FCC ID: XMR2023FCS850RB Wi-Fi & Bluetooth Module

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6576839.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case FCS850R-B Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-03-01 Status: Preliminary Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FCS850R-B_Hardware_Design 1 / 48 Wi-Fi&Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. FCS850R-B_Hardware_Design 2 / 48 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FCS850R-B_Hardware_Design 3 / 48 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description

2023-03-01 Mike Qin Creation of the document 1.0.0 2023-03-01 Mike Qin Preliminary FCS850R-B_Hardware_Design 4 / 48 Wi-Fi&Bluetooth Module Series Contents Safety Information ........................................................................................................................................3 About the Document ....................................................................................................................................4 Contents ........................................................................................................................................................ 5 Table Index ....................................................................................................................................................7 Figure Index .................................................................................................................................................. 8 1 Introduction ...............................................................................................................................................9 1.1. Special Mark .................................................................................................................................... 9 2 Product Overview ................................................................................................................................... 10 2.1. Key Features ................................................................................................................................. 10 3 RF Performances ....................................................................................................................................12 3.1. Wi-Fi Performances .......................................................................................................................12 3.2. Bluetooth Performances ................................................................................................................12 4 Application Interfaces ............................................................................................................................14 4.1. Pin Assignment ..............................................................................................................................14 4.2. Pin Description ...............................................................................................................................15 4.3. Power Supply .................................................................................................................................17 4.4. Wi-Fi Application Interface ............................................................................................................ 18 4.4.1. SDIO Interface .................................................................................................................... 18 4.5. Bluetooth Application Interface ..................................................................................................... 20 4.5.1. PCM Interface ..................................................................................................................... 20 4.5.2. UART interface ....................................................................................................................22 4.6. RF Antenna Interface .................................................................................................................... 23 4.6.1. Reference Design ............................................................................................................... 23 4.6.2. RF Routing Guidelines ........................................................................................................24 4.6.3. RF Connector Recommendation ........................................................................................ 26 5 Electrical Characteristics & Reliability ................................................................................................ 28 5.1. Absolute Maximum Ratings ...........................................................................................................28 5.2. Power Supply Ratings ................................................................................................................... 28 5.3. ESD Protection .............................................................................................................................. 29 5.4. Digital I/O Characteristics ..............................................................................................................29 5.5. Thermal Dissipation .......................................................................................................................29 6 Mechanical Information ......................................................................................................................... 31 6.1. Mechanical Dimensions ................................................................................................................ 31 6.2. Recommended Footprint ...............................................................................................................33 6.3. Top and Bottom Views .................................................................................................................. 34 7 Storage, Manufacturing & Packaging .................................................................................................. 35 FCS850R-B_Hardware_Design 5 / 48 Wi-Fi&Bluetooth Module Series 7.1. Storage Conditions ........................................................................................................................ 35 7.2. Manufacturing and Soldering ........................................................................................................ 36 7.3. Packaging Specifications .............................................................................................................. 38 7.3.1. Carrier Tape ........................................................................................................................ 38 7.3.2. Plastic Reel ......................................................................................................................... 39 7.3.3. Mounting Direction .............................................................................................................. 39 7.3.4. Packaging Process ............................................................................................................. 40 8 Appendix References .............................................................................................................................41 FCS850R-B_Hardware_Design 6 / 48 Wi-Fi&Bluetooth Module Series Table Index Table 1 : Special Mark ................................................................................................................................... 9 Table 2 : Basic Information .......................................................................................................................... 10 Table 3 : Key Features .................................................................................................................................10 Table 4 : Wi-Fi Performances ...................................................................................................................... 12 Table 5 : Bluetooth Performances ............................................................................................................... 12 Table 6 : I/O Parameters Definition ............................................................................................................. 15 Table 7 : Pin Description ..............................................................................................................................15 Table 8 : Antenna Design Requirements .................................................................................................... 23 Table 9 : Absolute Maximum Ratings (Unit: V) ........................................................................................... 28 Table 10 : Module Power Supply Ratings (Unit: V) .....................................................................................28 Table 11 : VDDIO I/O Characteristics (Unit: V) ........................................................................................... 29 Table 12 : Recommended Thermal Profile Parameters ............................................................................. 37 Table 13 : Carrier Tape Dimension Table (Unit: mm) ................................................................................. 38 Table 14 : Plastic Reel Dimension Table (Unit: mm) .................................................................................. 39 Table 15 : Related Documents .................................................................................................................... 41 Table 16 : Terms and Abbreviations ............................................................................................................41 FCS850R-B_Hardware_Design 7 / 48 Wi-Fi&Bluetooth Module Series Figure Index Figure 1 : Pin Assignment (Top View) ......................................................................................................... 14 Figure 2 : Reference Circuit of Power Supply ............................................................................................. 18 Figure 3 : Power-up Timing ......................................................................................................................... 18 Figure 4 : SDIO Interface Connection ......................................................................................................... 19 Figure 5 : Bluetooth Application Connection ............................................................................................... 20 Figure 6 PCM Interface (Long FrameSync) ............................................................................................21 Figure 7 PCM Interface (Short FrameSync) ......................................................................................... 21 Figure 8 : Reference Circuit for RF Antenna Interface .............................................................................. 24 Figure 9 : Microstrip Design on a 2-layer PCB ............................................................................................24 Figure 10 : Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 24 Figure 11 : Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 25 Figure 12 : Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 25 Figure 13 : Dimensions of the Receptacle (Unit: mm) ................................................................................ 26 Figure 14 : Specifications of Mated Plugs ................................................................................................... 26 Figure 15 : Space Factor of Mated Connectors (Unit: mm) ........................................................................ 27 Figure 16 : Placement and Fixing of the Heatsink ...................................................................................... 30 Figure 17 : Top and Side Dimensions ......................................................................................................... 31 Figure 18 : Bottom Dimension (Bottom View) ............................................................................................. 32 Figure 19 : Recommended Footprint ...........................................................................................................33 Figure 21 : Top and Bottom Views FCS850R-B ................................................................................. 34 Figure 22 : Recommended Reflow Soldering Thermal Profile ................................................................... 36 Figure 23 : Carrier Tape Dimension Drawing ..............................................................................................38 Figure 24 : Plastic Reel Dimension Drawing ...............................................................................................39 Figure 25 : Mounting Direction .....................................................................................................................39 Figure 26 : Packaging Process ....................................................................................................................40 FCS850R-B_Hardware_Design 8 / 48 Wi-Fi&Bluetooth Module Series 1 Introduction This document defines the FCS850R-B and describes its air interfaces and hardware interfaces which are connected with your applications.The document for FCS850R and FCS850R-B is generic. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. 1.1. Special Mark Table 1: Special Mark Mark Definition

Unless otherwise specified, the asterisk (*) after the module function, feature, interface, pin name, AT command or parameter indicates that the function, feature, interface, pin, AT command or parameter is under development, so it is not supported temporarily; The asterisk

(*) after the module sub-model indicates that there is no sample for the sub-model.. FCS850R-B_Hardware_Design 9 / 48 Wi-Fi&Bluetooth Module Series 2 Product Overview FCS850R-B is a low-energyhigh-performance IEEE 802.11 a/b/g/n/ac Wi-Fi and Bluetooth 5.0 module. It supports 2.4 GHz band and 2T2R with maximum data rates up to 866.7 Mbps. It provides SDIO 3.0 interface for Wi-Fi functions and UARTPCM for Bluetooth functions. It is an SMD module with compact packaging. Related information is listed in the table below:

Table 2: Basic Information FCS850R-B Packaging type Pin counts Dimensions Weight sub-model LCC 50

(13.0 0.15) mm (15.0 0.15) mm (2.3 0.2) mm TBD FCS850R-B 2.1. Key Features Table 3: Key Features Basic Information Protocol and Standard Power Supply Wi-Fi protocols: IEEE 802.11 a/b/g/n/ac Bluetooth protocol: Bluetooth 5.0 All hardware components are fully compliant with EU RoHS directive VBAT Power Supply:

3.1~3.6 V Typ: 3.3 V VDDIO Power Supply:

1.7~3.6 V Typ: 1.8/3.3 V FCS850R-B_Hardware_Design 10 / 48 Wi-Fi&Bluetooth Module Series Temperature Ranges Operating temperature: 0 to +70 C1 Storage temperature: -55 to +125 C EVB Kit FC850R-B-M.2 RF Antenna Interface Wi-Fi Antenna Interface BT Antenna Interface Hardware Interface Wi-Fi Application Interface Bluetooth Application Interface ANT_WIFI0 ANT_WIFI1/BT 50 impedance ANT_WIFI1/BT or ANT_BT2 50 impedance SDIO 3.0 UARTPCM 1 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules indicators comply with IEEE and Bluetooth specification requirements. 2 FCS850R-B is a three-antenna module, and the Bluetooth antenna interface is ANT_ BTANT_ WIFI1/BT is only used as Wi-Fi1 antenna interface. FCS850R-B_Hardware_Design 11 / 48 Wi-Fi&Bluetooth Module Series 3 RF Performances 3.1. Wi-Fi Performances Table 4: Wi-Fi Performances Operating Frequency 2.4 GHz: 2.4002.4835 GHz 5 GHz: 5.1505.850 GHz Modulation DBPSKDQPSKCCK BPSKQPSK16QAM64QAM256QAM Operating Mode AP STA Transmission Data Rate 802.11b1 Mbps2 Mbps5.5 Mbps11 Mbps 802.11a/g6 Mbps9 Mbps12 Mbps18 Mbps24 Mbps36 Mbps48 Mbps54 Mbps 802.11nHT20MCS 0~7HT40MCS 0~7 802.11acVHT20MCS 0~8VHT40MCS 0~9VHT80MCS 0~9 3.2. Bluetooth Performances Table 5: Bluetooth Performances Operating Frequency 2.4002.4835 GHz Modulation GFSK/4-DQPSK8-DPSK FCS850R-B_Hardware_Design 12 / 48 Wi-Fi&Bluetooth Module Series Operating Mode Classic BluetoothBR + EDR Low power BluetoothBLE FCS850R-B_Hardware_Design 13 / 48 Wi-Fi&Bluetooth Module Series 4 Application Interfaces 4.1. Pin Assignment Figure 1: Pin Assignment (Top View) NOTE 1. Keep all RESERVED or unused pins unconnected. FCS850R-B_Hardware_Design 