FCC ID: XMR2022SC262RNA Smart Module with LTE, Bluetooth and WiFi

 

SC262R Series Hardware Design Smart Module Series Version: 1.0.0 Date: 2022-07-11 Status: Preliminary SC262R_Series_Hardware_Design 0 / 115 Smart Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. SC262R_Series_Hardware_Design 2 / 115 Smart Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. SC262R_Series_Hardware_Design 3 / 115 Smart Module Series About the Document Revision History Version Date Author Description

2022-07-11 1.0.0 2022-07-11 Today JIN/

Xiaomeng GUO Today JIN/

Xiaomeng GUO Creation of the document Preliminary SC262R_Series_Hardware_Design 4 / 115 Smart Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 8 Figure Index ............................................................................................................................................... 10 1 Introduction ........................................................................................................................................ 12 2 Product Overview .............................................................................................................................. 13 Frequency Bands and Functions ............................................................................................. 13 Key Features ........................................................................................................................... 15 Functional Diagram ................................................................................................................. 18 EVB Kit..................................................................................................................................... 19 2.1. 2.2. 2.3. 2.4. 3.5. 3 Application Interfaces ....................................................................................................................... 20 3.1. General Description ................................................................................................................. 20 Pin Assignment ........................................................................................................................ 21 3.2. Pin Description ......................................................................................................................... 22 3.3. Power Supply ........................................................................................................................... 36 3.4. 3.4.1. Power Supply Pins ......................................................................................................... 36 3.4.2. Voltage Stability Requirements ...................................................................................... 36 3.4.3. Reference Design for Power Supply .............................................................................. 37 Turn On and Off ....................................................................................................................... 38 3.5.1. Turn On with PWRKEY .................................................................................................. 38 3.5.2. Turn Off the Module ....................................................................................................... 39 VRTC Interface ........................................................................................................................ 40 3.6. Power Output ........................................................................................................................... 40 3.7. Battery Charging and Management ........................................................................................ 41 3.8. 3.9. USB Interface .......................................................................................................................... 43 3.10. UART Interfaces ...................................................................................................................... 45

(U)SIM Interfaces..................................................................................................................... 47 3.11. 3.12. SD Card Interface .................................................................................................................... 49 3.13. GPIO Interfaces ....................................................................................................................... 51 I2C Interfaces .......................................................................................................................... 53 3.14. 3.15. SPI Interfaces .......................................................................................................................... 54 3.16. ADC Interface .......................................................................................................................... 55 3.17. Vibration Motor Driver Interface .............................................................................................. 55 3.18. LCM Interface .......................................................................................................................... 56 3.19. Touch Panel Interface ............................................................................................................. 59 3.20. Camera Interfaces ................................................................................................................... 60 3.20.1. Design Considerations ................................................................................................... 64 3.21. Sensor Interfaces..................................................................................................................... 66 3.22. Audio Interfaces ....................................................................................................................... 66 SC262R_Series_Hardware_Design 5 / 115 Smart Module Series 3.22.1. Reference Circuit Design for Microphone Interfaces ..................................................... 67 3.22.2. Reference Circuit Design for Earpiece Interface ........................................................... 68 3.22.3. Reference Circuit Design for Headset Interface ............................................................ 68 3.22.4. Reference Circuit Design for Loudspeaker Interface..................................................... 69 3.22.5. Design Considerations for Audio Interfaces .................................................................. 69 3.23. USB_BOOT Control Interface ................................................................................................. 69 4 Wi-Fi and Bluetooth ........................................................................................................................... 71 4.1. Wi-Fi ......................................................................................................................................... 71 4.1.1. Wi-Fi Performance ......................................................................................................... 71 Bluetooth .................................................................................................................................. 73 4.2.1. Bluetooth Performance .................................................................................................. 74 4.2. 5 GNSS ................................................................................................................................................... 75 5.1. GNSS Performance ................................................................................................................. 75 5.2. Reference Design .................................................................................................................... 76 6 Antenna Interfaces ............................................................................................................................. 77 6.1. Main/Rx-diversity Antenna Interfaces ...................................................................................... 77 6.1.1. Operating Frequencies................................................................................................... 77 6.1.2. Reference Design for Main and Rx-diversity Antenna Interfaces .................................. 79 6.2. Wi-Fi and Bluetooth Antenna Interface ................................................................................... 80 6.3. GNSS Antenna Interface & Frequency Bands ........................................................................ 81 6.3.1. Passive Antenna Reference Design .............................................................................. 82 6.3.2. Active Antenna Reference Design ................................................................................. 82 6.4. RF Routing Guidelines ............................................................................................................ 83 Antenna Installation ................................................................................................................. 85 6.5. 6.5.1. Antenna Design Requirements ...................................................................................... 85 6.5.2. RF Connector Recommendation ................................................................................... 86 7 Electrical Characteristics and Reliability ........................................................................................ 88 Absolute Maximum Ratings ..................................................................................................... 88 7.1. 7.2. Power Supply Ratings ............................................................................................................. 88 7.3. Operating and Storage Temperatures ..................................................................................... 89 Power Consumption ................................................................................................................ 89 7.4. 7.5. Tx Power .................................................................................................................................. 94 7.6. Rx Sensitivity ........................................................................................................................... 96 ESD Protection ........................................................................................................................ 98 7.7. 8 Mechanical Information ..................................................................................................................... 99 8.1. Mechanical Dimensions ........................................................................................................... 99 8.2. Recommended Footprint ....................................................................................................... 101 Top and Bottom Views .......................................................................................................... 102 8.3. 9 Storage, Manufacturing and Packaging ........................................................................................ 103 Storage Conditions ................................................................................................................ 103 9.1. 9.2. Manufacturing and Soldering ................................................................................................ 104 SC262R_Series_Hardware_Design 6 / 115 Smart Module Series 9.3. Packaging Specification ........................................................................................................ 105 9.3.1. Carrier Tape .................................................................................................................. 106 9.3.2. Plastic Reel .................................................................................................................. 106 9.3.3. Packaging Process ...................................................................................................... 107 10 Appendix References ...................................................................................................................... 108 SC262R_Series_Hardware_Design 7 / 115 Smart Module Series Table Index Table 1: SC262R-EM Frequency Bands .................................................................................................... 13 Table 2: SC262R-NA Frequency Bands..................................................................................................... 14 Table 3: SC262R-WF Frequency Bands .................................................................................................... 14 Table 4: Key Features ................................................................................................................................ 15 Table 5: I/O Parameters Definition ............................................................................................................. 22 Table 6: Pin Description ............................................................................................................................. 22 Table 7: Power Description ........................................................................................................................ 41 Table 8: Pin Definition of Charging Interface ............................................................................................. 42 Table 9: Pin Definition of USB Interface ..................................................................................................... 43 Table 10: USB Trace Length Inside the Module ........................................................................................ 45 Table 11: Pin Definition of UART Interfaces ............................................................................................... 45 Table 12: Pin Definition of (U)SIM Interfaces ............................................................................................. 47 Table 13: Pin Definition of SD Card Interface ............................................................................................ 49 Table 14: SD Card Trace Length Inside the Module .................................................................................. 50 Table 15: Pin Definition of GPIO Interfaces ............................................................................................... 51 Table 16: Pin Definition of I2C Interfaces ................................................................................................... 54 Table 17: Pin Definition of SPI Interfaces .................................................................................................. 54 Table 18: Pin Definition of ADC Interface ................................................................................................... 55 Table 19: Pin Definition of Vibration Motor Driver Interface ....................................................................... 55 Table 20: Pin Definition of LCM Interface .................................................................................................. 56 Table 21: Pin Definition of Touch Panel Interface ...................................................................................... 59 Table 22: Pin Definition of Camera Interface ............................................................................................. 60 Table 23: MIPI Trace Length Inside the Module ........................................................................................ 64 Table 24: Pin Definition of Sensor Interfaces ............................................................................................. 66 Table 25: Pin Definition of Audio Interfaces ............................................................................................... 66 Table 26: Wi-Fi Transmitting Performance ................................................................................................. 71 Table 27: Wi-Fi Receiving Performance ..................................................................................................... 72 Table 28: Bluetooth Data Rate and Version ............................................................................................... 74 Table 29: Bluetooth Transmitting and Receiving Performance .................................................................. 74 Table 30: GNSS Performance .................................................................................................................... 75 Table 31: Pin Definition of Main/Rx-diversity Antenna Interfaces .............................................................. 77 Table 32: SC262R-EM Operating Frequencies ......................................................................................... 77 Table 33: SC262R-NA Operating Frequencies .......................................................................................... 78 Table 34: Pin Definition of Wi-Fi/Bluetooth Antenna Interface ................................................................... 80 Table 35: Wi-Fi/Bluetooth Frequency ......................................................................................................... 80 Table 36: Pin Definition of GNSS Antenna Interface ................................................................................. 81 Table 37: GNSS Frequency ....................................................................................................................... 81 Table 38: Antenna Design Requirements .................................................................................................. 85 Table 39: Absolute Maximum Ratings ........................................................................................................ 88 Table 40: Power Supply Ratings ................................................................................................................ 88 Table 41: Operating and Storage Temperatures ........................................................................................ 89 SC262R_Series_Hardware_Design 8 / 115 Smart Module Series Table 42: SC262R-EM Power Consumption .............................................................................................. 89 Table 43: SC262R-NA Power Consumption .............................................................................................. 93 Table 44: SC262R-EM RF Output Power .................................................................................................. 94 Table 45: SC262R-NA RF Output Power ................................................................................................... 95 Table 46: SC262R-EM RF Receiving Sensitivity ....................................................................................... 96 Table 47: SC262R-NA RF Receiving Sensitivity ........................................................................................ 97 Table 48: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) ...................................................... 98 Table 49: Recommended Thermal Profile Parameters ............................................................................ 105 Table 50: Carrier Tape Dimension Table (Unit: mm) ................................................................................ 106 Table 51: Plastic Reel Dimension Table (Unit: mm) ................................................................................. 107 Table 52: Related Documents .................................................................................................................. 108 Table 53: Terms and Abbreviations .......................................................................................................... 108 SC262R_Series_Hardware_Design 9 / 115 Smart Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 19 Figure 2: Pin Assignment (Top View) ......................................................................................................... 21 Figure 3: Power Supply Limits during Burst Transmission ........................................................................ 36 Figure 4: Star Structure of the Power Supply ............................................................................................ 37 Figure 5: Reference Circuit of Power Supply ............................................................................................. 37 Figure 6: Turn On the Module Using Driving Circuit .................................................................................. 38 Figure 7: Turn On the Module Using Button .............................................................................................. 38 Figure 8: Timing of Turning On the Module ............................................................................................... 39 Figure 9: Timing of Turning Off the Module ................................................................................................ 40 Figure 10: RTC Powered by Coin Cell ....................................................................................................... 40 Figure 11: Reference Design for Battery Charging Circuit ........................................................................ 42 Figure 12: USB Interface Reference Design (OTG Not Supported) .......................................................... 44 Figure 13: USB Interface Reference Design (OTG Supported) ................................................................ 44 Figure 14: Reference Circuit with Voltage Level Translator Chip (for UART5) ......................................... 46 Figure 15: RS-232 Level Match Circuit (for UART5) ................................................................................. 46 Figure 16: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector ........................ 48 Figure 17: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector .......................... 48 Figure 18: Reference Circuit for SD Card Interface ................................................................................... 50 Figure 19: Reference Circuit for Motor Connection ................................................................................... 56 Figure 20: Reference Circuit Design for LCM Interface ............................................................................. 58 Figure 21: Reference Design for External Backlight Driving Circuit .......................................................... 59 Figure 22: Reference Circuit Design for TP Interface ................................................................................ 60 Figure 23: Reference Circuit Design for 3-Camera Applications ............................................................... 63 Figure 24: Reference Circuit Design for ECM Microphone Interface ........................................................ 67 Figure 25: Reference Circuit Design for MEMS Microphone Interface ..................................................... 68 Figure 26: Reference Circuit Design for Earpiece Interface ...................................................................... 68 Figure 27: Reference Circuit Design for Headset Interface ....................................................................... 68 Figure 28: Reference Circuit Design for Loudspeaker Interface ............................................................... 69 Figure 29: Reference Circuit Design for USB_BOOT Control Interface .................................................... 70 Figure 30: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces ................................. 80 Figure 31: Reference Circuit Design for Wi-Fi/Bluetooth Antenna ............................................................ 81 Figure 32: Reference Circuit Design for GNSS Passive Antenna ............................................................. 82 Figure 33: Reference Circuit Design for GNSS Active Antenna ................................................................ 83 Figure 34: Microstrip Design on a 2-layer PCB ......................................................................................... 83 Figure 35: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 84 Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 84 Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 84 Figure 38: Dimensions of the Receptacle (Unit: mm) ................................................................................ 86 Figure 39: Specifications of Mated Plugs .................................................................................................. 87 Figure 40: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 87 Figure 41: Top and Side Dimensions ......................................................................................................... 99 SC262R_Series_Hardware_Design 10 / 115 Smart Module Series Figure 42: Bottom Dimension (Bottom View) ........................................................................................... 100 Figure 43: Recommended Footprint (Top View) ...................................................................................... 101 Figure 44: Top and Bottom Views of the Module ..................................................................................... 102 Figure 45: Recommended Reflow Soldering Thermal Profile ................................................................. 104 Figure 46: Carrier Tape Dimension Drawing ............................................................................................ 106 Figure 47: Plastic Reel Dimension Drawing ............................................................................................ 106 Figure 48: Packaging Process ................................................................................................................. 107 SC262R_Series_Hardware_Design 11 / 115 Smart Module Series 1 Introduction This document defines SC262R series module and describes its air interface and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. This document is applicable to the following modules:

SC262R-WF SC262R-EM SC262R-NA SC262R-EM and SC262R-NA are temporarily under development. SC262R_Series_Hardware_Design 12 / 115 Smart Module Series 2 Product Overview 2.1. Frequency Bands and Functions SC262R is a series of 4G Smart LTE module based on Android operating system, and provides industrial grade performance. Its general features are listed below:

Supports worldwide LTE-FDD, LTE-TDD, DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS coverage. Integrates GPS/GLONASS/BDS or GPS/Galileo/BDS satellite positioning systems. Supports short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and Bluetooth 4.2 LE. Supports multiple audio and video codecs. Built-in high performance AdrenoTM 308 graphics processing unit. Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces. SC262R series module is available in three variants: SC262R-EM, SC262R-NA, SC262R-WF. The following tables show the supported frequency bands and network standards of SC262R series modules. Table 1: SC262R-EM Frequency Bands Mode LTE-FDD LTE-TDD WCDMA GSM Wi-Fi 802.11a/b/g/n/ac Bluetooth 4.2 LE GNSS Frequency B1/B2/B3/B4/B5/B7/B8/B20/B28 B38/B40/B41 B1/B2/B4/B5/B8 GSM850/EGSM900/DCS1800/PCS1900 24022482 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BDS: 1561.098 2.046 MHz SC262R_Series_Hardware_Design 13 / 115 Smart Module Series Galileo: 1575.42 1.023 MHz Table 2: SC262R-NA Frequency Bands Mode LTE-FDD LTE-TDD WCDMA Wi-Fi 802.11a/b/g/n/ac Bluetooth 4.2 LE GNSS Frequency B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 B41 B2/B4/B5 24022482 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BDS: 1561.098 2.046 MHz Galileo: 1575.42 1.023 MHz Table 3: SC262R-WF Frequency Bands Mode Wi-Fi 802.11a/b/g/n/ac Bluetooth 4.2 LE GNSS Frequency 24022482 MHz 51805825 MHz 24022480 MHz

SC262R is a series of SMD type modules, which can be embedded into applications through its 274 pins, including 146 LCC pins and 128 LGA pins. With a compact profile of 40.5 mm 40.5 mm 2.8 mm, the module can meet almost all requirements for M2M applications such as edge device, edge computing, CPE, wireless POS, smart metering, router, data card, automotive, smart phone, digital signage, alarm panel, security and industry PDA, etc. SC262R_Series_Hardware_Design 14 / 115 Smart Module Series 2.2. Key Features The following table describes the detailed features of SC262R series module. Table 4: Key Features Feature Details Application Processor 64-bit quad-core ARM Cortex-A53 microprocessor, up to 1.3 GHz 512 KB L2 cache Modem DSP GPU Memory Hexagon DSP v56 core, up to 691 MHz 768 KB L2 cache AdrenoTM 308 GPU with 64-bit addressing, up to 485 MHz 8 GB eMMC + 1 GB LPDDR3 (default) 16 GB eMMC + 2 GB LPDDR3 (optional) Operating System Android 10 Power Supply Supply voltage: 3.554.2 V Typical supply voltage: 3.8 V Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (30 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (23 dBm 2 dB) for WCDMA bands Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Supports 3GPP R10 Cat 4 FDD and TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth FDD: Max. 150 Mbps (DL)/Max. 50 Mbps (UL) TDD: Max. 130 Mbps (DL)/Max. 30 Mbps (UL) Supports 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA Supports 16QAM, 64QAM and QPSK modulations DC-HSDPA: Max. 42 Mbps DC-HSUPA: Max. 11.2 Mbps WCDMA: Max. 384 kbps (DL)/Max. 384 kbps (UL) Transmitting Power LTE Features UMTS Features SC262R_Series_Hardware_Design 15 / 115 Smart Module Series GSM Features R99:

CSD: 9.6 kbps, 14.4 kbps GPRS:

Supports GPRS multi-slot class 33 (33 by default) Coding scheme: CS 14 Max. 107 kbps (DL)/Max. 85.6 kbps (UL) EDGE:

Supports EDGE multi-slot class 33 (33 by default) Supports GMSK and 8-PSK for different MCS Downlink coding schemes: MCS 19 Uplink coding schemes: MCS 19 Max. 296 kbps (DL)/Max. 236.8 kbps (UL) WLAN Features Supports AP and STA mode 2.4 GHz, 5 GHz, 802.11a/b/g/n/ac, up to 433 Mbps Bluetooth Feature Bluetooth 4.2 LE GNSS Features 1 GPS/GLONASS/BDS or GPS/Galileo/BDS SMS Text and PDU mode Point-to-point MO and MT SMS cell broadcast LCM Interface Supports one 4-lane MIPI_DSI Supports HD+ (1440 720) @ 60 fps Camera Interfaces Supports two 4-lane MIPI_CSI, up to 2.1 Gbps/lane Supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane

+ 1-lane) Up to 13 MP Video Codec Video encoding + decoding: 720P @ 30 fps + 1080P @ 30 fps Encoding: up to 1080P @ 30 fps; Decoding: up to 1080P @ 30 fps Audio Interfaces Audio Codec Audio inputs:

Three single-ended microphone inputs Audio outputs:

Class AB stereo headphone output Class AB earpiece differential output Class D speaker differential amplifier output EVRC, EVRC-B, EVRC-WB;

G.711, G.729A, and G.729AB;

GSM-FR, GSM-EFR, GSM-HR;

AMR-NB, AMR-WB, eAMR, BeAMR 1 SC262R-WF does not support GNSS. SC262R_Series_Hardware_Design 16 / 115 Smart Module Series USB Interface UART Interfaces SD Card Interface

(U)SIM Interfaces Compliant with USB 2.0 specification Supports up to 480 Mbps Supports USB OTG Used for AT command communication, data transmission, software debugging and firmware upgrade Three UART interfaces: UART5, UART2 (debug UART) and UART1, baud rate up to 4 Mbps UART5: 4-wire UART interface, and hardware flow control is supported UART2 (debug UART): 2-wire UART interface, used for debugging by default UART1: 2-wire UART interface Supports SD 3.0 Supports SD card hot-plug Two (U)SIM interfaces Supports USIM/SIM card: 1.8 V or 2.95 V Supports Dual SIM Dual Standby (supported by default) I2C Interfaces Four I2C interfaces Used for peripherals such as camera, sensor, touch panel, etc. ADC Interface One generic ADC interface, up to 15-bit resolution Real Time Clock Supported Antenna Interfaces Main antenna, Rx-diversity antenna, GNSS antenna 1 and Wi-Fi/Bluetooth antenna Physical Characteristics Size: (40.5 0.15) mm (40.5 0.15) mm (2.8 0.2) mm Package: LCC + LGA Weight: Approx. 10.2 g Temperature Range Operating temperature range: -35 C to +75 C 2 Storage temperature range: -40 C to +90 C Firmware Upgrade Over USB interface or OTA RoHS All hardware components are fully compliant with EU RoHS directive. 2 Within the operating temperature range, the module meets 3GPP specifications. SC262R_Series_Hardware_Design 17 / 115 Smart Module Series 2.3. Functional Diagram The following figure shows a block diagram of SC262R series module and illustrates the major functional parts. Power management Radio frequency Baseband LPDDR3 + eMMC flash Peripheral interfaces

-- USB interface

-- UART interfaces

-- (U)SIM interfaces

-- SD card interface

-- GPIO interfaces

-- I2C interfaces

-- SPI interfaces

-- ADC interface

-- Vibration Motor Driver Interface

-- LCM interface

-- Touch panel interface

-- Camera interfaces

-- Audio interfaces SC262R_Series_Hardware_Design 18 / 115 Smart Module Series Figure 1: Functional Diagram 2.4. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (Smart EVB-G2) with accessories to control or test the module. For more details, see document [1]. SC262R_Series_Hardware_Design 19 / 115 BasebandTransceiverWCNLPDDReMMC ANT_GNSSANT_WIFI/BTGPIOsI2CSD 3.0UART 2(U)SIMUSB2.02CAMTPLCMEARSPKMICsADCRFCLKBBCLKMEMMultimediaConnectivityAir InterfaceProcessorsCodecPowerSignalPowerFunctionDuplexsPAPAMSAWLNASAWSAWSwitchSAWANT_DRXANT_MAIN19.2MXOPMUHK ADC &MPPsPWMHeadsetVRTCPWRKEYVOL_UPVOL_DOWNSD_LDO11USIM1_VDDUSIM2_VDDLDO6_1V8LDO5_1V8SD_LDO12LDO16_2V8LDO10_2V85VBAT_BBVBAT_RF2.4G SAWDiplex5G FEMSAWBUCKLCMSPIVIB_DRV_NLDO17_2V8548MXO Smart Module Series 3 Application Interfaces 3.1. General Description SC262R is a series of SMD type modules with 146 LCC pins and 128 LGA pins. The following chapters provide the detailed description of pins/interfaces listed below. Power supply VRTC interface Power output Battery charging and management USB interface UART interfaces

(U)SIM interfaces SD card interface GPIO interfaces I2C interfaces SPI interfaces ADC interface Vibration Motor Driver Interface LCM interface Touch panel interface Camera interfaces Sensor interfaces Audio interfaces USB_BOOT Control Interface SC262R_Series_Hardware_Design 20 / 115 Smart Module Series 3.2. Pin Assignment The following figure shows the pin assignment of SC262R series module. Figure 2: Pin Assignment (Top View) SC262R_Series_Hardware_Design 21 / 115 146145144143142141140139138137136135134133132131130129128127126125124123122121120119118117116115114113112111123456789101112131415161718192021222324252627282930313233343536371101091081071061051041031021011009998979695949392919089888786858483828180797877767574383940414243444546474849505152535455565758596061626364656667686970717273186185184183182181180179178177147187222221220219218217216215214176148188223250249248247246245244213175149189224251270269268267266243212174150190225252265242211173151191226253264241210172152192227254263240209171153193228255262239208170154194229256257258259260261238207169155195230231232233234235236237206168156196197198199200201202203204205167157158159160161162163164165166272271273274POWER PinsGND PinsAUDIO PinsUSB Pins(U)SIM PinsUART PinsGPIO PinsANT PinsTP PinsLCM PinsCAMERA PinsOTHERS PinsRESERVED Pins24SDCARD Pins254VBAT_BBVBAT_BBGNDMIC1_PMIC_GNDMIC2_PGNDEAR_PEAR_NSPK_PSPK_NGNDUSB_DMUSB_DPGNDUSB_IDUSIM2_DETUSIM2_RSTUSIM2_CLKUSIM2_DATAUSIM2_VDDUSIM1_DETUSIM1_RSTUSIM1_CLKUSIM1_DATAUSIM1_VDDGNDVIB_DRV_NPWMTP_INTTP_RSTSD_LDO12GPIO_33UART5_TXDUART5_RXDUART5_CTSUART5_RTSSD_LDO11SD_CLKSD_CMDSD_DATA0SD_DATA1SD_DATA2SD_DATA3SD_DETUSB_BOOTTP_I2C_SCLTP_I2C_SDALCD_RSTLCD_TEGNDDSI_CLK_NDSI_CLK_PDSI_LN0_NDSI_LN0_PDSI_LN1_NDSI_LN1_PDSI_LN2_NDSI_LN2_PDSI_LN3_NDSI_LN3_PGNDCSI1_CLK_NCSI1_CLK_PCSI1_LN0_NCSI1_LN0_PCSI1_LN1_NCSI1_LN1_PCSI1_LN3_NCSI1_LN3_PCSI1_LN2_NCSI1_LN2_PGNDCAM0_MCLKCAM1_MCLKGNDGNDANT_WIFI/BTCAM0_RSTCAM0_PWDNCAM1_RSTCAM1_PWDNCAM_I2C_SCLCAM_I2C_SDAGNDGNDANT_MAINGNDGNDGPIO_25SENSOR_I2C_SCLSENSOR_I2C_SDADBG_RXDDBG_TXDVOL_UPVOL_DOWNGPIO_130GPIO_45GPIO_48GPIO_59GPIO_12GPIO_95GPIO_94GPIO_87GPIO_66GPIO_43GPIO_63GPIO_44GPIO_42GPIO_13LDO5_1V8GPIO_93GPIO_46PWRKEYGPIO_23GPIO_22GPIO_21GPIO_20GNDANT_GNSSGNDGPIO_62GPIO_89GPIO_47LDO6_1V8VRTCCHG_SELADCLDO17_2V85GNDANT_DRXGNDBAT_SNSBAT_THERMGNDHPH_RHPH_REFHPH_LHS_DETGNDUSB_VBUSUSB_VBUSGNDGNDVBAT_RFVBAT_RF Smart Module Series 3.3. Pin Description Table 5: I/O Parameters Definition Type AI AO AIO DI DO DIO OD PI PO PIO Description Analog input Analog output Analog input/output Digital input Digital output Digital input/output Open drain Power input Power output Power input/output The following table shows the pin definition and electrical characteristics of the module. Table 6: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 1, 2 PIO Power supply for the modules baseband part Vmax = 4.2 V Vmin = 3.55 V Vnom = 3.8 V VBAT_RF 145, 146 PI Power supply for the modules RF part Vmax = 4.2 V Vmin = 3.55 V Vnom = 3.8 V You must provide them with sufficient current of up to 3 A. It is suggested to add a TVS for surge protection. VRTC 126 PIO Power supply for RTC VOmax = 3.2 V VI = 2.03.25 V If it is not used, keep this pin open. SC262R_Series_Hardware_Design 22 / 115 LDO5_1V8 111 PO 1.8 V output Vnom = 1.8 V IOmax = 20 mA LDO6_1V8 3 125 PO 1.8 V output Vnom = 1.8 V IOmax = 150 mA LDO10_2V85 156 PO 2.85 V output Vnom = 2.85 V IOmax = 150 mA LDO17_2V85 129 PO 2.85 V output Vnom = 2.85 V IOmax = 450 mA LDO16_2V8 193 PO 2.8 V output Vnom = 2.8 V IOmax = 55 mA Smart Module Series Power supply for external GPIOs pull-up and level shift circuits. Power supply for sensors, cameras, and I2C pull-up circuit. If it is used, connect an external 1.04.7 F capacitor to this pin in parallel. If it is not used, keep it open. Reserved power supply. If it is used, add a 1.02.2 F bypass capacitor. If it is not used, keep it open. Power supply for AVDD of LCM, TP, sensors and cameras. If it is used, connect an external 2.24.7 F capacitor to this pin in parallel. If it is not used, keep it open. Reserved power supply. If it is used, add a 1.02.2 F bypass capacitor. If it is not used, keep it open. 3 When the module is in sleep mode, LDO6_1V8 wakes up periodically or randomly. Considering the actual requirement for power consumption during sleep mode, you can use either LDO6_1V8 or an external LDO for power supply. For lower power consumption, use an external LDO instead. SC262R_Series_Hardware_Design 23 / 115 Smart Module Series GND Pin Name Pin No. 3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89, 120, 122, 130, 132, 135, 140, 143, 144, 149, 162, 171, 172, 176, 187191, 202204, 206224, 226231, 233238, 240, 241, 243245, 247, 248, 250, 251, 255, 256, 258, 259, 261, 266, 268, 269, 271274 GND Audio Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment MIC1_P MIC_GND MIC2_P EAR_P EAR_N SPK_P SPK_N 4 5 6 8 9 10 11 AI AI AI AO Microphone input for channel 1 (+) Microphone reference ground Microphone input for headset (+) Earpiece output

(+) AO Earpiece output (-) AO Speaker output (+) AO Speaker output (-) HPH_R 136 AO HPH_REF 137 AO HPH_L 138 AO HS_DET 139 AI MIC_BIAS1 147 AO MIC3_P 148 AI MIC_BIAS2 155 AO USB Interface Headphone right channel output Headphone reference ground Headphone left channel output Headset hot-plug detect Bias voltage output for microphone 1 Microphone input for channel 2 (+) Bias voltage output for microphone 2 If it is not used, connect it to the ground. High level by default. VO = 1.62.85 V VO = 1.62.85 V SC262R_Series_Hardware_Design 24 / 115 Pin Name Pin No. I/O Description DC Characteristics Comment Smart Module Series Vmax = 6.2 V Vmin = 4.35 V Vnom = 5.0 V Charging power input. USB 5 V power input. USB/adaptor insertion detection. USB 2.0 differential data (-) USB 2.0 differential data (+) AIO AIO DI USB ID detect USB_VBUS 141, 142 PI USB_DM USB_DP USB_ID 13 14 16

(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM2_DET 17 DI

(U)SIM2 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM2_RST USIM2_CLK 18 19 DO

(U)SIM2 card clock DO

(U)SIM2 card reset VOLmax = 0.4 V USIM2_DATA 20 DIO

(U)SIM2 card data VOHmin =

0.8 USIM2_VDD VILmax =

0.2 USIM2_VDD VIHmin =

0.7 USIM2_VDD VOLmax = 0.4 V VOHmin =

0.8 USIM2_VDD USB 2.0 standard compliant. 90 differential impedance. High level by default. Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. SC262R_Series_Hardware_Design 25 / 115 USIM2_VDD 21 PO

(U)SIM2 card power supply IOmax = 55 mA For 1.8 V (U)SIM:

Vmax = 1.85 V Vmin = 1.75 V For 2.95 V (U)SIM:

Vmax = 3.1 V Vmin = 2.8 V USIM1_DET 22 DI

(U)SIM1 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM1_RST USIM1_CLK 23 24 DO

(U)SIM1 card clock DO

(U)SIM1 card reset VOLmax = 0.4 V USIM1_DATA 25 DIO

(U)SIM1 card data USIM1_VDD 26 PO

(U)SIM1 card power supply VOHmin =

0.8 USIM1_VDD VILmax =

0.2 USIM1_VDD VIHmin =

0.7 USIM1_VDD VOLmax = 0.4 V VOHmin =

0.8 USIM1_VDD IOmax = 55 mA For 1.8 V (U)SIM:

Vmax = 1.85 V Vmin = 1.75 V For 2.95 V (U)SIM:

Vmax = 3.1 V Vmin = 2.8 V Smart Module Series Either 1.8 V or 2.95 V (U)SIM card is supported and can be identified automatically by the module. Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. Either 1.8 V or 2.95 V (U)SIM card is supported and can be identified automatically by the module. UART Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment SC262R_Series_Hardware_Design 26 / 115 UART5_TXD UART5_RXD UART5_CTS UART5_RTS 34 35 36 37 DBG_RXD 93 DI DBG_TXD 94 DO DO UART5 transmit DI UART5 receive DI DCE clear to send DO DCE request to send UART2 receive

(debug UART by default) UART2 transmit

(debug UART by default) UART1_RXD 153 DI UART1 receive UART1_TXD 154 DO UART1 transmit SD Card Interface Smart Module Series 1.8 V power domain. If not used, keep these pins open. VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V Pin Name Pin No. I/O Description DC Characteristics Comment SD_LDO11 38 PO SD card power supply Vnom = 2.95 V IOmax = 800 mA SD_LDO12 32 PO 1.8/2.95 V output power supply for SD card pull-up circuits. SD_CLK 39 DO SD card clock Vnom = 1.8/2.95 V IOmax = 50 mA 1.8 V SD card:

VOLmax = 0.45 V VOHmin = 1.4 V 2.95 V SD card:

VOLmax = 0.37 V VOHmin = 2.2 V SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 40 41 42 43 DIO SDIO data bit 0 DIO SD card command 1.8 V SD card:

VILmax = 0.58 V VIHmin = 1.27 V VOLmax = 0.45 V VOHmin = 1.4 V DIO SDIO data bit 1 DIO SDIO data bit 2 50 characteristic impedance. SC262R_Series_Hardware_Design 27 / 115 SD_DATA3 44 DIO SDIO data bit 3 Smart Module Series 2.95 V SD card:

VILmax = 0.73 V VIHmin = 1.84 V VOLmax = 0.37 V VOHmin = 2.2 V SD_DET 45 DI SD card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V Active low. Touch Panel Interface Pin Name Pin No. I/O Description DC Characteristics Comment TP_INT 30 DI TP interrupt TP_RST 31 DO TP reset TP_I2C_SCL TP_I2C_SDA 47 48 OD TP I2C clock OD TP I2C data LCM Interface VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. 1.8 V power domain. Active low. Externally pull them up to 1.8 V. Can be used for other I2C devices. Pin Name Pin No. I/O Description DC Characteristics Comment PWM LCD_RST LCD_TE DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N 29 49 50 52 53 54 55 56 57 58 DO PWM output DO LCD reset DI LCD tearing effect VOLmax = 0.45 V VOHmax = VBAT_BB Adjusts backlight brightness. VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. AO LCD MIPI clock (-) AO LCD MIPI clock (+) AO AO AO AO AO LCD MIPI data 0

(-) LCD MIPI data 0

(+) LCD MIPI data 1

(-) LCD MIPI data 1

(+) LCD MIPI data 2

(-) SC262R_Series_Hardware_Design 28 / 115 Smart Module Series DSI_LN2_P DSI_LN3_N DSI_LN3_P 59 60 61 Camera Interfaces AO AO AO LCD MIPI data 2

(+) LCD MIPI data 3

(-) LCD MIPI data 3

(+) Pin Name Pin No. I/O Description DC Characteristics Comment CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN3_N CSI1_LN3_P CSI1_LN2_N CSI1_LN2_P 63 64 65 66 67 68 70 71 72 73 CSI0_CLK_N 157 CSI0_CLK_P 196 CSI0_LN0_N 158 CSI0_LN0_P 197 CSI0_LN1_N 159 CSI0_LN1_P 198 AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI MIPI CSI1 clock

(-) MIPI CSI1 clock

(+) MIPI CSI1 lane 0 data (-) MIPI CSI1 lane 0 data (+) MIPI CSI1 lane 1 data (-) MIPI CSI1 lane 1 data (+) MIPI CSI1 lane 3 data (-) MIPI CSI1 lane 3 data (+) MIPI CSI1 lane 2 data (-) MIPI CSI1 lane 2 data (+) MIPI CSI0 clock

(-) MIPI CSI0 clock

(+) MIPI CSI0 lane 0 data (-) MIPI CSI0 lane 0 data (+) MIPI CSI0 lane 1 data (-) MIPI CSI0 lane 1 data (+) SC262R_Series_Hardware_Design 29 / 115 CSI0_LN2_N 160 CSI0_LN2_P 199 CSI0_LN3_N 161 CSI0_LN3_P 200 AI AI AI AI CAM0_MCLK 74 DO DO CAM1_MCLK CAM0_RST CAM0_PWDN CAM1_RST CAM1_PWDN 75 79 80 81 82 Smart Module Series MIPI CSI0 lane 2 data (-) MIPI CSI0 lane 2 data (+) MIPI CSI0 lane 3 data (-) MIPI CSI0 lane 3 data (+) Master clock of camera0 Master clock of camera1 VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. DO Reset of camera0 DO Power down of camera0 DO Reset of camera1 DO Power down of camera1 CAM_I2C_SCL 83 OD CAM_I2C_SDA 84 OD CAM2_MCLK 165 DO I2C clock of front and rear cameras I2C data of front and rear cameras Master clock of camera2 CAM2_RST 164 DO Reset of camera2 CAM2_PWDN 163 DO DCAM_I2C_SCL 166 OD DCAM_I2C_SDA 205 OD Keypad Interfaces Power down of camera2 I2C clock of depth camera I2C data of depth camera Externally pull them up to 1.8 V. VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. Externally pull them up to 1.8 V. Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 114 DI Turn on/off the module VILmax = 0.63 V VIHmin = 1.17 V Pulled up to 1.8 V internally. Active low. SC262R_Series_Hardware_Design 30 / 115 RESET_N 225 DI Reset the module VOL_UP 95 DI Volume up VILmax = 0.63 V VIHmin = 1.17 V VOL_DOWN 96 DI Volume down VILmax = 0.63 V VIHmin = 1.17 V Smart Module Series Disabled by default and can be enabled via software configuration. If it is not used, keep it open. Cannot be externally pulled up. 1.8 V power domain. If it is not used, keep it open. Cannot be externally pulled up. 1.8 V power domain. Sensor I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment SENSOR_I2C_ SCL 91 OD I2C clock for external sensor SENSOR_I2C_ SDA 92 OD I2C data for external sensor Charging Interface Dedicated for external sensors. Cannot be used for touch panel, NFC, I2C keyboard, etc. Externally pull them up to 1.8 V. Pin Name Pin No. I/O Description DC Characteristics Comment BAT_SNS 133 AI BAT_THERM 134 AI Sensed battery voltage for charger circuits Battery temperature detect The maximum input voltage is 4.2 V. Internally pulled up. Supports 47 k NTC thermistor by default - externally connect it to the 47 k NTC thermistor. If it is not used, connect it to GND with a 47 k resistor. SC262R_Series_Hardware_Design 31 / 115 BAT_ID 185 AI Battery type detect VI = 0.11.7 V CHG_SEL 127 DI Charging select Smart Module Series Internally pulled down with a 100 k resistor. If it is not used, keep it open. If you use an internal charging chip, keep this pin open. If you use an external charging chip, connect it to GND. ADC Interface Pin Name Pin No. I/O Description DC Characteristics Comment ADC 128 AI General-purpose ADC interface The maximum input voltage is 1.7 V. Antenna Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 87 AIO ANT_DRX 131 ANT_GNSS 4 121 AI AI ANT_WIFI/BT 77 AIO GPIO Interfaces Main antenna interface Rx-diversity antenna interface GNSS antenna interface Wi-Fi/Bluetooth antenna interface 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment GPIO_33 GPIO_25 GPIO_130 GPIO_45 33 90 97 98 DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output 4 SC262R-WF does not support GNSS. VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.4 V 1.8 V power domain. SC262R_Series_Hardware_Design 32 / 115 Smart Module Series GPIO_48 99 DIO GPIO_59 100 DIO GPIO_12 101 DIO GPIO_13 102 DIO GPIO_95 103 DIO GPIO_94 104 DIO GPIO_87 105 DIO GPIO_66 106 DIO GPIO_43 107 DIO GPIO_63 108 DIO GPIO_44 109 DIO GPIO_42 110 DIO GPIO_93 112 DIO GPIO_46 113 DIO GPIO_89 115 DIO GPIO_23 116 DIO GPIO_22 117 DIO GPIO_21 118 DIO GPIO_20 119 DIO GPIO_62 123 DIO GPIO_47 124 DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output SC262R_Series_Hardware_Design 33 / 115 GPIO_6 167 DIO GPIO_7 168 DIO GPIO_127 169 DIO GPIO_34 170 DIO GPIO_90 177 DIO GPIO_39 201 DIO GPIO_86 239 DIO GPIO_88 264 DIO GPIO_85 265 DIO GPIO_61 267 DIO GNSS LNA Enable Interface General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output Smart Module Series Cannot be pulled up during power-on. 1.8 V power domain. 1.8 V power domain. Pin Name Pin No. I/O Description DC Characteristics Comment GNSS_LNA_EN 194 DIO GNSS LNA enable control Antenna Tuner Control Interface Cannot be multiplexed into a generic GPIO. Pin Name Pin No. I/O Description DC Characteristics Comment RFFE3_CLK 260 DIO RFFE3_DATA 262 DIO USB_BOOT Control Interface Used for external MIPI IC Control Used for external MIPI IC Control Cannot be multiplexed into generic GPIOs. Pin Name Pin No. I/O Description DC Characteristics Comment SC262R_Series_Hardware_Design 34 / 115 USB_BOOT 46 DI Force the module into emergency download mode Smart Module Series You can force the module to enter emergency download mode by pulling this pin up to LDO5_1V8 during power-on. Vibration Motor Driver Interface Pin Name Pin No. I/O Description DC Characteristics Comment VIB_DRV_N 28 PO Indication Interface Vibration motor driver output control VO = 1.23.1 V IOmax = 175 mA Connect it to the negative pole of the motor. Pin Name Pin No. I/O Description DC Characteristics Comment CHG_LED 195 AO Other Interfaces Indicates the module's charging status IOmax = 5 mA Pin Name Pin No. I/O Description DC Characteristics Comment NFC_CLK 181 DO NFC clock NFC_CLK_REQ 182 DI CBL_PWR_N 186 DI NFC clock request Cable power-on;

initiates power on when grounded Reserved Pins The module cannot be turned off when this pin is pulled down. If it is not used, keep it open. Pin Name Pin No. Comment RESERVED 150152, 173175, 178180, 183, 184, 192, 232, 242, 246, 249, 252254, 257, 263, 270 Keep these pins open. SC262R_Series_Hardware_Design 35 / 115 Smart Module Series 3.4. Power Supply 3.4.1. Power Supply Pins SC262R series module provides two VBAT_RF pins and two VBAT_BB pins for connection with the external power supply. The VBAT_RF pins are used for the RF part of the module and the VBAT_BB pins are used for the baseband part of the module. 3.4.2. Voltage Stability Requirements The power supply range of the module is 3.554.2 V, and the recommended value is 3.8 V. The power supply performance, such as load capacity, voltage ripple, etc. directly influences the modules performance and stability. Under ultimate conditions, the transient peak current of the module may surge up to 3 A. If the power supply capacity is not sufficient, there will be the risk that the voltage drops below 3.1 V and as a result the module powers off automatically. Therefore, make sure the input voltage never drops below 3.1 V. Figure 3: Power Supply Limits during Burst Transmission To decrease voltage drop, use a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ), and reserve a multi-layer ceramic chip capacitor (MLCC) array due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) to compose the MLCC array and place these capacitors close to VBAT_BB/VBAT_RF pins. Additionally, add a 4.7 F capacitor in parallel. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT trace should be no less than 3 mm. In principle, the longer the VBAT trace is, the wider it should be. In addition, in order to get a stable power source, it is suggested to use a TVS and place it as close to the VBAT_BB/VBAT_RF pins as possible to enhance surge protection. The following figure shows the star structure of the power supply. SC262R_Series_Hardware_Design 36 / 115 Power Supply (V)Burst TransmissionRippleDropBurst TransmissionLoad (A) Smart Module Series Figure 4: Star Structure of the Power Supply 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of SC262R series module should be able to provide sufficient current of at least 3 A. If the voltage drop between the input and output is not too high, it is suggested to use an LDO to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is recommended. The following figure shows a reference design for +5 V input power source. The typical output voltage is 3.8 V and the maximum load current is 5.0 A. Figure 5: Reference Circuit of Power Supply NOTE 1. It is recommended to switch off the power supply when the module is in abnormal state, and then switch on the power to restart the module. SC262R_Series_Hardware_Design 37 / 115 ModuleVBAT_RFVBAT_BBVBATC1100 FC6100 nFC733 pFC810 pF+C3100 nFC433 pFC510 pFD1C9100 F+C24.7 FGNDD2DC_INC1C2U1INOUTENGNDADJ24135VBAT 100 nFC3470 FC4100 nFR2100K47KR3470 F470R51KR4R11%1 %

2. The module supports battery charging by default. If the above power supply design is adopted, make sure the charging function is disabled by software, or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply chip. Smart Module Series 3.5. Turn On and Off 3.5.1. Turn On with PWRKEY The module can be turned on by driving the PWRKEY pin low for at least 1.6 s. The PWRKEY pin is pulled up to 1.8 V internally. It is recommended to use an open drain/collector driver to control PWRKEY. A simple reference circuit is illustrated in the following figure. Figure 6: Turn On the Module Using Driving Circuit The other way to control PWRKEY is using a button directly. You must place a TVS component nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 7: Turn On the Module Using Button SC262R_Series_Hardware_Design 38 / 115 Turn on pulsePWRKEY4.7K47K>1.6 sR1R2Q1R31KPWRKEYS1Close to S1TVS1K The turning-on scenario is illustrated in the following figure. Smart Module Series Figure 8: Timing of Turning On the Module NOTE 1. When the module is powered on for the first time, its timing of turning on may be different from that shown above. 2. Make sure that VBAT is stable before pulling down PWRKEY. It is recommended to wait until VBAT to be stable at 3.8 V for at least 30 ms before pulling down PWRKEY. Additionally, PWRKEY cannot be kept pulling down all the time. 3.5.2. Turn Off the Module Drive the PWRKEY pin low for at least 1 s, and then choose to turn off the module when the prompt window comes up. You can also force the module to power off by driving PWRKEY low for at least 8 s. The forced power-down scenario is illustrated in the following figure. SC262R_Series_Hardware_Design 39 / 115 VBAT(Typ. 3.8 V)PWRKEY> 1.6 sOthersLDO5_1V838 sLDO6_1V847 msSoftware controlledLDO17_2V85ActiveNote2Software controlled Smart Module Series Figure 9: Timing of Turning Off the Module 3.6. VRTC Interface The RTC (Real Time Clock) can be powered by an external power source through VRTC when the module is powered down and there is no power supply for VBAT. The external power source can be a rechargeable battery (such as a coin cell) according to application demands. A reference circuit design is shown below. Figure 10: RTC Powered by Coin Cell If RTC is ineffective, it can be synchronized through the network after the module is powered on. The recommended input voltage range for VRTC is 2.03.25 V and the recommended typical value is 3.0 V. 3.7. Power Output SC262R series module supports output of regulated voltages for peripheral circuits. During application, it is recommended to connect a 33 pF and a 10 pF capacitor in parallel in the circuit to suppress high-frequency noise. SC262R_Series_Hardware_Design 40 / 115 VBATPWRKEYOthers> 8 sPower downCoin CellModuleRTC CoreVRTC Table 7: Power Description Pin Name Default Voltage (V) Driving Current (mA)

@ Idle State Smart Module Series LDO5_1V8 LDO6_1V8 5 LDO10_2V85 LDO17_2V85 LDO16_2V8 1.8 1.8 2.85 2.85 2.8 SD_LDO12 1.8/2.95 SD_LDO11 2.95 USIM1_VDD 1.8/2.95 USIM2_VDD 1.8/2.95 20 150 150 450 55 50 800 55 55 Keeps ON

3.8. Battery Charging and Management SC262R series module supports battery charging. The battery charger IC in the module supports trickle charging, constant current charging and constant voltage charging modes, which optimize the charging procedure for Li-ion batteries. Trickle charging: There are two steps in this mode. When the battery voltage is below 2.8 V, a 90 mA trickle charging current is applied to the battery. When the battery voltage is charged up and is between 2.8 V and 3.2 V, the charging current can be set to 450 mA maximally. Constant current mode (CC mode): When the battery is increased to 3.24.2 V, the system will switch to CC mode. The maximum charging current is 1.44 A when an adapter is used for battery charging, and the maximum charging current is 450 mA for USB charging. Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.2 V, the system will switch to CV mode and the charging current will decrease gradually. When the battery level reaches 100 %, charging is completed. 5 When the module is in sleep mode, LDO6_1V8 wakes up periodically or randomly. Considering the actual requirement for power consumption during sleep mode, you can use either LDO6_1V8 or an external LDO for power supply. If you require lower power consumption during sleep mode, use an external LDO for power supply. SC262R_Series_Hardware_Design 41 / 115 Smart Module Series Table 8: Pin Definition of Charging Interface Pin Name Pin No. I/O Description Comment BAT_SNS 133 AI Sensed battery voltage for charger circuits BAT_THERM 134 AI Battery temperature detect BAT_ID 185 AI Battery type detect CHG_SEL 127 DI Charging select The maximum input voltage is 4.2 V. Internally pulled up. Supports 47 k NTC thermistor by default - externally connect it to the 47 k NTC thermistor. If it is not used, connect it to GND with a 47 k resistor. Internally pulled down with a 100 k resistor. If it is not used, keep it open. If you use an internal charging chip, keep this pin open. If you use an external charging chip, connect it to GND. SC262R series module supports battery temperature detection in the condition that the battery integrates a thermistor (47 k 1 % NTC thermistor with a B-constant of 4050 K by default) and the thermistor is connected to BAT_THERM pin. If the BAT_THERM pin is not connected, there will be malfunctions such as battery charging failure, battery level display error, etc. The default battery temperature range is

-3.0 C to 48.5 C. A reference design for the battery charging circuit is shown below. Figure 11: Reference Design for Battery Charging Circuit Mobile devices such as mobile phones or handheld POS systems are powered by batteries. For different SC262R_Series_Hardware_Design 42 / 115 GNDBAT_SNSBAT_THERMVBAT0R100 FNTCVBAT33 pF1 FESDESD123USB_VBUSAdapter or USBModuleBatteryGNDC1C2C3R1D1D21 FC2NM_1 nFC4 Smart Module Series batteries, you should modify the charging and discharging curve correspondingly to achieve the best performance. If the thermistor is not available in the battery, or an adapter is utilized to power the module, you must connect BAT_THERM to GND via a 47 k resistor. Otherwise, the system may mistakenly judge that the battery temperature is abnormal, and therefore cause battery charging failure. BAT_SNS must be connected. Otherwise, the module will have abnormalities in voltage detection, as well as associated problems with power-on/off and battery charging/discharging. 3.9. USB Interface SC262R series module provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface supports USB OTG and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 9: Pin Definition of USB Interface Pin Name Pin No. I/O Description USB_VBUS 141, 142 PI Charging power input. USB 5 V power input. USB/adaptor insertion detection. USB_DM 13 AIO USB 2.0 differential data (-) USB_DP 14 AIO USB 2.0 differential data (+) Comment Vmax = 6.2 V Vmin = 4.35 V Vnom = 5.0 V USB 2.0 standard compliant. 90 differential impedance. USB_ID 16 DI USB ID detect High level by default. For the design of USB 2.0 interface, it is recommended to connect USB_ID directly to the USB_ID pin of the external USB port for USB ID detection. When you insert a device into the external USB port, the USB_ID pin of the module will be pulled down to make the module enter host mode. You can choose either to support USB OTG or not. The following figures show the reference designs. SC262R_Series_Hardware_Design 43 / 115 Smart Module Series Figure 12: USB Interface Reference Design (OTG Not Supported) Figure 13: USB Interface Reference Design (OTG Supported) In order to ensure USB performance, comply with the following principles when designing the USB interface. Route the USB signal traces as a differential pair with total grounding. The impedance of USB differential trace should be controlled to 90 . Keep the ESD protection devices as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection devices on USB data lines. Typically, the capacitance value should be less than 2 pF. Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer SC262R_Series_Hardware_Design 44 / 115 USB_DPUSB_DMUSB_VBUS12345USB_DPUSB_DMVUSBUSB_IDGNDGNDGNDGNDGND6789100 nFModuleC1D1D2D3ESDESDESDGND10 FENVINSWNCVOUTVOUT451786293AGNDPGNDPGND10K22 F/10 V1.0 H USB_DPUSB_DMUSB_VBUSUSB_ID12345USB_DPUSB_DMVUSBUSB_IDGNDGNDGNDGNDGND6789100 nFModuleVBATGPIOVBATC1C2L1U1R1C3D1D2D3D4ESDESDESDESDGND and with ground planes above and below. Make sure the trace length difference between USB 2.0 differential data signals is less than 0.7 mm. Smart Module Series Table 10: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (DP - DM) 13 14 USB_DM USB_DP 32.25 32.15

-0.10 3.10. UART Interfaces SC262R series module provides three UART interfaces and supports up to 4 Mbps:

UART5: 4-wire UART interface, and hardware flow control is supported UART2 (debug UART): 2-wire UART interface, used for debugging by default UART1: 2-wire UART interface Table 11: Pin Definition of UART Interfaces Pin Name Pin No. I/O Description Comment UART5_TXD 34 DO UART5 transmit UART5_RXD 35 UART5_CTS 36 DI DI UART5 receive DCE clear to send UART5_RTS 37 DO DCE request to send DBG_RXD 93 DI DBG_TXD 94 DO UART2 receive

(debug UART by default) UART2 transmit

(debug UART by default) UART1_RXD 153 DI UART1 receive UART1_TXD 154 DO UART1 transmit 1.8 V power domain. If not used, keep these pins open. UART5 is a 4-wire UART interface with 1.8 V power domain. You should use a voltage level translator if your application is equipped with a 3.3 V UART interface. The following figure shows the reference SC262R_Series_Hardware_Design 45 / 115 design. Smart Module Series Figure 14: Reference Circuit with Voltage Level Translator Chip (for UART5) The following figure is an example of connection between the module and PC. It is recommended to add a level translator and an RS-232 level translator chip between the module and PC. The following figure shows the reference design. Figure 15: RS-232 Level Match Circuit (for UART5) NOTE UART2 and UART1 are similar to UART5. For the reference design, refer to that of UART5. SC262R_Series_Hardware_Design 46 / 115 VCCAVCCBOEA1A2A3A4GNDB1B2B3B4LDO5_1V8UART5_RTSUART5_RXDUART5_CTSUART5_TXDRTS_3.3VRXD_3.3VCTS_3.3VTXD_3.3VVDD_3.3VC1100 pFC2U1100 pFRTS_3.3VRXD_3.3VCTS_3.3VTXD_3.3VRTS_1.8VRXD_1.8VCTS_1.8VTXD_1.8VVCCAModuleGNDGND1.8 VVCCB3.3 VDIN1ROUT3ROUT2ROUT1DIN4DIN3DIN2DIN5R1OUTBFORCEON/FORCEOFF/INVALID3.3 VDOUT1DOUT2DOUT3DOUT4DOUT5RIN3RIN2RIN1VCCGNDOEDB-9RTSTXDCTSRXDGNDUART5_RXDUART5_TXDUART5_RTSUART5_RXDUART5_CTS Smart Module Series 3.11. (U)SIM Interfaces SC262R series module provides two (U)SIM interfaces that meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the

(U)SIM card is powered by the internal power supply of the module. Table 12: Pin Definition of (U)SIM Interfaces Pin Name I/O Pin No. Description Comment USIM2_DET 17 DI

(U)SIM2 card hot-plug detect USIM2_RST USIM2_CLK USIM2_DATA 18 19 20 DO

(U)SIM2 card reset DO

(U)SIM2 card clock DIO

(U)SIM2 card data USIM2_VDD 21 PO

(U)SIM2 card power supply USIM1_DET 22 DI

(U)SIM1 card hot-plug detect USIM1_RST USIM1_CLK USIM1_DATA 23 24 25 DO

(U)SIM1 card reset DO

(U)SIM1 card clock DIO

(U)SIM1 card data USIM1_VDD 26 PO

(U)SIM1 card power supply Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. Either 1.8 V or 2.95 V (U)SIM card is supported and can be identified automatically by the module. Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs. Either 1.8 V or 2.95 V (U)SIM card is supported and can be identified automatically by the module. SC262R_Series_Hardware_Design 47 / 115 Smart Module Series SC262R series module supports (U)SIM card hot-plug via the USIM_DET pin. (This function is disabled by default via software. To enable it, contact Quectel Technical Supports to change the software configuration.) A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below. Figure 16: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector If you do not need to use USIM_DET, keep this pin open. The following is a reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector. Figure 17: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to ensure good performance and avoid damage of (U)SIM cards, follow the criteria listed below during (U)SIM circuit design:

Place the (U)SIM card connector as close to the module as possible. Keep the trace length as short as possible, at most 200 mm. Keep (U)SIM card signals away from RF and VBAT traces. Reserve a filter capacitor for USIM_VDD, and its maximum capacitance should not exceed 1 F. Additionally, place the capacitor near the (U)SIM card connector. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground. USIM_RST also needs ground protection. SC262R_Series_Hardware_Design 48 / 115 USIM_VDDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET22RLDO5_1V8100K100nF(U)SIM Card Connector22pFVCCRSTCLKIOVPPGNDUSIM_VDD10KModuleR1R2C122pF22pFC2C3C4D122R22RR3R4R5USIM_VDDNMR6TVS ArrayModuleUSIM_VDDUSIM_RSTUSIM_CLKUSIM_DATA22R22R22R100 nF(U)SIM card connector22 pFVCCRSTCLKIOVPPGND10KUSIM_VDD22 pF22 pFR1C1D1R2R3R4C2C3C4USIM_VDDNMR5TVS Array Smart Module Series In order to ensure good ESD protection, it is recommended to add a TVS array with parasitic capacitance not exceeding 50 pF. Add 22 resistors in series between the module and (U)SIM card to suppress EMI spurious transmission and enhance ESD protection. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. Add 22 pF capacitors in parallel on USIM_DATA, USIM_CLK and USIM_RST signal lines to filter RF interference, and place them as close to the (U)SIM card connector as possible. Place the reserved pull-up resistors R6 and R5 in Figure 16: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector and Figure 17: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector close to the module. 3.12. SD Card Interface SD Card interface of SC262R series module supports SD 3.0 protocol. The pin definition of SD card interface is shown below. Table 13: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_CLK SD_CMD 39 40 DO SD card clock DIO SD card command SD_DATA0 41 DIO SDIO data bit 0 SD_DATA1 42 DIO SDIO data bit 1 SD_DATA2 43 DIO SDIO data bit 2 SD_DATA3 44 DIO SDIO data bit 3 50 characteristic impedance. SD_DET 45 DI SD card hot-plug detect Active low. SD_LDO11 38 PO SD card power supply Vnom = 2.95 V IOmax = 800 mA SD_LDO12 32 PO 1.8/2.95 V output power supply for SD card pull-up circuits. Vnom = 1.8/2.95 V IOmax = 50 mA A reference circuit for the SD card interface is shown below. SC262R_Series_Hardware_Design 49 / 115 Smart Module Series Figure 18: Reference Circuit for SD Card Interface SD_LDO11 is the power supply for the SD card and can provide up to 800 mA output current. Due to the high output current, it is recommended that the trace width should be at least 0.8 mm. In order to ensure stability of output current, add a 4.7 F and a 33 pF capacitor in parallel near the SD card connector. SD_CMD, SD_CLK, SD_DATA0, SD_DATA1, SD_DATA2, and SD_DATA3 are all high-speed signal lines. In PCB design, control the characteristic impedance of them to 50 , and do not cross them with other traces. It is recommended to route the traces on the inner layer of PCB and keep them of the same length. Additionally, SD_CLK needs ground shielding separately. Layout guidelines:

Control the impedance to 50 10 % and add ground shielding. The trace length difference between SD_CLK and other signal traces like SD_CMD and SD_DATA should not exceed 1 mm. Table 14: SD Card Trace Length Inside the Module Pin No. 39 40 41 42 43 Signal SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 Length (mm) 21.50 21.40 21.45 21.60 21.40 SC262R_Series_Hardware_Design 50 / 115 SD_CMD120KNM_51KSD_DATA3SD_DATA2SD_CLKSD_DATA0SD_DETSD_DATA1P1-DAT2P2-CD/DAT3P3-CMDP4-VDDP5-CLKP8-DAT1GNDP6-VSSP7-DAT0DETECTIVEGNDGNDGND12345678910111213SD_LDO1133R33R33R33R33R33R1K33 pF4.7 FSD_LDO12ModuleR1R2R3R4R5R6NM_51KNM_10KNM_51KNM_51KR7R8R9R10R11R12R13D1D2D3D4D5D6D7D8C1C2SD Card ConnectorLDO5_1V8GNDR140R 44 SD_DATA3 21.35 Smart Module Series 3.13. GPIO Interfaces SC262R series module has abundant GPIO interfaces with a power domain of 1.8 V. The pin definition is listed below. Table 15: Pin Definition of GPIO Interfaces Pin Name Pin No. GPIO No. Default State Comment GPIO_6 GPIO_7 GPIO_12 GPIO_13 GPIO_20 GPIO_21 GPIO_22 GPIO_23 GPIO_25 GPIO_33 GPIO_34 GPIO_39 GPIO_42 GPIO_43 GPIO_44 167 168 101 102 119 118 117 116 90 33 170 201 110 107 109 GPIO_6 B-PD:nppukp 6 GPIO_7 B-PD:nppukp GPIO_12 B-PD:nppukp Wakeup 7 GPIO_13 B-PD:nppukp Wakeup GPIO_20 B-PD:nppukp GPIO_21 B-PD:nppukp Wakeup GPIO_22 B-PD:nppukp GPIO_23 B-PD:nppukp GPIO_25 B-PD:nppukp Wakeup GPIO_33 B-PD:nppukp GPIO_34 B-PD:nppukp Wakeup GPIO_39 B-PD:nppukp GPIO_42 B-PD:nppukp Wakeup GPIO_43 B-PD:nppukp Wakeup GPIO_44 B-PD:nppukp Wakeup 6 B: Bidirectional digital with CMOS input; PD:nppukp = default pull-down with programmable options following the colon

(:). 7 Wakeup: Interrupt pins that can wake up the system. SC262R_Series_Hardware_Design 51 / 115 GPIO_45 GPIO_46 GPIO_47 GPIO_48 GPIO_59 GPIO_61 GPIO_62 GPIO_63 GPIO_66 GPIO_85 GPIO_86 GPIO_87 GPIO_88 GPIO_89 GPIO_90 GPIO_93 GPIO_94 GPIO_95 GPIO_127 GPIO_130 SD_DET TP_INT TP_RST TP_I2C_SCL TP_I2C_SDA 98 113 124 99 100 267 123 108 106 265 239 105 264 115 177 112 104 103 169 97 45 30 31 47 48 Smart Module Series GPIO_45 B-PD:nppukp Wakeup GPIO_46 B-PD:nppukp Wakeup GPIO_47 B-PD:nppukp GPIO_48 B-PD:nppukp Wakeup GPIO_59 B-PD:nppukp Wakeup GPIO_61 B-PD:nppukp Wakeup GPIO_62 B-PD:nppukp Wakeup GPIO_63 B-PD:nppukp Wakeup GPIO_66 B-PD:nppukp GPIO_85 B-PD:nppukp GPIO_86 B-PD:nppukp Wakeup GPIO_87 B-PD:nppukp GPIO_88 B-PD:nppukp GPIO_89 B-PD:nppukp GPIO_90 B-PD:nppukp Wakeup GPIO_93 B-PD:nppukp Wakeup GPIO_94 B-PD:nppukp GPIO_95 B-PD:nppukp GPIO_127 B-PD:nppukp Wakeup GPIO_130 B-PD:nppukp Wakeup GPIO_67 B-PD:nppukp Wakeup GPIO_65 B-PD:nppukp Wakeup GPIO_64 B-PD:nppukp GPIO_11 B-PD:nppukp GPIO_10 B-PD:nppukp SC262R_Series_Hardware_Design 52 / 115 Smart Module Series GPIO_60 B-PD:nppukp GPIO_24 B-PD:nppukp GPIO_26 B-PD:nppukp GPIO_28 B-PD:nppukp Wakeup GPIO_128 B-PD:nppukp Wakeup GPIO_126 B-PD:nppukp Wakeup GPIO_129 B-PD:nppukp GPIO_125 B-PD:nppukp GPIO_27 B-PD:nppukp GPIO_38 B-PD:nppukp Wakeup GPIO_41 B-PD:nppukp Wakeup GPIO_91 B-PD:nppukp Wakeup GPIO_50 B-PD:nppukp Wakeup GPIO_16 B-PD:nppukp GPIO_17 B-PD:nppukp Wakeup GPIO_18 B-PD:nppukp GPIO_19 B-PD:nppukp GPIO_0 B-PD:nppukp GPIO_1 B-PD:nppukp Wakeup 49 50 74 75 79 80 81 82 165 164 163 95 96 34 35 36 37 154 153 LCD_RST LCD_TE CAM0_MCLK CAM1_MCLK CAM0_RST CAM0_PWDN CAM1_RST CAM1_PWDN CAM2_MCLK CAM2_RST CAM2_PWDN VOL_UP VOL_DOWN UART5_TXD UART5_RXD UART5_CTS UART5_RTS UART1_TXD UART1_RXD NOTE For more details about GPIO configuration, see document [2]. 3.14. I2C Interfaces SC262R series module provides four I2C interfaces. All I2C interfaces are open drain signals and SC262R_Series_Hardware_Design 53 / 115 therefore you must pull them up externally. The reference power domain is 1.8 V. The SENSOR_I2C interface only supports sensors of ADSP architecture. CAM_I2C and DCAM_I2C signals are controlled by Linux Kernel code and support connection with devices related to video output. Smart Module Series Table 16: Pin Definition of I2C Interfaces Pin Name Pin No. I/O Description Comment TP_I2C_SCL TP_I2C_SDA CAM_I2C_SCL CAM_I2C_SDA 47 48 83 84 OD TP I2C clock OD TP I2C data Used for touch panel OD I2C clock of front and rear cameras OD I2C data of front and rear cameras Used for camera DCAM_I2C_SCL 166 OD I2C clock of depth camera DCAM_I2C_SDA 205 OD I2C data of depth camera SENSOR_I2C_SCL 91 OD I2C clock for external sensor SENSOR_I2C_SDA 92 OD I2C data for external sensor Used for camera Used for external sensor 3.15. SPI Interfaces SC262R series module provides three SPI interfaces, which are multiplexed from UART and GPIO interfaces. These interfaces can only support master mode and can be used for fingerprint recognition. Table 17: Pin Definition of SPI Interfaces Pin Name Pin No. I/O Description Comment UART5_RXD 35 DI SPI5 data input Can be multiplexed into SPI5_MISO UART5_TXD 34 DO SPI5 data output Can be multiplexed into SPI5_MOSI UART5_RTS 37 DO SPI5 clock Can be multiplexed into SPI5_CLK UART5_CTS 36 DO SPI5 chip select Can be multiplexed into SPI5_CS GPIO_22 117 DO SPI6 chip select Can be multiplexed into SPI6_CS SC262R_Series_Hardware_Design 54 / 115 Smart Module Series GPIO_23 GPIO_20 GPIO_21 GPIO_87 GPIO_85 GPIO_88 GPIO_86 116 119 118 105 265 264 239 DO SPI6 clock Can be multiplexed into SPI6_CLK DO SPI6 data output Can be multiplexed into SPI6_MOSI DI SPI6 data input Can be multiplexed into SPI6_MISO DO SPI7 chip select Can be multiplexed into SPI7_CS DO SPI7 data output Can be multiplexed into SPI7_MOSI DO SPI7 clock Can be multiplexed into SPI7_CLK DI SPI7 data input Can be multiplexed into SPI7_MISO 3.16. ADC Interface SC262R series module supports one Analog-to-Digital Converter (ADC) interface. The ADC interface supports resolution of up to 15 bits. The pin definition is shown below. Table 18: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC 128 AI General-purpose ADC interface The maximum input voltage is 1.7 V. 3.17. Vibration Motor Driver Interface The pin definition of the Vibration Motor Driver Interface is listed below. Table 19: Pin Definition of Vibration Motor Driver Interface Pin Name Pin No. I/O Description Comment VIB_DRV_N 28 PO Vibration motor driver output control Connect it to the negative pole of the motor. The motor is driven by an exclusive circuit, and the reference circuit is shown below. SC262R_Series_Hardware_Design 55 / 115 Smart Module Series Figure 19: Reference Circuit for Motor Connection When the motor stops working and the VIB_DRV_N is disconnected, the redundant electricity on the motor can be discharged from the circuit loop formed by diodes, thus avoiding damage to components. 3.18. LCM Interface SC262R series module provides one LCM interface, which is MIPI_DSI standard compliant. The interface supports high-speed differential data transmission and supports HD+ display (1440 720 @ 60 fps). The pin definition of the LCM interface is shown below. Table 20: Pin Definition of LCM Interface Pin Name Pin No. I/O Description Comment LDO17_2V85 129 PO 2.85 V output power supply for LCM VCC PWM LCD_RST LCD_TE DSI_CLK_N DSI_CLK_P DSI_LN0_N 29 49 50 52 53 54 DO PWM output DO LCD reset DI AO AO AO LCD tearing effect LCD MIPI clock (-) LCD MIPI clock (+) LCD MIPI data 0 (-) Vnom = 2.85 V IOmax = 450 mA Adjusts backlight brightness 1.8 V power domain SC262R_Series_Hardware_Design 56 / 115 VIB_DRV_N143V3ModuleVIB+MotorVIB-1 FNMD1C1C2 Smart Module Series DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N DSI_LN3_P 55 56 57 58 59 60 61 AO AO AO AO AO AO AO LCD MIPI data 0 (+) LCD MIPI data 1 (-) LCD MIPI data 1 (+) LCD MIPI data 2 (-) LCD MIPI data 2 (+) LCD MIPI data 3 (-) LCD MIPI data 3 (+) SC262R_Series_Hardware_Design 57 / 115 A reference circuit for the LCM interface is shown below. Smart Module Series Figure 20: Reference Circuit Design for LCM Interface MIPI are high-speed signal lines. It is recommended to add common-mode filters in series near the LCM connector, to improve protection against electromagnetic radiation interference. It is recommended to read the LCM ID register through MIPI when compatible design with other displays is required. If several LCMs share the same IC, it is recommended that the LCM factory should burn an OTP register to distinguish different screens. You can also connect the LCD_ID pin of LCM to the ADC pin of the module, but you need to make sure that the output voltage of LCD_ID should not exceed the voltage range of the ADC pin. You can design the external backlight driving circuit for LCM according to actual requirements. A reference circuit design is shown in the following figure, in which the PWM pin is used to adjust the backlight brightness. SC262R_Series_Hardware_Design 58 / 115 DSI_CLK_PLEDANCLEDKLPTENC (SDA-TP) VIO18NC (VTP-TP) DSI_LN3_PLCD_TELCD_RSTDSI_LN3_NDSI_LN2_P_CLK_NDSI_LN2_NRESETLCD_IDNC (SCL-TP) NC (RST-TP) NC (EINT-TP) GNDVCC28GNDMIPI_TDP3MIPI_TDN3GNDMIPI_TDP2MIPI_TDN2GNDMIPI_TDP1MIPI_TDN1GNDLDO17_2V85LDO6_1V8LCM_LED+LCM_LED-1234567891012131415161718192021222324252627MIPI_TDP0MIPI_TDN0GNDMIPI_TCPMIPI_TCN2928303456345634563456DSI_LN1_NDSI_LN1_PDSI_LN0_NDSI_LN0_P1234561112121212100nF4.7F1FModuleLCMFL1FL2FL3FL4FL5EMI filterC3C2C1NCGNDGNDGNDGNDGPIO_6131323334DSIOUTGNDINEN1.8 VVBAT1F10KGND Smart Module Series Figure 21: Reference Design for External Backlight Driving Circuit 3.19. Touch Panel Interface SC262R series module provides one I2C interface for connection with Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The definitions of TP interface pins are illustrated below. Table 21: Pin Definition of Touch Panel Interface Pin Name Pin No. I/O Description Comment LDO17_2V85 129 PO LDO6_1V8 125 PO 2.85 V output power supply for TP VDD Vnom = 2.85 V IOmax = 450 mA 1.8 V output power supply for TP I/O power domain and I2C pull-up circuit Vnom = 1.8 V IOmax = 150 mA TP_INT TP_RST 30 31 DI TP interrupt DO TP reset TP_I2C_SCL 47 OD TP I2C clock TP_I2C_SDA 48 OD TP I2C data A reference circuit for the TP interface is shown below. 1.8 V voltage domain. 1.8 V voltage domain. Active low. Externally pull them up to 1.8 V. Can be used for other I2C devices. SC262R_Series_Hardware_Design 59 / 115 LCM_LED+PWMModule2.2 FBacklight driverLCM_LED-VBATC1 Smart Module Series Figure 22: Reference Circuit Design for TP Interface 3.20. Camera Interfaces Based on MIPI_CSI standard, SC262R series module supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane + 1-lane), and the maximum pixel of the camera can be up to 13 MP. The video and photo quality is determined by various factors such as the camera sensor, camera lens quality, etc. Table 22: Pin Definition of Camera Interface Pin Name Pin No. I/O Description Comment LDO6_1V8 125 PO LDO17_2V85 129 PO 1.8 V output power supply for DOVDD of camera Vnom = 1.8 V IOmax = 150 mA 2.85 V output power supply for AVDD of camera Vnom = 2.85 V IOmax = 450 mA CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P 63 64 65 66 67 68 AI AI AI AI AI AI MIPI CSI1 clock (-) MIPI CSI1 clock (+) MIPI CSI1 lane 0 data (-) MIPI CSI1 lane 0 data (+) MIPI CSI1 lane 1 data (-) MIPI CSI1 lane 1 data (+) SC262R_Series_Hardware_Design 60 / 115 TP_RSTTP_I2C_SCLTP_I2C_SDATP_INT1234562.2K2.2KLDO6_1V84.7 F100 nFModuleRESET 1.8 V SCL 1.8 VSDA 1.8 V INT 1.8 V GNDVDD 2.85 V TPR2R1C1C2D1D2D3D4D5LDO17_2V85GND CSI1_LN3_N CSI1_LN3_P CSI1_LN2_N CSI1_LN2_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P CAM0_MCLK CAM1_MCLK CAM0_RST CAM0_PWDN CAM1_RST CAM1_PWDN CAM_I2C_SCL 70 71 72 73 157 196 158 197 159 198 160 199 161 200 74 75 79 80 81 82 83 CAM_I2C_SDA 84 CAM2_MCLK CAM2_RST CAM2_PWDN 165 164 163 AI AI AI AI AI AI AI AI AI AI AI AI AI AI DO DO DO DO DO DO OD OD DO DO DO Smart Module Series 1.8 V power domain. Externally pull them up to 1.8 V. MIPI CSI1 lane 3 data (-) MIPI CSI1 lane 3 data (+) MIPI CSI1 lane 2 data (-) MIPI CSI1 lane 2 data (+) MIPI CSI0 clock (-) MIPI CSI0 clock (+) MIPI CSI0 lane 0 data (-) MIPI CSI0 lane 0 data (+) MIPI CSI0 lane 1 data (-) MIPI CSI0 lane 1 data (+) MIPI CSI0 lane 2 data (-) MIPI CSI0 lane 2 data (+) MIPI CSI0 lane 3 data (-) MIPI CSI0 lane 3 data (+) Master clock of camera0 Master clock of camera1 Reset of camera0 Power down of camera0 Reset of camera1 Power down of camera1 I2C clock of front and rear cameras I2C data of front and rear cameras Master clock of camera2 Reset of camera2 1.8 V power domain. Power down of camera2 SC262R_Series_Hardware_Design 61 / 115 DCAM_I2C_SDA 205 DCAM_I2C_SCL 166 OD OD I2C data of depth camera I2C clock of depth camera Externally pull them up to 1.8 V. Smart Module Series SC262R_Series_Hardware_Design 62 / 115 The following is a reference circuit design for 3-camera applications. Smart Module Series Figure 23: Reference Circuit Design for 3-Camera Applications NOTE In 3-camera applications, CSI1_LN3_P and CSI1_LN3_N are used as CLK_P and CLK_N of camera1, and CSI1_LN2_P and CSI1_LN2_N are used as the LN_P and LN_N of camera1. SC262R_Series_Hardware_Design 63 / 115 camera2 connectorCAM2_PWDNCAM2_MCLKDCAM_I2C_SDADCAM_I2C_SCL_CSI0_LN3_PCSI0_LN3_NCSI0_LN2_PCSI0_LN2_NCSI0_LN1_PCSI0_LN1_NCSI0_LN0_PCSI0_LN0_NCAM0_RSTCAM0_PWDNCAM0_MCLKCSI1_LN3_PCSI1_LN3_NCSI1_LN2_PCSI1_LN2_NCSI1_LN1_PCSI1_LN1_NCSI1_LN0_PCSI1_LN0_NCSI0_CLK_PCSI0_CLK_NCSI1_CLK_PCSI1_CLK_NLDO6_1V82.2K2.2K camera0 connector1 F4.7F4.7 F1 F1 F4.7 FCAM2_RSTCAM1_PWDNCAM1_MCLKCAM_I2C_SDA_CAM_I2C_SCLCAM1_RSTcamera1 connector AVDDDVDDDOVDDEMIEMIEMIEMIEMIEMIEMIEMI1F2.2K2.2KDVDDEMIEMI4.71FFAVDDDOVDDOUTGNDINENLDOVBAT1FAF_VDDOUTGNDINENLDOVBATGPIO1FLDO17_2V85GPIO Smart Module Series 3.20.1. Design Considerations Special attention should be paid to the pin definition of LCM/camera connectors. Make sure the module and the connectors are correctly connected. MIPI are high speed signal lines, supporting maximum data rate of up to 2.1 Gbps. The differential impedance should be controlled to 100 . Additionally, it is recommended to route the trace on the inner layer of PCB, and do not cross it with other traces. For the same group of DSI or CSI signals, keep all the MIPI traces of the same length. In order to avoid crosstalk, keep a distance of 1.5 times the trace width among MIPI signal lines. During impedance matching, do not connect GND on different planes to ensure impedance consistency. It is recommended to select a low-capacitance TVS for ESD protection and the recommended parasitic capacitance should be below 1 pF. Route MIPI traces according to the following rules:

a) The total trace length should not exceed 305 mm;

b) Control the differential impedance to 100 10 %;

c) Control intra-lane length difference within 0.67 mm;

d) Control inter-lane length difference within 1.3 mm. Table 23: MIPI Trace Length Inside the Module Pin Name Pin No. Length (mm) Length Difference (P - N) 52 53 54 55 56 57 58 59 60 61 63 64 DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N DSI_LN3_P CSI1_CLK_N CSI1_CLK_P 12.40 12.40 11.75 11.65 9.40 9.30 9.60 9.60 12.35 12.35 18.10 18.05 0.00

-0.10

-0.10 0.00 0.00

-0.05 SC262R_Series_Hardware_Design 64 / 115 Smart Module Series 65 66 67 68 70 71 72 73 157 196 158 197 159 198 160 199 161 200 CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN3_N CSI1_LN3_P CSI1_LN2_N CSI1_LN2_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P 18.05 18.10 18.15 18.20 18.10 18.20 18.05 18.10 22.60 22.55 22.55 22.50 20.25 20.30 20.50 20.50 12.95 12.95 0.05 0.05 0.10 0.05

-0.05

-0.05 0.05 0.00 0.00 SC262R_Series_Hardware_Design 65 / 115 Smart Module Series 3.21. Sensor Interfaces SC262R series module supports communication with sensors via I2C interfaces, and it supports ALS/PS sensor, compass, accelerometer sensor, gyroscopic sensor, etc. Table 24: Pin Definition of Sensor Interfaces Pin Name Pin No. I/O Description Comment Dedicated for external sensors. Cannot be used for touch panel, NFC, I2C keyboard, etc. Externally pull them up to 1.8 V. SENSOR_I2C_SCL 91 OD I2C clock of external sensor SENSOR_I2C_SDA 92 OD I2C data of external sensor GPIO_43 GPIO_44 GPIO_42 GPIO_63 107 109 110 108 DI DI DI DI Light sensor interrupt Direction sensor interrupt Accelerometer sensor interrupt Gyroscopic sensor interrupt 3.22. Audio Interfaces SC262R series module provides three analog input channels and three analog output channels. The following table shows the pin definition. Table 25: Pin Definition of Audio Interfaces Pin Name Pin No. I/O Description Comment MIC1_P MIC_GND MIC2_P 4 5 6 AI Microphone input for channel 1 (+) AI Microphone reference ground AI Microphone input for headset (+) If it is not used, connect it to the ground. SC262R_Series_Hardware_Design 66 / 115 MIC_BIAS2 MIC3_P MIC_BIAS1 EAR_P EAR_N SPK_P SPK_N HPH_R HPH_REF HPH_L HS_DET 155 148 147 8 9 10 11 136 137 138 139 Smart Module Series AO Bias voltage output for microphone 2 VO = 1.62.85 V AI Microphone input for channel 2 (+) AO Bias voltage output for microphone 1 VO = 1.62.85 V AO Earpiece output (+) AO Earpiece output (-) AO Speaker output (+) AO Speaker output (-) AO Headphone right channel output AO Headphone reference ground AO Headphone left channel output AI Headset hot-plug detect High level by default. The module offers three audio input channels, including three single-ended channels. The output voltage range of the two MIC_BIAS is programmable between 1.6 V and 2.85 V, and the maximum output current is 3 mA. The earpiece interface uses differential output. The loudspeaker interface uses differential output as well. The output channel is available with a Class-D amplifier whose output power is 1362 mW when the load is 8 . The headphone interface features stereo left and right channel output, and supports headphone insertion detect. 3.22.1. Reference Circuit Design for Microphone Interfaces Figure 24: Reference Circuit Design for ECM Microphone Interface SC262R_Series_Hardware_Design 67 / 115 MIC1_PECM MICR2R1ModuleD1MIC_GND33 pFC10R0RR30R Smart Module Series Figure 25: Reference Circuit Design for MEMS Microphone Interface 3.22.2. Reference Circuit Design for Earpiece Interface Figure 26: Reference Circuit Design for Earpiece Interface 3.22.3. Reference Circuit Design for Headset Interface Figure 27: Reference Circuit Design for Headset Interface SC262R_Series_Hardware_Design 68 / 115 MIC3_P33 pFMEMS MICR2R1C2ModuleMIC_GND0RC1MIC_BIAS11234F1D1OUTGNDGNDVDD100 nFC40R33 pFEAR_PEAR_NR233 pF33 pF33 pFC2C3C1R1ModuleD1D20R0R20KESDMIC_GNDMIC2_PHPH_LHS_DETHPH_RHPH_REF33 pFModuleR10R63452133 pF33 pFC3C4C5F3F2F1D1D2D3D4F4R2R30R 3.22.4. Reference Circuit Design for Loudspeaker Interface Smart Module Series Figure 28: Reference Circuit Design for Loudspeaker Interface 3.22.5. Design Considerations for Audio Interfaces It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) to filter out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied to filter out RF interference when the module is transmitting at EGSM900. Without this capacitor, TDD noise could be heard during voice calls. The 10 pF capacitor is used to filter out RF interference at DCS1800. Please note that the resonant frequency point of a capacitor largely depends on its material and manufacturing technique. Therefore, you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high-frequency noises. The severity of RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, you should select a suitable capacitor according to the test results. Sometimes, even no RF filtering capacitor is required. In order to decrease radio or other signal interference, place RF antennas away from audio interfaces and audio traces. Additionally, keep power traces far away from the audio traces and do not route them in parallel. Route the differential audio traces according to the differential signal layout rule. 3.23. USB_BOOT Control Interface USB_BOOT is an emergency download interface. You can force the module to enter emergency download mode by pulling it up to LDO5_1V8 during power-on. This is an emergency option when failures SC262R_Series_Hardware_Design 69 / 115 EARPEARNF2SPK_PSPK_N33 pF33 pFC1C2F1ModuleD1D2 such as abnormal start-up or running occur. For firmware upgrade and debugging in the future, reserve the following reference design. Smart Module Series Figure 29: Reference Circuit Design for USB_BOOT Control Interface SC262R_Series_Hardware_Design 70 / 115 LDO5_1V8S1 ModuleUSB_BOOTR110K Smart Module Series 4 Wi-Fi and Bluetooth SC262R series module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth functions. The interface impedance should be controlled to 50 . You can connect external antennas such as PCB antenna, sucker antenna, and ceramic antenna to the module via the interface to achieve Wi-Fi and Bluetooth functions. 4.1. Wi-Fi SC262R series module supports 2.4 GHz and 5 GHz dual-band WLAN based on IEEE 802.11a/b/g/n/ac standard protocols. The maximum data rate is up to 433 Mbps. The features are as below:

Supports Wake-on-WLAN (WoWLAN) Supports ad hoc mode Supports WAPI SMS4 hardware encryption Supports AP mode Supports Wi-Fi Direct Supports MCS 09 for VHT20, VHT40 and VHT80 4.1.1. Wi-Fi Performance The following table lists the Wi-Fi transmitting and receiving performance of the module. Table 26: Wi-Fi Transmitting Performance Standard 802.11b 802.11b Rate 1 Mbps Output Power 16 dBm 2.5 dB 11 Mbps 16 dBm 2.5 dB 2.4 GHz 802.11g 6 Mbps 16 dBm 2.5 dB 802.11g 54 Mbps 14 dBm 2.5 dB 802.11n HT20 MCS0 15 dBm 2.5 dB SC262R_Series_Hardware_Design 71 / 115 802.11n HT20 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11ac VHT20 802.11ac VHT20 802.11ac VHT40 802.11ac VHT40 802.11ac VHT80 802.11ac VHT80 5 GHz Table 27: Wi-Fi Receiving Performance Standard 802.11b 802.11b 802.11g 2.4 GHz 802.11g 802.11n HT20 802.11n HT20 802.11n HT40 Smart Module Series MCS7 MCS0 MCS7 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB 6 Mbps 15 dBm 2.5 dB 54 Mbps 13 dBm 2.5 dB MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 MCS0 MCS9 Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS0 MCS7 MCS0 14 dBm 2.5 dB 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB 14 dBm 2.5 dB 12 dBm 2.5 dB 14 dBm 2.5 dB 12 dBm 2.5 dB Sensitivity

-97 dBm

-89 dBm

-91 dBm

-74 dBm

-90 dBm

-71 dBm

-88 dBm SC262R_Series_Hardware_Design 72 / 115 Smart Module Series 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11ac VHT20 802.11ac VHT20 802.11ac VHT40 802.11ac VHT40 802.11ac VHT80 802.11ac VHT80 MCS7 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 MCS0 MCS9 5 GHz

-69 dBm

-91 dBm

-75 dBm

-90 dBm

-72 dBm

-88 dBm

-69 dBm

-85 dBm

-61 dBm

-88 dBm

-64 dBm 1-91 dBm

-69 dBm Reference specifications are listed below:

IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11a, IEEE Std 802.11b, IEEE Std 802.11g: IEEE 802.11-2007 WLAN MAC and PHY, June 2007 4.2. Bluetooth SC262R series module supports Bluetooth 4.2 (BR/EDR + BLE) specification, as well as GFSK, 8-DPSK,

/4-DQPSK modulation modes. Maximally supports up to 7 wireless connections. Maximally supports up to 3.5 piconets at the same time. Support one SCO or eSCO connection. The BR/EDR channel bandwidth is 1 MHz, and can accommodate 79 channels. The BLE channel bandwidth is 2 MHz, and can accommodate 40 channels. SC262R_Series_Hardware_Design 73 / 115 Smart Module Series Table 28: Bluetooth Data Rate and Version Version 1.2 2.0 + EDR 3.0 + HS 4.2 Data Rate Maximum Application Throughput 1 Mbit/s 3 Mbit/s 24 Mbit/s 24 Mbit/s

> 80 kbit/s

> 80 kbit/s Reference 3.0 + HS Reference 4.2 LE Reference specifications are listed below:

Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1 + EDR/3.0/3.0 + HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 4.2.1. Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of SC262R series module. Table 29: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 2-DH5 3-DH5 Transmitting Power 8.5 dBm

-0.5 dBm

-0.54 dBm Receiver Performance Packet Types DH5 Receiving Sensitivity

-92 dBm 2-DH5

-93 dBm 3-DH5

-88 dBm SC262R_Series_Hardware_Design 74 / 115 Smart Module Series 5 GNSS SC262R series module integrates a IZat GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, Galileo and BDS. With an embedded LNA, the module provides greatly improved positioning accuracy. 5.1. GNSS Performance The following table lists the GNSS performance of the module in conduction mode. Table 30: GNSS Performance Parameter Description Conditions Acquisition Autonomous Typ.

-146 Sensitivity Reacquisition Autonomous

-158 Tracking Autonomous

-158 TTFF Cold start

@ open sky Warm start

@ open sky Hot start

@ open sky Accuracy CEP-50 NOTE Autonomous 30.8 Autonomous 21 Autonomous 3.3 Autonomous

@ open sky 2.5 Unit dBm dBm dBm s s s m 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position SC262R_Series_Hardware_Design 75 / 115 successfully within 3 minutes after executing cold start command. 4. SC262R-WF does not support GNSS. Smart Module Series 5.2. Reference Design Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below:

Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference. In user systems, place GNSS RF signal lines and RF components far away from high-speed circuits, switch-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. For applications with harsh electromagnetic environment or high ESD-protection requirements, it is recommended to add ESD protective diodes for the antenna interface. The junction capacitance of the diodes should be less than 0.5 pF. Otherwise, it will influence the impedance characteristic of RF circuit loop, or cause attenuation of bypass RF signals. Control the impedance of feeder lines and PCB traces to 50 , and keep the trace as short as possible. See Chapter 6.3 for reference circuit designs of GNSS antenna. SC262R_Series_Hardware_Design 76 / 115 Smart Module Series 6 Antenna Interfaces SC262R series module provides four antenna interfaces for the main antenna, Rx-diversity antenna, Wi-Fi/Bluetooth antenna and GNSS antenna respectively. The impedance of the antenna ports should be controlled to 50 . Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. 6.1. Main/Rx-diversity Antenna Interfaces The pin definition of main/Rx-diversity antenna interfaces is shown below. Table 31: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_MAIN 87 AIO Main antenna interface ANT_DRX 131 AI Rx-diversity antenna interface 50 impedance The operating frequencies of SC262R series modules are listed in the following tables. 6.1.1. Operating Frequencies Table 32: SC262R-EM Operating Frequencies 3GPP Band GSM850 EGSM900 Receive 869894 925960 Transmit 824849 880915 Unit MHz MHz SC262R_Series_Hardware_Design 77 / 115 Smart Module Series DCS1800 PCS1900 18051880 17101785 19301990 18501910 WCDMA B1 21102170 19201980 WCDMA B2 19301990 18501910 WCDMA B4 21102155 17101755 WCDMA B5 WCDMA B8 869894 925960 824849 880915 LTE-FDD B1 21102170 19201980 LTE-FDD B2 19301990 18501910 LTE-FDD B3 18051880 17101785 LTE-FDD B4 21102155 17101755 LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B8 LTE-FDD B20 925960 791821 LTE-FDD B28 (A + B) 758803 880915 832862 703748 LTE-TDD B38 25702620 25702620 LTE-TDD B40 23002400 23002400 LTE-TDD B41 24962690 24962690 Table 33: SC262R-NA Operating Frequencies 3GPP Band Receive Transmit WCDMA B2 19301990 18501910 WCDMA B4 21102155 17101755 WCDMA B5 869894 824849 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz SC262R_Series_Hardware_Design 78 / 115 Smart Module Series LTE-FDD B2 19301990 18501910 LTE-FDD B4 21102155 17101755 LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 729746 746756 758768 734746 699716 777787 788798 704716 LTE-FDD B25 19301995 18501915 LTE-FDD B26 859894 814849 LTE-FDD B66 21002200 17101780 LTE-FDD B71 663698 617652 LTE-TDD B41 24962690 24962690 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 6.1.2. Reference Design for Main and Rx-diversity Antenna Interfaces A reference circuit design for main and Rx-diversity antenna interfaces is shown below. Reserve a -type matching circuit for each antenna to achieve better RF performance, and place the -type matching components (R1/C1/C2, R2/C3/C4) as close to the antennas as possible. The capacitors are not mounted by default and the resistors are 0 . SC262R_Series_Hardware_Design 79 / 115 Smart Module Series Figure 30: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces 6.2. Wi-Fi and Bluetooth Antenna Interface The following tables show the pin definition and frequency specification of the Wi-Fi/Bluetooth antenna interface. Table 34: Pin Definition of Wi-Fi/Bluetooth Antenna Interface Pin Name Pin No. I/O Description Comment ANT_WIFI/BT 77 AIO Wi-Fi/Bluetooth antenna interface 50 impedance Table 35: Wi-Fi/Bluetooth Frequency Type Wi-Fi (2.4 GHz) Wi-Fi (5 GHz) Bluetooth 4.2 LE Frequency 24022482 51805825 24022480 Unit MHz MHz MHz SC262R_Series_Hardware_Design 80 / 115 ANT_MAINR1 0RC1ModuleMainantennaNMC2NMR2 0RC3DRXantennaNMC4NMANT_DRX A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. C1 and C2 are not mounted by default and the resistor is 0 . Smart Module Series Figure 31: Reference Circuit Design for Wi-Fi/Bluetooth Antenna 6.3. GNSS Antenna Interface & Frequency Bands The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 36: Pin Definition of GNSS Antenna Interface Pin Name Pin No. ANT_GNSS 121 I/O AI Description Comment GNSS antenna interface 50 impedance Table 37: GNSS Frequency Type GPS Frequency 1575.42 1.023 GLONASS 1597.51605.8 1561.098 2.046 1575.42 1.023 BDS Galileo NOTE SC262R-WF does not support GNSS. Unit MHz MHz MHz MHz SC262R_Series_Hardware_Design 81 / 115 ANT_WIFI/BTR1 0RC1ModuleNMC2NMWi-Fi/Bluetooth antenna Smart Module Series 6.3.1. Passive Antenna Reference Design GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Figure 32: Reference Circuit Design for GNSS Passive Antenna NOTE When the passive antenna is placed far away from the module (that is, the antenna trace is long) and the external loss is more than 2 dB, it is recommended to add an external LNA circuit for better GNSS receiving performance, and place the LNA close to the antenna. 6.3.2. Active Antenna Reference Design In any case, it is recommended to use a passive antenna. If active antenna is indeed needed in your application, it is recommended to reserve a -type attenuation circuit provision and use high-performance LDO as the power supply. The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Despite its low power consumption, the active antenna still requires stable and clean power supplies. Therefore, it is recommended to use high-performance LDO as the power supply. A reference design for GNSS active antenna is shown below. SC262R_Series_Hardware_Design 82 / 115 LNAPassive AntennaModuleANT_GNSSNMC1C2L1U1C3C4NM Smart Module Series Figure 33: Reference Circuit Design for GNSS Active Antenna NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 6.4. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 34: Microstrip Design on a 2-layer PCB SC262R_Series_Hardware_Design 83 / 115 Smart Module Series Figure 35: Coplanar Waveguide Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

SC262R_Series_Hardware_Design 84 / 115 Smart Module Series Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. 6.5. Antenna Installation 6.5.1. Antenna Design Requirements The following table shows the requirement on the main antenna, Rx-diversity antenna, Wi-Fi/Bluetooth antenna and GNSS antenna. Table 38: Antenna Design Requirements Type Requirements GSM/WCDMA/LTE Wi-Fi/Bluetooth VSWR: 2 Gain: 1 dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable insertion loss:

< 1 dB: LB (<1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: HB (> 2.3 GHz) VSWR: 2 Gain: 1 dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable Insertion Loss: < 1 dB SC262R_Series_Hardware_Design 85 / 115 Smart Module Series GNSS Frequency range: 15591609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) For passive antenna usage:

Passive Antenna Gain: > 0 dBi For active antenna usage:

Passive Antenna Gain: > 0 dBi Active Antenna Gain: > -2 dBi Active Antenna Noise Figure: < 1.5 dB (Typ.) Active Antenna Embedded LNA Gain: < 17 dB (Typ.) 6.5.2. RF Connector Recommendation If you use an RF connector for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 38: Dimensions of the Receptacle (Unit: mm) SC262R_Series_Hardware_Design 86 / 115 U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT. Smart Module Series Figure 39: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 40: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. SC262R_Series_Hardware_Design 87 / 115 Smart Module Series 7 Electrical Characteristics and Reliability 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 39: Absolute Maximum Ratings Parameter VBAT USB_VBUS Peak Current of VBAT Voltage on Digital Pins Min.

-0.5

-0.5

-0.3 Max. Unit 6 16 3 2.16 V V A V 7.2. Power Supply Ratings Table 40: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT Voltage drop during transmitting burst The actual input voltages must be kept between the minimum and maximum values Maximum power control level at EGSM900 3.55 3.8 4.2 V

400 mV SC262R_Series_Hardware_Design 88 / 115 Smart Module Series IVBAT Peak supply current (during transmission slot) Maximum power control level at EGSM900

1.8 3.0 A USB_VBUS USB power supply 4.35 5.0 6.2 V VRTC Power supply voltage of the backup battery 2.0 3.0 3.25 V 7.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 41: Operating and Storage Temperatures Parameter Min. Operating temperature range

-35 Storage temperature range

-40 Typ.

+25

Max. Unit

+75

+90 C C 7.4. Power Consumption The values of current consumption are shown below. Table 42: SC262R-EM Power Consumption Description Conditions Typ. Unit OFF state Power down GSM/GPRS supply current Sleep (USB disconnected) @ DRX = 2 Sleep (USB disconnected) @ DRX = 5 Sleep (USB disconnected) @ DRX = 9 WCDMA Sleep (USB disconnected) @ DRX = 6 20 3.9 2.9 2.6 4.1 A mA mA mA mA SC262R_Series_Hardware_Design 89 / 115 supply current LTE-FDD supply current LTE-TDD supply current GSM voice call Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 GSM850 @ PCL 5 GSM850 @ PCL 12 GSM850 @ PCL 19 EGSM900 @ PCL 5 EGSM900 @ PCL 12 EGSM900 @ PCL 19 DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 PCS1900 @ PCL 0 PCS1900 @ PCL 7 PCS1900 @ PCL 15 B1 @ max. power B2 @ max. power WCDMA voice call B4 @ max. power B5 @ max. power B8 @ max. power Smart Module Series 3.1 2.8 4.6 3.5 3.0 4.7 3.6 3.0 282.9 116.4 96.7 268.6 155.9 94.6 201.7 155.4 150.3 200.3 155.4 151.1 559.4 583 587.6 511.9 558.7 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC262R_Series_Hardware_Design 90 / 115 GPRS data transfer GSM850 (1UL/4DL) @ PCL 5 GSM850 (2UL/3DL) @ PCL 5 GSM850 (3UL/2DL) @ PCL 5 GSM850 (4UL/1DL) @ PCL 5 EGSM900 (1UL/4DL) @ PCL 5 EGSM900 (2UL/3DL) @ PCL 5 EGSM900 (3UL/2DL) @ PCL 5 EGSM900 (4UL/1DL) @ PCL 5 DCS1800 (1UL/4DL) @ PCL 0 DCS1800 (2UL/3DL) @ PCL 0 DCS1800 (3UL/2DL) @ PCL0 DCS1800 (4UL/1DL) @ PCL 0 PCS1900 (1UL/4DL) @ PCL 0 PCS1900 (2UL/3DL) @ PCL 0 PCS1900 (3UL/2DL) @ PCL0 PCS1900 (4UL/1DL) @ PCL 0 Smart Module Series 278.8 414.2 495.3 598.1 262.4 397 469.3 566 195.5 289 366.5 456.7 186.8 279.2 361.2 453.3 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GSM850 (1UL/4DL) @ PCL 8 210.64 mA GSM850 (2UL/3DL) @ PCL 8 GSM850 (3UL/2DL) @ PCL 8 GSM850 (4UL/1DL) @ PCL 8 EDGE data transfer EGSM900 (1UL/4DL) @ PCL 8 EGSM900 (2UL/3DL) @ PCL 8 EGSM900 (3UL/2DL) @ PCL 8 EGSM900 (4UL/1DL) @ PCL 8 DCS1800 (1UL/4DL) @ PCL 2 337.6 454.4 579.1 209.1 333.5 454.2 578.9 197.3 mA mA mA mA mA mA mA mA SC262R_Series_Hardware_Design 91 / 115 DCS1800 (2UL/3DL) @ PCL 2 DCS1800 (3UL/2DL) @ PCL 2 DCS1800 (4UL/1DL) @ PCL 2 PCS1900 (1UL/4DL) @ PCL 2 PCS1900 (2UL/3DL) @ PCL 2 PCS1900 (3UL/2DL) @ PCL 2 PCS1900 (4UL/1DL) @ PCL 2 B1 (HSDPA) @ max. power B2 (HSDPA) @ max. power B4 (HSDPA) @ max. power B5 (HSDPA) @ max. power B8 (HSDPA) @ max. power B1 (HSUPA) @ max. power B2 (HSUPA) @ max. power B4 (HSUPA) @ max. power B5 (HSUPA) @ max. power B8 (HSUPA) @ max. power LTE-FDD B1 @ max. power LTE-FDD B2 @ max. power LTE-FDD B3 @ max. power LTE-FDD B4 @ max. power LTE-FDD B5 @ max. power LTE-FDD B7 @ max. power LTE-FDD B8 @ max. power LTE-FDD B20 @ max. power WCDMA data transfer LTE data transfer Smart Module Series 304.5 393.4 495.1 184.7 292.2 393.4 496.2 511.3 511.1 550.2 458.4 484.5 524.9 566.8 566.2 493.1 522.3 728.1 723 732.4 758.7 615.5 826.9 642.7 677.9 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC262R_Series_Hardware_Design 92 / 115 LTE-FDD B28 @ max. power LTE-TDD B38 @ max. power LTE-TDD B40 @ max. power LTE-TDD B41 @ max. power Smart Module Series 764.5 448.4 432.7 444.2 mA mA mA mA Table 43: SC262R-NA Power Consumption Description Conditions Typ. Unit OFF state Power down WCDMA supply current LTE-FDD supply current LTE-TDD supply current Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 8 Sleep (USB disconnected) @ DRX = 9 B2 @ max. power WCDMA voice call B4 @ max. power B5 @ max. power B2 (HSDPA) @ max. power B4 (HSDPA) @ max. power WCDMA data transfer B5 (HSDPA) @ max. power B2 (HSUPA) @ max. power B4 (HSUPA) @ max. power 8 3.698 2.711 2.566 6.698 3.509 3.011 6.954 3.611 2.897 603.0 659.3 586.1 617.1 608.5 541.7 631.8 608.8 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC262R_Series_Hardware_Design 93 / 115 B5 (HSUPA) @ max. power LTE-FDD B2 @ max. power LTE-FDD B4 @ max. power LTE-FDD B5 @ max. power LTE-FDD B7 @ max. power LTE-FDD B12 @ max. power LTE-FDD B13 @ max. power LTE data transfer LTE-FDD B14 @ max. power LTE-FDD B17@ max. power LTE-FDD B25 @ max. power LTE-FDD B26 @ max. power LTE-FDD B66 @ max. power LTE-FDD B71 @ max. power LTE-TDD B41 @ max. power Smart Module Series 553.3 729.9 727.8 581.1 850.7 734.9 721.7 700 763.5 771.9 659.5 718.6 688.1 469.1 mA mA mA mA mA mA mA mA mA mA mA mA mA mA 7.5. Tx Power The following tables show the RF output power of SC262R series module. Table 44: SC262R-EM RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850 EGSM900 DCS1800 PCS1900 33 dBm 2 dB 5 dBm 5 dB 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB WCDMA B1 24 dBm +1/-3 dB

< -49 dBm SC262R_Series_Hardware_Design 94 / 115 Smart Module Series 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB LTE-FDD B20 23 dBm 2 dB LTE-FDD B28 23 dBm 2 dB LTE-TDD B38 23 dBm 2 dB LTE-TDD B40 23 dBm 2 dB LTE-TDD B41 23 dBm 2 dB Table 45: SC262R-NA RF Output Power

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm Frequency Bands Max. RF Output Power Min. RF Output Power WCDMA B2 WCDMA B4 WCDMA B5 LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 24 dBm +1/-3 dB

< -49 dBm 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm SC262R_Series_Hardware_Design 95 / 115 Smart Module Series LTE-FDD B7 23 dBm 2 dB LTE-FDD B12 23 dBm 2 dB LTE-FDD B13 23 dBm 2 dB LTE-FDD B14 23 dBm 2 dB LTE-FDD B17 23 dBm 2 dB LTE-FDD B25 23 dBm 2 dB LTE-FDD B26 23 dBm 2 dB LTE-FDD B66 23 dBm 2 dB LTE-FDD B71 23 dBm 2 dB LTE-TDD B41 23 dBm 2 dB

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm

< -39 dBm NOTE In GPRS 4-slot Tx mode, the maximum output power is reduced by 3 dB. This design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 7.6. Rx Sensitivity The following table shows the RF receiving sensitivity of SC262R series module. Table 46: SC262R-EM RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO GSM850 EGSM900 DCS1800 PCS1900

-110.6

-110.2

-108.9

-109

3GPP (SIMO)

-102.4 dBm

-102.4 dBm

-102.4 dBm

-102.4 dBm SC262R_Series_Hardware_Design 96 / 115 WCDMA B1

-109.5 WCDMA B2 WCDMA B4

-110

-110

-111 109.5

-109.5 WCDMA B5

-111.5

-111 WCDMA B8

-111

-111.5 LTE-FDD B1 (10 MHz)

-98.2 LTE-FDD B2 (10 MHz)

-98.2 LTE-FDD B3 (10 MHz)

-97.8 LTE-FDD B4 (10 MHz)

-98.2

-99.5

-98.2

-97.8

-99.5 LTE-FDD B5 (10 MHz)

-100

-100.5 LTE-FDD B7 (10 MHz)

-97.3 LTE-FDD B8 (10 MHz)

-99.5 LTE-FDD B20 (10 MHz)

-99.5 LTE-FDD B28 (10 MHz)

-98.3 LTE-TDD B38 (10 MHz)

-98 LTE-TDD B40 (10 MHz)

-99

-97.5

-100

-100.2

-99.5

-98

-99 LTE-TDD B41 (10 MHz)

-97.3

-97.2 Table 47: SC262R-NA RF Receiving Sensitivity Smart Module Series TBD TBD TBD TBD TBD

-100.5

-100.5

-100

-101.5

-101.5

-100

-102.5

-102.5

-101.5

-100.5

-101.5

-99.5

-106.7 dBm

-104.7 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm

-96.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-94.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-94.8 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO WCDMA B2

-109.5 WCDMA B4 WCDMA B5

-110

-111 LTE-FDD B2 (10 MHz)

-98.6

-110

-110

-111.5

-99.3 TBD TBD TBD

-99 3GPP (SIMO)

-104.7 dBm

-106.7 dBm

-104.7 dBm

-94.3 dBm SC262R_Series_Hardware_Design 97 / 115 Smart Module Series LTE-FDD B4 (10 MHz)

-98.4 LTE-FDD B5 (10 MHz)

-99.8 LTE-FDD B7 (10 MHz)

-97.6 LTE-FDD B12 (10 MHz)

-98.8 LTE-FDD B13 (10 MHz)

-99.8 LTE-FDD B14 (10 MHz)

-98.9 LTE-FDD B17 (10 MHz)

-97.6 LTE-FDD B25 (10 MHz)

-98.4

-98.9

-100.9

-98.9

-98.8

-99.3

-98.8

-99

-99.3 LTE-FDD B26 (10 MHz)

-99.8

-100.8 LTE-FDD B66 (10 MHz)

-98.5 LTE-FDD B71 (10 MHz)

-97.8 LTE-TDD B41 (10 MHz)

-98.1

-99

-97.6

-97.8

-101.4

-103.8

-101.3

-102.2

-102.6

-101.9

-101.7

-101.6

-103.6

-101.5

-100.8

-100.8

-96.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-92.8 dBm

-93.8 dBm

-96.3 dBm

-93.5 dBm

-94.3 dBm 7.7. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. The following table shows the electrostatic discharge characteristics of SC262R series module. Table 48: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) Tested Points Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces 5 5 Other Interfaces 0.5 10 10 1 kV kV kV SC262R_Series_Hardware_Design 98 / 115 Smart Module Series 8 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 8.1. Mechanical Dimensions Pin 1 Top view Side view Figure 41: Top and Side Dimensions SC262R_Series_Hardware_Design 99 / 115 Smart Module Series Figure 42: Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. SC262R_Series_Hardware_Design 100 / 115 8.2. Recommended Footprint Smart Module Series Figure 43: Recommended Footprint (Top View) NOTE 1. Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. 2. All RESERVED pins should be kept open and MUST NOT be connected to ground. SC262R_Series_Hardware_Design 101 / 115 8.3. Top and Bottom Views Smart Module Series Figure 44: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC262R_Series_Hardware_Design 102 / 115 Smart Module Series 9 Storage, Manufacturing and Packaging 9.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 8 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 8 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. SC262R_Series_Hardware_Design 103 / 115 Smart Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 9.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 45: Recommended Reflow Soldering Thermal Profile SC262R_Series_Hardware_Design 104 / 115 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 1~3 C/s Cooling down slope: -1.5 ~ -3 C/s Max slope: 13 C/s Smart Module Series Table 49: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 13 C/s 4070 s 235 C to 246 C

-1.5 to -3 C/s 1 1. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 2. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [4]. 9.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

SC262R_Series_Hardware_Design 105 / 115 9.3.1. Carrier Tape Dimension details are as follow:

Smart Module Series Figure 46: Carrier Tape Dimension Drawing Table 50: Carrier Tape Dimension Table (Unit: mm) W 72 P 56 T A0 B0 0.4 41.2 41.2 K0 4 K1 4.6 F E 34.2 1.75 9.3.2. Plastic Reel Figure 47: Plastic Reel Dimension Drawing SC262R_Series_Hardware_Design 106 / 115 Smart Module Series Table 51: Plastic Reel Dimension Table (Unit: mm) D1 380 D2 180 9.3.3. Packaging Process W 72.5 Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 200 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 carton box can pack 800 modules. Figure 48: Packaging Process SC262R_Series_Hardware_Design 107 / 115 Smart Module Series 10 Appendix References Table 52: Related Documents Document Name

[1] Quectel_Smart_EVB_G2_User_Guide

[2] Quectel_SC262R_Series_Pin_Description_and_GPIO_Configuration

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_Secondary_SMT_Application_Note

[5] Quectel_SC262R_Series_Reference_Design Table 53: Terms and Abbreviations Abbreviation Description ADC ADSP ALS AMR AP ARM BB BLE bps BR Analog-to-Digital Converter Audio Digital Signal Processor Ambient Light Sensor Adaptive Multi-rate Access Point Advanced RISC Machine Baseband Bluetooth Low Energy Bits per Second Basic Rate SC262R_Series_Hardware_Design 108 / 115 Smart Module Series CDMA CEP CMOS CPE CS CSD CSI CTS DC DCS DL DPSK DQPSK DRX DSI DSP ECM EDGE EDR EFR EGSM eMMC eSCO ESD ESR Code Division Multiple Access Circular Error Probable Complementary Metal-Oxide-Semiconductor Customer-Premise Equipment Coding Scheme Circuit Switched Data Camera Serial Interface Clear to Send Dual Carrier Digital Cellular System Downlink Differential Phase Shift Keying Differential Quadrature Reference Phase Shift Keying Discontinuous Reception Display Serial Interface Digital Signal Processor Electret Condenser Microphone Enhanced Data Rate for GSM Evolution Enhanced Data Rate Enhanced Full Rate Extended GSM Embedded Multimedia Card Extended Synchronous Connection Oriented Electrostatic Discharge Equivalent Series Resistance SC262R_Series_Hardware_Design 109 / 115 Smart Module Series ETSI EVB European Telecommunications Standards Institute Evaluation Board EV-DO/EVDO Evolution-Data Optimized EVRC Enhanced Variable Rate Codec FDD FEM fps FR Frequency Division Duplex Front End Module Frame per Second Full Rate GFSK Gaussian Frequency Shift Keying GLONASS Global Navigation Satellite System (Russia) GMSK GNSS GPIO GPRS GPS GPU GRFC GSM G.W. HD+

HR HS HSDPA HSPA HSPA+

Gaussian Minimum Shift Keying Global Navigation Satellite System General Purpose Input/Output General Packet Radio Service Global Positioning System Graphics Processing Unit Generic RF control Global System for Mobile Communications Gross Weight High Definition Plus Half Rate High Speed High Speed Downlink Packet Access High Speed Packet Access High-Speed Packet Access+

SC262R_Series_Hardware_Design 110 / 115 Smart Module Series HSUPA High Speed Uplink Packet Access HT IC IEEE I/O I2C High Throughput Integrated Circuit Institute of Electrical and Electronics Engineers Input/Output Inter-Integrated Circuit IMT-2000 International Mobile Telecommunications for the year 2000 IOmax Maximum Output Load Current LCC LCD LCM LDO LE LED LGA LNA Leadless Chip Carrier Liquid Crystal Display LCD Module Low Dropout Regulator Low Energy Light Emitting Diode Land Grid Array Low Noise Amplifier LPDDR Low-Power Double Data Rate LTE M2M MAC MCS Long-Term Evolution Machine to Machine Media Access Control Modulation and Coding Scheme MEMS Micro-Electro-Mechanical System MIPI MOQ MP Mobile Industry Processor Interface Minimum Order Quantity Megapixel SC262R_Series_Hardware_Design 111 / 115 Smart Module Series MPP MSL N.W. NFC NTC OTA OTG OTP PA PC PCB PCL PCS PDA PDU PHY PMU POS PS PWM PSK QAM QPSK RF RFFE Multi Purpose Pin Moisture Sensitivity Levels Net Weight Near Field Communication Negative Temperature Coefficient Over-the-Air Upgrade On-The-Go One Time Programable Power Amplifier Personal Computer Printed Circuit Board Power Control Level Personal Communication Service Personal Digital Assistant Protocol Data Unit Physical Layer Power Management Unit Point of Sale Proximity Sensor Pulse Width Modulation Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency RF Front End SC262R_Series_Hardware_Design 112 / 115 Smart Module Series RoHS RTC RTS SAW SCO SD SIMO SMD SMS SMT SPI STA TDD TP TTFF TVS UART UL UMTS USB Restriction of Hazardous Substances Real Time Clock Request to Send Surface Acoustic Wave Synchronous Connection Oriented Secure Digital Single Input Multiple Output Surface Mounting Device Short Message Service Surface Mount Technology Serial Peripheral Interface Station Time-Division Duplex Touch Panel Time to First Fix Transient Voltage Suppressor Universal Asynchronous Receiver & Transmitter Uplink Universal Mobile Telecommunications System Universal Serial Bus

(U)SIM

(Universal) Subscriber Identity Module VBAT Vmax Vmin Vnom Voltage at Battery (Pin) Maximum Voltage Minimum Voltage Nominal Voltage SC262R_Series_Hardware_Design 113 / 115 Smart Module Series VI VIHmin VILmax VO VOmax VOHmax VOHmin VOLmax WAPI Voltage Input Minimum High-level Input Voltage Maximum Low-level Input Voltage Voltage Output Maximum Output Voltage Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage WLAN Authentication and Privacy Infrastructure WCDMA Wideband Code Division Multiple Access WLAN XO Wireless Local Area Network Crystal Oscillator FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain, and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2022SC262RNA 4. This module must not transmit simultaneously with any other antenna or transmitter 5. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. SC262R_Series_Hardware_Design 114 / 115 Smart Module Series Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2022SC262RNA or Contains FCC ID: XMR2022SC262RNA must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes, or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes:

SC262R_Series_Hardware_Design 115 / 115 Smart Module Series 1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-22SC262RNA or where: 10224A-22SC262RNA is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-22SC262RNA " ou "o: 10224A-22SC262RNA estle numro de certification du module". i. the device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;

iii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;

iv. Omnidirectional antenna is recommended SC262R_Series_Hardware_Design 116 / 115

 

 

 

 

 

 

 

 

 

 

QUECCTEL

$C262R-NA Qi-AWOK NA SC262RNANA-E51-UGNDA FCC ID:XMR2022SC262RNA. IC :10224A-22SC262RNA SN: E18671 9750XXXxXxXX IMEI1 : 861 1 O8O300XXXXK IMEI2: 861 1 O8BO300XXXXX Label Location

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Date: November 27, 2022 Federal Communications Commission Office of Engineering and Technology Laboratory Division 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Request for Confidentiality FCC ID: XMR2022SC262RNA To Whom It May Concern, Pursuant to the provisions of Sections 0.457 and 0.459 of Commissions rules (47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure indefinitely. Schematic Diagram Block Diagram Part List Operational Description Tune-up Procedure Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In additional to above mentioned documents, pursuant to Public Notice DA 04-1705 of the Commission s policy, in order to comply with the marketing regulations in 47 CFT 2.803 and the importation rules in 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. External Photos Internal Photos Test Setup Photos User Manual It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Best Regards, ___ _ Jean hu jean.hu@quectel.com