FCC ID: XMR2023FC06E Wi-Fi & Bluetooth Module

FC06E Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.3 Date: 2022-12-26 Status: Preliminary FC06E_Hardware_Design 1 / 56 Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FC06E_Hardware_Design 1 / 53 Wi-Fi&Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. FC06E_Hardware_Design 2 / 53 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FC06E_Hardware_Design 3 / 53 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description

2021-11-12 1.0.0 2021-11-12 Soni RAO/

Lucas HUANG Soni RAO/Lucas HUANG Creation of the document Preliminary 1.0.1 2022-5-24 Soni RAO 1.0.2 2022-5-25 Soni RAO Preliminary:

1. Updated power consumption data (Chapter 4.5). 2. Updated Wi-Fi RF performance data (Chapter 4.6). 3. Updated ESD data (Table 30). 4. Updated the modules weight (Table 2). Preliminary:

1. Updated the modules height (Table 2, Figure 19). 2. Updated top and side dimension figures and top and bottom views (Figure 19, Figure 22). Preliminary:

1. Updated the Wi-Fi transmitting power (Table 2, Table 25, Table 26). 1.0.3 2022-12-26 Soni RAO 2. Updated the minimum and maximum power supply of the module (Table 4, Table 5, Table 20). 3. Updated the ramp-up slope and cool-down slope

(Figure 23, Table 31). FC06E_Hardware_Design 4 / 53 Wi-Fi&Bluetooth Module Series Contents Safety Information ...................................................................................................................................... 3 About the Document .................................................................................................................................. 4 Contents ...................................................................................................................................................... 5 Table Index .................................................................................................................................................. 7 Figure Index ................................................................................................................................................ 8 1 Introduction ......................................................................................................................................... 9 1.1. Special Mark ............................................................................................................................ 10 2 Product Overview ............................................................................................................................. 11 2.1. General Description ................................................................................................................. 11 2.2. Key Features ............................................................................................................................ 11 2.3. Functional Diagram .................................................................................................................. 13 2.4. EVB Kit ..................................................................................................................................... 14 3 Application Interfaces ...................................................................................................................... 15 3.1. Pin Assignment ........................................................................................................................ 15 3.2. Pin Description ......................................................................................................................... 16 3.3. Power Supply ........................................................................................................................... 19 3.4. Wi-Fi Application Interface ....................................................................................................... 21 3.4.1. WLAN_EN ..................................................................................................................... 21 3.4.2. PCIe Interface ............................................................................................................... 21 3.5. Bluetooth Application Interfaces* ............................................................................................. 23 3.5.1. BT_EN .......................................................................................................................... 23 3.5.2. UART Interface ............................................................................................................. 24 3.5.3. BT_WAKE_HOST and HOST_WAKE_BT ................................................................... 25 3.5.4. PCM Interface ............................................................................................................... 25 3.6. Coexistence Interfaces ............................................................................................................ 26 3.7. Other Interfaces ....................................................................................................................... 26 3.7.1. WLAN_SLP_CLK .......................................................................................................... 26 3.7.2. SW_CTRL ..................................................................................................................... 27 3.8. RF Antenna Interfaces ............................................................................................................. 28 3.8.1. Operating Frequencies ................................................................................................. 28 3.8.2. RF Antenna Reference Design ..................................................................................... 28 3.8.3. RF Routing Guidelines .................................................................................................. 29 3.8.4. Antenna Design Requirements ..................................................................................... 30 3.8.5. RF Connector Recommendation .................................................................................. 31 4 Electrical Characteristics & Reliability ........................................................................................... 33 4.1. Absolute Maximum Ratings ..................................................................................................... 33 4.2. Power Supply Ratings .............................................................................................................. 34 4.3. Digital I/O Characteristics ........................................................................................................ 34 4.4. Operating and Storage Temperatures ..................................................................................... 35 4.5. Power Consumption ................................................................................................................. 36 FC06E_Hardware_Design 5 / 53 Wi-Fi&Bluetooth Module Series 4.5.1. Power Consumption in Low Power Modes................................................................... 36 4.5.2. Power Consumption ..................................................................................................... 36 4.6. RF Performances ..................................................................................................................... 38 4.6.1. Wi-Fi RF Performances ................................................................................................ 38 4.6.2. Bluetooth RF Performances* ........................................................................................ 42 4.7. ESD Protection ......................................................................................................................... 42 4.8. Thermal Dissipation ................................................................................................................. 43 5 Mechanical Information .................................................................................................................... 44 5.1. Mechanical Dimensions ........................................................................................................... 44 5.2. Recommended Footprint ......................................................................................................... 46 5.3. Top and Bottom Views ............................................................................................................. 47 6 Storage, Manufacturing and Packaging ......................................................................................... 48 6.1. Storage Conditions................................................................................................................... 48 6.2. Manufacturing and Soldering ................................................................................................... 49 6.3. Packaging Specifications ......................................................................................................... 51 6.3.1. Carrier Tape .................................................................................................................. 51 6.3.2. Plastic Reel ................................................................................................................... 52 6.3.3. Packaging Process ....................................................................................................... 52 7 Appendix References ....................................................................................................................... 54 FC06E_Hardware_Design 6 / 53 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark................................................................................................................................. 10 Table 2: Key Features ................................................................................................................................ 11 Table 3: I/O Parameters Definition ............................................................................................................. 16 Table 4: Pin Description ............................................................................................................................. 16 Table 5: Definition of Power Supply and GND Pins................................................................................... 19 Table 6: Pin Definition of WLAN_EN ......................................................................................................... 21 Table 7: Pin Definition of PCIe Interface .................................................................................................... 21 Table 8: Pin Definition of BT_EN ............................................................................................................... 23 Table 9: Pin Definition of UART Interface .................................................................................................. 24 Table 10: Pin Definition of BT_WAKE_HOST and HOST_WAKE_BT ...................................................... 25 Table 11: Pin Definition of PCM Interface .................................................................................................. 25 Table 12: Pin Definition of Coexistence Interfaces .................................................................................... 26 Table 13: Pin Definition of WLAN_SLP_CLK ............................................................................................ 26 Table 14: Parameters of WLAN_SLP_CLK ............................................................................................... 27 Table 15: Pin Definition of SW_CTRL ........................................................................................................ 27 Table 16: Pin Definition of RF Antenna Interfaces..................................................................................... 28 Table 17: Operating Frequencies (Unit: GHz) ........................................................................................... 28 Table 18: Antenna Requirements .............................................................................................................. 30 Table 19: Absolute Maximum Ratings (Unit: V) ......................................................................................... 33 Table 20: Module Power Supply Ratings (Unit: V) .................................................................................... 34 Table 21:Digital I/O Characteristics (Unit: V) ............................................................................................. 34 Table 22: Operating and Storage Temperatures (Unit: C) ....................................................................... 35 Table 23: Power Consumption of the Module (Low Power Modes, Unit: mA) .......................................... 36 Table 24: Power Consumption (Unit: mA) ................................................................................................. 36 Table 25: Wi-Fi Tx Power at 2.4 GHz (Unit: dBm) ..................................................................................... 38 Table 26: Wi-Fi Tx Power at 5 GHz (Unit: dBm) ........................................................................................ 39 Table 27: Wi-Fi Rx Sensitivity at 2.4 GHz (Unit: dBm) .............................................................................. 40 Table 28: Wi-Fi Rx Sensitivity at 5 GHz (Unit: dBm) ................................................................................. 41 Table 29: Bluetooth Tx Power and Rx Sensitivity (Unit: dBm) .................................................................. 42 Table 30: Electrostatic Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) ............ 42 Table 31: Recommended Thermal Profile Parameters ............................................................................. 49 Table 32: Carrier Tape Dimension Table (Unit: mm) ................................................................................. 51 Table 33: Plastic Reel Dimension Table (Unit: mm) .................................................................................. 52 Table 34: Related Documents .................................................................................................................... 54 Table 35: Terms and Abbreviations ........................................................................................................... 54 FC06E_Hardware_Design 7 / 53 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 14 Figure 2: Pin Assignment (Top View) ........................................................................................................ 15 Figure 3: Power-up and Power-down Timing ............................................................................................ 20 Figure 4: Wi-Fi Application Interface Connection ...................................................................................... 21 Figure 5: PCIe Interface Connection .......................................................................................................... 22 Figure 6: Bluetooth Application Interface Connection ............................................................................... 23 Figure 7: Reference Circuit with Voltage-level Translator ......................................................................... 24 Figure 8: PCM Interface Connection .......................................................................................................... 25 Figure 9: Requirements of WLAN_SLP_CLK ............................................................................................ 27 Figure 10: RF Antenna Reference Design ................................................................................................. 28 Figure 11: Microstrip Design on a 2-layer PCB ......................................................................................... 29 Figure 12: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 29 Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 29 Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 30 Figure 15: Dimensions of the Receptacle (Unit: mm) ................................................................................ 31 Figure 16: Specifications of Mated Plugs .................................................................................................. 32 Figure 17: Space Factor of the Mated Connectors (Unit: mm) .................................................................. 32 Figure 18: Placement and Fixing of the Heatsink ...................................................................................... 43 Figure 19: Module Top and Side Dimensions ............................................................................................ 44 Figure 20: Module Bottom Dimension (Bottom View) ................................................................................ 45 Figure 21: Recommended Footprint (Top View) ........................................................................................ 46 Figure 22: Top and Bottom Views of the Module ....................................................................................... 47 Figure 23: Recommended Reflow Soldering Thermal Profile ................................................................... 49 Figure 24: Carrier Tape Dimension Drawing ............................................................................................. 51 Figure 25: Plastic Reel Dimension Drawing .............................................................................................. 52 Figure 26: Packaging Process ................................................................................................................... 53 FC06E_Hardware_Design 8 / 53 Wi-Fi&Bluetooth Module Series 1 Introduction This document defines the FC06E and describes its air interfaces and hardware interfaces which are connected to your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. FC06E_Hardware_Design 9 / 53 Wi-Fi&Bluetooth Module Series 1.1. Special Mark Table 1: Special Mark Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. FC06E_Hardware_Design 10 / 53 Wi-Fi&Bluetooth Module Series 2 Product Overview 2.1. General Description The module is a Wi-Fi and Bluetooth module with low power consumption. It is a single-die Wi-Fi and Bluetooth* combo solution supporting IEEE 802.11a/b/g/n/ac/ax 2.4 GHz and 5 GHz Wi-Fi standards and Bluetooth 5.2 standard, which enables seamless integration of Wi-Fi and Bluetooth low energy technologies. FC06E can provide Wi-Fi functions with a low-power PCIe Gen 3 interface and Bluetooth functions with a UART and a PCM interface. 2.2. Key Features Table 2: Key Features Feature Detail Power Supply Core supply voltage: 0.95 V, 1.35 V, 1.95 V RF supply voltage: 3.3 V or 5.0 V I/O supply voltage: 1.8 V Operating Frequencies 2.4 GHz Wi-Fi: 2.4002.4835 GHz 5 GHz Wi-Fi: 5.1505.850 GHz Complies with IEEE 802.11a/b/g/n/ac/ax Supports 2 2 Multi-User Multiple-Input Multiple-Output (MU-MIMO) Supported channel bandwidths:

Wi-Fi Features

20/40 MHz at 2.4 GHz 20/40/80 MHz at 5 GHz Wi-Fi Transmission Data Rates Dual Band Simultaneous (DBS) with dual MAC, up to 1.77 Gbps data rate (2 2 + 2 2 802.11ax DBS) 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) FC06E_Hardware_Design 11 / 53 Wi-Fi&Bluetooth Module Series 802.11ac: VHT20 (MCS 08), VHT40 (MCS 09), VHT80 (MCS 09) 802.11ax: HE20 (MCS 011), HE40 (MCS 011), HE80 (MCS 011) Wi-Fi Transmitting Power VDD_FEM = 5 V 2.4 GHz:

802.11b @ 11 Mbps: 20 dBm 802.11g @ 54 Mbps: 19 dBm 802.11n, HT20 @ MCS 7: 18.5 dBm 802.11n, HT40 @ MCS 7: 18.5 dBm 802.11ax, HE20 @ MCS 11: 17.5 dBm 802.11ax, HE40 @ MCS 11: 17.5 dBm 5 GHz:

802.11a @ 54 Mbps: 19 dBm 802.11n, HT20 @ MCS 7: 18.5 dBm 802.11n, HT40 @ MCS 7: 18.5 dBm 802.11ac, VHT20 @ MCS 8: 17.5 dBm 802.11ac, VHT40 @ MCS 9: 17.5 dBm 802.11ac, VHT80 @ MCS 9: 17 dBm 802.11ax, HE20 @ MCS 11: 17 dBm 802.11ax, HE40 @ MCS 11: 17 dBm 802.11ax, HE80 @ MCS 11: 16.5 dBm VDD_FEM = 3.3 V 2.4 GHz:

802.11b @ 11 Mbps: 19 dBm 802.11g @ 54 Mbps: 15 dBm 802.11n, HT20 @ MCS 7: 15 dBm 802.11n, HT40 @ MCS 7: 15 dBm 802.11ax, HE20 @ MCS 11: 14 dBm 802.11ax, HE40 @ MCS 11: 14 dBm 5 GHz:

802.11a @ 54 Mbps: 16.5 dBm 802.11n, HT20 @ MCS 7: 16 dBm 802.11n, HT40 @ MCS 7: 16 dBm 802.11ac, VHT20 @ MCS 8: 15.5 dBm 802.11ac, VHT40 @ MCS 9: 15.5 dBm 802.11ac, VHT80 @ MCS 9: 15 dBm 802.11ax, HE20 @ MCS 11: 15 dBm 802.11ax, HE40 @ MCS 11: 15 dBm 802.11ax, HE80 @ MCS 11: 14 dBm Wi-Fi Operation Modes AP STA Wi-Fi Modulations CCK, DBPSK, BPSK, DQPSK, QPSK, 16QAM, 64QAM, 256QAM, 1024QAM FC06E_Hardware_Design 12 / 53 Wi-Fi&Bluetooth Module Series Wi-Fi Application Interface PCIe Bluetooth Application Interfaces*

UART PCM RF Antenna Interfaces ANT_WIFI0, ANT_WIFI1, ANT_BT 50 impedance Physical Characteristics Size: (25.5 0.15) mm (22 0.15) mm (2.25 0.2) mm Package: LCC Weight: approx. 2.27 g Temperature Ranges Operating temperature range: -30 C to +75 C 1 Storage temperature range: -40 C to +85 C RoHS All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram TThe following illustrates the main functional components of the module's block diagram Power supply Wi-Fi application interfaces Bluetooth application interfaces*

Coexistence interfaces Other interfaces RF antenna interfaces 1 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. FC06E_Hardware_Design 13 / 53 Wi-Fi&Bluetooth Module Series 2.4. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board ((FC06E-M.2) with accessories to control or test the module. For more details, see document [1]. FC06E_Hardware_Design 14 / 53 Wi-Fi&Bluetooth Module Series 3 Application Interfaces 3.1. Pin Assignment Figure 2: Pin Assignment (Top View) FC06E_Hardware_Design 15 / 53 31323334353736495054535251RESERVED4738394041424344454648GNDGNDANT_WIFI0GNDANT_BTGNDANT_WIFI1GNDGNDGNDGND55GND162930171819202122232425262728SW_CTRLCOEX_RXD/HOST_WAKE_BTBT_TXDBT_RXDBT_CTSWLAN_SLP_CLKGNDVDD_IOWLAN_ENPCIE_WAKE_NVDD_RFBT_RTSBT_ENGNDVDD_FEM56575859606162636465666768VDD_CORE_VMVDD_CORE_VL6970VDD_FEMVDD_CORE_VLGNDGNDVDD_CORE_VHGNDPCM_DOUTPCM_CLKPCM_DINPCM_SYNCVDD_RFBT_WAKE_HOSTGND141521RESERVEDRESERVED134567891011PCIE_RX_MRESERVEDPCIE_CLKREQ_NPCIE_RST_NPowerGNDWi-FiBluetoothANTCOEX3PCIE_RX_PPCIE_REFCLK_POthersGNDPCIE_TX_MGNDPCIE_TX_PPCIE_REFCLK_M12RESERVEDRESERVEDRESERVEDCOEX_TXDRESERVEDPA_MUTELAA_RXGNDLAA_TXENWLAN_TXENRESERVEDGNDGNDGNDGND7172737475908988878685911021011009984921031041059883939495969782767778798081FC06ETop View Wi-Fi&Bluetooth Module Series NOTE 1. Keep all RESERVED and unused pins unconnected. 2. All GND pins should be connected to ground. 3.2. Pin Description Table 3: I/O Parameters Definition Type AI AO AIO DI DO PI Description Analog Input Analog Input Analog Input/Output Digital Input Digital Output Power Input Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VDD_CORE_VL 69, 70 PI VDD_CORE_VM 66 PI VDD_CORE_VH 65 PI VDD_IO 18 PI Provides 0.95 V for the modules main chip Provides 1.35 V for the modules main chip Provides 1.95 V for the modules main chip Provides 1.8 V for the modules I/O pins Vmin = 0.9 V Vnom = 0.95 V Vmax = 1.05 V Vmin = 1.3 V Vnom = 1.35 V Vmax = 2.1 V Vmin = 1.85 V Vnom = 1.95 V Vmax = 2.1 V Vmin = 1.71 V Vnom = 1.8 V Vmax = 1.89 V FC06E_Hardware_Design 16 / 53 Wi-Fi&Bluetooth Module Series VDD_RF 28, 58 PI VDD_FEM 30, 56 PI Provides 1.95 V for RF circuit Vmin = 1.85 V Vnom = 1.95 V Vmax = 2.1 V Provides 3.3V or 5 V for the modules FEM part Vmin = 3.3 V Vnom = 5.0 V Vmax = 5.5 V GND 5, 8, 19, 29, 31, 3638, 4042, 4446, 4850, 55, 57, 64, 67, 68, 71105 Wi-Fi Application Interfaces Pin Name Pin No. I/O Description WLAN_EN 17 PCIE_REFCLK_M 3 PCIE_REFCLK_P PCIE_TX_M PCIE_TX_P PCIE_RX_M 4 6 7 9 DI AI AI Wi-Fi function enable control PCIe reference clock (-) PCIe reference clock (+) AO PCIe transmit (-) AO PCIe transmit (+) AI PCIe receive (-) PCIE_RX_P 10 AI PCIe receive (+) PCIE_CLKREQ_N 12 DO PCIe clock request DC Characteristics Comment VDD_IO Active high. Keep it connected. Requires differential impedance of 85 . PCIe Gen 3 compliant. Active low. Pull each of them up to 1.8 V with external 10 k resistors. PCIE_WAKE_N 16 DO PCIe wake up VDD_IO PCIE_RST_N 13 DI PCIe reset Active low. Bluetooth Application Interfaces*

Pin Name Pin No. I/O Description DC Characteristics Comment BT_EN 21 DI Bluetooth function enable control PCM_DIN PCM_SYNC PCM_CLK 62 60 63 DI PCM data input DI PCM data frame sync DI PCM clock VDD_IO Active high. If unused, pull it down with a 10 K resistor. If unused, keep them open. FC06E_Hardware_Design 17 / 53 Wi-Fi&Bluetooth Module Series DO PCM data output DO DCE request to send signal to DTE PCM_DOUT BT_RTS BT_CTS BT_RXD BT_TXD 61 22 23 24 25 BT_WAKE_HOST 59 DO HOST_WAKE_BT/

COEX_RXD 26 DI RF Antenna Interfaces DI DI DO DCE clear to send signal from DTE Bluetooth UART receive Bluetooth UART transmit Bluetooth wakes up host Host wakes up Bluetooth Pin Name Pin No. I/O Description DC Characteristics Comment ANT_WIFI0 ANT_WIFI1 ANT_BT*

43 47 39 AIO AIO AIO Wi-Fi 0 antenna interface Wi-Fi 1 antenna interface Bluetooth antenna interface Coexistence Interfaces 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment COEX_TXD 32 DO COEX_RXD/

HOST_WAKE_BT 26 DI LAA_TXEN 34 DI LAA_RX 54 DI 2.4 GHz LTE &

Wi-Fi coexistence transmit 2.4 GHz LTE &

Wi-Fi coexistence receive When it goes high, module places the 5 GHz receiver in a protected state. When it goes high, module allows LAA to receive on the Wi-Fi antennas. VDD_IO If unused, keep them open. FC06E_Hardware_Design 18 / 53 Wi-Fi&Bluetooth Module Series WLAN_TXEN 33 DO PA_MUTE 53 DI Other Interfaces Module asserts it to high state when 5 GHz is set to transmit at power greater than 10 dBm. When it goes high, 2.4 GHz PA is turned off. Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_SLP_CLK 20 DI SW_CTRL 27 DO 32.768 kHz sleep clock VDD_FEM power switch control VDD_IO If unused, keep it open. Active high. If unused, keep it open. RESERVED Pins Pin Name Pin No. Comment RESERVED 1, 2, 11, 14, 15, 35, 51,52 Keep them open. 3.3. Power Supply The following table shows the power supply pins and ground pins of the module. Table 5: Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VDD_CORE_VL 69, 70 VDD_CORE_VM 66 VDD_CORE_VH 65 VDD_IO 18 Provides 0.95 V for the modules main chip Provides 1.35 V for the modules main chip Provides 1.95 V for the modules main chip Provides 1.8 V for the modules I/O pins 0.9 0.95 1.05 1.3 1.35 2.1 1.85 1.95 2.1 1.71 1.8 1.89 V V V V FC06E_Hardware_Design 19 / 53 Wi-Fi&Bluetooth Module Series VDD_RF 28, 58 Provides 1.95 V for RF circuit 1.85 1.95 2.1 VDD_FEM 30, 56 Provides 3.3 V or 5 V for the modules FEM part 3.3 3.3, 5.0 5.5 V V GND 5, 8, 19, 29, 31, 3638, 4042, 4446, 4850, 55, 57, 64, 67, 68, 71105 The following figure shows the recommended power-up and power-down timing of the module. All input supplies must be ON and available before WLAN/BT_EN is asserted. There is no requirement for the timing between input power supplies. Figure 3: Power-up and Power-down Timing FC06E_Hardware_Design 20 / 53 VDD_IOVDD_CORE_VL/M/H 10 sWLAN_EN/BT_ENPCIE_CLKREQ_NPCIE_RST_NWLAN_SLP_CLK 4 ms 15 msSW_CTRL/VDD_RF 0 s Wi-Fi&Bluetooth Module Series 3.4. Wi-Fi Application Interfaces The following figure shows the Wi-Fi application interface connection between the module and the host. Figure 4: Wi-Fi Application Interface Connection 3.4.1. WLAN_EN WLAN_EN is used to control the Wi-Fi function of the module which will be enabled when WLAN_EN is at high level. Table 6: Pin Definition of WLAN_EN Pin Name Pin No. I/O Description Comment WLAN_EN 17 DI Wi-Fi function enable control 1.8 V power domain. Active high. Keep it connected. 3.4.2. PCIe Interface The module provides a PCIe interface with key features listed as below:

PCI Express Base Specification Revision 3.0 compliant. Data rate at 8 Gbps per lane. Used as the Wi-Fi application interface connected to the host. Table 7: Pin Definition of PCIe Interface Pin Name Pin No. I/O Description Comment PCIE_REFCLK_M 3 AI PCIe reference clock (-) Requires differential FC06E_Hardware_Design 21 / 53 PCIe InterfaceWLAN_ENModuleHostPCIe InterfaceWLAN_EN PCIE_REFCLK_P PCIE_TX_M PCIE_TX_P PCIE_RX_M 4 6 7 9 PCIE_RX_P 10 AI AO AO AI AI Wi-Fi&Bluetooth Module Series PCIe reference clock (+) impedance of 85 . PCIe Gen 3 compliant. PCIe transmit (-) PCIe transmit (+) PCIe receive (-) PCIe receive (+) PCIE_CLKREQ_N 12 DO PCIe clock request PCIE_WAKE_N 16 DO PCIe wake up PCIE_RST_N 13 DI PCIe reset 1.8 V power domain. Active low. Pull each of them up to 1.8 V with external 10 k resistors. 1.8 V power domain. Active low. The following figure shows the PCIe interface connection between the module and the host. Figure 5: PCIe Interface Connection To ensure the signal integrity of PCIe interface, C1 and C2 should be placed close to the module, and C3 and C4 should be placed close to the host. The extra stubs of traces must be as short as possible. The following principles of PCIe interface design should be complied with to meet PCIe Gen 3 specifications. It is important to route PCIE_TX_P/M, PCIE_RX_P/M, and PCIE_REFCLK_P/M as differential pairs FC06E_Hardware_Design 22 / 53 PCIE_CLKREQ_NPCIE_WAKE_NPCIE_RST_NModuleHostPCIE_REFCLK_PPCIE_REFCLK_MPCIE_TX_PPCIE_TX_MPCIE_RX_PPCIE_RX_MPCIE_CLKREQPCIE_WAKEPCIE_RSTPCIE_REFCLK_PPCIE_REFCLK_MPCIE_RX0_PPCIE_RX0_MPCIE_TX0_PPCIE_TX0_M1V810K10K220 nF220 nFC1C2NM220 nF220 nFC3C4R1R20R0R with ground surrounded. And the differential impedance should be 85 10 %. Wi-Fi&Bluetooth Module Series The maximum trace length of each differential pair (PCIE_TX_P/M, PCIE_RX_P/M, and PCIE_REFCLK_P/M) should be less than 200 mm, and trace length matching within each differential pair should be less than 0.5 mm. Space between PCIe signals and all other signals should be four times the trace width. Do not route signal traces under crystals, oscillators, magnetic devices, or RF signal traces. It is important to route the PCIe differential traces in inner-layer of the PCB and surround the traces with ground on that layer and with ground planes above and below. 3.5. Bluetooth Application Interfaces*

The following figure shows the Bluetooth application interface connection between the module and the host. Figure 6: Bluetooth Application Interface Connection NOTE GPIO1 of the host connected to BT_WAKE_HOST must be interruptible. 3.5.1. BT_EN BT_EN is used to control the Bluetooth function of the module. Bluetooth function will be enabled when BT_EN is at high level. If Bluetooth function is not needed, pull BT_EN down with a 10 k resistor. Table 8: Pin Definition of BT_EN Pin Name Pin No. I/O Description Comment BT_EN 21 DI Bluetooth function enable control 1.8 V power domain. FC06E_Hardware_Design 23 / 53 ModuleHostUARTPCMBT_ENUARTPCMBT_ENBT_WAKE_HOSTGPIO_1HOST_WAKE_BTGPIO_2 Wi-Fi&Bluetooth Module Series Active high. If unused, pull it down with a 10 K resistor. 3.5.2. UART Interface The module supports an HCI UART as defined in Bluetooth Core Specification Version 4.0. The UART supports hardware flow control, and it is used for data transmission with host. It supports up to 3.2 Mbps baud rates. The following table shows the pin definition of UART interface. Table 9: Pin Definition of UART Interface Pin Name Pin No. I/O Description Comment BT_RTS BT_CTS BT_RXD BT_TXD 22 23 24 25 DO DI DI DCE request to send signal to DTE DCE clear to send signal from DTE Bluetooth UART receive DO Bluetooth UART transmit 1.8 V power domain. If unused, keep them open. The module provides a 1.8 V UART interface. A voltage-level translator should be used if the application is equipped with a 3.3 V UART interface. A voltage-level translator TXS0104EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. Figure 7: Reference Circuit with Voltage-level Translator FC06E_Hardware_Design 24 / 53 VCCAVCCBOEGNDB1B2B3B4VCC_1V80.1 F0.1 FBT_CTS_3V3BT_RXD_3V3BT_RTS_3V3BT_TXD_3V3VCC_3V3TranslatorA1A2A3A4BT_CTSBT_RXDBT_RTSBT_TXD Wi-Fi&Bluetooth Module Series 3.5.3. BT_WAKE_HOST and HOST_WAKE_BT BT_WAKE_HOST and HOST_WAKE_BT are used to wake up the host and the module respectively. If you use Quectel 5G RG520x series as the host, these two pins can be left open because the wakeup function can be achieved through Bluetooth UART. Table 10: Pin Definition of BT_WAKE_HOST and HOST_WAKE_BT Pin Name Pin No. I/O Description Comment BT_WAKE_HOST HOST_WAKE_BT 59 26 DO Bluetooth wakes up host DI Host wakes up Bluetooth 1.8 V power domain. If unused, keep them open. 3.5.4. PCM Interface The PCM interface is used for Bluetooth audio. The following table shows the pin definition of PCM interface. Table 11: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_DIN PCM_SYNC PCM_CLK PCM_DOUT 62 60 63 61 DI DI DI PCM data input PCM data frame sync PCM clock DO PCM data output 1.8 V power domain. If unused, keep them open. The following figure shows the PCM interface connection between the module and the host. Figure 8: PCM Interface Connection FC06E_Hardware_Design 25 / 53 ModuleHostPCM_CLKPCM_SYNCPCM_DOUTPCM_DINPCM_CLKPCM_SYNCPCM_DINPCM_DOUT Wi-Fi&Bluetooth Module Series 3.6. Coexistence Interfaces The module supports 2.4 GHz LTE & Wi-Fi coexistence and 5 GHz LTE & Wi-Fi coexistence. The following table shows the pin definition of coexistence interfaces. Table 12: Pin Definition of Coexistence Interfaces Pin Name Pin No. I/O Description Comment COEX_TXD 32 DO 2.4 GHz LTE & Wi-Fi coexistence transmit COEX_RXD 26 DI 2.4 GHz LTE & Wi-Fi coexistence receive LAA_TXEN 34 LAA_RX 54 DI DI When it goes high, module places the 5 GHz receiver in a protected state. When it goes high, module allows LAA to receive on the Wi-Fi antennas. 1.8 V power domain. If unused, keep them open. WLAN_TXEN 33 DO Module asserts it to high state when 5 GHz is set to transmit at power greater than 10 dBm. PA_MUTE 53 DI When it goes high, 2.4 GHz PA is turned off. 3.7. Other Interfaces 3.7.1. WLAN_SLP_CLK The WLAN_SLP_CLK is 32.768 kHz sleep clock which is used in low power modes, such as power saving mode and sleep mode. It serves as a timer in various power saving schemes, and can maintain basic logic operations when the module is in sleep mode. Table 13: Pin Definition of WLAN_SLP_CLK Pin Name Pin No. I/O Description Comment WLAN_SLP_CLK 20 DI 32.768 kHz sleep clock 1.8 V power domain. If unused, keep it open. Figure and table below show the reference input clock requirements of WLAN_SLP_CLK. FC06E_Hardware_Design 26 / 53 Wi-Fi&Bluetooth Module Series Figure 9: Requirements of WLAN_SLP_CLK Table 14: Parameters of WLAN_SLP_CLK Parameter Description T (xoh) Sleep-clock logic high T (xol) Sleep-clock logic low T F Sleep-clock period Sleep-clock frequency (F = 1/T) Vpp Peak-to-peak voltage Min 4.58 4.58

Typ 4.58 4.58 30.5208 32.7645 1.8 Max Unit 25.94 25.94

s s s kHz V 3.7.2. SW_CTRL SW_CTRL can be used to control external RF power supply chip. The following table shows the pin definition of SW_CTRL. Table 15: Pin Definition of SW_CTRL Pin Name Pin No. I/O Description Comment SW_CTRL 27 DO VDD_FEM power switch control 1.8 V power domain. Active high. If unused, keep it open. FC06E_Hardware_Design 27 / 53 Wi-Fi&Bluetooth Module Series 3.8. RF Antenna Interfaces Table 16: Pin Definition of RF Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_WIFI0 ANT_WIFI1 ANT_BT*

43 47 39 AIO AIO AIO Wi-Fi 0 antenna interface Wi-Fi 1 antenna interface 50 impedance Bluetooth antenna interface 3.8.1. Operating Frequencies Table 17: Operating Frequencies (Unit: GHz) Feature 2.4 GHz Wi-Fi 5 GHz Wi-Fi Frequency 2.4002.4835 5.1505.850 3.8.2. RF Antenna Reference Design FC06E provides three RF antenna interfaces for antenna connection. The following reference design shows an example with ANT_WIFI0. For other RF antenna interfaces, the reference design is the same. It is recommended to reserve a -type matching circuit for better RF performance, and the -type matching components (C1, C2, R1) should be placed as close to the antenna as possible. C1 and C2 are not mounted by default. Figure 10: RF Antenna Reference Design FC06E_Hardware_Design 28 / 53 ModuleANT_WIFI0R10RC1C2NMNM Wi-Fi&Bluetooth Module Series 3.8.3. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 11: Microstrip Design on a 2-layer PCB Figure 12: Coplanar Waveguide Design on a 2-layer PCB Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) FC06E_Hardware_Design 29 / 53 Wi-Fi&Bluetooth Module Series Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [2]. 3.8.4. Antenna Design Requirements The following table shows the requirements for antennas. Table 18: Antenna Requirements Parameter Frequency Ranges (GHz) Cable Insertion Loss (dB) VSWR Gain (dBi) Requirement 2.4002.4835 5.1505.850

< 1 2 1 (Typ.) FC06E_Hardware_Design 30 / 53 Wi-Fi&Bluetooth Module Series Max. Input Power (W) Input Impedance () 50 50 Polarization Type Vertical 3.8.5. RF Connector Recommendation If the RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 15: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. FC06E_Hardware_Design 31 / 53 Wi-Fi&Bluetooth Module Series Figure 16: Specifications of Mated Plugs The following figure describes the space factor of the mated connectors. Figure 17: Space Factor of the Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FC06E_Hardware_Design 32 / 53 Wi-Fi&Bluetooth Module Series 4 Electrical Characteristics & Reliability 4.1. Absolute Maximum Ratings The following table shows the absolute maximum ratings. Table 19: Absolute Maximum Ratings (Unit: V) Parameter VDD_CORE_VL VDD_CORE_VM VDD_CORE_VH VDD_IO VDD_RF VDD_FEM I/O input pins voltage NOTE Min.

-0.3

-0.3

-0.3

-0.3

-0.3

-0.3

-0.3 Max. VDDX + 0.2 VDDX + 0.2 VDDX + 0.2 VDDX + 0.2 VDDX + 0.2 6.0 VDD_IO + 0.2 VDDX is the external supply voltage for the corresponding power input pins. FC06E_Hardware_Design 33 / 53 Wi-Fi&Bluetooth Module Series 4.2. Power Supply Ratings Table 20: Module Power Supply Ratings (Unit: V) Parameter VDD_CORE_VL VDD_CORE_VM VDD_CORE_VH VDD_IO VDD_RF VDD_FEM Min. 0.9 1.3 1.85 1.71 1.85 3.3 Typ. 0.95 1.35 1.95 1.8 1.95 5.0 Max. 1.05 2.1 2.1 1.89 2.1 5.5 4.3. Digital I/O Characteristics Table 21:Digital I/O Characteristics (Unit: V) Parameter Description Min. Max. VIH VIL VOH VOL High-level Input Voltage 0.65 VDD_IO VDD_IO + 0.3 Low-level Input Voltage

-0.3 0.35 VDD_IO High-level Output Voltage VDD_IO - 0.45 VDD_IO Low-level Output Voltage 0 0.45 FC06E_Hardware_Design 34 / 53 Wi-Fi&Bluetooth Module Series 4.4. Operating and Storage Temperatures Table 22: Operating and Storage Temperatures (Unit: C) Parameter Operating Temperature Range 2 Storage Temperature Range Min.

-30

-40 Typ. 25

Max.

+75

+85 2 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. FC06E_Hardware_Design 35 / 53 Wi-Fi&Bluetooth Module Series 4.5. Power Consumption The following tables show the power consumption of the module in different modes. 4.5.1. Power Consumption in Low Power Modes Table 23: Power Consumption of the Module (Low Power Modes, Unit: mA) Module State Wi-Fi State VDD_CORE_VL VDD_CORE_VM VDD_CORE_VH VDD_IO VDD_RF VDD_FEM OFF 3 Wi-Fi function disabled 0.12 0.08 0.07 2.1 0.03 0.02 4.5.2. Power Consumption Table 24: Power Consumption (Unit: mA) Mode Condition VDD_CORE_VL VDD_CORE_VM VDD_CORE_VH VDD_IO VDD_RF VDD_FEM 802.11n HT20 @ MCS 0 413.99 802.11n HT40 @ MCS 7 426.17 282.85 300.12 2 2 +

2 2

(DBS) 802.11n HT20 @ MCS 0 +

802.11ac VHT20 MCS 0 802.11n MCS 7 HT40 +

802.11ac MCS 9 VHT80 385.44 284.79 430.46 302.49 140.11 143.89 141.51 143.28 7.52 7.57 7.53 7.55 0.03 0.03 1287 1148 0.03 1316 0.02 1158 3 In OFF state, the Wi-Fi driver is uninstalled and WLAN_EN is pulled down. FC06E_Hardware_Design 36 / 53 Wi-Fi&Bluetooth Module Series 802.11ax MCS 0 HE20 402.1 295.64 802.11ax MCS 11 2.4 GHz HE40 + 5 GHz HE80 488.97 311.17 152.93 150.23 7.53 7.56 0.03 1289 0.03 1142 FC06E_Hardware_Design 37 / 53 Wi-Fi&Bluetooth Module Series 4.6. RF Performances The following tables summarize the Wi-Fi transmitting and receiving performances of the module. 4.6.1. Wi-Fi RF Performances Table 25: Wi-Fi Tx Power at 2.4 GHz (Unit: dBm) Description VDD_FEM = 5 V Typ. Tolerance 802.11b @ 1 Mbps 802.11b @ 11 Mbps 802.11g @ 6 Mbps 802.11g @ 54 Mbps 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11 Description VDD_FEM = 3.3 V 802.11b @ 1 Mbps 802.11b @ 11 Mbps 802.11g @ 6 Mbps 802.11g @ 54 Mbps 802.11n, HT20 @ MCS 0 20 20 20 19 20 18.5 20 18.5 20 17.5 20 17.5 Typ. 19 19 17 15 17 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB Tolerance 2 dB 2 dB 2 dB 2 dB 2 dB FC06E_Hardware_Design 38 / 53 Wi-Fi&Bluetooth Module Series 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11 15 17 15 17 14 17 14 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB Table 26: Wi-Fi Tx Power at 5 GHz (Unit: dBm) Description VDD_FEM = 5 V Typ. Tolerance 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ac, VHT20 @ MCS 0 802.11ac, VHT20 @ MCS 8 802.11ac, VHT40 @ MCS 0 802.11ac, VHT40 @ MCS 9 802.11ac, VHT80 @ MCS 0 802.11ac, VHT80 @ MCS 9 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 20 19 20 18.5 20 18.5 20 17.5 20 17.5 20 17 20 17 20 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB FC06E_Hardware_Design 39 / 53 Wi-Fi&Bluetooth Module Series 802.11ax, HE40 @ MCS 11 802.11ax, HE80 @ MCS 0 802.11ax, HE80 @ MCS 11 Description VDD_FEM = 3.3 V 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ac, VHT20 @ MCS 0 802.11ac, VHT20 @ MCS 8 802.11ac, VHT40 @ MCS 0 802.11ac, VHT40 @ MCS 9 802.11ac, VHT80 @ MCS 0 802.11ac, VHT80 @ MCS 9 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11 802.11ax, HE80 @ MCS 0 802.11ax, HE80 @ MCS 11 17 20 16.5 Typ. 18 16.5 18 16 18 16 18 15.5 18 15.5 17.5 15 18 15 18 15 17.5 14 2 dB 2 dB 2 dB Tolerance 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB Table 27: Wi-Fi Rx Sensitivity at 2.4 GHz (Unit: dBm) Description VDD_FEM = 5 V or 3.3V Typ. Tolerance FC06E_Hardware_Design 40 / 53 Wi-Fi&Bluetooth Module Series 802.11b @ 1 Mbps 802.11b @ 11 Mbps 802.11g @ 6 Mbps 802.11g @ 54 Mbps 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11

-95

-89

-93

-75

-91

-72

-89

-70

-91

-63

-90

-61 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB Table 28: Wi-Fi Rx Sensitivity at 5 GHz (Unit: dBm) Description VDD_FEM = 5 V or 3.3V Typ. Tolerance 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ac, VHT20 @ MCS 0 802.11ac, VHT20 @ MCS 8 802.11ac, VHT40 @ MCS 0 802.11ac, VHT40 @ MCS 9

-92

-74

-91

-72

-88

-70

-91

-70

-90

-65 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB FC06E_Hardware_Design 41 / 53 802.11ac, VHT80 @ MCS 0 802.11ac, VHT80 @ MCS 9 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11 802.11ax, HE80 @ MCS 0 802.11ax, HE80 @ MCS 11 Wi-Fi&Bluetooth Module Series

-86

-61

-91

-63

-90

-60

-86

-58 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 2 dB 4.6.2. Bluetooth RF Performances*

Table 29: Bluetooth Tx Power and Rx Sensitivity (Unit: dBm) Mode GFSK

/4-DQPSK 8-DQPSK BLE (1 Mbps) BLE (2 Mbps) Transmitting Power (Typ.) Receiving Sensitivity (Typ.) 8 6.5 6.5 8 8

-91

-91

-88

-98

-95 4.7. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 30: Electrostatic Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) Tested Interfaces Contact Discharge Air Discharge Unit FC06E_Hardware_Design 42 / 53 Wi-Fi&Bluetooth Module Series Antenna Interfaces Other Interfaces 3 0.5 6 1 kV kV 4.8. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and functions (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:

- Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.

- Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

- Choose the heatsink with adequate fins to dissipate heat;

- Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

- Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 18: Placement and Fixing of the Heatsink FC06E_Hardware_Design 43 / 53 PCBHeatsinkTIMModuleScrewTIMModuleHeatsinkPCB Wi-Fi&Bluetooth Module Series 5 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions Figure 19: Module Top and Side Dimensions FC06E_Hardware_Design 44 / 53 Wi-Fi&Bluetooth Module Series Figure 20: Module Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FC06E_Hardware_Design 45 / 53 Wi-Fi&Bluetooth Module Series 5.2. Recommended Footprint Figure 21: Recommended Footprint (Top View)

. NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FC06E_Hardware_Design 46 / 53 5.3. Top and Bottom Views Wi-Fi&Bluetooth Module Series Figure 22: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FC06E_Hardware_Design 47 / 53 Wi-Fi&Bluetooth Module Series 6 Storage, Manufacturing and Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 4 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 4 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. FC06E_Hardware_Design 48 / 53 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 6.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [3]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 23: Recommended Reflow Soldering Thermal Profile Table 31: Recommended Thermal Profile Parameters FC06E_Hardware_Design 49 / 53 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Ramp-to-soak slope: 03 C/s Cool-down slope: -30 C/s Ramp-up slope: 03 C/s Wi-Fi&Bluetooth Module Series Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3]. FC06E_Hardware_Design 50 / 53 Wi-Fi&Bluetooth Module Series 6.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

6.3.1. Carrier Tape Dimension details are as follow:

Figure 24: Carrier Tape Dimension Drawing Table 32: Carrier Tape Dimension Table (Unit: mm) W 44 P 32 T A0 B0 0.4 18.5 20.5 K0 3 K1 6.8 F E 20.2 1.75 FC06E_Hardware_Design 51 / 53 6.3.2. Plastic Reel Wi-Fi&Bluetooth Module Series Figure 25: Plastic Reel Dimension Drawing Table 33: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 6.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. FC06E_Hardware_Design 52 / 53 Wi-Fi&Bluetooth Module Series Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 1000 modules. Figure 26: Packaging Process FC06E_Hardware_Design 53 / 53 Wi-Fi&Bluetooth Module Series 7 Appendix References Table 34: Related Documents Document Name

[1] Quectel_Wi-Fi-M.2_EVB_User_Guide

[2] Quectel_RF_Layout_Application_Note

[3] Quectel_Module_SMT_Application_Note Table 35: Terms and Abbreviations Abbreviation Description AP BLE BPSK CCK CTS DBS DCE DPSK DQPSK DTE ESD EVB Access Point Bluetooth Low Energy Binary Phase Shift Keying Complementary Code Keying Clear To Send Dual Band Simultaneous Data Communications Equipment Differential Phase Shift Keying Differential Quadrature Phase Shift Keying Data Terminal Equipment Electrostatic Discharge Evaluation Board FC06E_Hardware_Design 54 / 53 Wi-Fi&Bluetooth Module Series FEM GFSK GND HCI HE HT IEEE I/O LAA LCC LGA LTE MAC Mbps MCS MSL Front-End Module Gauss frequency Shift Keying Ground Host Controller Interface High Efficiency High Throughput Institute of Electrical and Electronics Engineers Input/Output License Assisted Access Leadless chip carrier Land Grid Array Long Term Evolution Medium Access Control Megabits per second Modulation and Coding Scheme Moisture Sensitivity Levels MU-MIMO Multi-User Multiple-Input Multiple-Output PA PCB PCIe PCM QAM QPSK RF RoHS Power Amplifier Printed Circuit Board Peripheral Component Interconnect Express Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances FC06E_Hardware_Design 55 / 53 Wi-Fi&Bluetooth Module Series RTS Rx SMT STA TBD Tx UART VHT VIH VIL Vmax Vmin Vnom VOH VOL Vpp VSWR Wi-Fi Request To Send Receive Surface Mount Technology Station To Be Determined Transmit Universal Asynchronous Receiver/Transmitter Very High Throughput High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Nominal Voltage High-level Output Voltage Low-level Output Voltage Peak-to-peak Voltage Voltage Standing Wave Ratio Wireless-Fidelity FC06E_Hardware_Design 56 / 53 8 Worning 8.1. Important Notice to OEM integrators Product Marketing NameQuectel FC06E 1.This module is limited to OEM installation ONLY. 2.This module is limited to installation in fixed applications, according to Part 2.1091(b). 3.The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd.. that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product LabelingWhen the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2023FC06E The FCC ID can be used only when all FCC mpliance requirements are met. Antenna Installation

(1)The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2)The transmitter module may not be co-located with any other transmitter or antenna.

(3)Only antennas of the same type and with equal or less gains as shown below may be used with thismodule. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

(4)The max allowed antenna gain is 1 dBi for external monopole antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 7.2. FCC Statement Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following conditions:

(For module device use) 1)The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2)The transmitter module may not be co-located with any other transmitter or antenna. As long as 2conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. 8.3. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device."

or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-2023FC06E or where: 10224A-2023FC06E is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-2023FC06E" ou "o: 10224A-2023FC06E est le numro de certification du module". i. the device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;

iii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;

iv. Omnidirectional antenna is recommended

QUECTEL FCO6E Q1-CXXXX FCO6EACMD SN: C11 49065G200X FCC ID:XMR2023FCO6E 1C:10224A-2023FCO6E C cA O Label Location

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

City:

Country:

Declare that:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 Shanghai China Name Representative of agent: Well Wei Agent Company name:

Address:

City:

Country SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone Suzhou China is authorized to apply for Certification of the following product(s):

Product description: Wi-Fi & Bluetooth Module Type designation: FC06E Quectel Trademark:

FCC ID: XMR2023FC06E on our behalf. Date:

City:

Name:

Email:

2023/06/05.. Shanghai.. Jean hu .. jean.hu@quectel.com Signature:

Quectel Wireless Solutions Co., Ltd. To: Federal Communications Commission Date: 2023/06/14 7435 Oakland Mills Road Columbia, MD 21046 USA Attestation Section 2.911(d)(5)(i) and Section 2.911(d)(5)(ii)

(KDB 986446 D01 Covered Equipment) Section 2.911(d)(5)(i)

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Section 2.911(d)(5)(ii)

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing covered equipment. Type of Equipment subject to FCC Certification:

FCC ID:XMR2023FC06E If you have any questions, please feel free to contact me Contact Person:

Position in the Company: Certification Manager Date of Signature:

2023/06/14 Jean hu _ __________________________

RF_734_02 04 April 16 Quectel Wireless Solutions Co., Ltd. Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR2023FC06E Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. Answer from applicant Yes, please see exhibition external photos Yes, The modular has buffer modulation /data inputs 3. The modular transmitter must have its own power supply regulation. Yes, please see the schem.pdf 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. there are very strict operational and 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Yes, The requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, Please refer to the setup photo exhibition for the stand-alone configuration Yes, The Module will be label with its own FCC ID ,and the instruction on the labelling rule of the end product has been stated in the user manual of this module .please refer to the label and user manual exhibition. Yes, The required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, Please refer exhibition RF exposure for the compliance of MPE RF exposure rule. RF_734_02 04 April 16 Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. Name and surname of applicant (or authorized representative):_ Signature:

Date:

City:

Name:

Email:

2023/06/05 Shanghai .. Jean hu .. jean.hu@quectel.com Signature:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 We have declared below featured for FCC equipment authorization, device FCC ID:

UNII Declaration Letter XMR2023FC06E

(1) DFS Device --

Master, Client with Radar detection capability , N/A Client without radar detection capability,

(2) Active / Passive Scanning , adhoc mode access point capability Frequency Band

(MHz) Active Scanning

(the device can transmit a probe

(beacon)) 2412 2462 MHz 2422 2452 MHz 5745 5825 MHz 5755 5795 MHz 5180 5240 MHz 5190 5230 MHz 5260 5320 MHz 5270 5310 MHz 5500 5700 MHz Yes, 5510 5670 MHz Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No No passive scanning

(where the device is can listen only with no probes) Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No No Ad Hoc Mode capability Access point capability Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No No Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, Yes, No No No No No No No No No No

(3) Country code selection ability -

If no, pls explain how was implemented : use Microsoft network utility No Yes ,

(4) Meet 15.202 requirement -

pls check below :

Yes , No , A master device is defined as a device operating in a mode in which it has the capability to transmit without receiving an enabling signal. In this mode it is able to select a channel and initiate a network by sending enabling signals to other devices A client device is defined as a device operating in a mode in which the transmissions of the device are under control of the master. A device in client mode is not able to initiate a network.

(5) For client devices that have software configuration control to operate in different modes (active scanning in some and passive scanning in others) in different bands (devices with multiple equipment classes or those that operate on non-DFS frequencies) or modular devices which configure the modes of operations through software, the application must provide software and operations description on how the software and / or hardware is implemented to ensure that proper operations modes can not be modified by end user or an installer. No Apply , Apply ,

(If apply , pls help to provide explanation on how it was implement (By hardware or software , and how software was controlled) If you have any questions, please feel free to contact me at the address shown below. Yours sincerely, Signatory Quectel Wireless Solutions Co., Ltd. Printed Name:Jean hu

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Date: June 5, 2023 Federal Communications Commission Office of Engineering and Technology Laboratory Division 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Request for Confidentiality FCC ID: XMR2023FC06E To Whom It May Concern, Pursuant to the provisions of Sections 0.457 and 0.459 of Commissions rules (47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure indefinitely. Schematic Diagram Block Diagram Part List Operational Description Tune-up Procedure Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In additional to above mentioned documents, pursuant to Public Notice DA 04-1705 of the Commission s policy, in order to comply with the marketing regulations in 47 CFT 2.803 and the importation rules in 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. External Photos Internal Photos Test Setup Photos User Manual It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Best Regards, ___ _ Jean hu jean.hu@quectel.com