FCC ID: XMR2023FCU760C Wi-Fi 6 Module

FCU760C Hardware Design Wi-Fi Module Series Version: 1.0.0 Date: 2023-02-14 Status: Preliminary Wi-Fi Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FCU760C_Hardware_Design 1 / 38 Wi-Fi Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. FCU760C_Hardware_Design 2 / 38 Wi-Fi Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FCU760C_Hardware_Design 3 / 38 Wi-Fi Module Series About the Document Revision History Version Date Author Description

2023-02-14 Devin YU Creation of the document 1.0.0 2023-02-14 Devin YU Preliminary FCU760C_Hardware_Design 4 / 38 Wi-Fi Module Series Contents Safety Information ........................................................................................................................................3 About the Document ....................................................................................................................................4 Contents ........................................................................................................................................................ 5 Table Index ....................................................................................................................................................7 Figure Index .................................................................................................................................................. 8 1 2 3 4 5 Introduction ........................................................................................................................................... 9 Product Overview ............................................................................................................................... 10 2.1. General Description ................................................................................................................... 10 Key Features ..............................................................................................................................10 2.2. Functional Diagram ....................................................................................................................11 2.3. RF Performances ................................................................................................................................ 12 3.1. Wi-Fi Performances ................................................................................................................... 12 Application Interfaces ........................................................................................................................ 15 Pin Assignment .......................................................................................................................... 15 4.1. Pin Description ...........................................................................................................................16 4.2. 4.3. Power Supply .............................................................................................................................17 4.4. USB Interface .............................................................................................................................17 4.5. RF Antenna Interfaces ...............................................................................................................18 ANT_WIFI Antenna ........................................................................................................ 18 Reference Design ...........................................................................................................19 RF Routing Guidelines ................................................................................................... 19 Coaxial RF Connector (Optional) ...................................................................................21 Receptacle Specifications ................................................................................... 21 RF Connector Installation ....................................................................................22 4.5.1. 4.5.2. 4.5.3. 4.5.1. 4.5.1.1. 4.5.1.2. Electrical Characteristics & Reliability ............................................................................................ 24 Absolute Maximum Ratings .......................................................................................................24 5.1. Power Supply Ratings ............................................................................................................... 24 5.2. ESD Protection .......................................................................................................................... 25 5.3. Thermal Dissipation ................................................................................................................... 25 5.4. 6 Mechanical Information ..................................................................................................................... 27 6.1. Mechanical Dimensions .............................................................................................................27 6.2. Recommended Footprint ........................................................................................................... 29 Top and Bottom Views .............................................................................................................. 30 6.3. 7 Storage, Manufacturing & Packaging .............................................................................................. 31 7.1. Storage Conditions .................................................................................................................... 31 7.2. Manufacturing and Soldering .................................................................................................... 32 Packaging Specifications ...........................................................................................................34 7.3. Carrier Tape ................................................................................................................... 34 7.3.1. FCU760C_Hardware_Design 5 / 38 Wi-Fi Module Series Plastic Reel .....................................................................................................................35 7.3.2. 7.3.3. Mounting Direction ......................................................................................................... 35 Packaging Process .........................................................................................................36 7.3.4. 8 Appendix References ......................................................................................................................... 37 FCU760C_Hardware_Design 6 / 38 Wi-Fi Module Series Table Index Table 1: Key Features ................................................................................................................................. 10 Table 2: RF Performances ...........................................................................................................................12 Table 3: Power Consumption ...................................................................................................................... 13 Table 4: I/O Parameters Definition .............................................................................................................. 16 Table 5: Pin Description ...............................................................................................................................16 Table 6: Antenna Design Requirements ..................................................................................................... 18 Table 7: Absolute Maximum Ratings (Unit: V) ............................................................................................ 24 Table 8: Module Power Supply Ratings (Unit: V) ........................................................................................24 Table 9: Electrostatics Discharge Characteristics (Unit: kV) ...................................................................... 25 Table 10: Recommended Thermal Profile Parameters .............................................................................. 33 Table 11: Carrier Tape Dimension Table (Unit: mm) ..................................................................................34 Table 12: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 35 Table 13: Related Documents ..................................................................................................................... 37 Table 14: Terms and Abbreviations ............................................................................................................ 37 FCU760C_Hardware_Design 7 / 38 Wi-Fi Module Series Figure Index Figure 1: Functional Diagram ...................................................................................................................... 11 Figure 2: Pin Assignment (Top View) ..........................................................................................................15 Figure 3: Reference Circuit of Power Supply ..............................................................................................17 Figure 4: USB Interface Connection ............................................................................................................17 Figure 5: Reference Circuit for RF Antenna Interface ................................................................................ 19 Figure 6: Microstrip Design on a 2-layer PCB .............................................................................................19 Figure 7: Coplanar Waveguide Design on a 2-layer PCB .......................................................................... 20 Figure 8: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ...................... 20 Figure 9: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ...................... 20 Figure 10: Dimensions of the Receptacle (Unit: mm) ................................................................................. 21 Figure 11: Specifications of Mated Plugs ....................................................................................................22 Figure 12: Space Factor of Mated Connectors (Unit: mm) .........................................................................23 Figure 13: Placement and Fixing of the Heatsink ....................................................................................... 26 Figure 14: Top and Side Dimensions .......................................................................................................... 27 Figure 15: Bottom Dimension (Bottom View) ..............................................................................................28 Figure 16: Recommended Footprint ............................................................................................................29 Figure 17: Top and Bottom Views ............................................................................................................... 30 Figure 18: Recommended Reflow Soldering Thermal Profile .................................................................... 32 Figure 19: Carrier Tape Dimension Drawing .............................................................................................. 34 Figure 20: Plastic Reel Dimension Drawing ................................................................................................35 Figure 21: Mounting Direction ..................................................................................................................... 35 Figure 22: Packaging Process .....................................................................................................................36 FCU760C_Hardware_Design 8 / 38 Wi-Fi Module Series 1 Introduction This document defines the FCU760C and describes its air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. FCU760C_Hardware_Design 9 / 38 Wi-Fi Module Series 2 Product Overview 2.1. General Description FCU760C is a high-performance IEEE 802.11 b/g/n/ax Wi-Fi module supporting 2.4 GHz band and 1T1R. It supports USB 2.0 interface for Wi-Fi functions. It is an SMD module with compact packaging. Related information is listed in the table below:

LCC 6

(13.0 0.15) mm (12.2 0.15) mm (1.9 0.2) mm Approx. 0.6 g Table 1: Basic Information FCU760C Packaging type Pin counts Dimensions Weight 2.2. Key Features Table 1: Key Features Basic Information Protocol and Standard Power Supply Wi-Fi protocols: IEEE 802.11b/g/n/ax All hardware components are fully compliant with EU RoHS directive VBAT Power Supply:

2.13.46 V Typ.: 3.3 V FCU760C_Hardware_Design 10 / 38 Wi-Fi Module Series Temperature Ranges Operating temperature 1: -20 to +70 C Storage temperature: -40 to +125 C EVB Kit FCU760C TE-A RF Antenna Interface Wi-Fi Antenna Interface ANT_WIFI Coaxial RF connector (optional) 50 impedance Hardware Interface Wi-Fi Application Interface USB 2.0 2.3. Functional Diagram Figure 1: Functional Diagram NOTE The module supports pin antenna (ANT_WIFI) by default; coaxial RF connector is optional. 1 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules indicators comply with IEEE specification requirements. FCU760C_Hardware_Design 11 / 38 Wi-Fi Module Series 3 RF Performances 3.1. Wi-Fi Performances Table 2: RF Performances Operating Frequency 2.4 GHz: 2.4122.484 GHz Modulation DSSS, OFDM, DBPSK, DQPSK, CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM Operating Mode AP STA Transmission Data Rate 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) 802.11ax: HE20 (MCS 09), HE40 (MCS 09) Condition EVM Unit: dBm, Tolerance: 2 dB Transmitting Power

@ Typ. Receiving Sensitivity

@ Typ. 2.4 GHz 802.11b @ 1 Mbps 802.11b @ 11 Mbps

-9 dB 802.11g @ 6 Mbps

-5 dB 802.11g @ 54 Mbps

-25 dB 802.11n, HT20 @ MCS 0

-5 dB 802.11n, HT20 @ MCS 7

-27 dB 18 18 18 15 18 15

-96

-87

-91

-73

-91

-72 FCU760C_Hardware_Design 12 / 38 Wi-Fi Module Series 802.11n, HT40 @ MCS 0

-5 dB 802.11n, HT40 @ MCS 7

-27 dB 802.11ax, HE20 @ MCS 0 -5 dB 802.11ax, HE20 @ MCS 9 -32 dB 802.11ax, HE40 @ MCS 0 -5 dB 802.11ax, HE40 @ MCS 9 -32 dB 18 15 18 12 17 12

-86

-68

-91

-68

-88

-65 Table 3: Power Consumption Protocol Condition IVBAT Unit 802.11b 802.11g 802.11n, HT20 802.11n, HT40 Tx @ 1 Mbps Tx @ 11 Mbps Rx @ 1 Mbps Rx @ 11 Mbps Tx @ 6 Mbps Tx @ 54 Mbps Rx @ 6 bps Rx @ 54 Mbps Tx @ MCS 0 Tx @ MCS 7 Rx @ MCS 0 Rx @ MCS 7 Tx @ MCS 0 Tx @ MCS 7 Rx @ MCS 0 Rx @ MCS 7 802.11ax, HE20 Tx @ MCS 0 294 265 103 103 268 177 103 103 296 223 103 103 287 199 103 103 294 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA FCU760C_Hardware_Design 13 / 38 Tx @ MCS 9 Rx @ MCS 0 Rx @ MCS 9 Tx @ MCS 0 Tx @ MCS 9 Rx @ MCS 0 Rx @ MCS 9 802.11ax, HE40 Wi-Fi Module Series mA mA mA mA mA mA mA 234 103 103 287 207 103 103 FCU760C_Hardware_Design 14 / 38 Wi-Fi Module Series 4 Application Interfaces 4.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE All GND pins should be connected to ground. FCU760C_Hardware_Design 15 / 38 Wi-Fi Module Series 4.2. Pin Description Table 4: I/O Parameters Definition Type AIO PI Description Analog Input/Output Power Input DC characteristics include power domain and rate current. Table 5: Pin Description Power Supply Pin Name Pin No. I/O Description VBAT 3 PI Power supply for the module DC Characteristics Vmin = 2.1 V Vnom = 3.3 V Vmax = 3.46 V Comment It must be provided with sufficient current more than 0.6 A. GND 1, 6 Wi-Fi Application Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_DM USB_DP 4 5 AIO USB differential data (-) AIO USB differential data (+) Requires differential impedance of 90 . USB 2.0 compliant. Test points must be reserved. RF Antenna Interface Pin Name Pin No. I/O Description DC Characteristics Comment ANT_WIFI 2 AIO Wi-Fi antenna interface 50 impedance. FCU760C_Hardware_Design 16 / 38 4.3. Power Supply Wi-Fi Module Series The module is powered by VBAT. It is recommended to use a 3.3 V power supply chip with sufficient more than 0.6 A. For better power supply performance, it is recommended to parallel a 47 F decoupling capacitor, and 1 F and 100 nF filter capacitors near the modules VBAT pin. is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be. In addition, it VBAT reference circuit is shown below:

Figure 3: Reference Circuit of Power Supply 4.4. USB Interface The module provides one USB interface which complies with the USB 2.0 specifications. It supports high-speed (480 Mbps) mode and is backward-compatible with full-speed (12 Mbps) and low-speed

(1.5 Mbps) modes. The following figure shows the USB interface connection between the module and the host. Figure 4: USB Interface Connection FCU760C_Hardware_Design 17 / 38 Wi-Fi Module Series The following principles should be complied with when design the USB interface, to meet USB 2.0 specifications. Route the USB signal traces as differential pairs with ground surrounded. The differential impedance of USB 2.0 is 90 10 %. For USB 2.0 signal traces, the differential data pair matching should be less than 1 mm. Do not route signal traces under crystals, oscillators, magnetic devices, sensitive circuits/signals, such as RF circuits and analog signals, as well as noisy signals such as clock signals and DC-DC signals. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Junction capacitance of the ESD protection components might cause influences on USB data lines, so you should pay attention to the selection of the device. Typically, the stray capacitance should be less than 2.0 pF for USB 2.0. If possible, reserve a 0 resistor on USB_DP and USB_DM lines respectively. For more details about the USB 2.0 specifications, visit http://www.usb.org/home. 4.5. RF Antenna Interfaces The module supports ANT_WIFI antenna (stamp hole) by default and coaxial RF connector which is optional. The coaxial RF connector is not mounted on the module when using ANT_WIFI/BT antenna. Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. 4.5.1. ANT_WIFI Antenna Table 6: Antenna Design Requirements Parameter Requirement 2 Frequency Ranges (GHz) 2.4 GHz Wi-Fi: 2.4122.484 Cable Insertion Loss (dB) VSWR Gain (dBi)

< 1 2 1 (Typ) Max Input Power (W) 50 2 For more details about the RF performances, see Chapter 3. FCU760C_Hardware_Design 18 / 38 Wi-Fi Module Series Input Impedance () 50 Polarization Type Vertical 4.5.2. Reference Design A reference circuit for the RF antenna interface is shown below. It is recommended to reserve LC and a

-type matching circuit for better RF performance. Matching components (R1, C1, C2, C3 and L1) shall be placed as close to the antenna as possible. Capacitors C1, C2 and C3, and inductance L1 are not mounted by default. Figure 5: Reference Circuit for RF Antenna Interface 4.5.3. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 6: Microstrip Design on a 2-layer PCB FCU760C_Hardware_Design 19 / 38 Wi-Fi Module Series Figure 7: Coplanar Waveguide Design on a 2-layer PCB Figure 8: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 9: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to FCU760C_Hardware_Design 20 / 38 Wi-Fi Module Series 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [1]. 4.5.1. Coaxial RF Connector (Optional) 4.5.1.1. Receptacle Specifications If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 10: Dimensions of the Receptacle (Unit: mm) FCU760C_Hardware_Design 21 / 38 Wi-Fi Module Series Table 2: Major Specifications of the Receptacle Item Specification Nominal Frequency Range DC to 6 GHz Nominal Impedance 50 Temperature Rating

-40 C to +85 C Voltage Standing Wave Ratio (VSWR) Meet the requirements of:

Max. 1.3 (DC3 GHz) Max. 1.45 (36 GHz) 4.5.1.2. RF Connector Installation U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 11: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. FCU760C_Hardware_Design 22 / 38 Wi-Fi Module Series Figure 12: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FCU760C_Hardware_Design 23 / 38 Wi-Fi Module Series 5 Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 7: Absolute Maximum Ratings (Unit: V) Parameter VBAT Min.

-0.3 Max. 3.6 5.2. Power Supply Ratings Table 8: Module Power Supply Ratings (Unit: V) Parameter VBAT Min. 2.1 Typ. 3.3 Max. 3.46 FCU760C_Hardware_Design 24 / 38 Wi-Fi Module Series 5.3. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 9: Electrostatics Discharge Characteristics (Unit: kV) Model Test Result Standard Human Body Model (HBM) 2 JEDEC EIA/JESD22-A114 5.4. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:

Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation. Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

Choose the heatsink with adequate fins to dissipate heat;

Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. FCU760C_Hardware_Design 25 / 38 Wi-Fi Module Series Figure 13: Placement and Fixing of the Heatsink FCU760C_Hardware_Design 26 / 38 Wi-Fi Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 14: Top and Side Dimensions FCU760C_Hardware_Design 27 / 38 Wi-Fi Module Series Figure 15: Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FCU760C_Hardware_Design 28 / 38 6.2. Recommended Footprint Wi-Fi Module Series Figure 16: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCU760C_Hardware_Design 29 / 38 6.3. Top and Bottom Views Wi-Fi Module Series Figure 17: Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCU760C_Hardware_Design 30 / 38 Wi-Fi Module Series 7 Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. FCU760C_Hardware_Design 31 / 38 Wi-Fi Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [2]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute is maximum reflow temperature. To avoid damage to the module caused by repeated heating, recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. it Figure 18: Recommended Reflow Soldering Thermal Profile FCU760C_Hardware_Design 32 / 38 Wi-Fi Module Series Table 10: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2]. FCU760C_Hardware_Design 33 / 38 Wi-Fi Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape Dimension details are as follow:

Figure 19: Carrier Tape Dimension Drawing Table 11: Carrier Tape Dimension Table (Unit: mm) W 32 P 20 T 0.4 A0 B0 K0 12.6 13.4 2.55 K1 5.9 F E 14.2 1.75 FCU760C_Hardware_Design 34 / 38 7.3.2. Plastic Reel Wi-Fi Module Series Figure 20: Plastic Reel Dimension Drawing Table 12: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 32.5 7.3.3. Mounting Direction Figure 21: Mounting Direction FCU760C_Hardware_Design 35 / 38 7.3.4. Packaging Process Wi-Fi Module Series Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 22: Packaging Process FCU760C_Hardware_Design 36 / 38 Wi-Fi Module Series 8 Appendix References Table 13: Related Documents Document Name

[1] Quectel_RF_Layout_Application_Note

[2] Quectel_Module_SMT_Application_Note Table 14: Terms and Abbreviations Abbreviation Description 1T1R AP BPSK CCK DBPSK DQPSK DSSS ESD EVM GND HE HBM HT IEEE One Transmit One Receive Access Point Binary Phase Shift Keying Complementary Code Keying Differential Binary Phase Shift Keying Differential Quadrature Phase Shift Keying Direct Sequence Spread Spectrum Electrostatic Discharge Error Vector Magnitude Ground High Efficiency Human Body Model High Throughput Institute of Electrical and Electronics Engineers FCU760C_Hardware_Design 37 / 38 Wi-Fi Module Series LC Mbps MCS PCB PMIC QAM QPSK RF RoHS SMT STA TVS USB Vmax Vmin Vnom VSWR Wi-Fi Inductance and Capacitance Million Bits Per Second Modulation and Coding Scheme Printed Circuit Board Power Management IC Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Surface Mount Technology Station Transient Voltage Suppressor Universal Serial Bus Maximum Voltage Minimum Voltage Nominal Voltage Voltage Standing Wave Ratio Wireless Fidelity The device could be used with a separation distance of 20cm to the human body. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID:

XMR2023FCU760C FCU760C_Hardware_Design 38 / 38 4.This module must not transmit simultaneously with any other antenna or transmitter 5.The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2023FCU760C or Contains FCC ID: XMR2023FCU760C must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: March 6, 2023 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID: XMR2023FCU760C

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincerely, Name:

Email:

Jean hu .. (2) jean.hu@quectel.com. Signature:

. Rev 1/26/2023 Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: March 6, 2023 Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing FCC ID: XMR2023FCU760C

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincerely, Name:

Email:

Jean hu .. (2) jean.hu@quectel.com. Signature:

. Rev 1/26/2023

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Date: March 6, 2023 Federal Communications Commission Office of Engineering and Technology Laboratory Division 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Request for Confidentiality FCC ID: XMR2023FCU760C To Whom It May Concern, Pursuant to the provisions of Sections 0.457 and 0.459 of Commissions rules (47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure indefinitely. Schematic Diagram Block Diagram Part List Operational Description Tune-up Procedure Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In additional to above mentioned documents, pursuant to Public Notice DA 04-1705 of the Commission s policy, in order to comply with the marketing regulations in 47 CFT 2.803 and the importation rules in 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. External Photos Internal Photos Test Setup Photos User Manual It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Best Regards, _ Jean hu jean.hu@quectel.com

RF_734_02 04 April 16 Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR2023FCU760C Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. 3. The modular transmitter must have its own power supply regulation. 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Answer from applicant Yes, please see exhibition external photos Yes, The modular has buffer modulation /data inputs Yes, please see the schem.pdf Yes, The requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, Please refer to the setup photo exhibition for the stand-alone configuration Yes, The Module will be label with its own FCC ID ,and the instruction on the labelling rule of the end product has been stated in the user manual of this module .please refer to the label and user manual exhibition. Yes, The required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, Please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):_ Signature:

Date:

City:

Name:

Email:

2023/3/6 .. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature:

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: Wi-Fi 6 Module Type designation: FCU760C Trademark:

Quectel on our behalf. Date:

City:

Name:

Email:

2023/3/6 .. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature:

. Notes:

(1) : Required for FCC application

(2) : For FCC it must be the Grantee Code owner or the authorized agent.