14 / 48 Wi-Fi&Bluetooth Module Series 4.2. Pin Description Table 6: I/O Parameters Definition Type AIO DI DO DIO PI Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 7: Pin Description Power Supply Pin Name Pin No. I/O Description VBAT 36 PI Power supply for the module DC Characteristics Vmin = 3.1 V Vnom = 3.3 V Vmax = 3.6 V VDDIO 34 PI Power supply for the modules I/O pins Vmin = 1.7 V Vnom = 1.8/3.3 V Vmax = 3.6 V Comment It must be provided with sufficient current more than 1.5A. It must be provided with sufficient current more than 50 mA. The voltage of VDDIO determines the voltage range of I/O. GND 13~810112332394648 Wi-Fi Application Interface Pin Name Pin No. I/O Description DC Characteristics Comment FCS850R-B_Hardware_Design 15 / 48 Wi-Fi&Bluetooth Module Series Active high. Requires differential impedance of 50 . SDIO 3.0 compliant. WLAN_EN 15 DI WLAN enable control /GPIO15 16/24 DO Wi-Fi wakes up host WLAN_WAKE_ HOST SDIO_CMD SDIO_CLK SDIO_DATA3 SDIO_DATA2 SDIO_DATA0 SDIO_DATA1 SDIO_RST 17 18 19 20 21 22 44 DIO SDIO command DI SDIO clock DIO SDIO data bit 3 VDDIO DIO SDIO data bit 2 DIO SDIO data bit 0 DIO SDIO data bit 1 DI SDIO Reset Active low. Bluetooth Application Interface Pin Name Pin No. I/O Description DC Characteristics Comment PCM_SYNC PCM_DIN PCM_DOUT PCM_CLK BT_EN BT_TXD BT_RXD BT_RTS BT_CTS 27 28 29 30 38 40 41 42 43 HOST_WAKE_BT 49 DI DI PCM data frame sync PCM data input DO PCM data output If unused, keep these pins open. DI DI PCM clock BT enable control Active high. DO BT UART transmit VDD IO DI BT UART receive DO DI DI BT UART clear to send BT UART clear to send HOST wake up BT It is recommend to add a 0 series resistor Active high. BT_WAKE_HOST 50 DO BT wake up HOST RF Antenna Interface Pin Name Pin No. I/O Description ANT_WIFI1/BT 2 AIO Wi-Fi1/Bluetooth antenna interface DC Characteristics Comment 50 impedance. FCS850R-B_Hardware_Design 16 / 48 ANT_WIFI0 ANT_BT 3 9 12 Other Interfaces AIO AIO Wi-Fi 0 antenna interface Bluetooth antenna interface Wi-Fi&Bluetooth Module Series 50 impedance. 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_SLP_CLK 31 DI 32.768kHz WLAN sleep clock VDDIO If unused, keep it open. Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED1 13 DIO GPIO6 RESERVED2 14 DIO GPIO5 VDDIO RESERVED3 RESERVED4 25 45 DIO GPIO7 DIO GPIO4 NC Pins Pin Name Pin No. NC 2633353747 4.3. Power Supply If unused, keep it open. It needs to be suspended or pulled down during power-on. If unused, keep it open. I/O Keep them open. The module is powered by VBAT. It is recommended to use a 3.3 V power supply chip with sufficient more than 1.5 A. For better power supply performance, it is recommended to parallel a 47 F decoupling capacitor, and 1 F and 100 nF filter capacitors near the modules VBAT pin. is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be. In addition, it VBAT reference circuit is shown below:

3 For two antenna modules (FCS850R), keep ANT_BT open. FCS850R-B_Hardware_Design 17 / 48 Wi-Fi&Bluetooth Module Series Figure 2: Reference Circuit of Power Supply The power-up timing of the module is shown below. Figure 3: Power-up Timing 4.4. Wi-Fi Application Interface The module provides SDIO interface for communication with the host to realize the functional application of Wi-Fi. 4.4.1. SDIO Interface SDIO interface connection between the module and the host is illustrated in the following figure. FCS850R-B_Hardware_Design 18 / 48 Wi-Fi&Bluetooth Module Series Figure 4: SDIO Interface Connection To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles:

Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. And the SDIO_CLK signal trace should be routed with ground surrounded separately. The impedance of SDIO signal trace is 50 10 %. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals. SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be equal in length (less than 1 mm distance between the traces). The length of signal line inside the module is as follows:

SDIO_ CLK12.9mmSDIO_ CMD14.5mmSDIO_ DATA09.9mmSDIO_ DATA111.7mm SDIO_ DATA2 9.3mm SDIO_ DATA3: 9.8mm, pay attention to the SDIO wiring length during design. According to the transmission rate, the length of signal line has the following requirements:

1) For SDR104 mode, the recommended signal line length is less than 50 mm,. 2) For other modes, such as DDR50, SDR50, etc., the recommended signal line length is less than 150 mm. The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF. Keep SDIO wiring parallel on the same floor as much as possible. Ensure that SDIO wiring is surrounded by ground holes and does not cross each other. FCS850R-B_Hardware_Design 19 / 48 Wi-Fi&Bluetooth Module Series 4.5. Bluetooth Application Interface Bluetooth application interface connection between the module and the host is illustrated in the figure below. Figure 5: Bluetooth Application Connection 4.5.1. PCM Interface The module provides a PCM interface for Bluetooth voice applications and supports the following features Supports Master and Slave mode Programmable long/short Frame Sync Supports 8-bit A-law/u-law, and 13/16-bit linear pCM formats Supports sign-extension PCM Master Clock Output: 64, 128, 256, or 512kHz Supports SCO/ESCO link PCM interface timing as below:

FCS850R-B_Hardware_Design 20 / 48 Wi-Fi&Bluetooth Module Series Figure 6PCM Interface (Long FrameSync) Figure 7 PCM Interface (Short FrameSync) Table 1PCM Interface Clock Specifications Symbol Description Min. Typ. Max. Unit FBCLK Frequency of BCLK (Master) FFrame Sync Frequency of Frame Sync (Master) FBCLK Frequency of BCLK (Slave) 64

64

8

512

512 kHz kHz kHz FCS850R-B_Hardware_Design 21 / 48 Wi-Fi&Bluetooth Module Series FFrame Sync Frequency of Frame Sync (Slave) D N Data Size Number of Slots Per Frame

8 1 8 8 1

16 1 kHz bits Slots Table 2PCM Interface Timing Symbol Description Min. Typ. Max. Unit TBCLKH TBCLKL High Period of BCLK Low Period of BCLK TFrameSync_Delay Delay Time from BCLK High to Frame Sync High TBCLKD_OUT Delay Time from BCLK High to Valid DAC Data 980 970

TSETUPIN Set-up Time for ADC Data Valid to BCLK Low 10 THOLDIN Hold Time for BCLK Low to ADC Data Invalid 125

75 125

ns ns ns ns ns ns 4.5.2. UART interface The module supports Bluetooth HCI (Host Controller Interface) UART, supports hardware flow control

(RTS/CTS), and can be used for data transmission with the host. The default baud rate is 115200, which can support up to 4 Mbps baud rate Table 3UART interface timing parameters parameters Data bits Parity bit Stop bit value 8 No parity 1 hardware flow control RTS/CTS FCS850R-B_Hardware_Design 22 / 48 Support transmission rate bps 1.2 K9.6 K14.4 K19.2 K28.8K38.4 K57.6 K76.8K115.2 K 128 K153.6K230.4 K460.8 K500 K921.6 K1 M1.5 M2 M 2.5 M3 M4 M Wi-Fi&Bluetooth Module Series 4.6. RF Antenna Interface Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. Table 8: Antenna Design Requirements Parameter Requirement 4 Frequency Ranges (GHz) Cable Insertion Loss (dB) VSWR Gain (dBi) Max Input Power (W) Input Impedance () 2.400~2.4835 5.150~5.850

< 1 2 1 (Typ) 50 50 Polarization Type Vertical 4.6.1.Reference Design A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a -type matching circuit and add ESD protection components for better RF performance. Reserved matching components (R1, C1, C2, and D1) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 . The following reference design is based on ANT_WIFI0 as an example, the reference design of other RF antenna interfaces is the same. 4 For more details about the RF performances, see Chapter 3. FCS850R-B_Hardware_Design 23 / 48 Wi-Fi&Bluetooth Module Series Figure 8: Reference Circuit for RF Antenna Interface 4.6.2.RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 9: Microstrip Design on a 2-layer PCB Figure 10: Coplanar Waveguide Design on a 2-layer PCB FCS850R-B_Hardware_Design 24 / 48 Wi-Fi&Bluetooth Module Series Figure 11: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. FCS850R-B_Hardware_Design 25 / 48 Wi-Fi&Bluetooth Module Series 4.6.3. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 13: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 14: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. FCS850R-B_Hardware_Design 26 / 48 Wi-Fi&Bluetooth Module Series Figure 15: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FCS850R-B_Hardware_Design 27 / 48 Wi-Fi&Bluetooth Module Series 5 Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 9: Absolute Maximum Ratings (Unit: V) Parameter VBAT VDDIO Voltage at Digital Pins Min.

-0.3

-0.3

-0.3 5.2. Power Supply Ratings Table 10: Module Power Supply Ratings (Unit: V) Parameter VBAT VDDIO Min. 3.1 1.7 Typ. 3.3 1.8/3.3 Max. 3.6 3.6 3.6 Max. 3.6 3.6 FCS850R-B_Hardware_Design 28 / 48 Wi-Fi&Bluetooth Module Series 5.3. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. 5.4. Digital I/O Characteristics Table 11: VDDIO I/O Characteristics (Unit: V) 1.8 V voltage range Parameter Description Min. VIH VIL VOH VOL High-level Input Voltage 1.7 Low-level Input Voltage

-0.3 High-level Output Voltage 1.62 Low-level Output Voltage 0 3.3 V voltage range Parameter Description Min. VIH VIL VOH VOL High-level Input Voltage 2.0 Low-level Input Voltage

-0.3 High-level Output Voltage 2.97 Low-level Output Voltage 0 Max. 3.6 0.8 1.8 0.18 Max. 3.6 0.9 3.3 0.33 Parameter V V V V Parameter V V V V 5.5. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating FCS850R-B_Hardware_Design 29 / 48 Wi-Fi&Bluetooth Module Series temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:

Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation. Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

Choose the heatsink with adequate fins to dissipate heat;

Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 16: Placement and Fixing of the Heatsink FCS850R-B_Hardware_Design 30 / 48 Wi-Fi&Bluetooth Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 17: Top and Side Dimensions FCS850R-B_Hardware_Design 31 / 48 Wi-Fi&Bluetooth Module Series Figure 18: Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FCS850R-B_Hardware_Design 32 / 48 6.2. Recommended Footprint Wi-Fi&Bluetooth Module Series Figure 19: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCS850R-B_Hardware_Design 33 / 48 6.3. Top and Bottom Views Wi-Fi&Bluetooth Module Series Figure 21: Top and Bottom Views FCS850R-B NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCS850R-B_Hardware_Design 34 / 48 Wi-Fi&Bluetooth Module Series 7 Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 5 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 5 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. FCS850R-B_Hardware_Design 35 / 48 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [2]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute is maximum reflow temperature. To avoid damage to the module caused by repeated heating, recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. it Figure 22: Recommended Reflow Soldering Thermal Profile FCS850R-B_Hardware_Design 36 / 48 Wi-Fi&Bluetooth Module Series Table 12: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2]. FCS850R-B_Hardware_Design 37 / 48 Wi-Fi&Bluetooth Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape Dimension details are as follow:

Figure 23: Carrier Tape Dimension Drawing Table 13: Carrier Tape Dimension Table (Unit: mm) W 24 P 16 T A0 B0 0.35 12.4 12.4 K0 2.6 K1 3.6 F E 11.5 1.75 FCS850R-B_Hardware_Design 38 / 48 7.3.2.Plastic Reel Wi-Fi&Bluetooth Module Series Figure 24: Plastic Reel Dimension Drawing Table 14: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 24.5 7.3.3.Mounting Direction Figure 25: Mounting Direction FCS850R-B_Hardware_Design 39 / 48 7.3.4.Packaging Process Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Wi-Fi&Bluetooth Module Series Place the module into the carrier tape and use the cover tape to cover it;

then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 26: Packaging Process FCS850R-B_Hardware_Design 40 / 48 Wi-Fi&Bluetooth Module Series 8 Appendix References Table 15: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_RF_Layout_Application_Note

[3] Quectel_Module_SMT_Application_Note Table 16: Terms and Abbreviations Abbreviation Description 2T2R AP BLE BPSK CCK DBPSK DCE DQPSK DSSS DTE ESD EVM GFSK Two Transmit Two Receive Access Point Bluetooth Low Energy Binary Phase Shift Keying Complementary Code Keying Differential Binary Phase Shift Keying Data Communication Equipment Differential Quadrature Phase Shift Keying Direct Sequence Spread Spectrum Data Terminal Equipment Electrostatic Discharge Error Vector Magnitude Gauss Frequency Shift Keying FCS850R-B_Hardware_Design 41 / 48 Wi-Fi&Bluetooth Module Series GND HCI HBM HE HT IEEE I/O Mbps MCS PCB OFDM QAM QPSK RF RoHS Rx SDIO SMT STA TVS Tx UART VIH VIL Vmax Ground Host Controller Interface Human Body Model High Efficiency High Throughput Institute of Electrical and Electronics Engineers Input/Output Million Bits Per Second Modulation and Coding Scheme Printed Circuit Board Orthogonal Frequency-Division Multiplexing Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Receive Secure Digital Input/Output Surface Mount Technology Station Transient Voltage Suppressor Transmit Universal Asynchronous Receiver/Transmitter High-level Input Voltage Low-level Input Voltage Maximum Voltage FCS850R-B_Hardware_Design 42 / 48 Wi-Fi&Bluetooth Module Series Vmin Vnom VOH VOL VSWR Wi-Fi Minimum Voltage Nominal Voltage High-level Output Voltage Low-level Output Voltage Voltage Standing Wave Ratio Wireless Fidelity Important Notice to OEM integrators is required for all other operating configurations, 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. including portable Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to XXXX that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or

(XMR2023FCS850RB) procedure followed by a Class II permissive change application. the host manufacturer can take responsibility through the change in FCC ID End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2023FCS850RB Contains IC: 10224A-23FCS850RB The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. FCS850R-B_Hardware_Design 43 / 48 Wi-Fi&Bluetooth Module Series Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation. Antenna type Dipole 2.4GHz band Peak Gain

(dBi) 0.73 5.2GHz band Peak Gain

(dBi) 1.14 5.3GHz band Peak Gain

(dBi) 1.00 5.5GHz band Peak Gain

(dBi) 0.60 5.8GHz band Peak Gain

(dBi) 0.95 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular If this equipment does cause harmful interference to radio or television reception, which can installation. the be determined by turning the equipment off and on, interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. the user is encouraged to try to correct Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in FCS850R-B_Hardware_Design 44 / 48 conjunction with any other antenna or transmitter. Wi-Fi&Bluetooth Module Series List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27, part 90, 15.247 and 15.407 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body. FCS850R-B_Hardware_Design 45 / 48 Wi-Fi&Bluetooth Module Series IC Industry Canada Statement This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."

Radiation Exposure Statement This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz) The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology. The device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

The maximum antenna gain permitted for devices in the bands 52505350 MHz and 54705725 MHz shall comply with the e.i.r.p. limit; and The maximum antenna gain permitted for devices in the band 57255825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate. interrompre automatiquement la transmission en cas d'absence d'informations L'appareil peut transmettre ou de panne oprationnelle. Notez que ceci n'est pas destin interdire la transmission d'informations de contrle ou de signalisation ou l'utilisation de codes rptitifs lorsque cela est requis par FCS850R-B_Hardware_Design 46 / 48 Wi-Fi&Bluetooth Module Series la technologie. Le dispositif utilis dans la bande 5150-5250 MHz est rserv une utilisation en intrieur afin de rduire le risque de brouillage prjudiciable aux systmes mobiles par satellite dans le mme canal;

Le gain d'antenne maximal autoris pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit tre conforme la norme e.r.p. limite; et Le gain d'antenne maximal autoris pour les appareils de la bande 5725-5825 MHz doit tre conforme la norme e.i.r.p. les limites spcifies pour un fonctionnement point point et non point point, selon le cas. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du FCS850R-B_Hardware_Design 47 / 48 Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. Wi-Fi&Bluetooth Module Series End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC:10224A-23FCS850RB. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante:

"Contient des IC: 10224A-23FCS850RB ". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. FCS850R-B_Hardware_Design 48 / 48