FCC ID: XMR202207FC800L Wi-Fi&Bluetooth Module

FC800L Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.3 Date: 2022-08-22 Status: Preliminary Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. FC800L_Hardware_Design 1 / 50 Wi-Fi&Bluetooth Module Series Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. FC800L_Hardware_Design 2 / 50 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FC800L_Hardware_Design 3 / 50 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description

2021-11-08 Macky XU Creation of the document 1.0.0 2021-11-08 Macky XU Preliminary 1.0.1 2022-04-13 Arrow HUANG Preliminary:

1. Updated operating temperature. 1.0.2 2022-04-27 Arrow HUANG 1.0.3 2022-08-22 Arrow HUANG Preliminary:

1. Updated operating mode (Table 2, Table 29) Preliminary:

1. Update RF characteristics. 2. Update power consumption. 3. Updated WLAN_WAKE pin description and added SDIO interrupt description. 4. Updated evaluation board description and module weights. 5. Added chapter "3.8. RF Antenna Interfaces"

FC800L_Hardware_Design 4 / 50 Wi-Fi&Bluetooth Module Series Contents Safety Information .................................................................................................................................... 3 About the Document ................................................................................................................................ 4 Contents .................................................................................................................................................... 5 Table Index ............................................................................................................................................... 7 Figure Index .............................................................................................................................................. 8 1 Introduction ....................................................................................................................................... 9 1.1. Special Mark ........................................................................................................................... 14 2 Product Overview ............................................................................................................................ 15 2.1. General Description ................................................................................................................ 15 2.2. Key Features .......................................................................................................................... 15 2.3. EVB ........................................................................................................................................ 17 3 Application Interfaces ..................................................................................................................... 18 3.1. General Description ................................................................................................................ 18 3.2. Pin Assignment ...................................................................................................................... 19 3.3. Pin Description ....................................................................................................................... 20 3.4. Power Supply ......................................................................................................................... 22 3.5. WLAN Application Interface .................................................................................................... 23 3.5.1. WLAN_WAKE ............................................................................................................. 24 3.5.2. SDIO Interface ............................................................................................................. 24 3.6. Bluetooth Application Interface ............................................................................................... 25 3.6.1. BT_EN ......................................................................................................................... 26 3.6.2. UART Interface ............................................................................................................ 26 3.6.3. BT_WAKE_HOST* and HOST_WAKE_BT* ................................................................ 27 3.6.4. PCM Interface* ............................................................................................................ 27 3.7. Other Interfaces ...................................................................................................................... 28 3.7.1. RTC_CLK .................................................................................................................... 28 3.7.2. CHIP_EN ..................................................................................................................... 29 3.8. RF Antenna Interfaces ............................................................................................................ 30 3.8.1. Operating Frequency ................................................................................................... 30 3.8.2. Pin Definition of RF Antenna Interface ........................................................................ 30 3.8.3. Reference Design of RF Antenna Interfaces ............................................................... 30 3.8.4. Reference Design of RF Layout .................................................................................. 32 3.8.5. Antenna Requirements ................................................................................................ 33 3.8.6. Recommended RF Connector for Antenna Installation ............................................... 34 4 Reliability, Radio and Electrical Characteristic ............................................................................ 36 4.1. General Description ................................................................................................................ 36 4.2. Electrical Characteristics ........................................................................................................ 36 FC800L_Hardware_Design 5 / 50 Wi-Fi&Bluetooth Module Series I/O Interface Characteristics ................................................................................................... 37 4.3. 4.4. Current Consumption ............................................................................................................. 38 4.5. RF Performances ................................................................................................................... 40 4.5.1. Wi-Fi Performance ...................................................................................................... 40 4.5.2. Bluetooth Performance ................................................................................................ 42 4.6. Electrostatic Discharge ........................................................................................................... 43 5 Mechanical Information .................................................................................................................. 44 5.1. Mechanical Dimensions .......................................................................................................... 44 5.2. Recommended Footprint ........................................................................................................ 45 5.3. Top and Bottom Views ........................................................................................................... 46 6 Storage, Manufacturing and Packaging ........................................................................................ 47 6.1. Storage Conditions ................................................................................................................. 47 6.2. Manufacturing and Soldering .................................................................................................. 48 6.3. Packaging Specifications ........................................................................................................ 50 6.3.1. Carrier Tape ................................................................................................................ 50 6.3.2. Plastic Reel ................................................................................................................. 51 6.3.3. Packaging Process ...................................................................................................... 52 7 Appendix References ..................................................................................................................... 53 FC800L_Hardware_Design 6 / 50 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark .............................................................................................................................. 14 Table 2: Key Features ............................................................................................................................. 15 Table 3: I/O Parameters Definition .......................................................................................................... 20 Table 4: Pin Description .......................................................................................................................... 20 Table 5: Definition of Power Supply and GND Pins ................................................................................. 22 Table 6: Pin Definition of WLAN_WAKE ................................................................................................. 24 Table 7: Pin Definition of SDIO Interface ................................................................................................. 24 Table 8: Pin Definition of BT_EN ............................................................................................................. 26 Table 9: Pin Definition of UART Interface ................................................................................................ 26 Table 10: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT .......................................... 27 Table 11: Pin Definition of PCM Interface ............................................................................................... 28 Table 12: Pin Definition of RTC_CLK ...................................................................................................... 28 Table 13: Pin Definition of CHIP_EN ....................................................................................................... 29 Table 14: Conducted RF Output Power at 2.4 GHz ................................................................................ 40 Table 15: Conducted RF Output Power at 5 GHz ................................................................................... 40 Table 16: Conducted RF Receiving Sensitivity at 2.4 GHz ..................................................................... 41 Table 17: Conducted RF Receiving Sensitivity at 5 GHz ........................................................................ 41 Table 18: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity; Unit: kV) ................ 43 Table 19: Recommended Thermal Profile Parameters ........................................................................... 49 Table 20: Carrier Tape Dimension Table (Unit: mm) ............................................................................... 50 Table 21: Plastic Reel Dimension Table (Unit: mm) ................................................................................ 51 Table 22: Related Documents ................................................................................................................. 53 Table 23: Terms and Abbreviations ......................................................................................................... 53 FC800L_Hardware_Design 7 / 50 Wi-Fi&Bluetooth Module Series Figure Index Figure 2: Pin Assignment (Top View) ...................................................................................................... 19 Figure 3: Power up Timing ...................................................................................................................... 23 Figure 4: WLAN Application Interface Connection .................................................................................. 23 Figure 5: SDIO Interface Connection ...................................................................................................... 25 Figure 6: Block Diagram of Bluetooth Application Interface Connection ................................................. 26 Figure 7: Reference Design for UART Interface Connection ................................................................... 27 Figure 8: PCM Interface Connection ....................................................................................................... 28 Figure 9: Reference Circuit for RF Antenna Interfaces ............................................................................ 31 Figure 10: Microstrip Design on a 2-layer PCB ....................................................................................... 32 Figure 11: Coplanar Waveguide Design on a 2-layer PCB ..................................................................... 32 Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 32 Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 33 Figure 14: Dimensions of the U.FL-R-SMT Connector (Unit: mm) .......................................................... 34 Figure 15: Mechanicals of UF.L-LP Connectors (Unit: mm) .................................................................... 35 Figure 16: Space Factor of Mated Connector (Unit: mm) ........................................................................ 35 Figure 17: Top and Side Dimensions (Top and Side View) ..................................................................... 44 Figure 18: Recommended Footprint (Top View)...................................................................................... 45 Figure 19: Top and Bottom Views of the Module ..................................................................................... 46 Figure 20: Recommended Reflow Soldering Thermal Profile .................................................................. 48 Figure 21: Carrier Tape Dimension Drawing ........................................................................................... 50 Figure 22: Plastic Reel Dimension Drawing ............................................................................................ 51 Figure 23: Packaging Process................................................................................................................. 52 FC800L_Hardware_Design 8 / 50 Wi-Fi&Bluetooth Module Series 1 Introduction This document defines the FC800L and describes its air interfaces and hardware interfaces which are connected with your application. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-- Reorient or relocate the receiving antenna.

-- Increase the separation between the equipment and receiver.

-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-- Consult the dealer or an experienced radio/TV technician for help. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band FC800L_Hardware_Design 9 / 50 Wi-Fi&Bluetooth Module Series emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR202207FC800L The FCC ID can be used only when all FCC compliance requirements are met. Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

(4) The max allowed antenna gain is WIFI 2.4G/BT 0.52dBi; WIFI 5G 0.66 dBi for external antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device complies with ISEDs licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d ISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et (2) ce dispositif doit accepter tout brouillage reu, y compris un brouillage susceptible de provoquer un fonctionnement indsirable. FC800L_Hardware_Design 10 / 50 Wi-Fi&Bluetooth Module Series Radiation Exposure Statement:

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co- location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling FC800L_Hardware_Design 11 / 50 Wi-Fi&Bluetooth Module Series This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following:

Contains IC: 10224A-2022FC800L. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-2022FC800L ". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz) The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. FC800L_Hardware_Design 12 / 50 Wi-Fi&Bluetooth Module Series Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology. Caution:

i) The device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

ii) where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated. L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations transmettre ou de panne oprationnelle. Notez que ceci n'est pas destin interdire la transmission d'informations de contrle ou de signalisation ou l'utilisation de codes rptitifs lorsque cela est requis par la technologie. Avertissement:

i) Le dispositif utilis dans la bande 5150-5250 MHz est rserv une utilisation en intrieur afin de rduire le risque de brouillage prjudiciable aux systmes mobiles par satellite dans le mme canal;

ii) lorsquil y a lieu, les types dantennes (sil y en a plusieurs), les numros de modle de lantenne et les pires angles dinclinaison ncessaires pour rester conforme lexigence de la p.i.r.e. applicable au masque dlvation, nonce la section 6.2.2.3, doivent tre clairement indiqus. i. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;

FC800L_Hardware_Design 13 / 50 Wi-Fi&Bluetooth Module Series and iii. where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated. 1.1. Special Mark Table 1: Special Mark Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. FC800L_Hardware_Design 14 / 50 Wi-Fi&Bluetooth Module Series 2 Product Overview 2.1. General Description FC800L is a Wi-Fi and Bluetooth module with low power consumption. It is a single-die WLAN (Wireless Local Area Network) and Bluetooth combo solution supporting IEEE 802.11a/b/g/n/ac 2.4/5 GHz WLAN standards and Bluetooth 5.0 standard, which enables seamless integration of WLAN and Bluetooth low energy technologies. With a low-power SDIO 3.0 interface for WLAN, a UART and a PCM interface for Bluetooth. FC800L can provide WLAN and Bluetooth functions. 2.2. Key Features The following table describes the key features of FC800L. Table 2: Key Features Features Details Power Supply Operating Frequency VBAT power supply:

Supply voltage range: 2.973.63 V Typical supply voltage: 3.3 V VDDIO power supply:

Supply voltage range: 1.621.98 V Typical supply voltage: 1.8 V 2.4 GHz WLAN: 2.4002.4835 GHz 5 GHz WLAN: 5.155.85 GHz Bluetooth: 2.4022.480 GHz 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, Transmission Data Rates 48 Mbps, 54 Mbps 802.11n: HT20 (MCS0-7), HT40 (MCS0-7) 802.11ac: VHT20 (MCS0-8), VHT40 (MCS0-9), VHT80 (MCS0-9) FC800L_Hardware_Design 15 / 50 Wi-Fi&Bluetooth Module Series Transmitting Power 2.4 GHz 802.11b/11 Mbps16.0 2 dBm 802.11g/54 Mbps15.0 2 dBm 802.11n/HT20 MCS714 2 dBm 802.11n/HT40 MCS714 2 dBm 5 GHz 802.11a/54 Mbps15 3 dBm 802.11n/HT20 MCS714 3 dBm 802.11n/HT40 MCS714 3 dBm 802.11ac/VHT20 MCS813 3 dBm 802.11ac/VHT40 MCS912 3 dBm 802.11ac/VHT80 MCS911 3 dBm Operation Mode STA Modulation CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM WLAN Application Interface Bluetooth Application Interface RF Antenna Interfaces SDIO 3.0 UART and PCM ANT_WIFI ANT_BT Physical Characteristics Size: (13 0.15) mm (15 0.15) mm (2.2 0.2) mm Package: LCC Weight: about 0.8g Temperature Range Operating temperature range: 0 C to +70 C 1 Storage temperature range: -40 C to +95 C RoHS All hardware components are fully compliant with EU RoHS directive 1 Within operating temperature range, the module is IEEE compliant. FC800L_Hardware_Design 16 / 50 Wi-Fi&Bluetooth Module Series 2.3. EVB Quectel supplies an evaluation board (FC800L-M.2) with accessories to control or test the module. FC800L_Hardware_Design 17 / 50 Wi-Fi&Bluetooth Module Series 3 Application Interfaces 3.1. General Description FC800L is equipped with 50 LCC pins. The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module:

Power supply WLAN application interface Bluetooth application interface RF antenna interfaces Other interfaces FC800L_Hardware_Design 18 / 50 Wi-Fi&Bluetooth Module Series 3.2. Pin Assignment Figure 1: Pin Assignment (Top View) NOTE Keep all RESERVED pins open. FC800L_Hardware_Design 19 / 50 GNDSDIO_DATA2RESERVEDCHIP_ENSDIO_DATA3SDIO_DATA0RESERVEDWLAN_WAKESDIO_CMDSDIO_CLKGNDGNDANT_WIFISDIO_DATA1GNDANT_BTGND4675891011231484749504645434244414039383714131216171920182122232425GNDGNDGNDGNDRESERVEDGNDRESERVEDRESERVED3331303229282726353436RESERVEDPCM_SYNCPCM_DINPCM_DOUTRTC_CLKPCM_CLKVBATGNDVDDIORESERVEDRESERVEDRESERVEDGNDBT_ENBT_TXDBT_RXDBT_RTSBT_CTSRESERVEDRESERVEDRESERVEDGNDRESERVEDHOST_WAKE_BTBT_WAKE_HOSTFC800LGND PowerWLANRESERVED BluetoothRFOther signals15 Wi-Fi&Bluetooth Module Series 3.3. Pin Description Table 3: I/O Parameters Definition Type AI AO AIO DI DO DIO PI PO Description Analog Input Analog Input Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input Power Output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description Comment VBAT VDDIO GND 36 34 PI PI Power supply for the module It must be provided with sufficient current up to 1.2 A. Power supply for modules I/O pins VDDIO only support 1.8 V 1, 38, 1011, 23, 32, 39, 47 WLAN Application Interface Pin Name Pin No. I/O Description Comment WLAN_WAKE 16 DO Wake up the host by WLAN, and SDIO interrupt function SDIO_CMD SDIO_CLK 17 18 DIO SDIO command DI SDIO clock VDDIO power domain FC800L_Hardware_Design 20 / 50 Wi-Fi&Bluetooth Module Series SDIO_DATA3 SDIO_DATA2 SDIO_DATA0 SDIO_DATA1 19 20 21 22 DIO SDIO data bit 3 DIO SDIO data bit 2 DIO SDIO data bit 0 DIO SDIO data bit 1 Bluetooth Application Interface Pin Name Pin No. I/O Description Comment PCM_SYNC*

PCM_DIN*

PCM_DOUT*

27 28 29 DI DI PCM data frame sync PCM data input DO PCM data output VDDIO power domain PCM_CLK*

30 DI PCM clock BT_EN 38 DI Bluetooth enable control Active high. VDDIO power domain BT_TXD 40 DO Bluetooth UART transmit BT_RXD 41 DI Bluetooth UART receive BT_RTS 42 DO BT_CTS 43 DI Bluetooth UART request to send Bluetooth UART clear to send VDDIO power domain HOST_WAKE_BT*

49 DI Host wakes up Bluetooth BT_WAKE_ HOST*

Other Interfaces 50 DO Bluetooth wakes up host Pin Name Pin No. I/O Description Comment FC800L_Hardware_Design 21 / 50 Wi-Fi&Bluetooth Module Series RTC_CLK 31 DI External 32.768 kHz clock input VDDIO power domain CHIP_EN 15 DI Module enable pin Pull up internally to VDDIO through a 4.7 k resistor, high level by default. VDDIO power domain RF Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_BT ANT_WIFI 2 9 RESERVED Interfaces AIO Bluetooth antenna interface AIO Wi-Fi antenna interface 50 impedance. Pin Name Pin No. I/O Description Comment RESERVED 1214, 2426, 33, 35, 37, 4446, 48 Keep these pins open. 3.4. Power Supply The following table shows the power supply pins and ground pins of FC800L. Table 5: Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT VDDIO 36 34 Power supply for the module 2.97 3.3 3.63 V Power supply for modules I/O pins 1.62 1.8 1.98 V GND 1, 38, 1011, 23, 32, 39, 47 FC800L is powered by VBAT and VDDIO, and VBAT is recommended to use a power supply chip with maximum output current more than 1.2 A. The following figure shows the recommended power up timing of FC800L. FC800L_Hardware_Design 22 / 50 Wi-Fi&Bluetooth Module Series Figure 2: Power up Timing NOTE 1. VBAT should be up before or at the same time as VDDIO. VDDIO should not be present first or be held high before VBAT is high. 2. RTC_CLK must held stable before CHIP_EN held high. 3.5. WLAN Application Interface The following figure shows the WLAN application interface connection between FC800L and the host. Figure 3: WLAN Application Interface Connection FC800L_Hardware_Design 23 / 50 VBATVDDIOSDIO_DATA3BT_WAKE_HOSTRTC_CLKCHIP_ENHOSTFC800LSDIO3.0GPIO_1WLAN_WAKESDIO3.0 Wi-Fi&Bluetooth Module Series 3.5.1. WLAN_WAKE WLAN_WAKE is used to wake up the host. And the interrupt function that replaces the regular SDIO D1 interrupt pin. Table 6: Pin Definition of WLAN_WAKE Pin Name Pin No. I/O Description Comment WLAN_WAKE 16 DO Wake up the host by WLAN, and SDIO interrupt function GPIO_1 connected to WLAN_WAKE must be interruptible. 3.5.2. SDIO Interface The following table shows the pin definition of SDIO interface. Table 7: Pin Definition of SDIO Interface Pin Name Pin No. I/O Description Comment SDIO_CMD 17 DIO SDIO command SDIO_CLK 18 DI SDIO clock SDIO_DATA3 19 DIO SDIO data bit 3 SDIO_DATA2 20 DIO SDIO data bit 2 SDIO_DATA0 21 DIO SDIO data bit 0 SDIO_DATA1 22 DIO SDIO data bit 1 VDDIO power domain The following figure shows the SDIO interface connection between FC800L and host. FC800L_Hardware_Design 24 / 50 Wi-Fi&Bluetooth Module Series Figure 4: SDIO Interface Connection To ensure that the interface design complies with the SDIO 3.0 specification, the following principles are recommended to be adopted:

Route the SDIO traces in inner-layer of the PCB and the impedance is controlled at 50 10 %;

SDIO signals need to be keep away from sensitive signals, such as radio frequency, analog signals, clocks, and DC-DC noise signals;

The distance between SDIO signals and other signals must be greater than 2 times the trace width, and the busload capacitance must be less than 15 pF. SDIO signal traces need to be treated with equal length (the distance between the traces is less than 1 mm). According to the transmission rate, the trace length has the following requirements:

1) As for SDR104 mode, the recommended bus length is less than 50 mm, the internal trace length of the module is 11.36 mm. 2) As for other modes, such as DDR50, SDR100, etc., the recommended bus length is less than 150 mm. 3.6. Bluetooth Application Interface The following figure shows the block diagram of Bluetooth application interface connection between FC800L_Hardware_Design 25 / 50 SDIO_CLKSDIO_CMDSDIO_DATA0SDIO_DATA1SDIO_DATA2SDIO_DATA3HOSTFC800LSDIO_DATA0SDIO_DATA1SDIO_DATA2SDIO_DATA3SDIO_CLKSDIO_CMDNMVDDIONMNMNM10K NMNMNMNMNMNMNM Wi-Fi&Bluetooth Module Series FC800L and a host. Figure 5: Block Diagram of Bluetooth Application Interface Connection NOTE GPIO_2 connected to BT_WAKE_HOST must be interruptible. 3.6.1. BT_EN BT_EN is used to control the Bluetooth function of FC800L. Bluetooth function will be enabled when BT_EN is at high level. Table 8: Pin Definition of BT_EN Pin Name Pin No. I/O Description Comment BT_EN 38 DI Bluetooth enable control Active high. 3.6.2. UART Interface FC800L supports an HCI UART as defined in Bluetooth Core Specification Version 5.0. The UART supports hardware flow control, and it is used for data transmission with host. It supports up to 4.0 Mbps baud rates. The following table shows the pin definition of UART interface. Table 9: Pin Definition of UART Interface FC800L_Hardware_Design 26 / 50 FC800LHostUARTPCMBT_ENUARTPCMBT_ENBT_WAKE_HOSTGPIO_2HOST_WAKE_BTGPIO_3 Wi-Fi&Bluetooth Module Series Pin Name Pin No. I/O Description Comment BT_TXD BT_RXD BT_RTS BT_CTS 40 41 42 43 DO Bluetooth UART transmit DI Bluetooth UART receive DO Bluetooth UART request to send DI Bluetooth UART clear to send VDDIO power domain The voltage range of the Bluetooth UART interface of FC800L is determined by VDDIO. It is necessary to pay attention to whether the voltage range of host and FC800L Bluetooth UART interface is consistent. If necessary, voltage-level translator shall be added. The following figure shows a reference design for UART interface connection between FC800L and host. Figure 6: Reference Design for UART Interface Connection 3.6.3. BT_WAKE_HOST* and HOST_WAKE_BT*

Table 10: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT Pin Name Pin No. I/O Description Comment HOST_WAKE_BT BT_WAKE_HOST 49 50 DI Host wakes up Bluetooth DO Bluetooth wakes up host VDDIO power domain 3.6.4. PCM Interface*

PCM interface is used for audio over Bluetooth phone. The following table shows the pin definition of PCM interface. FC800L_Hardware_Design 27 / 50 BT_CTSBT_RTSBT_RXDBT_TXDFC800LUART_RXDUART_TXDUART_CTSUART_RTSHost Wi-Fi&Bluetooth Module Series Table 11: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_SYNC PCM_DIN PCM_DOUT PCM_CLK 27 28 29 30 DI DI PCM data frame sync PCM data input DO PCM data output DI PCM clock VDDIO power domain The following figure shows the PCM interface connection between FC800L and the host. Figure 7: PCM Interface Connection 3.7. Other Interfaces 3.7.1. RTC_CLK The RTC_CLK 32.768 kHz is used for internal PMU reference clock. Table 12: Pin Definition of RTC_CLK Pin Name Pin No. I/O Description Comment RTC_CLK 31 DI External 32.768 kHz clock input NOTE RTC_CLK should surrounded by GND. FC800L_Hardware_Design 28 / 50 FC800LHostPCM_CLKPCM_SYNCPCM_DOUTPCM_DINPCM_CLKPCM_SYNCPCM_DINPCM_DOUT Wi-Fi&Bluetooth Module Series 3.7.2. CHIP_EN The module is enabled by CHIP_EN. Table 13: Pin Definition of CHIP_EN Pin Name Pin No. I/O Description Comment CHIP_EN 15 DI Module enable pin Active high. VDDIO power domain FC800L_Hardware_Design 29 / 50 Wi-Fi&Bluetooth Module Series 3.8. RF Antenna Interfaces ANT_BT and ANT_WIFI is the RF antenna pin, and the RF port requires 50 characteristic impedance. 3.8.1. Operating Frequency The operating frequency of FC800L is shown in the following. Table 1: Operating Frequency of the Module Feature Frequency 2.4 GHz WLAN 2.4002.4835 5 GHz WLAN 5.1505.850 Bluetooth 2.4022.480 Unit GHz GHz GHz 3.8.2. Pin Definition of RF Antenna Interface Pin definitions of the antenna interface are shown in the following table:

Table 2: Pin Definition of RF Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_BT ANT_WIFI 2 9 AIO Bluetooth antenna interface 50 impedance AIO Wi-Fi antenna interface 0 50 impedance 3.8.3. Reference Design of RF Antenna Interfaces FC800L module provides an RF antenna pin for Wi-Fi & Bluetooth antenna connection. The RF trace in host PCB connected to the modules RF antenna pin should be microstrip line or other types of RF trace, with characteristic impendence close to 50 . FC800L module comes with grounding pins which are next to the antenna pin to give a better grounding. A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a -type matching circuit for better RF performance, and ESD protection devices are designed at the same time. Matching components C1, R1, L1~L4 and protection devices D1, D2 should be placed as close as possible to the antenna. Inductors (L1~L4) are not installed by default. FC800L_Hardware_Design 30 / 50 Wi-Fi&Bluetooth Module Series Figure 8: Reference Circuit for RF Antenna Interfaces FC800L_Hardware_Design 31 / 50 Wi-Fi&Bluetooth Module Series 3.8.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 9: Microstrip Design on a 2-layer PCB Figure 10: Coplanar Waveguide Design on a 2-layer PCB Figure 11: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) FC800L_Hardware_Design 32 / 50 Wi-Fi&Bluetooth Module Series Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document 3.8.5. Antenna Requirements The following tables show the requirements on antenna cables and antennas. Table 3: Antenna Cable Requirements Type Requirements 2.4002.4835 GHz Cable insertion loss: <1 dB 5.1505.850 GHz Cable insertion loss: <1 dB FC800L_Hardware_Design 33 / 50 Wi-Fi&Bluetooth Module Series Table 4: Antenna Requirements Type Frequency Range (GHz) VSWR Gain (dBi) Max Input Power (W) Input Impedance () Requirements 2.4002.4835 5.1505.850

< 2:1 recommended Typical 1 50 50 Polarization Type Vertical 3.8.6. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 13: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. FC800L_Hardware_Design 34 / 50 Wi-Fi&Bluetooth Module Series Figure 14: Mechanicals of UF.L-LP Connectors (Unit: mm) The following figure describes the space factor of mated connector Figure 15: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. FC800L_Hardware_Design 35 / 50 Wi-Fi&Bluetooth Module Series 4 Reliability, Radio and Electrical Characteristic 4.1. General Description This chapter mainly introduces the electrical characteristics and radio frequency characteristics of FC800L, the specific content is as follows:

Absolute maximum ratings I/O interface characteristics Power consumption RF performance ESD protection Operating and storage temperature 4.2. Electrical Characteristics Table 5: Absolute Maximum Ratings Parameter VBAT VDDIO Digital I/O Input Voltage Min.

-0.5

-0.5

-0.5 Max. 3.63 3.63 3.63 Unit V V V FC800L_Hardware_Design 36 / 50 Wi-Fi&Bluetooth Module Series The following table shows the recommended operating conditions of FC800L module. Table 6: Recommended Operating Conditions Parameter VBAT VDDIO Min. 2.97 1.62 Typ. 3.3 1.8 Max. 3.63 1.98 Unit V V 4.3. I/O Interface Characteristics The following table shows the general DC electrical characteristics over recommended operating conditions (unless otherwise specified). Table 7: General DC Electrical Characteristics Symbol Parameter Min. Max. Unit VIH VIL VOH VOL High-level Input Voltage 0.65 VDDIO VDDIO + 0.3 Low-level Input Voltage

-0.3 0.35 VDDIO High-level Output Voltage VDDIO - 0.2 VDDIO + 0.3 Low-level Output Voltage

-0.3 0.2 V V V V FC800L_Hardware_Design 37 / 50 Wi-Fi&Bluetooth Module Series 4.4. Current Consumption Table 8: Current Consumption of the Module (Normal Operation) Description Conditions VBAT (3.3 V) VDDIO (1.8 V) Unit Shutdown AT+QWIFI=0 Idle AT+QWIFI=1 802.11b 802.11g TX (2.4 GHz) 1 Mbps TX (2.4 GHz) 11 Mbps TX (2.4 GHz) 6 Mbps TX (2.4 GHz) 54 Mbps TBD TBD 241.50 203.50 266.50 165.50 TX (2.4 GHz) HT20 MCS0 265.50 TX (2.4 GHz) HT20 MCS7 158.00 TX (2.4 GHz) HT40 MCS0 261.00 TX (2.4 GHz) HT40 MCS7 161.00 802.11n TX (5 GHz) HT20 MCS0 TX (5 GHz) HT20 MCS7 TX (5 GHz) HT40 MCS0 TX (5 GHz) HT40 MCS7 802.11a TX (5 GHz) 6 Mbps TX (5 GHz) 54 Mbps TX (5 GHz) VHT20 MCS0 441.50 250.00 443.50 277.50 443.00 264.50 483.00 802.11ac TX (5 GHz) VHT20 MCS8 329.50 TX (5 GHz) VHT40 MCS0 TX (5 GHz) VHT40 MCS9 448.00 225.00 TBD TBD 0.03 0.07 0.04 0.04 0.04 0.05 0.04 0.02 0.04 0.05 0.04 0.01 0.04 0.04 0.03 0.02 0.04 0.02 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA FC800L_Hardware_Design 38 / 50 Wi-Fi&Bluetooth Module Series TX (5 GHz) VHT80 MCS0 431.50 TX (5 GHz) VHT80 MCS9 167.50 0.04 0.02 mA mA FC800L_Hardware_Design 39 / 50 Wi-Fi&Bluetooth Module Series 4.5. RF Performances The following tables summarize the transmitting and receiving performances of FC800L. 4.5.1. Wi-Fi Performance Table 14: Conducted RF Output Power at 2.4 GHz Standard Min. Typ. 802.11b @ 1 Mbps 802.11b @ 11 Mbps 802.11g @ 6 Mbps 802.11g @ 54 Mbps 802.11n, HT20 @ MCS0 802.11n, HT20 @ MCS7 802.11n, HT40 @ MCS0 802.11n, HT40 @ MCS7 14 14 15 13 15 12 14 12 16 16 17 15 17 14 16 14 Table 15: Conducted RF Output Power at 5 GHz Standard Min. Typ. 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11n, HT20 @ MCS0 802.11n, HT20 @ MCS7 802.11n, HT40 @ MCS0 802.11n, HT40 @ MCS7 802.11ac, VHT20 @ MCS0 14 12 14 11 13 11 14 17 15 17 14 16 14 17 Unit dBm dBm dBm dBm dBm dBm dBm dBm Unit dBm dBm dBm dBm dBm dBm dBm FC800L_Hardware_Design 40 / 50 Wi-Fi&Bluetooth Module Series 802.11ac, VHT20 @ MCS8 802.11ac, VHT40 @ MCS0 802.11ac, VHT40 @ MCS9 802.11ac, VHT80 @ MCS0 802.11ac, VHT80 @ MCS9 10 13 9 11 8 13 16 12 14 11 dBm dBm dBm dBm dBm Table 16: Conducted RF Receiving Sensitivity at 2.4 GHz Standard 802.11b, 1 Mbps 802.11b, 11 Mbps 802.11g, 6 Mbps 802.11g, 54 Mbps 802.11n, HT20, MCS0 802.11n, HT20, MCS7 802.11n, HT40, MCS0 802.11n, HT40, MCS7 Receiving Sensitivity (Typ.)

-95.5 dBm

-87.0 dBm

-93.0 dBm

-76.0 dBm

-92.5 dBm

-74.5 dBm

-89.0 dBm

-70.5 dBm Table 17: Conducted RF Receiving Sensitivity at 5 GHz Standard 802.11a, 6 Mbps 802.11a, 54 Mbps 802.11n, HT20, MCS0 802.11n, HT20, MCS7 802.11n, HT40, MCS0 802.11n, HT40, MCS7 Receiving Sensitivity (Typ.)

-94.0 dBm

-75.0 dBm

-93.0 dBm

-75.0 dBm

-89.0 dBm

-71.0 dBm FC800L_Hardware_Design 41 / 50 Wi-Fi&Bluetooth Module Series 802.11ac, VHT20, MCS0 802.11ac, VHT20, MCS8 802.11ac, VHT40, MCS0 802.11ac, VHT40, MCS9 802.11ac, VHT80, MCS0 802.11ac, VHT80, MCS9

-92.5 dBm

-69.5 dBm

-89.0 dBm

-64.5 dBm

-84.0 dBm

-59.0 dBm 4.5.2. Bluetooth Performance The following table shows the Bluetooth transmitting and receiving performance of FC800L module. Standard BR EDR(/4-DQPSK) EDR(8-DPSK) BLE(1M) BLE(2M) S=2 S=8 Transmitting Power Receiving Sensitivity Unit 6.8 5.1 5.1 6.7 6.7 6.7 6.7

-90.0

-90.5

-85.5

-98.5

-96.0

-100.5

-103.5 dBm dBm dBm dBm dBm dBm dBm FC800L_Hardware_Design 42 / 50 Wi-Fi&Bluetooth Module Series 4.6. Electrostatic Discharge Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 18: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity; Unit: kV) Tested Interfaces Contact Discharge Air Discharge Unit VBATGND ANT_BTANT_WIFI Other Interfaces 2 5 2 12 10 2 kV kV kV FC800L_Hardware_Design 43 / 50 Wi-Fi&Bluetooth Module Series 5 Mechanical Information This chapter describes the mechanical dimensions of FC800L. All dimensions are measured in millimeter

(mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions Figure 16: Top and Side Dimensions (Top and Side View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FC800L_Hardware_Design 44 / 50 Wi-Fi&Bluetooth Module Series 5.2. Recommended Footprint Figure 17: Recommended Footprint (Top View) NOTE 1. For easy maintenance of this module, keep at least 3 mm between the module and other components on the motherboard. 2. Keep all RESERVED pins open. FC800L_Hardware_Design 45 / 50 Wi-Fi&Bluetooth Module Series 5.3. Top and Bottom Views Figure 18: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FC800L_Hardware_Design 46 / 50 Wi-Fi&Bluetooth Module Series 6 Storage, Manufacturing and Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 hours 2 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 2 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. FC800L_Hardware_Design 47 / 50 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 6.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.130.15 mm. For more details, see document [2]

The peak reflow temperature should be 238246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 19: Recommended Reflow Soldering Thermal Profile FC800L_Hardware_Design 48 / 50 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 1~3 C/s Cooling down slope: -1.5 ~ -3 C/s Max slope: 2~3 C/s Wi-Fi&Bluetooth Module Series Table 19: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 23 C/s 4070 s 235 C to 246 C

-1.5 to -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. FC800L_Hardware_Design 49 / 50 Wi-Fi&Bluetooth Module Series 6.3. Packaging Specifications The module adopts carrier tape packaging and details are as follow:

6.3.1. Carrier Tape Dimension details are as follow:

Figure 20: Carrier Tape Dimension Drawing Table 20: Carrier Tape Dimension Table (Unit: mm) W 32 P 20 T 0.4 A0 B0 13.4 15.4 K0 2.7 K1 5.4 F E 14.2 1.75 FC800L_Hardware_Design 50 / 50 Wi-Fi&Bluetooth Module Series 6.3.2. Plastic Reel Figure 21: Plastic Reel Dimension Drawing Table 21: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 32.5 FC800L_Hardware_Design 51 / 50 Wi-Fi&Bluetooth Module Series 6.3.3. Packaging Process Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, then vacuumize it. Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. One plastic reel can load 500 modules. Place the vacuum-packed plastic reel into a pizza box. Put 4 pizza boxes into 1 carton and seal it. One carton can pack 2000 modules. Figure 22: Packaging Process FC800L_Hardware_Design 52 / 50 Wi-Fi&Bluetooth Module Series 7 Appendix References Table 22: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_Module_Secondary_SMT_Application_Note Table 23: Terms and Abbreviations Abbreviation Description BPSK Binary Phase Shift Keying BT CCK CTS GND HCI IEEE IIL I/O LNA LTE Mbps MCS PA Bluetooth Complementary Code Keying Clear to Send Ground Host Controller Interface Institute of Electrical and Electronics Engineers Input Leakage Current Input/Output Low-Noise Amplifier Long Term Evolution Megabits per second Modulation and Coding Scheme Power Amplifier FC800L_Hardware_Design 53 / 50 Wi-Fi&Bluetooth Module Series PCB PCM QAM QPSK RF RoHS RTS RX TBD TX UART VHT Wi-Fi WLAN Printed Circuit Board Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Request to Send Receive To Be Determined Transmit Universal Asynchronous Receiver/Transmitter Very High Throughput Wireless-Fidelity Wireless Local Area Network FC800L_Hardware_Design 54 / 50

QUECTEeL FC800L Q1-AXXXX FC800LAAMD SN:C11 4906562000 FCC ID:XMR202207FC800L IC :10224A-2022FC800L

Quectel Wireless Solutions Company Limited Date: 2022-08-12 Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: XMR202207FC800L Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Block Diagram Schematics Operational Description Parts List The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely,

Grantee Contacts Signature Quectel Wireless Solutions Company Limited Jean Hu

Quectel Wireless Solutions Company Limited FCC Modular Approval Statement Receiver Federal Communication Commission Equipment Authorization Devision, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Subject:

Modular Approval Statement Date: 2022-08-12 FCC Certification Number: XMR202207FC800L Model Name/Number: Wi-Fi&Bluetooth Module / FC800L TO WHOM IT MAY CONCERN Pursuant to Paragraphs CFR 15.212, we herewith declare for our module. Modular approval requirement Yes No *

(a) The radio elements must have the radio frequency circuitry be shielded. Physical/discrete and tuning capacitors may be located external to the shield, but must be on the module assembly.

*Please provide a detailed explanation if the answer is No.:

(b) The module shall have buffered modulation/data input(s) (if such inputs are provided) to ensure that the module will comply with the requirements set out in the applicable standard under conditions of excessive data rates or over-

modulation.

*Please provide a detailed explanation if the answer is No.:

(c) The module shall have its own power supply regulation on the module. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host device which houses the module.

*Please provide a detailed explanation if the answer is No.:

(d) The module shall comply with the provisions for external power amplifiers and antennas detailed in this standard. The equipment certification submission shall contain a detailed description of the configuration of all antennas that will be used with the module.

*Please provide a detailed explanation if the answer is No.:

(e) The module shall be tested for compliance with the applicable standard in a stand-alone configuration, i.e. the module must not be inside another device during testing.

*Please provide a detailed explanation if the answer is No.:

(f) The module shall comply with the Category I equipment labeling requirements and CFR 15.212(a)(1)(vi).

*Please provide a detailed explanation if the answer is No.:

1 Yes Yes Yes Yes Yes Yes Quectel Wireless Solutions Company Limited FCC Modular Approval Statement

(g) The module shall comply with applicable RSS-102 exposure requirements and any applicable FCC RF exposure requirement which are based on the intended use/configurations.

*Please provide a detailed explanation if the answer is No.:

Yes

(i) The modular transmitter complies with all applicable FCC rules. Instructions for maintaining compliance are given in the user instructions. Yes If you have any questions, please feel free to contact us at the address shown below Best Regards, ____________________

(Signed) Name / Title: Jean Hu/ Certification Section 2

Quectel Wireless Solutions Company Limited Declaration of Authorization We Name: Quectel Wireless Solutions Company Limited Address: Building 5, Shanghai Business Park PhaseIII, (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declare that:

Name Representative of agent: Ms. Riley Wei Agent Company name: BTL Inc. Address: No. 29, Jintang Road, Tangzhen Industry Park Pudong New Area City: Shanghai Country: China is authorized to apply for Certification of the following product(s) and signing all the related documents including 731 forms:

Product description: Wi-Fi&Bluetooth Module Type designation: FC800L Trademark: Quectel FCC ID: XMR202207FC800L on our behalf. Date: 2022-08-12 City: Shanghai Name: Jean Hu Function: Certification Section Signature:

Quectel Wireless Solutions Co., Ltd

Ad Hoc Mode Declaration

Date: 2022-08-12

We, the undersigned company

Company Name: Quectel Wireless Solutions Co., Ltd

Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang

District, Shanghai, China

Declare that:

Product description: Wi-Fi&Bluetooth Module

Type designation: FC800L

Brand: Quectel

FCC ID: XMR202207FC800L

1. The EUT doesn’t have Ad Hoc Mode function on “non-US frequencies”. 802.11a/n Ad Hoc

mode should not be supported even on US DFS frequencies (5.25 ~5.35GHz/5.47 ~5.725GHz).

2. In addition, The product meets all other requirements specified in Part 15E Section 15.407 and no

configuration controls are provided to change the frequency of operations outside the grant of

certification for US operation.

3. Only channels 1~11 will be used in USA. Country code selection is disabled.

If you have any questions regarding the authorization, please do not hesitate to contact us,

thank you~

Sincerely,

Signature: ________

Name: Jean Hu

Tel: +8602150086326

Email: jean.hu@quectel.com

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