800 (2UL/3DL) @ PCL 2 DCS1800 (3UL/2DL) @ PCL 2 DCS1800 (4UL/1DL) @ PCL 2 PCS1900 (1UL/4DL) @ PCL 2 PCS1900 (2UL/3DL) @ PCL 2 PCS1900 (3UL/2DL) @ PCL 2 PCS1900 (4UL/1DL) @ PCL 2 B1 (HSDPA) @ max. power B2 (HSDPA) @ max. power B4 (HSDPA) @ max. power B5 (HSDPA) @ max. power B8 (HSDPA) @ max. power B1 (HSUPA) @ max. power EDGE data transfer WCDMA data transfer Smart Module Series 279.2 361.2 453.3 337.6 454.4 579.1 209.1 333.5 454.2 578.9 197.3 304.5 393.4 495.1 184.7 292.2 393.4 496.2 511.3 511.1 550.2 458.4 484.5 524.9 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC200R&SC262R_Series_Hardware_Design 99 / 124 Smart Module Series 566.8 566.2 493.1 522.3 728.1 723 732.4 758.7 615.5 826.9 642.7 677.9 764.5 448.4 432.7 444.2 8 3.698 2.711 2.566 6.698 3.509 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA A mA mA mA mA mA B2 (HSUPA) @ max. power B4 (HSUPA) @ max. power B5 (HSUPA) @ max. power B8 (HSUPA) @ max. power LTE-FDD B1 @ max. power LTE-FDD B2 @ max. power LTE-FDD B3 @ max. power LTE-FDD B4 @ max. power LTE-FDD B5 @ max. power LTE-FDD B7 @ max. power LTE-FDD B8 @ max. power LTE-FDD B20 @ max. power LTE-FDD B28 @ max. power LTE-TDD B38 @ max. power LTE-TDD B40 @ max. power LTE-TDD B41 @ max. power LTE data transfer Table 49: SC200R-NA Current Consumption Description Conditions Typ. Unit OFF state Power down WCDMA supply current LTE-FDD supply current Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 SC200R&SC262R_Series_Hardware_Design 100 / 124 LTE-TDD supply current Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 B2 @ max. power WCDMA voice call B4 @ max. power WCDMA data transfer LTE data transfer B5 @ max. power B2 (HSDPA) @ max. power B4 (HSDPA) @ max. power B5 (HSDPA) @ max. power B2 (HSUPA) @ max. power B4 (HSUPA) @ max. power B5 (HSUPA) @ max. power LTE-FDD B2 @ max. power LTE-FDD B4 @ max. power LTE-FDD B5 @ max. power LTE-FDD B7 @ max. power LTE-FDD B12 @ max. power LTE-FDD B13 @ max. power LTE-FDD B14 @ max. power LTE-FDD B17@ max. power LTE-FDD B25 @ max. power LTE-FDD B26 @ max. power LTE-FDD B66 @ max. power LTE-FDD B71 @ max. power Smart Module Series 3.011 6.954 3.611 2.897 603.0 659.3 586.1 617.1 608.5 541.7 631.8 608.8 553.3 729.9 727.8 581.1 850.7 734.9 721.7 700 763.5 771.9 659.5 718.6 688.1 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC200R&SC262R_Series_Hardware_Design 101 / 124 Smart Module Series LTE-TDD B41 @ max. power 469.1 mA Table 50: SC200R-JP* Current Consumption Description Conditions Typ. Unit OFF state Power down WCDMA supply current LTE-FDD supply current LTE-TDD supply current WCDMA voice call Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 B1 @ max. power B6 @ max. power B8 @ max. power B19 @ max. power B1 (HSDPA) @ max. power B6 (HSDPA) @ max. power B8 (HSDPA) @ max. power B1 (HSUPA) @ max. power B6 (HSUPA) @ max. power B8 (HSUPA) @ max. power TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA data transfer B19 (HSDPA) @ max. power SC200R&SC262R_Series_Hardware_Design 102 / 124 Smart Module Series TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA LTE data transfer LTE-FDD B18 @ max. power B19 (HSUPA) @ max. power LTE-FDD B1 @ max. power LTE-FDD B3 @ max. power LTE-FDD B5 @ max. power LTE-FDD B8 @ max. power LTE-FDD B11 @ max. power LTE-FDD B19 @ max. power LTE-FDD B21 @ max. power LTE-FDD B26 @ max. power LTE-FDD B28 @ max. power LTE-TDD B41 @ max. power 7.5. RF Output Power The following tables show the RF output power of SC200R series modules. Table 51: SC200R-CE RF Output Power Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B8 LTE-FDD B1 LTE-FDD B3 Max. Min. 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 23 dBm 2 dB 23 dBm 2 dB

< -39 dBm

< -39 dBm EVDO/CDMA BC0 24 dBm +3/-1 dB

< -49 dBm SC200R&SC262R_Series_Hardware_Design 103 / 124 Smart Module Series LTE-FDD B5 LTE-FDD B8 23 dBm 2 dB 23 dBm 2 dB LTE-TDD B34 23 dBm 2 dB LTE-TDD B38 23 dBm 2 dB LTE-TDD B39 23 dBm 2 dB LTE-TDD B40 23 dBm 2 dB LTE-TDD B41 23 dBm 2 dB Table 52: SC200R-EM RF Output Power

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm Frequency Max. Min. GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 33 dBm 2 dB 5 dBm 5 dB 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm SC200R&SC262R_Series_Hardware_Design 104 / 124 Smart Module Series LTE-FDD B8 23 dBm 2 dB LTE-FDD B20 23 dBm 2 dB LTE-FDD B28 23 dBm 2 dB LTE-TDD B38 23 dBm 2 dB LTE-TDD B40 23 dBm 2 dB LTE-TDD B41 23 dBm 2 dB Table 53: SC200R-NA RF Output Power Frequency WCDMA B2 WCDMA B4 WCDMA B5 LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B12 23 dBm 2 dB LTE-FDD B13 23 dBm 2 dB LTE-FDD B14 23 dBm 2 dB LTE-FDD B17 23 dBm 2 dB LTE-FDD B25 23 dBm 2 dB LTE-FDD B26 23 dBm 2 dB LTE-FDD B66 23 dBm 2 dB LTE-FDD B71 23 dBm 2 dB LTE-TDD B41 23 dBm 2 dB Max. Min. 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm SC200R&SC262R_Series_Hardware_Design 105 / 124 Table 54: SC200R-JP* RF Output Power Smart Module Series Max. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Min. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Frequency WCDMA B1 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 LTE-FDD B8 LTE-FDD B11 LTE-FDD B18 LTE-FDD B19 LTE-FDD B21 LTE-FDD B26 LTE-FDD B28 LTE-TDD B41 NOTE In GPRS 4-slot Tx mode, the maximum output power is reduced by 3 dB. This design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 7.6. RF Receiving Sensitivity The following table shows the RF receiving sensitivity of SC200R series modules. SC200R&SC262R_Series_Hardware_Design 106 / 124 Smart Module Series Table 55: SC200R-CE RF Receiving Sensitivity Receiving Sensitivity (Typ.) Primary Diversity SIMO Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B8

-109

-109

-109

-110 EVDO/CDMA BC0

-109.5 LTE-FDD B1 (10 MHz)

-97.6

-101.2

-96.3 dBm

-109.5

-110

-99

-96

-98.3

-98.0

-99

-98

TBD TBD

-99.2

-102.8

-102.2

-100.5

-100.5

-101.2

-101.3

-99.2 LTE-FDD B3 (10 MHz)

-97.2 LTE-FDD B5 (10 MHz)

-99.2

-100 LTE-FDD B8 (10 MHz)

-97.9

-100.3 LTE-TDD B34 (10 MHz)

-98.2 LTE-TDD B38 (10 MHz)

-98.0 LTE-TDD B39 (10 MHz)

-98.3 LTE-TDD B40 (10 MHz)

-98.7 LTE-TDD B41 (10 MHz)

-97.2

-97.9 Table 56: SC200R-EM RF Receiving Sensitivity Frequency GSM850 EGSM900 DCS1800 PCS1900 Receiving Sensitivity (Typ.) Primary Diversity SIMO

-110.6

-110.2

-108.9

-109

3GPP (SIMO)

-102.4 dBm

-102.4 dBm

-106.7 dBm

-103.7 dBm

-104 dBm

-93.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-96.3 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm 3GPP (SIMO)

-102.4 dBm

-102.4 dBm

-102.4 dBm

-102.4 dBm SC200R&SC262R_Series_Hardware_Design 107 / 124 WCDMA B1

-109.5 WCDMA B2 WCDMA B4

-110

-110 WCDMA B5

-111.5

-111 WCDMA B8

-111

-111.5 LTE-FDD B5 (10 MHz)

-100

-100.5 LTE-FDD B1 (10 MHz)

-98.2 LTE-FDD B2 (10 MHz)

-98.2 LTE-FDD B3 (10 MHz)

-97.8 LTE-FDD B4 (10 MHz)

-98.2 LTE-FDD B7 (10 MHz)

-97.3 LTE-FDD B8 (10 MHz)

-99.5 LTE-FDD B20 (10 MHz)

-99.5 LTE-FDD B28 (10 MHz)

-98.3 LTE-TDD B38 (10 MHz)

-98 LTE-TDD B40 (10 MHz)

-99

-111 109.5

-109.5

-99.5

-98.2

-97.8

-99.5

-97.5

-100

-100.2

-99.5

-98

-99 TBD TBD TBD TBD TBD

-100.5

-100.5

-100

-101.5

-101.5

-100

-102.5

-102.5

-101.5

-100.5

-101.5

-99.5 LTE-TDD B41 (10 MHz)

-97.3

-97.2 Table 57: SC200R-NA RF Receiving Sensitivity Frequency Receiving Sensitivity (Typ.) Primary Diversity SIMO WCDMA B2

-109.5 WCDMA B4 WCDMA B5

-110

-111 LTE-FDD B2 (10 MHz)

-98.6

-110

-110

-111.5

-99.3 TBD TBD TBD

-99 Smart Module Series

-106.7 dBm

-104.7 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm

-96.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-94.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-94.8 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm 3GPP (SIMO)

-104.7 dBm

-106.7 dBm

-104.7 dBm

-94.3 dBm SC200R&SC262R_Series_Hardware_Design 108 / 124 LTE-FDD B26 (10 MHz)

-99.8

-100.8 LTE-FDD B4 (10 MHz)

-98.4 LTE-FDD B5 (10 MHz)

-99.8 LTE-FDD B7 (10 MHz)

-97.6 LTE-FDD B12 (10 MHz)

-98.8 LTE-FDD B13 (10 MHz)

-99.8 LTE-FDD B14 (10 MHz)

-98.9 LTE-FDD B17 (10 MHz)

-97.6 LTE-FDD B25 (10 MHz)

-98.4 LTE-FDD B66 (10 MHz)

-98.5 LTE-FDD B71 (10 MHz)

-97.8 LTE-TDD B41 (10 MHz)

-98.1 Frequency WCDMA B1 WCDMA B6 WCDMA B8 WCDAM B19 TBD TBD TBD TBD LTE-FDD B1 (10 MHz) TBD LTE-FDD B3 (10 MHz) TBD LTE-FDD B5 (10 MHz) TBD LTE-FDD B8 (10 MHz) TBD LTE-FDD B11 (10 MHz) TBD

-98.9

-100.9

-98.9

-98.8

-99.3

-98.8

-99

-99.3

-99

-97.6

-97.8 TBD TBD TBD TBD TBD TBD TBD TBD TBD Smart Module Series

-96.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-92.8 dBm

-93.8 dBm

-96.3 dBm

-93.5 dBm

-94.3 dBm 3GPP (SIMO)

-102.4 dBm

-102.4 dBm

-106.7 dBm

-103.7 dBm

-96.3 dBm

-93.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-101.4

-103.8

-101.3

-102.2

-102.6

-101.9

-101.7

-101.6

-103.6

-101.5

-100.8

-100.8 TBD TBD TBD TBD TBD TBD TBD TBD TBD Table 58: SC200R-JP* RF Receiving Sensitivity Receiving Sensitivity (Typ.) Primary Diversity SIMO SC200R&SC262R_Series_Hardware_Design 109 / 124 Smart Module Series LTE-FDD B18 (10 MHz) TBD LTE-FDD B19 (10 MHz) TBD LTE-FDD B21 (10 MHz) TBD LTE-FDD B26 (10 MHz) TBD LTE-FDD B28 (10 MHz) TBD LTE-TDD B41 (10 MHz) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-96.3 dBm

-96.3 dBm

-96.3 dBm

-93.8 dBm

-94.8 dBm

-94.3 dBm 7.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it should be subject to ESD handling precautions that are typically applied to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the electrostatic discharge characteristics of SC200R series module. Table 59: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) Tested Points Contact Discharge Air Discharge Unit VBAT, GND

+/-5 All Antenna Interfaces

+/-5 Other Interfaces

+/-0.5

+/-10

+/-10

+/-1 kV kV kV SC200R&SC262R_Series_Hardware_Design 110 / 124 Smart Module Series 8 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the tolerances for dimensions without tolerance values are 0.2 mm. 8.1. Mechanical Dimensions of the Module Pin 1 Top view Figure 40: Top and Side Dimensions Side view SC200R&SC262R_Series_Hardware_Design 111 / 124 Smart Module Series Figure 41: Bottom Dimensions (Bottom View) The package warpage level of the module conforms to JEITA ED-7306 standard. NOTE SC200R&SC262R_Series_Hardware_Design 112 / 124 8.2. Recommended Footprint Smart Module Series Figure 42: Recommended Footprint (Top View) NOTES on the host PCB. 1. For easy maintenance of the module, keep at least 5 mm between the module and other components 2. All RESERVED pins should be kept open and MUST NOT be connected to ground. SC200R&SC262R_Series_Hardware_Design 113 / 124 8.3. Top and Bottom Views of the Module Smart Module Series Figure 43: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC200R&SC262R_Series_Hardware_Design 114 / 124 Smart Module Series 9 Storage, Manufacturing and Packaging 9.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. should be 3560 %. 3. The floor life of the module is 168 hours 1) in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 5. SC200R&SC262R_Series_Hardware_Design 115 / 124 Smart Module Series NOTES 1. 1) This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. 2. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 3. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 4. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 9.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. SC200R&SC262R_Series_Hardware_Design 116 / 124 Smart Module Series Figure 44: Recommended Reflow Soldering Thermal Profile Table 60: Recommended Thermal Profile Parameters Soak time (between A and B: 150 C and 200 C) 70120 s Factor Soak Zone Max slope Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle Recommendation 13 C/s 23 C/s 4070 s 235 C to 246 C

-1.5 to -3 C/s 1 SC200R&SC262R_Series_Hardware_Design 117 / 124 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 1~3 C/s Cooling down slope: -1.5 ~ -3 C/s Max slope: 2~3 C/s Smart Module Series NOTE If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 9.3. Packaging SC200R series module is packaged in tape and reel carriers, and sealed in the vacuum-sealed bag. It is not recommended to open the vacuum package before using the module for actual production. Each reel is 380 mm in diameter and contains 200 modules. The following figures show the package details, measured in mm. Figure 45: Tape Dimensions (Unit: mm) SC200R&SC262R_Series_Hardware_Design 118 / 124 Smart Module Series Figure 46: Reel Dimensions (Unit: mm) Table 61: Reel Packaging Model Name SC200R series MOQ for MP Minimum Package: 200 pcs Minimum Package 4 = 800 pcs 200 pcs Size: 405 mm 390 mm 83 mm N.W.: 1.9 kg G.W.: 3.7 kg Size: 425 mm 358 mm 410 mm N.W.: 7.6 kg G.W.: 15.2 kg SC200R&SC262R_Series_Hardware_Design 119 / 124 Smart Module Series 10 Appendix References Table 62: Related Documents SN Document Name Description

[1]

Quectel_Smart_EVB_G2_User_Guide Smart EVB G2 User Guide Quectel_SC200R_Series_Pin_Description_and _GPIO_Configuration SC200R Series Pin Description and GPIO Configuration

[3]

Quectel_RF_Layout_Application_Note RF Layout Application Note Quectel_Module_Secondary_SMT_Application _Note Module Secondary SMT Application Note

[5]

Quectel_SC200R_Series_Reference_Design SC200R Series Reference Design Table 63: Terms and Abbreviations Abbreviation Description Analog-to-Digital Converter Audio Digital Signal Processor Ambient Light Sensor Adaptive Multi-rate Access Point Advanced RISC Machine Baseband Bluetooth Low Energy Bits per Second Basic Rate

[2]

[4]

ADC ADSP ALS AMR AP ARM BB BLE bps BR SC200R&SC262R_Series_Hardware_Design 120 / 124 Smart Module Series CDMA CEP CMOS CPE CS CSD CSI CTS DC DCS DL DPSK DQPSK DRX DSI DSP ECM EDGE EDR EFR EGSM eMMC eSCO ESD ESR Code Division Multiple Access Circular Error Probable Complementary Metal-Oxide-Semiconductor Customer-Premise Equipment Coding Scheme Circuit Switched Data Camera Serial Interface Clear to Send Dual Carrier Digital Cellular System Downlink Differential Phase Shift Keying Differential Quadrature Reference Phase Shift Keying Discontinuous Reception Display Serial Interface Digital Signal Processor Electret Condenser Microphone Enhanced Data Rate for GSM Evolution Enhanced Data Rate Enhanced Full Rate Extended GSM Embedded Multimedia Card Extended Synchronous Connection Oriented Electrostatic Discharge Equivalent Series Resistance SC200R&SC262R_Series_Hardware_Design 121 / 124 Smart Module Series European Telecommunications Standards Institute Evaluation Board EV-DO/EVDO Evolution-Data Optimized EVRC Enhanced Variable Rate Codec ETSI EVB FDD FEM fps FR GMSK GNSS GPIO GPRS GPS GPU GRFC GSM G.W. HD+

HR HS HSDPA HSPA HSPA+

GFSK Gaussian Frequency Shift Keying GLONASS Global Navigation Satellite System (Russia) Frequency Division Duplex Front End Module Frame per Second Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System General Purpose Input/Output General Packet Radio Service Global Positioning System Graphics Processing Unit Generic RF control Global System for Mobile Communications Gross Weight High Definition Plus Half Rate High Speed High Speed Downlink Packet Access High Speed Packet Access High-Speed Packet Access+

SC200R&SC262R_Series_Hardware_Design 122 / 124 HSUPA High Speed Uplink Packet Access Smart Module Series Institute of Electrical and Electronics Engineers IMT-2000 International Mobile Telecommunications for the year 2000 IOmax Maximum Output Load Current High Throughput Integrated Circuit Input/Output Inter-Integrated Circuit Leadless Chip Carrier Liquid Crystal Display LCD Module Low Dropout Regulator Low Energy Light Emitting Diode Land Grid Array Low Noise Amplifier Long-Term Evolution Machine to Machine Media Access Control LPDDR Low-Power Double Data Rate Modulation and Coding Scheme MEMS Micro-Electro-Mechanical System Mobile Industry Processor Interface Minimum Order Quantity Megapixel HT IC IEEE I/O I2C LCC LCD LCM LDO LE LED LGA LNA LTE M2M MAC MCS MIPI MOQ MP SC200R&SC262R_Series_Hardware_Design 123 / 124 Smart Module Series MPP MSL N.W. NFC NTC OTA OTG OTP PA PC PCB PCL PCS PDA PDU PHY PMU POS PS PWM PSK QAM QPSK RF RFFE Multi Purpose Pin Moisture Sensitivity Levels Net Weight Near Field Communication Negative Temperature Coefficient Over-the-Air Upgrade On-The-Go One Time Programable Power Amplifier Personal Computer Printed Circuit Board Power Control Level Personal Communication Service Personal Digital Assistant Protocol Data Unit Physical Layer Power Management Unit Point of Sale Proximity Sensor Pulse Width Modulation Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency RF Front End SC200R&SC262R_Series_Hardware_Design 124 / 124 Smart Module Series RoHS RTC RTS SAW SCO SD SIMO SMD SMS SMT SPI STA TDD TP TTFF TVS UART UL UMTS USB VBAT Vmax Vnom Vmin Restriction of Hazardous Substances Real Time Clock Request to Send Surface Acoustic Wave Synchronous Connection Oriented Secure Digital Single Input Multiple Output Surface Mounting Device Short Message Service Surface Mount Technology Serial Peripheral Interface Station Time-Division Duplex Touch Panel Time to First Fix Transient Voltage Suppressor Universal Asynchronous Receiver & Transmitter Uplink Universal Mobile Telecommunications System Universal Serial Bus Voltage at Battery (Pin) Maximum Voltage Value Normal Voltage Value Minimum Voltage Value

(U)SIM

(Universal) Subscriber Identity Module SC200R&SC262R_Series_Hardware_Design 125 / 124 Smart Module Series VI VIHmin VILmax VO VOmax VOHmax VOHmin VOLmax WAPI Voltage Input Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Voltage Output Maximum Output Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value WLAN Authentication and Privacy Infrastructure WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network XO Crystal Oscillator SC200R&SC262R_Series_Hardware_Design 126 / 124

 

 

 

 

 

 

 

 

 

 

QUECTEL

$C262R-WF Q1-ag631 NA SC262RWFNA-ES1-UNNNA FCC. 1D: XMR2022SC262RWF IC -1D:102244-2022S6262R SN:E186719750%000% [Ela 03 6 9SGrETZI

 

 

Quectel Wireless Solutions Company Limited Date: 2022-06-30 Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: XMR2022SC262RWF Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Block Diagram Schematics Operational Description The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely,

Grantee Contacts Signature Quectel Wireless Solutions Company Limited Jean Hu

 

 

Quectel Wireless Solutions Company Limited Declaration of Authorization We Name: Quectel Wireless Solutions Company Limited Address: Building 5, Shanghai Business Park PhaseIII, (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declare that:

Name Representative of agent: Ms. Riley Wei Agent Company name: BTL Inc. Address: No. 29, Jintang Road, Tangzhen Industry Park Pudong New Area City: Shanghai Country: China is authorized to apply for Certification of the following product(s) and signing all the related documents including 731 forms:

Product description: Smart Module Type designation: SC262R-WF Trademark: Quectel FCC ID: XMR2022SC262RWF on our behalf. Date: 2022-06-30 City: Shanghai Name: Jean Hu Function: Certification Section Signature:

 

 

Quectel Wireless Solutions Company Limited FCC Modular Approval Statement Receiver Federal Communication Commission Equipment Authorization Devision, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Subject:

Modular Approval Statement Date: 2022-07-01 FCC Certification Number: XMR2022SC262RWF Model Name/Number: Smart Module / SC262R-WF TO WHOM IT MAY CONCERN Pursuant to Paragraphs CFR 15.212, we herewith declare for our module. Modular approval requirement Yes No *

(a) The radio elements must have the radio frequency circuitry be shielded. Physical/discrete and tuning capacitors may be located external to the shield, but must be on the module assembly.

*Please provide a detailed explanation if the answer is No.:

(b) The module shall have buffered modulation/data input(s) (if such inputs are provided) to ensure that the module will comply with the requirements set out in the applicable standard under conditions of excessive data rates or over-

modulation.

*Please provide a detailed explanation if the answer is No.:

(c) The module shall have its own power supply regulation on the module. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host device which houses the module.

*Please provide a detailed explanation if the answer is No.:

(d) The module shall comply with the provisions for external power amplifiers and antennas detailed in this standard. The equipment certification submission shall contain a detailed description of the configuration of all antennas that will be used with the module.

*Please provide a detailed explanation if the answer is No.:

(e) The module shall be tested for compliance with the applicable standard in a stand-alone configuration, i.e. the module must not be inside another device during testing.

*Please provide a detailed explanation if the answer is No.:

(f) The module shall comply with the Category I equipment requirements and CFR 15.212(a)(1)(vi).

*Please provide a detailed explanation if the answer is No.:

1 Yes Yes Yes Yes Yes labeling Yes Quectel Wireless Solutions Company Limited FCC Modular Approval Statement Yes

(g) The module shall comply with applicable RSS-102 exposure requirements and any applicable FCC RF exposure requirement which are based on the intended use/configurations.

*Please provide a detailed explanation if the answer is No.:

(i) The modular transmitter complies with all applicable FCC rules. Instructions for maintaining compliance are given in the user instructions. If you have any questions, please feel free to contact us at the address shown below Best Regards, ____________________

(Signed) Name / Title: Jean Hu/ Certification Section Yes 2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Co., Ltd Ad Hoc Mode Declaration Date: 2022-06-30 We, the undersigned company Company Name: Quectel Wireless Solutions Co., Ltd Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China Declare that:

Product description: Smart Module Type designation: SC262R-WF Brand: Quectel FCC ID: XMR2022SC262RWF 1. The EUT doesnt have Ad Hoc Mode function on non-US frequencies. 802.11a/n Ad Hoc mode should not be supported even on US DFS frequencies (5.25 ~5.35GHz/5.47 ~5.725GHz). 2. In addition, The product meets all other requirements specified in Part 15E Section 15.407 and no configuration controls are provided to change the frequency of operations outside the grant of certification for US operation. 3. Only channels 1~11 will be used in USA. Country code selection is disabled. If you have any questions regarding the authorization, please do not hesitate to contact us, thank you~

Sincerely, Signature: ________________________ Name: Jean Hu Tel: +8602150086326 Email: jean.hu@quectel.com