FCC ID: XMR2023FC66E Wi-Fi & Bluetooth Module

FC66E Series Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.1 Date: 2023-02-09 Status: Preliminary Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FC66E_Series_Hardware_Design 1 / 63 Wi-Fi&Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. FC66E_Series_Hardware_Design 2 / 63 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FC66E_Series_Hardware_Design 3 / 63 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description

2020-12-30 1.0.0 2022-12-30 Soni RAO/

Michael DU Soni RAO/

Michael DU Creation of the document Preliminary Preliminary:

1. Deleted the relevant information of FC65E. 2. Added the relevant information of FC66E-B. 3. Updated the power supply voltages (Table 1&3&4). 4. Updated some TBD information (Table 1). 5. Updated the operating temperature range (Table 1). 6. Updated the power-up and power-down timing 1.0.1 2023-02-09 Soni RAO

(Figure 3). 7. Updated the reliability, radio and electrical characteristics (Chapter 4). 8. Updated the bottom dimensions and recommended footprint of the module (Figure 19&20). 9. Updated the ramp-up and cool-down slopes (Figure 20, Table 21). 10. Updated the packing specifications (Chapter 6.3). FC66E_Series_Hardware_Design 4 / 63 Wi-Fi&Bluetooth Module Series Contents Safety Information ...................................................................................................................................... 3 About the Document .................................................................................................................................. 4 Contents ...................................................................................................................................................... 5 Table Index .................................................................................................................................................. 7 Figure Index ................................................................................................................................................ 8 1 Introduction ......................................................................................................................................... 9 2 Product Overview ............................................................................................................................. 15 2.1. General Description ................................................................................................................. 15 2.2. Key Features ............................................................................................................................ 15 2.3. EVB Kit ..................................................................................................................................... 18 3 Application Interfaces ...................................................................................................................... 19 3.1. General Description ................................................................................................................. 19 3.2. Pin Assignment ........................................................................................................................ 20 3.3. Pin Description ......................................................................................................................... 21 3.4. Power Supply ........................................................................................................................... 25 3.5. Wi-Fi Application Interfaces ..................................................................................................... 26 3.5.1. WLAN_EN ..................................................................................................................... 26 3.5.2. PCIe Interface ............................................................................................................... 26 3.6. Bluetooth Application Interfaces .............................................................................................. 28 3.6.1. BT_EN........................................................................................................................... 28 3.6.2. UART Interface ............................................................................................................. 29 3.6.3. BT_WAKE_HOST and HOST_WAKE_BT ................................................................... 30 3.6.4. PCM Interface ............................................................................................................... 30 3.7. Coexistence Interfaces ............................................................................................................ 31 3.8. Other Interfaces ....................................................................................................................... 32 3.8.1. WLAN_SLP_CLK .......................................................................................................... 32 3.8.2. SW_CTRL ..................................................................................................................... 33 3.9. RF Antenna Interfaces ............................................................................................................. 33 3.9.1. Operating Frequencies ................................................................................................. 33 3.9.2. RF Antenna Reference Design ..................................................................................... 34 3.9.3. RF Routing Guidelines .................................................................................................. 34 3.9.4. Antenna Design Requirements ..................................................................................... 36 3.9.5. RF Connector Recommendation .................................................................................. 36 4 Reliability, Radio and Electrical Characteristics ........................................................................... 39 4.1. Absolute Maximum Ratings ..................................................................................................... 39 4.2. Power Supply Ratings .............................................................................................................. 40 4.3. Digital I/O Characteristics ........................................................................................................ 40 FC66E_Series_Hardware_Design 5 / 63 Wi-Fi&Bluetooth Module Series 4.4. Operating and Storage Temperatures ..................................................................................... 41 4.5. Power Consumption ................................................................................................................. 42 4.5.1. Power Consumption in Low Power Modes ................................................................... 42 4.5.2. Power Consumption in Non-signaling Mode ................................................................ 43 4.6. RF Performances ..................................................................................................................... 45 4.6.1. Wi-Fi RF Performances ................................................................................................ 45 4.6.2. Bluetooth RF Performances ......................................................................................... 49 4.7. ESD Protection ......................................................................................................................... 50 5 Mechanical Information .................................................................................................................... 51 5.1. Mechanical Dimensions ........................................................................................................... 51 5.2. Recommended Footprint ......................................................................................................... 53 5.3. Top and Bottom Views ............................................................................................................. 54 6 Storage, Manufacturing and Packaging ......................................................................................... 55 6.1. Storage Conditions................................................................................................................... 55 6.2. Manufacturing and Soldering ................................................................................................... 56 6.3. Packaging Specifications ......................................................................................................... 58 6.3.1. Carrier Tape .................................................................................................................. 58 6.3.2. Plastic Reel ................................................................................................................... 59 6.3.3. Mounting Direction ........................................................................................................ 59 6.3.4. Packaging Process ....................................................................................................... 60 7 Appendix References ....................................................................................................................... 61 FC66E_Series_Hardware_Design 6 / 63 Wi-Fi&Bluetooth Module Series Table Index Table 1: Key Features ................................................................................................................................ 15 Table 2: I/O Parameters Definition ............................................................................................................. 21 Table 3: Pin Description ............................................................................................................................. 21 Table 4: Definition of Power Supply and GND Pins................................................................................... 25 Table 5: Pin Definition of WLAN_EN ......................................................................................................... 26 Table 6: Pin Definition of PCIe Interface .................................................................................................... 26 Table 7: Pin Definition of BT_EN ............................................................................................................... 28 Table 8: Pin Definition of UART Interface .................................................................................................. 29 Table 9: Pin Definition of BT_WAKE_HOST and HOST_WAKE_BT ........................................................ 30 Table 10: Pin Definition of PCM Interface .................................................................................................. 30 Table 11: Pin Definition of Coexistence Interfaces .................................................................................... 31 Table 12: Pin Definition of WLAN_SLP_CLK ............................................................................................ 32 Table 13: Parameters of WLAN_SLP_CLK ............................................................................................... 32 Table 14: Pin Definition of SW_CTRL ........................................................................................................ 33 Table 15: Pin Definition of RF Antenna Interfaces..................................................................................... 33 Table 16: Operating Frequencies (Unit: GHz) ........................................................................................... 33 Table 17: Antenna Requirements .............................................................................................................. 36 Table 18: Absolute Maximum Ratings (Unit: V) ......................................................................................... 39 Table 19: Module Power Supply Ratings (Unit: V) .................................................................................... 40 Table 20: VDD_IO I/O Requirements (Unit: V) .......................................................................................... 40 Table 21: Operating and Storage Temperatures (Unit: C) ....................................................................... 41 Table 22: Power Consumption of the Module (Low Power Modes, Unit: mA) .......................................... 42 Table 23: Tx Power Consumption (Unit: mA) ............................................................................................ 43 Table 24: Wi-Fi Tx Power at 2.4 GHz ........................................................................................................ 45 Table 25: Wi-Fi Tx Power at 5 GHz ........................................................................................................... 45 Table 26: Wi-Fi Tx Power at 6 GHz ........................................................................................................... 46 Table 27: Wi-Fi Rx Sensitivity at 2.4 GHz .................................................................................................. 47 Table 28: Wi-Fi Rx Sensitivity at 5 GHz ..................................................................................................... 47 Table 29: Wi-Fi Rx Sensitivity at 6 GHz ..................................................................................................... 48 Table 30: Bluetooth Tx Power and Rx Sensitivity (Unit: dBm) .................................................................. 49 Table 31: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %, Unit: kV) ........................... 50 Table 32: Recommended Thermal Profile Parameters ............................................................................. 57 Table 33: Carrier Tape Dimension Table (Unit: mm) ................................................................................. 58 Table 34: Plastic Reel Dimension Table (Unit: mm) .................................................................................. 59 Table 35: Related Documents.................................................................................................................... 61 Table 36: Terms and Abbreviations ........................................................................................................... 61 FC66E_Series_Hardware_Design 7 / 63 Wi-Fi&Bluetooth Module Series Figure Index Figure 2: Pin Assignment (Top View) ........................................................................................................ 20 Figure 3: Power-up and Power-down Timing ............................................................................................ 25 Figure 4: Wi-Fi Application Interface Connection ...................................................................................... 26 Figure 5: PCIe Interface Connection .......................................................................................................... 27 Figure 6: Bluetooth Application Interface Connection ............................................................................... 28 Figure 7: Reference Circuit with a Voltage-level Translator ...................................................................... 29 Figure 8: PCM Interface Connection .......................................................................................................... 30 Figure 9: Requirements of WLAN_SLP_CLK ............................................................................................ 32 Figure 10: RF Antenna Reference Design ................................................................................................. 34 Figure 11: Microstrip Design on a 2-layer PCB ......................................................................................... 34 Figure 12: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 35 Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 35 Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 35 Figure 15: Dimensions of the Receptacle (Unit: mm) ................................................................................ 37 Figure 16: Specifications of Mated Plugs................................................................................................... 37 Figure 17: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 38 Figure 18: Module Top and Side Dimensions ............................................................................................ 51 Figure 19: Module Bottom Dimensions (Bottom View) .............................................................................. 52 Figure 20: Recommended Footprint .......................................................................................................... 53 Figure 21: Top & Bottom Views of the Module .......................................................................................... 54 Figure 22: Recommended Reflow Soldering Thermal Profile ................................................................... 56 Figure 23: Carrier Tape Dimension Drawing ............................................................................................. 58 Figure 24: Plastic Reel Dimension Drawing............................................................................................... 59 Figure 25: Mounting Direction .................................................................................................................... 59 Figure 26: Packaging Process ................................................................................................................... 60 FC66E_Series_Hardware_Design 8 / 63 Wi-Fi&Bluetooth Module Series 1 Introduction This document defines the FC66E series modules and describes their air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. This document is applicable to FC66E and FC66E-B. FCC Declaration:

Any changes or modifications not expressly approved by Quectel or the party responsible for compliance could void the users authority to operate the equipment and invalidate the regulatory approval. Host manufacturer must follow KDB Publication 996369 D04 Modulen Integration Guide. Host manufacturer is responsible for regression tests to show compliance to the applicable standards due to the following actions:

1.any modification done to the module. 2.Integration of the module into a host device Host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. Final host product is required to show compliance to Part 15 Subpart B with the modular transmitter installed This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-- Reorient or relocate the receiving antenna.

-- Increase the separation between the equipment and receiver.

-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-- Consult the dealer or an experienced radio/TV technician for help. FC66E_Series_Hardware_Design 9 / 63 Wi-Fi&Bluetooth Module Series This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the Max allowed antenna gain is as following table showed:

Operating Frequency Antenna Type Antenna P/N Antenna Gain (dBi) Band

(MHz) Bluetooth 2400~2483.5 PIFA F7G300 1.17dBi 2.4G WiFi 2400~2483.5 PIFA F7G280(Ant0) 2412MHz to 2462MHz 5G WiFi 5150~5850 PIFA F7G250(Ant1) 1.32dBi(Ant0) 1.61dBi(Ant1) F7G280(Ant0) F7G250(Ant1) 5150MHz to 5250MHz:

3.26dBi(Ant0); 2.66dBi(Ant1);

5250MHz to 5350MHz:

3.26dBi(Ant0); 2.61dBi(Ant1);

5470MHz to 5725MHz:

4.24dBi(Ant0); 3.93dBi(Ant1);

5725MHz to 5850MHz:

4.22dBi(Ant0); 4.22dBi(Ant1);

6E WiFi 5925~7125 PIFA F7G280(Ant0) 5925 MHz to 6425 MHz:

F7G250(Ant1) 4.62dBi (Ant0); 4.74dBi (Ant1);

6425 MHz to 6525 MHz:

4.32dBi (Ant0); 4.74dBi (Ant1);

6525 MHz to 6875 MHz:

5.35dBi (Ant0); 5.23dBi (Ant1);

6875 MHz to 7125 MHz:

5.84dBi (Ant0); 5.89dBi (Ant1);

The product is provided with an approved antenna. Use only supplied or approved antenna by Quectel. Any changes or modifications to the Antenna may void the regulatory approvals obtained for the product. Host device must comply with FCC Part 15 antenna requirements The OEM must design the host so that the antenna will be installed as an integrated antenna for the host containing the SG560D-WF and the end user shall not be able to access, remove or replace the antenna. 2) The transmitter module may not be co-located with any other transmitter or antenna. FC66E_Series_Hardware_Design 10 / 63 Wi-Fi&Bluetooth Module Series As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID: XMR2023FC66EB.The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 5.925-7.125 GHz Radio Transmitters General Refer to KDB publication 987594 D01, Operation of these devices in the 5.925-7.125 GHz band is prohibited on oil platforms, cars, trains, boats, and aircraft, except that operation of this device is permitted in large aircraft while flying above 10,000 feet. 1. Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. 2. That the device will only associate and connect with a low-power indoor access point or subordinate device and never directly connect to other client devices. 3. That this device will always initiate transmission under the control of a low-power indoor AP or subordinate except for brief transmissions before joining a network. These short messages will only occur if the client has detected an indoor AP or subordinate operating on a channel. These brief messages will have a time-out mechanism such that if it does not receive a response from an AP it will not continually repeat the request. 4. Prohibited for control of or communications with unmanned aircraft systems, including drones. IC Declaration:

This device complies with ISEDs licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any FC66E_Series_Hardware_Design 11 / 63 Wi-Fi&Bluetooth Module Series interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d ISED applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage prjudiciable, et (2) ce dispositif doit accepter tout brouillage reu, y compris un brouillage susceptible de provoquer un fonctionnement indsirable. Radiation Exposure Statement:

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator &

your body. Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co- location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations FC66E_Series_Hardware_Design 12 / 63 Wi-Fi&Bluetooth Module Series d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 10224A-2023FC66EB. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC:

10224A-2023FC66EB". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz) The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology. Caution:

i) The device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

ii) where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated. L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations transmettre ou de panne oprationnelle. Notez que ceci n'est pas destin interdire la transmission FC66E_Series_Hardware_Design 13 / 63 Wi-Fi&Bluetooth Module Series d'informations de contrle ou de signalisation ou l'utilisation de codes rptitifs lorsque cela est requis par la technologie. Avertissement:

Le dispositif utilis dans la bande 5150-5250 MHz est rserv une utilisation en intrieur afin de i) rduire le risque de brouillage prjudiciable aux systmes mobiles par satellite dans le mme canal;

ii) les pires angles dinclinaison ncessaires pour rester conforme lexigence de la p.i.r.e. applicable au masque dlvation, nonce la section 6.2.2.3, doivent tre clairement indiqus. lorsquil y a lieu, les types dantennes (sil y en a plusieurs), les numros de modle de lantenne et Caution:

Operation shall be limited to indoor use only;

Operation on oil platforms, cars, trains, boats and aircraft shall be prohibited except for on large aircraft flying above 10,000 ft. Avertissement:

Utilisation limite lintrieur seulement;

Utilisation interdite bord de plateformes de forage ptrolier, de voitures, de trains, de bateaux et daronefs, sauf bord dun gros aronef volant plus de 10 000 pieds daltitude 5.925-7.125 GHz Radio Transmitters General Refer to KDB publication 987594 D01, Operation of these devices in the 5.925-7.125 GHz band is prohibited on oil platforms, cars, trains, boats, and aircraft, except that operation of this device is permitted in large aircraft while flying above 10,000 feet. 1. Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. 2. That the device will only associate and connect with a low-power indoor access point or subordinate device and never directly connect to other client devices. 3. That this device will always initiate transmission under the control of a low-power indoor AP or subordinate except for brief transmissions before joining a network. These short messages will only occur if the client has detected an indoor AP or subordinate operating on a channel. These brief messages will have a time-out mechanism such that if it does not receive a response from an AP it will not continually repeat the request. 4. Prohibited for control of or communications with unmanned aircraft systems, including drones. FC66E_Series_Hardware_Design 14 / 63 Wi-Fi&Bluetooth Module Series 2 Product Overview 2.1. General Description FC66E series are Wi-Fi and Bluetooth modules with low power consumption. They are single-die Wi-Fi and Bluetooth combo solutions supporting IEEE 802.11a/b/g/n/ac/ax 2.4 GHz, 5 GHz and 6 GHz Wi-Fi standards and Bluetooth 5.2 standard, which enables seamless integration of Wi-Fi and Bluetooth low energy technologies. The module can provide Wi-Fi function with a low-power PCIe Gen 3 interface and Bluetooth function with a UART and a PCM interface. 2.2. Key Features Table 1: Key Features Feature Detail Power Supplies Operating Frequencies Core supply voltage: 1.0 V, 1.8 V, 2.0 V I/O supply voltage: 1.8 V RF supply voltage: 2.0 V 2.4 GHz Wi-Fi: 2.4002.4835 GHz 5 GHz Wi-Fi: 5.1505.850 GHz 6 GHz Wi-Fi: 5.9257.125 GHz Bluetooth: 2.4022.480 GHz Wi-Fi Features Compliant with IEEE 802.11a/b/g/n/ac/ax 2 2 Multi-User Multiple-Input Multiple-Output (MU-MIMO) Tri-band supports: 2.4 GHz, 5 GHz and 6 GHz Supported channel bandwidths:

20/40 MHz at 2.4 GHz 20/40/80/160 MHz at 5 GHz and 6 GHz Dual Band Simultaneous (DBS) with dual MAC, up to 3.0 Gbps data rate

(2 2 + 2 2 802.11ax DBS) FC66E_Series_Hardware_Design 15 / 63 Wi-Fi&Bluetooth Module Series Bluetooth Features Adaptive frequency hopping (AFH) for reducing radio frequency interference Compliant with Bluetooth Core Specification Version 5.2 with provisions for supporting future specifications Supports Bluetooth Class 1 or Class 2 transmitting power Supports 2 Mbps Bluetooth Low Energy (BLE), BLE Long Range 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps Wi-Fi Transmission Data Rates 802.11n: HT20 (MCS 07), HT40 (MCS 07) 802.11ac: VHT20 (MCS 08), VHT40 (MCS 09), VHT80 (MCS 09), VHT160 (MCS 09) 802.11ax: HE20 (MCS 011), HE40 (MCS 011), HE80 (MCS 011), Wi-Fi Transmitting Power HE160 (MCS 011) 2.4 GHz:

802.11b @ 11 Mbps: 17 dBm 2 dB 802.11g @ 54 Mbps: 14.5 dBm 2 dB 802.11n, HT20 @ MCS 7: 13.5 dBm 2 dB 802.11n, HT40 @ MCS 7: 13 dBm 2 dB 802.11ax, HE20 @ MCS 11: 11 dBm 2 dB 802.11ax, HE40 @ MCS 11: 10 dBm 2 dB 5 GHz:

802.11a @ 54 Mbps: 13 dBm 2 dB 802.11n, HT20 @ MCS 7: 12 dBm 2 dB 802.11n, HT40 @ MCS 7: 11.5 dBm 2 dB 802.11ac, VHT20 @ MCS 8: 11.5 dBm 2 dB 802.11ac, VHT40 @ MCS 9: 10.5 dBm 2 dB 802.11ac, VHT80 @ MCS 9: 10 dBm 2 dB 802.11ac, VHT160 @ MCS 9: 9.5 dBm 2 dB 802.11ax, HE20 @ MCS 11: 9.5 dBm 2 dB 802.11ax, HE40 @ MCS 11: 9.5 dBm 2 dB 802.11ax, HE80 @ MCS 11: 8.5 dBm 2 dB 802.11ax, HE160 @ MCS 11: 8 dBm 2 dB 6 GHz:

802.11a @ 54 Mbps: 12 dBm 2 dB 802.11ax, HE20 @ MCS 11: 8.5 dBm 2 dB 802.11ax, HE40 @ MCS 11: 8.5 dBm 2 dB 802.11ax, HE80 @ MCS 11: 7.5 dBm 2 dB 802.11ax, HE160 @ MCS 11: 7 dBm 2 dB Wi-Fi Operation Modes AP STA Wi-Fi Modulations CCK, DBPSK, DQPSK, BPSK, QPSK, QAM FC66E_Series_Hardware_Design 16 / 63 Wi-Fi&Bluetooth Module Series Bluetooth Transmitting Power BR (GFSK): 7 dBm (Typ.) EDR (/4-DQPSK): 4 dBm (Typ.) EDR (8-DPSK): 4 dBm (Typ.) BLE (1 Mbps): 7 dBm (Typ.) BLE (2 Mbps): 7 dBm (Typ.) Bluetooth Operation Modes Classic Bluetooth (BR + EDR) Bluetooth Low Energy (BLE) Bluetooth Modulations GFSK, /4-DQPSK, 8-DPSK Wi-Fi Application Interface Bluetooth Application Interfaces RF Antenna Interfaces Physical Characteristics PCIe 3.0 UART and PCM ANT_WIFI0, ANT_WIFI1, ANT_BT (optional) 50 impedance Size: (19.9 0.15) mm (18 0.15) mm (2.1 0.2) mm Package: LCC Weight: approx. 1.6 g Temperature Ranges Operating temperature range: -30 C to +75 C 1 Storage temperature range: -40 C to +85 C RoHS All hardware components are fully compliant with EU RoHS directive 1 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. FC66E_Series_Hardware_Design 17 / 63 Wi-Fi&Bluetooth Module Series 2.3. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (FC6xE M.2) to control or test the module. For more details, see document [1]. FC66E_Series_Hardware_Design 18 / 63 Wi-Fi&Bluetooth Module Series 3 Application Interfaces 3.1. General Description The module is equipped with 52 LCC pins and 28 LGA pins. The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module:

Power supply Wi-Fi application interfaces

- WLAN_EN

PCIe interface Bluetooth application interfaces BT_EN

- UART interface

BT_WAKE_HOST/HOST_WAKE_BT PCM interface Coexistence interfaces Other interfaces

- WLAN_SLP_CLK

SW_CTRL RF antenna interfaces FC66E_Series_Hardware_Design 19 / 63 Wi-Fi&Bluetooth Module Series 3.2. Pin Assignment Figure 1: Pin Assignment (Top View) NOTE 1. Keep all RESERVED and unused pins unconnected. 2. All GND pins should be connected to ground. FC66E_Series_Hardware_Design 20 / 63 9RESERVED4PCIE_TX_M5PCIE_TX_P3GND1PCIE_REFCLK_M2PCIE_REFCLK_P6GND7PCIE_RX_M8PCIE_RX_P10PCIE_CLKREQ_N11PCIE_RST_NPowerGNDWi-FiBluetoothANTRESERVED7778798067686970717273747576Others636465665354555657585960616237GND35GND34GND36ANT_WIFI132ANT_WIFI033GND31GND30GND29GND28ANT_BT27GND383940VDD_RF46GND44PCM_DIN41434245PCM_CLK51VDD_CORE_VL50GND49GND48VDD_CORE_VM47VDD_CORE_VH52VDD_CORE_VLPCM_DOUTPCM_SYNCBT_WAKE_HOSTGNDGND262524VDD_RF18BT_RTS20BT_RXD23212219BT_CTS13WLAN_EN14VDD_IO16WLAN_SLP_CLK17BT_EN12PCIE_WAKE_NBT_TXDCOEX_RXD/HOST_WAKE_BTSW_CTRLGNDVDD_3V315GNDPA_MUTELAA_RXCOEXCOEX_TXDLAA_TXENWLAN_TXEN Wi-Fi&Bluetooth Module Series 3.3. Pin Description Table 2: I/O Parameters Definition Type AI AO AIO DI DO PI Description Analog Input Analog Input Analog Input/Output Digital Input Digital Output Power Input Table 3: Pin Description Power Supply Pin Name Pin No. I/O Description VDD_CORE_VL 51, 52 PI VDD_CORE_VM 48 PI VDD_CORE_VH 47 PI VDD_IO 14 PI VDD_RF 24, 40 PI Provides 1.0 V for the modules main chip Provides 1.8 V for the modules main chip Provides 2.0 V for the modules main chip Provides 1.8 V for the modules I/O pins Provides 2.0 V for external RF circuit DC Characteristics Comment Vmin = 0.9 V Vnom = 1.0 V Vmax = 1.05 V Vmin = 1.3 V Vnom = 1.8 V Vmax = 2.1 V Vmin = 1.85 V Vnom = 2.0 V Vmax = 2.1 V Vmin = 1.71 V Vnom = 1.8 V Vmax = 1.89 V Vmin = 1.9 V Vnom = 2.0 V Vmax = 2.4 V It must be provided with sufficient current up to 0.8 A. It must be provided with sufficient current up to 0.4 A. It must be provided with sufficient current up to 0.4 A. It must be provided with sufficient current up to 0.05 A. It must be provided with sufficient current up to 2.0 A. FC66E_Series_Hardware_Design 21 / 63 Wi-Fi&Bluetooth Module Series VDD_3V3 26 PI Provides 3.3 V for the modules discrete Bluetooth part. Unused pin. Keep it open. GND 3, 6, 15, 25, 27, 2931, 3335, 3739, 46, 49, 50, 53, 54, 57, 58, 6064, 6780 DC Characteristics Comment VDD_IO Active high. Keep it connected. Requires differential impedance of 85 . Wi-Fi Application Interfaces Pin Name Pin No. I/O Description WLAN_EN 13 PCIE_REFCLK_M 1 PCIE_REFCLK_P 2 PCIE_TX_M PCIE_TX_P PCIE_RX_M PCIE_RX_P PCIE_CLKREQ_ N PCIE_RST_N 4 5 7 8 10 11 DI AI AI Wi-Fi function enable control PCIe reference clock (-) PCIe reference clock (+) AO PCIe transmit (-) AO PCIe transmit (+) AI AI PCIe receive (-) PCIe receive (+) DO PCIe clock request DI PCIe reset VDD_IO Active low. PCIE_WAKE_N 12 DO PCIe wake up Bluetooth Application Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment BT_EN 17 DI Bluetooth enable control PCM_DIN PCM_SYNC PCM_CLK 44 42 45 DI PCM data input DI PCM data frame sync DI PCM clock VDD_IO Active high. If unused, pull it down with a 10 k resistor. If unused, keep them open. FC66E_Series_Hardware_Design 22 / 63 Wi-Fi&Bluetooth Module Series Do not pull down when Bluetooth function is being enabled. If unused, keep them open. PCM_DOUT 43 DO PCM data output BT_RTS BT_CTS BT_RXD BT_TXD 18 19 20 21 DO DI DI DO BT_WAKE_HOST 41 DO COEX_RXD/

HOST_WAKE_BT 22 DI RF Antenna Interfaces DCE request to send signal to DTE DCE clear to send signal from DTE Bluetooth UART receive Bluetooth UART transmit Bluetooth wakes up host Host wakes up Bluetooth Pin Name Pin No. I/O Description DC Characteristics Comment ANT_WIFI0 32 AIO ANT_WIFI1 ANT_BT 36 28 AIO AIO Other Interfaces Wi-Fi 0 and Bluetooth antenna interface Wi-Fi 1 antenna interface Bluetooth antenna interface (optional) 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_SLP_CLK 16 DI Wi-Fi sleep clock SW_CTRL 23 DO VDD_RF switch control VDD_IO If unused, pull it down with a 10 k resistor. Active high. If unused, keep it open. Coexistence Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment FC66E_Series_Hardware_Design 23 / 63 Wi-Fi&Bluetooth Module Series LTE & Wi-Fi/

Bluetooth coexistence receive LTE & Wi-Fi/

Bluetooth coexistence transmit When it goes high, module places the 5 GHz receiver in a protected state. Module asserts it to high state when 5 GHz is set to transmit at power greater than 10 dBm. When it goes high, module allows LAA to receive through the Wi-Fi antennas. When it goes high, 2.4 GHz PA is turned off. COEX_RXD/

HOST_WAKE_BT 22 DI COEX_TXD 59 DO LAA_TXEN 65 DI WLAN_TXEN 66 DO LAA_RX 56 DI PA_MUTE 55 DI RESERVED Pin Pin Name Pin No. RESERVED 9 VDD_IO If unused, keep them open. Comment Keep it open. FC66E_Series_Hardware_Design 24 / 63 Wi-Fi&Bluetooth Module Series 3.4. Power Supply The following table shows the power supply and ground pins of the module. Table 4: Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VDD_CORE_VL 51, 52 VDD_CORE_VM 48 VDD_CORE_VH 47 VDD_IO 14 Provides 1.0 V for the modules main chip Provides 1.8 V for the modules main chip Provides 2.0 V for the modules main chip Provides 1.8 V for the modules I/O pins 0.9 1.0 1.05 1.3 1.8 2.1 1.85 2.0 2.1 1.71 1.8 1.89 VDD_RF 24, 40 Provides 2.0 V for RF circuit 1.9 2.0 2.4 V V V V V GND 3, 6, 15, 25, 27, 2931, 3335, 3739, 46, 49, 50, 53, 54, 57, 58, 6064, 6780 The following figure shows the recommended power-up and power-down timing of the module. All input power supplies must be ON and available before WLAN_EN/BT_EN is asserted. There is no requirement for the timing of input power supplies. Figure 2: Power-up and Power-down Timing FC66E_Series_Hardware_Design 25 / 63 VDD_IOVDD_CORE_VL/M/H 10 sWLAN_EN/BT_ENPCIE_CLKREQ_NPCIE_RST_NWLAN_SLP_CLK 4 ms 15 msSW_CTRL/VDD_RF 0 s Wi-Fi&Bluetooth Module Series 3.5. Wi-Fi Application Interfaces The following figure shows the Wi-Fi application interface connection between the module and the host. Figure 3: Wi-Fi Application Interface Connection 3.5.1. WLAN_EN WLAN_EN is used to control the Wi-Fi function of the module. Wi-Fi function will be enabled when WLAN_EN is at high level. Table 5: Pin Definition of WLAN_EN Pin Name Pin No. I/O Description Comment WLAN_EN 13 DI Wi-Fi function enable control Active high. Keep it connected. 3.5.2. PCIe Interface The module provides a PCIe interface with key features listed as below:

PCI Express Base Specification Revision 3.0 compliant. Data rate up to 8 Gbps/lane. As a Wi-Fi function interface connected to a host. Table 6: Pin Definition of PCIe Interface Pin Name Pin No. I/O Description Comment PCIE_REFCLK_M PCIE_REFCLK_P 1 2 AI AI PCIe reference clock (-) PCIe reference clock (+) Requires differential impedance of 85 . FC66E_Series_Hardware_Design 26 / 63 PCIe WLAN_ENModuleHostPCIeWLAN_EN Wi-Fi&Bluetooth Module Series PCIE_TX_M PCIE_TX_P PCIE_RX_M PCIE_RX_P 4 5 7 8 AO AO AI AI PCIe transmit (-) PCIe transmit (+) PCIe receive (-) PCIe receive (+) PCIE_CLKREQ_N 10 DO PCIe clock request PCIE_RST_N PCIE_WAKE_N 11 12 DI PCIe reset Active low. DO PCIe wake up The following figure shows the PCIe interface connection between the module and the host. Figure 4: PCIe Interface Connection To ensure the signal integrity of PCIe interface, C1 and C2 should be placed close to the module, and C3 and C4 should be placed close to the host. The extra stubs of traces must be as short as possible. The following principles of PCIe interface design should be complied with to meet PCIe Gen 3 specifications. It is important to route PCIE_TX_P/M, PCIE_RX_P/M, and PCIE_REFCLK_P/M as differential pairs with total grounding. And the differential impedance should be 85 10 %. The maximum trace length of each differential pair (PCIE_TX_P/M, PCIE_RX_P/M, and PCIE_REFCLK_P/M) should be less than 200 mm, and trace length matching within each differential pair should be less than 0.5 mm. FC66E_Series_Hardware_Design 27 / 63 PCIE_CLKREQ_NPCIE_WAKE_NPCIE_RST_NModuleHostPCIE_REFCLK_PPCIE_REFCLK_MPCIE_TX_PPCIE_TX_MPCIE_RX_PPCIE_RX_MPCIE_CLKREQPCIE_WAKEPCIE_RSTPCIE_REFCLK_PPCIE_REFCLK_MPCIE_RX0_PPCIE_RX0_MPCIE_TX0_PPCIE_TX0_M1V810K10K220 nF220 nFC1C2NM220 nF220 nFC3C4R1R20R0R Wi-Fi&Bluetooth Module Series Space between PCIe signals and all other signals should be four times the trace width. Do not route signal traces under crystals, oscillators, magnetic devices, or RF signal traces. It is important to route the PCIe differential traces in inner-layer of the PCB and surround the traces with ground on that layer and with ground planes above and below. 3.6. Bluetooth Application Interfaces The following figure shows the block diagram of Bluetooth application interface connection between the module and the host. Figure 5: Bluetooth Application Interface Connection NOTE The GPIO_1 connected to BT_WAKE_HOST must be interruptible. 3.6.1. BT_EN BT_EN is used to control the Bluetooth function of the module. Bluetooth function will be enabled when BT_EN is at high level. If Bluetooth function is not needed, pull BT_EN down with a 10 k resistor. Table 7: Pin Definition of BT_EN Pin Name Pin No. I/O Description Comment BT_EN 17 DI Bluetooth enable control Active high. If unused, pull it down with a 10 k resistor. FC66E_Series_Hardware_Design 28 / 63 ModuleHostUARTPCMBT_ENUARTPCMBT_ENBT_WAKE_HOSTGPIO_1COEX_RXD/HOST_WAKE_BTGPIO_2 Wi-Fi&Bluetooth Module Series 3.6.2. UART Interface The module serves as DCE (Data Communication Equipment), which is connected in the traditional DCE-DTE (Data Terminal Equipment) mode. The module supports an HCI UART as defined in Bluetooth Core Specification Version 4.0. The UART supports hardware flow control, and it is used for data transmission with host. It supports up to 3.2 Mbps baud rates. The following table shows the pin definition of UART interface. Table 8: Pin Definition of UART Interface Pin Name Pin No. I/O Description Comment BT_RTS BT_CTS BT_TXD BT_RXD 18 19 21 20 DO DCE request to send signal to DTE DI DCE clear to send signal from DTE DO Bluetooth UART transmit DI Bluetooth UART receive If unused, keep them open. The module provides 1.8 V UART interface. A voltage-level translator should be used if the application is equipped with a 3.3 V UART interface. A voltage-level translator TXS0104EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. Figure 6: Reference Circuit with a Voltage-level Translator FC66E_Series_Hardware_Design 29 / 63 VCCAVCCBOEGNDB1B2B3B4VDD_IO0.1 F0.1 FBT_CTS_3V3BT_RXD_3V3BT_RTS_3V3BT_TXD_3V3VCC_3V3TranslatorA1A2A3A4BT_CTSBT_RXDBT_RTSBT_TXD Wi-Fi&Bluetooth Module Series 3.6.3. BT_WAKE_HOST and HOST_WAKE_BT Table 9: Pin Definition of BT_WAKE_HOST and HOST_WAKE_BT Pin Name Pin No. I/O Description Comment BT_WAKE_HOST 41 DO Bluetooth wakes up host COEX_RXD/

HOST_WAKE_BT 22 DI Host wakes up Bluetooth If unused, keep them open. 3.6.4. PCM Interface The PCM interface is used for Bluetooth audio. The following table shows the pin definition of PCM interface. Table 10: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_DIN PCM_SYNC PCM_CLK PCM_DOUT 44 42 45 43 DI DI DI PCM data input PCM data frame sync If unused, keep them open. PCM clock DO PCM data output Do not pull down when Bluetooth function is being enabled. The following figure shows the PCM interface connection between the module and the host. Figure 7: PCM Interface Connection FC66E_Series_Hardware_Design 30 / 63 ModuleHostPCM_CLKPCM_SYNCPCM_DOUTPCM_DINPCM_CLKPCM_SYNCPCM_DINPCM_DOUT Wi-Fi&Bluetooth Module Series 3.7. Coexistence Interfaces The module supports 2.4 GHz LTE & Wi-Fi/Bluetooth coexistence and 5 GHz and 6 GHz WWAN & Wi-Fi coexistence. The following table shows the pin definition of coexistence interfaces. Table 11: Pin Definition of Coexistence Interfaces Pin Name Pin No. I/O Description Comment COEX_RXD/

HOST_WAKE_BT COEX_TXD 22 59 DI DO LTE & Wi-Fi coexistence receive LTE & Wi-Fi coexistence transmit LAA_TXEN 65 DI WLAN_TXEN 66 DO LAA_RX 56 DI PA_MUTE 55 DI When it goes high, module places the 5 GHz receiver in a protected state. Module asserts it to high state when 5 GHz is set to transmit at power greater than 10 dBm. When it goes high, module allows LAA to receive through the Wi-Fi antennas. When it goes high, 2.4 GHz PA is turned off. If unused, keep them open. FC66E_Series_Hardware_Design 31 / 63 Wi-Fi&Bluetooth Module Series 3.8. Other Interfaces 3.8.1. WLAN_SLP_CLK The WLAN_SLP_CLK is 32.768 kHz sleep clock which is used in low power modes, such as IEEE power saving mode and sleep mode. It serves as a timer in various power saving schemes, and can maintain basic logic operations when the module is in sleep mode. Table 12: Pin Definition of WLAN_SLP_CLK Pin Name Pin No. I/O Description Comment WLAN_SLP_CLK 16 DI Wi-Fi sleep clock If unused, pull it down with a 10 k resistor. Figure and table below show the requirements of sleep clock:

Figure 8: Requirements of WLAN_SLP_CLK Table 13: Parameters of WLAN_SLP_CLK Parameter Comment Min. Typ. Max. Unit t (xoh) Sleep-clock logic high t (xol) Sleep-clock logic low T F Sleep-clock period Sleep-clock frequency

(F = 1/T) Vpp Peak-to-peak voltage 4.58 4.58

4.58 4.58 30.5208 32.7645 1.8 25.94 25.94

s s s kHz V FC66E_Series_Hardware_Design 32 / 63 Tt (xoh)t (xol)VppAverage(DC component)Sleep clock Wi-Fi&Bluetooth Module Series 3.8.2. SW_CTRL SW_CTRL can be used to control external VDD_RF power supply chip. The following table shows the pin definition of SW_CTRL. Table 14: Pin Definition of SW_CTRL Pin Name Pin No. I/O Description Comment SW_CTRL 23 DO VDD_RF switch control Active high. If unused, keep it open. 3.9. RF Antenna Interfaces Table 15: Pin Definition of RF Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_WIFI0 32 AIO Wi-Fi 0 and Bluetooth antenna interface ANT_WIFI1 36 AIO Wi-Fi 1 antenna interface 50 impedance. ANT_BT 28 AIO Bluetooth antenna interface

(optional) 3.9.1. Operating Frequencies Table 16: Operating Frequencies (Unit: GHz) Feature 2.4 GHz Wi-Fi 5 GHz Wi-Fi 6 GHz Wi-Fi Bluetooth Frequency 2.4002.4835 5.1505.850 5.9257.125 2.4022.480 FC66E_Series_Hardware_Design 33 / 63 Wi-Fi&Bluetooth Module Series 3.9.2. RF Antenna Reference Design The module provides three RF antenna interfaces for antenna connection. The following reference design shows an example with ANT_WIFI0. For other RF antenna interfaces, the reference design is the same. It is recommended to reserve a -type matching circuit for better RF performance, and the -type matching components (C1, C2, R1) should be placed as close to the antenna as possible. C1 and C2 are not mounted by default. Figure 9: RF Antenna Reference Design 3.9.3. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 10: Microstrip Design on a 2-layer PCB FC66E_Series_Hardware_Design 34 / 63 ModuleANT_WIFI0R10RC1C2NMNM Wi-Fi&Bluetooth Module Series Figure 11: Coplanar Waveguide Design on a 2-layer PCB Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully FC66E_Series_Hardware_Design 35 / 63 Wi-Fi&Bluetooth Module Series connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [2]. 3.9.4. Antenna Design Requirements The following table shows the requirements for antennas. Table 17: Antenna Requirements Parameter Requirement Frequency Range (GHz) Cable Insertion Loss (dB) VSWR Gain (dBi) Max. Input Power (W) Input Impedance () 2.4 GHz Wi-Fi: 2.4002.4835 5 GHz Wi-Fi: 5.1505.850 6 GHz Wi-Fi: 5.9257.125 Bluetooth: 2.4022.480

< 1 2 1 (Typ.) 50 50 Polarization Type Vertical 3.9.5. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. FC66E_Series_Hardware_Design 36 / 63 Wi-Fi&Bluetooth Module Series Figure 14: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 15: Specifications of Mated Plugs FC66E_Series_Hardware_Design 37 / 63 Wi-Fi&Bluetooth Module Series The following figure describes the space factor of mated connectors. Figure 16: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FC66E_Series_Hardware_Design 38 / 63 Wi-Fi&Bluetooth Module Series 4 Reliability, Radio and Electrical Characteristics 4.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital pins of the module are listed in the following table. Table 18: Absolute Maximum Ratings (Unit: V) Parameter VDD_CORE_VL VDD_CORE_VM VDD_CORE_VH VDD_IO VDD_RF Voltage at Digital Pins NOTE Min.

-0.3

-0.3

-0.3

-0.3

-0.3

-0.3 Max. VDDX + 0.2 VDDX + 0.2 VDDX + 0.2 VDDX + 0.2 VDDX + 0.2 VDD_IO + 0.2 VDDX is the external supply voltage associated with the input or output pin to which the test voltage is applied. FC66E_Series_Hardware_Design 39 / 63 Wi-Fi&Bluetooth Module Series 4.2. Power Supply Ratings Table 19: Module Power Supply Ratings (Unit: V) Parameter VDD_CORE_VL VDD_CORE_VM VDD_CORE_VH VDD_IO VDD_RF Min. 0.9 1.3 1.85 1.71 1.9 Typ. 1.0 1.8 2.0 1.8 2.0 Max. 1.05 2.1 2.1 1.89 2.4 4.3. Digital I/O Characteristics Table 20: VDD_IO I/O Requirements (Unit: V) Parameter Description Min. Max. VIH VIL VOH VOL High-level Input Voltage 0.65 VDD_IO VDD_IO + 0.3 Low-level Input Voltage

-0.3 0.35 VDD_IO High-level Output Voltage VDD_IO - 0.45 VDD_IO Low-level Output Voltage 0 0.45 FC66E_Series_Hardware_Design 40 / 63 Wi-Fi&Bluetooth Module Series 4.4. Operating and Storage Temperatures Table 21: Operating and Storage Temperatures (Unit: C) Parameter Operating Temperature Range 2 Storage Temperature Range Min.

-30

-40 Typ. 25

Max.

+75

+85 2 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. FC66E_Series_Hardware_Design 41 / 63 Wi-Fi&Bluetooth Module Series 4.5. Power Consumption The following tables show the power consumption of the module in different modes. 4.5.1. Power Consumption in Low Power Modes Table 22: Power Consumption of the Module (Low Power Modes, Unit: mA) Module State Wi-Fi State VDD_CORE_VL VDD_CORE_VM VDD_CORE_VH VDD_IO VDD_RF OFF 3 Disabled Idle 4 Disconnected on AP mode 0.12 257.84 0.08 104.27 0.07 46.99 2.1 2.2 0.2 30.33 3 In OFF state, the Wi-Fi driver is uninstalled and WLAN_EN is pulled down. 4 In idle state, the Wi-Fi is enabled AP mode but no SSID is connected. FC66E_Series_Hardware_Design 42 / 58 Wi-Fi&Bluetooth Module Series 4.5.2. Power Consumption in Non-signaling Mode Table 23: Tx Power Consumption (Unit: mA) Mode Condition VDD_CORE_VL VDD_CORE_VM VDD_CORE_VH VDD_IO VDD_RF 2.4 GHz 802.11b @ 1 Mbps 2.4 GHz 802.11g @ 6 Mbps 2.4 GHz 802.11n HT20 @ MCS 0 2.4 GHz 802.11ax HE40 @ MCS 11 1 1 5 GHz 802.11a @ 6 Mbps 5 GHz 802.11n HT20 @ MCS 0 5 GHz 802.11ac VHT40 @ MCS 9 5 GHz 802.11ax HE80 @ MCS 11 2.4 GHz 802.11n HT20 @ MCS 0 2.4 GHz 802.11n HT40 @ MCS 7 2 2 2.4 GHz 802.11ax HE40 @ MCS 11 5 GHz 802.11n HT20 @ MCS 0 5 GHz 802.11ac VHT40 @ MCS 9 300.42 299.17 300.62 322.96 316.01 309.07 326.02 409.37 386.73 394.78 390.55 402.2 439.5 136.38 136.37 136.09 143.7 162.62 163.07 165.52 168.34 173.39 179.08 185.37 260.99 264.94 93.6 93.61 93.35 92.72 107.6 104.23 103.38 99.36 123.84 118.99 117.55 143.97 141.83 2.93 366.89 2.92 352.65 2.7 345.94 2.83 304.95 2.64 312.3 2.83 316.67 2.9 370.09 2.56 455.29 2.92 2.83 717.42 606.19 2.9 554.28 2.84 663.39 2.91 552.6 FC66E_Series_Hardware_Design 43 / 58 Wi-Fi&Bluetooth Module Series 5 GHz 802.11ax HE80 @ MCS 11 5 GHz 802.11ax HE80 @ MCS 0 802.11n HT20 @ MCS 0 802.11n HT40 @ MCS 7 583.84 563.83 417.56 526.4 2 2 +

2 2 802.11n HT20 @ MCS 0 + 802.11ac VHT20 @ MCS 0 424.04 802.11n HT40 @ MCS 7+ 802.11ac VHT80 @ MCS 9 672.59 802.11ax HE20 @ MCS 0 429.49 268.09 273.32 303.69 316.91 306.3 319.42 311.57 151.57 153.62 222.21 218.83 223.24 218.2 232.78 2.95 540.68 2.91 630.2 2.92 1336 2.91 1087 2.91 1342 2.9 1127 2.91 1355 802.11ax 2.4 GHz HE40 @ MCS 11 + 5 G Hz HE80 @

MCS 11 674.75 324.69 228.4 2.92 1111 FC66E_Series_Hardware_Design 44 / 58 Wi-Fi&Bluetooth Module Series 4.6. RF Performances The following tables summarize the transmitting and receiving performances of the module. 4.6.1. Wi-Fi RF Performances Table 24: Wi-Fi Tx Power at 2.4 GHz Condition Typ. (dBm) Tolerance (dB) 802.11b @ 1 Mbps 802.11b @ 11 Mbps 802.11g @ 6 Mbps 802.11g @ 54 Mbps 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11 17 17 16 14.5 16 13.5 15.5 13 16 11 15.5 10 2 2 2 2 2 2 2 2 2 2 2 2 Table 25: Wi-Fi Tx Power at 5 GHz Condition Typ. (dBm) Tolerance (dB) 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11n, HT20 @ MCS 0 15 13 15 2 2 2 FC66E_Series_Hardware_Design 45 / 63 Wi-Fi&Bluetooth Module Series 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ac, VHT20 @ MCS 0 802.11ac, VHT20 @ MCS 8 802.11ac, VHT40 @ MCS 0 802.11ac, VHT40 @ MCS 9 802.11ac, VHT80 @ MCS 0 802.11ac, VHT80 @ MCS 9 802.11ac, VHT160 @ MCS 0 802.11ac, VHT160 @ MCS 9 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11 802.11ax, HE80 @ MCS 0 802.11ax, HE80 @ MCS 11 802.11ax, HE160 @ MCS 0 802.11ax, HE160 @ MCS 11 12 14.5 11.5 15 11.5 14.5 10.5 14 10 13.5 9.5 15 9.5 14 9.5 14 8.5 13.5 8 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Table 26: Wi-Fi Tx Power at 6 GHz Condition Typ. (dBm) Tolerance (dB) 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11ax, HE20 @ MCS 0 14 12 14 2 2 2 FC66E_Series_Hardware_Design 46 / 63 Wi-Fi&Bluetooth Module Series 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11 802.11ax, HE80 @ MCS 0 802.11ax, HE80 @ MCS 11 802.11ax, HE160 @ MCS 0 802.11ax, HE160 @ MCS 11 8.5 13.5 8.5 13 7.5 12.5 7 2 2 2 2 2 2 2 Table 27: Wi-Fi Rx Sensitivity at 2.4 GHz Condition Typ. (dBm) Tolerance (dB) 802.11b @ 1 Mbps 802.11b @ 11 Mbps 802.11g @ 6 Mbps 802.11g @ 54 Mbps 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11

-97

-89

-93

-75

-93

-75

-91

-72

-94

-63

-91

-61 2 2 2 2 2 2 2 2 2 2 2 2 Table 28: Wi-Fi Rx Sensitivity at 5 GHz Condition Typ. (dBm) Tolerance (dB) FC66E_Series_Hardware_Design 47 / 63 Wi-Fi&Bluetooth Module Series 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7 802.11n, HT40 @ MCS 0 802.11n, HT40 @ MCS 7 802.11ac, VHT20 @ MCS 0 802.11ac, VHT20 @ MCS 8 802.11ac, VHT40 @ MCS 0 802.11ac, VHT40 @ MCS 9 802.11ac, VHT80 @ MCS 0 802.11ac, VHT80 @ MCS 9 802.11ac, VHT160 @ MCS 0 802.11ac, VHT160 @ MCS 9 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11 802.11ax, HE80 @ MCS 0 802.11ax, HE80 @ MCS 11 802.11ax, HE160 @ MCS 0 802.11ax, HE160 @ MCS 11

-91

-73

-91

-73

-88

-71

-91

-68

-88

-65

-85

-62

-83

-59

-91

-62

-88

-60

-85

-57

-82

-53 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Table 29: Wi-Fi Rx Sensitivity at 6 GHz Condition Typ. (dBm) Tolerance (dB) FC66E_Series_Hardware_Design 48 / 63 Wi-Fi&Bluetooth Module Series 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 802.11ax, HE40 @ MCS 0 802.11ax, HE40 @ MCS 11 802.11ax, HE80 @ MCS 0 802.11ax, HE80 @ MCS 11 802.11ax, HE160 @ MCS 0 802.11ax, HE160 @ MCS 11

-90

-72

-90

-60

-88

-58

-84

-56

-82

-52 2 2 2 2 2 2 2 2 2 2 4.6.2. Bluetooth RF Performances The following tables summarize the transmitting and receiving performances of the module. Table 30: Bluetooth Tx Power and Rx Sensitivity (Unit: dBm) Condition Transmitting Power (Typ.) Receiving Sensitivity (Typ.) Tolerance (dB) GFSK

/4-DQPSK 8-DQPSK BLE (1 Mbps) BLE (2 Mbps) 7 4 4 7 7

-91

-90

-84

-94

-92 2 2 2 2 2 FC66E_Series_Hardware_Design 49 / 63 Wi-Fi&Bluetooth Module Series 4.7. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 31: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %, Unit: kV) Tested Interfaces Contact Discharge Air Discharge Antenna Interfaces Other Interfaces 4 0.5 6 1 FC66E_Series_Hardware_Design 50 / 63 Wi-Fi&Bluetooth Module Series 5 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions Figure 17: Module Top and Side Dimensions FC66E_Series_Hardware_Design 51 / 63 Wi-Fi&Bluetooth Module Series Figure 18: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FC66E_Series_Hardware_Design 52 / 63 Wi-Fi&Bluetooth Module Series 5.2. Recommended Footprint Figure 19: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FC66E_Series_Hardware_Design 53 / 63 Wi-Fi&Bluetooth Module Series 5.3. Top and Bottom Views Figure 20: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FC66E_Series_Hardware_Design 54 / 63 Wi-Fi&Bluetooth Module Series 6 Storage, Manufacturing and Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 5 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 5 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. FC66E_Series_Hardware_Design 55 / 63 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 6.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [3]

The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 21: Recommended Reflow Soldering Thermal Profile FC66E_Series_Hardware_Design 56 / 63 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Ramp-to-soak slope: 03 C/s Cool-down slope: -30 C/s Ramp-up slope: 03 C/s Wi-Fi&Bluetooth Module Series Table 32: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3]. FC66E_Series_Hardware_Design 57 / 63 Wi-Fi&Bluetooth Module Series 6.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

6.3.1. Carrier Tape Figure 22: Carrier Tape Dimension Drawing Table 33: Carrier Tape Dimension Table (Unit: mm) W 44 P 32 T 0.4 A0 B0 20.4 18.5 K0 2.6 K1 6.8 F E 20.2 1.75 FC66E_Series_Hardware_Design 58 / 63 Wi-Fi&Bluetooth Module Series 6.3.2. Plastic Reel Figure 23: Plastic Reel Dimension Drawing Table 34: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 6.3.3. Mounting Direction Figure 24: Mounting Direction FC66E_Series_Hardware_Design 59 / 63 Wi-Fi&Bluetooth Module Series 6.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 1000 modules. Figure 25: Packaging Process FC66E_Series_Hardware_Design 60 / 63 Wi-Fi&Bluetooth Module Series 7 Appendix References Table 35: Related Documents Document Name

[1] Quectel_FC6xE_M.2_User_Guides

[2] Quectel_RF_Layout_Application_Note

[3] Quectel_Module_SMT_Application_Note Table 36: Terms and Abbreviations Abbreviation Description AFH AP BPSK BLE CCK CTS Adaptive Frequency Hopping Access Point Binary Phase Shift Keying Bluetooth Low Energy Complementary Code Keying Clear To Send DBPSK Differential Binary Phase Shift Keying DBS DCE Dual Band Simultaneous Data Communications Equipment DQPSK Differential Quadrature Phase Shift Keying DTE ESD Data Terminal Equipment Electrostatic Discharge FC66E_Series_Hardware_Design 61 / 63 Wi-Fi&Bluetooth Module Series EVB GFSK GND HCI HE HT IEEE I/O LAA LCC LGA LTE MAC Mbps MCS MSL Evaluation Board Gauss frequency Shift Keying Ground Host Controller Interface High Efficiency High Throughput Institute of Electrical and Electronics Engineers Input/Output License Assisted Access Leadless chip carrier Land Grid Array Long Term Evolution Medium Access Control Megabits per second Modulation and Coding Scheme Moisture Sensitivity Levels MU-MIMO Multi-User Multiple-Input Multiple-Output PA PCB PCIe PCM QAM QPSK RF RoHS Power Amplifier Printed Circuit Board Peripheral Component Interconnect Express Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances FC66E_Series_Hardware_Design 62 / 63 Wi-Fi&Bluetooth Module Series RTS Rx SMT SSID STA Tx UART VHT Vmax Vmin Vnom VSWR Wi-Fi WLAN Request To Send Receive Surface Mount Technology Service Set Identifier Station Transmit Universal Asynchronous Receiver/Transmitter Very High Throughput Maximum Voltage Minimum Voltage Nominal Voltage Voltage Standing Wave Ratio Wireless-Fidelity Wireless Local Area Network FC66E_Series_Hardware_Design 63 / 63

PKG D: % CARTON_NUM BS Quantity: % PACK_QUAN%

OT LATENT TIL

% PN% Lot No.: & HOS IN UM

& DC& & YEARS Orderng Code:

UIT TUT me FC66E @A)

% ST% FRVsEeree

& SW _2%

% PACKERS (

FCC ID:XMR2023FC66E 1C:10224A-2023FC66E RoHS MSL3 |}MADEIN CHINA

Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: July 26, 2023 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID: XMR2023FC66E

[Quectel Wireless Solutions Co., Ltd.] certifies that the equipment FCC ID: XMR2023FC66E for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules.

[Quectel Wireless Solutions Co., Ltd.] certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing covered equipment. Sincerely, Name:

Email:

Jean hu .. (2) jean.hu@quectel.com. Signature:

. Rev 1/26/2023

Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: XMR2023FC66E Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Exhibit Type Schematic Diagram Block Diagram NII Software Security Info BOM Operational Description Tune-up Procedure The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. Exhibit Type User Manual EUT Photos Test Setup Photos Sincerely, Signature:

Name: Jean Hu Title: Certification Manager Rev 11/20/07

RF_734_02 04 April 16 Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China FCC ID: XMR2023FC66E Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. Answer from applicant Yes, please see exhibition external photos Yes, the modular has buffer modulation /data inputs 3. The modular transmitter must have its own power supply regulation. Yes, please see the SCH.pdf 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. there are very strict operational and 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Yes, the requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, please refer to the setup photo exhibition for the stand-alone configuration Yes, the module will be label with its own FCC ID, and the instruction on the labelling rule of the end product has been stated in the user manual of this module. Please refer to the label and user manual exhibition. Yes, the required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):

Date:

City:

Name:

Email:

2023/07/05.. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature:

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: Wi-Fi & Bluetooth Module Type designation: FC66E Quectel Trademark:

FCC ID: XMR2023FC66E on our behalf. Date:

City:

Name:

Email:

2023/07/05.. Shanghai .. Jean hu .. jean.hu@quectel.com. Signature:

Quectel Wireless Solutions Co., Ltd Statement We Quectel Wireless Solutions Co., Ltd declare the following models. Product Name: BT&WIFI Module Model Number: FC66E&FC66E-B FC66E-BFCC ID: XMR2023FC66EB IC: 10224A-2023FC66EB Hardware version: Refer to below table FC66E and FC66E-B share the similar HW and SW design, the difference is just as follow:

1 FC66E version is BT/WiFi0 shared antenna, FC66E-B version is BT individual antenna FC66E FC66E-B 2.The part in the red box are mounted in the FC66E-B version. FC66E FC66E-B Quectel Wireless Solutions Co., Ltd We hereby state that there is no any other internal difference between them and the change are mounted part of Bluetooth individual antenna which wont affect the WiFi RF portions Your assistance on this matter is highly appreciated. Sincerely, Name: Jean Hu Title: Certification Manager

Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Rd Columbia MD 21046 Subject: Letter of Declaration on LPI Operation FCC ID: XMR2023FC66E Product Name: Wi-Fi & Bluetooth Module To whom it may concern:

Date: May 26, 2023

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) hereby attest that this device complies with the following requirements of Part 15E of the FCCs rules for the 6GHz bands:

a.) 1. Contention-Based Protocol, as demonstrated in the test report, is permanently embedded in the module and is not host-dependent. 2. That the device will only associate and connect with a low-power indoor access point or subordinate device and never directly connect to other client devices. 3. That this device will always initiate transmission under the control of a low-power indoor AP or subordinate except for brief transmissions before joining a network. These short messages will only occur if the client has detected an indoor AP or subordinate operating on a channel. These brief messages will have a time-out mechanism such that if it does not receive a response from an AP it will not continually repeat the request. 4. That transmission will be lower or equal to the power advertised by the indoor low-

power access point or subordinate and never above the maximum output power allowed by the FCC grant for equipment class 6XD. b.) The statement acknowledging device restrictions:

Prohibited for control of or communications with unmanned aircraft systems, including drones. Sincerely, Date:

City:

Name:

Email:

2023/07/05.. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature: