FCC ID: XMR2022FCM100D Wi-Fi&Bluetooth Module

FCM100D Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0 Date: 2022-10-24 Status: Released Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FCM100D_Hardware_Design 49 1 /

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Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or FCM100D_Hardware_Design 49 3 /

Wi-Fi&Bluetooth Module Series metal powders. FCM100D_Hardware_Design 49 4 /

Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description

1.0 2022-07-18 Soni RAO/Michael DU Creation of the document 2022-10-24 Kaiven MU First official release FCM100D_Hardware_Design 49 5 /

Wi-Fi&Bluetooth Module Series Contents Safety Information ........................................................................................................................................ 3 About the Document .................................................................................................................................... 5 Contents .........................................................................................................................................................6 Table Index .................................................................................................................................................... 8 Figure Index ...................................................................................................................................................9 1 2 Introduction ..........................................................................................................................................10 Special Mark ...............................................................................................................................10 1.1. Product Concept ................................................................................................................................. 11 2.1. General Description ....................................................................................................................11 Key Features .............................................................................................................................. 11 2.2. Functional Diagram .................................................................................................................... 13 2.3. EVB .............................................................................................................................................13 2.4. 3.6.1. 3 Application Interfaces .........................................................................................................................14 3.1. General Description ....................................................................................................................14 Pin Assignment ...........................................................................................................................15 3.2. Pin Description ........................................................................................................................... 16 3.3. 3.4. Power Supply Design ................................................................................................................. 18 3.5. Reset .......................................................................................................................................... 19 3.6. Wireless Connectivity Interfaces ................................................................................................20 UART Interfaces ..............................................................................................................20 3.7. GPIO Interfaces ..........................................................................................................................22 3.8. RF Antenna Interface ................................................................................................................. 23 3.8.1. Operating Frequency ...................................................................................................... 23 RF Antenna Pin Description (Optional) .......................................................................... 23 3.8.2. Reference Design of RF Layout (Optional) ......................................................... 24 3.8.3. On Board PCB Antenna .................................................................................................. 26 IPEX Connector (Optional) ............................................................................................. 26 3.8.4. Antenna Cable and Antenna Requirements ...................................................................29 3.8.5. 3.8.2.1. 4 Reliability, Radio and Electrical Characteristics .............................................................................30 Absolute Maximum Ratings ....................................................................................................... 30 4.1. 4.2. Power Supply Ratings ................................................................................................................30 4.3. Digital I/O Characteristics ...........................................................................................................31 Power Consumption ................................................................................................................... 31 4.4. Power Consumption in Low Power Modes .....................................................................31 Power Consumption in Normal Operating Modes ..........................................................32 4.5. RF Performances ....................................................................................................................... 33 4.5.1. Wi-Fi Performances .........................................................................................................33 4.4.1. 4.4.2. FCM100D_Hardware_Design 49 6 /

Wi-Fi&Bluetooth Module Series 4.5.2. BLE Performances .......................................................................................................... 34 4.6. ESD Protection ........................................................................................................................... 34 4.7. Operating and Storage Temperatures .......................................................................................35 5 Mechanical Information ...................................................................................................................... 36 5.1. Mechanical Dimensions ............................................................................................................. 36 5.2. Recommended Footprint ............................................................................................................39 Top and Bottom Views ............................................................................................................... 40 5.3. 6 Storage, Manufacturing and Packaging ........................................................................................... 41 Storage Conditions .....................................................................................................................41 6.1. 6.2. Manufacturing and Soldering ..................................................................................................... 42 Packaging Specifications ........................................................................................................... 44 6.3. Carrier Tape .................................................................................................................... 44 Plastic Reel ......................................................................................................................45 Packaging Process ..........................................................................................................46 6.3.1. 6.3.2. 6.3.3. 7 Appendix References ......................................................................................................................... 47 FCM100D_Hardware_Design 49 7 /

Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark ......................................................................................................................................... 10 Table 2: Key Features ........................................................................................................................................ 11 Table 3: I/O Parameter Description .................................................................................................................... 16 Table 4: Pin Description ..................................................................................................................................... 16 Table 5: Pin Definition of Power Supply and GND Pins .....................................................................................18 Table 6: Pin Definition of Reset Pin ....................................................................................................................19 Table 7: Pin Definition of UART Interfaces .........................................................................................................21 Table 8: Pin Definition of GPIO Interfaces ......................................................................................................... 22 Table 9: FCM100D Operating Frequency .......................................................................................................... 23 Table 10: Antenna Pin Definition ........................................................................................................................ 23 Table 11: On Board PCB Antenna Characteristics ............................................................................................ 26 Table 12: Antenna Cable Requirement .............................................................................................................. 29 Table 13: Antenna Requirement .........................................................................................................................29 Table 14: Absolute Maximum Ratings ................................................................................................................30 Table 15: Module Power Supply Ratings ........................................................................................................... 30 Table 16: Digital I/O Requirements .................................................................................................................... 31 Table 17: Power Consumption in Low Power Modes ........................................................................................ 31 Table 18: Power Consumption in Normal Operating Modes ..............................................................................32 Table 19: 2.4 GHz Wi-Fi Conducted Output Power ........................................................................................... 33 Table 20: 2.4 GHz Wi-Fi Conducted Receive Sensitivity ................................................................................... 33 Table 21: 2.4 GHz Wi-Fi OTA TRP Test ............................................................................................................ 33 Table 22: 2.4 GHz Wi-Fi OTA TIS ...................................................................................................................... 34 Table 23: BLE Conducted Mode Output Power / Receive Sensitivity ................................................................34 Table 24: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) ..............................................................34 Table 25: Operating and Storage Temperatures (Unit: C) ................................................................................35 Table 26: Recommended Thermal Profile Parameters ......................................................................................43 Table 27: Carrier Tape Dimension Table (Unit: mm) ......................................................................................... 44 Table 28: Plastic Reel Dimension Table (Unit: mm) .......................................................................................... 45 Table 29: Reference Documents ........................................................................................................................47 Table 30: Terms and Abbreviations ................................................................................................................... 47 FCM100D_Hardware_Design 49 8 /

Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ............................................................................................................................. 13 Figure 2: Pin Assignment (Top View) .................................................................................................................15 Figure 3: VBAT Reference Circuit ...................................................................................................................... 18 Figure 4: Power-up Timing ................................................................................................................................. 19 Figure 5: Reference Circuit of CEN by Using Driving Circuit ............................................................................. 20 Figure 6: Reference Circuit of CEN by Using Button ......................................................................................... 20 Figure 7: Timing of Resetting the Module .......................................................................................................... 20 Figure 8: Main UART Connection Diagram ........................................................................................................21 Figure 9: Debug UART Reference Circuit .......................................................................................................... 22 Figure 10: RF Antenna Reference Design ......................................................................................................... 24 Figure 11: Microstrip Design on a 2-layer PCB ..................................................................................................24 Figure 12: Coplanar Waveguide Design on a 2-layer PCB ................................................................................25 Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ............................ 25 Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ............................ 25 Figure 15: IPEX Connector Size .........................................................................................................................27 Figure 16: IPEX Connector Size .........................................................................................................................27 Figure 17: Plug Size to match IPEX Connector ................................................................................................. 28 Figure 18: RF Connectors assembling ...............................................................................................................28 Figure 19: Module Top and Side Dimensions for FCM100D_PCB_Antenna .................................................... 36 Figure 20: Module Top and Side Dimensions for FCM100D_IPEX ................................................................... 37 Figure 21: Module Top and Side Dimensions for FCM100D_LCC .................................................................... 37 Figure 22: Module Dimension (Bottom View) .....................................................................................................38 Figure 23: Recommended Footprint (Top View) ................................................................................................ 39 Figure 24: Top and Bottom Views of the Module ............................................................................................... 40 Figure 25: Recommended Reflow Soldering Thermal Profile ............................................................................42 Figure 26: Carrier Tape Dimension Drawing ......................................................................................................44 Figure 27: Plastic Reel Dimension Drawing ....................................................................................................... 45 Figure 28: Packaging Process ............................................................................................................................46 FCM100D_Hardware_Design 49 9 /

Wi-Fi&Bluetooth Module Series 1 Introduction This document defines the FCM100D and describes its air interface and hardware interfaces which are connected with your application. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. 1.1. Special Mark Table 1: Special Mark Mark Definition

When an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin name, AT command, or argument is under development and currently not supported, unless otherwise specified. FCM100D_Hardware_Design 49 10 /

Wi-Fi&Bluetooth Module Series 2 Product Concept 2.1. General Description FCM100D is a low-power, cost-effective Bluetooth 5.2 and IEEE 802.11b/g/n module, which integrates the hardware and software resources required for Wi-Fi and Bluetooth applications. It can support AP and STA of Wi-Fi connection, and low-power Bluetooth connection. is very suitable for low-speed applications and data acquisition applications such as home intelligent terminal, industrial application and so on. It FCM100D has a built-in Wi-Fi and Bluetooth ultra-high integration microcontroller, which provides the necessary ability to calculate and stable Wi-Fi and Bluetooth connectivity for IoT data terminals. It includes:

120 MHz ARM kernel 256 KB RAM 2 MB Flash Complies with IEEE 802.11b/g/n and Bluetooth 5.2 standards FCM100D offers 3.3V single power supply with 25 LCC pins , offering a compact size 16mm 24mm2.6mm 2.2. Key Features The following table describes the key features of FCM100D. Table 2: Key Features Features Details Power Supply Operating Frequency VBAT Power Supply:

Supply voltage range: 3.03.6 V Typical supply voltage: 3.3 V Wi-Fi: 2.4122.484 GHz Bluetooth: 2.4022.480 GHz FCM100D_Hardware_Design 49 11 /

Wi-Fi Transmission Data Rates Wi-Fi Transmitting Power Wi-Fi&Bluetooth Module Series 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS0MCS7) 2.4 GHz:

802.11b/11 Mbps: 16 dBm 802.11g/54 Mbps: 14 dBm 802.11n/HT20 MCS7: 13 dBm Wi-Fi Protocol Features IEEE 802.11b/g/n Wi-Fi Modulation CCK, BPSK, QPSK,16QAM, 64QAM Wi-Fi Operation Mode AP STA Bluetooth Protocol Feature GATT Bluetooth Operation Mode BLE Bluetooth Modulation GFSK Wireless Application Interfaces Antenna Interface Physical Characteristics Temperature Range Main UART: Used for AT command communication, data transmission and firmware upgrade Debug UART: Used for the output of partial logs SPI*: Supports one SPI interface and master and slave modes PCB antenna IPEX antenna (Optional) Wi-Fi/Bluetooth antenna interface (ANT_WIFI/BT), 50 impedance

(Optional) Package: LCC Weight: TBD Size: (16.0 0.2) mm (24.0 0.2) mm (2.6 0.2) mm Operating temperature range 1: -40 C to +85 C Storage temperature range: -45 C to +95 C RoHS All hardware components are fully compliant with EU RoHS directive 1 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. FCM100D_Hardware_Design 49 12 /

Wi-Fi&Bluetooth Module Series 2.3. Functional Diagram The following figure shows a block diagram of FCM100D. Figure 1: Functional Diagram NOTE FCM100D supports PCB antenna by default; IPEX antenna and ANT_WIFI/BT are optional. 2.4. EVB Quectel supplies an evaluation board (FCM100D TE-B) with accessories to control or test the module. For more details, see document [1]. FCM100D_Hardware_Design 49 13 /

Wi-Fi&Bluetooth Module Series 3 Application Interfaces 3.1. General Description The FCM100D has 25 LCC pins. The following interfaces are described in detail in subsequent chapters:

Power supply Module reset Wireless connectivity interfaces

- UART interfaces GPIO interfaces RF antenna interface FCM100D_Hardware_Design 49 14 /

3.2. Pin Assignment Wi-Fi&Bluetooth Module Series Figure 2: Pin Assignment (Top View) NOTE Keep all RESERVED and unused pins open. FCM100D_Hardware_Design 49 15 /

Wi-Fi&Bluetooth Module Series 3.3. Pin Description The following tables show the pin description of module. Table 3: I/O Parameter Description Type AIO DI DIO DO PI Description Analog Input/Output Digital Input Digital Input/Output Digital Output Power Input Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment Power supply for the module Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V It must be provided with sufficient current up to 0.3 A. VBAT 10 PI GND Reset 1, 17, 25 Pin Name Pin No. I/O Description DC Characteristics Comment CEN RST 5 3 DI Enable the module DI Reset the module Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V FCM100D_Hardware_Design 49 Internally pulled up to 3.3 V. Hardware enabling;

Compatible with other module designs. Internally pulled up to 3.3 V. Reset the module 16 /

Wi-Fi&Bluetooth Module Series Main UART Pin Name Pin No. I/O Description DC Characteristics Comment 24 23 19 16 MAIN_TXD MAIN_RXD Debug UART DBG_TXD DBG_RXD GPIO Interface DO DI DO DI Main UART transmits Main UART receives Debug UART transmits Debug UART receives 3.3 V 3.3 V Pin Name Pin No. I/O Description DC Characteristics Comment GPIO23 GPIO14 GPIO26 GPIO24 GPIO6 GPIO16 GPIO9 GPIO21 GPIO8 GPIO7 4 6 7 8 9 15 18 20 21 22 DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output 3.3 V GPIO26/GPIO24/G PIO6/GPIO9/GPIO 8/GPIO7 can also be used for PWM GPIO4/GPIO26/GP IO24/GPIO21 can also be used for ADC. RF Antenna Interface Pin Name Pin No. I/O Description DC Characteristics Comment ANT_WIFI/BT 2 AIO Wi-Fi/Bluetooth antenna interface 50 impedance. FCM100D_Hardware_Design 49 17 /

Wi-Fi&Bluetooth Module Series RESERVED Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED 1112 1314 RESERVED Keep it open. 3.4. Power Supply Design The following table shows the definition of power supply pin and ground pins of FCM100D. Table 5: Pin Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT GND 10 Power supply 3.0 3.3 3.6 V 1, 17, 25 Ground FCM100D is powered by VBAT, and it is recommended to use a power supply chip that can provide at least 0.3 A output current. To ensure better power supply performance, it is recommended to parallel 22 F decoupling capacitor, and 1 F and 100 nF filter capacitor near the modules VBAT pin. Meanwhile, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT line is, the wider it should be. VBAT reference circuit is shown as below:

Figure 3: VBAT Reference Circuit FCM100D_Hardware_Design 49 18 /

Wi-Fi&Bluetooth Module Series After the module VBAT is powered on, keep the CEN pin at high level to realize the automatic startup of the module. Figure 4: Power-up Timing Cut off the power supply of VBAT, the module will automatically execute power-off procedure. 3.5. Reset Drive RST low for at least 100 ms and then release it to reset the module. Table 6: Pin Definition of Reset Pin Pin Name Pin No. Description Comment RST 3 Reset the module ; Active at low level . Pulled up to 3.3 V internally. The reference designs for resetting the module are shown below. An open drain/collector driving circuit or a button can be used to control the RST pin. FCM100D_Hardware_Design 49 19 /

Wi-Fi&Bluetooth Module Series Figure 5: Reference Circuit of CEN by Using Driving Circuit Figure 6: Reference Circuit of CEN by Using Button The reset scenario is illustrated in the following figure. Figure 7: Timing of Resetting the Module 3.6. Wireless Connectivity Interfaces 3.6.1. UART Interfaces The module provides two UART interfaces: the main UART and the debug UART. The module is used as FCM100D_Hardware_Design 49 20 /

DCE (Data Communication Equipment), and is connected in the traditional DCE-DTE (Data Terminal Equipment) mode. Wi-Fi&Bluetooth Module Series Table 7: Pin Definition of UART Interfaces Pin Name Pin No. MAIN_TXD MAIN_RXD DBG_TXD DBG_RXD 24 23 19 16 I/O DO DI DO DI Description Main UART transmits data Main UART receives data Debug UART transmits data Debug UART receives data The main UART can be used for AT command communication and data transmission. The default baud rate is 115200 bps, and the maximum baud rate can reach 2 Mbps. The main UART is also available for firmware upgrade and supports a default baud rate of 921600 bps. The following is the schematic diagram of the main UART interface connection between DCE and DTE. Figure 8: Main UART Connection Diagram The debug UART interface supports 115200 bps baud rate by default, and is used for the output of partial logs. The following is a reference design of debug UART. FCM100D_Hardware_Design 49 21 /

Wi-Fi&Bluetooth Module Series Figure 9: Debug UART Reference Circuit 3.7. GPIO Interfaces FCM100D provides 10 GPIO interfaces by default. The following table shows the pin description of GPIO. Table 8: Pin Definition of GPIO Interfaces Pin Name Pin No. I/O Description Comment GPIO23 GPIO14 GPIO26 GPIO24 GPIO6 GPIO16 GPIO9 GPIO21 GPIO8 GPIO7 4 6 7 8 9 15 18 20 21 22 DIO General-purpose input/output Wake-up interrupt. FCM100D_Hardware_Design 49 22 /

Wi-Fi&Bluetooth Module Series 3.8. RF Antenna Interface FCM100D provides PCB antenna, IPEX connector and ANT_WIFI/BT (stamp hole). The IPEX connector is not mounted on the module when using PCB antenna or ANT_WIFI/BT. FCM100D supports PCB antenna by default; IPEX antenna and ANT_WIFI/BT are optional. 3.8.1. Operating Frequency The operating frequency of FCM100D is shown in the table below:

Table 9: FCM100D Operating Frequency Mode Frequency 2.4 GHz Wi-Fi 2.4122.484 Bluetooth 2.4022.480 Unit GHz GHz 3.8.2. RF Antenna Pin Description (Optional) RF Antenna pin description is as below:

Table 10: Antenna Pin Definition Pin Name Pin No. I/O Description Comment ANT_WIFI/BT 2 AIO Wi-Fi/Bluetooth antenna interface 50 impedance. The circuit of RF antenna interface is shown below. In order to achieve better RF performance, it is necessary to reserve matching circuit. Matching components such as R1, C1, C2 should be placed as close to the antenna as possible, C1, C2 are not mounted by default. FCM100D_Hardware_Design 49 23 /

Wi-Fi&Bluetooth Module Series Figure 10: RF Antenna Reference Design When using the PCB antenna on the module, the module should be placed on the PCB edge of the main board as far as possible. The clearance distance between the PCB antenna and the GND of the main board should be at least 3 mm. At the same time, it is necessary to ensure that the distance between the main board PCB and other metal devices, connectors, PCB vias, wiring, and copper coating is at least 16 mm. All layers of the main board PCB area below the PCB antenna need clearance. For details, please refer to the PCB design of FCM100D TE-B 3.8.2.1. Reference Design of RF Layout (Optional) The characteristic impedance of all RF traces on your PCB should be controlled at 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). The microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs for microstrip or coplanar waveguide transmission lines with different PCB structures. Figure 11: Microstrip Design on a 2-layer PCB FCM100D_Hardware_Design 49 24 /

Wi-Fi&Bluetooth Module Series Figure 12: Coplanar Waveguide Design on a 2-layer PCB Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, the following principles should be complied with in RF layout design:

FCM100D_Hardware_Design 49 25 /

Wi-Fi&Bluetooth Module Series Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [2]. 3.8.3. On Board PCB Antenna Table 11: On Board PCB Antenna Characteristics Characters Frequency Impedance VSWR Gain Efficiency Min. 2400

Typ.

50

-1.81 35 %

Max. 2500

3

Unit MHz

dBi

3.8.4. IPEX Connector (Optional) 1:The mechanic size of FCM100D is as follows. the IPEX connector (MPN: U.FL-R-SMT-1(80), MHF 1L) provided by the FCM100D_Hardware_Design 49 26 /

Wi-Fi&Bluetooth Module Series Figure 15: IPEX Connector Size 2RF Connector recommended to use. U.FL-R-SMT connectors of Hirose have a high priority Figure 16: IPEX Connector Size FCM100D_Hardware_Design 49 27 /

Wi-Fi&Bluetooth Module Series UFL-LP series connectors are chosen to match U.FL-R-SMT. Figure 17: Plug Size to match IPEX Connector The image shown below is the size of assembling the two connectors. Figure 18: RF Connectors assembling FCM100D_Hardware_Design 49 28 /

Wi-Fi&Bluetooth Module Series 3.8.5. Antenna Cable and Antenna Requirements Table 12: Antenna Cable Requirement Frequency Requirement 2.4122.484 GHz Insertion loss <1 dB Table 13: Antenna Requirement Type Frequency VSWR Gain (dBi) Max. input power (W) Input impedance () Requirement 2.4122.484 GHz

< 2 Typ. 1 50 50 Polarization type Vertical FCM100D_Hardware_Design 49 29 /

Wi-Fi&Bluetooth Module Series 4 Reliability, Radio and Electrical Characteristics 4.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 14: Absolute Maximum Ratings Parameter VBAT I/O input voltage Min.

-0.3

-0.3 Max. 3.9 3.9 Unit V V 4.2. Power Supply Ratings Table 15: Module Power Supply Ratings Parameter VBAT Min. 3.0 Typ. 3.3 Max. 3.6 Unit V FCM100D_Hardware_Design 49 30 /

Wi-Fi&Bluetooth Module Series 4.3. Digital I/O Characteristics Table 16: Digital I/O Requirements Parameter Description Min. Max. Unit VIH VIL VOH VOL IiL High Level Input Voltage 0.7 VBAT VBAT + 0.2 Low Level Input Voltage

-0.3 0.3 VBAT High Level Output Voltage 0.9 VBAT VBAT Low Level Output Voltage Input Leakage Current 0

-5 V V V V 0.1 VBAT 5 A Unit A A mA 4.4. Power Consumption 4.4.1. Power Consumption in Low Power Modes Table 17: Power Consumption in Low Power Modes Parameter Description Deep sleep mode Standby mode Idle state Typ. 8.6 110 AT+QDEEPSLEEP can set the module to deep sleep mode. In this case, the serial stop working and software settings are not saved. interfaces AT+QLOWPOWER can set the module to standby mode. In this case, the serial interfaces stop working but software settings can be saved. Neither Wi-Fi nor Bluetooth does any operation. 22.74 FCM100D_Hardware_Design 49 31 /

Wi-Fi&Bluetooth Module Series 4.4.2. Power Consumption in Normal Operating Modes Table 18: Power Consumption in Normal Operating Modes Parameter Description Wi-Fi Scan Scan in every 2 s Typ. 68.59 Wi-Fi Connected Data Transmission Bluetooth Connected RF Non-signaling Mode STA mode is ON, but no STA device is connected 74.52 SoftAP mode is ON, and 1 STA device is connected SoftAP mode is ON, and 2 STA devices is connected SoftAP mode is ON, but no STA device is connected SoftAP mode data transmission STA mode data transmission SoftAP mode + BLE Server mode data transmission 77.11 77.29 77.09 155.29 147.81 157.56 STA mode + BLE Server mode data transmission 149.66 Receive data as Server Transmit data as Server Receive data as Client Transmit data as Client 802.11b Tx (2.4 GHz) 1 Mbps 802.11b Tx (2.4 GHz) 11 Mbps 802.11g Tx (2.4 GHz) 6 Mbps 802.11g Tx (2.4 GHz) 54 Mbps 802.11n Tx (2.4 GHz) HT20 MCS0 802.11n Tx (2.4 GHz) HT20 MCS7 28.41 28.39 23.68 23.68 91 92 90 88 89 88 Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA FCM100D_Hardware_Design 49 32 /

Wi-Fi&Bluetooth Module Series 4.5. RF Performances 4.5.1. Wi-Fi Performances Table 19: 2.4 GHz Wi-Fi Conducted Output Power Operating Mode Rate Min. (dBm) Typ. (dBm) 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS0 MCS7 14 14 13 12 12 11 Table 20: 2.4 GHz Wi-Fi Conducted Receive Sensitivity Operating Mode 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS0 MCS7 Table 21: 2.4 GHz Wi-Fi OTA TRP Test Operating Mode 802.11b 802.11b 802.11g Rate 1 Mbps 11 Mbps 6 Mbps FCM100D_Hardware_Design 49 16 16 15 14 14 13 Typ. (dBm)

-96

-87

-89

-72

-89

-70 Typ. (dBm) 15 15 14 33 /

802.11g 802.11n, HT20 802.11n, HT20 Table 22: 2.4 GHz Wi-Fi OTA TIS Operating Mode 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 54 Mbps MCS0 MCS7 Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS0 MCS7 Wi-Fi&Bluetooth Module Series 13 13 12 Typ. (dBm)

-94

-85

-88

-71

-86

-66 4.5.2. BLE Performances Table 23: BLE Conducted Mode Output Power / Receive Sensitivity Operating Mode Output Power (Typ.) Receive Sensitivity (Typ.) BLE (1 MHz) 6

-95 Unit dBm 4.6. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 24: ESD Characteristics (Temperature: 25 C, Humidity: 45 %) Tested Interfaces Contact Discharge Air Discharge Unit FCM100D_Hardware_Design 49 34 /

Wi-Fi&Bluetooth Module Series VBAT, GND ANT_WIFI/BT 4 4 Other Interfaces 0.5 8 8 1 kV kV kV 4.7. Operating and Storage Temperatures Table 25: Operating and Storage Temperatures (Unit: C) Parameter Operating Temperature Range 2 Storage Temperature Range Min.

-40

-45 Typ.

+25

Max.

+105

+115 2 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. FCM100D_Hardware_Design 49 35 /

Wi-Fi&Bluetooth Module Series 5 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions Figure 19: Module Top and Side Dimensions for FCM100D_PCB_Antenna FCM100D_Hardware_Design 49 36 /

Wi-Fi&Bluetooth Module Series Figure 20: Module Top and Side Dimensions for FCM100D_IPEX Figure 21: Module Top and Side Dimensions for FCM100D_LCC FCM100D_Hardware_Design 49 37 /

Wi-Fi&Bluetooth Module Series Pin 1 Figure 22: Module Dimension (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. FCM100D_Hardware_Design 49 38 /

5.2. Recommended Footprint Wi-Fi&Bluetooth Module Series Figure 23: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCM100D_Hardware_Design 49 39 /

Wi-Fi&Bluetooth Module Series 5.3. Top and Bottom Views Figure 24: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCM100D_Hardware_Design 49 40 /

Wi-Fi&Bluetooth Module Series 6 Storage, Manufacturing and Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. FCM100D_Hardware_Design 49 41 /

Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 6.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [3]. The recommended reflow temperature should be 238246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is suggested that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 25: Recommended Reflow Soldering Thermal Profile FCM100D_Hardware_Design 49 42 /

Wi-Fi&Bluetooth Module Series Table 26: Recommended Thermal Profile Parameters Factor Soak Zone Max. slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max. slope Reflow time (D: over 217 C) Max. temperature Cooling down slope Reflow Cycle Max. reflow cycle NOTE 13 C/s 4070 s 238 C to 246 C

-1.5 to -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 information on the shielding can is still hours Neutral Salt Spray test, the laser engraved label clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. 4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3]. FCM100D_Hardware_Design 49 43 /

Wi-Fi&Bluetooth Module Series 6.3. Packaging Specifications The module adopts carrier tape packaging and details are as follow:

6.3.1. Carrier Tape Dimension details are as follow:

Figure 26: Carrier Tape Dimension Drawing Table 27: Carrier Tape Dimension Table (Unit: mm) W 44 P 24 T 0.4 A0 B0 16.4 24.4 K0 3.1 K1 F E 4.65 20.2 1.75 FCM100D_Hardware_Design 49 44 /

6.3.2. Plastic Reel Wi-Fi&Bluetooth Module Series Figure 27: Plastic Reel Dimension Drawing Table 28: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 FCM100D_Hardware_Design 49 45 /

6.3.3. Packaging Process Wi-Fi&Bluetooth Module Series Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 28: Packaging Process FCM100D_Hardware_Design 49 46 /

Wi-Fi&Bluetooth Module Series 7 Appendix References Table 29: Reference Documents Document Name

[1] Quectel_FCM100D_TE-B_User_Guide

[2] Quectel_RF_LAYOUT_Application_Note

[3] Quectel_Module_SMT_Application_Note Table 30: Terms and Abbreviations Abbreviation Description AP BLE BPSK CCK CTS DPSK Access Point Bluetooth Low Energy Binary Phase Shift Keying Complementary Code Keying Clear To Send Differential Phase Shift Keying DQPSK Differential Quadrature Reference Phase Shift Keying ESD GATT GFSK GND HT IEEE I/O Mbps Electrostatic Discharge Generic Attribute Profile Gauss Frequency Shift Keying Ground High Throughput Institute of Electrical and Electronics Engineers Input/Output Megabits per second FCM100D_Hardware_Design 49 47 /

Wi-Fi&Bluetooth Module Series MPN QAM QPSK RF RH RoHS STA RTS RXD SDIO TBD TXD UART USB VHT VIHmax VIHmin VILmax VILmin VOLmax VOHmin Vnom VSWR Manufacturer Part Number Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Relative Humidity Restriction of Hazardous Substances Station Request to Send Receive Data (Pin) Secure Digital Input and Output Card To Be Determined Transmit Data (Pin) Universal Asynchronous Receiver/Transmitter Universal Serial Bus Very High Throughput Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Maximum Low-level Output Voltage Minimum High-level Output Voltage Normal Voltage Value Voltage Standing Wave Ratio FCM100D_Hardware_Design 49 48 /

Wi-Fi&Bluetooth Module Series CE Statement The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. Hereby, We, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type BG951A-GL is in compliance with the Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address:

Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China https://www.quectel.com. The device operates with the following frequency bands and transmitting power:

Band Rx (MHz) Tx (MHz) The Maximum (EIRP) Transmitted Power (dBm) Bluetooth LE 2400 ~ 2483.5 2400 ~ 2483.5 4.97 dBm Wi-Fi 2.4G 2400 ~ 2483.5 2400 ~ 2483.5 18.25 dBm FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2022FCM100D. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth LE:-1dBi Wi-Fi 2.4G:-1dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. FCM100D_Hardware_Design 49 49 /

Wi-Fi&Bluetooth Module Series For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR2022FCM100D or Contains FCC ID: XMR2022FCM100D must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. FCM100D_Hardware_Design 49 50 /

Wi-Fi&Bluetooth Module Series IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth LE:-1dBi Wi-Fi 2.4G:-1dBi The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-22FCM100D or where: 10224A-22FCM100D is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:"Contient IC: 10224A-2021BG951A " ou "o: 10224A-2021BG951A est le numro de certification du module. FCM100D_Hardware_Design 49 51 /

Wi-Fi&Bluetooth Module Series FCM100D_Hardware_Design 49 52 /

QUECTEL FCM100D Q1-AKOKXK FCM100DACMD eee c Eee FCC IDSXMR2022FCM 100D5""" oe"

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Quectel Wireless Solutions Co., Ltd February 20, 2023 Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: Attestation Statements Part 2.911(d)(5)(i) request for FCC IDXMR2022FCM100D

[Quectel Wireless Solutions Co., Ltd] (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincerely, Applicant signature Applicant printed nameJean Hu Quectel Wireless Solutions Co., Ltd February 20, 2023 Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: Attestation Statements Part 2.911(d)(5)(ii) request for FCC IDXMR2022FCM100D

[Quectel Wireless Solutions Co., Ltd] (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincerely, Applicant signature Applicant printed nameJean Hu

Quectel Wireless Solutions Co., Ltd

(January 9, 2023) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: LETTER OF AGENT AUTHORIZATION To Whom It May Concern:

We, the undersigned, hereby authorize (SunYue at TA Technology(Shanghai) Co., Ltd.) to act on our behalf in all matters relating to application for equipment authorization, including the signing of all documents relating to these matters. We also hereby certify that no party to the application authorized hereunder is subject to the denial of benefits, including FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C.853(a). This agreement expires one year from the current date. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Co., Ltd