FCC ID: XMR202303AF51Y Wi-Fi & Bluetooth Module

AF51Y Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.1 Date: 2021-07-19 Status: Preliminary Wi-Fi&Bluetooth Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to support@quectel.com. General Notes Quectel offers the information as a service to its customers. The information provided is based upon customers requirements. Quectel makes every effort to ensure the quality of the information it makes available. Quectel does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. All information supplied herein is subject to change without prior notice. Disclaimer While Quectel has made efforts to ensure that the functions and features under development are free from errors, it is possible that these functions and features could contain errors, inaccuracies and omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind, implied or express, with respect to the use of features and functions under development. To the maximum extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of the functions and features under development, regardless of whether such loss or damage may have been foreseeable. Duty of Confidentiality The Receiving Party shall keep confidential all documentation and information provided by Quectel, except when the specific permission has been granted by Quectel. The Receiving Party shall not access or use Quectels documentation and information for any purpose except as expressly provided herein. Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information to any third party without the prior written consent by Quectel. For any noncompliance to the above requirements, unauthorized use, or other illegal or malicious use of the documentation and information, Quectel will reserve the right to take legal action. AF51Y_Hardware_Design 1 / 47 Wi-Fi&Bluetooth Module Series Copyright The information contained here is proprietary technical information of Quectel. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. AF51Y_Hardware_Design 2 / 47 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. AF51Y_Hardware_Design 3 / 47 Wi-Fi&Bluetooth Module Series About the Document Revision History Revision Date Author Description

2020-12-22 1.0.0 2020-12-24 Wilson PAN/

Lucas HUANG Wilson PAN/

Lucas HUANG Creation of the document Preliminary 1.0.1 2021-07-19 Wilson PAN/

Lucas HUANG Preliminary:

1. Updated Bluetooth 5.1 to Bluetooth 5.2. 2. Added Time Sequence (Chapter 3.4.1). 3. Updated RF Performances (Chapter 4.5) 4. Updated data of transmitting power in Key Features

(Table 2). 5. Deleted VDD_RF (Figure 1, Table 4&5). 6. Updated Pin 64 in Pin Assignment (Table 4). 7. Updated Pin Description, deleted VDD_RF (Table 4). 8. Updated Current consumption data (Table 22). 9. Updated RF0_ANT, RF1_ANT, BT_ANT into ANT_WIFI1, ANT_WIFI0 and ANT_BT (Figure 1). 10. Updated CTS and RTS of the HOST (Figure 8). 11. Updated Top & Bottom Views of the Module (Figure 21). AF51Y_Hardware_Design 4 / 47 Wi-Fi&Bluetooth Module Series Contents Safety Information ...................................................................................................................................... 3 About the Document .................................................................................................................................. 4 Contents ...................................................................................................................................................... 5 Table Index .................................................................................................................................................. 7 Figure Index ................................................................................................................................................ 8 1 Introduction ......................................................................................................................................... 9 1.1. Special Mark .............................................................................................................................. 9 2 Product Concept ............................................................................................................................... 10 2.1. General Description ................................................................................................................. 10 2.2. Key Features ............................................................................................................................ 10 2.3. Functional Diagram .................................................................................................................. 12 2.4. Evaluation Board ...................................................................................................................... 12 3 Application Interfaces ...................................................................................................................... 13 3.1. General Description ................................................................................................................. 13 3.2. Pin Assignment ........................................................................................................................ 14 3.3. Pin Description ......................................................................................................................... 15 3.4. Power Supply ........................................................................................................................... 18 3.4.1. Power on and off Scenarios .......................................................................................... 19 3.5. WLAN Application Interface ..................................................................................................... 19 3.5.1. WLAN_EN ..................................................................................................................... 20 3.5.2. PCIe Interface ............................................................................................................... 20 3.6. Bluetooth Application Interface ................................................................................................ 22 3.6.1. BT_EN ........................................................................................................................... 22 3.6.2. PCM Interface* .............................................................................................................. 22 3.6.3. UART Interface .............................................................................................................. 23 3.7. Control Signal Pins* ................................................................................................................. 24 3.7.1. HOST_WAKEUP_BT and BT_WAKEUP_HOST .......................................................... 24 3.8. Coexistence Interfaces ............................................................................................................ 25 3.8.1. UART Coexistence Interface ......................................................................................... 25 3.9. WLAN_SLP_CLK Interface* .................................................................................................... 25 RF Antenna Interfaces .......................................................................................................... 26 3.10. 3.10.1. Operating Frequency .................................................................................................... 26 3.10.2. Reference Design of RF Antenna Interfaces ................................................................ 26 3.10.3. Reference Design of RF Layout ................................................................................... 27 3.10.4. Antenna Requirements ................................................................................................. 29 3.10.5. Recommended RF Connector for Antenna Installation ................................................ 30 4 Reliability, Radio and Electrical Characteristic ............................................................................. 32 AF51Y_Hardware_Design 5 / 47 Wi-Fi&Bluetooth Module Series 4.1. General Description ................................................................................................................. 32 4.2. Electrical Characteristics .......................................................................................................... 32 4.3. I/O Interface Characteristics .................................................................................................... 33 4.4. Current Consumption ............................................................................................................... 34 4.5. RF Performances ..................................................................................................................... 35 4.5.1. Conducted RF Output Power ........................................................................................ 35 4.5.2. Conducted RF Receiving Sensitivity ............................................................................. 36 4.6. Electrostatic Discharge ............................................................................................................ 37 5 Mechanical Dimensions ................................................................................................................... 38 5.1. Mechanical Dimensions of the Module .................................................................................... 38 5.2. Recommended Footprint ......................................................................................................... 40 5.3. Top and Bottom Views of the Module ...................................................................................... 41 6 Storage, Manufacturing and Packaging ......................................................................................... 42 6.1. Storage ..................................................................................................................................... 42 6.2. Manufacturing and Soldering ................................................................................................... 43 6.3. Packaging ................................................................................................................................ 44 7 Worning .............................................................................................................................................. 46 7.1. Important Notice to OEM integrators ....................................................................................... 46 7.2. FCC Statement ........................................................................................................................ 47 IC Statement ............................................................................................................................ 48 7.3. 8 Appendix References ....................................................................................................................... 49 AF51Y_Hardware_Design 6 / 47 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark ................................................................................................................................... 9 Table 2: Key Features ................................................................................................................................ 10 Table 3: I/O Parameters Definition ............................................................................................................. 15 Table 4: Pin Description ............................................................................................................................. 15 Table 5: Definition of Power Supply and GND Pins ................................................................................... 18 Table 6: Pin Definition of WLAN_EN .......................................................................................................... 20 Table 7: Pin Definition of PCIe Interface .................................................................................................... 20 Table 8: Pin Definition of BT_EN ................................................................................................................ 22 Table 9: Pin Definition of PCM Interface .................................................................................................... 22 Table 10: Pin Definition of UART Interface ................................................................................................ 23 Table 11: Pin Definition of HOST_WAKEUP_BT and BT_WAKEUP_HOST ............................................. 24 Table 12: Pin Definition of UART Coexistence Interface ........................................................................... 25 Table 13: Pin Definition of WLAN_SLP_CLK Interface .............................................................................. 25 Table 14: Pin Definition of RF Antenna Interfaces ..................................................................................... 26 Table 15: Operating Frequency of the Module ........................................................................................... 26 Table 16: Antenna Cable Requirements .................................................................................................... 29 Table 17: Antenna Requirements ............................................................................................................... 29 Table 18: Absolute Maximum Ratings ........................................................................................................ 32 Table 19: Recommended Operating Conditions ........................................................................................ 33 Table 20: General DC Electrical Characteristics ........................................................................................ 33 Table 21: Current Consumption of the Module (Low Power Modes) ......................................................... 34 Table 22: Current Consumption of the Module (Normal Operation) .......................................................... 34 Table 23: Conducted RF Output Power at 2.4 GHz ................................................................................... 35 Table 24: Conducted RF Output Power at 5 GHz ...................................................................................... 35 Table 25: Conducted RF Receiving Sensitivity at 2.4 GHz ........................................................................ 36 Table 26: Conducted RF Receiving Sensitivity at 5 GHz ........................................................................... 36 Table 27: Recommended Thermal Profile Parameters .............................................................................. 44 Table 28: Reel Packaging .......................................................................................................................... 45 Table 29: Related Documents .................................................................................................................... 49 Table 30: Terms and Abbreviations ............................................................................................................ 49 AF51Y_Hardware_Design 7 / 47 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram of AF51Y Module ........................................................................................ 12 Figure 2: Pin Assignment (Top View) ......................................................................................................... 14 Figure 3: Time Sequence ........................................................................................................................... 19 Figure 4: WLAN Interface Connection ....................................................................................................... 19 Figure 5: PCIe Interface Connection .......................................................................................................... 21 Figure 6: Block Diagram of Bluetooth Interface Connection ..................................................................... 22 Figure 7: PCM Interface Connection .......................................................................................................... 23 Figure 8: UART Interface Connection ........................................................................................................ 24 Figure 9: UART Coexistence Interface Connection ................................................................................... 25 Figure 10: Reference Circuit for RF Antenna Interfaces ............................................................................ 27 Figure 11: Microstrip Design on a 2-layer PCB .......................................................................................... 27 Figure 12: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 27 Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 28 Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 28 Figure 15: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 30 Figure 16: Mechanicals of UF.L-LP Connectors (Unit: mm) ...................................................................... 30 Figure 17: Space Factor of Mated Connector (Unit: mm) .......................................................................... 31 Figure 18: AF51Y Top and Side Dimensions ............................................................................................. 38 Figure 19: AF51Y Bottom Dimension (Bottom View) ................................................................................. 39 Figure 20: Recommended Footprint (Bottom View) .................................................................................. 40 Figure 21: Top & Bottom Views of the Module ........................................................................................... 41 Figure 23: Recommended Reflow Soldering Thermal Profile ................................................................... 43 AF51Y_Hardware_Design 8 / 47 Wi-Fi&Bluetooth Module Series 1 Introduction This document, describing AF51Y module and its air interface and hardware interfaces connected to your applications, informs you of the interface specifications, electrical and mechanical details, as well as other related information of the module. With the application notes and user guides provided separately, you can easily use the module to design and set up mobile applications. 1.1. Special Mark Table 1: Special Mark Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. AF51Y_Hardware_Design 9 / 47 Wi-Fi&Bluetooth Module Series 2 Product Concept 2.1. General Description AF51Y is an automotive grade Wi-Fi and Bluetooth module with low power consumption. It is a single-die IEEE WLAN (Wireless Local Area Network) and Bluetooth combo solution, complying with 802.11a/b/g/n/ac 2.4 GHz & 5 GHz WLAN standards and Bluetooth 5.2 standard, which enables seamless integration of WLAN and Bluetooth Low Energy technologies. AF51Y supports a low-power PCIe Gen 2 interface for WLAN and a UART/PCM interface for Bluetooth, and it also supports LTE & WLAN/Bluetooth coexistence interface. It is designed to be used in conjunction with Quectel AG52xR series and AG55xQ series, to provide AG52xR series and AG55xQ series with WLAN and Bluetooth functions. 2.2. Key Features The following table describes the key features of AF51Y module. Table 2: Key Features Features Details Power Supply Operating Frequency Core supply voltage: 1.8 V I/O supply voltage: 1.8 V VDD PA supply voltage: 2.2 V 2.4 GHz WLAN: 2.4002.4835 GHz 5 GHz WLAN: 5.1505.850 GHz Bluetooth: 2.4022.480 GHz 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, Transmission Data Rates 48 Mbps, 54 Mbps 802.11n: HT20 (MCS07), HT40 (MCS07) 802.11ac: VHT20 (MCS08), VHT40 (MCS09), VHT80 (MCS09) AF51Y_Hardware_Design 10 / 47 Wi-Fi&Bluetooth Module Series Protocol Features IEEE 802.11a/b/g/n/ac Bluetooth 5.2 Operation Mode AP, STA Modulation CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM WLAN Interface PCIe Bluetooth Interface UART and PCM Antenna Interfaces Wi-Fi&Bluetooth antenna interfaces 50 impedance Physical Characteristics Size: (19.5 0.2) mm (21.5 0.2) mm (2.5 0.2) mm Package: LGA Weight: TBD Temperature Range Operating temperature range: -40 C to +85 C Storage temperature range: -40 C to +95 C RoHS All hardware components are fully compliant with EU RoHS directive AF51Y_Hardware_Design 11 / 47 Wi-Fi&Bluetooth Module Series 2.3. Functional Diagram The following figure shows a block diagram of AF51Y module. Figure 1: Functional Diagram of AF51Y Module 2.4. Evaluation Board In order to help you develop applications with AF51Y module conveniently, Quectel supplies the evaluation board (EVB), USB to RS232 converter cable, USB data cable, power adapter, antenna and other peripherals to control or test the module. For more details, see document [1]. AF51Y_Hardware_Design 12 / 47 WLAN_EN ANT_WIFI1VDD_IODiplexer48MHzXO5G_TX_CH0WLAN_PCIeMain ChipBT_PCMBT_UARTBT_ENRF SwitchCOEX_UARTDebug UART x2VDD_COREVDD_PA ANT_WIFI0Diplexer2.4G_TRX_CH05G_RX_CH0RFSW_5G_CH0VDD_PASAW5G_TX_CH1RF Switch5G_RX_CH1RFSW_5G_CH1VDD_PASAWRF Switch2.4G_TRX_CH1xPA_BTBT_TRXANT_BTSAWVDD_PAOptionalHOST_WAKEUP_BTBT_WAKEUP_HOSTWLAN_SLP_CLK Wi-Fi&Bluetooth Module Series 3 Application Interfaces 3.1. General Description AF51Y module is equipped with 108 LGA pins that can be connected to the cellular application platform. The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module:

Power supply WLAN interface Bluetooth interface Control signal pins*

Coexistence interfaces WLAN_SLP_CLK interface RF antenna interfaces AF51Y_Hardware_Design 13 / 47 Wi-Fi&Bluetooth Module Series 3.2. Pin Assignment Figure 2: Pin Assignment (Top View) AF51Y_Hardware_Design 14 / 47 Power PinsGND PinsRESERVED PinsPCIe PinsUART PinsANT Pins1VDD_CORESignal Pins PCM Pins85GND47VDD_CORE2VDD_CORE3RESERVED48RESERVED4RESERVED5RESERVED6GND7PCIE_TX_M8RESERVED9PCIE_REFCLK_M10RESERVED49RESERVED50RESERVED51GND52PCIE_TX_P53RESERVED54PCIE_REFCLK_P55RESERVED11PCIE_RX_M56PCIE_RX_P106GND22BT_DBG_RXD21WLAN_DBG_TXD20VDD_PA19VDD_PA18RESERVED17RESERVED16COEX_RXD15WLAN_SLP_CLK14PCIE_RST_N13PCIE_WAKE_N12PCIE_CLKREQ_N23BT_DBG_TXD65WLAN_DBG_RXD64RESERVED63VDD_PA62RESERVED61HOST_WAKEUP_BT60BT_WAKEUP_HOST59COEX_TXD58RESERVED57RESERVED34GND33ANT_WIFI032GND31GND30GND29GND28ANT_WIFI127GND26GND25ANT_BT24GND107GND75GND74GND73RESERVED72RESERVED71RESERVED70GND69GND68RESERVED67GND66GND36PCM_DOUT37PCM_CLK38BT_CTS39BT_TXD40RESERVED41RESERVED42RESERVED43VDD_IO44GND45RESERVED46RESERVED35PCM_SYNC76PCM_DIN77BT_RTS78BT_RXD79RESERVED80RESERVED81RESERVED82RESERVED83BT_EN84WLAN_EN108GND86GND87GND88GND98GND99GND100GND89GND97GND104GND101GND90GND96GND103GND102GND91GND95GND94GND93GND92GND105GND Wi-Fi&Bluetooth Module Series NOTE Keep all RESERVED pins open. 3.3. Pin Description The following tables show the pin description of AF51Y module. Table 3: I/O Parameters Definition Type AI AO AIO DI DO DIO PI Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description Comment VDD_CORE 1, 2, 47 PI Voltage for core VDD_PA 19, 20, 63 PI Voltage for power amplifier VDD_IO 43 PI Voltage supply for I/O It must be provided with sufficient current up to 1.3 A. It must be provided with sufficient current up to 1.5 A. It must be provided with sufficient current up to 50 mA. GND 6, 24, 26, 27, 29, 30, 31, 32, 34, 44, 51, 66, 67, 69, 70, 74, 75, 85108 WLAN Interface AF51Y_Hardware_Design 15 / 47 Wi-Fi&Bluetooth Module Series Pin Name Pin No. I/O Description Comment WLAN_EN 84 DI WLAN enable control 1.8 V power domain. Active high. PCIE_REFCLK_P 54 PCIE_REFCLK_M 9 PCIE_TX_P PCIE_TX_M PCIE_RX_P PCIE_RX_M PCIE_CLKREQ_N PCIE_RST_N PCIE_WAKE_N 52 7 56 11 12 14 13 WLAN_DBG_TXD 21 WLAN_DBG_RXD 65 Bluetooth Interface AI AI PCIe reference clock

(+) PCIe reference clock

(-) AO PCIe transmit (+) AO PCIe transmit (-) AI AI PCIe receive (+) PCIe receive (-) DO PCIe clock request Require differential impedance of 100 . DI PCIe reset 1.8 V power domain DO PCIe wakes up host 1.8 V power domain DO DI WLAN debug UART transmit 1.8 V power domain WLAN debug UART receive 1.8 V power domain. If unused, keep this pin open. Pin Name Pin No. I/O Description Comment BT_EN PCM_DIN*

PCM_SYNC*

PCM_CLK*

PCM_DOUT*

BT_RTS BT_CTS BT_TXD 83 76 35 37 36 77 38 39 DI DI DI DI Bluetooth enable control 1.8 V power domain. Active high. PCM data input 1.8 V power domain PCM data frame sync 1.8 V power domain PCM clock 1.8 V power domain DO PCM data output 1.8 V power domain DO DI DO Bluetooth UART request to send Bluetooth UART clear to send Bluetooth UART transmit 1.8 V power domain 1.8 V power domain 1.8 V power domain AF51Y_Hardware_Design 16 / 47 Wi-Fi&Bluetooth Module Series BT_RXD BT_DBG_TXD BT_DBG_RXD 78 23 22 Control Signal Pins*

DI DO DI Bluetooth UART receive 1.8 V power domain Bluetooth debug UART transmit 1.8 V power domain. If unused, keep this pin open. Bluetooth debug UART receive 1.8 V power domain. If unused, keep this pin open. Pin Name Pin No. I/O Description Comment HOST_WAKEUP_BT 61 BT_WAKEUP_HOST 60 Coexistence Interface DI DO Host wakes up Bluetooth 1.8 V power domain. If unused, keep this pin open. Bluetooth wakes up the host 1.8 V power domain. If unused, keep this pin open. Pin Name Pin No. I/O Description Comment COEX_TXD 59 DO COEX_RXD 16 DI RF Antenna Interfaces LTE & WLAN &

Bluetooth coexistence transmit LTE & WLAN &

Bluetooth coexistence receive 1.8 V power domain. If unused, keep this pin open. 1.8 V power domain. If unused, keep this pin open. Pin Name Pin No. I/O Description Comment ANT_WIFI1 ANT_WIFI0 ANT_BT 28 33 25 WLAN_SLP_CLK Interface*

AIO AIO AIO Bluetooth and 2.4G &

5G WLAN antenna interface 0 2.4G & 5G WLAN antenna interface 1 Reserved dedicated Bluetooth antenna interface 50 impedance 50 impedance 50 impedance Pin Name Pin No. I/O Description Comment WLAN_SLP_CLK 15 DI External 32.768 kHz sleep clock input 1.8 V power domain RESERVED Interfaces Pin Name Pin No. I/O Description Comment AF51Y_Hardware_Design 17 / 47 Wi-Fi&Bluetooth Module Series 3, 4, 5, 8, 10, 17, 18, 40, 41, 42, 45, 46, 48, 49, 50, 53, 55, 57, 58, 62, 64, 68, 71, 72, 73, 79, 80, 81, 82 Keep these pins open. RSERVED NOTE Please keep all RESERVED and unused pins open. 3.4. Power Supply The following table shows the power supply pins and ground pins of AF51Y module. Table 5: Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VDD_CORE 1, 2, 47 Voltage for core 1.71 1.8 1.89 VDD_PA 19, 20, 63 Voltage for power amplifier 2.09 2.2 2.31 VDD_IO 43 Voltage supply for I/O 1.62 1.8 1.98 V V V GND 6, 24, 26, 27, 29, 30, 31, 32, 34, 44, 51, 66, 67, 69, 70, 74, 75, 85108 Ground

V AF51Y_Hardware_Design 18 / 47 Wi-Fi&Bluetooth Module Series 3.4.1. Power on and off Scenarios The power on scenario is illustrated in the following figure. Figure 3: Time Sequence 3.5. WLAN Application Interface The following figure shows the WLAN application interface connection between AF51Y and host. Figure 4: WLAN Interface Connection AF51Y_Hardware_Design 19 / 47 VDD_IOVDD_COREVDD_PA 10us 10us 10 usWLAN_EN/BT_ENPCIE_CLK_REQ_NPCIE_RST_L 10 us PCIe Interface WLAN_ENAF51YHOSTPCIe InterfaceWLAN_EN Wi-Fi&Bluetooth Module Series 3.5.1. WLAN_EN WLAN_EN is used to control the WLAN function of AF51Y module. WLAN function will be enabled when WLAN_EN is at high level. Table 6: Pin Definition of WLAN_EN Pin Name Pin No. I/O Description Comment WLAN_EN 84 DI WLAN enable control Active high NOTE WLAN_EN is a sensitive signal, and it should be ground shielded and routed as close as possible to AF51Y module. 3.5.2. PCIe Interface Table 7: Pin Definition of PCIe Interface Pin Name Pin No. I/O Description Comment PCIE_REFCLK_P 54 PCIE_REFCLK_M 9 AI AI PCIe reference clock (+) PCIe reference clock (-) PCIE_TX_P PCIE_TX_M PCIE_RX_P PCIE_RX_M 52 7 56 11 AO PCIe transmit (+) AO PCIe transmit (-) AI AI PCIe receive (+) PCIe receive (-) PCIE_CLKREQ_N 12 DO PCIe clock request Require differential impedance of 100 . PCIE_RST_N PCIE_WAKE_N 14 13 DI PCIe reset 1.8 V power domain DO PCIe wakes up host AF51Y_Hardware_Design 20 / 47 Wi-Fi&Bluetooth Module Series The following figure shows the PCIe interface connection between AF51Y and the host. Figure 5: PCIe Interface Connection In order to ensure the signal integrity of PCIe interface, C3 and C4 should be placed close to the host module, and C5 and C6 should be placed close to the AF51Y module. The extra stubs of traces must be as short as possible. A couple of 100 nF capacitors (C1/C2) must be added when the host is I.MX serial, because the differential clock of I.MX serial does not meet PCIe compliance standard. The following principles of PCIe interface design should be complied with, to meet PCIe Gen2 specifications. It is important to route the PCIe signal traces as differential pairs with total grounding. And the differential impedance is 100 10 %. For PCIe signal traces, the maximum length of each differential data pair

(PCIE_TX/PCIE_RX/PCIE_REFCLK) is recommended to be less than 300 mm, and each differential data pair matching should be less than 0.7 mm (5 ps). Spacing to all other signals (inter-interface) is four times of trace width. Do not route signal traces under crystals, oscillators, magnetic devices, or RF signal traces. It is important to route the PCIe differential traces in inner-layer of the PCB and surround the traces with ground on that layer and with ground planes above and below. AF51Y_Hardware_Design 21 / 47 PCIE_TX0_MPCIE_TX0_PPCIE_RST_NPCIE_RX0_PHOSTPCIE_REFCLK_MPCIE_REFCLK_PPCIE_WAKEPCIE_CLKREQPCIE_RX0_MPCIE_CLKREQ_NAF51YPCIE_WAKE_NPCIE_RST_NPCIE_REFCLK_PPCIE_REFCLK_MPCIE_RX_MPCIE_RX_PPCIE_TX_PPCIE_TX_MR1100KR2100KVDD_EXTC3100 nFC4100 nFC5100 nFC6100 nFR3NM_100KC1100 nFC2100 nF Wi-Fi&Bluetooth Module Series 3.6. Bluetooth Application Interface The following figure shows the block diagram of Bluetooth interface connection between AF51Y and the host. If Bluetooth function of AF51Y module is used, the UART and PCM interfaces of AF51Y must be connected to that of the host. Figure 6: Block Diagram of Bluetooth Interface Connection 3.6.1. BT_EN BT_EN is used to control the Bluetooth function of AF51Y module. Bluetooth function will be enabled when BT_EN is at high level. Table 8: Pin Definition of BT_EN Pin Name Pin No. I/O Description Comment BT_EN 83 DI Bluetooth enable control Active high. 3.6.2. PCM Interface*

Table 9: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_DIN PCM_SYNC 76 35 DI DI PCM data input 1.8 V power domain PCM data frame sync 1.8 V power domain AF51Y_Hardware_Design 22 / 47 AF51YHOSTUARTPCMBT_ENUARTPCMBT_EN Wi-Fi&Bluetooth Module Series PCM_CLK PCM_DOUT 37 36 DI PCM clock 1.8 V power domain DO PCM data output 1.8 V power domain The following figure shows the PCM interface connection between AF51Y and the host. Figure 7: PCM Interface Connection 3.6.3. UART Interface Table 10: Pin Definition of UART Interface Pin Name Pin No. I/O Description Comment BT_RTS BT_CTS BT_TXD BT_RXD 77 38 39 78 DO Bluetooth UART request to send 1.8 V power domain DI Bluetooth UART clear to send 1.8 V power domain DO Bluetooth UART transmit 1.8 V power domain DI Bluetooth UART receive 1.8 V power domain AF51Y_Hardware_Design 23 / 47 AF51YHOSTPCM_CLKPCM_SYNCPCM_DOUTPCM_DINPCM_CLKPCM_SYNCPCM_INPCM_OUT Wi-Fi&Bluetooth Module Series The following figure shows the reference design for UART interface connection between AF51Y and the host. Figure 8: UART Interface Connection 3.7. Control Signal Pins*

3.7.1. HOST_WAKEUP_BT and BT_WAKEUP_HOST Table 11: Pin Definition of HOST_WAKEUP_BT and BT_WAKEUP_HOST Pin Name Pin No. I/O Description Comment HOST_WAKEUP_BT 61 DI Host wakes up Bluetooth BT_WAKEUP_HOST 60 DO Bluetooth wakes up the host 1.8 V power domain. If unused, keep this pin open . 1.8 V power domain. If unused, keep this pin open . AF51Y_Hardware_Design 24 / 47 AF51YHOSTBT_TXDBT_RXDBT_RTSBT_CTSBT_UART_RXDBT_UART_TXDBT_UART_CTSBT_UART_RTS Wi-Fi&Bluetooth Module Series 3.8. Coexistence Interfaces 3.8.1. UART Coexistence Interface Table 12: Pin Definition of UART Coexistence Interface Pin Name Pin No. I/O Description Comment COEX_TXD 59 DO COEX_RXD 16 DI LTE & WLAN & Bluetooth coexistence transmit If unused, keep this pin open. LTE & WLAN & Bluetooth coexistence receive If unused, keep this pin open. AF51Y module supports LTE & WLAN coexistence and LTE & Bluetooth coexistence. The following figure shows the UART coexistence interface connection between AF51Y and AG52xR series and AG55xQ series modules. Figure 9: UART Coexistence Interface Connection 3.9. WLAN_SLP_CLK Interface*

An external 32.768 kHz sleep clock connecting to WLAN_SLP_CLK is necessary. AF51Y is unable to boot up and work without sleep clock. Table 13: Pin Definition of WLAN_SLP_CLK Interface Pin Name Pin No. I/O Description Comment WLAN_SLP_CLK 15 DI External 32.768 kHz sleep clock input 1.8 V power domain AF51Y_Hardware_Design 25 / 47 AF51YHOSTCOEX_TXDCOEX_RXDCOEX_UART_RXDCOEX_UART_TXD Wi-Fi&Bluetooth Module Series 3.10. RF Antenna Interfaces Table 14: Pin Definition of RF Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_WIFI1 28 AIO Bluetooth and 2.4G & 5G WLAN antenna interface 0 50 impedance ANT_WIFI0 33 AIO 2.4G & 5G WLAN antenna interface 1 50 impedance ANT_BT 25 AIO Reserved dedicated Bluetooth antenna interface 50 impedance 3.10.1. Operating Frequency Table 15: Operating Frequency of the Module Feature Frequency 2.4 GHz WLAN 2.4002.4835 5 GHz WLAN 5.1505.850 Bluetooth 2.4022.480 Unit GHz GHz GHz 3.10.2. Reference Design of RF Antenna Interfaces AF51Y module provides three RF antenna interfaces for antenna connection. A reference circuit design for an RF antenna interface is shown below. It is recommended to reserve a -type and notch matching circuit for better RF performance, and the

-type matching components (C3, C4, and R1) and the notch (C1, C2, L1 and L2) should be placed as close to the antenna as possible. The capacitors and inductors are not mounted by default. AF51Y_Hardware_Design 26 / 47 Wi-Fi&Bluetooth Module Series Figure 10: Reference Circuit for RF Antenna Interfaces 3.10.3. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 11: Microstrip Design on a 2-layer PCB Figure 12: Coplanar Waveguide Design on a 2-layer PCB AF51Y_Hardware_Design 27 / 47 AF51YRF_ANTR10RC3C4NMNML1NMC1NML2NMC2NM Wi-Fi&Bluetooth Module Series Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. AF51Y_Hardware_Design 28 / 47 Wi-Fi&Bluetooth Module Series For more details about RF layout, see document [2]. 3.10.4. Antenna Requirements The following tables show the requirements on antenna cables and antennas. Table 16: Antenna Cable Requirements Type Requirements 2.4002.4835 GHz Cable insertion loss: <1 dB 5.1505.850 GHz Cable insertion loss: <1 dB Table 17: Antenna Requirements Type Frequency Range (GHz) VSWR Gain (dBi) Max Input Power (W) Input Impedance () Requirements 2.4002.4835 5.1505.850

< 2:1 recommended Typical 1 50 50 Polarization Type Vertical AF51Y_Hardware_Design 29 / 47 Wi-Fi&Bluetooth Module Series 3.10.5. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 15: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 16: Mechanicals of UF.L-LP Connectors (Unit: mm) AF51Y_Hardware_Design 30 / 47 Wi-Fi&Bluetooth Module Series The following figure describes the space factor of mated connector Figure 17: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. AF51Y_Hardware_Design 31 / 47 Wi-Fi&Bluetooth Module Series 4 Reliability, Radio and Electrical Characteristic 4.1. General Description This chapter mainly introduces electrical and radio frequency characteristics of AF51Y module. The details are listed in the subsequent chapters. 4.2. Electrical Characteristics Table 18: Absolute Maximum Ratings Parameter VDD_CORE VDD_PA VDD_IO Digital I/O Input Voltage NOTE Min.

-0.3

-0.3

-0.3

-0.3 Max. Unit VDDX + 0.2 VDDX + 0.2 VDDX + 0.2 VDD_IO + 0.2 V V V V VDDX is the supply voltage associated with the input pin to which the test voltage is applied. AF51Y_Hardware_Design 32 / 47 Wi-Fi&Bluetooth Module Series The following table shows the recommended operating conditions of AF51Y module. Table 19: Recommended Operating Conditions Parameter VDD_CORE VDD_PA VDD_IO Min. 1.71 2.09 1.62 Typ. 1.8 2.2 1.8 Max. 1.89 2.31 1.98 Unit V V V 4.3. I/O Interface Characteristics The following table shows the general DC electrical characteristics over recommended operating conditions (unless otherwise specified). Table 20: General DC Electrical Characteristics Symbol Parameter Min. Max. Unit VIH VIL VOH VOL IIL High Level Input Voltage 0.65 VDD_IO VDD_IO + 0.3 Low Level Input Voltage

-0.3 0.35 VDD_IO High Level Output Voltage VDD_IO - 0.45 VDD_IO Low Level Output Voltage 0 Input Leakage Current TBD 0.45 TBD V V V V A AF51Y_Hardware_Design 33 / 47 Wi-Fi&Bluetooth Module Series 4.4. Current Consumption Table 21: Current Consumption of the Module (Low Power Modes) Conditions IVDD_CORE IVDD_IO IVDD_PA Unit AT+QWIFI=0 AT+QWIFI=1 TBD TBD TBD TBD TBD TBD mA mA Table 22: Current Consumption of the Module (Normal Operation) Description Conditions IVDD_CORE IVDD_IO IVDD_PA Unit 802.11b 802.11g TX 1 Mbps TX 11 Mbps TX 6 Mbps TX 54 Mbps 296.51 303.32 317.34 330.46 4.51 483.47 4.41 475.61 4.36 467.53 4.52 377.17 TX HT20-MCS0 320.44 4.34 461.51 802.11n (2.4G) TX HT20-MCS7 334.63 4.64 359.71 TX HT40-MCS0 332.38 4.51 443.62 TX HT40-MCS7 343.47 4.43 231.70 802.11a TX 6 Mbps TX 54 Mbps 330.27 360.58 4.51 488.71 4.37 382.78 TX HT20-MCS0 342.22 4.28 472.62 TX HT20-MCS7 359.91 4.32 365.83 TX HT40-MCS0 378.65 4.31 467.85 TX HT40-MCS7 381.73 4.33 264.71 TX VHT20 MCS0 342.72 4.27 473.15 802.11n (5G) 802.11ac mA mA mA mA mA mA mA mA mA mA mA mA mA mA TX VHT20 MCS8 364.76 4.38 348.54 mA AF51Y_Hardware_Design 34 / 47 Wi-Fi&Bluetooth Module Series TX VHT40 MCS0 378.70 4.39 467.86 TX VHT40 MCS9 378.68 4.32 230.11 TX VHT80 MCS0 434.65 4.74 434.39 TX VHT80 MCS9 380.91 4.37 161.64 mA mA mA mA 4.5. RF Performances The following tables summarize the transmitting and receiving performances of AF51Y. 4.5.1. Conducted RF Output Power Table 23: Conducted RF Output Power at BT Frequency Classic BLE Min. 8 5 Table 24: Conducted RF Output Power at 2.4 GHz Frequency 802.11b @ 1 Mbps 802.11g @ 6 Mbps 802.11n, HT20 @ MCS0 802.11n, HT40 @ MCS0 Min. 15.5 15 15 11 Table 25: Conducted RF Output Power at 5 GHz Frequency 802.11a @ 6 Mbps Min. 13.5 Typ. 10 7 Typ. 17.5 17 17 13.5 Typ. 15.5 Unit dBm dBm Unit dBm dBm dBm dBm Unit dBm AF51Y_Hardware_Design 35 / 47 Wi-Fi&Bluetooth Module Series 802.11n, HT20 @ MCS0 802.11n, HT40 @ MCS0 802.11ac, VHT20 @ MCS0 802.11ac, VHT40 @ MCS0 802.11ac, VHT80 @ MCS0 13.5 13 13.5 13 12.5 15.5 15 15.5 15 14.5 dBm dBm dBm dBm dBm 4.5.2. Conducted RF Receiving Sensitivity Table 26: Conducted RF Receiving Sensitivity at 2.4 GHz Frequency 802.11b, 1 Mbps 802.11b, 11 Mbps 802.11g, 6 Mbps 802.11g, 54 Mbps 802.11n, HT20, MCS0 802.11n, HT20, MCS7 802.11n, HT40, MCS0 802.11n, HT40, MCS7 Receiving Sensitivity (Typ.) 93 dBm 84 dBm 87 dBm 70 dBm 87 dBm 69 dBm 84 dBm 67 dBm Table 27: Conducted RF Receiving Sensitivity at 5 GHz Frequency 802.11a, 6 Mbps 802.11a, 54 Mbps 802.11n, HT20, MCS0 802.11n, HT20, MCS7 Receiving Sensitivity (Typ.) 90 dBm 73 dBm 90 dBm 72 dBm AF51Y_Hardware_Design 36 / 47 Wi-Fi&Bluetooth Module Series 802.11n, HT40, MCS0 802.11n, HT40, MCS7 802.11ac, VHT20, MCS0 802.11ac, VHT20, MCS8 802.11ac, VHT40, MCS0 802.11ac, VHT40, MCS9 802.11ac, VHT80, MCS0 802.11ac, VHT80, MCS9 87 dBm 70 dBm 90 dBm 68 dBm 87 dBm 64 dBm 84 dBm 60 dBm 4.6. Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. AF51Y_Hardware_Design 37 / 47 Wi-Fi&Bluetooth Module Series 5 Mechanical Dimensions This chapter describes the mechanical dimensions of AF51Y module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions of the Module Figure 18: AF51Y Top and Side Dimensions AF51Y_Hardware_Design 38 / 47 Wi-Fi&Bluetooth Module Series Figure 19: AF51Y Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. AF51Y_Hardware_Design 39 / 47 Wi-Fi&Bluetooth Module Series 5.2. Recommended Footprint Figure 20: Recommended Footprint (Bottom View) NOTE 1. For easy maintenance of the module, keep about 3 mm between the module and other components on the motherboard. 2. Keep all RESERVED pins open. AF51Y_Hardware_Design 40 / 47 Wi-Fi&Bluetooth Module Series 5.3. Top and Bottom Views of the Module Figure 21: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. AF51Y_Hardware_Design 41 / 47 Wi-Fi&Bluetooth Module Series 6 Storage, Manufacturing and Packaging 6.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 hours 1 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 1 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. AF51Y_Hardware_Design 42 / 47 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 6.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.130.15 mm. For more details, see document [3]. The peak reflow temperature should be 238246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 22: Recommended Reflow Soldering Thermal Profile AF51Y_Hardware_Design 43 / 47 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 1~3 C/s Cooling down slope: -1.5 ~ -3 C/s Max slope: 2~3 C/s Wi-Fi&Bluetooth Module Series Table 28: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 23 C/s 4070 s 235 C to 246 C

-1.5 to -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. 6.3. Packaging AF51Y module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. AF51Y is packaged in tape and reel carriers. AF51Y_Hardware_Design 44 / 47 Wi-Fi&Bluetooth Module Series Table 29: Reel Packaging Model Name MOQ for MP Minimum Package: TBD Minimum Package TBD AF51Y TBD Size: TBD N.W: TBD G.W: TBD Size: TBD N.W: TBD G.W: TBD AF51Y_Hardware_Design 45 / 47 Wi-Fi&Bluetooth Module Series 7 Worning 7.1. Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd.. that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR202303AF51Y The FCC ID can be used only when all FCC mpliance requirements are met. AF51Y_Hardware_Design 46 / 47 Wi-Fi&Bluetooth Module Series Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

(4) The max allowed antenna gain is 3.76dBi for external monopole antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 7.2. FCC Statement Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. AF51Y_Hardware_Design 47 / 47 Wi-Fi&Bluetooth Module Series This device is intended only for OEM integrators under the following conditions:

(For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body. 7.3. IC Statement This device complies with Industry Canada's licence exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'lndustrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes (1) l'appareil ne doit pas produire de brouillage, et.

(2) I' utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. This device complies with the Canadian ICES-003 Class B specifications. CAN ICES-3(B)/ NMB-3(B). Cet appareil numrique de la Canadian ICES-003. Cet appareil num rique de la classe B est conforme la norme NMB-003 du Canada. AF51Y_Hardware_Design 48 / 47 Wi-Fi&Bluetooth Module Series 8 Appendix References Table 30: Related Documents Document Name

[1] Quectel_V2X&5G_EVB_User_Guide

[2] Quectel_RF_Layout_Application_Note

[3] Quectel_Module_Secondary_SMT_User_Guide Table 31: Terms and Abbreviations Abbreviation Description AP BPSK Access Point Binary Phase Shift Keying Bluetooth Bluetooth CCK CTS ESD GND HT IEEE IIL I/O LTE Complementary Code Keying Clear To Send Electrostatic Discharge Ground High Throughput Institute of Electrical and Electronics Engineers Input Leakage Current Input/Output Long Term Evolution AF51Y_Hardware_Design 49 / 47 Wi-Fi&Bluetooth Module Series Mbps MCS MOQ PCB PCM QAM QPSK RF RoHS RTS TBD TX UART USB VHT VIHmax VIHmin VILmax VILmin VOLmax VOHmin VSWR Wi-Fi WLAN Megabits per second Modulation and Coding Scheme Minimum Order Quantity Printed Circuit Board Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Request To Send To Be Determined Transmit Universal Asynchronous Receiver/Transmitter Universal Serial Bus Very High Throughput Maximum High-level Input Voltage Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Maximum Output Low Level Voltage Value Minimum High-level Output Voltage Voltage Standing Wave Ratio Wireless-Fidelity Wireless Local Area Network AF51Y_Hardware_Design 50 / 47

RUCLCTEL AF51Y Q2-AYOKK AFS1YABMD SN: MPA7301 730XXXXX C FCC ID: XMR202303AF51Y IC: 10224A-202201AF51Y

Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: March 10, 2023 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID: XMR202303AF51Y

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincerely, Name:

Email:

Jean hu .. (2) jean.hu@quectel.com. Signature:

. Rev 1/26/2023 Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: March 10, 2023 Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing FCC ID: XMR202303AF51Y

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincerely, Name:

Email:

Jean hu .. (2) jean.hu@quectel.com. Signature:

. Rev 1/26/2023

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +8602150086326; Fax: +862153253668 Date: March 10, 2023 Federal Communications Commission Office of Engineering and Technology Laboratory Division 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Request for Confidentiality FCC ID: XMR202303AF51Y To Whom It May Concern, Pursuant to the provisions of Sections 0.457 and 0.459 of Commissions rules

(47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure indefinitely. Schematic Diagram Block Diagram Part List Operational Description Tune-up Procedure Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In additional to above mentioned documents, pursuant to Public Notice DA 04-1705 of the Commission s policy, in order to comply with the marketing regulations in 47 CFT 2.803 and the importation rules in 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. External Photos Internal Photos Test Setup Photos User Manual It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Best Regards, Jean Hu Jean.hu@quectel.com

Modular Approval Request FCC FCC ID: XMR202303AF51Y Items to be covered 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. 3. The modular transmitter must have its own power supply regulation. 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable).. 5. 6. 7. 8. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. The modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID: XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, Answer from applicant Y The EUT provides the RF shielding. See EUT photo. Y The EUT has its buffered modulation. Y The EUT has its own power supply regulation, please see the Schematic Diagram. Y The EUT meets the FCC antenna requirements;

unique antenna connector and photo of antenna are shown in the test report. Y The EUT was tested with a test board, Please see test report and setup photo Y The FCC ID is XMR202303AF51Y Y The EUT is compliant with all applicable FCC rules. Details instructions for maintaining compliance are give in the User Manual. Y The EUT complies with RF exposure requirement. typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Note: If compliance with one or more of the numbered requirements, listed above, cannot be demonstrated, it may be possible to obtain a Limited Modular Approval (LMA). Name and surname of applicant (or authorized representative): Jean Hu Date: 2023-03-10 Signature:

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang Quectel Wireless Solutions Co., Ltd. District, Shanghai, China 200233 City:

Country: China Shanghai Declare that:

Name Representative of agent: Well Wei Agent Company name:

Branch Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: Wi-Fi & Bluetooth Module Type designation:

Trademark:

FCC ID:

AF51Y QUECTEL XMR202303AF51Y on our behalf. Sincerely yours, Contact Person: Jean Hu Applicant: Quectel Wireless Solutions Co., Ltd. Phone: +86-21-51086236 E-Mail: Jean.hu@quectel.com Notes:

(1): Required for FCC application

(2): For FCC it must be the Grantee Code owner or the authorized agent.

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 We have declared below featured for FCC equipment authorization, device FCC ID:

UNII Declaration Letter XMR202303AF51Y

(1) DFS Device --

Master, Client with Radar detection capability , N/A Client without radar detection capability,

(2) Active / Passive Scanning , adhoc mode access point capability Frequency Band

(MHz) Active Scanning

(the device can transmit a probe

(beacon)) 2412 2462 MHz 2422 2452 MHz 5745 5825 MHz 5755 5795 MHz 5180 5240 MHz 5190 5230 MHz 5260 5320 MHz 5270 5310 MHz 5500 5700 MHz Yes, 5510 5670 MHz Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No No passive scanning

(where the device is can listen only with no probes) Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No No Ad Hoc Mode capability Access point capability Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No No Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No No

(3) Country code selection ability -

If no, pls explain how was implemented : use Microsoft network utility No Yes ,

(4) Meet 15.202 requirement -

pls check below :

Yes , No , A master device is defined as a device operating in a mode in which it has the capability to transmit without receiving an enabling signal. In this mode it is able to select a channel and initiate a network by sending enabling signals to other devices A client device is defined as a device operating in a mode in which the transmissions of the device are under control of the master. A device in client mode is not able to initiate a network.

(5) For client devices that have software configuration control to operate in different modes (active scanning in some and passive scanning in others) in different bands (devices with multiple equipment classes or those that operate on non-DFS frequencies) or modular devices which configure the modes of operations through software, the application must provide software and operations description on how the software and / or hardware is implemented to ensure that proper operations modes can not be modified by end user or an installer. No Apply , Apply ,

(If apply , pls help to provide explanation on how it was implement (By hardware or software , and how software was controlled) If you have any questions, please feel free to contact me at the address shown below. Yours sincerely, Signatory Quectel Wireless Solutions Co., Ltd. Printed Name:Jean hu