FCC ID: XMR202009UG89 UMTS/HSPA+Module

UG89 Hardware Design UMTS/HSPA+ Module Series Rev. UG89_Hardware_Design_V1.0 Date: 2020-07-12 Status: Preliminary www.quectel.com UMTS/HSPA+ Module Series UG89 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

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http://www.quectel.com/support/technical.htm Or Email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. UG89_Hardware_Design 1 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design About the Document History 1.0 Revision Date Author Description 2020-07-12 Woody Initial UG89_Hardware_Design 2 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Contents About the Document .................................................................................................................................. 2 Contents ...................................................................................................................................................... 3 Table Index .................................................................................................................................................. 5 Figure Index ................................................................................................................................................ 6 1 Introduction ......................................................................................................................................... 7 1.1. Safety Information..................................................................................................................... 8 2 Product Concept ................................................................................................................................. 9 2.1. General Description .................................................................................................................. 9 Key Features .......................................................................................................................... 10 2.2. 2.3. Functional Diagram ................................................................................................................ 12 Evaluation Board .................................................................................................................... 13 2.4. 3.6. 3 Application Interfaces ...................................................................................................................... 14 3.1. General Description ................................................................................................................ 14 Pin Assignment ....................................................................................................................... 15 3.2. 3.3. Pin Description ........................................................................................................................ 16 3.4. Operating Modes .................................................................................................................... 22 Power Supply .......................................................................................................................... 23 3.5. 3.5.1. Power Supply Pins ........................................................................................................ 23 3.5.2. Decrease Voltage Drop ................................................................................................. 23 3.5.3. Reference Design for Power Supply ............................................................................. 24 Power-on/off/Reset Scenarios ................................................................................................ 25 3.6.1. Turn on the Module Using the PWRKEY ...................................................................... 25 3.6.2. Turn off the Module ....................................................................................................... 27 3.6.2.1. Turn off the Module Using the PWRKEY Pin...................................................... 28 3.6.2.2. Turn off Module Using AT Command .................................................................. 28 3.6.3. Reset the Module .......................................................................................................... 28 3.6.4. Automatic Shutdown* .................................................................................................... 30 3.6.4.1. Thermal Shutdown* ............................................................................................ 30 3.6.4.2. Undervoltage Shutdown* .................................................................................... 31 3.6.4.3. Overvoltage Shutdown* ...................................................................................... 32 3.7. UART Interfaces ..................................................................................................................... 32 3.8.

(U)SIM Interface ..................................................................................................................... 35 3.9. USB Interface ......................................................................................................................... 37 3.10. ADC Interfaces ....................................................................................................................... 38 3.11. PCM and I2C Interfaces ......................................................................................................... 39 3.12. STATUS .................................................................................................................................. 41 3.13. Behaviors of the UART1_RI ................................................................................................... 42 4 Antenna Interface .............................................................................................................................. 44 4.1. GSM/UMTS Antenna Interface ............................................................................................... 44 4.1.1. Pin Definition ................................................................................................................. 44 UG89_Hardware_Design 3 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 4.1.2. Operating Frequency .................................................................................................... 44 4.1.3. Reference Design of RF Antenna Interface .................................................................. 45 4.1.4. Reference Design of RF Layout.................................................................................... 45 Antenna Installation ................................................................................................................ 48 4.2.1. Antenna Requirements ................................................................................................. 48 4.2.2. Recommended RF Connector for Antenna Installation ................................................ 48 4.2. 5 Electrical, Reliability and Radio Characteristics ........................................................................... 50 Absolute Maximum Ratings .................................................................................................... 50 5.1. 5.2. Power Supply Ratings ............................................................................................................ 51 5.3. Operation and Storage Temperatures .................................................................................... 51 5.4. Current Consumption ............................................................................................................. 52 5.5. RF Output Power .................................................................................................................... 54 5.6. RF Receiving Sensitivity ......................................................................................................... 54 Electrostatic Discharge ........................................................................................................... 55 5.7. 6 Mechanical Dimensions ................................................................................................................... 56 6.1. Mechanical Dimensions of the Module................................................................................... 56 6.2. Recommended Footprint Design ............................................................................................ 58 6.3. Top and Bottom Views of the Module ..................................................................................... 59 7 Storage, Manufacturing and Packaging ......................................................................................... 61 7.1. Storage ................................................................................................................................... 61 7.2. Manufacturing and Soldering ................................................................................................. 62 7.3. Packaging ............................................................................................................................... 63 8 Appendix A References .................................................................................................................... 64 9 Appendix B GPRS Coding Schemes .............................................................................................. 68 10 Appendix C GPRS Multi-slot Classes ............................................................................................. 69 11 Appendix D EDGE Modulation and Coding Schemes .................................................................. 71 12 Appendix E Certification List ........................................................................................................... 72 UG89_Hardware_Design 4 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Table Index Table 1: UG89 Frequency Bands ................................................................................................................. 9 Table 2: P/N Information ............................................................................................................................... 9 Table 3: Key Features of UG89 Module ..................................................................................................... 10 Table 4: I/O Parameters Definition ............................................................................................................. 16 Table 5: Pin Description ............................................................................................................................. 16 Table 6: Overview of Operating Modes ...................................................................................................... 22 Table 7: VBAT and GND Pins .................................................................................................................... 23 Table 8: Pin Description of PWRKEY ......................................................................................................... 25 Table 9: Pin Description of RESET_N ........................................................................................................ 29 Table 10: Temperature dependent behavior .............................................................................................. 31 Table 11: Pin Definition of the UART1 Interface......................................................................................... 32 Table 12: Pin Definition of the Debug UART Interface ............................................................................... 33 Table 13: Logic Levels of Digital I/O ........................................................................................................... 33 Table 14: Pin Definition of the (U)SIM Card Interface ................................................................................ 35 Table 15: Pin Description of USB Interface ................................................................................................ 37 Table 16: Pin Definition of the ADC Interfaces ........................................................................................... 39 Table 17: Characteristic of the ADC ........................................................................................................... 39 Table 18: Pin Definition of PCM and I2C Interfaces .................................................................................. 40 Table 19: Pin Definition of STATUS ............................................................................................................ 41 Table 20: Behaviors of the UART1_RI ....................................................................................................... 43 Table 21: Pin Definition of RF Antenna ...................................................................................................... 44 Table 22: Module Operating Frequencies .................................................................................................. 44 Table 23: Antenna Requirements ............................................................................................................... 48 Table 24: Absolute Maximum Ratings ........................................................................................................ 50 Table 25: The Module Power Supply Ratings ............................................................................................ 51 Table 26: Operation and Storage Temperatures ........................................................................................ 51 Table 27: UG89 Current Consumption ....................................................................................................... 52 Table 28: RF Output Power ........................................................................................................................ 54 Table 29UG89 Conducted RF Receiving Sensitivity .............................................................................. 54 Table 30: Electrostatics Discharge Characteristics (Temperature=25 C, Humidity=45%) ....................... 55 Table 31: Recommended Thermal Profile Parameters .............................................................................. 62 Table 32: Related Documents .................................................................................................................... 64 Table 33: Terms and Abbreviations ............................................................................................................ 64 Table 34: Description of Different Coding Schemes .................................................................................. 68 Table 35: GPRS Multi-slot Classes ............................................................................................................ 69 Table 36: EDGE Modulation and Coding Schemes ................................................................................... 71 Table 37: Certification List .......................................................................................................................... 72 UG89_Hardware_Design 5 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Figure Index Figure 1: Functional Diagram ..................................................................................................................... 13 Figure 2: Pin Assignment (Bottom View) ................................................................................................... 15 Figure 3: Voltage Drop during Burst Transmission .................................................................................... 24 Figure 4: Star Structure of the Power Supply ............................................................................................ 24 Figure 5: Reference Circuit of Power Supply ............................................................................................. 25 Figure 6: Reference Circuit of Turing on the Module Using Driving Circuit ............................................... 26 Figure 7: Reference Circuit of Turing on the Module Using Keystroke ..................................................... 26 Figure 8: Timing of Turning on the Module ................................................................................................ 27 Figure 9: Timing of Turning off the Module ................................................................................................ 28 Figure 10: Reference Circuit of Resetting the Module by Using Driving Circuit ........................................ 29 Figure 11: Reference Circuit of Resetting the Module by Using Button .................................................... 29 Figure 12: Timing of Resetting Module ...................................................................................................... 30 Figure 13: Reference Circuit with a Level Translator Chip ........................................................................ 34 Figure 14: Reference Circuit with a Transistor Circuit ............................................................................... 34 Figure 15: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ......................... 36 Figure 16: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 36 Figure 17: Reference Circuit of USB Application ....................................................................................... 38 Figure 18: Primary Mode Timing ................................................................................................................ 40 Figure 19: Reference Circuit of PCM Application with Audio Codec ......................................................... 41 Figure 20: Reference Circuits of STATUS ................................................................................................. 42 Figure 21: Reference Circuit of RF Antenna Interface ............................................................................... 45 Figure 22: Microstrip Design on a 2-layer PCB ......................................................................................... 46 Figure 23: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 46 Figure 24: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 46 Figure 25: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 47 Figure 26: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 48 Figure 27: Mechanicals of U.FL-LP Connectors ........................................................................................ 49 Figure 28: Space Factor of Mated Connector (Unit: mm) .......................................................................... 49 Figure 29: Module Top and Side Dimensions ............................................................................................ 56 Figure 30: Module Bottom Dimensions (Top View) .................................................................................... 57 Figure 31: Recommended Footprint (Top View) ........................................................................................ 58 Figure 32: Top View of the Module ............................................................................................................. 59 Figure 33: Bottom View of the Module ....................................................................................................... 59 Figure 34: Reflow Soldering Thermal Profile ............................................................................................. 62 UG89_Hardware_Design 6 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 1 Introduction This document defines UG89 module and describes its air interface and hardware interface which are connected with customers applications. This document helps customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of UG89 module. Associated with application note and user guide, customers can use UG89 module to design and set up mobile applications easily. UG89_Hardware_Design 7 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating UG89 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. UG89_Hardware_Design 8 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 2 Product Concept 2.1. General Description UG89 is a WCDMA/GSM wireless communication module. Its general features are listed below Support HSDPA, HSUPA, HSPA+, WCDMA, EDGE, GSM and GPRS coverage. Provide audio support for customers specific applications. Table 1: UG89 Frequency Bands Type WCDMA GSM Frequency Bands B1/B2/B5/B6/B8 850/900/1800/1900MHz With a compact profile of 27.6mm 25.4mm 2.2mm, UG89 can meet almost all requirements of M2M applications such as wireless POS, metering, telematics, security, industry PDA/PC and tablet, etc. UG89 is an SMD-type module, which can be embedded in application through its 120 LGA pins. UG89 is integrated with internet service protocols like TCP, UDP and PPP. Extended AT commands have been developed for customers to use these internet service protocols easily. The following table shows the P/N information of UG89. Table 2: P/N Information Part Description VFI P/N Quectel ordering P/N UG89ASR Blank IMEI RAD268-024-01-A UG89TA-128-VFI UG89ASR Quectels IMEI RAD268-024-02-A UG89TA-128-STD UG89_Hardware_Design 9 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 2.2. Key Features The following table describes the detailed features of UG89 module. Table 3: Key Features of UG89 Module Feature Details Power Supply Supply voltage: 3.3V~4.5V Typical supply voltage: 3.8V Transmitting Power UMTS Features Class 4 (33dBm2dB) for GSM850/EGSM900 Class 1 (30dBm2dB) for DCS1800/PCS1900 Class E2 (27dBm3dB) for GSM850/EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800/PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Support 3GPP R7 HSDPA, HSPA+, HSUPA and WCDMA Support QPSK, 16-QAM (DL only) HSPA+: Max 21Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL), Max 384Kbps (UL) modulation GSM Features GPRS Support GPRS multi-slot class 12 Coding schemes: CS-1, CS-2, CS-3 and CS-4 Max 85.6Kbps (DL), Max 85.6Kbps (UL) EDGE Support EDGE multi-slot class 12 Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 236.8Kbps (DL), Max 236.8Kbps (UL) Internet Protocol Features Support TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CMUX/HTTPS/FTPS/

SSL/FILE/MQTT/SMTP*/MMS*/SMTPS* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which as usually used for PPP connection Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: (U)SIM card currently USIM Interface Support USIM/SIM card: 1.8V/3.0V SMS UG89_Hardware_Design 10 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design PCM Interface USB Interface UART Interface I2C Interfaces AT Commands Used for audio function with an external codec chip Support 16-bit linear data format Support short frame synchronization Support master and slave modes transmission, software for AT command communication, data Compliant with USB 2.0 specification (slave only), with transmission rates up to 480Mbps Used debugging and firmware upgrade Support USB serial drivers for:

Windows 7/8/8.1/10 Windows CE 5.0/6.0/7.0*

Linux 2.6~5.0 Android 4.x/5.x/6.x/7.x/8.x/9.x UART1 Used for AT command communication and data transmission Baud rate reach up to 1Mbps; 115200bps by default Support RTS and CTS hardware flow control UART2 Used for Linux console, log output 115200bps baud rate Compliant with I2C specification version 5.0 Multi-master is not supported Used for codec configuration by default Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Real Time Clock Support Antenna Interface GSM/UMTS antenna, 50 Physical Characteristics Temperature Range Size: (25.40.15)mm (27.60.15)mm (2.20.2)mm Package: LGA Weight: TBD Operation temperature range: -35C ~ +75C1) Extended temperature range: -40C ~ +85C2) Storage temperature range: -40C ~ +90C Firmware Upgrade USB interface or UART interface RoHS All hardware components are fully compliant with EU RoHS directive UG89_Hardware_Design 11 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design NOTES 1. 1) Within the operation temperature range, the module is 3GPP compliant. 2. 2) Within the extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 3. * means under development. 2.3. Functional Diagram The following figure shows a block diagram of UG89 and illustrates the major functional parts. RF transceiver Baseband Flash Radio frequency Peripheral interfaces UART interface

(U)SIM interface USB interface PCM interface I2C interface Status indication UG89_Hardware_Design 12 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Figure 1: Functional Diagram 2.4. Evaluation Board In order to help customers to develop applications with UG89, Quectel provides an evaluation board (EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. For more details, please refer to document [4]. UG89_Hardware_Design 13 / 73 ANT_MAIN PAM Duplex PA Tx PRx VBAT_RF VBAT_BB ADC PWRKEY PON Transceiver 26M VC_TXCO FLASH IQ Control PMIC Control Baseband RAM VDD_EXT 32K XO VDD_EXT RESET_N I2C PCM UARTs USB

(U)SIM GPIO STATUS UMTS/HSPA+ Module Series UG89 Hardware Design 3 Application Interfaces 3.1. General Description UG89 is equipped with 120 pins that can be connected to customers cellular application platforms. Sub-

interfaces included in these pins are described in detail in the following chapters:

Power supply UART interface

(U)SIM interface USB interface ADC interface PCM and I2C interfaces Status indication UG89_Hardware_Design 14 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of UG89 module. Figure 2: Pin Assignment (Bottom View) NOTES 1. If PCM_CLK, and I2C_SCL are not used, it is recommended to mount a 33pF capacitor close to each of the three pins to prevent interference from affecting RFs performance. Other unused pins and RESERVED pins should be kept open, and all GND pins should be connected to the ground. 1) means that these pins cannot be pulled up before startup. UG89_Hardware_Design 15 / 73 PWM1 / USB_BOOT 1) COUNTER 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 VBAT GND GND GND GND GND GND GND GND GND ANT_MAIN RESERVED RESERVED RESERVED RESERVED GPIO5 72 S U T A T S D N G 2 M W P D E V R E S E R D E V R E S E R M D _ B S U P D _ B S U S U B V _ B S U R T D _ 1 T R A U D C D _ 1 T R A U R S D _ 1 T R A U D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D N G D N G D N G 4 5 3 5 2 5 1 5 0 5 9 4 8 4 7 4 6 4 5 4 4 4 3 4 2 4 1 4 0 4 9 3 8 3 7 3 93 92 91 90 89 88 87 86 85 117 116 115 114 113 112 111 110 109 94 118 95 119 96 120 108 84 107 83 106 82 97 98 99 100 101 102 103 104 105 73 74 75 76 77 78 80 81 79 Y E K R W P 54321 6 0 7 8 9 1 1 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 D N G T A B V D N G C D A N O P D N G D E V R E S E R D E V R E S E R T X E _ D D V D X T _ 1 T R A U S T C _ 1 T R A U D X R _ 1 T R A U I R _ 1 T R A U S T R _ 1 T R A U D E V R E S E R T S R _ M S U I T E D _ M S U I A T A D _ M S U I 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 GPIO4 GPIO3 RESET_N DBG_CTS DBG_RTS DBG_TXD DBG_RXD I2C_SCL I2C_SDA PCM_CLK PCM_DIN PCM_SYNC PCM_DOUT VCORE USIM_CLK USIM_VDD GPIO2 GPIO1 POWER USB UART

(U)SIM PCM ANT GND RESERVED OTHERS UMTS/HSPA+ Module Series UG89 Hardware Design 3.3. Pin Description The following tables show the pin definition of UG89 module. Table 4: I/O Parameters Definition Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Type AI AO DI DO IO OD PI PO Table 5: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT 4, 57 PI Power supply for module Vmax=4.5V Vmin=3.3V Vnorm=3.8V VDD_EXT 9 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA VCORE 23 PO Provide 1.2V for external circuit Vnorm=1.2V Iomax=10mA It must be able to provide sufficient current in a transmitting burst which typically rises to 2.0A. Power supply for external GPIOs pull up circuits. If unused, keep it open. VCORE can be used for the power indication circuit. UG89_Hardware_Design 16 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design If unused, keep it open. GND Ground 3, 5, 8,37, 39, 41, 52, 58~62, 64~67, 73 82~84, 89~97, 106 110~120 Turn On/Off Pin Name Pin No. I/O Description DC Characteristics Comment High pulse. Set this signal low before and after the startup impulse. PON 7 DI Turn on the module PWRKEY 79 VILmax=0.5V VBAT power domain. DI DI Turn on/off the module Reset the module Active Low. VILmax=0.5V If unused, keep it open. RESET_N 34 Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 53 DO USB Interface Indicate the modules operation status VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 47 AI USB connection detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V USB_DP 48 IO USB differential data bus (+) USB_DM 49 IO USB differential data bus (-) Typical: 5.0V If unused, keep it open. USB 2.0 compliant;

90 differential impedance;

If unused, keep it open. USB 2.0 compliant;

90 differential impedance. If unused, keep it UG89_Hardware_Design 17 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design

(U)SIM Interface Pin Name Pin No. I/O Description DC Characteristics Comment open. Either 1.8V or 3.0V

(U)SIM card is supported and can be identified automatically by the module. USIM_VDD 21 PO Power supply for

(U)SIM card USIM_DATA 18 IO

(U)SIM card data USIM_CLK 22 DO

(U)SIM card clock USIM_RST 16 DO

(U)SIM card reset Iomax=50mA For 1.8V (U)SIM:

Vmax=1.9V Vmin=1.7V For 3.0V (U)SIM:

Vmax=3.05V Vmin=2.7V For 1.8V (U)SIM:

VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V USIM_DET 17 DI

(U)SIM card hot-

plug detect 1.8V power domain. If unused, keep it open. UG89_Hardware_Design 18 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design UART1 Interface Pin Name Pin No. I/O Description DC Characteristics Comment UART1_RI 13 DO Ring indicator VOLmax=0.45V VOHmin=1.35V UART1_DCD 45 DO Data carrier detection VOLmax=0.45V VOHmin=1.35V UART1_CTS 11 DO Clear to send from DTE VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V UART1_RTS 14 DI Request to send from DTE UART1_DTR 46 DI Data terminal ready. Sleep mode control. UART1_TXD 10 DO Transmit data UART1_RXD 12 DI Receive data UART1_DSR 44 DO Data set ready Debug UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_RXD 30 DI Debug receive data DBG_TXD 31 DO Debug transmit data DBG_RTS 32 DI Debug request to send VILmin=-0.3V VILmax=0.6V UG89_Hardware_Design 19 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design DBG_CTS 33 DO Debug clear to send VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 63 IO Main antenna 50 impedance RF Interface ADC Interface Pin Name Pin No I/O Description DC Characteristics Comment ADC 6 AI PCM Interface General purpose analog to digital converter interface Voltage range:

0V to 1.2 If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment PCM_DIN 26 DI PCM data input PCM_DOUT 24 DO PCM data output PCM_SYNC 25 IO PCM data frame synchronization signal PCM_CLK 27 IO PCM data bit clock VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it serves as an output signal. In slave mode, it serves as an input signal. If unused, keep it open. 1.8V power domain. In master mode, it serves as an output signal. In slave mode, it serves as an input signal. If unused, it is recommended to mount a 33pF UG89_Hardware_Design 20 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design capacitor close to the pin. An external 1.8V pull-up resistor is required. If unused, keep it open. An external 1.8V pull-up resistor is required. If unused, it is recommended to mount a 33pF capacitor close to the pin. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C serial clock. Used for external codec I2C serial data. Used for external codec I2C_SDA 28 OD I2C_SCL 29 OD GPIO Pins*

GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 Other Pins*

19 20 35 36 72 IO IO IO IO IO Pin Name Pin No. I/O Description DC Characteristics Comment General purpose input/output interface 1.8V power domain. If unused, keep the pins open. VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V Pin Name Pin No. I/O Description DC Characteristics Comment PWM1/USB_ BOOT 55 DO VOLmax=0.45V VOHmin=1.35V PWM2 54 DO VOLmax=0.45V VOHmin=1.35V Pulse width modulation interface1 /

Force the module to enter into emergency download mode Pulse width modulation interface2 1.8V power domain. If unused, keep it open. It is recommended to reserve test point. 1.8V power domain. If unused, keep it open. UG89_Hardware_Design 21 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design NOTE COUNTER 56 DI Pulse Counter RESERVED Pins VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED Reserved Keep these pins unconnected. 1, 2, 15, 38, 40, 42, 43, 50, 51, 68~71, 74~78, 80, 81, 85~88, 98~105, 107~109

* means under development. 3.4. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following sections. Table 6: Overview of Operating Modes Mode Details Normal Operation Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data A network connection is ongoing. In this mode, the power consumption is decided by the network setting and data transfer rate. Minimum Functionality Mode AT+CFUN=0 command can set the module to a minimum functionality mode without removing the power supply. In this case, both the RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN=4 command or W_DISABLE# pin can set the module to airplane mode. In this case, the RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to a minimal UG89_Hardware_Design 22 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design level. In this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. Power Down Mode In this mode, the power management unit (PMU) shuts down the power supply, software goes inactive and the serial interfaces are not accessible. However, the VBAT pins are still powered. 3.5. Power Supply 3.5.1. Power Supply Pins UG89 provides two VBAT pins for connection with the external power supply. The following table shows the details of power supply and GND pins. Table 7: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT 4, 57 Power supply for module 3.3 3.8 4.5 V GND Ground

3, 5, 8,37, 39, 41, 52, 58~62, 64~67, 73, 82~84, 89~97, 106 110~120 3.5.2. Decrease Voltage Drop The power supply range of the module is 3.3V~4.5V. Please make sure that the input voltage will never drop below 3.3V. If the voltage drops to below 3.3V, the module will be turned off automatically. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G networks. UG89_Hardware_Design 23 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Figure 3: Voltage Drop during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100F with low ESR (ESR0.7) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to the VBAT_BB and VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with a star structure. The width of VBAT_BB trace should be no less than 1mm, and the width of VBAT_RF trace should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to ensure the stability of power source, it is suggested that a TVS diode WS4.5D3HV of which reverse stand-off voltage is 4.7V and peak pulse power is up to 2550W should be used. The following figure shows the star structure of the power supply. Figure 4: Star Structure of the Power Supply 3.5.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2.0A at least to the module. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. UG89_Hardware_Design 24 / 73 Burst Transmission Burst Transmission Current VBAT Min. 3.3V 2.0A

<400mV VBAT

D1 C1 C2 C3 C4 C5 C6 C7 C8

WS4.5D3HV 100uF 100nF 33pF 10pF 100uF 100nF 33pF 10pF VBAT_RF VBAT_BB Module UMTS/HSPA+ Module Series UG89 Hardware Design The following figure shows a reference design for a +5V input power source. The typical output of the power supply is about 3.8V and the maximum load current is 3.0A. Figure 5: Reference Circuit of Power Supply 3.6. Power-on/off/Reset Scenarios 3.6.1. Turn on the Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 8: Pin Description of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 79 DI Turn on/off the module VBAT power domain When UG89 is in power-down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. UG89_Hardware_Design 25 / 73 DC_IN VBAT MIC29302WU 2 IN N E 1 OUT 4 J D A D N G 51K 3 5 100K 1%

47K 1%

470uF 100nF 4.7K VBAT_EN 47K 470R 470uF 100nF UMTS/HSPA+ Module Series UG89 Hardware Design Figure 6: Reference Circuit of Turing on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, an electrostatic strike may generate from the finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 7: Reference Circuit of Turing on the Module Using Keystroke The timing of turning on the module is illustrated in the following figure. UG89_Hardware_Design 26 / 73 PWRKEY 10nF 500ms Turn-on pulse 4.7K 47K S1 PWRKEY TVS Close to S1 UMTS/HSPA+ Module Series UG89 Hardware Design Figure 8: Timing of Turning on the Module NOTES is no less than 30ms. 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them 2. PWRKEY can be pulled down directly to GND with a recommended 4.7k resistor if the module needs to be powered on automatically and shutdown is not needed. 3.6.2. Turn off the Module The following procedures can be used to turn off the module:

Using the PWRKEY pin. Using AT+QPOWD command. UG89_Hardware_Design 27 / 73 NOTE 1 500ms VIL0.5V About 5ms 100ms. After this time, the pin can be set high level by an external circuit. About 22ms 10s 10s 10s I nactive Inactive Active Active VBAT PWRKEY VDD_EXT USB_BOOT RESET_N STATUS

(DO) UART USB UMTS/HSPA+ Module Series UG89 Hardware Design 3.6.2.1. Turn off the Module Using the PWRKEY Pin Driving the PWRKEY pin to a low-level voltage for at least 650ms, the module will execute power-down procedure after the PWRKEY is released. The timing of turning off the module is illustrated in the following figure. Figure 9: Timing of Turning off the Module NOTES 3.6.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to the procedure of turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 2. When turning off the module with the AT command, please keep PWRKEY at a high level after the execution of the command. Otherwise, the module will turn itself back on after being shut down. 3.6.3. Reset the Module The RESET_N pin can be used to reset the module. The module can be reset by pulling the RESET_N pin low for at least 300ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended that the traces between the RESET_N pin and customers device should be as short as UG89_Hardware_Design 28 / 73 650ms 2s VBAT PWRKEY STATUS

(DO) Module Status RUNNING Power-down procedure OFF UMTS/HSPA+ Module Series UG89 Hardware Design possible and must be encircled by ground traces. Table 9: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 34 DI Reset the module. Active low. 1.8V power domain. If unused, keep it open. The recommended circuit is similar to the PWRKEY control circuit. An open-drain/collector driver or button can be used to control the RESET_N. Figure 10: Reference Circuit of Resetting the Module by Using Driving Circuit Figure 11: Reference Circuit of Resetting the Module by Using Button UG89_Hardware_Design 29 / 73 RESET_N 300ms Reset pulse 4.7K 47K S2 RESET_N TVS Close to S2 UMTS/HSPA+ Module Series UG89 Hardware Design The timing of resetting module is illustrated in the following figure. Figure 12: Timing of Resetting Module NOTES 1. Please make sure that there is no large capacitance with the max value exceeding 10nF on PWRKEY and RESET_N pins. 2. RESET_N only resets the internal baseband chip of the module and does not reset the power 3. management chip. It is recommended to use RESET_N only when fail to turn off the module by AT+QPOWD command or PWRKEY pin. 3.6.4. Automatic Shutdown*

3.6.4.1. Thermal Shutdown*

UG89 board is exceeding the critical limits of overtemperature or undertemperature,and undervoltage or overvoltage is detected than The UG89 will automatic shutdown. The board temperature is constantly monitored by an internal NTC resistor located on the PCB.The values detected by the NTC resistor are measured directly on the board and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, UG89 instantly displays an alert (if enabled). URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT+SCTM* write command: AT+SCTM=1*: Presentation of URCs is always enabled. AT+SCTM=0* (default): Presentation of URCs is enabled during the 2 minute guard period after start-up UG89_Hardware_Design 30 / 73 VBAT RESET_N Module Status 300ms VIL 0.5V Running Baseband resetting Baseband restart UMTS/HSPA+ Module Series UG89 Hardware Design of UG89. After expiry of the 2 minute guard period, the presentation of URCs will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated. URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The presentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT+SCTM=0* was never changed. Please refer to document [2] for details about AT+SCTM* command. The maximum temperature ratings are stated in Section 5.3. Refer to Table 12 for the associated URCs. Table 10: Temperature dependent behavior Sending temperature alert (2min after UG89 start-up, otherwise only if URC presentation enabled)

^SCTM_B: 1 Board close to overtemperature limit.

^SCTM_B: -1 Board close to undertemperature limit.

^SCTM_B: 0 Board back to non-critical temperature range. Automatic shutdown (URC appears no matter whether or not presentation was enabled)

^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. UG89 switches off.

^SCTM_B: -2 Alert: Board equal or below undertemperature limit. UG89 switches off. 3.6.4.2. Undervoltage Shutdown*

The undervoltage shutdown threshold is the specified minimum supply voltage VBAT given in Table 23. When the average supply voltage measured by UG89 approaches the undervoltage shutdown threshold

(i.e., 0.05V offset) the module will send the following URC:

^SBC: Undervoltage Warning The undervoltage warning is sent only once until the next time the module is close to the undervoltage shutdown threshold. If the voltage continues to drop below the specified undervoltage shutdown threshold, the module will send the following URC:

^SBC: Undervoltage Shutdown This alert is sent only once before the module shuts down cleanly without sending any further messages. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. UG89_Hardware_Design 31 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 3.6.4.3. Overvoltage Shutdown*

The overvoltage shutdown threshold is the specified maximum supply voltage VBAT given in Table 23. When the average supply voltage measured by UG89 approaches the overvoltage shutdown threshold

(i.e., 0.05V offset) the module will send the following URC:

^SBC: Overvoltage Warning The overvoltage warning is sent only once until the next time the module is close to the overvoltage shutdown threshold. If the voltage continues to rise above the specified overvoltage shutdown threshold, the module will send the following URC:

^SBC: Overvoltage Shutdown This alert is sent only once before the module shuts down cleanly without sending any further messages. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. NOTE

* means under development. 3.7. UART Interfaces The module provides two UART interfaces: the UART1 interface and the debug UART interface. The features of these interfaces are shown below. The UART1 interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps, 921600bps and 1Mbps baud rates, and the default is 115200bps. This interface is used for data transmission and AT command communication. The debug UART interface supports 115200bps baud rate. It is used for outputting partial logs. The following tables show the pin definition of UART1 interface. Table 11: Pin Definition of the UART1 Interface Pin Name Pin No. I/O Description Comment UART1_RI 13 Ring indication UART1_DCD 45 Data carrier detection DO DO 1.8V power domain. If unused, keep open. UG89_Hardware_Design 32 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design UART1_CTS 11 DO DTE clear to send UART1_RTS 14 DTE request to send UART1_DTR 46 Data terminal ready UART1_TXD 10 UART1_RXD 12 Transmit data Receive data UART1_DSR 44 Data set ready Table 12: Pin Definition of the Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_RXD DBG_TXD DBG_RTS DBG_CTS 30 31 32 33 Debug receive data Debug transmit data Debug request to send Debug clear to send 1.8V power domain. The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter VIL VIH VOL VOH Max. 0.6 2.0 0.45 1.8 Unit V V V V The module provides a 1.8V UART interface. A level translator should be used if the application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. DI DI DO DI DO DI DO DI DO Min.

-0.3 1.2 0 1.35 UG89_Hardware_Design 33 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Figure 13: Reference Circuit with a Level Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown below. For the design of circuits in dotted lines, please refer to that of the circuits in solid lines, but please pay attention to the direction of connection. Figure 14: Reference Circuit with a Transistor Circuit UG89_Hardware_Design 34 / 73 VDD_EXT VCCA VCCB 0.1uF VDD_MCU 0.1uF 1 0 K 120K UART1_RI UART1_DCD UART1_CTS UART1_RTS UART1_DTR UART1_TXD UART1_RXD UART1_DSR OE A1 A2 A3 A4 A5 A6 A7 A8 Translator GND B1 B2 B3 B4 B5 B6 B7 B8 RI_MCU DCD_MCU CTS_MCU RTS_MCU DTR_MCU TXD_MCU RXD_MCU DSR_MCU MCU/ARM VDD_EXT VDD_EXT 4.7K 1nF 10K 10K 1nF VCC_MCU 4.7K VDD_EXT TXD RXD RTS CTS GPIO EINT GPIO GPIO GND Module UART1_RXD UART1_TXD UART1_RTS UART1_CTS UART1_DTR UART1_RI UART1_DCD UART1_DSR GND UMTS/HSPA+ Module Series UG89 Hardware Design NOTE The transistor circuit solution is not suitable for applications with baud rates exceeding 460Kbps. 3.8. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and 3.0V

(U)SIM cards are supported. Table 14: Pin Definition of the (U)SIM Card Interface Pin Name Pin No. I/O Description Comment USIM_DET 17 DI

(U)SIM card hot-plug detect USIM_VDD 21 PO Power supply for (U)SIM card USIM_DATA 18 IO

(U)SIM card data USIM_CLK 22 DO

(U)SIM card clock USIM_RST 16 DO

(U)SIM card reset 1.8V power domain. If unused, keep it open. Either 1.8V or 3.0V (U)SIM card is supported and can be identified automatically by the module. UG89 supports (U)SIM card hot-plug via the USIM_DET pin. The function supports low-level and high-

level detections. By default, it is disabled and can be configured via AT+QSIMDET. Please refer to document [2] for details about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. UG89_Hardware_Design 35 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Figure 15: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 16: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector as close to the module as possible. Keep the trace length less than 200mm as far as possible. Keep (U)SIM card signals away from RF and VBAT traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with the surrounded ground. UG89_Hardware_Design 36 / 73 VDD_EXT USIM_VDD 51K 15K Module USIM_GND USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 0R 0R 0R 100nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33pF 33pF 33pF GND GND GND USIM_VDD USIM_GND USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 0R 0R 0R Module 100nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33pF 33pF 33pF GND GND UMTS/HSPA+ Module Series UG89 Hardware Design In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering interference of GSM900MHz. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA can improve anti-jamming capability of the (U)SIM card. If the

(U)SIM card traces are too long, or the interference source is relatively close, it is recommended to add a pull-up resistor near the (U)SIM card connector. 3.9. USB Interface UG89 provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12Mbps) and high-speed (480Mbps) modes. The USB interface can only serve as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 15: Pin Description of USB Interface Pin Name Pin No. I/O Description USB_DP 48 USB differential data (+) USB_DM 49 USB differential data (-) IO IO AI Comment 90 differential impedance 90 differential impedance USB_VBUS 47 USB connection detection Typical 5.0V For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. It is recommended to reserve the USB interface for firmware upgrade on customers designs. The following figure shows a reference circuit of the USB interface. UG89_Hardware_Design 37 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Figure 17: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of the USB data line signal, L1, R3 and R4 components must be placed close to the module, and also resistors R3 and R4 should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be followed when designing the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and ground planes above and below. Please pay attention to the selection of the ESD component on the USB data line. Its parasitic capacitance should not exceed 2pF and should be placed as close as possible to the USB interface. 3.10. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 can be used to read the voltage value on ADC pin. For more details about these AT commands, please refer to the document

[2]. In order to improve the accuracy of ADC, the traces of ADC interfaces should be encircled by ground traces. UG89_Hardware_Design 38 / 73 Minimize these stubs Test Points Module VDD NM_0R NM_0R R3 R4 L1 Close to Module ESD Array USB_VBUS USB_DM USB_DP GND MCU USB_DM USB_DP GND NOTE UMTS/HSPA+ Module Series UG89 Hardware Design Table 16: Pin Definition of the ADC Interfaces Pin Name Pin No. Description ADC 6 General-purpose analog to digital converter The following table describes the characteristic of the ADC function. Table 17: Characteristic of the ADC Parameter Min. Typ. Max. ADC Voltage Range ADC Resolution 0 12 1.2 Unit V bits It is recommended to use a resistor divider circuit for ADC application. 3.11. PCM and I2C Interfaces UG89 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the primary mode (short frame synchronization) and UG89 works as both master and slave. UG89 works as a master device pertaining to I2C interface. In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC. UG89 supports 16-bit linear data format. The following figure shows the primary modes timing relationship with 8kHz PCM_SYNC and 2048kHz PCM_CLK. UG89_Hardware_Design 39 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Figure 18: Primary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 18: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN 26 DI PCM data input PCM_DOUT 24 DO PCM data output PCM_SYNC 25 IO PCM data frame synchronization PCM_CLK 27 IO PCM clock 1.8V power domain If unused, keep it open 1.8V power domain If unused, keep it open 1.8V power domain . In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. 1.8V power domain In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, it is recommended to mount a 33pF capacitor close to the pin. I2C_SCL 29 OD I2C serial clock for an An external 1.8V pull-up resistor UG89_Hardware_Design 40 / 73 125us P CM _CLK 1 2 2 5 5 2 5 6 P CM _S YNC P CM _DOUT P CM _DIN MS B LS B MS B MS B LS B MS B UMTS/HSPA+ Module Series UG89 Hardware Design external codec is required. If unused, it is recommended to mount a 33pF capacitor close to the pin. An external 1.8V pull-up resistor is required. If unused, keep it open. I2C_SDA 28 OD I2C serial data for an external codec Clock and mode can be configured by AT command, and the default configuration is short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. The following figure shows a reference design of a PCM interface with external codec IC. Figure 19: Reference Circuit of PCM Application with Audio Codec NOTE 3.12. STATUS It is recommended to reserve an RC (R=22, C=22pF) circuit on the PCM lines, especially for PCM_CLK. The STATUS pin is an open drain output for the modules operation status indication. It can be connected to a GPIO of DTE with a pulled-up resistor, or as an LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-

impedance state. Table 19: Pin Definition of STATUS UG89_Hardware_Design 41 / 73 PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN I2C_SCL I2C_SDA S A B I MICBIAS INP INN LOUTP LOUTN BCLK LRCK DAC ADC SCL SDA Module K 7

. 4 K 7

. 4 1.8V Codec UMTS/HSPA+ Module Series UG89 Hardware Design Pin Name Pin No. I/O Description Comment STATUS 53 DO Indicate the modules operation status The following figure shows different circuit designs of STATUS, and customers can choose either one according to the application demands. Figure 20: Reference Circuits of STATUS NOTE NOTE The status pin cannot be used as an indication of module shutdown status when VBAT is removed. 3.13. Behaviors of the UART1_RI AT+QCFG="risignaltype","physical" command can be used to configure UART1_RI behaviors. No matter on which port a URC is presented, the URC will trigger behaviors of the UART1_RI pin. The URC can be outputted from the UART port, USB AT port and USB modem port, which can be set by AT+QURCCFG. The default port is USB AT port. In addition, the UART1_RI behavior can be configured flexibly. The default behavior of the UART1_RI is shown below. UG89_Hardware_Design 42 / 73 Module STATUS 4.7K VBAT 2.2K 47K UMTS/HSPA+ Module Series UG89 Hardware Design Table 20: Behaviors of the UART1_RI State Idle URC Response UART1_RI keeps at a high level UART1_RI outputs 120ms low pulse when a new URC is returned The UART1_RI behavior can be changed via AT+QCFG="urc/ri/ring" *. Please refer to document [2] for details. NOTE

* means under development. UG89_Hardware_Design 43 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 4 Antenna Interface UG89 includes a GSM/UMTS antenna interface. The RF interface has a 50 impedance. 4.1. GSM/UMTS Antenna Interface 4.1.1. Pin Definition The pin definition of the RF antenna is shown below. Table 21: Pin Definition of RF Antenna GND GND GND GND Band GSM850 EGSM900 DCS1800 PCS1900 Pin Name Pin No. I/O Description Comment ANT_MAIN 63 IO RF antenna pad 50 impedance 61 62 64 65 Ground Ground Ground Ground 4.1.2. Operating Frequency Table 22: Module Operating Frequencies Transmit 824~849 880~915 Receive 869~894 925~960 1710~1785 1805~1880 1850~1910 1930~1990 WCDMA B1 1920~1980 2110~2170 WCDMA B2 1850~1910 1930~1990 Unit MHz MHz MHz MHz MHz MHz UG89_Hardware_Design 44 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design WCDMA B5 WCDMA B6 WCDMA B8 824~849 830~840 880~915 869~894 875~885 925~960 MHz MHz MHz 4.1.3. Reference Design of RF Antenna Interface A reference design of RF antenna interface is recommended as below. A -type matching circuit should be reserved for better RF performance, and the -type matching components (R1/C1/C2) should be placed as close to the antenna as possible. The capacitors are not mounted by default. Figure 21: Reference Circuit of RF Antenna Interface UG89 provides an RF antenna pad for customers antenna connection. The RF trace in host PCB connected to the modules RF antenna pad should be micro-strip line or other types of RF traces, whose characteristic impendence should be close to 50. UG89 comes with grounding pins which are next to the antenna pad in order to give a better grounding. 4.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled to 50. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, height from the reference ground to the signal layer (H), and the clearance between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures UG89_Hardware_Design 45 / 73 Module ANT_MAIN R1 0R C1 NM C2 NM UMTS/HSPA+ Module Series UG89 Hardware Design

. Figure 22: Microstrip Design on a 2-layer PCB Figure 23: Coplanar Waveguide Design on a 2-layer PCB Figure 24: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) UG89_Hardware_Design 46 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Figure 25: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50. connected to ground. The GND pins adjacent to RF pins should not be designed as thermal relief pins, and should be fully The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times as wide as RF signal traces (2*W). For more details about RF layout, please refer to document [5]. UG89_Hardware_Design 47 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 4.2. Antenna Installation 4.2.1. Antenna Requirements The following table shows the requirements on GSM/UMTS antenna. Table 23: Antenna Requirements Type Requirements VSWR: 2 Efficiency: > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB Cable insertion loss: < 1.5dB

(DCS1800/PCS1900UMTS1900/2100 ) GSM/UMTS 4.2.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by HIROSE. Figure 26: Dimensions of the U.FL-R-SMT Connector (Unit: mm) UG89_Hardware_Design 48 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 27: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector Figure 28: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. UG89_Hardware_Design 49 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 5 Electrical, Reliability and Radio Characteristics 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 24: Absolute Maximum Ratings Parameter VBAT USB_VBUS Peak Current of VBAT Voltage at Digital Pins Voltage at ADC Min.

-0.3

-0.3 0 0

-0.3 Max. Unit 6.0 5.5 2 2.3 VBAT V V A V V UG89_Hardware_Design 50 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 5.2. Power Supply Ratings Table 25: The Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages must be kept between the minimum and maximum values. VBAT 3.3 3.8 4.5 V VBAT IVBAT Voltage drop during burst transmission Maximum power control level on GSM850/EGSM900. Peak supply current

(during each transmission slot) Maximum power control level on GSM850/EGSM900. 400 mV 1.8 2.0 A USB_VBUS USB connection detection 3.0 5.0 5.25 V 5.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 26: Operation and Storage Temperatures Parameter Min. Max. Unit Typ.

+25

+75

+85

+90 C C C Operation Temperature Range 1)

-35 Extended Operation Range 2) Storage Temperature Range

-40

-40 NOTES 1. 2. 1) Within the operation temperature range, the module is 3GPP compliant. 2) Within the extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no UG89_Hardware_Design 51 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 5.4. Current Consumption Table 27: UG89 Current Consumption Parameter Description Condition Typical Unit Power off Module power off 18 AT+CFUN=0 (USB disconnected) TBD Sleep mode IVBAT Idle mode EGSM @DRX=2

(USB disconnected) EGSM @DRX=9

(USB disconnected) WCDMA PF=64

(USB disconnected) WCDMA PF=128 EGSM @DRX=5

(USB disconnected) EGSM @DRX=5

(USB connected) WCDMA PF=64

(USB disconnected) WCDMA @DRX=64

(USB connected) TBD TBD TBD TBD 29.34 29.29 31.66 32.48 EGSM900 4DL/1UL @33.34dBm 268.4 EGSM900 3DL/2UL @33.26dBm 437.3 GPRS data transfer EGSM900 2DL/3UL @31.59dBm 525.0 EGSM900 1DL/4UL @29.57dBm 580.8 DCS1800 4DL/1UL @30.59dBm 204.7 DCS1800 3DL/2UL @30.56dBm 325.2 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA UG89_Hardware_Design 52 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design DCS1800 2DL/3UL @28.77dBm 373.7 DCS1800 1DL/4UL @26.69dBm 393.5 EGSM900 4DL/1UL @27.23dBm 171.3 EGSM900 3DL/2UL @27.10dBm 269.9 EGSM900 2DL/3UL @24.96dBm 316.9 EGSM900 1DL/4UL @23.15dBm 359.4 DCS1800 4DL/1UL @26.62dBm 160.3 DCS1800 3DL/2UL @26.46dBm 246.8 DCS1800 2DL/3UL @24.40dBm 301.4 DCS1800 1DL/4UL @22.11dBm 352.9 WCDMA B1 HSDPA @23.64dBm 598.3 WCDMA B1 HSUPA @23.58dBm 597.8 WCDMA B2 HSDPA @23.56dBm 649.0 WCDMA B2 HSUPA @23.34dBm 653.7 WCDMA B5 HSDPA @23.46dBm 626.8 WCDMA B5 HSUPA @23.35dBm 622.8 WCDMA B8 HSDPA @23.91dBm 626.5 WCDMA B8 HSUPA @23.95dBm 625.4 EGSM900 PCL=5 @33.24dBm 260.9 EGSM900 PCL=12 @19.33dBm 123.4 EGSM900 PCL=19 @5.42dBm 95.0 DCS1800 PCL=0 @30.49dBm 193.6 DCS1800 PCL=7 @16.67dBm 109.4 DCS1800 PCL=15 @0.84dBm 91.7 EDGE data transfer WCDMA data transfer GSM voice call mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA voice call WCDMA B1 @23.97dBm 600.2 UG89_Hardware_Design 53 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design WCDMA B2 @23.78dBm WCDMA B5 @ 23.68dBm WCDMA B8 @ 23.96dBm 658.1 623.9 632.3 mA mA mA 5.5. RF Output Power The following table shows the RF output power of UG89 module. Table 28: RF Output Power Frequency Max. GSM850/EGSM900 33dBm2dB DCS1800/PCS1900 30dBm2dB GSM850/EGSM900 (8-PSK) 27dBm3dB DCS1800/PCS1900 (8-PSK) 26dBm3dB Min. 5dBm5dB 0dBm5dB 5dBm5dB 0dBm5dB WCDMA B1/B2/B5/B6/B8 24dBm+1/-3dB

<-49dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 4.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 5.6. RF Receiving Sensitivity The RF receiving sensitivity of UG89 is listed in the following tables. Table 29UG89 Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPPSIMO Receive sensitivity UG89_Hardware_Design 54 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design GSM850

-109.5dBm NA EGSM900

-109.5dBm NA DCS1800

-108.5dBm NA PCS1900

-108dBm NA WCDMA B1

-109.5dBm NA WCDMA B2

-109.5dBm NA WCDMA B5

-110dBm WCDMA B6

-111dBm WCDMA B8

-110dBm NA NA NA 5.7. Electrostatic Discharge NA NA NA NA NA NA NA NA NA

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-106.7dBm

-104.7dBm

-104.7dBm

-106.7dBm

-103.7dBm The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling, and operation of any application that incorporates the module. The following table shows the module electrostatics discharge characteristics. Table 30: Electrostatics Discharge Characteristics (Temperature=25 C, Humidity=45%) Tested Points Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces Other Interfaces 8 8 0.5 12 12 1 kV kV kV UG89_Hardware_Design 55 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 6 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm). The tolerances for dimensions without tolerance values are 0.05mm. 6.1. Mechanical Dimensions of the Module Figure 29: Module Top and Side Dimensions UG89_Hardware_Design 56 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design Figure 30: Module Bottom Dimensions (Top View) UG89_Hardware_Design 57 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 6.2. Recommended Footprint Design Figure 31: Recommended Footprint (Top View) NOTES 1. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. 2. All RESERVED pins should be kept open and MUST NOT be connected to ground. UG89_Hardware_Design 58 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 6.3. Top and Bottom Views of the Module Figure 32: Top View of the Module Figure 33: Bottom View of the Module UG89_Hardware_Design 59 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design These are renderings of UG89 module. For authentic dimension and appearance, please refer to the module that you receive from Quectel. NOTE UG89_Hardware_Design 60 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 7 Storage, Manufacturing and Packaging 7.1. Storage UG89 is stored in the vacuum-sealed bag. It is rated at MSL 3 and its storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40C/<90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:

Mounted within 168 hours at the factory conditions of 30C/<60%RH. Stored at <10%RH. 3. Devices require baking before mounting, if any circumstance below occurs. When the ambient temperature is 23C5C and the humidity indication card shows the humidity is >10% before opening the vacuum-sealed bag. Device mounting cannot be finished within 168 hours at factory conditions of 30C/60%RH. If baking is required, devices may be baked for 8 hours at 120C5C. As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (120C) baking. If shorter bake times are desired, please refer to IPC/JEDECJ-

STD-033 for bake procedure. 4. NOTE UG89_Hardware_Design 61 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.13mm~0.15mm. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 238~245C, and the absolute maximum reflow temperature is 245C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 34: Reflow Soldering Thermal Profile Factor Soak Zone Max slope Table 31: Recommended Thermal Profile Parameters Recommendation 1 to 3C/sec UG89_Hardware_Design 62 / 73 Temp. (C) 245 238 220 200 150 100 Soak Zone A Max slope: 1~3C/sec Reflow Zone Max slope:

2~3C/sec C Cooling down slope: 1~4C/sec B D UMTS/HSPA+ Module Series UG89 Hardware Design Soak time (between A and B: 150C and 200C) 60 to 120 sec 2 to 3C/sec 40 to 60 sec 238C ~ 245C 1 to 4C/sec 1 Reflow Zone Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTES 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the 2D barcode is still readable, although white rust may be found. 7.3. Packaging UG89 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. UG89_Hardware_Design 63 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 8 Appendix A References Table 32: Related Documents SN Document Name Remark

[1]

Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide

[2]

Quectel_UG89_AT_Commands_Manual UG89 AT Commands Manual

[3]

Quectel_RF_Layout_Application_Note RF Layout Application Note

[4]

Quectel_UMTS&LTE_EVB_User_Guide UMTS&LTE EVB user guide for UMTS&LTE modules Table 33: Terms and Abbreviations Abbreviation Description CHAP Challenge Handshake Authentication Protocol Analog-to-Digital Converter Adaptive Multi-rate Bits Per Second Coding Scheme Clear To Send Downlink Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Enhanced GSM ADC AMR bps CS CTS DL DTE DTR EFR EGSM UG89_Hardware_Design 64 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design ESD ESR FDD FR FTP FTPS GMSK GSM HR HSPA HSDPA HSUPA HTTP LED ME LTE MMS MQTT MSL NITZ NTP PAP PCB PDU PF Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplex Full Rate File Transfer Protocol FTP-over-SSL Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Hypertext Transfer Protocol Light Emitting Diode Mobile Equipment Long Term Evolution Multimedia Messaging Service Message Queuing Telemetry Transport Moisture Sensitivity Level Network Identity and Time Zone Network Time Protocol Password Authentication Protocol Printed Circuit Board Protocol Data Unit Paging Frame UG89_Hardware_Design 65 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design PPP PSK QAM QPSK RF SMS SMTP SSL TCP TDD UART UDP UL UMTS URC

(U)SIM Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VOHmax VOHmin Point-to-Point Protocol Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Short Message Service Simple Mail Transfer Protocol Secure Sockets Layer Transmission Control Protocol Time Division Duplexing Universal Asynchronous Receiver &Transmitter User Datagram Protocol Uplink Universal Mobile Telecommunications System Unsolicited Result Code

(Universal) Subscriber Identity Module Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value UG89_Hardware_Design 66 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design VOLmax VOLmin VSWR WCDMA WLAN Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network UG89_Hardware_Design 67 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 9 Appendix B GPRS Coding Schemes Table 34: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF BCS Tail Coded Bits Punctured Bits Data Rate Kb/s Radio Block excl.USF and BCS 181 268 CS-1 CS-2 CS-3 CS-4 2/3 3/4 1/2 3 3 40 4 456 0 3 6 16 4 588 132 9.05 13.4 3 6 312 16 4 676 220 15.6 1 3 12 428 16 456

21.4 UG89_Hardware_Design 68 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 10 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 35: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 1 2 2 3 2 3 3 4 3 4 4 4 1 1 2 1 2 2 3 1 2 2 3 4 2 3 3 4 4 4 4 5 5 5 5 5 UG89_Hardware_Design 69 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 3 4 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 3 4 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 UG89_Hardware_Design 70 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 11 Appendix D EDGE Modulation and Coding Schemes Table 36: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot GMSK GMSK GMSK GMSK GMSK GMSK GMSK GMSK 8-PSK 8-PSK 8-PSK 8-PSK 8-PSK

C B A C B A B A A 9.05kbps 18.1kbps 36.2kbps 13.4kbps 26.8kbps 53.6kbps 15.6kbps 31.2kbps 62.4kbps 21.4kbps 42.8kbps 85.6kbps 8.80kbps 17.60kbps 35.20kbps 11.2kbps 22.4kbps 44.8kbps 14.8kbps 29.6kbps 59.2kbps 17.6kbps 35.2kbps 70.4kbps 22.4kbps 44.8kbps 89.6kbps 29.6kbps 59.2kbps 118.4kbps 44.8kbps 89.6kbps 179.2kbps 54.4kbps 108.8kbps 217.6kbps 59.2kbps 118.4kbps 236.8kbps CS-1:

CS-2:

CS-3:

CS-4:

MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 UG89_Hardware_Design 71 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design 12 Appendix E Certification List Table 37: Certification List Country or Operator Comment Certification Australia Government RCM 2 months Australia Telstra 4 months(need RCM & GCF) Australia Vodafone 3 months(need FCC & PTCRB) Brazil Government ANATEL 5 months Brazil Vivo Modules do not need to do Vivo certification. Canada Government IC 2 months Canada Rogers 3 months(need FCC & PTCRB) Europe GCF/R&TTE (CE) Europe RED GCF: 3 months CE: 2 months 2 months France SFR (Vodafone) 3 months(need CE & GCF) Germany Vodafone 3 months(need CE & GCF) Ireland Vodafone 3 months(need CE & GCF) Italy Vodafone 3 months(need CE & GCF) Mexico COFETEL Government (new name IFT) IFETEL6~8 weeks(based on FCC) Netherland Vodafone 3 months(need CE & GCF) South Africa ICASA Gov. 3~6 months(based on CE) Spain Vodafone 3 months(need CE & GCF) UG89_Hardware_Design 72 / 73 UMTS/HSPA+ Module Series UG89 Hardware Design UK Vodafone 3 months(need CE & GCF) USA FCC/IC/PTCRB/UL Gov. FCC/IC: 2 months PTCRB: 3 months UL: Modules do not need to do UL. USA AT&T 5~6 Months(need FCC & PTCRB). UG89_Hardware_Design 73 / 73 FCC KDB996369 D03v01 Requirements List of applicable FCC rules FCC Part 15 Subpart B, Part 22 Subpart H, Part 24 Subpart E Summarize the specific operational use conditions Not Applicable Limited module procedures Not Applicable Trace antenna designs Refer to Manual Section 4 RF exposure considerations Refer to FCC certification requirements Antennas GSM850 PCS1900

(MHz) 824.2 ~ 848.8 1850.2 ~ 1909.8 WCDMA Band II 1852.4 ~ 1907.6 WCDMA Band V 826.4 ~ 846.6 Label and compliance information Refer to FCC Label Information on test modes and additional testing requirements Not Applicable Additional testing, Part 15 Subpart B disclaimer Refer to FCC 15B Report Technology Frequency Range Antenna Type Max Peak Gain (dBi) Dipole 2.29 1.59 1.59 2.29 FCC Certification Requirements. device is a mobile device. And the following conditions must be met:

According to the definition of mobile and fixed device is described in Part 2.1091(b), this 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202009UG89. 4. This module must not transmit simultaneously with any other antenna or transmitter 5. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certifed modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manu al instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module's FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: "Contains Transmitter Module FCC ID: XMR202009UG89" or "Contains FCC ID:

XMR202009UG89" must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user's manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in This device complies with part 15 of the FCC Rules. Operation is subject to the following two that form. conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/ TV technician for help. IC Statement This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation IRSS-GEN of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage le brouillage est susceptible d'en compromettre le radiolectrique subi, mme si fonctionnement. Technology Frequency Range Antenna Type Max Peak Gain (dBi) Technologie Gamme de Type d'antenne Gain de crte maximum (dBi) Antennas Antennes GSM850 PCS1900

(MHz) 824.2 ~ 848.8 1850.2 ~ 1909.8 WCDMA Band II 1852.4 ~ 1907.6 WCDMA Band V 826.4 ~ 846.6 GSM850 PCS1900 frquences (MHz) 824.2 ~ 848.8 1850.2 ~ 1909.8 WCDMA Bande II 1852.4 ~ 1907.6 WCDMA Bande V 826.4 ~ 846.6 Radiation Exposure Statement:

Dipole Diple 2.29 1.59 1.59 2.29 2.29 1.59 1.59 2.29 The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transm itter. Dclarationd'exposition aux radiations:

L'EST est un appareil mobile; maintenir une distance d'au moins 20 cm entre l'EST et le corps de l'utilisateur et ne pas mettre simultanment avec une autre antenne ou un autre metteur. The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains" or similar wording expressing the same meaning, as follows: Contains IC: 10224A-202009UG89 or "where:

10224A-202009UG89 is the module's certification number". Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est install dans le produit hte; sinon, le produit hte doit tre tiquet pour afficher le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell similaire exprimant le mme sens, comme suit: Contient IC: 10224A-202009UG89 ou

"o: 10224A-202009UG89 est le numro de certification du module".

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Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declaration of authorization Date: 2020.08.19 Product Name: UMTS/HSPA+ Module Model No.: UG89 SW: UG89TAR02A01M16 FCC ID: XMR202009UG89 We, the undersigned, hereby authorize MRT Technology (Suzhou) Co., Ltd to act on our behalf, to act on our behalf in all manners relating to FCC approval of our products: report submittal, related correspondence, the signing of all documents relating to these matters, and any other lawful activity necessary to obtain such certification. Any act carried out by MRT Technology (Suzhou) Co., Ltd within the scope of this authorization shall have the same effects as our own. Name Representative of agent: Marlin Chen Agent Company name: MRT Technology (Suzhou) Co., Ltd Address: D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone, City: Suzhou Country: China If you have any questions regarding the authorization, please dont hesitate to contact us. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Confidentiality Letter Date: 2020.08.19 Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR202009UG89 Confidentiality Request released to the public. Operational Description Parts List Tune up procedure Block Diagram Schematics Pursuant to FCC 47 CRF 0.457(d) and 0.459, we request that a part of the subject FCC application listed below be held permanently confidential and permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily Further, the Applicant has spent substantial effort in developing this product, some aspects of which are deemed to be trade secret and proprietary. Having the subject information easily available to our competitors in this market would negate the advantage we have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Modular Approval Request Letter Applicant: Quectel Wireless Solutions Company Limited, Product Name: UMTS/HSPA+ Module Model No.: UG89 FCC ID: XMR202009UG89 The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

Modular approval requirement The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. The modular transmitter must have its own power supply regulation. The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. EUT Condition The radio elements of the modular transmitter have their own shielding. Comply The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf All power lines derived from the host device are regulated before energizing other circuits internal to the UG89. Please see schematic.pdf A permanently attached antenna or unique antenna connector is not a requirement for licensed modules. Yes Yes Yes Yes Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 The UG89 was tested in a stand alone configuration via a PCMCIA extender. Please see spurious setup The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see Section 15.31(i)) must not be inside another device during testing. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization requirements, which are based on the intended use/configurations The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511 Yes Yes Yes Yes The label position of UG89 is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text:

Contains FCC ID: XMR202009UG89. Please see the label.pdf The UG89 is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. The UG89 is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction.