FCC ID: XMR2023FCM360W Wi-Fi & Bluetooth Module

FCM360W Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-03-08 Status: Preliminary Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FCM360W_Hardware_Design 1 / 56 Wi-Fi&Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness information, advertising, commercial offers, products, services, and materials on third-party of websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. FCM360W_Hardware_Design 2 / 56 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular or mobile terminal incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety precautions by incorporating them into all product manuals. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times to reduce the risk of an accident. Using a mobile phone while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular or mobile terminal before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. If emergency assistance is needed, use emergency call if the device supports it. To make or receive a call, the cellular or mobile terminal must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method since network connection cannot be guaranteed under all circumstances. The cellular or mobile terminal contains a transceiver. When it is ON, it receives and transmits radio signals. RF interference can occur if it is used close to TV sets, radios, computers, or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phones or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FCM360W_Hardware_Design 3 / 56 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description

2023-03-08 Mark WU Creation of the document 1.0.0 2023-03-08 Mark WU Preliminary FCM360W_Hardware_Design 4 / 56 Wi-Fi&Bluetooth Module Series Contents Safety Information ........................................................................................................................................ 3 About the Document .................................................................................................................................... 4 Contents .........................................................................................................................................................5 Table Index .................................................................................................................................................... 7 Figure Index ...................................................................................................................................................8 1 2 Introduction ............................................................................................................................................9 Special Marks ............................................................................................................................... 9 1.1. Product Overview ................................................................................................................................10 Key Features .............................................................................................................................. 11 2.1. Functional Diagram .................................................................................................................... 12 2.2. 3.4.1. 3.4.2. 3.4.3. 3.4.4. 3.4.5. 3.4.6. 3.4.7. 3 Application Interfaces .........................................................................................................................13 Pin Assignment ...........................................................................................................................13 3.1. 3.2. Pin Description ........................................................................................................................... 14 3.3. GPIO Multiplexing ...................................................................................................................... 17 Application Interfaces ................................................................................................................. 19 3.4. UARTs ............................................................................................................................. 19 SPI ................................................................................................................................... 20 I2C Interface* ...................................................................................................................21 SDIO Interface* ............................................................................................................... 22 PWM Interfaces* ............................................................................................................. 23 I2S Interface* ...................................................................................................................24 ADC Interfaces* ...............................................................................................................24 3.5. RF Antenna Interfaces ............................................................................................................... 25 3.5.1. Operating Frequencies ....................................................................................................25 ANT_WIFI/BT Antenna (Optional) .................................................................................. 25 3.5.2. Reference Design .................................................................................................25 Antenna Design Requirements ............................................................................26 RF Routing Guidelines ......................................................................................... 26 PCB Antenna (Optional) ..................................................................................................28 Coaxial RF Connector (Optional) ....................................................................................30 Receptacle Specifications ....................................................................................30 Assemble Coaxial Cable Plug Manually ..............................................................32 Assemble Coaxial Cable Plug with Jig ................................................................ 33 Recommended Manufacturers of RF Connector and Cable ...............................33 3.5.4.1. 3.5.4.2. 3.5.4.3. 3.5.4.4. 3.5.2.1. 3.5.2.2. 3.5.2.3. 3.5.3. 3.5.4. 4.1. 4 Operating Characteristics .................................................................................................................. 34 Power Supply ............................................................................................................................. 34 Reference Design for Power Supply .............................................................................. 34 4.2. Turn On .......................................................................................................................................35 4.3. Reset .......................................................................................................................................... 35 4.1.1. FCM360W_Hardware_Design 5 / 56 Wi-Fi&Bluetooth Module Series 4.4. Download Mode ......................................................................................................................... 37 5 RF Performances .................................................................................................................................38 5.1. Wi-Fi Performances ....................................................................................................................38 Bluetooth Performances .............................................................................................................39 5.2. 6 Electrical Characteristics & Reliability ............................................................................................. 40 Absolute Maximum Ratings ....................................................................................................... 40 6.1. Power Supply Ratings ................................................................................................................40 6.2. 6.3. Power Consumption ................................................................................................................... 41 6.4. Digital I/O Characteristics ...........................................................................................................42 ESD Protection ........................................................................................................................... 42 6.5. 7 Mechanical Information ...................................................................................................................... 43 7.1. Mechanical Dimensions ............................................................................................................. 43 7.2. Recommended Footprint ............................................................................................................45 Top and Bottom Views ............................................................................................................... 46 7.3. 8 Storage, Manufacturing & Packaging ...............................................................................................48 8.1. Storage Conditions .....................................................................................................................48 8.2. Manufacturing and Soldering ..................................................................................................... 49 Packaging Specifications ........................................................................................................... 51 8.3. Carrier Tape .................................................................................................................... 51 8.3.1. 8.3.2. Plastic Reel ......................................................................................................................52 8.3.3. Mounting Direction .......................................................................................................... 52 Packaging Process ..........................................................................................................53 8.3.4. 9 Appendix References ......................................................................................................................... 54 FCM360W_Hardware_Design 6 / 56 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Marks .................................................................................................................................. 9 Table 2: Basic Information ........................................................................................................................... 10 Table 3: Key Features ..................................................................................................................................11 Table 4: I/O Parameter Description .............................................................................................................14 Table 5: Pin Description ...............................................................................................................................14 Table 6: GPIO Multiplexing ..........................................................................................................................17 Table 7: Pin Definition of UARTs .................................................................................................................19 Table 8: Pin Definition of SPI .......................................................................................................................21 Table 9: Pin Definition of I2C Interface ........................................................................................................22 Table 10: Pin Definition of SDIO Interface .................................................................................................. 22 Table 11: Pin Definition of PWM Interfaces ................................................................................................ 23 Table 12: Pin Definition of I2S Interface ......................................................................................................24 Table 13: Pin Definition of ADC Interfaces ..................................................................................................24 Table 14: ADC Features .............................................................................................................................. 24 Table 15: Operating Frequencies (Unit: GHz) ............................................................................................ 25 Table 16: ANT_WIFI/BT Pin Definition ........................................................................................................25 Table 17: Antenna Design Requirements ................................................................................................... 26 Table 18: PCB Antenna Specifications ....................................................................................................... 28 Table 19: Major Specifications of the RF Connector .................................................................................. 30 Table 20: Pin Definition of Power Supply and GND Pins ........................................................................... 34 Table 21: Pin Definition of CEN ...................................................................................................................35 Table 22: Pin Definition of RESET .............................................................................................................. 35 Table 23: Wi-Fi Performances ..................................................................................................................... 38 Table 24: Bluetooth Performances ..............................................................................................................39 Table 25: Absolute Maximum Ratings (Unit: V) .......................................................................................... 40 Table 26: Module Power Supply Ratings (Unit: V) ......................................................................................40 Table 27: Power Consumption in Low Power Modes ................................................................................. 41 Table 28: Power Consumption in Non-signaling Modes (Unit: mA) ........................................................... 41 Table 29: VBAT I/O Characteristics (Unit: V) .............................................................................................. 42 Table 30: ESD Characteristics (Unit: kV) .................................................................................................... 42 Table 31: Recommended Thermal Profile Parameters .............................................................................. 50 Table 32: Carrier Tape Dimension Table (Unit: mm) ..................................................................................51 Table 33: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 52 Table 34: Reference Documents .................................................................................................................54 Table 35: Terms and Abbreviations ............................................................................................................ 54 FCM360W_Hardware_Design 7 / 56 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ...................................................................................................................... 12 Figure 2: Pin Assignment (Top View) ..........................................................................................................13 Figure 3: Main UART Connection ................................................................................................................20 Figure 4: Debug UART Reference Design ..................................................................................................20 Figure 5: SPI Connection .............................................................................................................................21 Figure 6SDIO Interface Connection .........................................................................................................22 Figure 7: RF Antenna Reference Design .................................................................................................... 26 Figure 8: Microstrip Design on a 2-layer PCB .............................................................................................27 Figure 9: Coplanar Waveguide Design on a 2-layer PCB .......................................................................... 27 Figure 10: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 27 Figure 11: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 27 Figure 12: Keepout Area on Motherboard ...................................................................................................29 Figure 13: Prohibited Area for Routing ........................................................................................................29 Figure 14: Dimensions of the Receptacle (Unit: mm) ................................................................................. 30 Figure 15: Specifications of Mated Plugs (Unit: mm) ..................................................................................31 Figure 16: Space Factor of the Mated Connectors (Unit: mm) ...................................................................31 Figure 17: Plug in a Coaxial Cable Plug ..................................................................................................... 32 Figure 18: Pull out a Coaxial Cable Plug .................................................................................................... 32 Figure 19: Install the Coaxial Cable Plug with Jig .......................................................................................33 Figure 20: VBAT Reference Circuit ............................................................................................................. 34 Figure 21: Turn-on Timing ........................................................................................................................... 35 Figure 22: Reference Circuit of RESET by A Using Driving Circuit ............................................................36 Figure 23: Reference Circuit of RESET with A Button ................................................................................36 Figure 24: Reset Timing .............................................................................................................................. 36 Figure 25: Reference Design for Download Mode ......................................................................................37 Figure 26: Top and Side Dimensions .......................................................................................................... 43 Figure 27: Bottom Dimensions (Bottom View) ............................................................................................ 44 Figure 28: Recommended Footprint ............................................................................................................45 Figure 29: Top and Bottom Views (Pin Antenna) ........................................................................................46 Figure 30: Top and Bottom Views (PCB Antenna) ..................................................................................... 46 Figure 31: Top and Bottom Views (Coaxial RF Connector) ....................................................................... 47 Figure 32: Recommended Reflow Soldering Thermal Profile .................................................................... 49 Figure 33: Tape Specifications .................................................................................................................... 51 Figure 34: Plastic Reel Dimension Drawing ................................................................................................52 Figure 35: Mounting Direction ..................................................................................................................... 52 Figure 36: Packaging Process .....................................................................................................................53 FCM360W_Hardware_Design 8 / 56 Wi-Fi&Bluetooth Module Series 1 Introduction QuecOpen is a solution where the module acts as the main processor. Constant transition and evolution of both the communication technology and the market highlight its merits. It can help you to:

Realize embedded applications quick development and shorten product R&D cycle Simplify circuit and hardware structure design to reduce engineering costs Miniaturize products Reduce product power consumption Apply OTA technology Enhance product competitiveness and price-performance ratio Apply anti-copy encryption technology to enhance product safety This document defines FCM360W in QuecOpen solution and describes its air interfaces and hardware interfaces, which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. 1.1. Special Marks Table 1: Special Marks Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3]

four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. refers to all FCM360W_Hardware_Design 9 / 56 Wi-Fi&Bluetooth Module Series 2 Product Overview FCM360W is a high-performance Wi-Fi and Bluetooth module for smart-home IoT terminals supporting IEEE 802.11b/g/n/ax and Bluetooth 5.1 standards. The module, featuring built-in PMU, PA, LNA and T/R switch, provides multiple interfaces including UART, SPI, I2C*, I2S*, SDIO*, ADC* and PWM* for various applications. FCM360W is an SMD module with compact packaging. It includes:

240 MHz RICS processor 48 KB ROM, 512 KB SRAM and a built-in 4 MB flash Support secondary development Table 2: Basic Information FCM360W Packaging type Pin counts Dimensions Weight LCC 39

(25.5 0.15) mm (18 0.15) mm (3.2 0.2) mm Approx. 1.65 g FCM360W_Hardware_Design 10 / 56 Wi-Fi&Bluetooth Module Series 2.1. Key Features Table 3: Key Features Basic Information Protocols and Standards Power Supply Temperature Ranges Wi-Fi Protocols: IEEE 802.11b/g/n/ax Bluetooth protocol: Bluetooth 5.1 All hardware components are fully compliant with EU RoHS directive VBAT Power Supply:

3.03.6 V Typ.: 3.3 V Operating temperature 1: -40 to +85 C Storage temperature: -45 to +95 C EVB Kit FCM360W TE-B 2 RF Antenna Interface Antenna Interfaces Application Interface 3 ANT_WIFI/BT (optional) PCB antenna (optional) Coaxial RF connector (optional) 50 impedance Application Interfaces UART, SPI, I2C*, I2S*, SDIO*, PWM*, ADC*

1 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. 2 For more details about the EVB, see document [1]. 3 For more details about the interfaces, see Chapter 3.3 and Chapter 3.4. FCM360W_Hardware_Design 11 / 56 Wi-Fi&Bluetooth Module Series 2.2. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. Main chip Radio frequency Peripheral interfaces Figure 1: Functional Diagram NOTE The module supports pin antenna (ANT_WIFI/BT), PCB antenna and coaxial RF connector for your selection. FCM360W_Hardware_Design 12 / 56 Wi-Fi&Bluetooth Module Series 3 Application Interfaces 3.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE 1. Keep all RESERVED and unused pins open. 2. All GND pins should be connected to ground. 3. The module supports UART 3, SPI 1, I2C 1, SDIO 1, PWM 6, I2S 1 and ADC 3 multiplexed with up to 19 GPIO pins. For more details, see Chapter 3.3 and Chapter 3.4. FCM360W_Hardware_Design 13 / 56 Wi-Fi&Bluetooth Module Series 3.2. Pin Description Table 4: I/O Parameter Description Type AIO DI DO DIO PI Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rated current, etc. Table 5: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT 4 VDD_EFUSE 17 PI PI Power supply for the module Power supply for eFuse programming Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V Vmax = 3.3 V Vmin = 0 V Vnom = 1.8 V It must be provided with sufficient current more than 0.6 A. Used to enter safe mode;

If unused, keep it open. GND 1, 3, 30, 3139 Control Signals Pin Name Pin No. I/O Description DC Characteristics Comment RESET 11 DI Resets the module VBAT CEN 5 DI Enable the module UART0 Hardware reset;

Internally pulled up to 3.3 V;

Active low. Hardware enable;

Internally pulled up to 3.3 V;

Active high. FCM360W_Hardware_Design 14 / 56 Wi-Fi&Bluetooth Module Series Pin Name Pin No. I/O Description DC Characteristics Comment UART0_TXD 27 DO UART0 transmit UART0_RXD 26 DI UART0 receive VBAT GPIO Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment GPIO20 GPIO15 GPIO14 GPIO4 GPIO16 GPIO21 GPIO22 GPIO23 GPIO24 GPIO25 GPIO17 GPIO13 GPIO1 GPIO0 GPIO3 GPIO2 6 7 8 9 10 12 13 14 15 16 19 20 21 22 23 29 DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output VBAT Interrupt wakeup. Interrupt wakeup. Interrupt wakeup. FCM360W_Hardware_Design 15 / 56 Wi-Fi&Bluetooth Module Series RF Antenna Interface Pin Name Pin No. I/O Description DC Characteristics Comment Wi-Fi/Bluetooth antenna interface

(optional) ANT_WIFI/BT 2 AIO RESERVED Pins Pin Name Pin No. RESERVED 18, 24, 25, 28 50 impedance. Comment Keep it unconnected. FCM360W_Hardware_Design 16 / 56 Wi-Fi&Bluetooth Module Series 3.3. GPIO Multiplexing The module provides 19 GPIO interfaces by default. Pins are defined as follows:

Table 6: GPIO Multiplexing Pin Name Pin No. Alternate Function 0

(GPIO No.) Alternate Function 1 Alternate Function 2 Alternate Function 3 GPIO4 GPIO16 GPIO21 GPIO22 GPIO23 GPIO24 GPIO25 GPIO20 GPIO15 GPIO14 9 10 12 13 14 15 16 6 7 8 GPIO4 GPIO16 GPIO21 GPIO22 GPIO23 GPIO24 GPIO25 GPIO20 GPIO15 GPIO14 TRST PWM2 PWM0 PWM1 PWM2 PWM3 ADC2 ADC1 ADC0 SDIO_CMD UART0_RXD I2S_TXD I2C_SDA UART0_RTS PWM0 UART1_CTS IR_OUT

Alternate Function 4 SPI_CS2 SDIO_DATA0 UART0_TXD I2S_TX_WS SDIO_DATA1 UART1_RTS I2S_TX_SCK SDIO_DATA2 UART1_CTS I2S_MCLK SDIO_DATA3 I2C_SDA PWM3 I2S_MCLK

Alternate Function 5

BOOTMODE1 VOUT_QN PWM5 I2S_TX_WS BOOTMODE0 VOUT_QP PWM4 I2S_TXD FCM360W_Hardware_Design 17 / 56 Wi-Fi&Bluetooth Module Series RESET GPIO17 GPIO13 GPIO1 GPIO0 GPIO3 GPIO2 11 19 20 21 22 23 29 GPIO18 GPIO17 GPIO13 GPIO1 GPIO0 GPIO3 GPIO2 TESTMODE UART1_RTS SPI_HOLD I2S_TXD I2C_SCL UART2_RXD WAKEUP SPI_WP PWM5 I2S_TX_WS UART2_TXD SDIO_CLK I2C_SCL I2S_RXD

SPI_CS0 SPI_CLK SPI_MISO SPI_MOSI TMS TCK TDI TDO UART1_RXD PWM1 I2S_RXD UART2_TXD PWM0 I2S_TX_SCK UART0_CTS PWM3 I2C_SDA UART1_TXD PWM2 I2C_SCL UART0_RXD 26 GPIO5 40M_CLK_OUT IR_OUT I2S_RX_WS XTAL_I_32K UART0_TXD 27 GPIO6 COLD_RESET 32K_CLK_OUT I2S_RX_SCK XTAL_O_32K

NOTE The GPIO0, GPIO1, GPIO2, GPIO17 and GPIO18 (RESET) can be used as sleep interrupt to wake up the module which will immediately enter the operating state after being awakened. FCM360W_Hardware_Design 18 / 56 Wi-Fi&Bluetooth Module Series 3.4. Application Interfaces 3.4.1. UARTs The module supports 3 UARTs: UART0, UART1 and UART2. The module serves as DCE (Data Communication Equipment), which is connected in the traditional DCE-DTE (Data Terminal Equipment) mode. Table 7: Pin Definition of UARTs Pin Name Pin No. Multiplexing Function I/O Description Comment UART0_TXD 27 UART0_RXD 26

DO UART0 transmit Pin 13 (alternative) DI UART0 receive Pin 12 (alternative) GPIO3 GPIO4 GPIO2 GPIO1 GPIO16 GPIO23 GPIO13 GPIO17 23 9 29 21 10 14 20 19 UART0_CTS DO UART0 clear to send UART0_RTS DI UART0 request to send UART1_TXD DO UART1 transmit UART1_RXD DI UART1 receive UART1_CTS DO UART1 clear to send Pin 15 (alternative) UART1_RTS DI UART1 request to send Pin 11 (alternative) UART2_TXD DO UART2 transmit Pin 22 (alternative) UART2_RXD DI UART2 receive The UART0 can be used as main UART for AT command communication and data transmission. The default baud rate is 115200 bps, and the maximum baud rate can reach 6 Mbps. Its also available for firmware upgrade and supports a default baud rate of 921600 bps. The pins 26 and 27 (default pins) can be used as communication, download and debugging ports, while the pins 12 and 13 (alternative pins) can only be used as communication and debugging ports. The main UART connection between DCE and DTE is illustrated below. FCM360W_Hardware_Design 19 / 56 Wi-Fi&Bluetooth Module Series Figure 3: Main UART Connection The UART1 and UART2 can all be used as debug UART. They support 115200 bps baud rate by default, and are used for outputting partial logs with debugging tools. The UART1 and UART2 can be used as communication and debugging ports but are not recommended to be used as download ports. The following is a reference design of debug UART. Figure 4: Debug UART Reference Design NOTE Test points must be reserved for UART1_TXD, UART2_TXD, UART1_RXD and UART2_RXD. 3.4.2. SPI The module provides one SPI frequency of the interface can reach 20 MHz in slave mode, and 40 MHz in master mode. that supports both master and slave modes. The maximum clock The following figure shows the connection between the host and the slave:

FCM360W_Hardware_Design 20 / 56 Wi-Fi&Bluetooth Module Series Figure 5: SPI Connection Table 8: Pin Definition of SPI Pin Name Pin No. Multiplexing Function I/O Description Comment GPIO1 21 SPI_CS0 DIO SPI chip select GPIO0 22 SPI_CLK DIO SPI clock GPIO3 GPIO2 23 29 SPI_MISO DIO SPI_MOSI DIO SPI master-in slave-out SPI master-out slave-in In master mode, it is an input signal;

In slave mode, it is an output signal. In master mode, it is an output signal;

In slave mode, it is an input signal. 3.4.3. I2C Interface*

The module provides one I2C interface that supports master mode only. It supports:

AMBA 2.0 APB bus Standard-mode (100 Kbps) and fast-mode (400 Kbps) protocols Programmable master and slave modes 7-bit and 10-bit addressing modes Automatic clock stretching Programmable clock and data timing DMA Universal call address FCM360W_Hardware_Design 21 / 56 Wi-Fi&Bluetooth Module Series Table 9: Pin Definition of I2C Interface Pin Name Pin No. GPIO2 GPIO3 29 23 Multiplexing Function I2C_SCL I2C_SDA I/O Description Comment OD OD I2C serial clock Pin 11, Pin 20 (alternative) I2C serial data Pin 12, Pin 16 (alternative) 3.4.4. SDIO Interface*

Table 10: Pin Definition of SDIO Interface Pin Name Pin No. Multiplexing Function I/O Description GPIO21 GPIO13 GPIO25 GPIO24 GPIO22 GPIO23 12 20 16 15 13 14 SDIO_CMD DIO SDIO command SDIO_CLK SDIO_DATA3 SDIO_DATA2 SDIO_DATA0 SDIO_DATA1 DI DIO DIO DIO DIO SDIO clock SDIO data bit 3 SDIO data bit 2 SDIO data bit 0 SDIO data bit 1 The SDIO interface connection between the module and the host is illustrated in the following figure Figure 6SDIO Interface Connection FCM360W_Hardware_Design 22 / 56 Wi-Fi&Bluetooth Module Series To ensure compliance of interface design with the SDIO 3.0 specification, please comply with the following principles for SDIO interface design. Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. The impedance of SDIO signal trace is 50 10 %. Keep SDIO signals far away from other sensitive circuits/signals, such as RF circuits and analog signals, as well as noisy signals such as clock signals and DC-DC signals. The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF. SDIO signal traces need to be equal length (the distance between the traces should be less than 0.5 mm). 3.4.5. PWM Interfaces*

The module supports six PWM channels by default. Pin description of PWM interfaces are as follows. Table 11: Pin Definition of PWM Interfaces Pin Name Pin No. Multiplexing Function I/O Description Comment GPIO16 GPIO23 GPIO25 GPIO15 GPIO14 GPIO4 10 14 16 7 8 9 PWM2 PWM1 PWM3 PWM5 PWM4 PWM0 DO PWM2 out Pin 15, Pin 29 (alternative). DO PWM1 out Pin 21 (alternative). DO PWM3 out Pin 6, Pin 23 (alternative). DO PWM5 out Pin 19 (alternative). DO PWM4 out DO PWM0 out Pin 13, Pin 22 (alternative). FCM360W_Hardware_Design 23 / 56 Wi-Fi&Bluetooth Module Series 3.4.6. I2S Interface*

The module supports one I2S interface for transmission of digital audio data between internal components of the system, such as Codec, DSP, digital input/output interface, ADC, DAC and digital filter, etc. Table 12: Pin Definition of I2S Interface Pin Name Pin No. Multiplexing Function I/O Description Comment GPIO1 21 I2S_RXD DI I2S receive data Pin 20 (alternative). GPIO14 GPIO20 8 6 I2S_TXD DO I2S transmit data Pin 11, Pin 12 (alternative). I2S_MCLK OD I2S master clock Pin 15 (alternative). GPIO0 22 I2S_TX_SCK DIO GPIO15 7 I2S_TX_WS DIO I2S transmit serial clock I2S transmit word select Pin 14 (alternative). Pin 13, Pin 19 (alternative). 3.4.7. ADC Interfaces*

The module supports three ADC interfaces by default, whose voltage range is 03.3 V. To improve ADC accuracy, surround ADC trace with ground. Table 13: Pin Definition of ADC Interfaces Pin Name Pin No. Multiplexing Function I/O Description GPIO20 GPIO15 GPIO14 6 7 8 ADC2 ADC1 ADC0 AI AI AI General-purpose ADC interface General-purpose ADC interface General-purpose ADC interface Table 14: ADC Features Parameter ADC Voltage Range Min. 0 Typ.

Max. 3.3 Unit V FCM360W_Hardware_Design 24 / 56 ADC Resolution Rate

TBD

bit Wi-Fi&Bluetooth Module Series 3.5. RF Antenna Interfaces Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. The module supports PCB antenna, coaxial RF connector and ANT_WIFI/BT antenna pin (stamp hole). The coaxial RF connector is not mounted on the module when using PCB antenna or ANT_WIFI/BT antenna. 3.5.1. Operating Frequencies The operating frequencies of the module are listed below:

Table 15: Operating Frequencies (Unit: GHz) Feature 2.4 GHz Wi-Fi Bluetooth Frequency 2.4002.4835 2.4002.4835 3.5.2. ANT_WIFI/BT Antenna (Optional) Table 16: ANT_WIFI/BT Pin Definition Pin Name Pin No. I/O Description Comment ANT_WIFI/BT 2 AIO Wi-Fi/Bluetooth antenna interface 50 impedance. 3.5.2.1. Reference Design The circuit of RF antenna interface is shown below. For better RF performance, it is necessary to reserve a matching circuit and add ESD protection components. Reserved matching components such as R1, C1, C2, and D1 should be placed as close to the antenna as possible. C1, C2, and D1 are not mounted by FCM360W_Hardware_Design 25 / 56 default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 . Wi-Fi&Bluetooth Module Series Figure 7: RF Antenna Reference Design 3.5.2.2. Antenna Design Requirements Table 17: Antenna Design Requirements Parameter Requirement Frequency Range (GHz) 2.4002.4835 Cable Insertion Loss (dB) VSWR Gain (dBi) Max. input power (W) Input impedance ()

< 1 2 1 (Typ.) 50 50 Polarization type Vertical 3.5.2.3. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. FCM360W_Hardware_Design 26 / 56 Wi-Fi&Bluetooth Module Series Figure 8: Microstrip Design on a 2-layer PCB Figure 9: Coplanar Waveguide Design on a 2-layer PCB Figure 10: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 11: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) FCM360W_Hardware_Design 27 / 56 Wi-Fi&Bluetooth Module Series To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to control the characteristic impedance of RF traces to 50 . GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to the ground. The distance between the RF pins and the RF connector should be as short as possible and all right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. In addition, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be at least twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [2]. 3.5.3. PCB Antenna (Optional) Table 18: PCB Antenna Specifications Parameter Requirement Frequency Range (GHz) 2.4002.500 Input Impedance () VSWR Gain (dBi) Efficiency 50 3

-0.38 (Typ.) 26 %

When using the PCB antenna on the module, the module should be placed at the side of the motherboard. The distance between the PCB antenna and connectors, vias, traces, ethernet port and any other metal components on the motherboard should be at least 16 mm. All layers in the PCB of the motherboard under the PCB antenna should be designed as a keepout area. FCM360W_Hardware_Design 28 / 56 Wi-Fi&Bluetooth Module Series Figure 12: Keepout Area on Motherboard Do not routing at the RF test point at the bottom of the module to ensure its performances during PCB design. Figure 13: Prohibited Area for Routing FCM360W_Hardware_Design 29 / 56 Wi-Fi&Bluetooth Module Series 3.5.4. Coaxial RF Connector (Optional) 3.5.4.1. Receptacle Specifications The mechanical dimensions of the receptacle supported by the module are as follows. Figure 14: Dimensions of the Receptacle (Unit: mm) Table 19: Major Specifications of the RF Connector Item Nominal Frequency Range Nominal Impedance Temperature Rating Voltage Standing Wave Ratio (VSWR) Specification DC to 6 GHz 50

-40 C to +85 C Meet the requirements of:

Max. 1.3 (DC3 GHz) Max. 1.45 (36 GHz) FCM360W_Hardware_Design 30 / 56 The mated plug listed in the following figure can be used to match the connector. Wi-Fi&Bluetooth Module Series Figure 15: Specifications of Mated Plugs (Unit: mm) The following figure describes the space factor of the mated connectors. Figure 16: Space Factor of the Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. FCM360W_Hardware_Design 31 / 56 Wi-Fi&Bluetooth Module Series 3.5.4.2. Assemble Coaxial Cable Plug Manually The pictures for plugging in a coaxial cable plug is shown below, = 90 is acceptable, while 90 is not. Figure 17: Plug in a Coaxial Cable Plug The pictures of pulling out the coaxial cable plug is shown below, = 90 is acceptable, while 90 is not. Figure 18: Pull out a Coaxial Cable Plug FCM360W_Hardware_Design 32 / 56 Wi-Fi&Bluetooth Module Series 3.5.4.3. Assemble Coaxial Cable Plug with Jig The pictures of installing the coaxial cable plug with a jig is shown below, = 90 is acceptable, while 90 is not. Figure 19: Install the Coaxial Cable Plug with Jig 3.5.4.4. Recommended Manufacturers of RF Connector and Cable RF connectors and cables by I-PEX are recommended. For more details, visit https://www.i-pex.com. FCM360W_Hardware_Design 33 / 56 Wi-Fi&Bluetooth Module Series 4 Operating Characteristics 4.1. Power Supply Power supply pin and ground pins of the module are defined in the following table. Table 20: Pin Definition of Power Supply and GND Pins Pin Name Pin No. VBAT 4 I/O PI Description Min. Typ. Max. Unit Power supply for the module 3.0 3.3 3.6 V GND 1, 3, 30, 3139 4.1.1. Reference Design for Power Supply The module is powered by VBAT, and it is recommended to use a power supply chip that can provide more than 0.6 A output current. For better power supply performance, it is recommended to parallel a 22 F decoupling capacitor, and two filter capacitors (1 F and 100 nF) near the modules VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be. VBAT reference circuit is shown below:

Figure 20: VBAT Reference Circuit FCM360W_Hardware_Design 34 / 56 Wi-Fi&Bluetooth Module Series 4.2. Turn On After the module VBAT is powered on, keep the CEN pin at high level to realize the automatic startup of the module. Table 21: Pin Definition of CEN Pin Name Pin No. I/O Description Comment CEN 5 DI Enable the module Hardware enable;

Internally pulled up to 3.3 V;

Active high. The turn-on timing is shown below:

Figure 21: Turn-on Timing 4.3. Reset Drive RESET low for at least 100 ms and then release it to reset the module. Table 22: Pin Definition of RESET Pin Name Pin No. I/O Description Comment RESET 11 DI Resets the module Hardware reset;

Internally pulled up to 3.3 V;

Active low. FCM360W_Hardware_Design 35 / 56 The reference design for resetting the module are shown below. An open collector driving circuit can be used to control the RESET pin. Wi-Fi&Bluetooth Module Series Figure 22: Reference Circuit of RESET by A Using Driving Circuit Another way to control the RESET is by using a button directly. When pressing the button, an electrostatic strike may generate from finger. Therefore, a TVS component shall be placed near the button for ESD protection. Figure 23: Reference Circuit of RESET with A Button The module reset timing is illustrated in the following figure. Figure 24: Reset Timing FCM360W_Hardware_Design 36 / 56 Wi-Fi&Bluetooth Module Series 4.4. Download Mode Keep the input signal of RESET at low level during resetting or power-up and the module will enter download mode. In the download mode, the firmware can be download through the main UART. During the hardware design, the RESET pin of the module is connected to the RTS of the serial port chip, or the GPIO is controlled according to the following waveform, otherwise the download will fail. Figure 25: Reference Design for Download Mode FCM360W_Hardware_Design 37 / 56 Wi-Fi&Bluetooth Module Series 5 RF Performances 5.1. Wi-Fi Performances Table 23: Wi-Fi Performances Operating Frequency 2.4 GHz: 2.4002.4835 GHz Modulation BPSK, QPSK, CCK, 16QAM, 64QAM Operating Mode AP STA Transmission Data Rate 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) 802.11ax: HE20MCS 07 Condition EVM Unit: dBm, Tolerance: 2 dB Transmitting Power

@ Typ. Receiving Sensitivity

@ Typ. 2.4 GHz 802.11b @ 1 Mbps 802.11b @ 11 Mbps 35 %

802.11g @ 6 Mbps

-5 dB 802.11g @ 54 Mbps

-25 dB 802.11n, HT20 @ MCS 0

-5 dB 802.11n, HT20 @ MCS 7

-27 dB 17 17 14 14 14 14

-92

-86

-89

-73

-89

-70 FCM360W_Hardware_Design 38 / 56 Wi-Fi&Bluetooth Module Series 802.11n, HT40 @ MCS 0

-5 dB 802.11n, HT40 @ MCS 7

-27 dB 802.11ax, HE20 @ MCS 0 -5 dB 802.11ax, HE20 @ MCS 7 -27 dB 13 13 14 14

-87

-67

-89

-69 5.2. Bluetooth Performances Table 24: Bluetooth Performances Operating Frequency 2.400~2.4835 GHz Modulation GFSK Operating Mode BLE Condition BLE (1 Mbps) BLE (2 Mbps) Unit: dBm, Tolerance: 2 dB 4 Transmitting Power @ Typ. Receiving Sensitivity @ Typ. 6 dBm 6 dBm

-90 dBm

-89 dBm 4 The tolerance for Bluetooth receiving sensitivity is 4 dB in high channel (CH39). FCM360W_Hardware_Design 39 / 56 Wi-Fi&Bluetooth Module Series 6 Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 25: Absolute Maximum Ratings (Unit: V) Parameter VBAT Voltage at Digital Pins Voltage at ADC[0:2]

Min.

-0.3

-0.3 0 6.2. Power Supply Ratings Table 26: Module Power Supply Ratings (Unit: V) Max. 3.6 3.6 3.3 Parameter Description Condition Min. Typ. Max. VBAT Power supply for the module The actual input voltages must be kept between the minimum and maximum values. 3.0 3.3 3.6 FCM360W_Hardware_Design 40 / 56 Wi-Fi&Bluetooth Module Series 6.3. Power Consumption Table 27: Power Consumption in Low Power Modes Mode Light Sleep Deep Sleep DTIM1 DTIM3 OFF Typ. TBD TBD TBD TBD TBD Table 28: Power Consumption in Non-signaling Modes (Unit: mA) Unit A A mA mA A Condition 802.11b, Tx 1 Mbps @ 17 dBm 802.11b, Tx 11 Mbps @ 17 dBm 802.11g, Tx 6 Mbps @ 14 dBm 802.11g, Tx 54 Mbps @ 14 dBm 802.11n HT20, Tx MCS 0 @ 14 dBm 802.11n HT20, Tx MCS 7 @ 14 dBm 802.11n HT40, Tx MCS 0 @ 13 dBm 802.11n HT40, Tx MCS 7 @ 13 dBm 802.11ax HE20, Tx MCS 0 @14 dBm 802.11ax HE20, Tx MCS 7 @ 14 dBm Typ. 285 277 182 167 184 179 183 172 184 180 FCM360W_Hardware_Design 41 / 56 Wi-Fi&Bluetooth Module Series 6.4. Digital I/O Characteristics Table 29: VBAT I/O Characteristics (Unit: V) Parameter Description Min. Max. VIH VIL VOH VOL High-level Input Voltage 0.7 VBAT VBAT Low-level Input Voltage 0 0.3 VBAT High-level Output Voltage 0.9 VBAT

Low-level Output Voltage

0.1 VBAT 6.5. ESD Protection Static electricity occurs naturally and may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 30: ESD Characteristics (Unit: kV) Model Test Result Standard Human Body Model (HBM) Charged Device Model (CDM) 4 0.5 ANSI/ESDA/JEDEC JS-001-2017 ANSI/ESDA/JEDEC JS-002-2018 FCM360W_Hardware_Design 42 / 56 Wi-Fi&Bluetooth Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeters (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 26: Top and Side Dimensions FCM360W_Hardware_Design 43 / 56 Wi-Fi&Bluetooth Module Series Figure 27: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. FCM360W_Hardware_Design 44 / 56 7.2. Recommended Footprint Wi-Fi&Bluetooth Module Series Figure 28: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCM360W_Hardware_Design 45 / 56 7.3. Top and Bottom Views Wi-Fi&Bluetooth Module Series Figure 29: Top and Bottom Views (Pin Antenna) Figure 30: Top and Bottom Views (PCB Antenna) FCM360W_Hardware_Design 46 / 56 Wi-Fi&Bluetooth Module Series Figure 31: Top and Bottom Views (Coaxial RF Connector) NOTE 1. Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. 2. The coaxial RF connector is not mounted on the module when using PCB antenna or ANT_WIFI/BT antenna. FCM360W_Hardware_Design 47 / 56 Wi-Fi&Bluetooth Module Series 8 Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 5 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 5 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. FCM360W_Hardware_Design 48 / 56 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [3]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute is maximum reflow temperature. To avoid damage to the module caused by repeated heating, recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. it Figure 32: Recommended Reflow Soldering Thermal Profile FCM360W_Hardware_Design 49 / 56 Wi-Fi&Bluetooth Module Series Table 31: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max. temperature Cool-down slope Reflow Cycle Max. reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 information on the shielding can is still hours Neutral Salt Spray test, the laser engraved label clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3]. FCM360W_Hardware_Design 50 / 56 Wi-Fi&Bluetooth Module Series 8.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

8.3.1. Carrier Tape Carrier tape dimensions are detailed below:

Figure 33: Tape Specifications Table 32: Carrier Tape Dimension Table (Unit: mm) W 44 P 32 T 0.4 A0 B0 18.4 25.9 K0 3.7 K1 6.8 F E 20.2 1.75 FCM360W_Hardware_Design 51 / 56 8.3.2. Plastic Reel Wi-Fi&Bluetooth Module Series Figure 34: Plastic Reel Dimension Drawing Table 33: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 8.3.3. Mounting Direction Figure 35: Mounting Direction FCM360W_Hardware_Design 52 / 56 8.3.4. Packaging Process Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, then vacuumize it. Wi-Fi&Bluetooth Module Series Place the modules into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape on the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the vacuum-packed plastic reel inside the pizza box. Place 4 packaged pizza boxes inside 1 carton box and seal it. 1 carton box can pack 1000 modules. Figure 36: Packaging Process FCM360W_Hardware_Design 53 / 56 Wi-Fi&Bluetooth Module Series 9 Appendix References Table 34: Reference Documents Document Name

[1] Quectel_FCM360W_TE-B_User_Guide

[2] Quectel_RF_Layout_Application_Note

[3] Quectel_Module_SMT_Application_Note Table 35: Terms and Abbreviations Abbreviation Description ADC AMBA AP APB BLE BPSK CCK CDM CS DAC DCE DMA DSP Analog-to-Digital Converter Advanced Microcontroller Bus Architecture Access Point Advanced Peripheral Bus Bluetooth Low Energy Binary Phase Shift Keying Complementary Code Keying Charged Device Model Chip Select Digital-to-Analog Converter Data Communications Equipment Direct Memory Access Digital Signal Processor FCM360W_Hardware_Design 54 / 56 Wi-Fi&Bluetooth Module Series DTE DTIM ESD GFSK GND GPIO HE HT I/O I2C I2S IEEE IoT LNA LCC Mbps MISO MOSI NC OTA PA PCB PMU PWM QAM QPSK RF Data Terminal Equipment Delivery Traffic Indication Message Electrostatic Discharge Gauss frequency Shift Keying Ground General-Purpose Input/Output High Efficiency High Throughput Input/Output Inter-Integrated Circuit Inter-IC Sound Institute of Electrical and Electronics Engineers Internet of Things Low Noise Amplifier Leadless Chip Carrier (package) Million Bits Per Second Master In Slave Out Master Out Slave In Not Connected Over-the-Air Power Amplifier Printed Circuit Board Power Management Unit Pulse Width Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency FCM360W_Hardware_Design 55 / 56 Wi-Fi&Bluetooth Module Series RISC RoHS ROM SCLK SDIO SPI SRAM STA TBD UART VIH VIL Vmax Vmin Vnom VOH VOL VSWR Wi-Fi Reduced Instruction-Set Computer Restriction of Hazardous Substances Read Only Memory Serial Clock Secure Digital Input/Output Serial Peripheral Interface Static Random Access Memory Station To Be Determined Universal Asynchronous Receiver/Transmitter High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Normal Voltage Value High-level Output Voltage Low-level Output Voltage Voltage Standing Wave Ratio Wireless Fidelity FCM360W_Hardware_Design 56 / 56 Wi-Fi&Bluetooth Module Series FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023FCM360W. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth LE:0.1dBi Wi-Fi 2.4G:0.1dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 FCM360W_Hardware_Design 57 / 56 Wi-Fi&Bluetooth Module Series If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR2023FCM360W or Contains FCC ID: XMR2023FCM360W must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

FCM360W_Hardware_Design 58 / 56 Wi-Fi&Bluetooth Module Series

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth LE:0.1dBi Wi-Fi 2.4G:0.1dBi FCM360W_Hardware_Design 59 / 56 Wi-Fi&Bluetooth Module Series The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-2023FCM360W or where: 10224A-2023FCM360W is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:"Contient IC: 10224A-2023FCM360W " ou "o:

10224A-2023FCM360W est le numro de certification du module. FCM360W_Hardware_Design 60 / 56 Wi-Fi&Bluetooth Module Series FCM360W_Hardware_Design 61 / 56

FUCCTEL FCM360W Q1-AXXXX FCM360WAAMD-1X-04 SN: MPA17L81 AXXXXX1 FCC ID: XMR2023FCM360W IC: 102244-2023FCM360W

(Quectel Wireless Solutions Co., Ltd) To: Federal Communications Commission Date: 2023/05/24 7435 Oakland Mills Road Columbia, MD 21046 USA Attestation Section 2.911(d)(5)(i) and Section 2.911(d)(5)(ii)

(KDB 986446 D01 Covered Equipment) Section 2.911(d)(5)(i)

[Quectel Wireless Solutions Co., Ltd] (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Section 2.911(d)(5)(ii)

[Quectel Wireless Solutions Co., Ltd] (the applicant) certifies that, as of the date of the filing of the application, the applicant [is not] identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing covered equipment. Type of Equipment subject to FCC Certification:

FCC ID:XMR2023FCM360W If you have any questions, please feel free to contact me Jean Hu Contact Person:

Position in the Company: Quectel Wireless Solutions Co., Ltd Date of Signature:

2023/05/24 ___________________________ Signatory

(signature of the applicant)

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

Quectel Wireless Solutions Co., Ltd. XMR2023FCM360W FCM360W The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

EUT Condition The radio elements of the modular transmitter have their own shielding. Comply YES The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES All power lines derived from the host device are regulated before energizing other circuits internal to the FCM360W. Please see schematic.pdf A permanently attached antenna or unique antenna connector is a requirement . YES YES The FCM360W was tested in a stand alone configuration via a PCMCIA extender. Please see spurious setup YES Modular approval requirement

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(b) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to the module will comply with part 15 ensure that requirements under conditions of excessive data rates or over-modulation.

(c)The modular transmitter must have its own powersupply regulation.

(d) The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(e)The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that Quectel Wireless Solutions Company Limited length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see Section 15.31(i))mustnotbeinsideanotherdeviceduringtesting.

(f)The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedonthei ntendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. The label position of FCM360W is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text:

Contains FCC ID: XMR2023FCM360W. Please see the label.pdf The FCM360W is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. The FCM360W is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. YES YES YES Dated By:

2023/05/24 Jean Hu Signature Printed Title: Project Manager

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY DATE:May 24, 2023 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Sun Yue on our behalf, to apply to FCC on our equipment for FCC ID:

XMR2023FCM360W. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Sun Yue on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Co., Ltd

Quectel Wireless Solutions Company Limited Request for Confidentiality Date:

_2023/05/24_ Subject: Confidentiality Request for: _____ FCC ID: XMR2023FCM360W____ _____ IC ID: 10224A-2023FCM360W____ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100 Issue 12 / 12.4, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Permanent Permanent*1 Permanent Permanent Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term ______(Insert Explanation as Necessary)______ Permanent*

Permanent

*Note:

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement Schematics Test Setup Photos Users Manual ___Quectel Wireless Solutions Company Limited _has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of _180___ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

(Signature/Title2) Jean Hu

(Print name)