FCC ID: XMR202210FC900E Wi-Fi&Bluetooth Module

FC900E Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.2 Date: 2022-09-01 Status: Preliminary Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FC900E_Hardware_Design 1 / 49 Wi-Fi&Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. FC900E_Hardware_Design 2 / 49 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft is forbidden to prevent communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FC900E_Hardware_Design 3 / 49 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date

2022-05-27 1.0.0 2022-05-27 Author Lisa LI Lisa LI 1.0.1 2022-09-19 Lisa LI Description Creation of the document Preliminary Updated RF specificationsPower Consumption; Update module size FC900E_Hardware_Design 4 / 49 Wi-Fi&Bluetooth Module Series Contents Safety Information ........................................................................................................................................3 About the Document ....................................................................................................................................4 Contents ........................................................................................................................................................ 5 Table Index ....................................................................................................................................................7 Figure Index .................................................................................................................................................. 8 1 Introduction ...............................................................................................................................................9 1.1. Special Marks .................................................................................................................................. 9 2 Product Overview ................................................................................................................................... 10 2.1. General Description .......................................................................................................................10 2.2. Key Features ................................................................................................................................. 10 2.3. EVB ................................................................................................................................................ 12 3 Application Interfaces ............................................................................................................................13 3.1. General Description .......................................................................................................................13 3.2. Pin Assignment ..............................................................................................................................14 3.3. Pin Description ...............................................................................................................................15 3.4. Power Supply .................................................................................................................................17 3.4.1. Power Supply Pins Introduction ..........................................................................................17 3.5. Wi-Fi Application Interface ............................................................................................................ 18 3.5.1. SDIO Interface .................................................................................................................... 19 3.5.2. WLAN_EN ........................................................................................................................... 20 3.5.3. WLAN_WAKE ..................................................................................................................... 20 3.6. Bluetooth Application Interface ..................................................................................................... 21 3.6.1. Bluetooth UART .................................................................................................................. 21 3.6.2. BT_EN .................................................................................................................................22 3.6.3. BT_WAKE_HOST & HOST_WAKE_BT ............................................................................ 22 3.6.4. PCM Interface ..................................................................................................................... 23 3.7. Other Interfaces ............................................................................................................................. 24 3.7.1. WLAN_SLP_CLK ................................................................................................................24 3.8. RF Antenna Interfaces ...................................................................................................................25 3.8.1. Operating Frequency .......................................................................................................... 25 3.8.2. Pin Definition of RF Antenna Interface ............................................................................... 25 3.8.3. Reference Design ............................................................................................................... 25 3.8.4. Reference Design of RF Routing ....................................................................................... 26 3.8.5. Requirements for Antenna Design ..................................................................................... 28 3.8.6. RF Connector Recommendation ........................................................................................ 29 4 Electrical Characteristics & Reliability ................................................................................................ 31 4.1. General Description .......................................................................................................................31 FC900E_Hardware_Design 5 / 49 Wi-Fi&Bluetooth Module Series 4.2. Absolute Maximum Ratings ...........................................................................................................31 4.3. I/O Interface Characteristics ..........................................................................................................32 4.4. Power Consumption ...................................................................................................................... 32 4.5. RF Performances ...........................................................................................................................34 4.5.1. Wi-Fi Performance .............................................................................................................. 34 4.5.2. BLE Performance ................................................................................................................36 4.6. ESD Protection .............................................................................................................................. 36 4.7. Operating and Storage Temperatures .......................................................................................... 37 5 Mechanical Information ......................................................................................................................... 38 5.1. Mechanical Dimensions ................................................................................................................ 39 5.2. Recommended Footprint ...............................................................................................................41 6 Storage, Manufacturing & Packaging .................................................................................................. 42 6.1. Storage Conditions ........................................................................................................................ 42 6.2. Manufacturing and Soldering ........................................................................................................ 43 6.3. Notification ..................................................................................................................................... 45 6.3.1. Coating ................................................................................................................................ 45 6.3.2. Cleaning .............................................................................................................................. 45 6.4. Packaging Specifications .............................................................................................................. 45 6.4.1. Carrier Tape ........................................................................................................................ 45 6.4.2. Plastic Reel ......................................................................................................................... 46 6.4.3. Packaging Process ............................................................................................................. 46 7 Appendix References .............................................................................................................................48 FC900E_Hardware_Design 6 / 49 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Marks .................................................................................................................................. 9 Table 2: Key Features ................................................................................................................................. 10 Table 3: I/O Parameters Definition .............................................................................................................. 15 Table 4: Pin Description ...............................................................................................................................15 Table 5: Definition of Power Supply and GND Pins ....................................................................................17 Table 6: Pin Definition of SDIO Interface .................................................................................................... 19 Table 7: Pin Definition of WLAN_EN ...........................................................................................................20 Table 8: Pin Definition of WLAN_WAKE ..................................................................................................... 20 Table 9: Pin Definition of Bluetooth UART .................................................................................................. 21 Table 10: Pin Definition of BT_EN ...............................................................................................................22 Table 11: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT ............................................ 22 Table 12: Pin Definition of PCM Interface ................................................................................................... 23 Table 13: Pin Definition of WLAN_SLP_CLK ..............................................................................................24 Table 14: WLAN_SLP_CLK Parameter Recommendation ........................................................................ 24 Table 15: FC900E Operating Frequency .................................................................................................... 25 Table 16: Pin Definition of RF Antenna Interfaces ......................................................................................25 Table 17: Antenna Requirements ................................................................................................................28 Table 18: Absolute Maximum Ratings .........................................................................................................31 Table 19: Recommended Operating Conditions .........................................................................................31 Table 20: General DC Electrical Characteristics .........................................................................................32 Table 21: Power Consumption of the Module .............................................................................................32 Table 22: Conducted RF Output Power at 2.4 GHz ................................................................................... 34 Table 23: Conducted RF Output Power at 5 GHz ...................................................................................... 34 Table 24: Conducted RF Receiving Sensitivity at 2.4 GHz ........................................................................ 35 Table 25: Conducted RF Receiving Sensitivity at 5 GHz ........................................................................... 35 Table 26: BLE Transmitting and Receiving Performance ...........................................................................36 Table 27: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity; Unit: kV) .................37 Table 28: Operating and Storage Temperatures (Unit: C) ........................................................................ 37 Table 29: Recommended Thermal Profile Parameters .............................................................................. 44 Table 30: Carrier Tape Dimension Table (Unit: mm) ..................................................................................46 Table 31: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 46 Table 32: Related Documents ..................................................................................................................... 48 Table 33: Terms and Abbreviations ............................................................................................................ 48 FC900E_Hardware_Design 7 / 49 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram of FC900E ...................................................................... Figure 2: Pin Assignment (Top View) ..........................................................................................................14 Figure 3: VBAT Circuit ................................................................................................................................. 17 Figure 4: Power-up Timing .......................................................................................................................... 18 Figure 5: Wi-Fi Application Interface Connection ........................................................................................18 Figure 6: SDIO Interface Connection .......................................................................................................... 19 Figure 7: Module and Host Connection Diagram ........................................................................................21 Figure 8: Reference Design for UART Interface Connection ..................................................................... 22 Figure 9: PCM Interface Connection ........................................................................................................... 23 Figure 10: Reference Design .......................................................................................................................26 Figure 11: Microstrip Design on a 2-layer PCB ...........................................................................................26 Figure 12: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 27 Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 27 Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 27 Figure 15: Dimensions of the Receptacle (Unit: mm) ................................................................................. 29 Figure 16: Specifications of Mated Plugs ....................................................................................................29 Figure 17: Space Factor of Mated Connectors (Unit: mm) .........................................................................30 Figure 18: Top and Side Dimensions (Top and Side View) ........................................................................39 Figure 19: Bottom Dimension (Top View) ................................................................................................... 40 Figure 20: Recommended Footprint (Top View) .........................................................................................41 Figure 21: Recommended Reflow Soldering Thermal Profile .................................................................... 43 Figure 22: Carrier Tape Dimension Drawing .............................................................................................. 45 Figure 23: Plastic Reel Dimension Drawing ................................................................................................46 Figure 24: Packaging Process .....................................................................................................................47 FC900E_Hardware_Design 8 / 49 Wi-Fi&Bluetooth Module Series 1 Introduction This document defines the FC900E and describes its air interfaces and hardware interfaces which are connected with your application. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, you can use FC900E to design and set up applications easily. 1.1. Special Marks Table 1: Special Marks Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, ANTCTL[0:3] refers to all four ANTCTL pins, ANTCTL0, ANTCTL1, ANTCTL2 and ANTCTL3. FC900E_Hardware_Design 9 / 49 Wi-Fi&Bluetooth Module Series 2 Product Overview 2.1. General Description The FC900E is a low-power, cost-effective Wi-Fi & Bluetooth module that supports the 1 1 IEEE 802.11a/b/g/n/ac WLAN standard and Bluetooth 5.0 standard protocols, and supports the Wi-Fi low-power SDIO 3.0 interface. UART & PCM interface for Bluetooth. The FC900E module is a patch module with 44 LCC pins. The module is compact in package and the size is only 12.0 mm 12.0 mm 2.05 mm. 2.2. Key Features The following table describes the key features of FC900E. Table 2: Key Features Features Details Power Supply Wi-Fi Transmission Data Rates VBAT power supply:

Supply voltage range: 3.143.46 V Typical supply voltage: 3.3 V VIO power supply:

Supply voltage range: 1.713.46 V Typical supply voltage: 1.8/3.3 V 2.4 GHz:

802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS0MCS7) 5 GHz:

802.11a: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS0MCS7), HT40 (MCS0MCS7) FC900E_Hardware_Design 10 / 49 Wi-Fi&Bluetooth Module Series 802.11ac: VHT20 (MCS0MCS8), VHT40 (MCS0MCS9), VHT80 (MCS0MCS9) 2.4 GHz 802.11b (11 Mbps): 16 dBm 802.11g (54 Mbps): 14 dBm 802.11n (HT20 MCS7): 14 dBm 802.11n (HT40 MCS7): 13 dBm 5 GHz 802.11a (54 Mbps): 11 dBm 802.11n (HT20 MCS7): 9 dBm 802.11n (HT40 MCS7): 12.5 dBm 802.11ac (VHT20 MCS8): 9 dBm 802.11ac (VHT40 MCS9): 7.5 dBm 802.11ac (VHT80 MCS9): 8 dBm Wi-Fi Transmitting Power Wi-Fi Protocol Feature IEEE 802.11a/b/g/n/ac Wi-Fi Modulation CCK, BPSK, QBPSK, 16QAM, 64QAM, 256QAM Wi-Fi Operation Mode Bluetooth Operation Mode AP STA BR + EDR BLE Bluetooth Modulation GFSK, /4-DQPSK, 8-DPSK Wi-Fi Application Interface SDIO 3.0 Bluetooth Application Interface UART and PCM RF Antenna Interfaces ANT_WIFI0/BT 50 characteristic impedance Physical Characteristics Temperature Range Size: (12.0 0.15) mm (12.0 0.15) mm (2.05 0.2) mm Package: LCC Weight: TBD Operating temperature range: -40C to +85 C 1 Storage temperature range: -40 C to +95 C RoHS All hardware components are fully compliant with EU RoHS directive 1 To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules related performance can meet IEEE specifications. FC900E_Hardware_Design 11 / 49 Wi-Fi&Bluetooth Module Series 2.3. EVB Quectel supplies an evaluation board (FC900E-M.2) with accessories to control or test the module. FC900E_Hardware_Design 12 / 49 Wi-Fi&Bluetooth Module Series 3 Application Interfaces 3.1. General Description FC900E is equipped with 44 LCC pins. The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module:

Power supply Wi-Fi application interface

- SDIO interface

- WLAN_EN

- WLAN_WAKE Bluetooth application interface

- Bluetooth UART

- BT_EN

- BT_WAKE_HOST & HOST_WAKE_BT

- PCM interface RF antenna interfaces

- ANT_WIFI0/BT Another interface

-WLAN_SLP_CLK FC900E_Hardware_Design 13 / 49 3.2. Pin Assignment Wi-Fi&Bluetooth Module Series GND ANT_WIFI0/BT GND RESERVED RESERVED HOST_WAKE_BT BT_WAKE_HOST RESERVED VBAT 1 2 3 4 5 6 7 8 9 RESERVED RESERVED 10 11 S T C _ T B D X R _ T B D X T _ T B S T R _ T B D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R N E _ T B D N G 4 4 3 4 2 4 1 4 0 4 9 3 8 3 7 3 6 3 5 3 4 3 FC900E 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 1 0 2 1 2 2 2 W L A N _ E N W L A N _ W A K E I S D O _ D A T A 2 I S D O _ D A T A 3 I S D O _ C M D I S D O _ C L K I S D O _ D A T A 0 I S D O _ D A T A 1 G N D R E S E R V E D I V O 33 32 31 30 29 28 27 26 25 24 23 GND RESERVED GND RESERVED RESERVED PCM_SYNC PCM_DIN PCM_CLK PCM_DOUT WLAN_SLP_CLK RESERVED Power GND WLAN Bluetooth RF Other signals RESERVED Figure 2: Pin Assignment (Top View) NOTE Keep all RESERVED pins open. FC900E_Hardware_Design 14 / 49 Wi-Fi&Bluetooth Module Series 3.3. Pin Description The following tables show the pin description of FC900E. Table 3: I/O Parameters Definition Type Description AIO DI DO DIO PI PO Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input Power Output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description Comment VBAT VIO GND 9 22 PI PI Power supply for the module Power supply for modules I/O pins 1, 3, 20, 31, 33, 36 Wi-Fi Application Interface Pin Name Pin No. WLAN_EN WLAN_WAKE SDIO_DATA2 SDIO_DATA3 12 13 14 15 Description Comment I/O DI DO Wi-Fi function enable control Wake up the host by Wi-Fi DIO SDIO data bit 2/NC VIO power domain. Active high. VIO power domain. Need to be pulled up. DIO SDIO data bit 3/NC VIO power domain. FC900E_Hardware_Design 15 / 49 Wi-Fi&Bluetooth Module Series SDIO_CMD SDIO_CLK SDIO_DATA0 SDIO_DATA1 16 17 18 19 DIO SDIO command DI DIO DIO SDIO clock SDIO data bit 0 SDIO data bit 1/IRQ Bluetooth Application Interface Pin Name Pin No. I/O Description Comment BT_EN 34 HOST_WAKE_BT 6 BT_WAKE_HOST 7 PCM_DOUT PCM_CLK PCM_DIN PCM_SYNC BT_RTS BT_TXD BT_RXD BT_CTS 25 26 27 28 41 42 43 44 RF Antenna Interfaces VIO power domain. Active high. If unused, pull it down. VIO power domain. If unused, keep them open. DI DI DO DO DI DI DI DO DO DI DI Bluetooth enable control Host wakes up Bluetooth Bluetooth wakes up host PCM data output PCM clock PCM data input PCM data frame sync Bluetooth UART request to send Bluetooth UART transmit Bluetooth UART receive Bluetooth UART clear to send Pin Name Pin No. I/O Description Comment ANT_WIFI0/BT 2 AIO Wi-Fi0/Bluetooth antenna interface 50 impedance. Other Interface Pin Name Pin No. WLAN_SLP_CLK 24 RESERVED I/O DI Description Comment External 32.768 kHz low power clock input FC900E_Hardware_Design 16 / 49 Wi-Fi&Bluetooth Module Series Pin Name Pin No. Comment RESERVED 4, 5, 8, 10, 11, 21, 23, 29, 30, 32, 35, 37, 38, 39, 40 Keep them open. 3.4. Power Supply 3.4.1. Power Supply Pins Introduction The following table shows the power supply pins and ground pins of FC900E. Table 5: Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT VIO 9 22 Power supply for the module 3.14 3.3 3.46 Power supply for modules I/O pins 1.71 1.8/3.3 3.46 V V GND 1, 3, 20, 31, 33, 36 Ground The FC900E is powered by VBAT. It is recommended to use a power chip with a maximum output current of more than 0.6. The reference circuit of VBAT input terminal is as shown in the figure below:

D1 D2 D3 E1 E2 E3 E4 L1 L1 L1 VIN VIN VIN VINA D4 EN DC_5V C405 10 F EN_CTRL R407 100K C4 GND L401 1 H U402 L2 L2 L2 B1 B2 B3 VOUT VOUT VOUT FB PFM/PWM PGND PGND PGND A1 A2 A3 A4 B4 C1 C2 C3 TPS630242 Figure 3: VBAT Circuit C406 22 F VDD_3V3 R408 1M DC_5V FC900E_Hardware_Design 17 / 49 Wi-Fi&Bluetooth Module Series The time sequence of FC900E power on and off is shown in the below:

0 VIO

> 0

> 0 EN_CTRL VDD_3V3 WLAN_EN Module Status 5 s 10 s Power up Running Power down Figure 4: Power-up Timing 3.5. Wi-Fi Application Interface The following figure shows the Wi-Fi application interface connection between FC900E and the host. FC900E SDIO WLAN_EN Host SDIO WLAN_EN WLAN_WAKE WALN_WAKE Figure 5: Wi-Fi Application Interface Connection FC900E_Hardware_Design 18 / 49 Wi-Fi&Bluetooth Module Series 3.5.1. SDIO Interface FC900E SDIO interface definition is as follows:

Table 6: Pin Definition of SDIO Interface Pin Name Pin No. I/O Description Comment SDIO_DATA3 SDIO_DATA2 SDIO_DATA1 SDIO_DATA0 SDIO_CLK SDIO_CMD 15 14 19 18 17 16 DIO SDIO data bit 3 VIO power domain VIO power domain;

Need to pull up to 1.8 V via external 10 k resistors. VIO power domain DIO SDIO data bit 2 DIO DIO DI SDIO data bit 1 SDIO data bit 0 SDIO clock DIO SDIO command The following figure shows the SDIO interface connection between FC900E and host. VIO N M _ 1 0 K N M _ 1 0 K N M _ 1 0 K N M _ 1 0 K 1 0 K N M _ 1 0 K FC900E SDIO_CLK SDIO_CMD SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 SDIO_DATA3 Host SDIO_CLK SDIO_CMD SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 SDIO_DATA3 NM NM NM NM NM NM Figure 6: SDIO Interface Connection FC900E_Hardware_Design 19 / 49 Wi-Fi&Bluetooth Module Series To ensure that the interface design complies with the SDIO 3.0 specification, the following principles are recommended to be adopted:

Route the SDIO traces in inner-layer of the PCB and the impedance is controlled at 50 10 %. SDIO signals need to be keep away from sensitive signals, such as radio frequency, analog signals, clocks, and DC-DC noise signals. SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be treated with equal length (the distance between the traces is less than 1 mm). The distance between SDIO signals and other signals must be greater than 2 times the trace width, and the busload capacitance must be less than 15 pF. The maximum length of the internal wiring of the SDIO module is 7.99 mm. 3.5.2. WLAN_EN WLAN_EN is used to control the Wi-Fi function of the module. Wi-Fi function will be enabled when WLAN_EN is at high level. Table 7: Pin Definition of WLAN_EN Pin Name Pin No. I/O Description Comment WLAN_EN 12 DI Wi-Fi function enable control VIO power domain. Active high. NOTE WLAN_EN is the Wi-Fi function enable signal. When wiring, keep it away from sensitive signals such as radio frequency, analog signal, clock, and DC-DC noise signals. 3.5.3. WLAN_WAKE WLAN_WAKE is used to wake up the host. Table 8: Pin Definition of WLAN_WAKE Pin Name Pin No. I/O Description Comment WLAN_WAKE 13 DO Wake up the host by Wi-Fi VIO power domain. If unused, keep it open. FC900E_Hardware_Design 20 / 49 Wi-Fi&Bluetooth Module Series 3.6. Bluetooth Application Interface The following figure shows the block diagram of Bluetooth application interface connection between FC900E and a host. FC900E Host UART PCM BT_EN BT_WAKE_HOST HOST_WAKE_BT UART PCM BT_EN Interrupt GPIO1 Interrupt GPIO2 Figure 7: Module and Host Connection Diagram 3.6.1. Bluetooth UART The FC900E supports Host Controller Interface (HCI) UART defined by Bluetooth. The UART supports hardware flow control, and it is used for data transmission with host. It supports up to 4 Mbps baud rates. Table 9: Pin Definition of Bluetooth UART Pin Name Pin No. I/O Description Comment BT_RTS BT_TXD BT_RXD BT_CTS 41 42 43 44 DO Bluetooth UART request to send DO Bluetooth UART transmit DI DI Bluetooth UART receive Bluetooth UART clear to send VIO power domain. If unused, keep them open. FC900E_Hardware_Design 21 / 49 The following figure shows a reference design for UART interface connection between FC900E and host. Wi-Fi&Bluetooth Module Series FC900E BT_TXD BT_RXD BT_RTS BT_CTS Host UART_RXD UART_TXD UART_CTS UART_RTS Figure 8: Reference Design for UART Interface Connection 3.6.2. BT_EN BT_EN is used to control the Bluetooth function of FC900E. Bluetooth function will be enabled when BT_EN is at high level. Table 10: Pin Definition of BT_EN Pin Name Pin No. I/O Description Comment BT_EN 34 DI Bluetooth enable control Active high. If unused, please pull it down. VIO power domain. 3.6.3. BT_WAKE_HOST & HOST_WAKE_BT BT_WAKE_HOST and HOST_WAKE_BT are used to wake up Bluetooth function. Table 11: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT Pin Name Pin No. I/O Description Comment HOST_WAKE_BT 6 DI Host wakes up Bluetooth function BT_WAKE_HOST 7 DO Bluetooth function wakes up host VIO power domain. If unused, keep them open. FC900E_Hardware_Design 22 / 49 Wi-Fi&Bluetooth Module Series 3.6.4. PCM Interface PCM interface is used for audio over Bluetooth. The following table shows the pin definition of PCM interface. Table 12: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_DOUT PCM_CLK PCM_DIN PCM_SYNC 25 26 27 28 DO PCM data output DI DI DI PCM clock PCM data input PCM data frame sync VIO power domain. If unused, keep them open. The following figure shows the PCM interface connection between FC900E and the host. FC900E PCM_OUT PCM_SYNC PCM_IN PCM_CLK Host PCM_IN PCM_SYNC PCM_OUT PCM_CLK Figure 9: PCM Interface Connection FC900E_Hardware_Design 23 / 49 Wi-Fi&Bluetooth Module Series 3.7. Other Interfaces 3.7.1. WLAN_SLP_CLK The 32.768 kHz sleep clock is used in low power modes, such as IEEE power saving mode and sleep mode. It serves as a timer to determine when to wake up the FC900E to receive signals in various power saving schemes, and to maintain basic logic operations when the module is in sleep mode. Table 13: Pin Definition of WLAN_SLP_CLK Pin Name Pin No. WLAN_SLP_CLK 24 I/O DI Description External 32.768 kHz low power clock input. The following are the recommended selection parameters for the recommended 32.768 kHz crystal:

Table 14: WLAN_SLP_CLK Parameter Recommendation Parameter Frequency Frequency accuracy Duty cycle Value 32.768 200 3070 Unit kHz ppm

Input signal amplitude 2003300 mV, p-p Signal type Square wave or sine wave

Input impedance Crystal load capacitance Clock jitter

> 100

< 5

< 10000 k pF ppm FC900E_Hardware_Design 24 / 49 Wi-Fi&Bluetooth Module Series 3.8. RF Antenna Interfaces ANT_WIFI0/BT is the RF antenna pin, and the RF port requires 50 characteristic impedance. 3.8.1. Operating Frequency The operating frequency of FC900E is shown in the following. Table 15: FC900E Operating Frequency Feature Frequency 2.4 GHz Wi-Fi 2.4122.484 5 GHz Wi-Fi 5.1805.825 BLE 5.0 2.4022.480 Unit GHz GHz GHz 3.8.2. Pin Definition of RF Antenna Interface Pin definitions of the antenna interface are shown in the following table:

Table 16: Pin Definition of RF Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_WIFI0/BT 2 AIO Wi-Fi0/Bluetooth antenna interface 50 impedance. 3.8.3. Reference Design FC900E module provides an RF antenna pin for Wi-Fi/Bluetooth antenna connection. The RF trace in host PCB connected to the modules RF antenna pin should be microstrip line or other types of RF trace, with characteristic impendence close to 50 . FC900E module comes with grounding pins which are next to the antenna pin to give a better grounding. A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a -type matching circuit for better RF performance. R1/C1/C2 shall be placed as close to the antenna as possible. Capacitors (C1/C2) are not mounted by default. FC900E_Hardware_Design 25 / 49 Wi-Fi&Bluetooth Module Series FC900E ANT_WIFI0/BT R1 0R C1 NM C2 NM Figure 10: Reference Design When using the PCB antenna on the module, place the module near the PCB of the mainboard. Ensure that the distance between the PCB of the mainboard and other metal components, connectors, PCB via holes, cabling, and copper coating is at least 16 mm. Ensure that all layers of the PCB area of the mainboard under the PCB antenna are cleared. 3.8.4. Reference Design of RF Routing For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 11: Microstrip Design on a 2-layer PCB FC900E_Hardware_Design 26 / 49 Wi-Fi&Bluetooth Module Series Figure 12: Coplanar Waveguide Design on a 2-layer PCB Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, the following principles should be complied with RF layout design:

Use impedance simulation tool to control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pins, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. FC900E_Hardware_Design 27 / 49 Wi-Fi&Bluetooth Module Series There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [1]. 3.8.5. Requirements for Antenna Design The antenna design requirements are as follows:

Table 17: Antenna Requirements Type Requirements Frequency Range VSWR Gain (dBi) Max Input Power (W) Input Impedance () 2.4122.484 GHz (cable insertion loss < 1 dB) 5.1505.875 GHz (cable insertion loss < 1 dB)

< 2 Typ. 1 50 50 Polarization Type Vertical FC900E_Hardware_Design 28 / 49 Wi-Fi&Bluetooth Module Series 3.8.6. RF Connector Recommendation If you use an RF connector for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 15: Dimensions of the Receptacle (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 16: Specifications of Mated Plugs FC900E_Hardware_Design 29 / 49 The following figure describes the space factor of mated connectors. Wi-Fi&Bluetooth Module Series Figure 17: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FC900E_Hardware_Design 30 / 49 Wi-Fi&Bluetooth Module Series 4 Electrical Characteristics & Reliability 4.1. General Description This chapter mainly introduces the electrical characteristics and radio frequency characteristics of FC900E, the specific content is as follows:

Absolute maximum ratings I/O interface characteristics Power consumption RF performance ESD protection Operating and storage temperature 4.2. Absolute Maximum Ratings Table 18: Absolute Maximum Ratings Parameter VBAT Digital I/O Input Voltage Min.

-0.3

-0.3 Max. 3.46 3.46 The following table shows the recommended operating conditions of the module. Table 19: Recommended Operating Conditions Parameter VBAT VIO Min. 3.13 1.71 Typ. 3.3 1.8/3.3 Max. 3.46 3.46 Unit V V Unit V V FC900E_Hardware_Design 31 / 49 Wi-Fi&Bluetooth Module Series 4.3. I/O Interface Characteristics The following table shows the general DC electrical characteristics over recommended operating conditions (unless otherwise specified). Table 20: General DC Electrical Characteristics Symbol Parameter Min. Max. Unit VIH VIL VOH VOL IiL High-level Input Voltage 0.7 VIO VIO + 0.2 Low-level Input Voltage

-0.3 0.3 VIO High-level Output Voltage 0.9 VIO VIO Low-level Output Voltage Input leakage current 0

-5 0.1 VIO 5 V V V V A 4.4. Power Consumption Table 21: Power Consumption of the Module Description Condition IWLAN3V3 IVIO Unit OFF state AT+QWIFI=0 Idle state AT+QWIFI=1 802.11b TX 1 Mbps TX 11 Mbps RX 1 Mbps RX 11 Mbps TX 6 Mbps 802.11g TX 54 Mbps RX 6 Mbps 0.35 36.28 343.48 313.83 49.82 49.38 301.60 193.76 49.19 178.40 2.96 6.08 6.07 6.04 6.03 6.61 6.05 6.03 A mA mA mA mA mA mA mA mA FC900E_Hardware_Design 32 / 49 802.11n (2.4 GHz) 802.11a 802.11n (5 GHz) RX 54 Mbps TX HT20-MCS0 TX HT20-MCS7 TX HT40-MCS0 TX HT40-MCS7 RX HT20-MCS0 RX HT20-MCS7 RX HT40-MCS0 RX HT40-MCS7 TX 6 Mbps TX 54 Mbps RX 6 Mbps RX 54 Mbps TX HT20-MCS0 TX HT20-MCS7 TX HT40-MCS0 TX HT40-MCS7 RX HT20-MCS0 RX HT20-MCS7 RX HT40-MCS0 RX HT40-MCS7 49.71 300.01 198.75 261.61 159.06 49.24 50.06 53.41 54.66 404.76 264.71 70.87 75.38 394.21 252.31 372.55 215.34 71.17 71.79 75.83 75.73 802.11ac TX VHT20 MCS0 393.99 TX VHT20 MCS8 245.02 TX VHT40 MCS0 358.76 TX VHT40 MCS9 197.73 Wi-Fi&Bluetooth Module Series 6.04 6.06 6.09 6.06 6.05 6.03 6.03 6.05 6.05 6.06 6.08 6.05 6.05 6.09 6.08 6.09 6.07 6.05 6.05 6.06 6.06 6.10 6.07 6.09 6.07 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA FC900E_Hardware_Design 33 / 49 Wi-Fi&Bluetooth Module Series TX VHT80 MCS0 324.33 TX VHT80 MCS9 182.54 RX VHT20 MCS0 RX VHT20 MCS8 RX VHT40 MCS0 RX VHT40 MCS9 RX VHT80 MCS0 RX VHT80 MCS9 71.11 71.84 75.67 75.84 84.70 82.86 6.08 6.07 6.05 6.05 6.06 6.06 6.07 6.07 mA mA mA mA mA mA mA mA 4.5. RF Performances 4.5.1. Wi-Fi Performance Table 22: Conducted RF Output Power at 2.4 GHz Standard Data Rate 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 Typ. 19 dBm 19 dBm 18 dBm 17 dBm 18 dBm 16 dBm 17 dBm 16 dBm Table 23: Conducted RF Output Power at 5 GHz Standard Data Rate Typ. FC900E_Hardware_Design 34 / 49 Wi-Fi&Bluetooth Module Series 802.11a 802.11a 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 802.11ac, VHT20 802.11ac, VHT20 802.11ac, VHT40 802.11ac, VHT40 802.11ac, VHT80 802.11ac, VHT80 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 MCS0 MCS9 Table 24: Conducted RF Receiving Sensitivity at 2.4 GHz Standard Data Rate 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 15 dBm 12 dBm 13.5 dBm 10 dBm 13.5 dBm 10 dBm 12.5 dBm 10 dBm 12 dBm 8.5 dBm 12 dBm 9 dBm Typ.

-94 dBm

-87 dBm

-89 dBm

-73 dBm

-89 dBm

-70 dBm

-86 dBm

-67.5 dBm Table 25: Conducted RF Receiving Sensitivity at 5 GHz Standard Data Rate Typ. FC900E_Hardware_Design 35 / 49 Wi-Fi&Bluetooth Module Series 802.11a 802.11a 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 802.11ac, VHT20 802.11ac, VHT20 802.11ac, VHT40 802.11ac, VHT40 802.11ac, VHT80 802.11ac, VHT80 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 MCS0 MCS9

-89.5 dBm

-73 dBm

-89 dBm

-70 dBm

-86.5 dBm

-67.5 dBm

-89 dBm

-66 dBm

-86 dBm

-61.5 dBm

-83.5 dBm

-58.5 dBm 4.5.2. BLE Performance The following table shows the BLE transmitting and receiving performance of FC900E module. Table 26: BLE Transmitting and Receiving Performance Channel Transmitting Power Receiving Sensitivity 0 19 39

(-3 2.5) dBm

(-2 2.5) dBm

(-3 2.5) dBm

-96 dBm

-95 dBm

-94 dBm 4.6. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the FC900E_Hardware_Design 36 / 49 development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Wi-Fi&Bluetooth Module Series Table 27: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity; Unit: kV) Tested Interfaces Contact Discharge Air Discharge VDD GND Antenna Interfaces 7 8 7 12 12 12 4.7. Operating and Storage Temperatures Table 28: Operating and Storage Temperatures (Unit: C) Parameter Operating temperature range 2 Storage temperature range Min.

-40

-40 Typ.

+25

Max.

+85

+95 2 To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules related performance can meet IEEE specifications. FC900E_Hardware_Design 37 / 49 Wi-Fi&Bluetooth Module Series 5 Mechanical Information This chapter describes the mechanical dimensions of FC900E. All dimensions are measured in millimeter

(mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. FC900E_Hardware_Design 38 / 49 5.1. Mechanical Dimensions Wi-Fi&Bluetooth Module Series Figure 18: Top and Side Dimensions (Top and Side View) FC900E_Hardware_Design 39 / 49 Wi-Fi&Bluetooth Module Series Figure 19: Bottom Dimension (Top View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FC900E_Hardware_Design 40 / 49 5.2. Recommended Footprint Wi-Fi&Bluetooth Module Series Figure 20: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FC900E_Hardware_Design 41 / 49 Wi-Fi&Bluetooth Module Series 6 Storage, Manufacturing & Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. FC900E_Hardware_Design 42 / 49 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 6.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18mm. For more details, see document [2]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Tem p. (C ) 246 235 217 200 150 100 S oak Z one A M ax slope: 1~3 C /s R eflow Z one M ax slope:

1~3 C /s C C ooling dow n slope:

-1.5 ~ -3 C /s B D Figure 21: Recommended Reflow Soldering Thermal Profile FC900E_Hardware_Design 43 / 49 Wi-Fi&Bluetooth Module Series Table 29: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 13 C/s 4070 s 235 C to 246 C

-1.5 to -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. FC900E_Hardware_Design 44 / 49 Wi-Fi&Bluetooth Module Series 6.3. Notification Please follow the principles below in the module application. 6.3.1. Coating If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 6.3.2. Cleaning Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6.4. Packaging Specifications The module adopts carrier tape packaging and details are as follow:

6.4.1. Carrier Tape Dimension details are as follow:

Figure 22: Carrier Tape Dimension Drawing FC900E_Hardware_Design 45 / 49 Wi-Fi&Bluetooth Module Series Table 30: Carrier Tape Dimension Table (Unit: mm) W 24 P 16 T A0 B0 0.35 12.4 12.4 K0 2.6 K1 3.6 F E 11.5 1.75 6.4.2. Plastic Reel Figure 23: Plastic Reel Dimension Drawing Table 31: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 24.5 6.4.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. FC900E_Hardware_Design 46 / 49 Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it. Wi-Fi&Bluetooth Module Series Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton and seal it. 1 carton can pack 2000 modules. Figure 24: Packaging Process FC900E_Hardware_Design 47 / 49 Wi-Fi&Bluetooth Module Series 7 Appendix References Table 32: Related Documents Document Name

[1] Quectel_RF_Layout_Application_Note

[2] Quectel_Module_SMT_Application_Note Table 33: Terms and Abbreviations Abbreviation Description AP BLE BPSK BT CCK CTS DQPSK GATT GND HT IEEE I/O Mbps QAM Access Point Bluetooth Low Energy Binary Phase Shift Keying Bluetooth Complementary Code Keying Clear To Send Differential Quadrature Reference Phase Shift Keying Generic Attribute Profile Ground High Throughput Institute of Electrical and Electronics Engineers Input/Output Million Bits Per Second Quadrature Amplitude Modulation FC900E_Hardware_Design 48 / 49 Wi-Fi&Bluetooth Module Series QPSK RF RoHS STA RTS RXD TBD TXD UART USB VIHmax VIHmin VILmax VILmin VOLmax VOHmin Vnom VSWR Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Spike-triggered average Request to Send Receive Data To Be Determined Transmit Data Universal Asynchronous Receiver/Transmitter Universal Serial Bus Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Maximum Low-level Output Voltage Minimum High-level Output Voltage Normal Voltage Voltage Standing Wave Ratio FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

is limited to OEM installation for mobile and fixed applications only. The 1. This Modular Approval antenna installation and operating configurations of including any applicable this transmitter, source-based timeaveraging duty factor, antenna gain, and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202210FC900E FC900E_Hardware_Design 49 / 49 Wi-Fi&Bluetooth Module Series 4. This module must not transmit simultaneously with any other antenna or transmitter 5. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. including portable configurations with respect is required for all other operating to 2.1093 and different antenna For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval configurations, configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR202210FC900E or Contains FCC ID: XMR202210FC900E must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes, or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. FC900E_Hardware_Design 50 / 49 Wi-Fi&Bluetooth Module Series Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. L exploitation est autorise aux deux conditions suivantes:

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-2022FC900E or where: 10224A-2022FC900E is the module s certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-2022FC900E " ou "o: 10224A-2022FC900E est le numro de certification du module". i.the device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;

iii. 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;

iv. Omnidirectional antenna is recommended CE Statement Regulatory Conformance for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band FC900E_Hardware_Design 51 / 49 Hereby, we (Quectel Wireless Solutions Co., Ltd.) declares that the radio equipment type FC900E series are in compliance with Directive 2014/53/EU. Wi-Fi&Bluetooth Module Series RF exposure This equipment complies with CE radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body. This device may be operated in all member states of the EU. Observe national and local regulations where the device is used. This device is restricted to indoor use only when operating in the 5150 to 5350 MHz,frequency range in the following countries:

UK Regulations Regulations 2017 (SI 2017/1206) Declaration of Conformity Quectel Wireless Solutions Co., Ltd. hereby declares that this Bluetooth and Wi-Fi functions, FC900E series are in compliance with the essential requirements and other relevant provisions of the UK Radio Equipment Regulations 2017 (SI 2017/1206). FC900E_Hardware_Design 52 / 49

QUELTEE. FCSOoE Q1-AXXXX FC900EABMD SN:E1149065G2XXXXX C UK Ela FCC ID:XMR202210FC900E IC 1D:10224A-2022FC900E Label Location

Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: XMR202210FC900E Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Exhibit Type

(1. Block Diagram.pdf; 2.SCH.pdf; 3. Operation Description.pdf; 4.BOM.pdf; 5. Tune up.pdf;) File Name

(Block Diagram, SCH, Operation Description, BOM, Tune Up Procedure) The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 45 days after the grant as outlined in Public Notice DA 04-1705. Exhibit Type

(External Photos, Internal Photos, Test Setup Photos, Manual) File Name

(Appendix A.4-External Photos.pdf; Appendix A.5-Internal Photos.pdf; Appendix A.2 -

DSS_DTS_NII Setup Photos; Appendix A.3 -

PCB Setup Photos; Manual;) Sincerely, Name: Jean Hu Title: Certification Manager Rev 11/20/07

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: Wi-Fi&Bluetooth Module Type designation: FC900E Quectel Trademark:

on our behalf. Date:

City:

Name:

Email:

2022/12/16.. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature:

. Notes:

(1): Required for FCC application

(2): For FCC it must be the Grantee Code owner or the authorized agent.

FCC FEDERAL COMMUNICATIONS COMMISSION Suppliers Declaration of Conformity (SDoC) Trademark(s) and Model(s): Quectel / FC900E Equipment: Wi-Fi&Bluetooth Module Manufacturer: Quectel Wireless Solutions Co., Ltd. FCC ID in case other parts of this equipment are subject to certification:

XMR202210FC900E This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1)

(2) this device may not cause harmful interference, and this device must accept any interference received, including interference that may cause undesired operation. The following test reports are subject to this declaration:

Test report number:

SEWA2210000062RG06 Issue date:

2022-12-15 The following manufacturer/importer/entity (located in the USA) is responsible for this declaration:

Date:

City:

Name:

Email:

2022/12/16.. Shanghai .. Jean hu .. jean.hu@quectel.com. Signature:

Quectel Wireless Solutions Co., Ltd Statement We Quectel Wireless Solutions Co., Ltd declare the following models. Product Name: Wi-Fi&Bluetooth Module Model Number: FC900E Hardware version: Refer to below table Model FC900E QCA1023-0 version V1.0 QCA9377-3 version V2.0 V1.0 and V2.0 share the similar HW and SW design, the difference is just as follow:

1. FC900E V1.0 version is QCA1023-0 version, FC900E V2.0 version is QCA9377-3 version 2.The RF chip is different, RF chip changed from QCA1023-0 to QCA9377-

3.for further description We hereby state that QCA9377-3 and QCA1023-0 are exactly pin to pin products derived from same silicon design but with different function set. QCA9377-3 is superset of Tufello contains all features it can support but QCA1023 is subset of Tufello to disable MU-MIMO and TxBF client mode for differentiation by silicon integrated OTP programming. As a result, there is no design difference from schematic and layout to other BOM related to the design. It is guaranteed the functionality other than difference mentioned above and performance both throughput and RF output/input are identical between QCA9377-3 and QCA1023-0. QCA1023-0 version full testQCA9377-3 version Spot check QCA1023-0 worse mode, The test plan reference is as follows Standard Part 15B Remark QCA1023-0 version full test QCA9377-3 version check worse Part15C/15E QCA1023-0 version full test QCA9377-3 version check power & rse worse mode Sincerely, Name:Jean Hu Date:2022/12/16 Title: Certification Manager Email: Jean.hu@quectel.com

RF_734_02 04 April 16 Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR202210FC900E Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. Answer from applicant Yes, please see exhibition external photos Yes, the modular has buffer modulation /data inputs 3. The modular transmitter must have its own power supply regulation. Yes, please see the SCH.pdf 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Yes, the requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, please refer to the setup photo exhibition for the stand-alone configuration Yes, the module will be label with its own FCC ID, and the instruction on the labelling rule of the end product has been stated in the user manual of this module. Please refer to the label and user manual exhibition. Yes, the required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):

Signature:

Date:

2022/12/16.. City:

Name:

Email:

Shanghai .. Jean hu .. jean.hu@quectel.com. Signature: