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UC200A-GL Hardware Design UMTS/HSPA+ Module Series Version: 1.0.0 Date: 2021-11-19 Status: Preliminary UMTS/HSPA+ Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:
http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel UC200A-GL_Hardware_Design 1 / 78 UMTS/HSPA+ Module Series or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties
(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. UC200A-GL_Hardware_Design 2 / 78 UMTS/HSPA+ Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. UC200A-GL_Hardware_Design 3 / 78 UMTS/HSPA+ Module Series About the Document Revision History Version Date Author Description
2021-10-29 Anthony LIU/Ethan FANG Creation of the document 1.0.0 2021-10-29 Anthony LIU/Ethan FANG Preliminary UC200A-GL_Hardware_Design 4 / 78 UMTS/HSPA+ Module Series Contents Safety Information .................................................................................................................................... 3 About the Document ................................................................................................................................ 4 Contents .................................................................................................................................................... 5 Table Index ............................................................................................................................................... 7 Figure Index .............................................................................................................................................. 9 1 Introduction ..................................................................................................................................... 11 Special Marks ........................................................................................................................11 1.1. 2 Product Overview ............................................................................................................................ 12 Frequency Bands and Functions .......................................................................................... 12 Key Features ........................................................................................................................ 13 Pin Assignment ..................................................................................................................... 15 Pin Description ..................................................................................................................... 16 EVB ...................................................................................................................................... 21 2.1. 2.2. 2.3. 2.4. 2.5. 3.3. 3.1. 3.2. 3 Operating Characteristics .............................................................................................................. 22 Operating Modes .................................................................................................................. 22 Sleep Mode .......................................................................................................................... 22 3.2.1. UART Application ......................................................................................................... 23 3.2.2. USB Application with USB Remote Wakeup Function ................................................. 23 USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function 3.2.2.1. 24 3.2.2.2. USB Application without USB Suspend Function ......................................... 25 Airplane Mode ...................................................................................................................... 26 3.3.1. Hardware ..................................................................................................................... 26 3.3.2. Software ...................................................................................................................... 26 Power Supply ....................................................................................................................... 26 3.4.1. Power Supply Interfaces .............................................................................................. 26 3.4.2. Reference Design for Power Supply ............................................................................ 27 3.4.3. Requirements for Voltage Stability ............................................................................... 28 Turn On ................................................................................................................................. 29 Turn on the Module with PWRKEY .............................................................................. 29 Turn Off ................................................................................................................................. 31 Turn off the Module with PWRKEY .............................................................................. 31 Turn off the Module with AT Command ........................................................................ 31 Reset .................................................................................................................................... 32 3.6.1. 3.6.2. 3.5.1. 3.4. 3.5. 3.6. 3.7. 4 Application Interfaces ..................................................................................................................... 34 USB Interface ....................................................................................................................... 34 USB_BOOT Interface ........................................................................................................... 36 4.1. 4.2. UC200A-GL_Hardware_Design 5 / 78 UMTS/HSPA+ Module Series 4.3. 4.4. 4.5. 4.6. 4.7. 4.8. 4.9.
(U)SIM Interface ................................................................................................................... 37 PCM and I2C Interface ......................................................................................................... 40 UART Interface ..................................................................................................................... 42 SDIO Interface ...................................................................................................................... 44 ADC Interface ....................................................................................................................... 45 Indication Signal ................................................................................................................... 46 4.8.1. Network Status Indication ............................................................................................ 46 4.8.2. STATUS ....................................................................................................................... 47 Behaviors of the MAIN_RI .................................................................................................... 48 5.1. 5 RF Specifications ............................................................................................................................ 49 Cellular Network ................................................................................................................... 49 5.1.1. Antenna Interface & Frequency Bands ........................................................................ 49 Tx Power ..................................................................................................................... 50 5.1.2. 5.1.3. Rx Sensitivity ............................................................................................................... 51 5.1.4. Reference Design ........................................................................................................ 51 Reference Design of RF Routing .......................................................................................... 52 Requirements for Antenna Design ........................................................................................ 54 RF Connector Recommendation .......................................................................................... 55 5.2. 5.3. 5.4. 6 Electrical Characteristics & Reliability .......................................................................................... 57 Absolute Maximum Ratings .................................................................................................. 57 Power Supply Ratings .......................................................................................................... 58 Power Consumption ............................................................................................................. 58 Digital I/O Characteristic ....................................................................................................... 60 ESD ...................................................................................................................................... 61 Operating and Storage Temperatures ................................................................................... 62 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 7 Mechanical Information .................................................................................................................. 63 7.1. Mechanical Dimensions ........................................................................................................ 63 Recommended Footprint ...................................................................................................... 65 7.2. Top and Bottom Views .......................................................................................................... 66 7.3. 8 Storage, Manufacturing & Packaging ............................................................................................ 67 Storage Conditions ............................................................................................................... 67 8.1. 8.2. Manufacturing and Soldering ................................................................................................ 68 Packaging Specifications ...................................................................................................... 70 8.3. 8.3.1. Plastic Reel .................................................................................................................. 70 8.3.2. Packaging Process ...................................................................................................... 71 9 Appendix References ..................................................................................................................... 72 10 Warnings sentences ....................................................................................................................... 77 UC200A-GL_Hardware_Design 6 / 78 UMTS/HSPA+ Module Series Table Index Table 1: Special Marks ............................................................................................................................. 11 Table 2: Brief Introduction of the Module ................................................................................................. 12 Table 3: Wireless Network Type .............................................................................................................. 12 Table 4: Key Features ............................................................................................................................. 13 Table 5: I/O Parameters Definition ........................................................................................................... 16 Table 6: Pin Description ........................................................................................................................... 16 Table 7: Overview of Operating Modes ................................................................................................... 22 Table 8: Pin Definition of Power Supply ................................................................................................... 27 Table 9: Pin Definition of PWRKEY ......................................................................................................... 29 Table 10: Pin Definition of RESET ........................................................................................................... 32 Table 11: Functions of the USB Interface ................................................................................................ 34 Table 12: Pin Definition of USB Interface ................................................................................................ 34 Table 13: Pin Definition of USB_BOOT Interface .................................................................................... 36 Table 14: Pin Definition of (U)SIM Interface ............................................................................................ 37 Table 15: Pin Definition of PCM Interface ................................................................................................ 40 Table 16: Pin Definition of I2C Interface .................................................................................................. 41 Table 17: Pin Definition of Main UART Interface ..................................................................................... 42 Table 18: Pin Definition of Debug UART Interface ................................................................................... 42 Table 19: Pin Definition of SD Card Interface .......................................................................................... 44 Table 20: Pin Definition of ADC Interface ................................................................................................ 45 Table 21: Characteristics of ADC Interface .............................................................................................. 46 Table 22: Pin Definition of Indication Signal ............................................................................................ 46 Table 23: Working State of the Network Connection Status/Activity Indication ........................................ 47 Table 24: Behaviors of the MAIN_RI ....................................................................................................... 48 Table 25: Pin Definition of Cellular Network Interface .............................................................................. 49 Table 26: Operating Frequency of UC200A-GL ....................................................................................... 49 Table 27: Tx Power .................................................................................................................................. 50 Table 28: Conducted RF Receiving Sensitivity of UC200A-GL ............................................................... 51 Table 29: Requirements for Antenna Design ........................................................................................... 54 Table 30: Absolute Maximum Ratings ..................................................................................................... 57 Table 31: The Modules Power Supply Ratings ....................................................................................... 58 Table 32: The Module Power Consumption ............................................................................................. 58 Table 33: 1.8 V I/O Requirements ........................................................................................................... 60 Table 34: (U)SIM 1.8 V I/O Requirements ............................................................................................... 61 Table 35: (U)SIM 3.0 V I/O Requirements ............................................................................................... 61 Table 36: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) .............................. 62 Table 37: Operating and Storage Temperatures ...................................................................................... 62 Table 38: Recommended Thermal Profile Parameters ............................................................................ 69 Table 39: Carrier Tape Dimension Table (Unit: mm) ................................................................................ 70 Table 40: Plastic Reel Dimension Table (Unit: mm) ................................................................................. 71 Table 41: Related Documents ................................................................................................................. 72 UC200A-GL_Hardware_Design 7 / 78 UMTS/HSPA+ Module Series Table 42: Terms and Abbreviations .......................................................................................................... 72 UC200A-GL_Hardware_Design 8 / 78 UMTS/HSPA+ Module Series Figure Index Figure 2: Pin Assignment (Top View) ....................................................................................................... 15 Figure 3: Sleep Mode Application via UART ............................................................................................ 23 Figure 4: Sleep Mode Application with USB Remote Wakeup ................................................................. 24 Figure 5: Sleep Mode Application with MAIN_RI ..................................................................................... 25 Figure 6: Sleep Mode Application without Suspend Function .................................................................. 25 Figure 7: Reference Design of Power Supply ......................................................................................... 27 Figure 8: Power Supply Limits during Burst Transmission ...................................................................... 28 Figure 9: Star Structure of the Power Supply .......................................................................................... 29 Figure 10: Turning on the Module Using Driving Circuit .......................................................................... 29 Figure 11: Turning on the Module with a Button ...................................................................................... 30 Figure 12: Power-up Timing .................................................................................................................... 30 Figure 13: Timing of Turning off Module .................................................................................................. 31 Figure 14: Reference Circuit of RESET_N with Driving Circuit ............................................................... 32 Figure 15: Reference Circuit of RESET_N with Button ........................................................................... 33 Figure 16: Timing of Resetting Module .................................................................................................... 33 Figure 17: Reference Circuit of USB Application ..................................................................................... 35 Figure 18: Reference Circuit of USB_BOOT Interface ............................................................................ 36 Figure 19: Timing Sequence for Entering Emergency Download Mode .................................................. 37 Figure 20: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ......................... 38 Figure 21: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 39 Figure 22Timing Sequence for Short frame mode ............................................................................... 40 Figure 23: PCM and I2C Interface Circuit Reference Design ............................................................. 41 Figure 24: Reference Circuit with Translator Chip ................................................................................... 43 Figure 25: Reference Circuit with Transistor Circuit .......................................................................... 43 Figure 26: Reference Circuit of SD Card Interface .................................................................................. 44 Figure 27: Reference Circuit of the Network Status Indication ................................................................ 47 Figure 28: Reference Circuits of STATUS ............................................................................................... 48 Figure 29: Reference Circuit for RF Antenna Interfaces .......................................................................... 52 Figure 30: Microstrip Design on a 2-layer PCB ....................................................................................... 52 Figure 31: Coplanar Waveguide Design on a 2-layer PCB ...................................................................... 53 Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 53 Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 53 Figure 34: Dimensions of U.FL-R-SMT Connector (Unit: mm) .......................................................... 55 Figure 35: Mechanicals of U.FL-LP Connectors ................................................................................. 55 Figure 36: Space Factor of Mated Connector (Unit: mm) ........................................................................ 56 Figure 37: Module Top and Side Dimensions (Unit: mm) ........................................................................ 63 Figure 38: Module Bottom Dimensions View (Unit: mm) ......................................................................... 64 Figure 39: Recommended Footprint (Bottom View) ................................................................................ 65 Figure 40: Top and Bottom View of the Module ....................................................................................... 66 Figure 41: Recommended Reflow Soldering Thermal Profile .................................................................. 68 Figure 42: Carrier Tape Dimension Drawing ....................................................................................... 70 UC200A-GL_Hardware_Design 9 / 78 UMTS/HSPA+ Module Series Figure 43: Plastic Reel Dimension Drawing ........................................................................................ 70 Figure 44: Packaging Process................................................................................................................. 71 UC200A-GL_Hardware_Design 10 / 78 UMTS/HSPA+ Module Series 1 Introduction This document defines UC200A-GL module and describes its air interface and hardware interface which are connected with customers applications. This document helps customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of UC200A-GL module. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily. 1.1. Special Marks Table 1: Special Marks Mark Definition
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SD_SDIO_DATA[0:3] refers to all four SD_SDIO_DATA pins, SD_SDIO_DATA0, SD_SDIO_DATA1, SD_SDIO_DATA2, and SD_SDIO_DATA3. UC200A-GL_Hardware_Design 11 / 78 UMTS/HSPA+ Module Series 2 Product Overview UC200A-GL is a WCDMA/GSM wireless communication module. Its general features are listed below Supports HSDPA, HSUPA, HSPA+, WCDMA, EDGE and GPRS coverage. Provides audio support for customers specific applications. Table 2: Brief Introduction of the Module Categories Dimensions Weight Packaging and pins number 80 LCC pins; 64 LGA pins
(29.0 0.15) mm (32.0 0.15) mm (2.4 0.2) mm approx. 4.4 g Wireless network functions WCDMA/GSM 2.1. Frequency Bands and Functions Table 3: Wireless Network Type Type WCDMA GSM UC200A-GL B1/B2/B5/B8 850/900/1800/1900 MHz UC200A-GL_Hardware_Design 12 / 78 UMTS/HSPA+ Module Series 2.2. Key Features Table 4: Key Features Features Details Supply voltage range: 3.44.5 V Typical supply voltage: 3.8 V Text and PDU modes. Point-to-point MO and MT. SMS cell broadcast. SMS storage: ME by default.
(U)SIM Interface Supports (U)SIM card: 1.8/3.0 V. Power Supply SMS Audio Features PCM Interface I2C Interface Supports one digital audio interface: PCM interface. GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB Supports echo cancellation and noise suppression. Used for audio function with external Codec. Supports 16-bit linear data format. Supports short frame synchronization. Supports master and slave modes. Supports one digital I2C interface. Complies with I2C bus protocol specifications 100/400 kHz. The multi-host mode is not supported. Compliant with USB 2.0 specification (slave only); the data transfer USB Interface Used for AT command communication, data transmission, software Supports USB serial driver for Windows 7/8/8.1/10, Linux 2.65.12 rate can reach up to 480 Mbps. debugging and firmware upgrade. and Android 4.x11.x systems. SDIO Interface Supports SD 3.0 protocol. Main UART:
Used for AT command communication and data transmission. Baud rate: 115200 bps by default, Max. 921600 bps. Supports RTS and CTS hardware flow control. Debug UART:
Used for log output. Baud rate: 115200 bps. NET_MODE and NET_STATUS to indicate network connectivity UART Interfaces Network Indication status. UC200A-GL_Hardware_Design 13 / 78 UMTS/HSPA+ Module Series Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel AT Commands Antenna Interface Transmitting Power UMTS Features GSM Features enhanced AT commands. Main antenna interface (ANT_MAIN). 50 impedance. GSM850: Class 4 (33 dBm 2 dB) EGSM900: Class 4 (33 dBm 2 dB) DCS1800: Class 1 (30 dBm 2 dB) PCS1900: Class 1 (30 dBm 2 dB) GSM850 8-PSK: Class E2 (27 dBm 3 dB) EGSM900 8-PSK: Class E2 (27 dBm 3 dB) DCS1800 8-PSK: Class E2 (26 dBm 3 dB) PCS1900 8-PSK: Class E2 (26 dBm 3 dB) WCDMA: Class 3 (24 dBm +1/-3 dB) Supports 3GPP R7 HSPA+/HSDPA/HSUPA and WCDMA. Supports QPSK/16QAM/64QAM modulation. HSPA+: Max 21 Mbps (DL). HSUPA: Max 5.76 Mbps (UL). WCDMA: Max 384 kbps (DL)/384 kbps (UL). GPRS:
Supports GPRS multi-slot class 12. Coding scheme: CS 1-4. Max 85.6 Kbps (DL)/85.6 Kbps (UL). EDGE:
Supports EDGE multi-slot class 12. Supports GMSK and 8-PSK for different MCS (Modulation and Coding Scheme). Downlink coding schemes: MCS 1-9. Uplink coding schemes: MCS 1-9. Max 236.8 Kbps (DL)/236.8 Kbps (UL). Internet Protocol Features
/FTPS/SSL/FILE/MQTT/MMS/SMTP/SMTPS protocols. Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CMUX/HTTPS Temperature Range Supports PAP and CHAP for PPP connections Operating temperature range 1: -35 C to +75 C Extended temperature range 2: -40 C to +85 C Storage temperature range: -40 C to +90 C Firmware Upgrade Use USB interface or DFOTA to upgrade All hardware components are fully compliant with EU RoHS directive RoHS 1 Within the operating temperature range, the module meets 3GPP specifications. 2 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. UC200A-GL_Hardware_Design 14 / 78 UMTS/HSPA+ Module Series 2.3. Pin Assignment The following figure illustrates the pin assignment of the module. Figure 1: Pin Assignment (Top View) NOTE UC200A-GL_Hardware_Design 15 / 78 WAKEUP_INAP_READYRESERVEDW_DISABLE#NET_MODENET_STATUSVDD_EXT100101102106107111112103104109105110899498889397869196859095998792108RESERVEDRESERVED14114211812345678GND9GND10USIM_GND1112DBG_TXD13USIM_DET14USIM_VDD15USIM_DATA16USIM_CLK17USIM_RST18RESERVEDDBG_RXDRESERVED130RESERVED129RESERVED117RESERVED131RESERVED119132RESERVED120RESERVED133RESERVED121RESERVED134RESERVED122RESERVED135RESERVED123RESERVED136RESERVED124RESERVED137RESERVED125RESERVED138RESERVED126RESERVED139127RESERVED140RESERVED128RESERVED116RESERVED115USB_BOOTGND19RESET_N20PWRKEY21GND22SD_DET23PCM_DIN24PCM_DOUT25PCM_SYNC26PCM_CLK27SD_SDIO_DATA328SD_SDIO_DATA229SD_SDIO_DATA130SD_SDIO_DATA031SD_SDIO_CLK32SD_SDIO_CMD33SD_SDIO_VDD34RESERVED35GND36GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDANT_MAINGND144143545352515049484746GND45ADC04443RESERVED42I2C_SDA4140RESERVED393837ADC1I2C_SCLRESERVEDRESERVEDRESERVED114RESERVED113RESERVEDGND72USB_VBUS71USB_DM70USB_DP69MAIN_RXD68676665646362STATUS6160595857GND56RESERVED55828384798081767377747875RESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDMAIN_TXDMAIN_DTRMAIN_RTSMAIN_CTSMAIN_DCDMAIN_RIVBAT_BBVBAT_BBVBAT_RFVBAT_RFSignal PinsPower PinsDebugMainRESERVED(U)USIMSDANTPCM PinsI2CADCUSBRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDGND UMTS/HSPA+ Module Series 1. USB_BOOT cannot be pulled up before startup. 2. Other unused and RESERVED pins are kept open, and all GND pins are connected to the ground network. 2.4. Pin Description The following table shows the DC characteristics and pin descriptions. Table 5: I/O Parameters Definition Description Analog Input Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Type AI AIO DI DO DIO OD PI PO Table 6: Pin Description Power Supply Pin Name I/O Description Pin No. DC Characteristics Comment VBAT_BB 59, 60 PI Power supply for the modules baseband part VBAT_RF 57, 58 PI Power supply for the modules RF part Vmax = 4.5 V Vmin = 3.4 V Vnom = 3.8 V It must be provided with sufficient current up to 0.8 A. It must be provided with sufficient current up to 1.8 A. UC200A-GL_Hardware_Design 16 / 78 UMTS/HSPA+ Module Series It can provide a pull-up power to the external GPIO. If unused, keep it open. Comment VBAT power domain. Active low. 1.8 V power domain. Active low after turn-on. External pull to 1.8 V. If unused, keep it open. VDD_EXT 7 PO Provide 1.8 V for external circuit Vnom = 1.8 V IOmax = 50 mA Turn On/Off Pin Name I/O Description PWRKEY 21 DI Turn on/off the module DC Characteristics VILmax = 0.5 V RESET_N 20 DI Reset the module Indication Interface Pin Name I/O Description DC Characteristics Comment STATUS 61 OD NET_STATUS NET_MODE USB Interface Indicate the module's operation status Indicate the module's network activity status Indicate the modules network registration mode DO DO VOHmin = 1.35 V VOLmax = 0.45 V 1.8 V power domain. If unused, keep it open. Pin Name I/O Description USB_VBUS 71 AI USB connection detect USB_DP 69 AIO USB differential data (+) USB_DM 70 AIO USB differential data (-) DC Characteristics Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V Comment Typ. 5.0 V. If unused, keep it open. 90 differential impedance. USB 2.0 compliant. If unused, keep it open.
(U)SIM Interface Pin Name I/O Description DC Characteristics Comment UC200A-GL_Hardware_Design 17 / 78 Pin No. Pin No. 6 5 Pin No. Pin No. UMTS/HSPA+ Module Series USIM_VDD 14 PO
(U)SIM card power supply USIM_DATA 15 DIO
(U)SIM card data USIM_CLK 16 DO
(U)SIM card clock USIM_RST 17 DO
(U)SIM card reset USIM_DET 13 DI
(U)SIM card hot-plug detect 1.8 V (U)SIM Vmax = 1.9 V Vmin = 1.7 V 3.0 V (U)SIM Vmax = 3.05 V Vmin = 2.7 V 1.8 V (U)SIM VILmax = 0.6 V VIHmin = 1.2 V VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VOLmax = 0.45 V VOHmin = 2.55 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. 1.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8 V power domain. SD Interface Pin Name I/O Description Pin No. DC Characteristics Comment SD_SDIO_CLK 32 DO SD card SDIO clock SD_SDIO_CMD 33 DIO SD card SDIO command SD_SDIO_DATA0 31 DIO SD card SDIO bit 0 SD_SDIO_DATA1 30 DIO SD card SDIO bit 1 SD_SDIO_DATA2 29 DIO SD card SDIO bit 2 SD_SDIO_DATA3 28 DIO SD card SDIO bit 3 SD_SDIO_VDD 34 PO SD card SDIO power supply SD_DET*
23 DI SD card detect UC200A-GL_Hardware_Design 18 / 78 UMTS/HSPA+ Module Series Main UART Interface Pin Name I/O Description MAIN_RI 62 DO Main UART ring indication MAIN_DCD 63 DO Main UART data carrier detect VOLmax = 0.45 V VOHmin = 1.35 V MAIN_CTS 64 DO DTE clear to send
(Connect to DTEs CTS) MAIN_RTS MAIN_DTR DI DI DTE request to send
(Connect to DTEs RTS) VILmin = -0.3 V VILmax = 0.6 V Main UART data terminal VIHmin = 1.2 V ready VIHmax = 2.0 V MAIN_RXD DI Main UART receive MAIN_TXD DO Main UART transmit Debug UART Interface Pin Name I/O Description Comment If unused, keep it open. DC Characteristics Comment 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Used for external Codec. An external 1.8 V pull-up resistor is needed. If unused, keep it open. VOLmax = 0.45 V VOHmin = 1.35 V DC Characteristics VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V DC Characteristics Comment DBG_RXD 11 DI Debug UART transmit DBG_TXD 12 DO Debug UART receive I2C Interface Pin Name I/O Description I2C_SCL OD I2C serial clock I2C_SDA 42 OD I2C serial data PCM Interface Pin Name I/O Description DC Characteristics Comment UC200A-GL_Hardware_Design 19 / 78 Pin No. 65 66 68 67 Pin No. Pin No. 41 Pin No. PCM_CLK 27 DIO PCM clock UMTS/HSPA+ Module Series PCM_SYNC 26 DIO PCM data frame sync 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. 1.8 V power domain. If unused, keep it open. VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V DC Characteristics Comment PCM_DIN 24 DI PCM data input PCM_DOUT 25 DO PCM data output RF Antenna Interface Pin Name I/O Description ANT_MAIN AIO Main antenna interface Pin No. 49 Pin No. 45 44 Pin No. 1 2 4 Pin Name I/O Description DC Characteristics Comment AI AI General-purpose ADC interface Voltage Range:
0 VVBAT_BB If unused, keep it open. ADC Interface ADC0 ADC1 Other Interface Pin Name I/O Description DC Characteristics Comment USB_BOOT 115 DI Forces the module to enter emergency download mode WAKEUP_IN*
DI Wake up the module AP_READY DI Application processor ready W_DISABLE#
DI Airplane mode control VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. Active High. It is recommended to reserve test points. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. UC200A-GL_Hardware_Design 20 / 78 UMTS/HSPA+ Module Series Pull-up by default. In low voltage level, module can enter into airplane mode. If unused, keep it open. Comment Keep these pins open. GND 8, 9, 10,19, 22, 36, 46, 48, 5054, 56, 72, 85112 RESERVED 3, 18, 35, 3740, 43, 47, 55, 7384,113, 114, 116144 GND Pin Name Pin No. RESERVED Pins Pin Name Pin No. 2.5. EVB In order to help customers to develop applications with the module conveniently, Quectel supplies an evaluation board (UMTS & LTE EVB), USB to RS-232 converter cable, earphone, antenna, and other peripherals to control or to test the module. For more details, see document [1]. UC200A-GL_Hardware_Design 21 / 78 UMTS/HSPA+ Module Series 3 Operating Characteristics 3.1. Operating Modes The table below outlines operating modes of the module. Table 7: Overview of Operating Modes Mode Details Normal Operation Idle Talk/Data Software is active. The module is registered on the network and ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN=0 can set the module to a minimum functionality mode. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN=4 or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, current consumption of the module will be reduced to the minimal level. The module can still receive paging, SMS, voice call and TCP/UDP data from network. Power Down Mode In this mode, the VBAT power supply is constantly turned on and the software stops working. 3.2. Sleep Mode In sleep mode, the module can reduce power consumption to a very low level, the following section describes power saving procedures of UC200A-GL module. UC200A-GL_Hardware_Design 22 / 78 UMTS/HSPA+ Module Series 3.2.1. UART Application If the host communicates with module via UART interface, the following preconditions should be met to enable the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR to high level. The following figure shows the connection between the module and the host. Figure 2: Sleep Mode Application via UART Driving MAIN_DTR to low level by host will wake up the module. When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please refer to Chapter 4.9 for details about MAIN_RI behavior. 3.2.2. USB Application with USB Remote Wakeup Function If the host supports USB Suspend/Resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is kept at high level or kept open. The hosts USB bus, which is connected with the modules USB interface, enters Suspend state. UC200A-GL_Hardware_Design 23 / 78 MAIN_RXDMAIN_TXDMAIN_RIMAIN_DTRAP_READYTXDRXDEINTGPIOGPIOModuleHostGNDGND UMTS/HSPA+ Module Series The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application with USB Remote Wakeup Sending data to the module through USB will wake up the module. When the module has a URC to report, the module will send remote wakeup signals via USB bus to wake up the host. NOTE The AP_READY is active low and the default state is high. 3.2.2.1. USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function If the host supports USB Suspend/Resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is held at high level or kept open. The hosts USB bus, which is connected with the modules USB interface, enters Suspend state. UC200A-GL_Hardware_Design 24 / 78 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGND UMTS/HSPA+ Module Series The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with MAIN_RI Sending data to UC200A-GL through USB will wake up the module. When UC200A-GL has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please refer to Chapter 4.9 for details about MAIN_RI behavior. 3.2.2.2. USB Application without USB Suspend Function If the host does not support USB Suspend function, please disconnect USB_VBUS with additional control circuit to let the module enter into sleep mode. Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is held at high level or kept open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application without Suspend Function UC200A-GL_Hardware_Design 25 / 78 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGNDMAIN_RIEINTUSB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostMAIN_RIEINTPower SwitchGPIOGNDGND UMTS/HSPA+ Module Series Turn on the power switch and supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. 3.3. Airplane Mode When the module enters into airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable the function. Driving the pin to low level can make the module enter airplane mode. 3.3.1. Hardware 3.3.2. Software AT+CFUN=<fun> command provides choices of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: minimum functionality mode (both (U)SIM and RF functions are disabled). AT+CFUN=1: full functionality mode (by default). AT+CFUN=4: airplane mode (RF function is disabled.). 3.4. Power Supply 3.4.1. Power Supply Interfaces The module provides four VBAT pins dedicated to the connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part Two VBAT_BB pins for modules baseband part UC200A-GL_Hardware_Design 26 / 78 UMTS/HSPA+ Module Series The following table shows the details of power supply and GND pins. Table 8: Pin Definition of Power Supply Pin Name Pin No. I/O Description Comment VBAT_BB 59, 60 PI VBAT_RF 57, 58 PI Power supply for the modules baseband part Power supply for the modules RF part VDD_EXT 7 PO Provide 1.8 V for external circuit It must be provided with sufficient current up to 0.8 A. It must be provided with sufficient current up to 1.8 A. It can provide a pull-up power to the external GPIO. If unused, keep it open. 3.4.2. Reference Design for Power Supply The performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of 3 A at least. If the voltage drops between input and output is not too high, it is suggested that an LDO should be used to supply power to the module. If there is a big voltage difference between input and the desired output VBAT, a buck converter is preferred as the power supply. The following figure shows a reference design for +5 V input power source. The design uses the LDO MIC29302WU from Micrel company. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. Figure 6: Reference Design of Power Supply UC200A-GL_Hardware_Design 27 / 78 DC_INMIC29302WUINOUTENGNDADJ24135VBAT 100 nF470 F100 nF100K47K470 F330R51K1%1%4.7K47KVBAT_EN UMTS/HSPA+ Module Series NOTE 1. 2. If you use the module that does not support the GSM band, a power supply capable of providing at least 2 A can be used in the design. It is recommended to design switch control for power supply. 3.4.3. Requirements for Voltage Stability The power supply range of the module is from 3.4 V to 4.5 V. Please make sure the input voltage will never drop below 3.4 V. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT_BB and VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1 mm; and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to ensure the stability of power source, it is suggested that a TVS diode of which reverse stand-off voltage is 4.7 V and peak pulse power is up to 2550 W should be used. The following figure shows the star structure of the power supply. UC200A-GL_Hardware_Design 28 / 78 VBATRippleDropBurst TransmissionBurst Transmission UMTS/HSPA+ Module Series Figure 8: Star Structure of the Power Supply 3.5. Turn On 3.5.1. Turn on the Module with PWRKEY Table 9: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module VBAT power domain. Active low. When the module is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. Figure 9: Turning on the Module Using Driving Circuit UC200A-GL_Hardware_Design 29 / 78 ModuleVBAT_RFVBAT_BBVBATC1100FC6100nFC733pFC810pF++C2100nFC5100FC333pFC410pFD1WS4.5D3HVPWRKEY4.7K47K10 nFTurn-on pulse 500 ms UMTS/HSPA+ Module Series Another way to control the PWRKEY is using a button directly. When pressing the button, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 10: Turning on the Module with a Button The power up scenario is illustrated in the following figure. Figure 11: Power-up Timing UC200A-GL_Hardware_Design 30 / 78 PWRKEYModuleS1Close to S1TVSTurn-on pulseVIL 0.5 VVBATPWRKEY 500 msRESET_NSTATUS(OD)InactiveActiveUARTNOTE 1InactiveActiveUSB 10 sVDD_EXTUSB_BOOT 100 ms. After this time, the pin can be set high level by an external circuit. About 22 msAbout 5 ms 10 s 10 s UMTS/HSPA+ Module Series
. NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time difference between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 4.7 k resistor if module needs to be powered on automatically and shutdown is not needed. 3.6. Turn Off The following procedures can be used to turn off the module. 3.6.1. Turn off the Module with PWRKEY Driving the PWRKEY to a low-level voltage for at least 650 ms, then the module will execute power-down procedure after the PWRKEY is released. The timing of turning off the module is illustrated in the following figure. Figure 12: Timing of Turning off Module 3.6.2. Turn off the Module with AT Command It is safe to use AT+QPOWD to turn off the module, which is equal to turn off the module via PWRKEY Pin. UC200A-GL_Hardware_Design 31 / 78
. UMTS/HSPA+ Module Series See document [2] for details about AT+QPOWD. NOTE 1. To avoid damaging internal flash, do not switch off the power supply when the module works normally. Only after shutting down the module with PWRKEY or AT command can you cut off the power supply. 2. When turning off module with the AT command, please keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on again after successfully turn-off. 3.7. Reset The module can be reset by driving the RESET_N low for at least 300 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 10: Pin Definition of RESET Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8 V power domain. Active low after turn-on. The recommended circuit is equal to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 13: Reference Circuit of RESET_N with Driving Circuit UC200A-GL_Hardware_Design 32 / 78 Reset pulseRESET_N4.7K47K 300 ms UMTS/HSPA+ Module Series Figure 14: Reference Circuit of RESET_N with Button The timing of resetting module is illustrated in the following figure. Figure 15: Timing of Resetting Module NOTE and RESET_N pins. management chip. 1. Please ensure that there is no large capacitance with the max value exceeding 10 nF on PWRKEY 2. RESET_N only resets the internal baseband chip of the module and does not reset the power UC200A-GL_Hardware_Design 33 / 78 RESET_NS2Close to S2TVSVIL 0.5 VVBATModule StatusRunningRESET_NBaseband restart Baseband resetting 300 ms UMTS/HSPA+ Module Series 4 Application Interfaces 4.1. USB Interface UC200A-GL provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 11: Functions of the USB Interface Functions AT command communication Data transmission Software debugging Firmware upgrade Pin definition of the USB interface is here as follows:
Table 12: Pin Definition of USB Interface YES YES YES YES Pin Name Pin No. I/O Description Comment USB_VBUS AI USB connection detect USB_DP USB_DM AIO USB differential data (+) AIO USB differential data (-) 71 69 70 Typ. 5.0 V. If unused, keep it open. 90 differential impedance. USB 2.0 compliant. If unused, keep it open. UC200A-GL_Hardware_Design 34 / 78 UMTS/HSPA+ Module Series It is recommended to reserve test points for debugging and firmware upgrade in your designs. The following figure shows a reference circuit of USB interface. Figure 16: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and your MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R1 and R2) should be added in series between the module and the test points to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1, R1 and R2 components must be placed close to the module, and R1 and R2 should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when designing the USB interface, to meet USB specifications. It is important to route the USB signal traces as differential pairs with ground surrounded. The impedance of USB differential trace is 90 . Do not route signal traces under crystals, oscillators, magnetic devices, PCIe and RF signal traces. It is important to route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and ground planes above and below. Junction capacitance of the ESD protection device might cause influences on USB data lines, so please pay attention to the selection of the device. Typically, the stray capacitance should be less than 2 pF for USB. If possible, reserve a 0 resistor on USB_DP and USB_DM lines respectively. For more details about the USB specifications, please visit http://www.usb.org/home. UC200A-GL_Hardware_Design 35 / 78 USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR1R2Test PointsESD ArrayNM_0 RNM_0 RMinimize these stubsModuleMCUUSB_VBUSVDD UMTS/HSPA+ Module Series 4.2. USB_BOOT Interface The module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 13: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 115 DI Forces the module to enter download mode The following figure shows a reference circuit of USB_BOOT interface. 1.8 V power domain. Active High. It is recommended to reserve test points. Figure 17: Reference Circuit of USB_BOOT Interface UC200A-GL_Hardware_Design 36 / 78 ModuleUSB_BOOTVDD_EXT4.7KTest pointTVSClose to test point UMTS/HSPA+ Module Series Figure 18: Timing Sequence for Entering Emergency Download Mode NOTE
. 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up FORCE_USB_BOOT to 1.8 V before powering up VBAT. Directly connect the test points as shown in Figure 17 can manually force the module into download mode. 3. USB_BOOT cannot be pulled up before startup. 4.3. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported. Table 14: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD 14 PO
(U)SIM card power supply Either 1.8 V or 3.0 V (U)SIM UC200A-GL_Hardware_Design 37 / 78 VIL 0.5VVBATPWRKEY 500 msRESET_NNOTE 1VDD_EXTAbout 5 msUSB_BOOTUSB_BOOT can be pulled up to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on.About 22 ms UMTS/HSPA+ Module Series card is supported and can be identified automatically by the module. USIM_DATA DIO
(U)SIM card data DO
(U)SIM card clock DO
(U)SIM card reset USIM_CLK USIM_RST USIM_DET 15 16 17 13 DI
(U)SIM card hot-plug detect 1.8 V power domain. If unused, keep it open. The module supports (U)SIM card hot-plug via the USIM_DET pin, the function supports low-level and high-level detections. By default, it is disabled, and can be configured via AT+QSIMDET. Refer to document [2] for details about the command. The reference circuit of the 8-pin (U)SIM interface is as follows. Figure 19: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector UC200A-GL_Hardware_Design 38 / 78 ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET0R0R0RVDD_EXT51K100 nFGNDGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15K(U)SIM Card Connector UMTS/HSPA+ Module Series If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 20: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design. Keep (U)SIM card connector as close as possible to the module. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signal traces away from RF and VCC traces. USIM_VDD maximum bypass capacitor does not exceed 1 F. Ensure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground surrounded. In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15 pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33 pF capacitors on the USIM_DATA, USIM_CLK and USIM_RST trances are used for filtering interference. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA can improve anti-jamming capability of the (U)SIM card. If the
(U)SIM card traces are too long, or the interference source is relatively close, it is recommended to add a pull-up resistor near the (U)SIM card connector. UC200A-GL_Hardware_Design 39 / 78 ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATA0R0R0R100 nFGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGND15KUSIM_VDD(U)SIM Card Connector UMTS/HSPA+ Module Series 4.4. PCM and I2C Interface The module provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the primary mode (short frame synchronization) and the module works as both master and slave. The module can only be used as primary devices in applications related to I2C interfaces. In short frame mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024 kHz, 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4069 kHz PCM_CLK at 16 kHz PCM_SYNC. The module supports a 16-bit linear encoding format. The following figure shows the sequence diagram of short frame mode. (PCM_SYNC = 8 kHz, PCM_CLK = 2048 kHz). Figure 21Timing Sequence for Short frame mode Table 15: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_SYNC 26 DIO PCM data frame sync PCM_CLK 27 DIO PCM clock 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. UC200A-GL_Hardware_Design 40 / 78 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125 s12256255PCM_DINMSBLSBMSB UMTS/HSPA+ Module Series PCM_DIN DI PCM data input PCM_DOUT DO PCM data output 1.8 V power domain. If unused, keep it open. Table 16: Pin Definition of I2C Interface Pin Name Pin No. Description Comment I/O OD OD I2C serial clock I2C serial data Used for external Codec. An external 1.8 V pull-up resistor is needed. Clock and mode can be configured by AT command, and the default configuration is short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. I2C_SCL I2C_SDA The following is a reference design for the PCM and I2C interfaces with external Codec chip 24 25 41 42 Figure 22: PCM and I2C Interface Circuit Reference Design NOTE It is recommended to reserve the RC (R = 22 , C = 33 pF) circuit on the PCM signal line and the capacitor should be placed close to the module, especially on PCM_CLK. UC200A-GL_Hardware_Design 41 / 78 PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8 V4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec22R33 pF22R22R33 pF22R33 pF UMTS/HSPA+ Module Series 4.5. UART Interface The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps, 921600 bps baud rates, and the baud rate is 115200 bps by default. This interface is used for data transmission and AT command communication. Also, it supports RTS and CTS hardware flow control. The debug UART interface supports 115200 bps baud rate. It is used for the output of partial logs. Table 17: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment MAIN_RI MAIN_DCD MAIN_CTS MAIN_RTS MAIN_DTR MAIN_RXD MAIN_TXD DO DO DO DI DI DI 62 63 64 65 66 68 67 Main UART ring indication Main UART data carrier detect DTE clear to send signal from DCE (Connect to DTEs CTS) DTE request to send signal to DCE (Connect to DTEs RTS) Main UART data terminal ready Main UART receive DO Main UART transmit Table 18: Pin Definition of Debug UART Interface 1.8 V power domain. If unused, keep it open. I/O DI Pin Name Pin No. Description Comment DBG_RXD DBG_TXD 11 12 Debug UART transmit DO Debug UART receive 1.8 V power domain. If unused, keep it open. The module provides a 1.8 V UART interface. A level translator should be used if the application is equipped with a 3.3 V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. UC200A-GL_Hardware_Design 42 / 78 UMTS/HSPA+ Module Series Figure 23: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor circuit is shown as below. For the design of circuits shown in dotted lines, please refer to that shown in solid lines, but pay attention to the direction of connection. Figure 24: Reference Circuit with Transistor Circuit NOTE 1. Transistor circuit solution is not suitable for applications with baud rates exceeding 460 kbps. 2. Please note that the module CTS is connected to the host CTS, and the module RTS is connected to the host RTS. UC200A-GL_Hardware_Design 43 / 78 VCCAVCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTMAIN_RIMAIN_DCDMAIN_RTSMAIN_RXDMAIN_DTRMAIN_CTSMAIN_TXD51K51K0.1 F0.1 FRI_MCUDCD_MCURTS_MCUTXD_MCUDTR_MCUCTS_MCURXD_MCUVDD_MCUTranslator10K120KMCU/ARMTXDRXDVDD_EXT10KVCC_MCU4.7K10KVDD_EXTMAIN_TXDMAIN_RXDMAIN_RTSMAIN_CTSMAIN_DTRMAIN_RIRTSCTSGNDGPIOMAIN_DCDModuleGPIOEINTVDD_EXT4.7KGND1 nF1 nF UMTS/HSPA+ Module Series 4.6. SDIO Interface The module provides one SD card interface which supports SD 3.0 protocol. Table 19: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_SDIO_CLK DO SD card SDIO clock SD_SDIO_CMD DIO SD card SDIO command SD_SDIO_DATA0 DIO SD card SDIO bit 0 SD_SDIO_DATA1 DIO SD card SDIO bit 1 SD_SDIO_DATA2 DIO SD card SDIO bit 2 SD_SDIO_DATA3 DIO SD card SDIO bit 3 32 33 31 30 29 28 34 23 SD_SDIO_VDD PO SD card SDIO power supply SD_DET*
DI SD card hot-plug detect 1.8 V power domain. If unused, keep it open. The following figure illustrates a reference design of SD card interface with the module. 1.8/2.8 V power domain. If unused, keep it open. Figure 25: Reference Circuit of SD Card Interface In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:
UC200A-GL_Hardware_Design 44 / 78 SD Card ConnectorDAT2CD/DAT3CMDVDDCLKVSSDAT0DAT1DETECTIVEModuleSD_SDIO_DATA3SD_SDIO_DATA2SD_SDIO_DATA1SD_SDIO_VDDSD_SDIO_DATA0SD_SDIO_CLKSD_SDIO_CMDSD_DETR1 0RR7NMR8NMR9NMR10NMR11NMVDD_3VR2 0RR3 0RR4 0RR5 0RR6 0RC2NMD2C3NMD3C4NMD4C5NMD5C6NMD6C1NMD1C710 pFD7C833 pFC9100 nFC10100 uF+
UMTS/HSPA+ Module Series The voltage range of SD card power supply VDD_3V is 2.73.6 V and a sufficient current up to 800 mA should be provided. The maximum output current of SD_SDIO_VDD is 50 mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, R7R11 are needed to pull up the SDIO to SD_SDIO_VDD. Value of these resistors is among 10 k to 100 k and the recommended value is 100 k. SD_SDIO_VDD should be used as the pull-up power. In order to improve signal quality, it is recommended to add 0 resistors R1 to R6 in series between the module and the SD card. The bypass capacitors C1 to C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module. In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15 pF. It is important to route the SDIO signal traces with ground surrounded. The impedance of SDIO data trace is 50 (10 %). Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is recommended to keep the traces of SD_SDIO_CLK, SD_SDIO_DATA [0:3] and SD_SDIO_CMD with equal length (the difference among them is less than 1 mm) and the total routing length needs to be less than 50 mm. Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO Bus should be less than 15 pF. 4.7. ADC Interface The module provides two Analog-to-Digital Converter (ADC) interfaces. In order to improve the accuracy of ADC, the trace of ADC interfaces should be surrounded by ground. Table 20: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC0 ADC1 45 44 AI AI General-purpose ADC interface If unused, keep it open. The voltage value on ADC pins can be read via AT+QADC=<port>:
AT+QADC=0: read the voltage value on ADC0. AT+QADC=1: read the voltage value on ADC1. For more details about the AT command, see document [2]. UC200A-GL_Hardware_Design 45 / 78 UMTS/HSPA+ Module Series The resolution of the ADC is up to 12 bits. The following table describes the characteristic of the ADC interface. Table 21: Characteristics of ADC Interface Name Min. Typ. Max. ADC0 Voltage Range ADC1 Voltage Range ADC Resolution 0 0
12 VBAT_BB VBAT_BB
Unit V V bits NOTE 1. The input voltage of ADC should not exceed its corresponding voltage range. It is prohibited to supply any voltage to ADC pin when VBAT is removed. 2. It is recommended to use resistor divider circuit for ADC application and the divider resistance should 3. not exceed 100K. 4.8. Indication Signal The pin definition of indication signal is as follows:
Table 22: Pin Definition of Indication Signal Pin Name Pin No. I/O Description Comment NET_MODE NET_STATUS 5 6 DO DO Indicate the modules network registration mode Indicate the module's network activity status 1.8 V power domain. If unused, keep it open. 4.8.1. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two network indication pins: NET_MODE and NET_STATUS. The following tables describe pin definition and logic level changes in different network status. UC200A-GL_Hardware_Design 46 / 78 UMTS/HSPA+ Module Series Table 23: Working State of the Network Connection Status/Activity Indication Pin Name Status Description NET_MODE Always High Always Low Registered on UMTS network Others Flicker slowly (200 ms High/1800 ms Low) Network searching NET_STATUS Flicker slowly (1800 ms High/200 ms Low) Idle Flicker quickly (125 ms High/125 ms Low) Data transfer is ongoing Always High Voice calling Figure 26: Reference Circuit of the Network Status Indication 4.8.2. STATUS The STATUS pin is an open drain output for modules operation status indication. It can be connected to a GPIO of DTE with a pulled-up resistor, or as an LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Except for this, the STATUS will present high-impedance state. The following figure shows different circuit designs of STATUS, and you can choose either one according to the application demands. UC200A-GL_Hardware_Design 47 / 78 4.7 K47 KVBAT2.2 KModuleNET_STATUS UMTS/HSPA+ Module Series Figure 27: Reference Circuits of STATUS NOTE NOTE State Idle URC The status pin cannot be used as indication of module shutdown status when VBAT is removed. 4.9. Behaviors of the MAIN_RI AT+QCFG="risignaltype","physical" can be used to configure MAIN_RI behaviors. No matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI pin. The URC can be outputted via UART port, USB AT port and USB modem port, which can be set by AT+QURCCFG. The default port is USB AT port. In addition, MAIN_RI behavior can be configured flexibly. The MAIN_RI behavior can be changed via AT+QCFG. See document [2] for details. The default behavior of the MAIN_RI is shown as below. Table 24: Behaviors of the MAIN_RI Response MAIN_RI keeps at high level MAIN_RI outputs 120 ms low pulse when a new URC returns UC200A-GL_Hardware_Design 48 / 78 VDD_MCU33 KModuleSTATUSMCU_GPIOModuleSTATUSVBAT2.2 K UMTS/HSPA+ Module Series NOTE GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 5 RF Specifications 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 25: Pin Definition of Cellular Network Interface Pin Name Pin No. I/O Description Comment ANT_MAIN 49 AIO Main antenna interface Only passive antennas are supported. Considering authentication requirements, it is recommended to reserve diversity positions for overseas versions. Table 26: Operating Frequency of UC200A-GL Operating Frequency Transmit (MHz) Receive (MHz) 824849 880915 17101785 18501910 19221978 18521908 869894 925960 18051880 19301990 21122168 19321988 UC200A-GL_Hardware_Design 49 / 79 UMTS/HSPA+ Module Series 826847 882913 871892 927958 WCDMA B5 WCDMA B8 5.1.2. Tx Power The following table shows the Tx power of the module. Table 27: Tx Power Max. Tx Power Min. Tx Power 33 dBm 2 dB 5 dBm 5 dB 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB GSM850 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB GSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB PCS1900 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB WCDMA B1/B2/B5/B8 24 dBm +1/-3 dB
<-49 dBm In GPRS 4 slots Tx mode, the maximum output power is reduced by 4 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. Frequency GSM850 EGSM900 DCS1800 PCS1900 NOTE
. UC200A-GL_Hardware_Design 50 / 79 UMTS/HSPA+ Module Series 5.1.3. Rx Sensitivity The following table shows conducted Rx sensitivity of the module. Table 28: Conducted RF Receiving Sensitivity of UC200A-GL Receiving Sensitivity (Typ.) Primary Diversity SIMO 3GPP Requirement
(SIMO) Frequency GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B5 WCDMA B8 TBD TBD TBD TBD TBD TBD TBD TBD 5.1.4. Reference Design
-102 dBm
-102 dBm
-102 dBm
-102 dBm
-106.7 dBm
-104.7 dBm
-104.7 dBm
-103.7 dBm The module provides one RF antenna interfaces for antenna connection. It is recommended to reserve a -type matching circuit for better RF performance, and the -type matching components (C1, R1, C2) should be placed as close to the antenna as possible. The capacitors are not mounted by default. UC200A-GL_Hardware_Design 51 / 79 UMTS/HSPA+ Module Series Figure 28: Reference Circuit for RF Antenna Interfaces 5.2. Reference Design of RF Routing For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 29: Microstrip Design on a 2-layer PCB UC200A-GL_Hardware_Design 52 / 79 ANT_MAINR1 0 RC1ModuleMainantennaNMC2NM UMTS/HSPA+ Module Series Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) UC200A-GL_Hardware_Design 53 / 79 UMTS/HSPA+ Module Series In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:
Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . connected to ground. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, ground vias around RF traces and the reference ground improves RF performance. The distance between the ground vias and RF traces should be more than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. 5.3. Requirements for Antenna Design Table 29: Requirements for Antenna Design Antenna Type Requirements GSM/UMTS VSWR: 2 Efficiency: > 30 %
Max. input power: 50 W Input impedance: 50 Cable insertion loss:
< 1 dB: LB (< 1 GHz)
< 1.5 dB: MB (1~2.3 GHz) UC200A-GL_Hardware_Design 54 / 79 UMTS/HSPA+ Module Series 5.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors UC200A-GL_Hardware_Design 55 / 79 UMTS/HSPA+ Module Series The following figure describes the space factor of mated connector. Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com. UC200A-GL_Hardware_Design 56 / 79 UMTS/HSPA+ Module Series 6 Electrical Characteristics &
Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Parameter Max. Unit Table 30: Absolute Maximum Ratings VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage on Digital Pins
-0.3 Voltage at ADC0 Voltage at ADC1 Min.
-0.3
-0.3
0 0 5.5 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V UC200A-GL_Hardware_Design 57 / 79 UMTS/HSPA+ Module Series 6.2. Power Supply Ratings Table 31: The Modules Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT IVBAT VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. Voltage drop during transmitting burst Maximum power control level at EGSM 900. Peak supply current
(during transmission slot) Maximum power control level at EGSM 900. 0 0 3.4 3.8 4.5 V 0 400 mV 1.8 2.0 A USB_VBUS USB connection detection 3.0 5.0 5.25 V 6.3. Power Consumption Table 32: The Module Power Consumption UC200A-GL Description Conditions OFF state Power down Sleep state Typ. 11 TBD AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 2 (USB disconnected) TBD EGSM900 @ DRX = 5 (USB disconnected) TBD EGSM900 @ DRX = 5 (USB suspend) TBD EGSM900 @ DRX = 9 (USB disconnected) TBD DCS1800 @ DRX = 2 (USB disconnected) TBD DCS1800 @ DRX = 5 (USB disconnected) TBD DCS1800 @ DRX = 5 (USB suspend) TBD Unit A mA mA mA mA mA mA mA mA UC200A-GL_Hardware_Design 58 / 79 Idle state GPRS data transfer UMTS/HSPA+ Module Series DCS1800 @ DRX = 9 (USB disconnected) TBD WCDMA @ PF = 64 (USB disconnected) TBD WCDMA @ PF = 64 (USB suspend) TBD WCDMA @ PF = 128 (USB disconnected) TBD WCDMA @ PF = 256 (USB disconnected) TBD WCDMA @ PF = 512 (USB disconnected) TBD EGSM900 @ DRX = 5 (USB disconnected) TBD EGSM900 @ DRX = 5 (USB connected) TBD WCDMA @ PF = 64 (USB disconnected) TBD WCDMA @ PF = 64 (USB connected) TBD EGSM900 4DL/1UL @ 32.34 dBm EGSM900 3DL/2UL @ 32.31 dBm EGSM900 2DL/3UL @ 31.08 dBm EGSM900 1DL/4UL @ 29.28 dBm DCS1800 4DL/1UL @ 29.65 dBm DCS1800 3DL/2UL @ 29.58 dBm DCS1800 2DL/3UL @ 28.03 dBm DCS1800 1DL/4UL @ 26.16 dBm EGSM900 4DL/1UL @ 27.06 dBm EGSM900 3DL/2UL @ 26.87 dBm EGSM900 2DL/3UL @ 25.01 dBm DCS1800 4DL/1UL @ 25.66 dBm DCS1800 3DL/2UL @ 25.50 dBm DCS1800 2DL/3UL @ 23.95 dBm TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transfer EGSM900 1DL/4UL @ 22.87 dBm UC200A-GL_Hardware_Design 59 / 79 UMTS/HSPA+ Module Series TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD WCDMA data transfer GSM voice call DCS1800 1DL/4UL @ 21.93 dBm WCDMA B1 HSDPA @ 22.06 dBm WCDMA B5 HSDPA @ 21.68 dBm WCDMA B8 HSDPA @ 21.64 dBm WCDMA B1 HSUPA @ 21.30 dBm WCDMA B5 HSUPA @ 20.02 dBm WCDMA B8 HSUPA @ 21.03 dBm EGSM900 PCL = 5 @ 32.24 dBm EGSM900 PCL = 12 @ 19.09 dBm EGSM900 PCL = 19 @ 5.82 dBm DCS1800 PCL = 0 @ 29.40 dBm DCS1800 PCL = 7 @ 15.75 dBm DCS1800 PCL = 15 @ -0.43 dBm WCDMA B1 @ 22.77 dBm WCDMA voice call WCDMA B5 @ 22.42 dBm WCDMA B8 @ 22.43 dBm 6.4. Digital I/O Characteristic Table 33: 1.8 V I/O Requirements mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Parameter Description Max. Unit Min. 1.2
-0.3 Input high voltage Input low voltage Output high voltage 1.35 Output low voltage
-0.3 2.0 0.6 1.8 0.45 V V V V VIH VIL VOH VOL UC200A-GL_Hardware_Design 60 / 79 UMTS/HSPA+ Module Series Table 34: (U)SIM 1.8 V I/O Requirements Parameter Description Max. Unit USIM_VDD Power supply Input high voltage Input low voltage Output high voltage 1.35 Output low voltage
-0.3 0.45 Min. 1.7 1.2
-0.3 Min. 2.7 1.95
-0.3 VIH VIL VOH VOL VIH VIL VOH VOL Table 35: (U)SIM 3.0 V I/O Requirements Parameter Description USIM_VDD Power supply Input high voltage Input low voltage Output high voltage 2.55 Output low voltage
-0.3 1.9 2.0 0.6 1.8 Max. 3.05 3.05 1.0 3.0 0.45 V V V V V V V V V V Unit 6.5. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example, wearing anti-static gloves during the development, production, assembly and testing of the module;
adding ESD protective components to the ESD sensitive interfaces and points in the product design. ESD characteristics of the modules pins are as follows:
UC200A-GL_Hardware_Design 61 / 79 UMTS/HSPA+ Module Series Table 36: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND 8 All Antenna Interfaces 8 Other Interfaces 0.5 10 10 1 kV kV kV 6.6. Operating and Storage Temperatures Table 37: Operating and Storage Temperatures Parameter Typ. Max. Unit Operating Temperature Range 3 Extended Operating Temperature Range 4
-40 Storage temperature range
-40
+25
+75
+85
+90 C C C Min.
-35 3 Within the operating temperature range, the module meets 3GPP specifications. 4 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. UC200A-GL_Hardware_Design 62 / 79 UMTS/HSPA+ Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 36: Module Top and Side Dimensions (Unit: mm) UC200A-GL_Hardware_Design 63 / 79 UMTS/HSPA+ Module Series Pin 1 Figure 37: Module Bottom Dimensions View (Unit: mm) The package warpage level of the module conforms to the JEITA ED-7306 standard. NOTE UC200A-GL_Hardware_Design 64 / 79 UMTS/HSPA+ Module Series 7.2. Recommended Footprint Figure 38: Recommended Footprint (Bottom View) Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. NOTE
. UC200A-GL_Hardware_Design 65 / 79 UMTS/HSPA+ Module Series 7.3. Top and Bottom Views Figure 39: Top and Bottom View of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. UC200A-GL_Hardware_Design 66 / 79 UMTS/HSPA+ Module Series 8 Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed package. MSL of the module is rated as 3, and its storage restrictions are shown as below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 hours 5 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition;
Violation of the third requirement above occurs;
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
Before module repairing. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 5 C;
All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 5. 5 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. UC200A-GL_Hardware_Design 67 / 79 UMTS/HSPA+ Module Series NOTE the air is forbidden. 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 40: Recommended Reflow Soldering Thermal Profile UC200A-GL_Hardware_Design 68 / 79 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 1 to 3C/s Cooling down slope: -1.5 to -3C/s Max slope: 2 to 3C/s UMTS/HSPA+ Module Series Table 38: Recommended Thermal Profile Parameters Soak time (between A and B: 150 C and 200 C) 70 to 120 s Recommendation 1 to 3 C/s 2 to 3 C/s 45 to 70 s 235 to 246 C
-1.5 ~ -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. 4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [4]. Factor Soak Zone Max slope Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE UC200A-GL_Hardware_Design 69 / 79 UMTS/HSPA+ Module Series 8.3. Packaging Specifications The module is packaged in tape and reel carriers. One reel is 11.88 meters long and contains 250 modules. The figures below show the package details, measured in mm. Figure 41: Carrier Tape Dimension Drawing Table 39: Carrier Tape Dimension Table (Unit: mm) W 44 P 44 T A0 B0 0.35 32.5 29.5 K0 3.0 K1 3.8 F E 20.2 1.75 8.3.1. Plastic Reel Figure 42: Plastic Reel Dimension Drawing UC200A-GL_Hardware_Design 70 / 79 UMTS/HSPA+ Module Series Table 40: Plastic Reel Dimension Table (Unit: mm) D2 100 W 44.5 D1 330 8.3.2. Packaging Process Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules. Figure 43: Packaging Process UC200A-GL_Hardware_Design 71 / 79 UMTS/HSPA+ Module Series 9 Appendix References Table 41: Related Documents Document Name
[1] Quectel_UMTS<E_EVB_User_Guide
[2] Quectel_UC200T_AT_Commands_Manual
[3] Quectel_RF_Layout_Application_Note
[4] Quectel_Module_Secondary_SMT_Application_Note Table 42: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband AON AP bps BPSK CHAP CS CSD CTS DAI Challenge Handshake Authentication Protocol Active Optical Network Application Processor Bits Per Second Binary Phase Shift Keying Coding Scheme Circuit Switched Data Clear To Send Digital Audio Interface UC200A-GL_Hardware_Design 72 / 79 UMTS/HSPA+ Module Series DCE Data Communications Equipment DC-HSDPA Dual-carrier High Speed Downlink Packet Access Double Data Rate Delta Firmware Upgrade Over the Air DDR DFOTA DL DRX DTE DTR EFR ESD FDD FEM FR GMSK GNSS GPS GRFC HB HPUE HR HSDPA HSPA HSUPA IC Downlink Diversity Receive Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Front-End Module Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System General RF Control High Band High Power User Equipment Half Rate High Speed Downlink Packet Access High Speed Packet Access High Speed Uplink Packet Access Integrated Circuit GLONASS Global Navigation Satellite System (Russia) UC200A-GL_Hardware_Design 73 / 79 UMTS/HSPA+ Module Series LMHB Low/Middle/High Band I2C I2S I/O Inom LAA LB LED LGA LNA LTE MAC MB MCU MDC MDIO MHB MIMO MO MS MT NR NSA PA PAP Inter-Integrated Circuit Inter-IC Sound Input/Output Normal Current License Assisted Access Low Band Light Emitting Diode Land Grid Array Low Noise Amplifier Long Term Evolution Media Access Control Middle Band Microcontroller Unit Management Data Clock Management Data Input/Output Middle/High Band Multiple Input Multiple Output Mobile Originated Mobile Station Mobile Terminated New Radio Non-Stand Alone Power Amplifier Password Authentication Protocol UC200A-GL_Hardware_Design 74 / 79 UMTS/HSPA+ Module Series PC PCB PCIe PCM PDA PDU PHY PMIC PRX QAM QPSK QZSS RI RF RGMII RHCP Rx SA SCS SD SIMO SMD SMS SoC SPI Peripheral Component Interconnect Express Personal Computer Printed Circuit Board Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Physical Layer Power Management Integrated Circuit Primary Receive Quadrature Amplitude Modulation Quadrature Phase Shift Keying Quasi-Zenith Satellite System Ring Indicator Radio Frequency Reduced Gigabit Media Independent Interface Right Hand Circularly Polarized Receive Stand Alone Sub-Carrier Space Secure Digital Single Input Multiple Output Surface Mount Device Short Message Service System on a Chip Serial Peripheral Interface UC200A-GL_Hardware_Design 75 / 79 UMTS/HSPA+ Module Series TD-SCDMA Time Division-Synchronous Code Division Multiple Access
(U)SIM Universal Subscriber Identity Module STB TDD TDMA TRX Tx UART UHB UL UMTS URC USB VBAT Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHmax VOHmin Universal Asynchronous Receiver/Transmitter Universal Mobile Telecommunications System Set Top Box Time Division Duplexing Time Division Multiple Access Transmit & Receive Transmit Ultra High Band Uplink Unsolicited Result Code Universal Serial Bus Voltage at Battery (Pin) Maximum Voltage Nominal Voltage Minimum Voltage Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage Maximum High-level Output Voltage Minimum High-level Output Voltage UC200A-GL_Hardware_Design 76 / 79 UMTS/HSPA+ Module Series WCDMA Wideband Code Division Multiple Access Maximum Low-level Output Voltage Minimum Low-level Output Voltage Voltage Standing Wave Ratio Wireless Local Area Network Wireless Wide Area Network VOLmax VOLmin VSWR WLAN WWAN 10 Warnings sentences 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different Part 2.1091(b). antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is UC200A-GL_Hardware_Design 77 / 79 UMTS/HSPA+ Module Series required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. End Product Labeling When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text:
Contains FCC ID: XMR202112UC200AGL The FCC ID can be used only when all FCC compliance requirements are met. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
UC200A-GL_Hardware_Design 78 / 79 UMTS/HSPA+ Module Series
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving
- Increase the separation between the equipment antenna. and receiver. connected.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is
- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation,maximum antenna gain (including cable loss)must not exceed:
GSM850/WCDMA Band5/: 7dBi GSM1900/WCDMA Band2: 3dBi Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. UC200A-GL_Hardware_Design 79 / 79
| 1 | Label | ID Label/Location Info | 190.82 KiB | December 03 2021 |
QUEL FEE UC200A-GL 1-A000K UC200AGLAA-NO6-SNNSA Ob ae einen 7, FCC ID: XMR202112UC200AGL | JR coe a SN:MPA1 7L81AXXXXX1 "
IMEI: 86718403XXXXXXO
| 1 | Conf Letter | Cover Letter(s) | 110.29 KiB | December 03 2021 |
Quectel Wireless Solutions Company Limited Date: 2021-11-18 Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: XMR202112UC200AGL Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:
Block Diagram Schematics Operational Description Part Lists and Tune-up information The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely,
Grantee Contacts Signature Quectel Wireless Solutions Company Limited Jean Hu
| 1 | Declaration of authorization | Cover Letter(s) | 90.73 KiB | December 03 2021 |
Quectel Wireless Solutions Company Limited Declaration of Authorization We Name: Quectel Wireless Solutions Company Limited Address: Building 5, Shanghai Business Park PhaseIII, (Area B), No.1016 Tianlin Road, Minhang District, Shanghai China, 200233 Declare that:
Name Representative of agent: Ms. Riley Wei Agent Company name: BTL Inc. Address: No. 29, Jintang Road, Tangzhen Industry Park Pudong New Area City: Shanghai Country: China is authorized to apply for Certification of the following product(s) and signing all the related documents including 731 forms:
Product description: UMTS/HSPA+ Module Type designation: UC200A-GL Trademark: Quectel FCC ID: XMR202112UC200AGL on our behalf. Date: 2021-11-18 City: Shanghai Name: Jean Hu Function: Certification Section Signature:
| 1 | FCC Modular Approval Request | Cover Letter(s) | 180.50 KiB | December 03 2021 |
Quectel Wireless Solutions Company Limited FCC Modular Approval Statement Receiver Federal Communication Commission Equipment Authorization Devision, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Subject:
Modular Approval Statement Date: 2021-11-18 FCC Certification Number: XMR202112UC200AGL Model Name/Number: UMTS/HSPA+ Module / UC200A-GL TO WHOM IT MAY CONCERN Pursuant to Paragraphs CFR 15.212, we herewith declare for our module. Modular approval requirement Yes No *
(a) The radio elements must have the radio frequency circuitry be shielded. Physical/discrete and tuning capacitors may be located external to the shield, but must be on the module assembly.
*Please provide a detailed explanation if the answer is No.:
(b) The module shall have buffered modulation/data input(s) (if such inputs are provided) to ensure that the module will comply with the requirements set out in the applicable standard under conditions of excessive data rates or over-
modulation.
*Please provide a detailed explanation if the answer is No.:
(c) The module shall have its own power supply regulation on the module. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host device which houses the module.
*Please provide a detailed explanation if the answer is No.:
(d) The module shall comply with the provisions for external power amplifiers and antennas detailed in this standard. The equipment certification submission shall contain a detailed description of the configuration of all antennas that will be used with the module.
*Please provide a detailed explanation if the answer is No.:
(e) The module shall be tested for compliance with the applicable standard in a stand-alone configuration, i.e. the module must not be inside another device during testing.
*Please provide a detailed explanation if the answer is No.:
(f) The module shall comply with the Category I equipment requirements and CFR 15.212(a)(1)(vi).
*Please provide a detailed explanation if the answer is No.:
1 Yes Yes Yes Yes Yes labeling Yes Quectel Wireless Solutions Company Limited FCC Modular Approval Statement
(g) The module shall comply with applicable RSS-102 exposure requirements and any applicable FCC RF exposure requirement which are based on the intended use/configurations.
*Please provide a detailed explanation if the answer is No.:
(i) The modular transmitter complies with all applicable FCC rules. Instructions for maintaining compliance are given in the user instructions. If you have any questions, please feel free to contact us at the address shown below Best Regards, Yes Yes ___________________
(Signed) Name / Title: Jean Hu / Certification Section 2
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2021-12-03 | 1852.4 ~ 1907.6 | PCB - PCS Licensed Transmitter | Original Equipment |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 | Effective |
2021-12-03
|
||||
| 1 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
| 1 | FCC Registration Number (FRN) |
0018988279
|
||||
| 1 | Physical Address |
Building 5, Shanghai Business Park PhaseIII (Area B),No.1016 Tianlin Road, Minhang District
|
||||
| 1 |
Building 5, Shanghai Business Park PhaseIII
|
|||||
| 1 |
Shanghai, N/A
|
|||||
| 1 |
China
|
|||||
| app s | TCB Information | |||||
| 1 | TCB Application Email Address |
T******@TIMCOENGR.COM
|
||||
| 1 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
| app s | FCC ID | |||||
| 1 | Grantee Code |
XMR
|
||||
| 1 | Equipment Product Code |
202112UC200AGL
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 | Name |
J****** H****
|
||||
| 1 | Telephone Number |
+8602******** Extension:
|
||||
| 1 | Fax Number |
+8621********
|
||||
| 1 |
j******@quectel.com
|
|||||
| app s | Technical Contact | |||||
| n/a | ||||||
| app s | Non Technical Contact | |||||
| n/a | ||||||
| app s | Confidentiality (long or short term) | |||||
| 1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
| 1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | UMTS/HSPA+ Module | ||||
| 1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 | Modular Equipment Type | Single Modular Approval | ||||
| 1 | Purpose / Application is for | Original Equipment | ||||
| 1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
| 1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 | Grant Comments | Output Power is EIRP and ERP for above and below 1 GHz, respectively. Single Modular Approval for mobile RF Exposure condition. The module antenna must be installed to meet the RF exposure compliance separation distance of 20 cm, and is limited to 7 dBi gain (GSM 850/WDCMA Band V) and 3dBi (GSM 1900/WCDAM Band II), as described in this filing. Integration not consistent with these conditions will entail additional testing and authorization process. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. Approved for OEM integration only. The grantee must provide OEM integrators with installation and operating instructions for satisfying FCC multi-transmitter product guidelines. This grant is valid only when the device is sold to OEM integrators. | ||||
| 1 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 | Firm Name |
BTL INC.
|
||||
| 1 | Name |
S****** H****
|
||||
| 1 | Telephone Number |
+86-7******** Extension:
|
||||
| 1 |
S******@newbtl.com
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 22H | 824.2 | 848.8 | 1.7378 | 6.76 Hz | 248KGXW | ||||||||||||||||||||||||||||||||||
| 1 | 2 | 22H | 824.2 | 848.8 | 0.5768 | 6.76 Hz | 244KG7W | ||||||||||||||||||||||||||||||||||
| 1 | 3 | 22H | 826.4 | 846.6 | 0.2203 | 5.12 Hz | 4M17F9W | ||||||||||||||||||||||||||||||||||
| 1 | 4 | 24E | 1850.2 | 1909.8 | 1.0889 | 6.7 Hz | 246KGXW | ||||||||||||||||||||||||||||||||||
| 1 | 5 | 24E | 1850.2 | 1909.8 | 0.4634 | 6.7 Hz | 243KG7W | ||||||||||||||||||||||||||||||||||
| 1 | 6 | 24E | 1852.4 | 1907.6 | 0.2084 | 5.86 Hz | 4M16F9W | ||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC