FCC ID: XMR202007UC200TGL UMTS/HSPA+ Module

 

UC200T-GL Mini PCIe Hardware Design UMTS/HSPA+ Standard Module Series Rev. UC200T-GL_Mini_PCIe_Hardware_Design_V1.0 Date: 2019-12-12 Status: Released www.quectel.com UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. UC200T-GL_Mini_PCIe_Hardware_Design 1 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design About the Document History Revision Date Author Description 1.0 2019-12-12 Jouni Yang/

Initial UC200T-GL_Mini_PCIe_Hardware_Design 2 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 3 Table Index ............................................................................................................................................... 5 Figure Index .............................................................................................................................................. 6 1 Introduction ....................................................................................................................................... 7 1.1. Safety Information ................................................................................................................. 10 2 Product Concept ............................................................................................................................. 12 2.1. General Description .............................................................................................................. 12 Key Features ......................................................................................................................... 12 2.2. 2.3. Functional Diagram ............................................................................................................... 15 3.5. 3.6. 3 Application Interfaces ..................................................................................................................... 16 Pin Assignment ..................................................................................................................... 16 3.1. 3.2. Pin Description ...................................................................................................................... 17 3.3. Operating Modes .................................................................................................................. 20 3.4. Power Saving ........................................................................................................................ 20 3.4.1. Sleep Mode.................................................................................................................. 20 3.4.2. Airplane Mode .............................................................................................................. 20 Power Supply ........................................................................................................................ 21 UART Interfaces .................................................................................................................... 21 3.6.1. Main UART Interface ................................................................................................... 22 3.6.2. COEX UART Interface* .................................................................... USB Interface ........................................................................................................................ 22 3.7.

(U)SIM Interface .................................................................................................................... 24 3.8. 3.9. PCM and I2C Interfaces ........................................................................................................ 25 3.10. Control and Indication Signals .............................................................................................. 28 3.10.1. RI Signal ...................................................................................................................... 28 3.10.2. DTR Signal .................................................................................................................. 29 3.10.3. W_DISABLE# Signal ................................................................................................... 29 3.10.4. PERST# Signal ............................................................................................................ 30 3.10.5. LED_WWAN# Signal ................................................................................................... 30 3.10.6. WAKE# Signal ............................................................................................................. 31 4 GNSS Receiver .................................................................................................... 4.1. General Description .................................................................................. 4.2. GNSS Performance .................................................................................. 4.3. GNSS Frequency ...................................................................................... 5.1. 5 Antenna Connection ....................................................................................................................... 32 Antenna Connectors ............................................................................................................. 32 5.1.1. Operating Frequency ................................................................................................... 32 Antenna Requirements ......................................................................................................... 32 5.2. UC200T-GL_Mini_PCIe_Hardware_Design 3 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 5.3. Recommended Mating Plugs for Antenna Connection .......................................................... 33 6 Electrical, Reliability and Radio Characteristics ........................................................................ 35 6.1. General Description .............................................................................................................. 35 6.2. Power Supply Requirements ................................................................................................. 35 I/O Requirements .................................................................................................................. 36 6.3. RF Characteristics ................................................................................................................ 36 6.4. 6.5. ESD Characteristics .............................................................................................................. 37 Thermal Consideration .............................................................................. 6.6. 6.7. Current Consumption ............................................................................................................ 38 7 Dimensions and Packaging ............................................................................................................ 41 7.1. General Description .............................................................................................................. 41 7.2. Mechanical Dimensions of UC200T-GL Mini PCIe ................................................................ 41 7.3. Standard Dimensions of Mini PCI Express ............................................................................ 41 Packaging Specifications ...................................................................................................... 43 7.4. 8 Appendix A References .................................................................................................................. 44 UC200T-GL_Mini_PCIe_Hardware_Design 4 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Table Index TABLE 1: SUPPORTED BANDS OF UC200T-GL MINI PCIE .......................................................................... 12 TABLE 2: KEY FEATURES OF UC200T-GL MINI PCIE ................................................................................... 12 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 17 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 17 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 20 TABLE 6: DEFINITION OF POWER SUPPLY INTERFACE ............................................................................. 21 TABLE 7: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................... 22 TABLE 8: PIN DEFINITION OF COEX UART INTERFACE .................................................. TABLE 9: PIN DEFINITION OF USB INTERFACE ........................................................................................... 23 TABLE 10: PIN DEFINITION OF (U)SIM INTERFACE ..................................................................................... 24 TABLE 11: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 26 TABLE 12: PIN DEFINITION OF CONTROL AND INDICATION SIGNALS ...................................................... 28 TABLE 13: AIRPLANE MODE CONTROLLED BY HARDWARE METHOD ..................................................... 29 TABLE 14: AIRPLANE MODE CONTROLLED BY SOFTWARE METHOD ..................................................... 29 TABLE 15: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",0, DEFAULT SETTING) ......... 31 TABLE 16: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",2) ........................................... 31 TABLE 17: GNSS PERFORMANCE ..................................................................................... TABLE 18: GNSS FREQUENCY ........................................................................................... TABLE 19: OPERATING FREQUENCIES ........................................................................................................ 32 TABLE 20: ANTENNA REQUIREMENTS .......................................................................................................... 32 TABLE 21: POWER SUPPLY REQUIREMENTS .............................................................................................. 35 TABLE 22: I/O REQUIREMENTS ...................................................................................................................... 36 TABLE 23: UC200T-GL MINI PCIE CONDUCTED RF OUTPUT POWER ....................................................... 36 TABLE 24: UC200T-GL MINI PCIE CONDUCTED RF RECEIVING SENSITIVITY ......................................... 37 TABLE 25: ESD CHARACTERISTICS OF UC200T-GL MINI PCIE .................................................................. 37 TABLE 26: CURRENT CONSUMPTION OF UC200T-GL MINI PCIE............................................................... 38 TABLE 27: GNSS CURRENT CONSUMPTION OF UC200T-GL MINI PCIE ................................................... 40 TABLE 28: RELATED DOCUMENTS ................................................................................................................ 44 TABLE 29: TERMS AND ABBREVIATIONS ...................................................................................................... 44 UC200T-GL_Mini_PCIe_Hardware_Design 5 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 15 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 16 FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 21 FIGURE 4: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 22 FIGURE 5: REFERENCE CIRCUIT OF USB INTERFACE .............................................................................. 23 FIGURE 6: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR 24 FIGURE 7: R REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 25 FIGURE 8: TIMING IN PRIMARY MODE .......................................................................................................... 27 FIGURE 9: TIMING IN AUXILIARY MODE ....................................................................................................... 27 FIGURE 10: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 28 FIGURE 11: RI BEHAVIORS ............................................................................................................................. 29 FIGURE 12: TIMING OF RESETTING MODULE ............................................................................................. 30 FIGURE 13: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 30 FIGURE 14: WAKE# BEHAVIOR ...................................................................................................................... 31 FIGURE 15: DIMENSIONS OF THE RECEPTACLE RF CONNECTORS (UNIT: MM) .................................... 33 FIGURE 16: MECHANICALS OF U.FL-LP MATING PLUGS ........................................................................... 34 FIGURE 17: SPACE FACTOR OF MATING PLUGS (UNIT: MM) ..................................................................... 34 FIGURE 18: REFERENCED HEATSINK DESIGN ............................................................... FIGURE 19: MECHANICAL DIMENSIONS OF UC200T-GL MINI PCIE .......................................................... 41 FIGURE 20: STANDARD DIMENSIONS OF MINI PCI EXPRESS ................................................................... 42 FIGURE 21: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679100002) .................... 43 UC200T-GL_Mini_PCIe_Hardware_Design 6 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 1 Introduction This document defines UC200T-GL Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers applications. This document helps customers quickly understand module interface specifications, electrical characteristics, mechanical specifications and other related information of the module. To facilitate application designs, it also includes some reference designs for customers reference. The document, coupled with application notes and user guides, makes it easy to design and set up wireless applications with UC200T-GL Mini PCIe. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a FCC Certification Requirements. mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202007UC200TGL. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

UC200T-GL_Mini_PCIe_Hardware_Design 7 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design GSM850: <7.636dBi GSM1900: <9.360dBi WCDMA B2: <8.000dBi WCDMA B5: <9.416dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR202007UC200TGL or Contains FCC ID: XMR202007UC200TGL must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. UC200T-GL_Mini_PCIe_Hardware_Design 8 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. UC200T-GL_Mini_PCIe_Hardware_Design 9 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating UC200T-GL Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. UC200T-GL_Mini_PCIe_Hardware_Design 10 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. UC200T-GL_Mini_PCIe_Hardware_Design 11 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 2 Product Concept 2.1. General Description UC200T-GL Mini PCIe module provides data connectivity on DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, TD-SCDMA, EVDO, CDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It provides audio and high-speed data transmission for customers applications. UC200T-GL Mini PCIe module can be applied in the following fields:

PDA and Laptop Computer Remote Monitor System Vehicle System Wireless POS System Wireless Router and Switch Other Wireless Terminal Devices Intelligent Meter Reading System Table 1: Supported Bands of UC200T-GL Mini PCIe Module Description WCDMA: B1/B8 TD-SCDMA: B34/B39 EVDO/CDMA: BC0 GSM: 900/1800MHz Support digital audio 3) UC200T-GL Mini PCIe 2.2. Key Features The following table describes the detailed features of UC200T-GL Mini PCIe module. Table 2: Key Features of UC200T-GL Mini PCIe Features Description UC200T-GL_Mini_PCIe_Hardware_Design 12 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Function Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Supply voltage: 3.0V~3.6V Typical supply voltage: 3.3V Transmitting Power UMTS Features Class 4 (33dBm2dB) for EGSM900MHz Class 1 (30dBm2dB) for DCS1800MHz Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class 3 (24dBm+2/-1dB) for EVDO/CDMA BC0 Class 3 (24dBm+1/-3dB) for WCDMA bands Class 2 (24dBm+1/-3dB) for TD-SCDMA bands Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK,16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (UL), 384Kbps (DL) TD-SCDMA Features Support CCSA Release 3 TD-SCDMA Max 4.2Mbps (DL)/Max 2.2Mbps (UL) CDMA2000 Features Support 3GPP2 CDMA2000 1X Advanced and 1xEV-DO Rev.A EVDO: Max 3.1Mbps (DL)/Max 1.8Mbps (UL) 1X Advanced: Max 307.2Kbps (DL)/Max 307.2Kbps (UL) GSM Features GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/Max 85.6Kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Support protocols TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/

CMUX*/HTTPS*/SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols Support protocols PAP (Password Authentication Protocol) and CHAP

(Challenge Handshake Authentication Protocol) which are usually used for PPP connection Internet Protocol Features SMS Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V UC200T-GL_Mini_PCIe_Hardware_Design 13 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design UART Interfaces Audio Features PCM Interface USB Interface Main UART:

Support RTS and CTS hardware flow control Baud rate can reach up to 230400bps; 115200bps by default Used for AT command communication and data transmission Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB Support echo cancellation and noise suppression Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA output and voice over USB Support USB serial driver for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Antenna Connectors Main antenna AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Temperature Range Size: (51.00.15)mm (30.00.15)mm (4.90.2)mm Weight: approx. 10.6g Operation temperature range: -35C ~ +75C 1) Extended temperature range: -40C ~ +80C 2) Storage temperature range: -40C ~ +90C Firmware Upgrade Upgrade via USB interface or DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again.

* means under development. UC200T-GL_Mini_PCIe_Hardware_Design 14 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 2.3. Functional Diagram The following figure shows the block diagram of UC200T-GL Mini PCIe. Boost Circuit VBAT I n t e r f a c e M n i i P C I E x p r e s s VCC USB PCM&I2C UART

(U)SIM W_DISABLE#

PERST#

DTR WAKE#

RI LED_WWAN#

UC200T Module Main antenna Figure 1: Functional Diagram UC200T-GL_Mini_PCIe_Hardware_Design 15 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 3 Application Interfaces The physical connections and signal levels of UC200T-GL Mini PCIe comply with PCI Express Mini Card Electromechanical Specification. This chapter mainly describes the definition and application of the following interfaces for UC200T-GL Mini PCIe:

Power supply UART interfaces USB interface PCM and I2C interfaces Control and Indication signals

(U)SIM interfaces 3.1. Pin Assignment The following figure shows the pin assignment of UC200T-GL Mini PCIe module. The top side contains UC200T-GL module and antenna connectors. Pin Name Pin No. Pin No. PIN1 PIN2 TOP BOT PIN51 PIN52 WAKE#

RESERVED RESERVED RESERVED GND UART_RX UART_TX GND RESERVED RI GND UART_CTS UART_RTS GND GND DTR GND GND RESERVED VCC_3V3 VCC_3V3 GND PCM_CLK PCM_DOUT PCM_DIN PCM_SYNC 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 Pin Name VCC_3V3 GND NC USIM_VDD USIM_DATA USIM_CLK USIM_RST RESERVED GND W_DISABLE#

PERST#

RESERVED GND NC I2C_SCL I2C_SDA GND USB_DM USB_DP GND LED_WWAN#

USIM_PRESENCE RESERVED NC GND VCC_3V3 Figure 2: UC200T-GL Mini PCIe Pin Assignment UC200T-GL_Mini_PCIe_Hardware_Design 16 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 3.2. Pin Description The following tables show the pin definition and description of the 52 pins on UC200T-GL Mini PCIe. Table 3: I/O Parameters Definition Description Digital Input Digital Output Bidirectional Open Collector Power Input Power Output Table 4: Pin Description Pin No. Mini PCI Express Standard Name UC200T-GL Mini PCIe Pin Name I/O Description Comment WAKE#

WAKE#

3.3Vaux VCC_3V3 OC PI Output signal used to wake up the host. 3.0V~3.6V, typically 3.3V DC supply RESERVED RESERVED Reserved GND GND Mini card ground RESERVED RESERVED Reserved 1.5V NC Not connected CLKREQ#

RESERVED Reserved UIM_PWR USIM_VDD PO GND GND Mini card ground Power supply for the

(U)SIM card Data signal of (U)SIM card 10 UIM_DATA USIM_DATA IO UC200T-GL_Mini_PCIe_Hardware_Design 17 / 51 Type DI DO IO OC PI PO 1 2 3 4 5 6 7 8 9 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 Connect to DTEs TX. Connect to DTEs RX. REFCLK-

UART_RX DI UART receive data UIM_CLK USIM_CLK DO Clock signal of (U)SIM card REFCLK+

UART_TX DO UART transmit data UIM_RESET USIM_RST DO Reset signal of (U)SIM card GND GND Mini card ground UIM_VPP RESERVED Reserved RESERVED RI DO Ring indication GND GND Mini card ground RESERVED RESERVED Reserved W_DISABLE#

W_DISABLE#

DI Airplane mode control Active low. GND GND Mini card ground PERST#

PERST#

DI Fundamental reset signal PERn0 UART_CTS DI UART clear to send 3.3Vaux RESERVED Reserved PERp0 UART_RTS DO UART request to send Active low. Connect to DTEs RTS. Connect to DTEs CTS. GND GND 1.5V GND GND GND NC GND Mini card ground Mini card ground Not connected Mini card ground 30 SMB_CLK I2C_SCL DO I2C serial clock 31 PETn0 DTR DI Sleep mode control 32 SMB_DATA I2C_SDA IO I2C serial data Require external pull-up to 1.8V. Require external pull-up to 1.8V. UC200T-GL_Mini_PCIe_Hardware_Design 18 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design PETp0 UART_DCD DO Data carrier detection GND GND GND GND Mini card ground Mini card ground 36 USB_D-

USB_DM IO USB differential data (-) 37 GND GND Mini card ground 38 USB_D+

USB_DP IO USB differential data (+) 3.3Vaux VCC_3V3 PI 3.0V~3.6V, typically 3.3V DC supply GND GND Mini card ground 3.3Vaux VCC_3V3 PI 3.0V~3.6V, typically 3.3V DC supply LED signal for indicating the network status of the module 42 LED_WWAN#

LED_WWAN#

OC Require differential impedance of 90. Require differential impedance of 90. GND GND Mini card ground LED_WLAN#

USIM_PRESENCE DI

(U)SIM card insertion detection RESERVED PCM_CLK IO PCM clock LED_WPAN#

RESERVED Reserved RESERVED PCM_DOUT DO PCM data output 1.5V NC Not connected RESERVED PCM_DIN DI PCM data input GND GND RESERVED PCM_SYNC 2) 3.3Vaux VCC_3V3 Mini card ground PCM frame synchronization 3.0V~3.6V, typically 3.3V DC supply IO PI 33 34 35 39 40 41 43 44 45 46 47 48 49 50 51 52 UC200T-GL_Mini_PCIe_Hardware_Design 19 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design NOTES 1. Keep all NC, reserved and unused pins unconnected. 3.3. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN=0command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN=4command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. In this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. 3.4. Power Saving 3.4.1. Sleep Mode UC200T-GL Mini PCIe is able to reduce its current consumption to a minimum value in sleep mode. There are three preconditions must be met to make the module enter sleep mode. Execute AT+QSCLK=1; to enable sleep mode. Ensure the DTR is kept at high level or be kept open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. 3.4.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. For more details, please refer to Chapter 3.10.3. UC200T-GL_Mini_PCIe_Hardware_Design 20 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 3.5. Power Supply The following table shows pin definition of power supply interface. Table 6: Definition of Power Supply Interface Pin Name Pin No. I/O Power Domain Description VCC_3V3 2, 39, 41, 52 PI 3.0V~3.6V Typically 3.3V DC supply GND Mini card ground 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 The typical supply voltage of UC200T-GL Mini PCIe is 3.3V. In the 2G network, the input peak current may reach 2.7A during the transmitting time. Therefore, the power supply must be able to provide a rated output current of 2.7A at least, and a bypass capacitor of no less than 470F with low-ESR should be used to prevent the voltage from dropping. The following figure shows a reference design of power supply where R2 and R3 are 1% tolerance resistors and C3 is a low-ESR capacitor. Figure 3: Reference Circuit of Power Supply 3.6. UART Interfaces UC200T-GL Mini PCIe provides one main UART interface. UC200T-GL_Mini_PCIe_Hardware_Design 21 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 3.6.1. Main UART Interface The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps and 230400bps baud rates, and the default is 115200bps. This interface supports RTS and CTS hardware flow control, and can be used for AT command communication and data transmission. The following table shows the pin definition of the main UART interface. Table 7: Pin Definition of Main UART Interface Pin Name Pin No. I/O Power Domain Description UART_RX UART_TX UART_CTS UART_RTS DI 3.3V UART receive data DO 3.3V UART transmit data DI 3.3V UART clear to send DO 3.3V UART request to send The signal level of main UART interface is 3.3V. When connecting to the peripheral MCU/RAM, customers need to pay attention to the signal direction. The reference circuit is as follows:

11 13 23 25 TXD RXD RTS CTS GND MCU/ARM Module UART_TXD UART_RXD UART_RTS UART_CTS GND Voltage level: 3.3V Voltage level: 3.3V Figure 4: Reference Circuit of Power Supply 3.7. USB Interface UC200T-GL Mini PCIe provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification. It can only be used as a slave device. Meanwhile, it supports high speed (480Mbps) mode and full speed (12Mbps) mode. The USB interface is used for AT command communication, data UC200T-GL_Mini_PCIe_Hardware_Design 22 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design transmission, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 8: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DM 36 IO USB differential data (-) Require differential impedance of 90 USB_DP 38 IO USB differential data (+) Require differential impedance of 90 The following figure shows a reference circuit of USB interface. Minimize these stubs Test Points Module USB_DM USB_DP GND NM_0R NM_0R R3 R4 L1 ESD Array Close to Module MCU USB_DM USB_DP GND Figure 5: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also R3 and R4 should be placed close to each other. The extra stubs of trace must be as short as possible. Please follow the requirements below during USB interface design so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. UC200T-GL_Mini_PCIe_Hardware_Design 23 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Special attention should be paid to the selection of ESD device on the USB data line. Its parasitic capacitance should not exceed 2pF and should be placed as close as possible to the USB interface. 3.8. (U)SIM Interface UC200T-GL Mini PCIes (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. The following table shows the pin definition of the (U)SIM interface. Table 9: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Power Domain Description USIM_VDD PO 1.8V/3.0V Power supply for (U)SIM card USIM_DATA IO 1.8V/3.0V Data signal of (U)SIM card USIM_CLK USIM_RST DO 1.8V/3.0V Clock signal of (U)SIM card DO 1.8V/3.0V Reset signal of (U)SIM card 8 10 12 14 USIM_PRESENCE 44 DI 1.8V

(U)SIM card insertion detection UC200T-GL Mini PCIe supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, It is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for details about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. USIM_VDD 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM_PRESENCE USIM_DATA 0R 0R 0R 100nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33pF 33pF 33pF GND Figure 6: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector GND GND UC200T-GL_Mini_PCIe_Hardware_Design 24 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. USIM_VDD 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM_DATA 0R 0R 0R 33pF 33pF 33pF 100nF

(U)SIM Card Connector VCC RST CLK GND VPP IO GND GND Figure 7: R Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and power supply traces. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode with parasitic capacitance not exceeding 15pF. The 0 resistors should be added in series between the module and the (U)SIM card connector so as to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied and should be placed close to the (U)SIM card connector. 3.9. PCM and I2C Interfaces UC200T-GL Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. UC200T-GL_Mini_PCIe_Hardware_Design 25 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec design. Table 10: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Power Domain Description PCM_CLK PCM_DOUT PCM_DIN PCM_SYNC I2C_SCL I2C_SDA 45 47 49 51 30 32 IO DO DI IO 1.8V 1.8V 1.8V 1.8V DO 1.8V IO 1.8V PCM clock PCM data output PCM data input PCM frame synchronization I2C serial clock. Require external pull-up to 1.8V. I2C serial data. Require external pull-up to 1.8V. UC200T-GL Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the following modes:

Primary mode (short frame synchronization, works as either master or slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC. The following figure shows the timing relationship in primary mode with 8kHz PCM_SYNC and 2048kHz PCM_CLK. UC200T-GL_Mini_PCIe_Hardware_Design 26 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Figure 8: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC. The following figure shows the timing relationship in auxiliary mode with 8kHz PCM_SYNC and 256kHz PCM_CLK. Figure 9: Timing in Auxiliary Mode Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. In addition, UC200T-GL Mini PCIes firmware has integrated the configuration on some PCM codecs application with I2C interface. Please refer to document [2] for details about AT+QDAI command. The following figure shows a reference design of PCM interface with an external codec IC. UC200T-GL_Mini_PCIe_Hardware_Design 27 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Figure 10: Reference Circuit of PCM Application with Audio Codec RI DTR DCD 3.10. Control and Indication Signals The following table shows the pin definition of control and indication signals. Table 11: Pin Definition of Control and Indication Signals Pin Name Pin No. I/O Power Domain Description 17 31 33 22 42 1 DO 3.3V Output signal used to wake up the host. DI 3.3V Sleep mode control. DO 3.3V Data carrier detection W_DISABLE#

20 DI 3.3V PERST#

DI 3.3V Airplane mode control. Pulled up by default. Active low. Fundamental reset signal. Active low. OC OC LED signal for indicating the network status of the module. Output signal used to wake up the host. LED_WWAN#

WAKE#

3.10.1. RI Signal The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG="risignaltype","physical". UC200T-GL_Mini_PCIe_Hardware_Design 28 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Figure 11: RI Behaviors 3.10.2. DTR Signal The DTR signal is used for sleep mode control. It is pulled up by default. When module is in sleep mode, driving it to low level can wake up the module. For more details about the preconditions for module to enter sleep mode, please refer to Chapter 3.4.1. 3.10.3. W_DISABLE# Signal UC200T-GL Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (GNSS not included). The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable the function. Driving it to low level can make the module enter airplane mode. Table 12: Airplane Mode Controlled by Hardware Method W_DISABLE#

RF Function Status Module Operation Mode High level Low level RF enabled Normal mode RF disabled Airplane mode Software method can be controlled by AT+CFUN, and has the same effect with W_DISABLE# signal function, the details are as follows. Table 13: Airplane Mode Controlled by Software Method AT+CFUN=?

RF Function Status Module Operation Mode 0 1 RF and (U)SIM disabled Minimum functionality mode RF enabled Normal mode UC200T-GL_Mini_PCIe_Hardware_Design 29 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 4 3.10.4. PERST# Signal RF disabled Airplane mode The PERST# signal can be used to force a hardware reset on the card. Customers can reset the module by driving PERST# signal low for more 300ms and then releasing it. The reset scenario is illustrated in the following figure. VCC_3V3 PERST#

Module Status 300ms VIL0.5V Running Baseband resetting Baseband restart Figure 12: Timing of Resetting Module 3.10.5. LED_WWAN# Signal The LED_WWAN# signal of UC200T-GL Mini PCIe is used to indicate the network status of the module, and can absorb a current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN# output signal is low. Figure 13: LED_WWAN# Signal Reference Circuit Diagram There are two indication modes for LED_WWAN# signal to indicate network status, which can be switched through following AT commands:

AT+QCFG="ledmode",0 (Default setting) AT+QCFG="ledmode",2 UC200T-GL_Mini_PCIe_Hardware_Design 30 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design The following tables show the detailed network status indications of the LED_WWAN# signal. Table 14: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting) Pin Status Description Flicker slowly (200ms Low/1800ms High) Network searching Flicker slowly (1800ms Low/200ms High) Idle Flicker quickly (125ms Low/125ms High) Data transfer is ongoing Always Low Voice calling Table 15: Indications of Network Status (AT+QCFG="ledmode",2) Pin Status Description Low Level (Light ON) Registered on network successfully High Impedance (Light OFF) 3.10.6. WAKE# Signal No network coverage or not registered W_DISABLE# signal is at low level. (Disable RF) AT+CFUN=0, AT+CFUN=4 The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG="risignaltype","physical" command are required. When a URC returns, a 120ms low level pulse will be outputted. The state of WAKE# signal is shown as below. Figure 14: WAKE# Behavior UC200T-GL_Mini_PCIe_Hardware_Design 31 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 4 Antenna Connection 4.1. Antenna Connectors UC200T-GL Mini PCIe is mounted with a main antenna connector. The impedance of the antenna connectors is 50. 4.1.1. Operating Frequency Table 16: Operating Frequencies 3GPP Band EGSM900 DCS1800 Transmit 880~915 Receive 925~960 1710~1785 1805~1880 EVDO/CDMA BC0 824~849 869~894 WCDMA B1 1920~1980 2110~2170 WCDMA B8 880~915 925~960 TD-SCDMA B34 2010~2025 2010~2025 TD-SCDMA B39 1880~1920 1880~1920 4.2. Antenna Requirements The following table shows the requirements on main antenna Table 17: Antenna Requirements Type Requirements Unit MHz MHz MHz MHz MHz MHz MHz UC200T-GL_Mini_PCIe_Hardware_Design 32 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design VSWR: 2 Efficiency: > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB

(EGSM900, WCDMA B8, LTE-FDD B5/B8, EVDO/CDMA BC0) Cable insertion loss: < 1.5dB

(DCS1800, WCDMA B1, LTE-FDD B1/B3, LTE-TDD B34/B39, TD-SCDMA B34/B39) Cable insertion loss: < 2dB GSM/EVDO/CDMA/UMTS/

TD-SCDMA/LTE 4.3. Recommended Mating Plugs for Antenna Connection UC200T-GL Mini PCIe is mounted with RF connectors (receptacles) for convenient antenna connection. The dimensions of the antenna connectors are shown as below. Figure 15: Dimensions of the Receptacle RF Connectors (Unit: mm) U.FL-LP mating plugs listed in the following figure can be used to match the receptacles. UC200T-GL_Mini_PCIe_Hardware_Design 33 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Figure 16: Mechanicals of U.FL-LP Mating Plugs The following figure describes the space factor of mating plugs. Figure 17: Space Factor of Mating Plugs (Unit: mm) For more details of the recommended mating plugs, please visit http://www.hirose.com. UC200T-GL_Mini_PCIe_Hardware_Design 34 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 5 Electrical, Reliability and Radio Characteristics 5.1. General Description I/O requirements This chapter mainly describes the following electrical and radio characteristics of UC200T-GL Mini PCIe:

Power supply requirements RF characteristics ESD characteristics Thermal consideration Current consumption 5.2. Power Supply Requirements The input voltage of UC200T-GL Mini PCIe is 3.0V~3.6V. The following table shows the power supply requirements of UC200T-GL Mini PCIe. Table 18: Power Supply Requirements Parameter Description Min. Typ. Max. VCC_3V3 Power Supply 3.0 3.3 3.6 Unit V UC200T-GL_Mini_PCIe_Hardware_Design 35 / 51 VIH VIL VOH VOL NOTES UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 5.3. I/O Requirements The following table shows the I/O requirements of UC200T-GL Mini PCIe. Table 19: I/O Requirements Parameter Description Min. Max. Unit Input High Voltage 0.7 VCC_3V3 VCC_3V3 + 0.3 Input Low Voltage

-0.3 0.3 VCC_3V3 Output High Voltage VCC_3V3 - 0.5 VCC_3V3 Output Low Voltage 0 0.4 V V V V 1. The PCM and I2C interfaces belong to 1.8V power domain and other I/O interfaces belong to VCC_3V3 power domain. 2. The maximum voltage value of VIL for PERST# signal and W_DISABLE# signal is 0.5V. 5.4. RF Characteristics The following tables show the conducted RF output power and receiving sensitivity of UC200T-GL Mini PCIe module. Table 20: UC200T-GL Mini PCIe Conducted RF Output Power Frequency EGSM900 DCS1800 EGSM900 (8-PSK) DCS1800 (8-PSK) Max. 33dBm2dB 30dBm2dB 27dBm3dB 26dBm3dB WCDMA B1/B8 24dBm+1/-3dB TD-SCDMA B34/B39 24dBm+1/-3dB Min. 5dBm5dB 0dBm5dB 5dBm5dB 0dBm5dB

< -49dBm

< -49dBm UC200T-GL_Mini_PCIe_Hardware_Design 36 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design CDMA BC0 24dBm+2/-1dB

< -49dBm Table 21: UC200T-GL Mini PCIe Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) EGSM900 DCS1800

-109dBm NA

-109dBm NA CDMA BC0

-108dBm NA TD-SCDMA B34

-110dBm NA TD-SCDMA B39

-110dBm NA NA NA NA NA NA

-102dBm

-102dBm

-104dBm

-108dBm

-108dBm WCDMA B1

-110dBm

-109.5dBm

-112dBm

-106.7dBm WCDMA B8

-110dBm

-109.5dBm

-112dBm

-103.7dBm 5.5. ESD Characteristics The following table shows the ESD characteristics of UC200T-GL Mini PCIe. Table 22: ESD Characteristics of UC200T-GL Mini PCIe Tested Interfaces Contact Discharge Air Discharge Unit Power Supply and GND Antenna Interfaces USB Interface

(U)SIM Interface Others kV kV kV kV kV UC200T-GL_Mini_PCIe_Hardware_Design 37 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 5.6. Current Consumption Table 23: Current Consumption of UC200T-GL Mini PCIe Parameter Description Conditions Typ. Unit Sleep state IVBAT AT+CFUN=0 (USB disconnected) EGSM @DRX=2 (USB disconnected) EGSM @DRX=5 (USB disconnected) EGSM @DRX=5 (USB suspend) EGSM @DRX=9 (USB disconnected) DCS @DRX=2 (USB disconnected) DCS @DRX=5 (USB disconnected) DCS @DRX=5 (USB suspend) DCS @DRX=9 (USB disconnected) TD-SCDMA Band A @PF=64

(USB disconnected) TD-SCDMA Band A @PF=128

(USB disconnected) TD-SCDMA Band A @PF=256

(USB disconnected) TD-SCDMA Band A @PF=512

(USB disconnected) BC0 @SCI=1 (USB disconnected) BC0 @SCI=1 (USB suspend) WCDMA @PF=64 (USB suspend) WCDMA @PF=128 (USB disconnected) WCDMA @PF=256 (USB disconnected) WCDMA @ PF=512 (USB disconnected) mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state EGSM DRX=5 (USB disconnected) UC200T-GL_Mini_PCIe_Hardware_Design 38 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design EGSM DRX=5 (USB connected) BC0 @SCI=1 (USB disconnected) BC0 @SCI=1 (USB connected) TD-SCDMA Band A @PF=64

(USB disconnected) TD-SCDMA Band A @PF=64

(USB connected) WCDMA @PF=64 (USB disconnected) WCDMA @PF=64 (USB connected) EGSM900 4DL/1UL @32.71dBm EGSM900 3DL/2UL @32.50dBm EGSM900 2DL/3UL @30.83dBm EGSM900 1DL/4UL @29.68dBm DCS1800 4DL/1UL @29.60dBm DCS1800 3DL/2UL @29.48dBm DCS1800 2DL/3UL @29.81dBm DCS1800 1DL/4UL @29.73dBm EGSM900 4DL/1UL @27.50dBm EGSM900 3DL/2UL @27.50dBm EGSM900 2DL/3UL @27.60dBm EGSM900 1DL/4UL @27.42dBm DCS1800 4DL/1UL @26.20dBm DCS1800 3DL/2UL @26.10dBm DCS1800 2DL/3UL @27.67dBm DCS1800 1DL/4UL @27.55dBm mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) CDMA/TD-SCDMA data transfer

(GNSS OFF) BC0 @23.55dBm TD-SCDMA Band A @23.18dBm UC200T-GL_Mini_PCIe_Hardware_Design 39 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design TD-SCDMA Band F @23.42dBm WCDMA B1 HSDPA @22.03dBm WCDMA B1 HSUPA @22.02dBm WCDMA B8 HSDPA @21.68dBm WCDMA B8 HSUPA @21.75dBm EGSM900 PCL=5 @32.47dBm EGSM900 PCL=12 @19.40dBm EGSM900 PCL=19 @5.58dBm DCS1800 PCL=0 @29.49dBm DCS1800 PCL=7 @16.47dBm DCS1800 PCL=15 @0.24dBm BC0 @23.87dBm BC0 @-60.67dBm WCDMA B1 @23.05dBm WCDMA B8 @23.1dBm WCDMA data transfer

(GNSS OFF) GSM voice call CDMA voice call WCDMA voice call Table 24: GNSS Current Consumption of UC200T-GL Mini PCIe Parameter Description Conditions Typ. Unit Searching

(AT+CFUN=0) Cold start @Passive Antenna Lost state @Passive Antenna IVBAT

(GNSS) Tracking

(AT+CFUN=0) Instrument Environment Open Sky @Passive Antenna Open Sky @Active Antenna mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA UC200T-GL_Mini_PCIe_Hardware_Design 40 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 6 Dimensions and Packaging 6.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of UC200T-GL Mini PCIe module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.05mm unless otherwise specified. 6.2. Mechanical Dimensions of UC200T-GL Mini PCIe 30.000.15 24.200.20 3x3.000.10 5.980.10 2x2.600.1 0.610.05 5.10.15 48.050.20 4.90.20 1.400.10 34.150.10 50.950.15 2.90.20 8.250.10 6.000.20 5.830.20 8.450.20 32.00.15 0.50.10 4.000.10 0.5 Pin1 Pin51 Top View 9.930.20 1.000.10 Side View Figure 18: Mechanical Dimensions of UC200T-GL Mini PCIe 10.50.20 6.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1]

for Detail A and Detail B. UC200T-GL_Mini_PCIe_Hardware_Design 41 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Figure 19: Standard Dimensions of Mini PCI Express UC200T-GL Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in document [1]. The following figure takes the Molex 679100002 as an example. UC200T-GL_Mini_PCIe_Hardware_Design 42 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design Figure 20: Dimensions of the Mini PCI Express Connector (Molex 679100002) 6.4. Packaging Specifications UC200T-GL Mini PCIe modules are packaged in a tray. Each tray contains 10 modules. The smallest package of UC200T-GL Mini PCIe contains 100 modules. UC200T-GL_Mini_PCIe_Hardware_Design 43 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design 7 Appendix A References Table 25: Related Documents SN Document Name Remark PCI Express Mini Card Electromechanical Specification Revision 1.2 PCI Express Mini Card Electromechanical Specification

[2]

Quectel_UC200T-GL_AT_Commands_Manual UC200T-GL AT commands manual Quectel_LTE_Standard_GNSS_AT_ Commands_Manual GNSS AT commands manual Standard modules for LTE Table 26: Terms and Abbreviations Abbreviation Description DC-HSPA+

Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air Adaptive Multi-rate Bits Per Second Coding Scheme Clear to Send Down Link Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electro Magnetic Interference

[1]

[3]

AMR bps CS CTS DL DTE DTR EFR EMI ESD Electrostatic Discharge UC200T-GL_Mini_PCIe_Hardware_Design 44 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design GLONASS GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System ESR FDD FR GMSK GNSS GPS GSM HR kbps LED LTE Mbps MCU ME MIMO MMS MO MT PCM PDA PDU POS PPP Equivalent Series Resistance Frequency Division Duplexing Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate Kilo Bits Per Second Light Emitting Diode Long-Term Evolution Million Bits Per Second Micro Control Unit Mobile Equipment Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated Mobile Terminated Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Point of Sale Point-to-Point Protocol NMEA National Marine Electronics Association UC200T-GL_Mini_PCIe_Hardware_Design 45 / 51 UMTS/HSPA+ Standard Module Series UC200T-GL Mini PCIe Hardware Design RF RTS Rx SIMO SMS TX TVS UART UL URC USB

(U)SIM WCDMA WLAN Radio Frequency Ready To Send Receive Direction Single Input Multiple Output Short Message Service Transmitting Direction Transient Voltage Suppressor Up Link Unsolicited Result Code Universal Serial Bus Universal Asynchronous Receiver & Transmitter

(Universal) Subscriber Identification Module Wideband Code Division Multiple Access Wireless Local Area Networks UC200T-GL_Mini_PCIe_Hardware_Design 46 / 51

 

 

UC Ha C20 0T-

war

-GL L Des re D rdw sign n UMTS S/HSPA+

+ Module e Series Rev. UC200T-

-GL_Hard dware_De esign_V1 1.0 Date: 20 19-10-14 4 Statu s: Releas sed wwww.quectel.com UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Our aim assistanc Quectel W Building 5, Shanghai, C Tel: +86 21 Email:info@

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L NOTES OFFERS TH D IS BASED RE THE QUA Y WARRANT LITY FOR A UPON TH WITHOUT P HE INFORM D UPON CU ALITY OF T TY AS TO TH ANY INJURY E INFORMA RIOR NOTI MATION AS STOMERS THE INFOR HE INFORM Y, LOSS O ATION. ALL CE. A SERVICE REQUIRE RMATION IT MATION CO R DAMAGE L INFORMA E TO ITS C MENTS. QU T MAKES AV NTAINED H E OF ANY K ATION SUP CUSTOMER UECTEL MA VAILABLE. HEREIN, AN KIND INCUR PPLIED HER S. THE INF AKES EVER QUECTEL ND DOES NO RRED BY U REIN IS SU FORMATION N RY EFFORT T DOES NOT T OT ACCEPT T USE OF OR R UBJECT TO O GHT ORMATION WIRELESS TING OF T EN WITHOU

. ALL RIG ATION OF A CONTAINE SOLUTION THIS DOCU UT PERMIS GHTS ARE UTILITY MO ED HERE NS CO., LTD UMENT AS SSION. OFF E RESERV ODEL OR D IS PROP D. TRANSM S WELL A FENDERS W VED IN TH DESIGN. RIETARY MITTING, RE AS UTILIZA WILL BE H HE EVENT TECHNICA EPRODUCT ATION OF ELD LIABL T OF A P AL INFORM TION, DISSE THE CON LE FOR PA PATENT G MATION OF F EMINATION N TENT ARE E AYMENT OF F GRANT OR R Copyrigh t Quecte el Wireles ss Solution ns Co., Ltd d. 2019. A All rights re eserved. L_Hardware e_Design1 /

/ 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Abou ut the e Doc cume nt History y Revision Date A Author Des scription 1.0 2019-1 0-14 ouni YANG/

Jo A Andrea ZHAN NG Initi ial L_Hardware e_Design2 /

/ 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Contents s 3 Applic 2.1. 2.2. 2.3. 2.4. 3.1. 3.2. 3.3. 3.4. 3.5. About the D Contents ... Table Index Figure Inde Document . .................. x ................ ex ............... ................. ................. ................. ................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. ................. 2 2 3

.................. 5

.................. 7

.................. 1 Introdu 1.1. uction ........ Safety Info

.................. rmation ...... .................. .................. .................. .................. .................. ................. .................. ................. .................. .................. ................. 9 9

................ 12 2 2 Produc ct Concept General De Key Featur Functional Evaluation

.................. escription ... res .............. Diagram .... Board ........ .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. ................. ................. ................. ................. .................. ................. ................. ................. ................. .................. .................. .................. .................. .................. ............... 14 4

................ 14 4 5

................ 1 7

................ 1 8

................ 1 ation Interf General De Pin Assignm Pin Descrip Operating M Power Sav 5.1. Sleep 3.5 3.5.1.1. 3.5.1.2. 3.5.1.3. 3.5.1.4. 3.6. 3.7. 3.5 3.6 3.6 3.6 5.2. Airpla Power Sup 6.1. Powe 6.2. Decre 6.3. Refer Power-on/o 7.1. Turn 7.2. Turn 3.7 3.7 3.7.2.1. 3.7.2.2. faces .......... escription ... ment .......... ption ........... Modes ....... ving ............. p Mode....... UART App USB Appli USB Appli USB Appli ane Mode ... pply ............. er Supply Pi ease Voltag rence Desig off/Reset Sc on the Mod off the Mod Turn off th Turn off M 3.7 7.3. Rese

(U)SIM Inte USB Interfa UART Inter PCM and I2 SD Card In ADC Interfa Network St et the Module erface ......... ace ............. rfaces ......... 2C Interface nterface* ..... aces ........... tatus Indicat 3.8. 3.9. 3.10. 3.11. 3.12. 3.13. 3.14. .................. .................. .................. .................. .................. .................. .................. plication ....... cation with U cation with U cation witho

................... .................. ns ............... e Drop ........ gn for Power cenarios ...... ule Using th ule .............. e Module Us odule Using e ................. .................. .................. .................. es ................ .................. .................. tion ............. .................. .................. .................. .................. .................. .................. .................. .................. USB Remot USB Suspen out USB Sus

................... .................. .................. .................. r Supply ...... .................. he PWRKEY

................... sing the PW g AT Comma

................... .................. .................. .................. .................. .................. .................. .................. .................. ................. ................. ................. ................. ................. ................. ................. e Wakeup F nd/Resume spend Funct

.................. ................. ................. ................. ................. ................. Y ................. ................. WRKEY Pin . and ............. ................. ................. ................. ................. ................. ................. ................. ................. .................. ................. ................. ................. ................. ................. ................. ................. Function ..... and MAIN_ tion ............. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. .................. .................. .................. .................. .................. .................. .................. .................. .................. _RI Wakeup

................... .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. .................. ............... 19 9

................ 1 9

................ 2 0

................ 2 1 8

................ 2 8

................ 2 8

................ 2 8

................ 2 9

................ 2 0 Function . 3 1

................ 3 1

................ 3

................ 32 2

................ 32 2 3

................ 3

................ 34 4

................ 34 4

................ 34 4

................ 36 6 7

................ 3 7

................ 3 8

................ 3 9

................ 3 1

................ 4 3

................ 4 5

................ 4 8

................ 4 0

................ 5 1

................ 5 L_Hardware e_Design3 /

/ 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 3.15. 3.16. 3.17. STATUS ... Behaviors o FORCE_U

.................. of the MAIN SB_BOOT I

................... _RI ............. Interface ..... .................. .................. .................. ................. ................. ................. ................. ................. ................. .................. .................. .................. ............... 52 2 3

................ 5

................ 54 4 4 Antenn 4.1. na Interface Main Anten 1.1. Pin D 1.2. Oper 1.3. Refer 1.4. Refer Antenna In 2.1. Anten 2.2. Reco e ................. nna Interface Definition ..... rating Freque rence Desig rence Desig stallation ... nna Require ommended R

................... e ................. .................. ency ........... gn of RF Ant gn of RF Lay

................... ement .......... RF Connecto

................... .................. .................. .................. enna Interfa yout ............. .................. .................. or for Anten

................... ................. ................. ................. ace ............. ................. ................. ................. na Installatio

................... ................. ................. ................. ................. ................. ................. ................. on .............. .................. .................. .................. .................. .................. .................. .................. .................. .................. ............... 5

................ 5

................ 5

................ 5

................ 5

................ 5

................ 6

................ 6

................ 6 7 7 7 7 8 9 1 1 1 4.1 4.1 4.1 4.1 4.2 4.2 5 Electri cal, Reliabi Absolute M Power Sup Operation a Current Co RF Output RF Receivi Electrostati ility and Ra Maximum Ra pply Ratings and Storage onsumption . Power ....... ing Sensitivi ic Discharge dio Charac atings .......... .................. e Temperatu

................... .................. ity ............... e ................. cteristics .... .................. .................. res ............. .................. .................. .................. .................. .................. ................. ................. ................. ................. ................. ................. ................. .................. ................. ................. ................. ................. ................. ................. ................. .................. .................. .................. .................. .................. .................. .................. .................. ............... 64 4

................ 64 4 5

................ 6 5

................ 6

................ 66 6 1

................ 7 1

................ 7

................ 72 2 6 Mecha nical Dimen Mechanica Recommen Top and Bo nsions....... l Dimension nded Footpr ottom View o

................... ns of the Mod rint ............... of UC200T-G

................... dule............ .................. GL .............. .................. ................. ................. ................. .................. ................. ................. ................. .................. .................. .................. .................. ............... 73 3

................ 7 3

................ 7 5

................ 76 6 7 Storag ge, Manufac Storage .... Manufactur Packaging cturing and

.................. ring and Sol

.................. Packaging

................... ldering ........ .................. ................. .................. .................. .................. .................. ................. ................. ................. .................. ................. ................. ................. .................. .................. .................. .................. ............... 7

................ 7

................ 7

................ 7 7 7 8 9 8 Appen 9 Appen 10 Appen 11 Appen dix A Refer dix B GPRS dix C GPRS dix D EDGE rences ....... S Coding S S Multi-slot E Modulatio

................... chemes ..... t Classes .... on and Cod

................... .................. .................. ding Schem

................... .................. .................. es .............. .................. .................. .................. .................. .................. .................. .................. .................. ............... 8

................ 8

................ 8

................ 8 1 5 6 8 4.2. 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. 6.1. 6.2. 6.3. 7.1. 7.2. 7.3. L_Hardware e_Design4 /

/ 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Table In dex TABLE 1: UC C200T-GL-E EM FREQUE NCY BANDS S .................. ................... ................... .................. TABLE 2: UC C200T-GL-G GL FREQUEN NCY BANDS S .................. ................... ................... .................. TABLE 3: KE EY FEATUR ES OF UC20 00T-GL MOD DULE ........... ................... ................... .................. TABLE 4: I/O O PARAMET TERS DEFIN NITION .......... ................... ................... ................... .................. TABLE 5: PI N DESCRIP PTION .......... ................... ................... ................... ................... .................. TABLE 6: OV VERVIEW O OF OPERATI NG MODES S ................... ................... ................... .................. TABLE 7: VB BAT AND GN ND PINS ...... ................... ................... ................... ................... .................. TABLE 8: PI N DESCRIP PTION OF PW WRKEY ....... ................... ................... ................... .................. TABLE 9: PI N DESCRIP PTION OF RE ESET_N ...... ................... ................... ................... .................. TABLE 10: P PIN DEFINIT TION OF THE E (U)SIM CA ARD INTERF FACE ............ ................... .................. TABLE 11: P PIN DESCRI PTION OF U USB INTERF FACE ........... ................... ................... .................. TABLE 12: P PIN DEFINIT TION OF THE E MAIN UAR RT INTERFA CE ............... ................... .................. TABLE 13: P PIN DEFINIT TION OF THE E DEBUG UA ART INTERF FACE ........... ................... .................. TABLE 14:L OGIC LEVE LS OF DIGIT TAL I/O ........ ................... ................... ................... .................. TABLE 15: P PIN DEFINIT TION OF PCM M AND I2C I NTERFACE S ................. ................... .................. TABLE 16: P PIN DEFINIT TION OF SD CARD INTE ERFACE ...... ................... ................... .................. TABLE 17: P PIN DEFINIT TION OF THE E ADC INTE RFACES ..... ................... ................... .................. TABLE 18: C CHARACTER RISTIC OF T THE ADC ..... ................... ................... ................... .................. TABLE 19: P PIN DEFINIT TION OF NET TWORK CO NNECTION STATUS/AC CTIVITY IND ICATION..... TABLE 20: W WORKING S STATE OF TH HE NETWOR RK CONNEC CTION STAT TUS/ACTIVIT TY INDICATIO TABLE 21: P PIN DEFINIT TION OF STA ATUS ........... ................... ................... ................... .................. TABLE 22: B BEHAVIORS S OF THE MA AIN_RI ......... ................... ................... ................... .................. TABLE 23: P PIN DEFINIT TION OF FOR RCE_USB_B BOOT INTER RFACE ........ ................... .................. TABLE 24: P PIN DEFINIT TION OF THE E RF ANTEN NNA ............. ................... ................... .................. TABLE 25: U UC200T-GL-

EM MODUL E OPERATIN NG FREQUE ENCIES ....... ................... .................. TABLE 26: A ANTENNA R EQUIREME NTS ............. ................... ................... ................... .................. TABLE 27: A ABSOLUTE M MAXIMUM R RATINGS ..... ................... ................... ................... .................. TABLE 28: T THE MODUL LE POWER S SUPPLY RAT TINGS ........ ................... ................... .................. TABLE 29: O OPERATION N AND STOR RAGE TEMPE ERATURES

.................... ................... .................. TABLE 30: U UC200T-GL-

EM CURRE NT CONSUM MPTION ...... ................... ................... .................. TABLE 31: U UC200T-GL-

GL CURREN NT CONSUM MPTION ....... ................... ................... .................. TABLE 32: R RF OUTPUT T POWER .... ................... ................... ................... ................... .................. TABLE 33: U TABLE 34 UC200T-GL-

EM CONDU CTED RF R RECEIVING S SENSITIVITY Y .................. .................. UC200T-GL L-GL CONDU UCTED RF R RECEIVING S SENSITIVITY Y ................. .................. TABLE 35: E ELECTROST TATICS DISC CHARGE CH HARACTERIS STICS (TEM MPERATURE E=25 C, HUM

................... ................... ................... ................... ................... ................... ................... .................. TABLE 36: R RECOMMEN NDED THER MAL PROFI LE PARAME ETERS ......... ................... .................. TABLE 37: R RELATED DO OCUMENTS S ................... ................... ................... ................... .................. TABLE 38: T TERMS AND D ABBREVIAT TIONS ......... ................... ................... ................... .................. TABLE 39: D DESCRIPTIO ON OF DIFF ERENT COD DING SCHEM MES ............ ................... .................. TABLE 40: G GPRS MULT TI-SLOT CLA ASSES ......... ................... ................... ................... .................. ............... 14 4

................ 14 4

................ 15 5

................ 21 1

................ 21 1

................ 28 8

................ 32 2

................ 34 4

................ 38 8

................ 39 9

................ 42 2

................ 43 3

................ 44 4

................ 44 4

................ 46 6

................ 48 8

................ 50 0

................ 50 0

................ 51 1 ON .......... 51 1

................ 52 2

................ 54 4

................ 54 4

................ 57 7

................ 57 7

................ 61 1

................ 64 4

................ 65 5

................ 65 5

................ 66 6

................ 68 8

................ 71 1

................ 71 1

................ 72 2 MIDITY=45%

................ 72 2

................ 78 8

................ 81 1

................ 81 1

................ 85 5

................ 86 6 L_Hardware e_Design5 /

/ 84 UC200T-GL TABLE 41: E EDGE MODU ULATION AN ND CODING SCHEMES ..................... ................... .................. ............... 88 8 UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n L_Hardware e_Design6 /

/ 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Figure In ndex FIGURE 1: F FUNCTIONA AL DIAGRAM M .................. ................... ................... ................... .................. FIGURE 2: P PIN ASSIGN NMENT (TOP P VIEW) ....... ................... ................... ................... .................. FIGURE 3: S SLEEP MOD DE APPLICAT ATION VIA UA ART ............. ................... ................... .................. FIGURE 4: S SLEEP MOD DE APPLICAT ATION WITH USB REMO TE WAKEUP P ................. .................. FIGURE 5: S SLEEP MOD DE APPLICA ATION WITH MAIN_RI .... ................... ................... .................. FIGURE 6: S SLEEP MOD DE APPLICAT ATION WITHO OUT SUSPE END FUNCTI ION ............. .................. FIGURE 7: P POWER SUP PPLY LIMITS S DURING B BURST TRAN NSMISSION N ................... .................. FIGURE 8: S STAR STRU CTURE OF THE POWE R SUPPLY .. ................... ................... .................. FIGURE 9: R REFERENC E CIRCUIT O OF POWER SUPPLY .... ................... ................... .................. FIGURE 10:

: REFERENC CE CIRCUIT T OF TURING G ON THE M MODULE US ING DRIVIN G CIRCUIT FIGURE 11:

REFERENC CE CIRCUIT T OF TURING G ON THE M MODULE US ING KEYSTR ROKE ......... FIGURE 12:

: TIMING OF F TURNING O ON THE MO ODULE ......... ................... ................... .................. FIGURE 13:

: TIMING OF F TURNING O OFF THE MO ODULE ....... ................... ................... .................. FIGURE 14:

: REFERENC CE CIRCUIT T OF RESET TING THE M MODULE BY Y USING DRI IVING CIRCU FIGURE 15:

: REFERENC CE CIRCUIT T OF RESET TING THE M MODULE BY Y USING BUT TTON .......... FIGURE 16:

: TIMING OF F RESETTIN G MODULE

................... ................... ................... .................. FIGURE 17:

: REFERENC CE CIRCUIT T OF (U)SIM INTERFACE E WITH AN 8 8-PIN (U)SIM M CARD CON NNECTOR

................... ................... ................... ................... ................... ................... ................... .................. FIGURE 18:

: REFERENC CE CIRCUIT T OF (U)SIM INTERFACE E WITH A 6-P PIN (U)SIM C CARD CONN FIGURE 19:

: REFERENC CE CIRCUIT T OF USB AP PPLICATION N ................... ................... .................. FIGURE 20:

: REFERENC CE CIRCUIT T WITH A LEV VEL TRANS LATOR CHIP P ................. .................. FIGURE 21:

: REFERENC CE CIRCUIT T WITH A TRA ANSISTOR CIRCUIT ..... ................... .................. FIGURE 22:

: PRIMARY M MODE TIMIN NG ............... ................... ................... ................... .................. FIGURE 23:

: REFERENC CE CIRCUIT T OF PCM AP PPLICATION N WITH AUD DIO CODEC . .................. FIGURE 24:

: REFERENC CE CIRCUIT T OF SD CAR RD INTERFA ACE .............. ................... .................. FIGURE 25:

: REFERENC CE CIRCUIT T OF THE NE ETWORK ST TATUS INDIC CATION ....... .................. FIGURE 26:

: REFERENC CE CIRCUIT TS OF STATU US ............... ................... ................... .................. FIGURE 27:

: REFERENC CE CIRCUIT T OF FORCE E_USB_BOO OT INTERFAC CE .............. .................. FIGURE 28:

: TIMING SE EQUENCE FO OR ENTERI NG EMERG ENCY DOW WNLOAD MO ODE ............. FIGURE 29:

: REFERENC CE CIRCUIT T OF RF ANT TENNA INTE ERFACE ....... ................... .................. FIGURE 30:

: MICROSTR RIP DESIGN ON A 2-LAY YER PCB ..... ................... ................... .................. FIGURE 31:

: COPLANAR R WAVEGUI DE DESIGN N ON A 2-LAY YER PCB ..... ................... .................. FIGURE 32:

: COPLANAR R WAVEGUI DE DESIGN N ON A 4-LAY YER PCB (LA AYER 3 AS R REFERENC

................... ................... ................... ................... ................... ................... ................... .................. FIGURE 33:

: COPLANAR R WAVEGUI DE DESIGN N ON A 4-LAY YER PCB (LA AYER 4 AS R REFERENC

................... ................... ................... ................... ................... ................... ................... .................. FIGURE 34:

: DIMENSIO NS OF THE U.FL-R-SMT T CONNECT TOR (UNIT: M MM) ............. .................. FIGURE 35:

: MECHANIC CALS OF U.F FL-LP CONN NECTORS ... ................... ................... .................. FIGURE 36:

: SPACE FAC CTOR OF M ATED CONN NECTORS (U UNIT: MM) ... ................... .................. FIGURE 37:

: MODULE T TOP AND SID DE DIMENS IONS ........... ................... ................... .................. FIGURE 38:

: MODULE B BOTTOM DIM MENSIONS

(BOTTOM V VIEW) ........... ................... .................. ............... 17 7

................ 20 0

................ 29 9

................ 30 0

................ 30 0

................ 31 1

................ 33 3

................ 33 3

................ 34 4

................ 35 5

................ 35 5

................ 36 6

................ 37 7 UIT .......... 38 8

................ 39 9

................ 39 9

................ 40 0 NECTOR . 41 1

................ 42 2

................ 45 5

................ 45 5

................ 46 6

................ 47 7

................ 49 9

................ 52 2

................ 53 3

................ 55 5

................ 55 5

................ 58 8

................ 59 9

................ 59 9

) E GROUND

................ 60 0

) E GROUND

................ 60 0

................ 61 1

................ 62 2

................ 63 3

................ 73 3

................ 74 4 L_Hardware e_Design7 /

/ 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n FIGURE 39:

: RECOMME ENDED FOO OTPRINT (TO OP VIEW) .... ................... ................... .................. FIGURE 40:

: TOP VIEW OF THE MO ODULE ......... ................... ................... ................... .................. FIGURE 41:

: BOTTOM V VIEW OF TH E MODULE . ................... ................... ................... .................. FIGURE 42:

: REFLOW S SOLDERING G THERMAL PROFILE .... ................... ................... .................. FIGURE 43:

: TAPE AND REEL SPEC CIFICATIONS S ................. ................... ................... .................. FIGURE 44:

: TAPE AND REEL DIRE CTIONS ...... ................... ................... ................... .................. ............... 75 5

................ 76 6

................ 76 6

................ 78 8

................ 80 0

................ 80 0 L_Hardware e_Design8 /

/ 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n ntrod ductio on 1 In This docum are connect This docum mechanical application applications ment helps details, as note and us s easily. FCC Certific cation Requ irements. mobile devic ce. And the follo owing condi tions must b be met:

ment defines ted with cus UC200T-GL tomers app L module an plications. nd describes s its air inte rface and ha ardware inte erface which h customers s well as o ser guide, c quickly un other relate customers c derstand m ed informati can use UC module inter ion of UC2 200T-GL m rface specif 200T-GL mo odule to de fications, el odule. Asso esign and se ectrical and d ociated with h et up mobile e According to o the definit ion of mobile e and fixed device is de escribed in P Part 2.1091(

b), this devi ce is a 1. This Mod dular Approv val is limited to OEM inst tallation for m mobile and f fixed applica ations only. T The antenna a installation a and operatin ng configura ations of this s transmitter r, including a any applicab ble source-ba ased time-

averaging d duty factor, a antenna gain n and cable loss must sa atisfy MPE c categorical E Exclusion R equirements s of 2.1091. 2. The EUT is a mobile device; mai ntain at leas st a 20 cm se eparation be etween the E EUT and the e users body y and mus st not transm mit simultane eously with a any other an ntenna or tra ansmitter. 3.A label wit th the follow wing stateme ents must be e attached to o the host e nd product:

This device contains FCC ID: X XMR202007 7UC200TGL L. 4.To comply y with FCC r regulations l imiting both maximum R RF output po ower and hu uman expos sure to RF radiation n, maximum antenna ga ain (including g cable loss

) must not e exceed:

GSM85 50: <7.636d Bi L_Hardware e_Design9 /

/ 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n GSM19 WCDM WCDM 900: <9.360d MA B2: <8.00 MA B5: <9.41 dBi 00dBi 16dBi 5. This mo odule must n not transmit s simultaneou usly with any y other anten nna or trans smitter 6. The host end produc ct must inclu de a user m manual that c clearly define es operating g requireme nts and conditions s that must be observed d to ensure c compliance with current t FCC RF ex xposure guid delines. For porta ble devices,

, in addition to the cond itions 3 thro ugh 6 descr ribed above,

, a separate approval is required t to satisfy the e SAR requi rements of FCC Part 2. 1093 If the dev vice is used f for other equ uipment tha t separate a approval is re equired for a all other ope erating configura tions, includ ding portable e configurati ons with res spect to 2.10 093 and diffe erent antenn na configura tions. For this device, OEM M integrator rs must be p provided with h labeling ins structions of f finished pr oducts. Please r refer to KDB B784748 D0 1 v07, sectio on 8. Page 6 6/7 last two paragraphs

A certifie ed modular h has the optio on to use a permanently y affixed lab bel, or an ele ectronic labe el. For a permane ently affixed label, the m module must t be labeled with an FCC C ID - Sectio on 2.926 (se ee 2.2 Certifica ation (labelin ng requireme ents) above)

). The OEM manual mu st provide c lear instruct tions explainin ng to the OE EM the label ing requirem ments, optio ns and OEM M user manu ual instructio ons that are required d (see next p paragraph). For a hos st using a ce ertified modu ular with a st tandard fixe d label, if (1

) the module es FCC ID is not visible e when inst talled in the host, or (2) if the host is s marketed s so that end users do no ot have straig ghtforward commonly y used meth hods for acc cess to remo ove the mod ule so that t the FCC ID o of the modu le is visible;

then an a dditional pe rmanent lab bel referring to the enclo sed module

:Contains T Transmitter M Module FCC C ID: XMR2 202007UC20 00TGL or C Contains FC CC ID: XMR R202007UC2 200TGL mu ust be used. The host OEM use er manual m ust also con ntain clear in nstructions o on how end u users can fin nd and/or ac ccess the module a nd the FCC ID. L_Hardware e_Design10 0 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n The final host / modu ule combinat tion may als so need to be e evaluated against the FCC Part 1 15B criteria for uninte entional radia ators in orde er to be prop perly authori ized for ope ration as a P Part 15 digit tal device. The user s manual or r instruction manual for an intention nal or uninte ntional radia ator shall ca ution the user that changes or modification ns not expre essly approv ved by the p arty respons sible for com mpliance could void d the user's authority to operate the e equipment t. In cases w where the ma anual is prov vided only in n a form oth her than pap per, such as s on a compu uter disk or over the Inte ernet, the in formation re equired by this sectio on may be in ncluded in th he manual in n that alterna ative form, p provided the user can re easonably be e expected to have the e capability to o access inf formation in that form. This devic ce complies s with part 15 5 of the FCC C Rules. Ope eration is su ubject to the following tw wo conditions s:

(1) This d device may n not cause ha armful interf ference, and d (2) this dev vice must ac ccept any int terference received, including in nterference t that may cau use undesire ed operation n. Changes or modificat tions not exp pressly appr roved by the e manufactu rer could vo oid the users s authority to o operate th he equipme nt. compliance w with the mo as an uninte certified mod e module is al radiator re transmitter f with all non-

talled and fu odule(s) inst ator under t entional radia module is ad dule and a m installed and d operationa s. equirements functions the lly operation he Declarat dded, the ho al the host c e host manu nal. For exam ion of Confo ost manufact continues to ufacturer is r mple, if a ho ormity proce turer is respo be complian responsible ost was prev edure withou onsible for e nt with the P for ensuring g viously ut a ensuring tha Part 15B at To ensure c compliance authorized a transmitter c the after the unintentiona UC200T-GL L_Hardware e_Design11

/ 84 UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 1.1. Safe ety Inform mation The followin or repair of terminal sho these guide forcustomer ng safety pre any cellular ould send th elines into rs failure to ecautions m r terminal or he following all manuals comply with must be obse mobile inco g safety info s supplied h these prec erved during orporating U ormation to with the pr cautions. g all phases UC200T-GL users and o roduct. If no of operatio module. Ma operating pe ot so, Que n, such as u anufacturers ersonnel, an ctel assume usage, servi of the cellu nd incorpora es no liabil ice lar ate lity F Full attention a accident. U d distraction a r restricting th n must be g sing a mo and can lead he use of wir given to drivi bile while d to an accid reless device ing at all tim driving (eve dent. Please es while driv mes in order en with a e comply wi ving. to reduce th handsfree ith laws and he risk of an n kit) causes s d regulations s S Switch off th o of wireless c communicat e enabled prio r restrictions o he cellular te appliances tion systems or to board on the use o erminal or m in an aircr s. If the dev ing an airc of wireless d obile before raft is forbi vice offers a raft. Please evices on bo dden to pre n Airplane M e consult th oarding the e boarding a n aircraft. Th event interf Mode, then e airline sta aircraft. he operation n ference with h it should be e aff for more e W Wireless de p please be a h hospitals,clin evices may aware of th nics or other cause inte he restrictio r healthcare facilities. rference on ons on the n sensitive use of wir medical eq eless devic uipment, so o ces when in n T The cellular r receives and u used close t terminal or m d transmits o TV set, ra mobile conta radio freque dio, comput ains a transm ency signals ter or other e mitter and re s. RF interfe electric equi eceiver. Whe erence can pment. en it is ON, i it occur if it is s L_Hardware e_Design12 2 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n I n locations o off wireless p potentially e f fuel or che c chemicals or with potent devices su explosive atm mical trans r particles su ially explosi ch as your mospheres sfer or stor uch as grain ve atmosph phone or o include fue rage facilitie n, dust or me heres, obey other cellula lling areas, es, areas w etal powders all posted s ar terminals below deck where the s, etc. signs to turn n

. Areas with h ks on boats s, air contains s L_Hardware e_Design13 3 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Produ uct Co once pt 2.1. Gen neral Des scription L is a WCDM MA/GSM wir reless comm munication m module. Itsge eneralfeatur resarelistedb below rt HSDPA, H e audio supp HSUPA, HSP port for custo PA+, WCDM omers spec MA, EDGE, G cific applicat GSM and GP tions. PRS covera age. Lis available C200T-GLar e in two var reshown in t riants:UC200 the following 0T-GL-EM a g tables. and UC200T T-GL-GL. Th he supporte ed frequency y Table 1: UC C200T-GL-E EMFrequen cy Bands Table 2: UC C200T-GL-G GLFrequenc cy Bands Frequen ncy Bands B1/B8 900/1800 0MHz Frequen ncy Bands B1/B2/B 5/B6/B8 850/900/

/1800/1900M MHz L is an SM 80 LCC pins st all requir uter, wireles MD-type mod and 64 LGA rements for ss POS, mob dule which A pins). Wit M2M appl bile computi can be em th a compac ications suc ng device, P mbedded in ct profile of 2 ch as autom PDA phone, application 29.0mm 3 motive, met tablet PC a s through i 32.0mm 2 tering, track and etc. its 144 pins s

.4mm, it can n m, king system 2 P UC200T-GL Suppor Provide UC200T-GL bands of UC Type WCDMA GSM Type WCDMA GSM UC200T-GL

(including 8 meet almos security, rou L_Hardware e_Design14 4 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 2.2. Key y Feature es The followin ng table des cribes the d etailedfeatu ures of UC20 00T-GL mod dule. Table 3: Ke ey Features s of UC200T T-GL Modul e Feature Details s Power Sup pply Supply Typica y voltage: 3. al supply volt 4V~4.5V tage: 3.8V Transmittin ng Power UMTS Fea atures Class 4 Class Class Class Class 4 (33dBm2 1 (30dBm2 E2 (27dBm E2 (26dBm 3 (24dBm+1 2dB) for GSM 2dB) for DCS 3dB) for GS 3dB) for DC 1/-3dB) for W M850/EGSM S1800/PCS SM850/EGS CS1800/PC WCDMA ban M900 1900 SM900 8-PS S1900 8-PS nds SK SK SPA+, HSU ulation PA and WCD DMA Suppo Suppo HSPA+

HSUPA WCDM ort 3GPP R7 ort QPSK, 16

+: Max 21M A: Max 5.76 MA: Max 384 7 HSDPA, HS 6-QAM mod bps (DL) 6Mbps (UL) 4Kbps (DL), Max 384Kb bps (UL) RS multi-slot mes: CS-1, C s (DL), Max class 12 CS-2, CS-3 x 85.6Kbps (

and CS-4 UL) GPRS Su upport GPR Co oding schem M ax 85.6Kbp EDGE Su upport EDG Su upport GMS Sc cheme) Do ownlink cod Up plink coding M ax 236.8Kb Suppo SSL/F Suppo Hands connec ort TCP/UDP ILE/MQTT/S ort PAP (Pas shake Authe ction GSMFeatu ures E multi-slot SK and 8-PS class 12 SK for diffe rent MCS (

Modulation and Coding g ing scheme g schemes: C ps (DL), Ma s: CS 1-4 an CS 1-4 and ax 236.8Kbp nd MCS 1-9 9 MCS 1-9 s (UL) P/PPP/NTP/

SMTP*/MMS ssword Auth ntication Pro NITZ/FTP/H S*/SMTPS*

entication P otocol) proto protocols HTTP/PING/

CMUX/HTT TPS/FTPS/

Protocol) and ocols which d CHAP (Ch as usually u hallenge used for PPP P rotocol Internet Pr Features SMS Text a Point-t SMS c SMS s nd PDU mo to-point MO cell broadcas storage: (U)S des and MT st SIM card cu rrently USIM Inter rface Suppo ort USIM/SIM M card: 1.8V V/3.0V L_Hardware e_Design15 5 / 84 UC200T-GL Audio Feat tures PCM Interf face USB Interf face UART Inte erface UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n cification (sla aveonly), wit th transmiss sion rates up p on, data transmissio n, software e rface: PCM interface Suppo GSM:

WCDM Suppo ort one digita HR/FR/EFR MA: AMR/AM ort echo canc al audio inter R/AMR/AMR MR-WB cellation and R-WB Used f Suppo Suppo Suppo for audio fun ort 16-bit line ort short fram ort master an nction with a ear data form me synchron nd slave mo an external c mat nization des d noise supp pression codec chip SB 2.0 spec Compl to 480 Used debug Suppo W W Li An Main U Us Ba Su ommand c mware upgr al drivers for

/8.1/10 5.0/6.0/7.0*

liant with US Mbps for AT co ging and firm ort USB seria Windows 7/8/

Windows CE nux 2.6~5.0 0

.x/6.x/7.x/8.x ndroid 4.x/5 UART sed for AT c aud rate rea upport RTS command co ach up to 1M and CTS ha communicati ade r:

x/9.x Debug Us 11 g UART sed for Linu 15200bps ba x console, lo aud rate og output ommunicatio Mbps; 11520 ardware flow on and data 00bps by def w control transmissio fault on SD Card In nterface*

Suppo ort SD3.0 pro otocol AT Comma ands Network In ndication Compl comma liant with 3 ands NET_M connec MODE and d NET_STA s ctivity status 3GPP TS 27.007, 27 7.005 and Quectel en nhanced AT T ATUS are used to indicate he network t k Antenna In nterface Main a antenna inte rface (ANT_ _MAIN) Physical C Characteristic cs Temperatu ure Range Size: (

Weigh

(29.00.15)m t: approx. 4 mm(32.00

.3g 0.15)mm(2

.40.2)mm Operat Extend Storag tion tempera ded tempera ge temperatu ature range:

ature range:

ure range: -4

: -35C ~ +7

-40C ~ +8 40C ~ +90 75C 1) 5C 2) C Firmware U Upgrade USB in nterface and d FOTA RoHS All har rdware comp ponents are fully compli ant with EU RoHS direc ctive L_Hardware e_Design16 6 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n ture range, ature range, n, emergenc ectrum and n and exceed t ure levels, th the module the module cy call, etc. no harm to ra the specifie he module w is 3GPP co remains the There is no adio networ d tolerances will meet 3G mpliant. e ability to e o unrecovera k. Only one s. When the PP specifica establish an able malfun or more par e temperatu ations again d maintain a a nction. There e rameters like e re returns to o

. NOTES 1. 1) Within 2. 2) Within voice, S are also Pout mig the norm n the operati n the extend SMS, data t o no effects o ght reduce th mal operatin ns under de on tempera ded tempera ransmission on radio spe heir value a ng temperatu evelopment. 3. * mea 2.3. Fun ctional D Diagram The followin Power Baseba Flash Radio f Periphe managemen and nt frequency eral interface es ng figure sho ows a block diagram of UC200T-GL L and illustra ates the maj jor functiona al parts. ANT_MAIN N PAM Duplex x PA Tx PRx VBAT T_RF VBAT T_BB PWR RKEY A ADCs PMIC Co ontrol 32K XO Transceive er 26M VC_TXCO FLASH I Q Control Baseban nd RAM V VDD_EXT RESET_ _N USB

(U)S SIM PCM I2 C UARTs S STATUS SD Figure 1:

Functiona l Diagram L_Hardware e_Design17 7 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 2.4. Eva luation B Board In order to board (EVB the module. help custom B), USB to R

. For more d mers to dev RS-232 conv details, pleas velop applic verter cable, se refer to d UC200T-G cations with earphone, a antenna and 4]. document [4 GL, Quectel d other perip provides an pherals to co n evaluation n st ontrol or tes L_Hardware e_Design18 8 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Applic cation n Inte erface es 3.1. Gen neral Des scription L is equippe platforms. T ed with 80 The following LCC pins a g sections p and 64 LGA rovide detai A pins, whi led descript ch can be ions of pins/

embedded

/interfaces li r into cellula isted below. supply interface terface interfaces nd I2C inter d interface*

nterfaces rfaces indication E_USB_BOO OT interface e

* means fu unction of th he SD card i nterface is u under develo opment. 3 A UC200T-GL application Power

(U)SIM USB in UART i PCM a SD card ADC in Status FORCE NOTE L_Hardware e_Design19 9 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 3.2. Pin Assignm ment The followin ng figure sho ows the pin assignment of UC200T-

-GL module

. WA WAKEUP_IN A AP_READY R RESERVED 3 W_ _DISABLE#

N NET_MODE NET T_ST ATUS VDD_EXT R RESERVED R RESERVED 141 142 GND GND U USIM_GND DBG_RXD DBG_TXD U USIM_DET U USIM_VDD U USIM_DATA USIM_CLK USIM_RST R RESERVED 1 2 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 U S B _ V B U S U S B _ D M U S B _ D P I M A N _ R X D I M A N _ T X D I M A N _ D T R I M A N _ R T S I M A N _ C T S I M A N _ D C D G G N N D D I M A N _ R I S T A T U S V B A T _ B B V V B B A A T T _ B B B B V B A T _ R F V B A T _ R F G N D R E S E R V E D 7 7 2 2 7 1 7 0 6 9 6 6 8 8 6 7 6 6 6 5 6 4 6 3 6 2 6 1 6 0 5 5 9 9 5 8 5 7 5 6 5 5 5 5 108 103 99 9 95 90 85 109 104 100 9 96 91 86 110 105 92 87 82 83 84 79 80 81 76 77 78 73 74 75 111 106 101 9 97 93 88 112 107 102 9 98 94 89 1 1 9 9 2 0 2 1 2 2 2 2 3 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 3 2 2 3 3 3 4 3 5 3 3 6 6 G G N N D D R E S E T _ N P W R K E Y G N D S S D D _ D D E E T T P C M _ D N I P C M _ D O U T P C M _ S Y N C P C M _ C L K I S D _ S D O _ D A T A 3 I S D _ S D O _ D A T A 2 I S D _ S D O _ D A T A 1 I S D _ S D O _ D A T A 0 G G N N D D I I S S D D _ S S D D O O _ C C L L K K I S D _ S D O _ C M D I S D _ S D O _ V D D R E S E R V E D R E S E R V E D R E S E R V E D 1 1 4 1 1 3 129 117 130 118 131 119 132 120 133 121 134 122 135 123 136 124 137 125 138 126 139 127 140 128 1 1 6 1 1 5 R E S E R V E D F O R C E _ U S B _ B O O T 1

) GND GND GND GND GND GND ANT_ _MAIN 144 143 47 RESE ERVED RESE ERVED RESE ERVED GND ADC0 0 ADC 1 RESE ERVED I2C_S SDA I2C_S SCL RESE ERVED RESE ERVED RESE ERVED RESE ERVED 54 53 52 51 50 49 48 46 45 44 43 42 41 40 39 38 37 Power Pins GND P Pins Signal Pins RES SERVED Pins Fi gure 2: Pin n Assignme ent (Top Vie ew) NOTES 1. 2. 1) mean If PCM capacit Other connec 3. GND p be used ns pin FORC M_CLK, SD_ tor close to unused pin cted to the g ins 85~112 d in schema CE_USB_BO _SDIO_CLK each of the s and RES round. should be c atics and PC L_Hardware e_Design20 0 / 84 UC200T-GL OOT cannot K, and I2C_S e three pins SERVED pi t be pulled u SCL are no s to prevent ns should up before sta ot used, it i interference be kept op artup. s recomme e from affec pen, and al nded to mo cting RFs p l GND pins ount a 33pF F performance e. s should be e connected to CB layoutdes o ground. RE sign, and the ESERVED p ese pins sho pins 73~84 a ould be serv and 117~14 ved as a kee 0 should no epout area. ot UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 4. The fun nction of the e SD card int terface is un nder develop pment. 3.3. Pin Descript tion The followin Table 4: I/O O Paramete rs Definitio on ng tables sho ow the pin d definition of UC200T-GL L module. Type AI AO DI DO IO OD PI PO Des scription Ana alog Input Ana alog Output Dig ital Input Dig ital Output Bidi irectional Ope en Drain Pow wer Input Pow wer Output Table 5: Pin n Descriptio on Power Su pply Input Pin Name Pin No o. I/O Descriptio on DC Charac cteristics Comment VBAT_BB 59,60 PI VBAT_RF 57,58 PI Power sup the module baseband pply for es part pply for es RF Power sup the module part Vmax=4.5V V V Vmin=3.4V Vnorm=3.8 8V Vmax=4.5V V V Vmin=3.4V Vnorm=3.8 8V It must be p sufficient cu 0.8A. It must be p sufficient cu 1.8A. providedwith h urrent up to providedwith h urrent up to GND Ground 8,9,19, 22, 36,46,4 50~54, 72, 48, 56, L_Hardware e_Design21 1 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 85~112 2 Power Su pply Outpu ut Pin Name Pin No o. I/O Descriptio on DC Charac cteristics Comment VDD_EXT T 7 PO Provide 1. external ci 8V for rcuit Vnorm=1.8 IOmax=50m 8V mA Power supp external GP circuits. If unused, k ply for PIOs pull up p keep it open n. Power on/

/off PWRKEY 21 Status Ind dication Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt RESET_N 20 VILmax=0. 5V

, keep it If unused open. DI DI module Reset the Active Low w. f the Turnon/off module VILmax=0. 5V VBAT pow wer domain. Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt NET_MOD DE 5 DO NET_ STATUS 6 DO STATUS 61 OD USB Interf face VOHmin=1. VOLmax=0

.35V

.45V VOHmin=1. VOLmax=0

.35V

.45V Indicate th modules n registration he network n mode Indicate th modules n activity sta he network atus he operation Indicate th modules o status Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt USB_DP 69 IO rential data USB differ

(+) USB_DM 70 IO rential data USB differ

(-) L_Hardware e_Design22 2 / 84 UC200T-GL wer domain.

, keep it wer domain.

, keep it nal pull-up s required.

, keep it 1.8V pow If unused open. 1.8V pow If unused open. An extern resistor is If unused open. compliant;

rential ce;

, keep it USB 2.0 c 90 diffe impedanc If unused open. compliant;

rential ce.

, keep it USB 2.0 c 90 diffe impedanc If unused open. UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n USB conn detection ection Vmax=5.2 5V V Vmin=3.0V Vnorm=5.0 0V 5.0V

, keep it Typical: 5 If unused open. Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt USB_VBU US 71 AI

(U)SIM Int terface USIM_GN D 10 Dedicated for (U)SIM M ground USIM_DET T 13 DI

(U)SIM ca detection rd USIM_VDD D 14 PO Power sup

(U)SIM ca pply for rd A GND pi connect (

connecto in used to U)SIM card r. wer domain.

, keep it 1.8V pow If unused open. 8V or 3.0V ard is d and can fied cally by the Either 1.8

(U)SIM ca supported be identif automatic module. VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V Iomax=50m mA For 1.8V (

U)SIM:

Vmax=1.9V V Vmin=1.7V V U)SIM:

For 3.0V (

5V Vmax=3.0 Vmin=2.7V V U)SIM:

6V 2V

.45V

.35V For 1.8V (

VILmax=0. VIHmin=1.2 VOLmax=0 VOHmin=1. For 3.0V (

VILmax=1. VIHmin=1.9 VOLmax=0 VOHmin=2. U)SIM:

0V 95V

.45V

.55V U)SIM:

.45V

.35V For 1.8V (

VOLmax=0 VOHmin=1. For 3.0V (

VOLmax=0 VOHmin=2. U)SIM:

.45V

.55V For 1.8V (

VOLmax=0 VOHmin=1. U)SIM:

.45V

.35V USIM_DAT TA 15 IO

(U)SIM da ta USIM_CLK K 16 DO

(U)SIM clo ock USIM_RST T 17 DO

(U)SIM res set L_Hardware e_Design23 3 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n For 3.0V (

VOLmax=0 VOHmin=2. U)SIM:

.45V

.55V Main UAR RT Interface e Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt MAIN_RI 62 DO Ring indica ation VOLmax=0 VOHmin=1. 45V

.35V MAIN_DCD D 63 DO er Data carrie detection VOLmax=0 VOHmin=1. 45V

.35V wer domain.

, keep it wer domain.

, keep it wer domain.

, keep it 1.8V pow If unused open. 1.8V pow If unused open. 1.8V pow If unused open. wer domain.

, keep it 1.8V pow If unused open. wer domain. ed, keep i it 1.8V pow If unuse open. wer domain.

, keep it 1.8V pow If unused open. wer domain.

, keep it 1.8V pow If unused open. wer domain.

, keep it 1.8V pow If unused open. wer domain.

, keep it 1.8V pow If unused open. MAIN_CTS S 64 DO Clear to se end MAIN_RTS S 65 DI Request to o send MAIN_DTR R 66 DI Data termi inal ready MAIN_TXD D 67 DO Transmit d data MAIN_RXD D 68 DI Receive da ata Debug UA ART Interfac ce DBG_RXD D 11 DI Debug rec ceive data DBG_TXD D 12 DO Debug tran nsmit data VOLmax=0 VOHmin=1. 45V

.35V VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V VOLmax=0 VOHmin=1. 45V

.35V VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V VOLmax=0 VOHmin=1. 45V

.35V L_Hardware e_Design24 4 / 84 UC200T-GL Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n ADC Inter rfaces ADC1 44 AI ADC0 45 AI PCM & I2C C Interfaces s Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt urpose digital General-pu analog to d converter urpose digital General-pu analog to d converter Voltage ran 0V to VBA nge:

AT_BB

, keep it If unused open. Voltage ran 0V to VBA nge:

AT_BB

, keep it If unused open. Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V VOLmax=0 VOHmin=1. 45V

.35V VOLmax=0 VOHmin=1. VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 45V

.35V 3V 6V 2V 0V VOLmax=0 VOHmin=1. VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 45V

.35V 3V 6V 2V 0V wer domain.

, keep it 1.8V pow If unused open. wer domain.

, keep it wer domain. r mode, as an output t mode, as an input

, keep it wer domain. r mode, as an output t mode, as an input

, it is ended to 33pF close to the e 1.8V pow If unused open. 1.8V pow In master itserves a signal. In slave m itserves a signal. If unused open. 1.8V pow In master itserves a signal. In slave m itserves a signal. If unused recomme mount a 3 capacitor pin. An extern pull-up re required. If unused recomme mount a 3 nal 1.8V esistor is

, it is ended to 33pF PCM_DIN 24 DI PCM data input PCM_DOU UT 25 DO PCM data output PCM_SYN NC 26 IO PCM data synchroniz frame zation PCM_CLK K 27 IO PCM clock k I2C_SCL 41 OD I2C serial external co clock for odec L_Hardware e_Design25 5 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt I2C_SDA 42 OD I2C serial external co data for odec SD Card In nterface*

SD_DET 23 DI SD card de etect SD_SDIO_ _ DATA3 28 IO SD card S bit 3 DIO data SD_SDIO_ _ DATA2 29 IO SD card S bit 2 DIO data SD_SDIO_ _ DATA1 30 IO SD card S bit 1 DIO data SD_SDIO_ _ DATA0 31 IO SD card S bit 0 DIO data SD_SDIO_ _ CLK 32 DO SD card S DIO clock 33 IO SD card S command DIO 34 PO SD card S power DIO L_Hardware e_Design26 6 / 84 SD_SDIO_ _ CMD SD_SDIO_ _ VDD UC200T-GL close to the e capacitor pin. An extern pull-up re required. If unused open. nal 1.8V esistor is

, keep it V power

, keep it V power

, keep it V power

, keep it V power

, keep it V power

, keep it V power 1.8V/2.8V domain. If unused open. 1.8V/2.8V domain. If unused open. 1.8V/2.8V domain. If unused open. 1.8V/2.8V domain. If unused open. 1.8V/2.8V domain. If unused open. 1.8V/2.8V domain. If unused recomme mount a 3 capacitor pin. 1.8V/2.8V domain. If unused open. 1.8V/2.8V domain.

, it is ended to 33pF close to the e V power

, keep it V power UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n

, keep it If unused open. Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt ANT_MAIN N 49 IO Main anten nna 50imped dance RF Interfa ace Other Inte erfaces Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt WAKEUP_ _IN 1 DI Wake up t he module AP_READ DY 2 DI Application n sleep processor state detec ction W_DISABL LE# 4 DI mode Airplane m control USB FORCE_U _BOOT 115 DI Force USB B boot RESERVE ED Pins VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V VILmin=-0. VILmax=0. VIHmin=1.2 VIHmax=2. 3V 6V 2V 0V wer domain.

, keep it 1.8V pow If unused open. wer domain.

, keep it 1.8V pow If unused open. wer domain. y default. w voltage module will plane mode.

, keep it 1.8V pow Pull-up by In the low level, the enter airp If unused open. 1.8V pow Active hig It is recom reserve te wer domain. gh. mmended to o est points. Pin Name Pin N No. I/O Descriptio on DC Chara cteristics Commen nt RESERVE ED Reserved Keepthes unconnec se pins cted 3, 18 37~4 47, 5 73~8 113, 116~

8, 35 40, 43, 55, 84, 114, 144 NOTE UC200T-GL L_Hardware e_Design27 7 / 84 UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n

* means th he function o of SD card i nterface is u under develo opment. ng table brie efly outlines t the operatin ng modes to be mention ed in the fol llowing secti ions. 3.4. Ope erating M Modes The followin Table 6: Ov verview of O Operating M Modes Mode De etails Normal Operation Minimum Functional Mode ity Airplane M Mode Sleep Mod de wn Power Dow Mode S Software is a r ready to sen active. The nd and receiv module has ve data. sregistered o on the netwo ork, and it is s Ta lk/Data A A network co is s decided by onnection is y the netwo s ongoing. In rk settingan n this mode, d data trans sfer rate. the power c consumption n T+CFUN=0 c moving the p command ca power supp an set the m ly. In this ca module to a m ase, both th minimum fun he RF functio nctionality m on and (U)S mode withou SIM card wil t ll Idle e AT rem be invalid. AT this T+CFUN=4 c s case, the R command or RF function r W_DISABL will be inval LE# pin can lid. set the mod dule to airpla ane mode. In n In lev TC this mode, vel. In this m CP/UDP data the current ode, the mo a from the n consumptio odule can sti etwork norm mally. on of the mo ll receive pa odule will b aging messa e reduced t age, SMS, vo to a minima al oice call and d In sof VB this mode, ftware goes BAT_RF and the power s inactive an d VBAT_BB manageme nd the seria pins are stil ent unit (PM al interfaces l powered. MU) shuts d s are not ac own the po ccessible. H ower supply y, However, the e L is able to ection descri reduce its ibes the pow current con wer saving p nsumption t procedure of to an ultra-l f UC200T-G low value in L module. n the sleep mode. The e If the host c to let the mo communicate odule enter es with the sleep mode module via e. UART interf face, the fol lowing preco onditions sh hould be me et 3.5. Pow wer Savin ng 3.5.1. Sle eep Mode UC200T-GL following se 3.5.1.1. UA ART Applica ation L_Hardware e_Design28 8 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Execut Drive M The followin e AT+QSCL MAIN_DTR t LK=1 to ena to a high lev able sleep m vel. mode. ng figure sho ows the con nection betw ween the mo odule and th he host. Module MAIN_R RXD MAIN_T TXD MAIN_ _RI MAIN_D DTR AP_REA DY G ND Host TX XD R XD E INT G PIO G PIO G GND Figur re 3: Sleep Mode Appl ication via UART If the host precondition Execut Ensure The ho The followin Driving When U MAIN_DTR UC200T-GL o Chapter 3. R to a low lev L has a URC

.16 for detai vel by host w C to report, ls about MA will wake up the URC w AIN_RI beha p the module ill trigger the aviors. refer to e. e behavior o of MAIN_RI pin. Please e 3.5.1.2. US SB Applicat tion with US SB Remote e Wakeup Fu unction t supports ns must be m USB Susp met to let the pend/Resum e module en me and rem nter sleep m mote wakeu mode. up function ns, the follo owing three e e AT+QSCL e the MAIN_ sts USB bu LK=1 comm DTR is kept us, which is c and to enab t at a high le connected w ble the sleep evel or kept o with the mod p mode. open. dules USB i nterface, en nters the Sus spend state. ng figure sho ows the con nection betw ween the mo odule and th he host. L_Hardware e_Design29 9 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Module USB_V BUS USB B_DP USB_ _DM AP_RE ADY G GND Host VD DD US SB_DP US SB_DM GP PIO GN ND Fig gure 4: Slee ep Mode Ap pplication w with USB Re emote Wake eup g data to UC UC200T-GL wake up the h C200T-GL th has a URC host. hrough USB to report, th B will wake u he module w up the modu will send rem le. mote wakeup p signals via USB bus so o 3.5.1.3. US SB Applicat tion with US SB Suspen d/Resume a and MAIN_ RI Wakeup Function upports USB eded to wak B Suspend/R ke up the ho Resume, bu ost. ut does not s support remo ote wake-up p functions, t the MAIN_R RI hree precon ditions to let t the module e enter the s sleep mode. e AT+QSCL e the MAIN_ sts USB bu LK=1 to ena DTR is kept us, which is c able the slee t at a high le connected w ep mode. evel or kept o with the mod open. dules USB i nterface, en nters the Sus spend state. ng figure sho ows the con nection betw ween the mo odule and th he host. Sendin When U as to w If the host s signal is nee There are th Execut Ensure The ho The followin Module USB_VB BUS USB_ _DP USB_ DM AP_REA ADY MAIN_ _RI G ND Host VD DD US SB_DP US SB_DM GP PIO EI NT GN ND Figure 5 5: Sleep Mo ode Applica ation with M MAIN_RI L_Hardware e_Design30 0 / 84 UC200T-GL Sendin When U If the host d control circu Execut Ensure Discon The followin Switching o NOTE When the m it will be ina Hardware:

UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n g data to UC UC200T-GL C200T-GL th has a URC hrough USB to report, th B will wake u he URC will up the modu trigger the b le. behavior of M MAIN_RI pin n. 3.5.1.4. US SB Applicat tion withou t USB Susp pend Funct tion does not su uit to let the upport USB module ente Suspend fu er sleep mo unction, plea de. ase disconn nect USB_V VBUS with a an additiona al e AT+QSCL e the MAIN_ nect USB_V LK=1comma DTR is held VBUS. and to enabl at a high le le the sleep evel or keep mode. it open. ng figure sho ows the con nection betw ween the mo odule and th he host. Modu ule Host Power Switch USB B_VBUS U USB_DP U USB_DM M MAIN_RI AP_ _READY GND GPIO VDD USB_ _DP USB_ DM EINT GPIO GND Fig gure 6: Slee ep Mode Ap pplication w without Susp pend Funct tion n the power r switch to s upply power r to USB_VB BUS will wak ke up the m odule. Please pay attention to the level ma atch shown in the dotte d line betwe een the mod dule and the host. 3.5.2. Air plane Mod de module enter accessible. T rs airplane m This mode ca mode, the R an be set via F function w a the followi will be disabl ing ways. led, and all A AT command ds related to o The W_DIS SABLE# pin is pulled up by default. Its control fu unction for a irplane mod de is disable d by default t, and AT+QC make the m CFG=airpla module enter anecontrol r airplane mo

,1 can be ode. used to ena able the fun nction. Drivin ng it to a lo ow level can n L_Hardware e_Design31 1 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n

=<fun> provi ides the cho oice of the fu unctionality l level through h setting <fu un> into 0, 1 1 or 4. UN=0: Minim UN=1: Full f UN=4: Airpla mum functio functionality ane mode. R nality mode mode (by d RF function

; both (U)SI default). is disabled. M and RF fu unctions are e disabled. 3.6. Pow wer Supp ply 3.6.1. Pow wer Suppl ly Pins L provides fo te voltage do our VBAT pi omains for V ins dedicate VBAT. ed to connec cting with th e external p power suppl y. There are e BAT_RF pins BAT_BB pins s for the mo s for the mo odules RF p odules base art band part ng table sho ws the deta ils of power supply and GND pins. Table 7: VB BAT and GN ND Pins Pin Name Pin No o. Description n Mi in. Typ p. Max x. Unit VBAT_RF 57,58 3.4 4 3.8 8 4.5 VBAT_BB 59,60 3.4 4 3.8 8 4.5 Power supp modules R ply for the RF part Power supp modules ba ply for the aseband pa rt GND Ground

0

V V V

, 22, 8,9,19, 36,46, 48,50~

72, 85~

~54,56,

~112 Software:

AT+CFUN=

AT+CFU AT+CFU AT+CFU UC200T-GL two separat Two VB Two VB The followin L_Hardware e_Design32 2 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 3.6.2. Dec crease Vo ltage Drop p The power s never drop network. Th supply rang below 3.4V he voltage dr e of the mo V. The follow rop will be le dule is from wing figure ess in 3G ne m 3.4V to 4.5 shows the etworks. 5V. Please m voltage dro make sure th op during bu hat the input urst transmi t voltage wil ll ission in 2G G Burst Tr ransmissio n Burst Transmiss ion VBAT Min.3.4V Drop Ripple Fi igure 7: Pow wer Supply y Limits dur ring Burst T Transmissio on To decreas multi-layer c recommend place these external app structure. T should be n In addition, WS4.5D3HV used. The fo VBAT e voltage d ceramic chi ded to use th e capacitors plication has The width of no less than drop, a bypa p (MLCC) c hree cerami s close to th s to be a sin f VBAT_BB 2mm.In prin ass capacito capacitor ar c capacitors he VBAT_B ngle voltage trace should nciple, the lo or of about rray should s (100nF, 33 BB and VBA source and d be no les onger the VB 100F with also be res 3pF, 10pF) f AT_RF pins d can be exp s than 1mm BAT trace is, h low ESR served due for composin

. The main panded to tw m, and the w

, the wider it should be u toitsultra-low ng the MLC power sup wo sub path width of VBA t will be. used, and a a w ESR. It is s C array, and d pply from an n r s with a sta AT_RF trace e

, in order Vof which re ollowing figu to ensure everse stand ure shows th the stability d-off voltage he star struc y of power e is 4.7V an cture of the p r source, it nd peak puls power suppl is sugges se power is y. sted that a up to 2550W TVS diode e W should be e

D1 C1 C C2 C3 C4 C5 C C6 C7 C8

WS4.5D3H HV 100uF 100 0nF 33pF 10pF 100uF 100 0nF 33pF 10pF Figure e 8: Star St ructure of t the Power S Supply VBAT_RF VBAT_BB Mo odule UC200T-GL L_Hardware e_Design33 3 / 84 UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 3.6.3. Ref ference De esign for P Power Su pply Power desig power sourc module. If t should be u source and The followin power supp gn for the m ce. The pow the voltage used to sup the desired ng figure sh ply is about 3 module is ver wer supply s drop betwe pply power f output (VBA hows a refer 3.8V and the ry important should be a een the inpu for the mod AT), a buck rence desig e maximum

, as the perf able to provi ut and outpu ule. If there converter is n for a +5V load current formance of ide sufficien ut is not too e is a big vo s preferred to V input powe f the module nt current up o high, it is s oltage differe o be used as er source. T e largely dep p to 2.0A at suggested t ence betwe s the power The typical o pends on the e least to the e that an LDO O t en the inpu r supply. output of the e t is 3.0A. D C_IN VBA AT M MIC29302WU 2 IN N E 1 4 OUT T J D A D N G 3 5 5 1K 4.7K 470uF 100n nF VBAT_EN 47K 100K 1%

47K 1%

470R 470uF 100nF Figure e 9: Referen nce Circuit of Power S Supply 3.7. Pow wer-on/of ff/Reset S Scenario os 3.7.1. Tur rn on the M Module Us sing the P PWRKEY The followin ng table sho ws the pin d definition of PWRKEY. Table 8: Pin n Descriptio on of PWRK KEY Pin Name Pin No. I/O Descrip ption Comm ment PWRKEY 21 DI Turn on/

/off the mod ule VBAT power doma ain When UC20 pin to a low PWRKEY.A 00T-GL is in level for at A simple refe n power-dow least 500ms erence circui wn mode, it c s. It is recom t is illustrate can be turne mmended to ed in the follo rmal mode b ed on to no use an open n drain/colle e. owing figure by driving th ector driver t he PWRKEY Y o control the e L_Hardware e_Design34 4 / 84 UC200T-GL 500ms Turn n-on pulse 4.7 7K UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n PWRKEY Y 10nF 4 47K Figure 10:

: Reference e Circuit of T Turing on t the Module Using Driv ving Circuit The other w strike may g the button fo way to contro generate fro or ESD prot ol the PWRK om the finge tection. A ref KEY is using er. Therefore ference circu g a button d e, a TVS co uit is shown directly. Whe omponent is in the follow the key, an en pressing indispensab ble to be pla wing figure. electrostatic c aced nearby y S1 TVS PWRKEY Close to S S1 Figure 1 11: Referen ce Circuit o of Turing on n the Modu ule Using Ke eystroke L_Hardware e_Design35 5 / 84 UC200T-GL The timing o of turning on n the module e is illustrate ed in the foll owing figure e. UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n N NOTE 1 500ms VIL0.5V V About 5ms VBAT PWRKEY VDD_EXT RESET_N STATUS

(OD) UART USB 100 high le 0ms. After this evel by an ext ternal circuit. time, the pin c can be set FORCE_U SB_BOOT About 22m ms 10s 10s 10s I nactive Inactive Active Active Figur re 12: Timin ng of Turnin ng on the M Module is stable bef fore pulling down PWRK KEY pin. Th he time betw ween them is s n directly to matically and o GND with d shutdown a recomme is not neede ended 4.7k ed. resistor if f the module e NOTES 1. Please no less 2. PWRKE needs t make sure that VBAT i

. s than 30ms. EY can be pulled down red on autom to be power 3.7.2. Tur rn off the M Module The followin Using t Using A the PWRKEY Y pin. AT+QPOWD Dcommand. L_Hardware e_Design36 6 / 84 UC200T-GL ng procedure es can be us sed to turn o off the modu ule:

UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 3.7.2.1. Tu urn off the M Module Usin ng the PWR RKEY Pin Driving the procedure a figure. PWRKEY p after the PW pin to a low-

WRKEY is rel

-level voltag eased. The e for at leas timing of tur st 650ms, th rning off the he module w module is i will execute llustrated int power-down n the following g 650ms 2s RUNNI ING Pow wer-down proc cedure OFF Figur re 13: Timin ng of Turnin ng off the M Module 3.7.2.2. Tu urn off Mod ule Using A AT Comman nd safe way to u ff the modul use AT+QPO e via PWRK OWDcomma KEY pin. and to turn o off the modu ule, which is similar to th he procedure e r to docume ent [2] for d etails about AT+QPOW WD command d. amaging inte nly after the ernal flash, p module is s please do no shutdown by ot switch off y PWRKEY f the power s or AT comm supply when mand, the p n the module e power supply y he module w ommand. Ot with the AT therwise, the command, e module wi please keep ll turn itself b p PWRKEY back on afte at a high le er being shu evel after the e t down. VBA T PWRKEY Y STATUS S

(OD) Module Status It is also a s of turning of Please refe NOTES 1. In orde works n can be 2. When t executi r to avoid da normally. On cut off. turning off th ion of the co L_Hardware e_Design37 7 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 3.7.3. Res set the Mo odule The RESET pin low for a recommend possible and Table 9: Pin n Descriptio on of RESE ET_N T_N pin can at least 300m ded that the d must be e be used to ms and then traces betw encircled by o reset the m n releasing i ween the RE ground trace module. The it. The RES ESET_N pin es. module can ET_N signa n and custom n be reset b al is sensitive mers device by pulling th e to interfere e should be e RESET_N N ence, so it is s e as short as s Pin Name Pin No o. I/O D escription RESET_N 20 DI R Ac eset the mo ctive low. odule. Comment 1.8V power If unused open. r domain. d, keep i it The recomm button can b mended circ be used to c cuit is simil control the R RESET_N. ar to the P PWRKEY co ontrol circuit t. An open-

drain/collect tor driver o r RESE ET_N 30 0ms Reset t pulse 4.7K K 47K F Figure 14: R Reference C Circuit of R Resetting the e Module b by Using Dri iving Circu it S2 TVS R ESET_N Close to S2 L_Hardware e_Design38 8 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Figure 1 15: Referen nce Circuit o of Resetting g the Modu ule by Using g Button The timing o of resetting module is ill lustrated inth he following figure. 300ms VIL0.5V R unning Ba aseband resetti ing Base eband restart Fig gure 16: Tim ming of Res setting Mod dule 1. Please PWRKE 2. RESET manage that there is s no large ca make sure

. SET_N pins EY and RES sets the inte T_N only res rnal baseba ement chip. apacitance w with the max x value exce eeding 10nF on and chip of th he module a and does no t reset the p power to use RES SET_N only when fail to o turn off the module by AT+QPOW WD command d VB BAT RE ESET_N Mo Sta odule atus NOTES It is rec or PWR commended RKEY pin. 3. 3.8. (U)S SIM Interf face The (U)SIM

(U)SIM card M interface ci ds are suppo ircuitrymeets orted. s ETSI and IMT-2000 S SIM interface e requireme nts. Both 1.8 8V and 3.0V V Ta able 10: Pin n Definition n of the (U)S SIM Card In terface Pin Name Pin No. I/O Description n Comment USIM_GN D 10 Dedicated g ground for (U U)SIM USIM_DET T 13 DI

(U)SIM card d detection 1.8V powe If unused, r domain. keep it open n. L_Hardware e_Design39 9 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Either 1.8V supported automatica V or 3.0V (U and can b ally by the m U)SIM card is s be identified d module. USIM_VDD D 14 PO Power supp ply for (U)SI M card USIM_DAT TA 15 IO

(U)SIM data a USIM_CLK K 16 DO

(U)SIM cloc ck USIM_RST T 17 DO

(U)SIM rese et UC200T-GL high-level d document [

The followin L supports (

U)SIM card hot-plug via a the USIM_ _DET pin. T The function n supports lo ow-level and d and can be e configured d via AT+QS SIMDET. Ple ease refer to o etections. B

[2]for details By default, it s about the t is disabled command. ng figure sho ows a refere ence design for (U)SIM interface wit th an 8-pin (

(U)SIM card connector. V VDD_EXT US IM_VDD 5 51K 15K Module USIM_GND USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 0R 0R 0R 100nF

(U)SIM Card C Connector VCC RST CLK GND VPP IO 33p pF 33pF 33pF GND GND GND Figu ure 17: Refe erence Circ uit of (U)SIM M Interface with an 8-p pin (U)SIM C Card Conne ector If (U)SIM ca for (U)SIM i ard detection nterface wit n function is th a 6-pin (U not needed U)SIM card c d, please kee connector is ep USIM_D illustrated in ET unconne n the followi ected. A refe ng figure. erence circui it L_Hardware e_Design40 0 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n USIM_GND USIM_VDD USIM_RST USIM_CLK USIM_DATA A 15K 0R 0R 0R Module USIM_V VDD 33pF 3 33pF 33pF 1 100nF

(U)SIM Card C Connector VCC RST CLK GND VPP IO GND GND Figu ure 18: Refe erence Circ cuit of (U)SI IM Interface e with a 6-p pin (U)SIM C Card Conne ector enhance the riteria below e reliability w in (U)SIM c and availab circuit desig bility of the (

n:

(U)SIM card d in custome ers applicat tions, please e r as close to o the module e as possible e. Keep the trace length h and VBAT tra and the (U) less than 0 B, USIM_GN A and USIM aces.

)SIMcard co

.5mm to ma ND can be c M_CLK, keep onnector sh aintain the sa connected to p them awa ort and wid ame electric o PCB groun ay from eac e. Keep the e f c potential. I nd directly. ch other and d s recommen F. The 0 re tedebugging e that the (U nded to add esistors sho g. The 33pF U)SIM periph a TVS diod ould be adde F capacitors heral circuit de array who ed in series s are used t should be ose parasitic c between the e for filtering g close to the e rd connector ssible. ay from RF a he module M_VDD no tomers PCB USIM_DATA ed ground. otection, it is re than 15p d to facilitat Please note placement of an 200mm a U)SIM card the ground width of grou und is comp id cross-talk them with th er to offer go tance should e and the (

rence of GS card connec ull-up resisto card traces pull-up resist f (U)SIM car as far as pos signals awa d between t und and USI plete on cus k between U he surrounde ood ESD pro d not be mo

(U)SIM card SM900MHz.P ctor. or on USIM_ s are too lon tor near the _DATA can ng, or the in

(U)SIM card ti-jamming c improve ant nterference s source is re r. d connector capability of latively clos f the (U)SIM e, it is recom M card. If the e mmended to o 3.9. USB B Interfac ce L provides o ation and su erve as a s ebugging and one integrate upports full-s slave device d firmware u ed Universa speed (12Mb e and is us upgrade. Th al Serial Bus bps) and hig sed for AT e following t s (USB) inte gh-speed (48 command c table shows erface which 80Mbps) mo communicat the pin defi complies w odes. The U tion, data tr inition of US with the USB B SB interface e n, ransmission SB interface. L_Hardware e_Design41 1 / 84 In order to follow the cr Keep p less tha Keep (U Assure trace w the gro To avo shield t In orde capacit module interfer

(U)SIM The pu

(U)SIM add a p UC200T-GL 2.0 specifica can only se software de UC200T-GL Table 11: P Pin Descript tion of USB B Interface Pin Name Pin No o. I/O Desc cription USB_DP 69 USB differential d data (+) USB_DM 70 USB differential d data (-) UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Comment t 90 differ ential impedance e ential 90 differ impedance e USB_VBU US 71 USB connection detection Typical 5.0 0V GND 72 Grou nd For more de It is recom following fig etails about the USB 2.0 0 specificatio ons, please visithttp://ww ww.usb.org/

/home. mended to gure shows a reserve the a reference e USB inte circuit of the erface for fir e USB interf rmware upg face. grade on cu ustomers d esigns. The e IO IO AI Minimize t these stubs Test Poin nts Module VDD NM_0R NM_0R R3 R4 L1 Close to M Module ESD Array USB_VBUS USB_DM M USB_DP GND D MCU USB_DM USB_DP GND Figure 1 19: Referen nce Circuit o of USB App plication mode choke er to suppre ries betwee ed by defau s must be pl The extra s e L1 is reco ess EMI spur n the modul lt. In order laced close tubs of trace ommended t rious transm e and the te to ensure t to the modu e must be as to be added mission. Mea est points so the integrity ule, and also s short as p in series be anwhile, the as to facilita y of the USB o resistors R ossible. etween the 0 resistors ate debuggin B data line R3 and R4 sh module and s (R3 and R ng, and the signal, L1, hould be pla d customers s 4) should be e resistors are e R3 and R4 4 aced close to o ng principles n. s should be e followed w when design ing the USB B interface, so as to me eet USB 2.0 0 portant to ro ute the USB B signal trace es as differe ential pairs w with total gro ounding. The e impedance e L_Hardware e_Design42 2 / 84 A common MCU in orde added in se not mounte components each other. The followin specification It is imp UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n of USB Do not importa ground Please capacit B differential route signa ant to route t on that laye pay attenti tance should trace is 90 al traces un the USB diff er and groun ion to the s d not exceed

. der crystals ferential trac nd planes ab selection of d 2pF and s s, oscillators ces in inner-

bove and be the ESD c hould be pla s, magnetic

-layer of the elow. component o aced as clos devices and e PCB, and s d RF signal surround the traces. It is s e traces with h on the USB se as possib B data line. ble to the US Its parasitic c

. SB interface 3.10. UA ART Inter rfaces The module features of t The ma 230400 interfac The de The followin e provides tw these interfa wo UART int aces are sho terfaces: the own below. e main UAR RT interface a and the deb bug UART in nterface. The e ain UART int 0bps, 46080 ce is used fo bug UART i terface supp 00bps, 9216 or data trans interface sup ports 4800bp 600bps and smission and pports 1152 ps, 9600bps 1Mbps ba d AT comma 200bps baud s, 19200bps ud rates, a and commun d rate. It is u s, 38400bps, nd the defa nication. sed for outp

, 57600bps, ault is 1152 115200bps s, 200bps. This s putting partia al logs. ng tables sho ow the pin d definition of main UART interface. Table 12: P Pin Definitio on of the Ma ain UART In nterface Pin Name Pin N No. I/O O De escription Commen nt MAIN_RI 62 Ri ng indicatio n MAIN_DCD D 63 Da ata carrier d etection DO O DO O DO O DI DI DO O DI DT TE clear to s send DT TE request t to send Da ata terminal ready Tr ransmit data a Re eceive data MAIN_CTS S MAIN_RTS S MAIN_DTR R MAIN_TXD D MAIN_RXD D 64 65 66 67 68 1.8V pow If unused wer domain. d, keep open n. L_Hardware e_Design43 3 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Table 13: P Pin Definitio on of the De ebug UART T Interface Pin Name Pin N No. I/O O De escription Commen nt DBG_RXD D DBG_TXD D 11 12 DI DO O De ebug receive e data De ebug transm mit data 1.8V pow wer domain. The logic le Parameter r VIL VIH VOL VOH The module equipped w recommend vels are des scribed in th e following t table. Table 14:Lo ogic Levels s of Digital I I/O Min n.

-0.3 3 1.2 2 0 1.3 35 Max. 0.6 2.0 0.45 1.8 Unit V V V V e provides ith a 3.3V U ded. The foll a 1.8V UAR ART interfac owing figure RT interface ce. A level tr e shows a re e. A level tr ranslator TX eference des ranslator sh XS0108EPW sign. hould be us WR provided sed if the a by Texas In pplication is s nstruments is s VDD_EX T VCCA A V VCCB 0.1u uF V VDD_MCU 0.1uF 1 0 120 K0K MAIN_R RI MAIN_DCD D MAIN_CTS S MAIN_RTS S MAIN_DTR R MAIN_TXD D MAIN_RXD D OE A1 A2 A3 A4 A5 A6 A7 A8 Translator GND B1 B2 B3 B4 B5 B6 B7 B8 51K K 5 51K R RI_MCU D DCD_MCU C CTS_MCU R RTS_MCU D DTR_MCU T TXD_MCU R RXD_MCU L_Hardware e_Design44 4 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n F Figure 20: R Reference C Circuit with a Level Tra anslator Ch ip http://www. ti.comfor mo ore informat tion. Please visit Another exa please refer ample with tr r to that of th ransistor tra he circuits in nslation circ n solid lines, cuit is shown but please n below. For pay attentio the design on to the dire of circuits in ection of con n dottedlines nnection. s, MCU/A ARM VDD_EXT VDD_EXT 4.7K 1nF 10K 10K 1nF VCC_MCU 4.7K V VDD_EXT TXD RXD RTS CTS GPIO EINT GPIO GND Mo odule MAIN_R RXD MAIN_T TXD MAIN_R MAIN_C MAIN_D RTS CTS DTR RI MAIN_R MAIN_D DCD GND Figure 21:

: Reference e Circuit wit th a Transis stor Circuit NOTE UC200T-GL the primary UC200T-GL In primary m edge. The 256kHz, 5 4096kHzPC UC200T-GL The transist tor circuit so olution is not t suitable for r application s with baud rates excee eding 460Kb bps. 3.11. PC CM and I2 2C Interfa aces L provides on mode (shor ne Pulse Co rt frame sync ode Modulat chronization tion (PCM) d n) and UC20 digital interfa 00T-GL work ace for audio ks as both m o design, wh master and s hich supports s slave. L works as a a master dev vice pertaini ng to I2C in terface. mode, the d PCM_SYNC 12kHz, 102 CM_CLK at 1 ata is samp C falling ed 24kHz or 16kHz PCM pled on the f dge represe 2048kHz P _SYNC. falling edge nts the MS PCM_CLK of the PCM B. In this m at 8kHz M_CLK and t mode, the P PCM_SYNC transmitted o PCM interfa C, and als on the rising g ace supports s so supports s L_Hardware e_Design45 5 / 84 UC200T-GL relationship L supports 1 with 8kHz P 16-bit linear PCM_SYNC r data form C and 2048k at. The follo kHz PCM_C owing figure LK. e shows the eprimary m odes timing g UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 12 25us P CM _CLK 1 2 2 5 5 5 2 5 6 P CM _S YNC P CM _DOUT P CM _DIN MS B LS B MS B MS B LS B MS B Figure 22:

Primary Mo ode Timing g The followin codec desig ng table sho gn. ows the pin definition o of PCM and I2C interfac ces which c can be appli ed on audio o Table 15: P Pin Definitio on of PCM a and I2C Inte erfaces Pin Name Pin N No. I/O Descri iption Commen nt PCM_DIN 24 DI PCM d data input PCM_DOU UT 25 DO PCM d data output PCM_SYN NC 26 IO PCM d synchr data frame ronization PCM_CLK K 27 IO PCM c clock L_Hardware e_Design46 6 / 84 UC200T-GL 1.8V pow If unused wer domain d, keep it ope en 1.8V pow If unused wer domain d, keep it ope en 1.8V pow In master output sig In slave m input sign If unused wer domain. r mode, it se gnal. mode, it is u nal. d, keep it ope en. erves as an sed as an 1.8V pow In master output sig In slave m input sign If unused mount a 3 wer domain r mode, it se gnal. mode, it is u nal. d, it is recom 33pF capac erves as an sed as an mmended to itor close to UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n the pin. nal 1.8V pull ed. d, it is recom 33pF capac An extern is require If unused mount a 3 the pin. l-up resistor mmended to itor close to An extern is require If unused nal 1.8V pull ed. d, keep it ope en. l-up resistor I2C_SCL 41 OD I2C se externa rial clock for al codec r an I2C_SDA 42 OD rial data for an external I2C se codec Clock and synchroniza The followin mode can ation format be configu with 2048kH red by AT Hz PCM_CL command, LK and 8kHz and the de z PCM_SYN efault config NC. guration is short frame e ng figure sho ows a refere ence design of a PCM in nterface with h external co odec IC. PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN I2C_SCL I2C_SDA MICB BIAS INP INN LOU UTP LOU UTN BCLK LRCK DAC ADC SCL SDA M Module K 7

. 4 K 7

. 4 1.8V V Codec Figure e 23: Refere ence Circui t of PCM A pplication w with Audio Codec S A I B It is recomm mended to re eserve an RC C (R=22, C C=22pF) circ cuit on the P PCM lines, e especially for r PCM_CLK K. NOTE L_Hardware e_Design47 7 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 3.12. SD D Card In terface*

UC200T-GL The followin L provides a n SD card in nterface, wh hich complie s with SD 3

.0 specificat tion. ng table sho ws the pin d definition of t the SD card d interface. Table 16: P Pin Definitio on of SD Ca ard Interface e Pin Name Pin No. I/O Description n Com ment SD_DET 23 S SD card det tect SD_SDIO_ _DATA3 28 S SD card SD DIO data bit 3 3 SD_SDIO_ _DATA2 29 S SD card SD DIO data bit 2 2 SD_SDIO_ _DATA1 30 S SD card SD DIO data bit 1 1 SD_SDIO_ _DATA0 31 S SD card SD DIO data bit 0 0 DI IO IO IO IO SD_SDIO_ _CLK 32 DO S SD card SD DIO clock SD_SDIO_ _CMD 33 IO S SD card SD DIO comman nd SD_SDIO_ _VDD 34 PO S SD card SD DIO power 1.8V/

If unu

/2.8V power used, keep i r domain. t open. 1.8V/

If unu

/2.8V power used, keep i r domain. t open. 1.8V/

If unu

/2.8V power used, keep i r domain. t open. 1.8V/

If unu

/2.8V power used, keep i r domain. t open. 1.8V/

If unu

/2.8V power used, keep i r domain. t open. 1.8V/

If unu to mo close

/2.8V power used, it is re ount a 33pF e to the pin. r domain. commended d capacitor 1.8V/

If unu

/2.8V power used, keep i r domain. t open. 1.8V/

If unu

/2.8V power used, keep i r domain. t open. L_Hardware e_Design48 8 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n The followin ng figure sho ows a refere ence design of the SD c ard interface e. R7 NM R8 NM R9 NM R10 0 NM R11 NM

C10 100uF C9 100nF C8 33pF C7 10pF VDD_ _3V SD Card Co onnector M Module SD D_SDIO_VDD SD_S SDIO_DATA3 SD_S SDIO_DATA2 SD_S SDIO_DATA1 SD_S SDIO_DATA0 S D_SDIO_CLK SD D_SDIO_CMD SD_DET R 1 0R R 2 0R R 3 0R R 4 0R R 5 0R R 6 0R C1 NM D1 C2 NM D2 C3 NM D3 C4 4 NM M D4 C5 NM D5 D7 D6 C6 NM Figure 2 24: Referenc ce Circuit o of SD Card Interface interface d esign princip design, in o ples should b rder to ens be complied ure good co with:

ommunicatio on performa ance with S SD card, the e CD/DAT3 VDD DAT2 DAT1 DAT0 CLK CMD VSS DETECTIVE E y VDD_3V i tput current al power su re needed to and the rec s 2.7V~3.6V of SD_SDIO pply is need o pull up the commended V and a suff O_VDD is 5 ded for SD c e SDIO to S d value is 1 ficient curren 50mA which card. D_SDIO_VD 100k. SD_ nt up to 0.8A A can only be e DD. Value o of _SDIO_VDD D mmended to acitors C1~C e placed clos s recommen citance less ensitive circu k signals, DC traces with t add 0 res C6 are reser se to the mo nded to add than 15pF. uits/signals C-DC signa total ground sistors R1~R rved and not odule. R6 in series t mounted b between the e by default. Al ll a TVS diod de on SD ca ard pins nea r such as RF ls, etc . ding. The im circuits, ana alog signals s, mpedance o f SDIO data a two times o of the trace width and t the load ca pacitance o of SD_SDIO_C hem is less t CLK, SD_SD than 1mm) a DIO_DATA[0 and the total 0:3]and SD_ l routing leng _SDIO_CMD D gth needs to o In SD card following de he volta should used fo To avoi these r should In orde module resistor In orde the SD Keep S etc., as It is im trace is Make s SDIO b It is rec with eq be less age range o be provided or SDIO pull-

id jitter of bu resistors is be used as er to adjust s e and the SD rs and bypas er to offer go card conne SDIO signals s well as nois portant to r s 50 (10%

sure the adj bus should b commended qual length (t s than 50mm m. of SD card p d. As the ma

-up resistors us, resistors among 10k the pull-up signal quality D card. The b ss capacitor ood ESD pro ector with jun s far away fr sy signals s route the SD

%). power supply aximum out s, an externa s R7~R11 ar k~100k power. y, it is recom bypass capa rs should be otection, it is nction capac rom other se uch as clock DIO signal t acent trace be less than d to keep the the differenc spacing is 15pF. e traces of S ce among th L_Hardware e_Design49 9 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n

* means th he function o of the SD ca ard interface e is under de evelopment. 3.13. AD DC Interfa aces e provides tw value on A s about thes wo analog-to DC0 pin. AT se AT comm o-digital con T+QADC=1 mands, pleas nverter (ADC can be use se refer to th C) interfaces ed to read t he documen s. AT+QADC he voltage v nt [2]. C=0can be u value on AD used to read d r DC1 pin. Fo mprove the accuracy of f ADC, the tr races of ADC C interfaces s should be e encircled by y ground Table 17: P Pin Definitio on of the AD DC Interface es Pin Name Pin n No. Descripti ion 44 45 General-p purpose ana alog to digita al converter General-p purpose ana alog to digita al converter ng table des cribes the c characteristic c of the ADC C function. Table 18: C Characterist tic of the A DC Parameter r M Min. Typ. M Max. ADC0 Volt tage Range ADC1 Volt tage Range ADC Reso olution 0 0 0 0 V VBAT_BB V VBAT_BB 12 Uni it V V bits s NOTE It is recomm mended to us se a resisto r divider circ cuit for ADC application. NOTE The module the voltage more details In order to i traces. ADC1 ADC0 The followin L_Hardware e_Design50 0 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 3.14. Ne twork St tatus Ind dication The networ two pins wh describe pin k indication hich are NE n definition a pins can be ET_MODE a and logic lev e used to d and NET_ST vel changes rive network TATUS for n in different k status indi network stat network stat ication LEDs tus indicatio tus. s. The mod on. The follo ule provides s owing tables s Table 19: P Pin Definitio on of Netwo ork Connec tion Status

/Activity In dication Pin Name Pin No. I/O O Des scription C Comment NET_MOD DE 5 NET_STAT TUS 6 DO O DO O Indi regi cate the mo istration mod odules netw de. ork Indi acti cate the mo vity status. odules netw ork 1 If

.8V power d unused, ke domain. ep it open. 1 If

.8V power d unused, ke domain. ep it open. Table 20: W Working Sta ate of the N etwork Con nnection St tatus/Activit ty Indicatio on Pin Name Lo ogic Level C Changes Network Status NET_MOD DE Al ways high Al ways low Registere ed on UMTS S network Others Fl icker slowly

(200ms hig gh/1800ms lo ow) Network s searching NET_STAT TUS Fl icker slowly

(1800ms hi igh/200ms lo ow) Idle Fl icker quickly y (125ms hig gh/125ms lo ow) Data tran nsfer is ongo oing Al ways High Voice cal ling L_Hardware e_Design51 1 / 84 UC200T-GL A reference e circuit is sh hown in the f following fig ure. UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n M Module VB BAT Network Indicator 4.7K K 2.2K K 47K Fig ure 25: Ref ference Circ cuit of the N Network Sta atus Indica tion 3.15. STA TATUS The STATU to a GPIO o turned on high-impeda open drain o S pin is an o a pulled-up of DTE with normally, th he STATUS ance state. Table 21: P Pin Definitio on of STATU US output for the resistor, or S will prese e modules o as an LED ent the low operation st indication ci w state. Oth tatus indicat ircuit as belo herwise, the ion. It can b ow. When th e STATUS e connected d he module is s will presen nt Pin Name Pin No. I/O Description n Com mment STATUS 61 OD Indicate the e modules o operation sta atus

-up resistor An e is req If un external pull-

quired. used, keep it open. L_Hardware e_Design52 2 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n The followin according to ng figure sh o the applica hows differe ation deman nt circuit de nds. esigns of ST TATUS, and d customers can choos e either one e Mod dule VD D_MCU Mod dule VBAT 10K K ST TATUS MCU_ _GPIO ST TATUS 2. 2K Figu ure 26: Refe erence Circ cuits of STA ATUS The status p pin cannot b be used as a an indication n of module shutdown st tatus when V VBAT is rem moved. 3.16. Be haviors of the M AIN_RI

="risignalty ype","physic cal" comma and can be u used to conf figure MAIN_ _RI behavio ors. on which por rt a URC is p presented, t he URC will l trigger beh aviors of the e MAIN_RI p pin. The URC ca an be outpu utted from th e UART por rt, USB AT p port and US B modem p ort, which c an be set by y AT+QURCC CFG. The de efault port is s USB AT po ort. NOTE AT+QCFG=

No matter o NOTE L_Hardware e_Design53 3 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n RI behavior c can be conf figured flexib bly. The defa ault behavio r of the MAI N_RI is In addition, shown below the MAIN_R w. Table 22: B Behaviors o of the MAIN_ _RI R Response M MAIN_RI ke eeps at a hig gh level M MAIN_RI ou utputs 120m s low pulse when a new w URC is ret turned RI behavior r can be cha anged via AT T+QCFG="u urc/ri/ring"

*. Please re efer to docu ument [2] fo r

* means u under develo opment. 3.17. FO ORCE_US SB_BOO OT Interfa ace L provides a D_EXT is p n. In this mod a FORCE_U owered up, de, the mod USB_BOOT

, and the m ule supports pin. Custom module will s firmware u mers can pu enter emer upgrade ove ull up FORC rgency dow er a USB inte CE_USB_BO nload mode erface. OOT to 1.8V V e when it is s Table 23: P Pin Definitio on of FORC CE_USB_BO OOT Interfac ce Pin Name I/O Description n C Comment Pin No. USB FORCE_U _BOOT 115 DI Force the emergency module t to enter download m mode 1 1.8V power d I t is recomm p points. domain.Acti mended to re ve high. serve test State Idle URC The MAIN_ details. NOTE UC200T-GL before VDD powered on L_Hardware e_Design54 4 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n The followin ng figure sho ows a refere ence circuit o of FORCE_U USB_BOOT T interface. Mo dule FORCE_ _USB_BOOT Test points 4.7K VDD_EXT Close to test p points TV VS Fig ure 27: Ref ference Circ cuit of FOR RCE_USB_B BOOT Interf face NOTE E1 VBAT 500m ms PWRK KEY VIL0 0.5V VDD_E EXT FORC USB_B E_ BOOT RESET T_N OOT can be p T Is powered u ency download pulled up to 1. up, and the mo d mode when 8V odule it is prox. 5ms RCE_USB_BO ore VDD_EXT enter emerge Ap FOR befo will pow wered on. Approx. 22m ms Figure 28 8: Timing S Sequence f for Enterin g Emergen ncy Downlo oad Mode NOTES 1. Please time be 2. When u the abo powerin make sure t etween powe using MCU t ove timing se ng up the VB that VBAT is ering up VBA to control mo equence. It BAT. Directly s stable befo AT and pulli odule to ente is not recom y connect th ore pulling d ng down PW er the forced mmended to he two test p down PWRK WRKEY pin d emergenc pull up FOR points as sho KEY pin. It is is no less th cy download RCE_USB_B own in Figur s recommen han 30ms. nded that the e mode, plea BOOT to 1.8 re 27 will ma ase follow 8V before anually L_Hardware e_Design55 5 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n force th he module to o enter down nload mode

. L_Hardware e_Design56 6 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 4 A UC200T-GL Anten nna In nterfa ace L provides o one main ant tenna interfa ace with an impedance of 50. 4.1. Main n Antenn na Interfa ace 4.1.1. Pin n Definition n The pin defi inition of the e main anten nna interface e is shown b below. Table 24: P Pin Definitio on of the RF F Antenna Pin Name Pi in No. Descriptio on Comment t ANT_MAIN N 49 9 Main anten nna 50imped dance I/O IO 4.1.2. Ope erating Fr requency Table 25: U UC200T-GL-

-EM Module e Operating g Frequenci ies 3GPP Ban nd EGSM900 DCS1800 Tra nsmit 880

~915 171 0~1785 WCDMA B B1 192 0~1980 WCDMA B B8 880

~915 Receive e 925~960 0 1805~18 880 2110~21 170 925~960 0 U Unit M MHz M MHz M MHz M MHz L_Hardware e_Design57 7 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Table 25: U UC200T-GL-

-GL Module e Operating g Frequenci es 3GPPBan d Tra nsmit 171 0~1785 1805~18 880 185 50~1910 1930~19 990 WCDMA B B1 192 0~1980 2110~21 170 WCDMA B B2 185 52~1908 1932~19 988 Receive e 869~894 4 925~960 0 871~892 2 877~883 3 925~960 0 U Unit M MHz M MHz M MHz M MHz M MHz M MHz M MHz M MHz M MHz 4.1.3. Ref ference De esign of R RF Antenn na Interfac ce A reference circuit for be e design of A etter RF per ANT_MAIN rformance. T antenna pin The capacito n is shown ors are not m as below. It mounted by d t should res default. erve a -ty pe matching g 824

~850 880

~915 826 6~847 832

~838 880

~915 Mod dule AN NT_MAIN R1 0R C1 NM C2 NM Main antenna Figure 29:

: Reference e Circuit of RF Antenna a Interface NOTE Place the-

-type matchi ing compone ents (R1/C1

/C2 and R2 2/C3/C4) as close to the antenna as s possible. GSM850 EGSM900 DCS1800 PCS1900 WCDMA B B5 WCDMA B B6 WCDMA B B8 L_Hardware e_Design58 8 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 4.1.4. Ref ference De esign of R RF Layout PCB, the of the RF tra the referenc tripor coplan ng figures a characterist aces is usua ce ground to nar wavegu re reference tic impedan ally determin o the signal ideis typica e designs of nce of all R ned by the tr layer (H), an lly used in f microstrip RF traces s race width (W nd the spaci RF layout to line or copl should be c W), the mate ing between o control ch anar waveg controlled to erials dielec n RF traces a haracteristic guide with d o 50. The e nt, ctric constan and grounds s impedance e. ifferent PCB B For users impedance height from

(S). Microst The followin structures. L_Hardware e_Design59 9 / 84 UC200T-GL Figure e 30: Micros strip Design n on a 2-lay yer PCB F Figure 31: C Coplanar W aveguide D Design on a 2-layer PC CB UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Figure e 32: Copla nar Waveg uide Design n on a 4-lay yer PCB (La ayer 3 as Re eference Gr round) ensure RF p gn:

In order to e layout desig Use an 50. Figure e 33: Copla nar Waveg uide Design n on a 4-lay yer PCB (La ayer 4 as Re eference Gr round) performance e and reliabi ility, the follo owing princi ples should be complie ed with in RF F n impedance e simulation tool to acc urately cont trol the char racteristic im mpedanceof RF tracesto o pins should not bedesig gned as the rmal relief p pads, and sh hould be fully y The GN connec The dis right-an There s The ref RF trac the gro ND pins adja cted to groun stance betw ngle traces s should be cl ference grou ces and the und vias an acent to RF nd. ween the RF should be ch earance und und of RF tra reference g d RF traces pinsand the hanged to cu der the sign aces should ground could should be n e RFconnec urved ones. al pin of the d be complet d help to im no less than ctor should b be as short as possible e, and all the e e antenna co te. Meanwhi mprove RF p two times a onnector or s ile, adding s performance as wide as R solder joint. some ground e. The distan RF signal tra d viasaround d nce between n aces (2 W)

). For more de UC200T-GL etails about the RF layo out, please re efer to the d document [3 3]. L_Hardware e_Design60 0 / 84 UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 4.2. Ante enna Ins stallation n 4.2.1. Ant tenna Req quirement The followin ng table sho ws the requ irements on n the main a ntenna. Table 26: A Antenna Req quirements s Type Requirem ments GSM/WCD DMA VSWR:

Efficiency Max input Input impe Cable inse

(GSM850/

Cable inse

(DCS1800 2

: >30%

t power: 50W W edance: 50

<1dB ertion loss: <

WCDMA B

/EGSM900,

<1.5dB ertion loss <

WCDMA B 0/PCS1900, 5/B6/B8) 1/B2) 4.2.2. Rec commend ded RF Co nnector fo or Antenn a Installat tion If an RF co provided by onnector is y Hirose. used for an ntenna conn ection, it is recommend ded to use U.FL-R-SM MT connecto r Figu re 34: Dime ensions of t the U.FL-R-

-SMT Conne ector (Unit:

: mm) L_Hardware e_Design61 1 / 84 UC200T-GL U.FL-LP se rial connecto ors listed in the followin g figure can n be used to match the U U.FL-R-SMT T. UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Figure 35: Mechan nicals of U. FL-LP Con nectors L_Hardware e_Design62 2 / 84 UC200T-GL The followin ng figure des scribes the s space factor r of mated c onnectors. UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n F Figure 36: S Space Facto or of Mated Connector rs (Unit: mm m) For more de etails, pleas e visithttp://h hirose.com. L_Hardware e_Design63 3 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 5 E Electr Rad rical, dioCh Relia aract ability terist y and d tics wer supply a and voltage e on digital a and analog pins of the module are e 5.1. Abs solute Ma aximum Ratings Absolute m listed in the aximum rat following ta ings for pow able. Table 27: A Absolute Ma aximum Ra tings Parameter r VBAT_RF/

/VBAT_BB USB_VBU US Peak Curre ent of VBAT T_BB Peak Curre ent of VBAT T_RF Voltage at ADC0 Voltage at ADC1 Min n.

-0.3 3

-0.3 3 0 0 0 0 Voltage at Digital Pins

-0.3 3 L_Hardware e_Design64 4 / 84 UC200T-GL M Max. Un nit 6 6.0 5 5.5 0 0.8 1 1.8 2 2.3 V VBAT_BB V VBAT_BB V V A A V V V UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 5.2. Pow wer Supp ply Rating gs Table 28: T The Module Power Sup pply Rating s Parameter r Descri ption Conditi ions Min. Ty yp. Max x. Unit VBAT_ VBAT_ _BB and _RF tual input vo e kept betwe m and maxi oltages een the mum The act must be minimu values. Voltage burst tr e drop during ransmission g Maximu on GSM um power co M850/EGSM ontrol level M900. nt Peak s

(during transm upply curren each issionslot) Maximu on GSM um power co M850/EGSM ontrol level M900. 3.4 3.8 8 4.5 V 400 mV 1.8 8 2.0 A USB_VBU US USB co detectio onnection on 3.0 5.0 0 5.25 5 V 5.3. Ope eration an nd Stora age Temp peratures s The operatio onand stora age tempera atures are lis sted in the fo ollowing tabl e. Table 29: O Operation a nd Storage e Temperatu ures Parameter r Min. Max. Uni t Operation Temperatur re Range 1)

-35 Extended O Operation R Range 2) Storage Te emperature Range

-40

-40 Typ.

+25

+75

+85

+90 C C C VBAT IVBAT NOTES 1. 2. 1)Within 2) Within voice, S on radio their va n the operat n the extend SMS, data tr o spectrum alue and e ion tempera ded tempera ransmission and no harm xceed the ature range, ature range, n, etc. There m to radio ne specified to the module the module is no unrec etwork. Only olerances. W is 3GPP co e remains th coverable ma y one or mor When the t ompliant. e ability to e alfunction. T re paramete emperature establish an There are als ers like Pout m returns to d maintain a a so no effects s might reduce e the norma al L_Hardware e_Design65 5 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n operati ng temperat ture levels, t the module w will meet 3G GPP specific cations again n. 5.4. Curr rent Con nsumptio on Table 30: U UC200T-GL-

-EM Curren nt Consump ption Parameter r Descript tion Condition n Typ ical Unit Power of ff Module po ower off 14 AT+CFUN N=0 (USB di isconnected

) 1.00 0 IVBAT Sleep mo ode EGSM900

(USB disc 0 @DRX=2 connected) EGSM900

(USB disc 0 @DRX=5 connected) EGSM900

(USB sus 0 @DRX=5 pend) EGSM900

(USB disc 0 @DRX=9 connected) DCS1800

(USB disc 0 @DRX=2 connected) DCS1800

(USB disc 0 @DRX=5 connected) DCS1800

(USB sus 0 @DRX=5 pend) DCS1800

(USB disc 0 @DRX=9 connected) WCDMA @

(USB disc

@PF=64 connected) WCDMA @

(USB sus

@PF=64 pend) WCDMA @

(USB disc

@PF=128 connected) WCDMA @

(USB disc

@PF=256 connected) WCDMA @

(USB disc

@ PF=512 connected) EGSM900

(USB disc 0 @DRX=5 connected) 2.78 8 1.80 0 1.92 2 1.44 4 2.70 0 1.76 6 1.76 6 1.45 5 4.24 4 4.38 8 2.60 0 1.95 5 1.50 0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle mod e 33.0 00 L_Hardware e_Design66 6 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n EGSM900

(USB con 0 @DRX=5 nected) WCDMA @

(USB disc

@PF=64 connected) WCDMA @

(USB con

@PF=64 nected) 33.1 16 34.8 82 34.9 95 EGSM900 0 4DL/1UL @

@32.58dBm m 262

.3 EGSM900 0 3DL/2UL @

@32.28dBm m 432

.5 EGSM900 0 2DL/3UL @

@30.8dBm 520

.9 EGSM900 0 1DL/4UL @

@28.78dBm m 543

.5 DCS1800 0 4DL/1UL @

@29.28dBm 208

.5 DCS1800 0 3DL/2UL @

@29.1dBm 320

.8 DCS1800 0 2DL/3UL @

@27.51dBm 380

.5 DCS1800 0 1DL/4UL @

@25.47dBm 400

.8 EGSM900 0 4DL/1UL @

@26.78dBm m 202

.6 EGSM900 0 3DL/2UL @

@26.57dBm m 315

.8 EGSM900 0 2DL/3UL @

@24.99dBm m 412

.7 EGSM900 0 1DL/4UL @

@22.12dBm m 513

.2 DCS1800 0 4DL/1UL @

@25.13dBm 191

.6 DCS1800 0 3DL/2UL @

@25.13dBm 290

.9 DCS1800 0 2DL/3UL @

@23.54dBm 371

.3 DCS1800 0 1DL/4UL @

@21.45dBm 443

.3 WCDMA B B1 HSDPA @

@23.2dBm 493

.3 WCDMA B B1 HSUPA @

@22.56dBm m 493

.3 WCDMA B B8 HSDPA @

@23.37dBm m 439

.7 WCDMA B B8 HSUPA @

@22.79dBm m 443

.6 EGSM900 0 PCL=5 @3 32.52dBm 258

.9 EGSM900 0 PCL=12 @

@19.27dBm 126

.0 GPRS da ata transfer EDGE da ata transfer A data WCDMA transfer GSM voi ce call mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA L_Hardware e_Design67 7 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n EGSM900 0 PCL=19 @

@5.34dBm 96.7 7 DCS1800 0 PCL=0 @2 29.33dBm 199

.3 DCS1800 0 PCL=7 @1 6.11dBm 112. 9 DCS1800 0 PCL=15 @

@1.34dBm 94.0 0 WCDMA A voice call WCDMA B B1 @23.24d dBm WCDMA B B8 @22.93d dBm 492

.9 438

.3 Table 31: U UC200T-GL-

-GL Curren t Consump ption Parameter r Descript tion Condition Typica al Unit Power of ff Module pow wer off 17 AT+CFUN=

=0 (USB dis sconnected) 1.10 EGSM900

(USB disco

@DRX=2 onnected) EGSM900

(USB disco

@DRX=5 onnected) EGSM900

(USB susp

@DRX=5 end) EGSM900

(USB disco

@DRX=9 onnected) DCS1800 @

(USB disco

@DRX=2 onnected) DCS1800 @

(USB disco

@DRX=5 onnected) DCS1800 @

(USB susp

@DRX=5 end) DCS1800 @

(USB disco

@DRX=9 onnected) WCDMA @

(USB disco

@PF=64 onnected)

@PF=64 WCDMA @

(USB susp end) WCDMA @

(USB disco

@PF=128 onnected) WCDMA @

(USB disco

@PF=256 onnected) 2.83 1.80 2.00 1.48 2.76 1.77 1.93 1.46 4.50 4.60 3.00 2.14 IVBAT Sleep mo ode L_Hardware e_Design68 8 / 84 UC200T-GL mA mA mA mA mA mA uA mA mA mA mA mA mA mA mA mA mA mA mA mA UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Idle mod de ata GPRS da transfer WCDMA @

(USB disco

@ PF=512 onnected) GSM @DR

(USB disco RX=5 onnected) GSM @DR

(USB conn RX=5 nected) WCDMA @

(USB disco

@PF=64 onnected) WCDMA @

(USB conn

@PF=64 nected) 1.75 31.67 28.71 33.89 30.95 EGSM900 4DL/1UL @

@32.97dBm 272.6 EGSM900 3DL/2UL @

@32.7dBm 451.1 EGSM900 2DL/3UL @

@31.19dBm 536.0 EGSM900 1DL/4UL @

@28.95dBm 560.7 DCS1800 4 4DL/1UL @2 29.89dBm 211.0 DCS1800 3 3DL/2UL @2 29.71dBm 326.4 DCS1800 2 2DL/3UL @2 28.18dBm 389.7 DCS1800 1 1DL/4UL @2 26.05dBm 406.0 EGSM900 4DL/1UL @

@27.05dBm 202.6 EGSM900 3DL/2UL @

@26.89dBm 316.8 EGSM900 2DL/3UL @

@24.96dBm 411.4 ata EDGE da transfer EGSM900 1DL/4UL @

@22.93dBm 494.4 DCS1800 4 4DL/1UL @2 25.67dBm 189.8 DCS1800 3 3DL/2UL @2 25.8dBm 288.7 DCS1800 2 2DL/3UL @2 24.01dBm 367.8 DCS1800 1 1DL/4UL @2 22.17dBm 429.6 WCDMA B 1 HSDPA @

@23.68dBm 527.9 WCDMA B 1 HSUPA @

@22.51dBm 509.7 WCDMA B 2 HSDPA @

@23.29dBm 502.8 A data WCDMA transfer mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA L_Hardware e_Design69 9 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n WCDMA B 2 HSUPA @

@22.18dBm 483.5 WCDMA B 5 HSDPA @

@22.82dBm 454.1 WCDMA B 5 HSUPA @

@21.81dBm 442.6 WCDMA B 6 HSDPA @

@22.96dBm 458.9 WCDMA B 6 HSUPA @

@22.62dBm 465.3 WCDMA B 8 HSDPA @

@22.96dBm 474.4 WCDMA B 8 HSUPA @

@22.04dBm 463.3 EGSM900P PCL=5 @32 2.92dBm 266.5 EGSM900P PCL=12 @1 19.54dBm 124.6 EGSM900P PCL=19 @5 5.27dBm 94.4 DCS1800 P PCL=0 @29 9.9dBm 199.2 DCS1800 P PCL=7 @16 6.61dBm 110.5 DCS1800 P PCL=15 @0 0.33dBm 90.8 WCDMA B 1 @23.63dB Bm WCDMA B 2 @23.47dB Bm WCDMA B 5 @ 22.91d dBm WCDMA B 6 @ 23.3dB Bm WCDMA B 8 @ 22.96d dBm 520.2 496.5 450.0 465.2 474.4 GSM voi ice call WCDMA A call voice mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA L_Hardware e_Design70 0 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 5.5. RF O Output P Power The followin Table 32: R RF Output P Power ng table sho ws the RF o output powe r of UC200T T-GL module e. Frequency y Max. GSM850/E EGSM900 33dBm2 dB DCS1800/

/PCS1900 30dBm2 dB GSM850/E EGSM900 (8 8-PSK) 27dBm3 dB DCS1800/

/PCS1900 (8 8-PSK) 26dBm3 dB Min. 5dBm5d dB 0dBm5d dB 5dBm5d dB 0dBm5d dB WCDMA B B1/B2/B5/B6 6/B8 24dBm+1

/-3dB

<-49dBm NOTE The RF rece In GPRS 4 GSM specif slots TX mo fication as d ode, the max escribed in ximum outp Chapter 13 ut power is 3.16of 3GPP reduced by P TS 51.010-

4.0dB. The

-1. e design con nforms to the e 5.6. RF R Receivin ng Sensit tivity eiving sensi tivity of UC2 200T-GLislis stedinthe foll lowing table es. Table 33: U UC200T-GL-

-EM Condu cted RF Re eceiving Se nsitivity Frequency y Primary D Diversity SIM MO1) 3GPP EGSM900

-109.5dBm m DCS1800

-109dBm WCDMA B B1

-110dBm WCDMA B B8

-110dBm N NA N NA N NA N NA NA NA NA NA

-102.4 4dBm

-102.4 4dBm

-106.7 7dBm

-103.7 7dBm L_Hardware e_Design71 1 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Table 34U UC200T-GL L-GL Condu ucted RF Re eceiving Se ensitivity Frequency y Primary Dive ersity SIMO 3GPPSIMO 3 O Re ceive sens itivity GSM850

-109.5dBm m EGSM900

-109.5dBm m DCS1800

-108.5dBm m PCS1900

-108dBm WCDMA B B1

-109.5dBm m WCDMA B B2

-109.5dBm m WCDMA B B5

-110dBm WCDMA B B6

-111dBm WCDMA B B8

-110dBm NA NA NA NA NA NA NA NA NA 5.7. Elec ctrostatic c Discha arge NA NA NA NA NA NA NA NA NA

-1 102.4dBm

-1 102.4dBm

-1 102.4dBm

-1 102.4dBm

-1 106.7dBm

-1 104.7dBm

-1 104.7dBm

-1 106.7dBm

-1 103.7dBm e is not prote dling precau procedures that incorpo ected agains utions that ty must be a orates the mo st electrosta ypically app applied thro odule. atics discharg ly to ESD se oughout the ge (ESD) in ensitive com processing general. Co mponents. Pr g, handling, onsequently roper ESD h and opera y, it is subjec ct handling and d ation of any y ng table sho ws the mod ule electros tatics discha arge charac teristics. Table 35: E Electrostatic cs Discharg ge Characte eristics (Te mperature=

=25 C, Hum midity=45%

) Tested Po oints Co ontact Disc charge Air Disch harge Unit VBAT, GN ND All Antenn a Interfaces s Other Inter rfaces 8 8 8 8 0 0.5 12 12 1 kV kV kV The module to ESD han packaging application t The followin L_Hardware e_Design72 2 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 6 M This chapte millimeter (m Mecha anica al Dim mensi ions er describes mm), and th s the mech e dimension hanical dime nal tolerance ensions of es are 0.05 the module 5mm unless e.All dimens otherwise s sions are m specified. measured in n 6.1. Mec chanical Dimensi ions of th he Modu ule Figure e 37: Modu le Top and Side Dimen nsions L_Hardware e_Design73 3 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Figure 38:

Module Bo ottom Dimeensions (Bo ottom View) L_Hardwaree_Design74 4 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 6.2. Rec commend ded Foot tprint Figure 39: Recom mended Fo ootprint (To op View) NOTES 1. Pins73 designi 2. For ea compon and1

~84 ingschemati sy maintena nents in the 117~140 icsand PCB ance of the host PCB. includedinth layout. he keepo out area should not be usedwhen n e module, p please keep p about 3m m between the module e and othe r L_Hardware e_Design75 5 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 6.3. Topa and Bott tom View wofUC20 0T-GL F Figure 40: T Top View of f the Modul e Fig gure 41: Bo ottom View of the Mod ule NOTE These are r you receive renderings o from Quect of UC200T-G tel. GL module. For authent tic appearan nce, please refer to the module tha at L_Hardware e_Design76 6 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 7 S Storag ge, M kagin Manuf ng Pac factur ring a and Lis stored in n a vacuum-

sealed bag. It is rated a at MSL 3, a nd its storag ge restrictio ns are listed d e in a vacuu um-sealed b ag: 12 mont ths at <40C C/90%RH. e vacuum-s mperature p sealed bag i rocesses m is opened, d ust be:

devices that t will be sub bjected to re eflow solder ring or othe r Mo Sto ounted withi ored at <10%

n 168 hours

% RH. s at the facto ory environm ment of 30 C/60%RH. s require bak king before mounting if any circums stances belo ow occurs:

Wh is>

De hen the amb

>10% before evice mounti bient temper e opening th ing cannot b rature is 23 e vacuum-s be finished w C5C and sealed bag. within 168 ho the humidity y indicator c card shows t the humidity y ours at facto ory condition ns of 30C/

/60%RH. If baking g is required d, devices m may be baked d for 8 hours s at 120C 5C. stic package As the plas temperat before high h IPC/JEDEC CJ-STD-033 e cannot be ture (120C for the baki e subjected C) baking. ng procedur re. to high tem If shorter mperature, it t should be is des me ti baking removed fr sired, pleas rom devices s to se refer o 7.1. Stor rage UC200T-GL below . 1. Shelf life 2. After the high-tem 3. Devices 4. NOTE L_Hardware e_Design77 7 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 7.2. Man nufacturi ng and S Soldering g apply the s then penetr ce a clean st for the mod solder paste rate to the tencil surfac ule is recom e on the su PCB. The ce on a singl mmended to rface of ste force on t e pass. To e be 0.18mm encil, thus m the squeege ensure the m m~0.20mm. F making the p ee should module solde For more de paste fill the e be adjusted d ering quality y, etails, please e sted that th e is 245C. ded that the pleted. The ameters are e peak reflo To avoid module sho recommend shown belo ow tempera damage to ould be mou ded reflow s ow. ature is 238 the module unted after soldering th C~245C, e caused b reflow solde hermal profi and the ab by repeated ering for the le (lead-free solute maxi d heating, it e other side e reflow so imum reflow w t is strongly y of PCB has s ldering) and d queegee to nings and as to produc s of stencil f ument [1]. Push the sq stencil ope properlyso a thethicknes refer todocu It is sugges temperature recommend been comp related para Te emp. (C) Re eflow Zone Max slope:

M 2

~3C/sec C Cooling down slope: 1~4C/s sec B D 245 238 220 200 150 100 Soa k Zone A Max slop pe: 1~3C/sec Figur re 42: Reflow w Soldering g Thermal P Profile T able 36: Re ecommende ed Thermal Profile Par rameters Soak time

(between A A and B: 150 C and 200 C) 60 sec ~ 12 20 sec Recomme ndation 1C/sec ~ 3 3C/sec 2C/sec ~ 3 3C/sec Factor Soak Zone e Max slope Reflow Zo one Max slope L_Hardware e_Design78 8 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 40 sec ~ 60 0 sec 238C ~ 24 45C 1C/sec ~ 4 4C/sec 1 Reflow tim me (D: over 2 220C) Max tempe erature Cooling do own slope Reflow Cy ycle Max reflow w cycle NOTES 7.3. Pac kaging UC200T-GL length and mm). 1

. 0 5 7

. 1 5 1

. 0 0 2 0 2

. 3

. 0 0 0

. 4 4 1. During NEVER isopropy 2. The shi hours N identifia manufacturi R wipe the yl alcohol, tr elding can Neutral Salt able and the ing and sold modules sh richloroethyl for the mod Spray test, t 2D barcode dering, or a hielding can ene, etc. Ot dule is made the laser en e is still read ny other pro n with orga therwise, the e of Cupro-

ngraved labe dable, althou ocesses tha nic solvents e shielding m

-Nickel base el informatio ugh white rus at may cont s, such as may become e material. I n on the shi st may be fo act the mod acetone, et e rusted. t is tested t ielding can i ound. dule directly y, thyl alcohol

, that after 12 2 s still clearly y L is package contains 25 ed in tape an 50pcs modu ndreel carrie ules. The de ers. Each ree etailed pack el is 330mm age informa in diameter ation is show r, each tape wn below (m is 11.88m in n measured in n 44.00 0.1 2.00 0.1 2 4.00 0.1 0.1 0 1.5 0 0.35 0 0.05 5 1

. 0 3 9 2

. 5 1

. 0 3

. 0 3 5 1

. 0 3

. 0 3 4 3

.2 0.15

.1 0.15 32.5 0.15 5 33.5 0.15 5 32.5 33.5 0.15 0.15 L_Hardware e_Design79 9 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Cove er tape Direc ction of feed d Figu ure 43: Tap pe and Reel Specificati ions 48.5 0 0 1 13 44.5+0.

-0.0

.20 00 1083 Carr pack rier tape king mod dule Carrier unfoldin tape ng F igure 44: Ta ape and Re eel Direction ns L_Hardware e_Design80 0 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 8 A Appen ndix A A Ref feren nces T able 37: Re elated Docu uments SN Do ocument Na ame Remark

[1]

Qu uectel_Modu ule_Seconda ary_SMT_U ser_Guide Module Se econdary SM MT User Gu ide

[2]

Qu uectel_UC20 00T-GL_AT_ _Commands s_Manual UC200T-G GL AT Comm mandsManua al

[3]

Qu uectel_RF_L Layout_Appl ication_Note e RF Layout t Application n Note

[4]

Qu uectel_UMTS S&LTE_EVB B_User_Gui ide TE EVB use er guide for rUMTS&LTE E UMTS&LT modules T able 38: Te rms and Ab bbreviation s Abbreviat tion Descr ription CHAP Challe enge Handsh hake Authen ntication Pro otocol Analog g-to-Digital C Converter Adapt ive Multi-rat e Bits Pe er Second Coding g Scheme Clear To Send Downl link Data T Terminal Equ uipment Data T Terminal Rea ady Enhan nced Full Ra ate EGSM Enhan nced GSM L_Hardware e_Design81 1 / 84 UC200T-GL ADC AMR bps CS CTS DL DTE DTR EFR UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n ESD ESR FDD FR FTP FTPS GMSK GSM HR HSPA HSDPA HSUPA HTTP LED ME LTE MMS MQTT MSL NITZ NTP PAP PCB PDU PF Electro ostatic Disch harge Equiva alent Series Resistance e Freque ency Divisio on Duplex Full Ra ate File Tr ransfer Proto ocol FTP-o over-SSL Gauss sian Minimu m Shift Keyi ing Globa l System for r Mobile Com mmunication ns Half R Rate High S Speed Packe et Access High S Speed Down nlink Packet Access High S Speed Uplin k Packet Ac ccess Hyper rtext Transfe er Protocol Light E Emitting Dio ode Mobile e Equipment t Long T Term Evolut ion Multim media Messa aging Servic ce Messa age Queuing g Telemetry Transport Moistu ure Sensitivi ty Level Netwo ork Identity a and Time Zo one Netwo ork Time Pro otocol Passw word Authen tication Prot tocol Printed d Circuit Bo ard Protoc col Data Uni t Paging g Frame L_Hardwaree_Design82 2 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n PPP PSK QAM QPSK RF SMS SMTP SSL TCP TDD UART UDP UL UMTS URC

(U)SIM Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VOHmax VOHmin Point-t to-Point Pro otocol Phase e Shift Keyin ng Quadr rature Ampli tude Modula ation Quadr rature Phase e Shift Keyin ng Radio Frequency Short Message Se ervice Simple e Mail Trans sfer Protoco l Secure e Sockets L Layer Transm mission Con ntrol Protoco ol Time D Division Dup plexing Univer rsal Asynch ronous Rece eiver &Tran smitter User D Datagram P rotocol Uplink k Univer rsal Mobile T Telecommun nications Sy ystem Unsoli icited Result t Code

(Unive ersal) Subsc criber Identit y Module Maxim mum Voltage e Value Norma al Voltage V Value Minim um Voltage Value Maxim mum Input H igh Level Vo oltage Value e Minim um Input Hi gh Level Vo oltage Value Maxim mum Input Lo ow Level Vo oltage Value e Minim um Input Lo ow Level Vo ltage Value Maxim mum Output High Level V Voltage Val ue Minim um Output H High Level V Voltage Valu ue L_Hardwaree_Design83 3 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Maxim mum Output Low Level V Voltage Valu ue Minim um Output L Low Level V Voltage Valu e Voltag ge Standing Wave Ratio o Wideb band Code D Division Mult tiple Access s Wirele ess Local Are ea Network VOLmax VOLmin VSWR WCDMA WLAN L_Hardwaree_Design84 4 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n Appen ndix B B GP PRS C Codin ng Sc heme es Table 39: D Description of Differen t Coding Sc chemes Radio Blo ock excl.US F and BCS 1 81 268 C CS-1 CS-2 CS-

-3 CS-4 2/3 3/4 1/

/2 3 3 4 0 4 4 56 0 3 6 16 4 588 132 9

.05 13.4 1 3 12 428 16 456

21.4 3 6 312 16 4 676 220 15.6 6 9 A Scheme Code Rate e USF Pre-coded d USF BCS Tail Coded Bit ts Punctured d Bits Data Rate Kb/s L_Hardware e_Design85 5 / 84 UC200T-GL UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 10 0 App pendix x C G GPRS S Mult ti-slo t Clas sses Twenty-nine classes are downlink dir while the se number of s The descrip e classes o product dep rections. Wr econd numb slots the GP of GPRS mu pendent, an ritten as 3+1 ber indicates RS device c ulti-slot mod d determine 1 or 2+2, th s the amou can use sim des are def e the maximu e first numb nt of uplink ultaneously fined for MS um achievab ber indicates timeslots. T for both upl S in GPRS ble data rate s the amoun The active s ink and dow specificatio es in both th nt of downlin slots determ wnlink comm on. Multi-slo ot he uplink and d nk timeslots s, al mine the tota munications. ption of differ rent multi-slo ot classes is s shown in t he following g table. Table 40: G GPRS Multi-

-slot Classe es Multislot C Class Downli ink Slots Upl ink Slots Active Slots A s 1 1 2 1 2 2 3 1 2 2 3 4 3 1 2 3 4 5 6 7 8 9 10 11 12 13 1 2 2 3 2 3 3 4 3 4 4 4 3 L_Hardware e_Design86 6 / 84 UC200T-GL 2 2 3 3 3 3 4 4 4 4 4 4 4 4 5 5 5 5 5 5 5 5 5 5 N NA UMTS/H UC200T HSPA+ Mod T-GLHardw dule Series s ware Design n 4 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 4 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 N NA N NA N NA N NA N NA N NA N NA N NA N NA N NA N NA N NA N NA N NA N NA N NA 6 6 6 6 6 6 6 6 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 L_Hardwaree_Design87 7 / 84 UC200T-GL UMTS/H U UC200T-GL-

HSPA(+) Mo

-EM Hardw odule Sires s ware Design n 11 App Cod pendix ding S x D E Schem EDGE mes E Mod dulati onan nd Table 41: E EDGE Modu ulation and Coding Sch hemes Coding Sc cheme Mo odulation Coding g Family 1 Timeslot t 2 Tim meslot 4 Timeslot t GM MSK GM MSK GM MSK GM MSK GM MSK GM MSK GM MSK GM MSK 8-P PSK 8-P PSK 8-P PSK 8-P PSK 8-P PSK

C B A C B A B A A 9.05kbps 18.1 kbps 36.2kbps 13.4kbps 26.8 8kbps 53.6kbps 15.6kbps 31.2 2kbps 62.4kbps 21.4kbps 42.8 8kbps 85.6kbps 8.80kbps 17.6 60kbps 35.20kbps 11.2kbps 22.4 4kbps 44.8kbps 14.8kbps 29.6 6kbps 59.2kbps 17.6kbps 35.2 2kbps 70.4kbps 22.4kbps 44.8 8kbps 89.6kbps 29.6kbps 59.2 2kbps 118.4kbps 44.8kbps 89.6 6kbps 179.2kbps 54.4kbps 108. 8kbps 217.6kbps 59.2kbps 118. 4kbps 236.8kbps CS-1:

CS-2:

CS-3:

CS-4:

MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 L_Hardware e_Design 88 8 /88 UC200T-GL

 

 

 

 

 

 

 

 

 

 

QUECcTet UC200T- GL ar-aszar UC200TGLAA-NO6-SNNSA CEB ae FCC ID: XMR202007UC200TGL rir ANATEL:01756-20-07968 [es aa SN:MPA17L81 AXXXXX1 of ES IMEI: 86718403XXOXXXXO

 

 

Quectel Wireless Solutions Co., Ltd Request for Confidentiality Date: _2020/8/3_ Subject: Confidentiality Request for: _____ FCC ID: XMR202007UC200TGL ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent Permanent Permanent*

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual

*Note: ______(Insert Explanation as Necessary)______ ______ FCC ID: XMR202007UC200TGL_____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

Jean Hu

(Signature/Title2)

(Print name)

 

 

 

 

 

 

QuectelWirelessSolutionsCompanyLimited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

QuectelWirelessSolutionsCo.,Ltd XMR202007UC200TGL UC200TGL,UC200TGLMINIPCIE Modular approval requirement EUT Condition

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The radio elements of the modular transmitter have their own shielding. Comply YES

(b) The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES All power lines derived from the host device are regulated before energizing other circuits internal to UC200T-GL, UC200T-GL MINIPCIE. Please see schematic.pdf A permanently attached antenna or unique antenna connector is not a requirement for licensed modules. YES YES The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(c)The modular transmitter must have its ownpowersupplyregulation.

(d) The modular antenna must transmitter must the antenna and comply with transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. either

(e)The modular be transmitter must tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with line conducted the AC UC200T-GL, UC200T-GL MINIPCIE was tested in a stand alone configuration via a PCMCIA extender. Please see spurious setup YES QuectelWirelessSolutionsCompanyLimited requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available

(see Section 15.31(i)) must not be in side another device during testing. supporting and

(f)The modular transmitter be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. must

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebas edon theintendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. YES YES The label position of EC25-AFX;

EC25-AFX MINIPCIE is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID: XMR201909EC25AFX. Please see the label.pdf UC200T-GL, UC200T-GL MINIPCIE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. UC200T-GL, UC200T-GL MINIPCIE is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. YES Quect telWirele essSolutio onsComp panyLimi ited 2020/8 8/03 Sign nature Title:

Project M Manager Dated By:

On beh half of :

Quectel Wireless S olutions Co ompany Lim mited Teleph one:

+86-2 21-51086236 6 ext 6511 Jea n Hu Pri rinted

 

 

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY DATE:August 3, 2020 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Jinnan Han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR202007UC200TGL. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Jinnan Han on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited