AF31G Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.1 Date: 2022-07-19 Status: Preliminary Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
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Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series metal powders. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description
2022-06-23 Barret XIONG/Logan ZHANG Creation of the document 1.0.0 2022-06-23 Barret XIONG/Logan ZHANG Preliminary 1.0.1 2022-07-19 Barret XIONG Preliminary 1. Updated the pin names: 20, 21, 24, 25, 27, 28, 58, 59, 60, 61, 62, 63 2. Updated the Pin Assignment
(Figure 2) 3. Updated the weight of AF31G
(Table 2) 4. Updated the SDIO routing requirements (Chapter 4.1.1.2) 5. Updated the packaging information (Chapter 8.3) 6. Updated the Absolute Maximum Ratings of VDD_IO (Table 23) AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Contents Safety Information ........................................................................................................................................3 About the Document ....................................................................................................................................5 Contents ........................................................................................................................................................ 6 Table Index ....................................................................................................................................................8 Figure Index .................................................................................................................................................. 9 1 Introduction .............................................................................................................................................10 1.1. Special Mark .................................................................................................................................. 10 2 Product Overview ................................................................................................................................... 11 2.1. Key Features ................................................................................................................................. 12 2.2. Functional Diagram ....................................................................................................................... 13 2.3. Pin Assignment ..............................................................................................................................14 2.4. Pin Description ...............................................................................................................................15 3 Operating Characteristics ..................................................................................................................... 19 3.1. Power Supply .................................................................................................................................19 3.1.1. Power Supply Pins ..............................................................................................................19 3.1.2. Reference Design for Power Supply .................................................................................. 19 3.1.3. Timing of Turning on the Module ........................................................................................21 4 Application Interfaces ............................................................................................................................22 4.1. Wireless Connection Interface ...................................................................................................... 22 4.1.1. Wi-Fi Application Interface ..................................................................................................22 4.1.1.1. PCIe Interface ........................................................................................................... 22 4.1.1.2. SDIO Interface .......................................................................................................... 24 4.1.1.3. WLAN_EN .................................................................................................................25 4.1.2. Bluetooth Application Interface ...........................................................................................26 4.1.2.1. PCM Interface ........................................................................................................... 26 4.1.2.2. BT_EN .......................................................................................................................27 4.1.2.3. BT_UART ..................................................................................................................27 4.2. Coexistence UART ........................................................................................................................ 28 4.3. WLAN_SLP_CLK ...........................................................................................................................28 5 RF Specifications ................................................................................................................................... 29 5.1. RF Antenna ....................................................................................................................................29 5.1.1. Antenna Interface & Frequency Bands .............................................................................. 29 5.1.2. Reference Design ............................................................................................................... 29 5.2. RF Performances ...........................................................................................................................30 5.2.1. Conducted RF Performance of Wi-Fi ................................................................................. 30 5.2.2. Conducted RF Performance of BLE ...................................................................................32 5.3. Reference Design of RF Routing .................................................................................................. 33 AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 5.4. Antenna Requirements ..................................................................................................................34 5.5. RF Connector Recommendation ...................................................................................................35 6 Electrical Characteristics & ...................................................................................................................37 7 Reliability .................................................................................................................................................38 7.1. Absolute Maximum Ratings ...........................................................................................................38 7.2. Digital I/O Characteristic ................................................................................................................38 7.3. Power Consumption ...................................................................................................................... 39 7.3.1. Wi-Fi Power Consumption .................................................................................................. 39 7.3.2. BLE Power Consumption ....................................................................................................40 7.4. ESD Protection .............................................................................................................................. 41 7.5. Thermal Dissipation .......................................................................................................................41 7.6. Operating and Storage Temperatures .......................................................................................... 42 8 Mechanical Information ......................................................................................................................... 43 8.1. Mechanical Dimensions ................................................................................................................ 43 8.2. Recommended Footprint ...............................................................................................................45 8.3. Top and Bottom Views .................................................................................................................. 46 9 Storage, Manufacturing and Packaging .............................................................................................. 47 9.1. Storage Conditions ........................................................................................................................ 47 9.2. Manufacturing and Soldering ........................................................................................................ 48 9.3. Packaging Specifications .............................................................................................................. 49 9.3.1. Carrier Tape ........................................................................................................................ 50 9.3.2. Plastic Reel ......................................................................................................................... 50 9.3.3. Packaging Process ............................................................................................................. 51 10 Appendix References .......................................................................................................................... 53 AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark .................................................................................................................................. 10 Table 2: Brief Introduction of the Module .................................................................................................... 11 Table 3: Key Features ................................................................................................................................. 12 Table 4: Parameters Definition .................................................................................................................... 15 Table 5: Pin Description ...............................................................................................................................15 Table 6: Pin Definition of Power Supply ......................................................................................................19 Table 7: Pin Definition of PCIe Interface ..................................................................................................... 22 Table 8: Pin Definition of SDIO Interface .................................................................................................... 24 Table 9: Pin Definition of WLAN_EN ...........................................................................................................25 Table 10: Pin Definition of PCM Interface ................................................................................................... 26 Table 11: Pin Definition of BT_EN ...............................................................................................................27 Table 12: Pin Definition of BT_UART ..........................................................................................................27 Table 13: Pin Definition of Coexistence UART ........................................................................................... 28 Table 14: Pin Definition of WLAN_SLP_CLK ..............................................................................................28 Table 15: Pin Definition of RF Antenna Interface ........................................................................................29 Table 16: Operating Frequency of AF31G (Unit: GHz) ...............................................................................29 Table 17: Conducted RF Output Power at 2.4 GHz (Unit: dBm) ................................................................30 Table 18: Conducted RF Output Power at 5 GHz (Unit: dBm) ...................................................................31 Table 19: Conducted RF Receiving Sensitivity at 2.4 GHz (Unit: dBm) .....................................................31 Table 20: Conducted RF Receiving Sensitivity at 5 GHz (Unit: dBm) ........................................................32 Table 21: Conducted RF Performance of BLE (Unit: dBm) ........................................................................32 Table 22: Antenna Requirements ................................................................................................................34 Table 23: Absolute Maximum Ratings (Unit: V) .......................................................................................... 38 Table 24: Recommended Operating Conditions (Unit: V) .......................................................................... 38 Table 25: General DC Electrical Characteristics .........................................................................................39 Table 26: Power Consumption of the Module (Normal Operation; Unit: mA) ............................................ 39 Table 27: BLE Power Consumption During Non-signaling .........................................................................40 Table 28: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity; Unit: kV) .................41 Table 29: Operating and Storage Temperatures (Unit: C) ........................................................................ 42 Table 30: Recommended Thermal Profile Parameters .............................................................................. 49 Table 31: Carrier Tape Dimension Table (Unit: mm) ..................................................................................50 Table 32: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 51 Table 33: Related Documents ..................................................................................................................... 53 Table 34: Terms and Abbreviations ............................................................................................................ 53 AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ...................................................................................................................... 13 Figure 2: Pin Assignment (Top View) ..........................................................................................................14 Figure 3: Reference Circuit for VDD_PA .....................................................................................................20 Figure 4: Reference Circuit for VDD_IO ......................................................................................................20 Figure 5: Power-up Timing .......................................................................................................................... 21 Figure 6: Wi-Fi Application Interface Connection ........................................................................................22 Figure 7: PCIe Interface Connection ........................................................................................................... 23 Figure 8: SDIO Interface Connection .......................................................................................................... 24 Figure 9: Block Diagram of Bluetooth Application Interface Connection ................................................... 26 Figure 10: Block Diagram of PCM Interface Connection ............................................................................26 Figure 11: BT_UART Interface Connection ................................................................................................ 27 Figure 12: Coexistence UART Interface Connection ..................................................................................28 Figure 13: Reference Design for RF Antenna Interface ............................................................................. 30 Figure 14: Microstrip Design on a 2-layer PCB ...........................................................................................33 Figure 15: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 33 Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 33 Figure 17: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 34 Figure 18: Dimensions of the Receptacle (Unit: mm) ................................................................................. 35 Figure 19: Specifications of Mated Plugs (Unit: mm) ..................................................................................35 Figure 20: Space Factor of the Mated Connectors (Unit: mm) ...................................................................36 Figure 21: Placement and Fixing of the Heatsink ....................................................................................... 42 Figure 22: Carrier Tape Dimension Drawing .............................................................................................. 50 Figure 23: Plastic Reel Dimension Drawing ................................................................................................50 Figure 24: Packaging Process .....................................................................................................................52 AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 1 Introduction This document, describing AF31G and its air interface and hardware interfaces connected to your applications, informs you of the interface and RF specifications, electrical and mechanical details, as well as other related information of the module. With the application notes and user guides provided separately, you can easily use the module to design and set up mobile applications. 1.1. Special Mark Table 1: Special Mark Mark Definition
Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3]
four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. refers to all AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 2 Product Overview AF31G is an automotive grade Wi-Fi and Bluetooth module with low power consumption. It is complying with IEEE 802.11a/b/g/n/ac 2.4 GHz & 5 GHz WLAN standards and Bluetooth 5.0 standard, which enables seamless integration of WLAN and Bluetooth Low Energy technologies. It supports a low-power PCIe Gen2 interface for Wi-Fi and a UART/PCM interface for Bluetooth, and it also supports LTE & Wi-Fi/Bluetooth coexistence interface. Table 2: Brief Introduction of the Module AF31G Footprint Pin numbers Size Weight LGA 112
(23 0.2) mm (23 0.2) mm (3 0.2) mm 3.11 g Wireless network functions Wi-Fi and Bluetooth 5.0 AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 2.1. Key Features Table 3: Key Features Parameter Details Power Supply Frequency Range VDD_PA:
3.143.46 V Typical: 3.3 V VDD_IO:
1.711.89 V Typical: 1.8 V Wi-Fi:
2.4 GHz: 2.4002.4835 GHz 5 GHz: 5.1505.850 GHz Bluetooth:
2.4 GHz: 2.4022.480 GHz 802.11b:
1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g:
6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n:
HT20 (MCS 0-7), HT40 (MCS 0-7) 802.11a:
6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11ac:
VHT20 (MCS 0-8), VHT40 (MCS 0-9), VHT80 (MCS 0-9) IEEE 802.11a/b/g/n/ac Bluetooth 5.0 Wi-Fi Transmission Data Rates Protocol Features Wi-Fi Modulation BPSK, QPSK, CCK, 16QAM, 64QAM and 256QAM Bluetooth Modulation GFSK, 8-DPSK and /4-DQPSK Wi-Fi Operating Modes Wireless Connection Interface WLAN_SLP_CLK Antenna Interfaces AP STA Wi-Fi: PCIe Gen2 interface used for Wi-Fi function Bluetooth: UART and PCM interfaces used for Bluetooth function 32 kHz clock interface, provide clock function when the module is under low power consumption mode Wi-Fi & Bluetooth antenna interfaces 50 characteristic impedance AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Operating Temperature Operating Temperature Range: -40 C to +85 C 1 Storage temperature range: -40 C to +95 C RoHS All hardware components are fully compliant with EU RoHS directive. 2.2. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. Power management Baseband Radio frequency Peripheral interfaces Figure 1: Functional Diagram 1 To meet normal operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this temperature range, the modules related indicators can meet IEEE and Bluetooth specifications. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 2.3. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE 1. Please keep all RESERVED pins open. 2. SDIO interface and PCIe interface exist in different hardware modules respectively. Modules supporting PCIe interface do not support SDIO interface. At this time, it is necessary to suspend the pins of all SDIO interfaces, and vice versa. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 2.4. Pin Description Table 4: Parameters Definition Parameter AI AO DI DO OD PI PO Description Analog input Analog output Digital Input Digital output Open drain Power input Power output Table 5: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics VDD_PA 101, 102, 105, 106 VDD_IO 71 PI PI Main Power supply for module 3.3 V Voltage supply for I/O 1.8 V Comments It must be provided with sufficient current up to 1.5 A. It must be provided with sufficient current up to 300 mA. GND 6, 11, 14, 17, 23, 26, 29, 36, 38, 43, 44, 46, 47, 52, 53, 55, 56, 67, 70, 78, 80, 81, 82, 84, 87, 88, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 103, 104, 107, 108, 109, 110, 111, 112 Bluetooth Application Interface Pin Name Pin No. I/O Description BT_WAKEUP_HOST 39 HOST_WAKEUP_BT 40 DO DI Bluetooth Wakeup Host Host Wakeup Bluetooth DC Characteristics Comments 1.8 V VDD_IO power domain. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series BT_EN PCM_DIN PCM_SYNC PCM_CLK PCM_DOUT BT_TXD BT_RXD BT_RTS BT_CTS SDIO Interface 69 2 5 4 3 74 75 72 73 DI DI DI DI DO DO DI DO Bluetooth enable control PCM data input PCM data frame sync PCM clock PCM data output Bluetooth UART transmit Bluetooth UART receive Request To Send DI Clear To Send Pin Name Pin No. I/O Description DC Characteristics VDD_IO power domain. Active high. VDD_IO power domain. Comments VDD_IO power domain. Active low. WLAN_WAKEUP_HO ST WLAN_SDIO_CLK WLAN_SDIO_CMD 30 24 25 WLAN_SDIO_DATA0 27 WLAN_SDIO_DATA1 28 WLAN_SDIO_DATA2 21 WLAN_SDIO_DATA3 20 PCIe Interface DO DI DIO DIO DIO DIO DIO SDIO wake up Host WLAN SDIO bus clock WLAN SDIO bus command WLAN SDIO data bus D0 WLAN SDIO data bus D1 WLAN SDIO data bus D2 WLAN SDIO data bus D3 1.8 V VDD_IO power domain. Pin Name Pin No. I/O Description WLAN_EN PCIE_CLK_P 68 19 DI AI Wi-Fi enable control PCIe reference DC Characteristics 1.8 V Comments VDD_IO power domain. Require AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series differential impedance of 85
. clock (+) PCIe reference clock (-) PCIe transmit
(+) PCIe transmit
(-) PCIe receive
(+) PCIe receive (-) PCIe clock request PCIe wakes up host 1.8 V VDD_IO power domain. AI AO AO AI AI OD OD DI PCIe reset PCIE_CLK_M PCIE_TX_P PCIE_TX_M PCIE_RX_P PCIE_RX_M PCIE_CLKREQ_N PCIE_WAKE_N PCIE_RST_N Coexistence UART 18 15 16 12 13 9 8 7 Pin Name Pin No. I/O Description DC Characteristics Comments COEX_TXD 76 DO COEX_RXD 1 DI Sleep Clock Interface LTE/WLAN &
Bluetooth coexistence transmit LTE/WLAN &
Bluetooth coexistence receive 1.8 V VDD_IO power domain. If unused, keep this pin open. Pin Name Pin No. I/O Description DC Characteristics Comments WLAN_SLP_CLK 22 DI RF Antenna Interface External 32.768 kHz sleep clock input 1.8 V VDD_IO power domain. Pin Name Pin No. I/O Description DC Characteristics Comments ANT_WIFI0/BT 45 IO 2.4/5 GHz Wi-Fi antenna interface 0 and Bluetooth antenna 50 characteristic impedance. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series ANT_WIFI1 54 IO Reserved Interface interface 2.4/5 GHz Wi-Fi antenna interface 1 Pin Name Pin No. Comments RESERVED 10, 31, 32, 33, 34, 37, 41, 42, 48, 49, 50, 51, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 77, 79, 83, 85, 86, 89 AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 3 Operating Characteristics 3.1. Power Supply 3.1.1. Power Supply Pins The following table shows the power supply pins and the ground pins of AF31G. Table 6: Pin Definition of Power Supply Pin Name Pin No. I/O Description Comments VDD_PA 101, 102, 105, 106 PI Main power supply for module It must be provided with sufficient current up to 1.5 A. VDD_IO 71 PI Voltage supply for I/O It must be provided with sufficient current up to 300 mA. GND 6, 11, 14, 17, 23, 26, 29, 36, 38, 43, 44, 46, 47, 52, 53, 55, 56, 67, 70, 78, 80, 81, 82, 84, 87, 88, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 103, 104, 107, 108, 109, 110, 111, 112 3.1.2. Reference Design for Power Supply AF31G is powered by VDD_PA, and it is recommended to use a power supply chip with maximum output current exceeding 1.5 A. The following figure shows a reference design for VDD_PA is controlled by WLAN_PWR_EN1. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Figure 3: Reference Circuit for VDD_PA The power supply for I/O in AF31G is from VDD_IO, and it is recommended to use a power supply chip with maximum output current exceeding 300 mA. The following figure shows a reference design for VDD_IO is controlled by WLAN_PWR_EN2. Figure 4: Reference Circuit for VDD_IO AF31G_Hardware_Design 53 / 53 3.1.3. Timing of Turning on the Module Wi-Fi&Bluetooth Module Series Figure 5: Power-up Timing AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 4 Application Interfaces 4.1. Wireless Connection Interface AF31G supports low power PCIe Gen2 interface or SDIO 3.0 for Wi-Fi function and UART as well as PCM interfaces for Bluetooth function. 4.1.1. Wi-Fi Application Interface The following figure shows the Wi-Fi application interface connection between AF31G and AG52x series modules. SDIO interface and PCIe interface exist in different hardware modules respectively. Please make sure witch AF31G module used. Figure 6: Wi-Fi Application Interface Connection 4.1.1.1. PCIe Interface Table 7: Pin Definition of PCIe Interface Pin Name Pin No. I/O Description Comments PCIE_REFCLK_P PCIE_REFCLK_M PCIE_TX_P PCIE_TX_M 19 18 15 16 AI AI AO AO PCIe reference clock (+) PCIe reference clock (-) PCIe transmit (+) PCIe transmit (-) Require differential impedance of 85 . AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series PCIE_RX_P PCIE_RX_M PCIE_CLKREQ_N PCIE_WAKE_N PCIE_RST_N 12 13 9 8 7 AI AI OD OD DI PCIe receive (+) PCIe receive (-) PCIe clock request PCIe wakes up host VDD_IO power domain PCIe reset The following figure shows the PCIe interface connection between AF31G and AG52x series modules. Figure 7: PCIe Interface Connection In order to ensure the integrity of PCIe signal, C1 and C2 components must be placed close to AG52x series modules. The extra stubs of traces must be as short as possible. The following principles of PCIe interface design should be complied with, specifications. to meet PCIe Gen2 It is important to route the PCIe signal traces (PCIE_TX/PCIE_RX/PCIE_REFCLK) as differential pairs with total grounding. And the differential impedance is 85 10%. For PCIe signal traces, the maximum length of each differential data pair (PCIE_TX/PCIE_RX/
PCIE_REFCLK) is recommended to be less than 300 mm, and each differential data pair mat ching should be less than 0.7 mm (5 ps). The trace space between TX differential data pair and RX differential data pair should be three times wider than PCIe trace width. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series The trace space between PCIe signals and the other signals should be four times wider than PCIe trace width. Do not route signal traces under crystals, oscillators, magnetic devices, or RF signal traces. It is important to route the PCIe differential traces in inner-layer of the PCB and surround the traces with ground on that layer and with ground planes above and below. 4.1.1.2. SDIO Interface Table 8: Pin Definition of SDIO Interface Pin Name Pin No. I/O Description Comments WLAN_WAKEUP_HOST 30 DO SDIO wake up Host VDD_IO power domain. Active low. WLAN_SDIO_CLK WLAN_SDIO_CMD WLAN_SDIO_DATA0 WLAN_SDIO_DATA1 WLAN_SDIO_DATA2 WLAN_SDIO_DATA3 24 25 27 28 21 20 DI WLAN SDIO bus clock DIO WLAN SDIO bus command DIO WLAN SDIO data bus D0 DIO WLAN SDIO data bus D1 DIO WLAN SDIO data bus D2 DIO WLAN SDIO data bus D3 VDD_IO power domain. The following figure shows the SDIO interface connection between AF31G and AG52x series modules. Figure 8: SDIO Interface Connection AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:
It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50 10%. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is recommended and WLAN_SDIO_DATA[0:3]/WLAN_SDIO_CMD less than 1 mm and total routing length less than 50 mm. AF31G has 14 mm of internal tracing and 36 mm of external tracing. between WLAN_SDIO_CLK keep matching length to It is recommended that keep termination resistors within 1524 on clock lines near the module and keep the route distance from the module clock pins to termination resistors less than 5 mm. Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15 pF. 4.1.1.3. WLAN_EN WLAN_EN is used to control the Wi-Fi function of AF31G. Wi-Fi function will be enabled when WLAN_EN is at high level. Table 9: Pin Definition of WLAN_EN Pin Name Pin No. WLAN_EN 68 I/O DI NOTE Description Comments Wi-Fi enable control VDD_IO power domain. WLAN_EN is a sensitive signal, and it should be ground shielded and routed as close as possible to AF31G. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 4.1.2. Bluetooth Application Interface The following figure shows the block diagram of Bluetooth application interface connection between AF31G and AG52x series modules:
Figure 9: Block Diagram of Bluetooth Application Interface Connection 4.1.2.1. PCM Interface AF31G provides PCM interface for Bluetooth voice application. Table 10: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comments PCM_DIN PCM_SYNC PCM_CLK PCM_DOUT 2 5 4 3 DI DI DI DO PCM data input PCM data frame sync PCM clock PCM data output VDD_IO power domain. The following figure shows the PCM interface connection between AF31G and AG52x series modules. Figure 10: Block Diagram of PCM Interface Connection AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 4.1.2.2. BT_EN BT_EN is used to control the Bluetooth function of AF31G. Bluetooth function will be enabled when BT_EN is at high level. Table 11: Pin Definition of BT_EN Pin Name Pin No. I/O Description Comments BT_EN 69 DI Bluetooth enable control VDD_IO power domain. Active high. 4.1.2.3. BT_UART Table 12: Pin Definition of BT_UART Pin Name Pin No. BT_TXD BT_RXD BT_RTS BT_CTS 74 75 72 73 I/O DO DI DO DI Description Comments Bluetooth UART transmit Bluetooth UART receive Request To Send Clear To Send VDD_IO power domain. The following figure shows the reference design for BT_UART connection between AF31G and AG52x series modules. Figure 11: BT_UART Interface Connection AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 4.2. Coexistence UART Table 13: Pin Definition of Coexistence UART Pin Name Pin No. I/O Description Comments COEX_TXD 76 COEX_RXD 1 DO DI LTE/WLAN & Bluetooth coexistence transmit LTE/WLAN & Bluetooth coexistence receive VDD_IO power domain. If unused, keep this pin open. The following figure shows the reference design for coexistence UART interface connection between AF31G and AG52x series modules. Figure 12: Coexistence UART Interface Connection 4.3. WLAN_SLP_CLK The 32.768 kHz clock can be used in low power consumption mode, such as power saving mode and sleep mode, in which basic logic operations can be maintained. Table 14: Pin Definition of WLAN_SLP_CLK Pin Name Pin No. I/O Description Comments WLAN_SLP_CLK 22 DI External 32.768 kHz sleep clock input VDD_IO power domain. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 5 RF Specifications 5.1. RF Antenna The characteristic impedance of the antenna ports should be controlled to 50 . 5.1.1. Antenna Interface & Frequency Bands Table 15: Pin Definition of RF Antenna Interface Pin Name Pin No. I/O Description NOTE ANT_WIFI0/BT 45 IO 2.4/5 GHz Wi-Fi antenna interface 0 and Bluetooth antenna interface ANT_WIFI1 54 IO 2.4/5 GHz Wi-Fi antenna interface 1 50 characteristic impedance. Table 16: Operating Frequency of AF31G (Unit: GHz) Parameter 2.4 GHz Wi-Fi 5 GHz Wi-Fi Bluetooth Frequency Bands 2.4002.4835 5.1505.850 2.4022.480 5.1.2. Reference Design AF31G provides an RF antenna pin for Wi-Fi/Bluetooth antenna connection. The RF trace in host PCB connected to the modules RF antenna pin should be microstrip line or other types of RF trace, with characteristic impendence close to 50 . This module comes with grounding pins which are next to the antenna pin in order to give a better grounding. It is recommended to reserve a -type and LCs matching circuit for better RF performance, and add a TVS for ESD protection. The -type matching components (C3, C4, R1), the LCs (L1, C1, L2, C2) and AF31G_Hardware_Design 53 / 53 TVS (D1) should be placed as close to the antenna as possible. The capacitors and inductors are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF. Wi-Fi&Bluetooth Module Series Figure 13: Reference Design for RF Antenna Interface 5.2. RF Performances 5.2.1. Conducted RF Performance of Wi-Fi Table 17: Conducted RF Output Power at 2.4 GHz (Unit: dBm) Standard Data Rate 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7 Typ. TBD TBD TBD TBD TBD TBD TBD TBD AF31G_Hardware_Design 53 / 53 Table 18: Conducted RF Output Power at 5 GHz (Unit: dBm) Wi-Fi&Bluetooth Module Series Standard 802.11a 802.11a 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 802.11ac, VHT20 802.11ac, VHT20 802.11ac, VHT40 802.11ac, VHT40 802.11ac, VHT80 802.11ac, VHT80 Data Rate 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7 MCS 0 MCS 8 MCS 0 MCS 9 MCS 0 MCS 9 Typ. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Table 19: Conducted RF Receiving Sensitivity at 2.4 GHz (Unit: dBm) Standard 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 Data Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7 Typ. TBD TBD TBD TBD TBD TBD TBD TBD AF31G_Hardware_Design 53 / 53 Table 20: Conducted RF Receiving Sensitivity at 5 GHz (Unit: dBm) Wi-Fi&Bluetooth Module Series Standard 802.11a 802.11a 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 802.11ac, VHT20 802.11ac, VHT20 802.11ac, VHT40 802.11ac, VHT40 802.11ac, VHT80 802.11ac, VHT80 Data Rate 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7 MCS 0 MCS 8 MCS 0 MCS 9 MCS 0 MCS 9 Typ. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 5.2.2. Conducted RF Performance of BLE Table 21: Conducted RF Performance of BLE (Unit: dBm) Frequency Transmitting Power (Typ.) Receiving Sensitivity (Typ.) 0 19 39 TBD TBD TBD TBD TBD TBD AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 5.3. Reference Design of RF Routing the characteristic impedance of all RF traces should be controlled to 50 . The For users PCB, impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 14: Microstrip Design on a 2-layer PCB Figure 15: Coplanar Waveguide Design on a 2-layer PCB Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Figure 17: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, follow the principles below in RF layout design:
Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . Design the GND pins adjacent to RF pins as thermal relief pads, and fully connect them to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. Reserve clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, please refer to document [2]. 5.4. Antenna Requirements Table 22: Antenna Requirements Parameter Requirements Frequency range:
VSWR Gain:
Max Input Power:
Input Impedance:
2.4002.4835 GHz (Cable Insertion Loss: < 1 dB) 5.1505.850 GHz (Cable insertion loss: <1 dB)
< 2 1 dBi 50 W 50 AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Polarization Type Vertical 5.5. RF Connector Recommendation If the RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connectors provided by Hirose. Figure 18: Dimensions of the Receptacle (Unit: mm) U.FL-LP series connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 19: Specifications of Mated Plugs (Unit: mm) The following figure describes the space factor of the mated connector. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Figure 20: Space Factor of the Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 6 Electrical Characteristics &
AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 7 Reliability 7.1. Absolute Maximum Ratings Table 23: Absolute Maximum Ratings (Unit: V) Parameter VDD_IO VDD_PA Digital I/O Input Voltage NOTE Min.
-0.3
-0.3
-0.3 Max. 3.6 3.6 VDDIO + 0.2 VDDIO is the supply voltage associated with the input pin to which the test voltage is applied. The following table shows the recommended operating conditions of AF31G. Table 24: Recommended Operating Conditions (Unit: V) Parameter VDD_IO VDD_PA Min. 1.71 3.14 Typ. 1.8 3.3 Max. 1.89 3.46 7.2. Digital I/O Characteristic AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Table 25: General DC Electrical Characteristics Parameter Description Min. Max. Unit VIH VIL VOH VOL IiL IoL High Level Input Voltage 0.7 VDD_IO VDD_IO + 0.2 Low Level Input Voltage
-0.3 0.3 VDD_IO High Level Output Voltage 0.9 VDD_IO VDD_IO Low Level Output Voltage 0 0.3 VDD_IO Input Leakage Current
-5.0 Input Leakage Current 5.0
-11 V V V V A mA 7.3. Power Consumption 7.3.1. Wi-Fi Power Consumption Under the maximum transmit power, the Wi-Fi power consumption test results are as follows:
Table 26: Power Consumption of the Module (Normal Operation; Unit: mA) Description Conditions IVDD_ IVDD_ IVDD_ CORE_VL CORE_VM CORE_VH IVDD_IO IVDD_PA_A IVDD_PA_ 802.11b 802.11g 802.11n
(2.4 GHz) B TBD TBD TBD TBD TX 1 Mbps @ TBD dBm TBD TBD TBD TBD TBD TX 11 Mbps @ TBD dBm TBD TBD TBD TBD TBD TX 6 Mbps @ TBD dBm TBD TBD TBD TBD TBD TX 54 Mbps @ TBD dBm TBD TBD TBD TBD TBD TX HT20 MCS 0 @TBD dBm TX HT20 MCS 7 @TBD dBm TX HT40 MCS 0 @ TBD dBm TX HT40 MCS 7 @ TBD dBm TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 802.11a TX 6 Mbps @ TBD dBm TBD TBD TBD TBD TBD TBD AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series
(5 GHz) 802.11n
(5 GHz) 802.11ac
(5 GHz) TX 54 Mbps @ TBD dBm TBD TBD TBD TBD TBD TBD TX HT20 MCS 0 @ TBD dBm TX HT20 MCS 7 @ TBD dBm TX HT40 MCS 0 @ TBD dBm TX HT40 MCS 7 @ TBD dBm TX VHT20 MCS 0 @
TBD dBm TX VHT20 MCS 8 @
TBD dBm TX VHT40 MCS 0 @
TBD dBm TX VHT40 MCS 9 @
TBD dBm TX VHT80 MCS 0 @
TBD dBm TX VHT80 MCS 9 @
TBD dBm TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 7.3.2. BLE Power Consumption BLE power consumption during non-signaling is here as follows:
Table 27: BLE Power Consumption During Non-signaling Description Power Power Supply Consumed Current Non-signaling TBD dBm 3.3 V 1.8 V TBD TBD NOTE For more details about current consumption, please contact Quectel Technical Supports for the power consumption test report of the module. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 7.4. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 28: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity; Unit: kV) Tested Interfaces Contact Discharge Air Discharge VDD GND Antenna Interfaces TBD TBD TBD TBD TBD TBD 7.5. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:
Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:
Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation. Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
Choose the heatsink with adequate fins to dissipate heat;
Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
AF31G_Hardware_Design 53 / 53
Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Wi-Fi&Bluetooth Module Series Figure 21: Placement and Fixing of the Heatsink 7.6. Operating and Storage Temperatures Table 29: Operating and Storage Temperatures (Unit: C) Parameter Operating temperature range 2 Storage temperature range Min.
-40
-40 Typ.
+25 Max.
+85
+95 2 To meet normal operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this temperature range, the modules related indicators can meet IEEE and Bluetooth specifications. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 8 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 8.1. Mechanical Dimensions Figure 22: Module Top and Side Dimensions AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Figure 23: Module Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. AF31G_Hardware_Design 53 / 53 8.2. Recommended Footprint Wi-Fi&Bluetooth Module Series Figure 24: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. AF31G_Hardware_Design 53 / 53 8.3. Top and Bottom Views Wi-Fi&Bluetooth Module Series Figure 25: Top View of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 9 Storage, Manufacturing and Packaging 9.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition;
Violation of the third requirement mentioned above;
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
Before module repairing. If needed, the pre-baking should follow the requirements below:
5. The module should be baked for 8 hours at 120 5 C;
The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 9.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be TBD mm. For more details, please refer to document [1]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 26: Recommended Reflow Soldering Thermal Profile AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Table 30: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 1 to 3 C/s Soak time (between A and B: 150 C and 200 C) 70 to 120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 1 to 3 C/s 40 to 70 s 235 to 246 C
-1.5 to -3 C/s 1 1. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [1][2]. 9.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:
AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 9.3.1. Carrier Tape Dimension details are as follow:
Figure 22: Carrier Tape Dimension Drawing Table 31: Carrier Tape Dimension Table (Unit: mm) W 44 P 32 T 0.4 A0 B0 23.5 23.5 K0 3.5 K1 6.8 F E 20.2 1.75 9.3.2. Plastic Reel Figure 23: Plastic Reel Dimension Drawing AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Table 32: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 9.3.3. Packaging Process Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the vacuum-packed plastic reel into the pizza box. AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules. Figure 24: Packaging Process AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 10 Appendix References Table 33: Related Documents Document Name
[1] Quectel_Module_Secondary_SMT_Application_Note
[2] Quectel_RF_Layout_Application_Note Table 34: Terms and Abbreviations Abbreviation Description bps CDMA CHAP CS CTS ESD GND HSIC IEEE LGA LTE MCS PCB PCM Bytes per second Code Division Multiple Access Challenge Handshake Authentication Protocol Coding Scheme Clear To Send Electrostatic Discharge Ground High Speed Inter Chip Institute of Electrical and Electronics Engineers Land Grid Array Long Term Evolution Modulation and Coding Scheme Printed Circuit Board Pulse Code Modulation AF31G_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series PSK QAM QPSK RF RoHS RTS SMS UART Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VOHmin VOLmax VSWR WLAN Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Request To Send Short Message Service Universal Asynchronous Receiver/Transmitter Maximum Voltage Nominal Voltage Minimum Voltage Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Voltage Standing Wave Ratio Wireless Local Area Network AF31G_Hardware_Design 53 / 53 FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202302AF31G. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:
Buletooth:3.67dBi Buletooth(LE):3.67dBi Wi-Fi 2.4G:4.35dBi Wi-Fi 5G:5.4dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID -
Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID:
XMR202302AF31G. or Contains FCC ID: XMR202302AF31G. must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment.