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FCS940R Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-04-21 Status: Preliminary Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:
http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FCS940R_Hardware_Design 1 / 47 Wi-Fi&Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties
(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. FCS940R_Hardware_Design 2 / 47 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal shall notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it shall be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FCS940R_Hardware_Design 3 / 47 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description
2023-04-21 Macky XU Creation of the document 1.0.0 2023-04-21 Macky XU Preliminary FCS940R_Hardware_Design 4 / 47 Wi-Fi&Bluetooth Module Series Contents Safety Information ........................................................................................................................................3 About the Document ....................................................................................................................................4 Contents ........................................................................................................................................................ 5 Table Index ....................................................................................................................................................7 Figure Index .................................................................................................................................................. 8 1 2 3 4 5 Introduction ........................................................................................................................................... 9 Special Mark ................................................................................................................................ 9 1.1. Product Overview ............................................................................................................................... 10 Key Features ..............................................................................................................................11 2.1. Functional Diagram ....................................................................................................................12 2.2. RF Performances ................................................................................................................................ 13 3.1. Wi-Fi Performances ................................................................................................................... 13 Bluetooth Performances ............................................................................................................ 14 3.2. 4.5. 4.4.1. Application Interfaces ........................................................................................................................ 15 Pin Assignment .......................................................................................................................... 15 4.1. Pin Description ...........................................................................................................................16 4.2. 4.3. Power Supply .............................................................................................................................19 4.4. Wi-Fi Application Interfaces .......................................................................................................20 SDIO Interface ................................................................................................................21 Bluetooth Application Interfaces ................................................................................................23 UART .............................................................................................................................. 23 PCM Interface .................................................................................................................24 4.6. RF Antenna Interface ................................................................................................................ 25 Antenna Design Requirements ...................................................................................... 25 Reference Design ...........................................................................................................25 RF Routing Guidelines ................................................................................................... 26 RF Connector Recommendation ................................................................................... 28 4.6.1. 4.6.2. 4.6.3. 4.6.4. 4.5.1. 4.5.2. Electrical Characteristics & Reliability ............................................................................................ 30 Absolute Maximum Ratings .......................................................................................................30 5.1. 5.2. Power Supply Ratings ............................................................................................................... 30 Power Consumption .................................................................................................................. 31 5.3. 5.4. Digital I/O Characteristics .......................................................................................................... 32 ESD Protection .......................................................................................................................... 33 5.5. Thermal Dissipation ................................................................................................................... 33 5.6. 6 Mechanical Information ..................................................................................................................... 35 6.1. Mechanical Dimensions .............................................................................................................35 6.2. Recommended Footprint ........................................................................................................... 37 Top and Bottom Views .............................................................................................................. 38 6.3. FCS940R_Hardware_Design 5 / 47 Wi-Fi&Bluetooth Module Series 7 Storage, Manufacturing & Packaging .............................................................................................. 39 7.1. Storage Conditions .................................................................................................................... 39 7.2. Manufacturing and Soldering .................................................................................................... 40 Packaging Specifications ...........................................................................................................42 7.3. Carrier Tape ................................................................................................................... 42 7.3.1. 7.3.2. Plastic Reel .....................................................................................................................43 7.3.3. Mounting Direction ......................................................................................................... 43 Packaging Process .........................................................................................................44 7.3.4. 8 Appendix References ......................................................................................................................... 45 FCS940R_Hardware_Design 6 / 47 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark .................................................................................................................................... 9 Table 2: Basic Information ........................................................................................................................... 10 Table 3: Key Features ................................................................................................................................. 11 Table 4: Wi-Fi Performances .......................................................................................................................13 Table 5: Bluetooth Performances ................................................................................................................14 Table 6: I/O Parameter Definition ................................................................................................................16 Table 7: Pin Description ...............................................................................................................................16 Table 8: SDIO Interface Trace Length Inside the Module (Unit: mm) ........................................................ 22 Table 9: Antenna Design Requirements ..................................................................................................... 25 Table 10: Absolute Maximum Ratings (Unit: V) .......................................................................................... 30 Table 11: Module Power Supply Ratings (Unit: V) ..................................................................................... 30 Table 12: Wi-Fi Power Consumption (Unit: mA) ......................................................................................... 31 Table 13: Bluetooth Power Consumption (Unit: mA) .................................................................................. 31 Table 14: VDD_IO Low-voltage I/O Requirements (Unit: V) ...................................................................... 32 Table 15: VDD_IO High-voltage I/O Requirements (Unit: V) ..................................................................... 32 Table 16: Recommended Thermal Profile Parameters .............................................................................. 41 Table 17: Carrier Tape Dimension Table (Unit: mm) ..................................................................................42 Table 18: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 43 Table 19: Related Documents ..................................................................................................................... 45 Table 20: Terms and Abbreviations ............................................................................................................ 45 FCS940R_Hardware_Design 7 / 47 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ...................................................................................................................... 12 Figure 2: Pin Assignment (Top View) ..........................................................................................................15 Figure 3: Reference Design for Power Supply ............................................................................................19 Figure 4: Power-up Timing .......................................................................................................................... 19 Figure 5: Wi-Fi Application Interface Connection ........................................................................................20 Figure 6: SDIO Interface Connection (1-bit Mode) ..................................................................................... 21 Figure 7: SDIO Interface Connection (4-bit Mode) ..................................................................................... 21 Figure 8: Bluetooth Application Interface Connection .................................................................................23 Figure 9: UART Connection with Host Supporting Hardware Flow Control ...............................................23 Figure 10: UART Connection with Host Not Supporting Hardware Flow Control ...................................... 24 Figure 11: PCM Interface Connection ......................................................................................................... 24 Figure 12: Reference Design of RF Antenna Interface .............................................................................. 26 Figure 13: Microstrip Design on a 2-layer PCB ...........................................................................................26 Figure 14: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 26 Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 27 Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 27 Figure 17: Dimensions of the Receptacle (Unit: mm) ................................................................................. 28 Figure 18: Specifications of Mated Plugs ....................................................................................................28 Figure 19: Space Factor of Mated Connectors (Unit: mm) .........................................................................29 Figure 20: Placement and Fixing of the Heatsink ....................................................................................... 34 Figure 21: Top and Side Dimensions .......................................................................................................... 35 Figure 22: Bottom Dimension (Bottom View) ..............................................................................................36 Figure 23: Recommended Footprint ............................................................................................................37 Figure 24: Top and Bottom Views ............................................................................................................... 38 Figure 25: Recommended Reflow Soldering Thermal Profile .................................................................... 40 Figure 26: Carrier Tape Dimension Drawing .............................................................................................. 42 Figure 27: Plastic Reel Dimension Drawing ................................................................................................43 Figure 28: Mounting Direction ..................................................................................................................... 43 Figure 29: Packaging Process .....................................................................................................................44 FCS940R_Hardware_Design 8 / 47 Wi-Fi&Bluetooth Module Series 1 Introduction This document defines the FCS940R and describes its air interfaces and hardware interfaces, which are connected with your application. With this document, you can quickly understand module interface specifications, RF performances, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. 1.1. Special Mark Table 1: Special Mark Mark Definition
Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same four SDIO pins: SDIO_DATA0, type. For example, SDIO_DATA[0:3]
SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. refers to all FCS940R_Hardware_Design 9 / 47 Wi-Fi&Bluetooth Module Series 2 Product Overview FCS940R is a low-energy, high-performance 2.4 GHz Wi-Fi and Bluetooth module supporting 1 1 IEEE 802.11b/g/n Wi-Fi and Bluetooth 4.2 standards. It provides Wi-Fi function with an SDIO 2.0 interface, and Bluetooth function with a UART and a PCM interface. It is an SMD module with compact packaging. Related information is listed in the table below:
Table 2: Basic Information FCS940R Packaging type Pin counts Dimensions Weight LCC 44
(12.0 0.15) mm (12.0 0.15) mm (2.0 0.2) mm Approx. 0.6 g FCS940R_Hardware_Design 10 / 47 Wi-Fi&Bluetooth Module Series 2.1. Key Features Table 3: Key Features Basic Information Protocol and Standard Wi-Fi protocols: IEEE 802.11b/g/n Bluetooth protocol: Bluetooth 4.2 All hardware components are fully compliant with EU RoHS directive Power Supply Temperature Ranges VBAT Power Supply:
3.03.6 V Typ.: 3.3 V VDD_IO Power Supply:
1.623.6 V Typ.: 1.8/3.3 V Operating temperature 1: 0 to +70 C Storage temperature: -40 to +85 C EVB Kit TBD RF Antenna Interface Wi-Fi/Bluetooth Antenna Interface Application Interface Wi-Fi Application Interface Bluetooth Application Interfaces ANT_WIFI/BT 50 impedance SDIO 2.0 UART, PCM 1 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules indicators comply with IEEE and Bluetooth specification requirements. FCS940R_Hardware_Design 11 / 47 2.2. Functional Diagram Wi-Fi&Bluetooth Module Series Figure 1: Functional Diagram FCS940R_Hardware_Design 12 / 47 Wi-Fi&Bluetooth Module Series 3 RF Performances 3.1. Wi-Fi Performances Table 4: Wi-Fi Performances Operating Frequency 2.4 GHz: 2.4002.4835 GHz Modulation OFDM, CCK, BPSK, QPSK, CCK, 16QAM, 64QAM Operating Mode AP STA Transmission Data Rate 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) Condition 802.11b @ 1 Mbps 802.11b @ 11 Mbps EVM 35%
802.11g @ 6 Mbps
-5 dB 2.4 GHz 802.11g @ 54 Mbps
-27 dB 802.11n, HT20 @ MCS 0
-5 dB 802.11n, HT20 @ MCS 7
-28 dB 802.11n, HT40 @ MCS 0
-5 dB Unit: dBm, Tolerance: 2 dB Transmitting Power
@ Typ. Receiving Sensitivity
@ Typ. 18 18 18 15 16 14 16
-93
-87
-91
-73
-90
-71
-87 FCS940R_Hardware_Design 13 / 47 802.11n, HT40 @ MCS 7
-28 dB 14
-68 Wi-Fi&Bluetooth Module Series 3.2. Bluetooth Performances Table 5: Bluetooth Performances Operating Frequency 2.4002.4835 GHz Modulation GFSK, /4-DQPSK, 8-DPSK Operating Mode Classic Bluetooth (BR + EDR) Bluetooth Low Energy (BLE) Condition BR EDR (/4-DQPSK) EDR (8-DPSK) BLE (1 Mbps) Unit: dBm, Tolerance: 3 dB Transmitting Power @ Typ. Receiving Sensitivity @ Typ. 5 5 5 5
-89
-90
-91
-96 FCS940R_Hardware_Design 14 / 47 Wi-Fi&Bluetooth Module Series 4 Application Interfaces 4.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE 1. Keep all RESERVED and unused pins unconnected. 2. All GND pins should be connected to ground. FCS940R_Hardware_Design 15 / 47 Wi-Fi&Bluetooth Module Series 4.2. Pin Description Table 6: I/O Parameter Definition Type AIO DI DO DIO PI Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 7: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT 9 PI VDD_IO 22 PI Main power supply for the module Vmin = 3.0 V Vnom = 3.3 V Vmax = 3.6 V It must be provided with sufficient current up to 0.6 A. Power supply for modules I/O pins Vmin = 1.62 V Vnom = 1.8/3.3 V Vmax = 3.6 V It must be provided with sufficient current up to 0.1 A. GND 1, 3, 20, 31, 33, 36 Wi-Fi Application Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_EN 12 DI WLAN function enable control 3.3 V power domain WLAN_WAKE 13 DO WLAN wakes up host VDD_IO Active high. Internally pulled up to VBAT with a 100 k resistor. Connect it to the host when using FCS940R_Hardware_Design 16 / 47 Wi-Fi&Bluetooth Module Series wake-up function;
If unused, pull it up to VDD_IO with a 100 k resistor. Supports 1-bit or 4-bit mode. SDIO_DATA2 14 SDIO_DATA3 15 SDIO_CMD SDIO_CLK SDIO_DATA0 16 17 18 SDIO_DATA1 19
NC (1-bit mode) DIO SDIO data bit 2 (4-bit mode)
NC (1-bit mode) DIO SDIO data bit 3 (4-bit mode) DIO SDIO command DI SDIO clock DIO SDIO data bit 0 DO IRQ (1-bit mode) DIO SDIO data bit 1 (4-bit mode) Bluetooth Application Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment BT_EN 34 DI Bluetooth enable control 3.3 V power domain HOST_WAKE_BT 6 DI Host wakes up Bluetooth BT_WAKE_HOST 7 DO Bluetooth wakes up host VDD_IO Active high. Internally pulled up to VBAT with a 100 k resistor. If unused, pull it down to GND with a 10 k resistor. Connect it to the host when using wake-up function;
If unused, pull it up to VDD_IO with a 100 k resistor. Connect it to the host when using wake-up function, and keep it at low level during startup. If unused, pull it FCS940R_Hardware_Design 17 / 47 Wi-Fi&Bluetooth Module Series down to GND with a 100 k resistor. Internally connected to GND. DC Characteristics Comment 50 impedance. PCM_DOUT PCM_CLK PCM_DIN PCM_SYNC BT_RTS BT_TXD BT_RXD BT_CTS 25 26 27 28 41 42 43 44 DO PCM data output DI DI DI DO DO DI DI PCM clock PCM data input PCM data frame sync Bluetooth UART request to send Bluetooth UART transmit Bluetooth UART receive Bluetooth UART clear to send RF Antenna Interface Pin Name Pin No. I/O Description ANT_WIFI/BT 2 AIO Wi-Fi/Bluetooth antenna interface Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_SLP_CLK 24 DI WLAN sleep clock VDD_IO External 32.768 kHz clock input. If unused, keep it open. RESERVED Pin Name Pin No. Comment RESERVED 4, 5, 8, 10, 11, 21, 23, 29, 30, 32, 35, 3740 Keep them open. FCS940R_Hardware_Design 18 / 47 Wi-Fi&Bluetooth Module Series 4.3. Power Supply The module is powered by VBAT, and it is recommended to use a power supply chip that can provide at least 0.6 A output current. To ensure better power supply performance, it is recommended to parallel two 10 F decoupling capacitors, and a 100 nF filter capacitor near the modules VBAT pin. Meanwhile, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace, the wider it should be. The reference circuit for modules power supply is shown in the figure below:
Figure 3: Reference Design for Power Supply The following figure shows the recommended power-up timing of the module. Figure 4: Power-up Timing FCS940R_Hardware_Design 19 / 47 Table 6Power-on Timing Parameters (Unit: ms) Wi-Fi&Bluetooth Module Series Parameter T3V3 power on ramp T3V3 power off ramp T1V8 ramp Tnon-rdy Ten NOTE Min. Typ. Max. 0.2 0.2 0.2 1
0.5 5 0.5 2 0 2.5 10 2.5 10
BT_WAKE_HOST should keep low level during module start-up. 4.4. Wi-Fi Application Interfaces Wi-Fi application interface connection between the module and the host is illustrated in the figure below. Figure 5: Wi-Fi Application Interface Connection FCS940R_Hardware_Design 20 / 47 Wi-Fi&Bluetooth Module Series 4.4.1. SDIO Interface The module supports 1-bit or 4-bit SDIO 2.0 interface (automatically detect when SDIO is connected). SDIO interface connection between the module and the host is illustrated in the following figure. Figure 6: SDIO Interface Connection (1-bit Mode) Figure 7: SDIO Interface Connection (4-bit Mode) FCS940R_Hardware_Design 21 / 47 Wi-Fi&Bluetooth Module Series To ensure compliance of interface design with the SDIO 2.0 specification, it is recommended to adopt the following principles:
To avoid jitter of bus, pull up SDIO_CMD and SDIO_DATA_[0:3]/SDIO_CMD to VDD_IO with resistors respectively. Value range of these resistors should be 10100 k and the recommended value is 10 k. The impedance of SDIO signal trace is 50 10 %. Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. And the SDIO_CLK signal trace should be routed with ground surrounded separately. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals. The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF. The vias of SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) should be less than 4. SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be equal in length (less than 2 mm distance between the traces). The length of signal tarce inside the module is as follows:
Table 8: SDIO Interface Trace Length Inside the Module (Unit: mm) Pin No. 16 17 15 14 18 19 Pin Name SDIO_CMD SDIO_CLK SDIO_DATA3 SDIO_DATA2 SDIO_DATA0 SDIO_DATA1 Length 4.78 3.47 6.45 7.37 4.34 5.17 FCS940R_Hardware_Design 22 / 47 Wi-Fi&Bluetooth Module Series 4.5. Bluetooth Application Interfaces Bluetooth application interface connection between the module and the host is illustrated in the figure below. Figure 8: Bluetooth Application Interface Connection 4.5.1. UART The module provides an HCI UART defined in Bluetooth Core Specification Version 4.2. It supports hardware flow control and can be used for data transmission with the host with default baud rate of 115200 bps. The voltage range of the Bluetooth UART is determined by VDD_IO. It is necessary to monitor the consistency of the voltage range of the host and Bluetooth UART. If necessary, adopt a voltage-level translator. The UART connection between the module and the host supporting hardware flow control is as below:
Figure 9: UART Connection with Host Supporting Hardware Flow Control FCS940R_Hardware_Design 23 / 47 The UART connection between the module and the host not supporting hardware flow control is as below:
Wi-Fi&Bluetooth Module Series Figure 10: UART Connection with Host Not Supporting Hardware Flow Control NOTE 1. When paired with Quectel's LTE modules, you need to pay attention to the input and output of BT_CTS and BT_RTS. 2. Reserve 0 resistors between the module and host for Bluetooth signaling test. 4.5.2. PCM Interface The module provides a PCM interface for Bluetooth audio application. It supports the following features:
Supports Master and Slave mode Programmable long/short Frame Sync Supports 8-bit and 16-bit linear PCM formats PCM Master Clock Output: 64 kHz, 128 kHz, 256 kHz, or 512 kHz Supports SCO/eSCO link PCM interface connection between the module and the host is illustrated in the figure below. Figure 11: PCM Interface Connection FCS940R_Hardware_Design 24 / 47 Wi-Fi&Bluetooth Module Series 4.6. RF Antenna Interface Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. The module provides one RF antenna pin (ANT_WIFI/BT), and the RF port requires 50 impedance. 4.6.1. Antenna Design Requirements Table 9: Antenna Design Requirements Parameter Requirement 2 Frequency Ranges (GHz) 2.4002.4835 Cable Insertion Loss (dB)
< 1 VSWR Gain (dBi) Max Input Power (W) Input Impedance () 2 (Typ.) 1 (Typ.) 50 50 Polarization Type Vertical 4.6.2. Reference Design A reference circuit for the RF antenna interface is shown below. It is recommended to reserve an LC and
-type matching circuit for better RF performance, and add ESD protection components. Matching components such as C1, R1, C2, C3, L1 and the protection device D1 should be placed as close to the antenna as possible. R1 is recommended to be 0 . C1, C2, C3, L1, and D1 are not mounted by default. 2 For more details about the RF performances, see Chapter 3. FCS940R_Hardware_Design 25 / 47 Wi-Fi&Bluetooth Module Series Figure 12: Reference Design of RF Antenna Interface 4.6.3. RF Routing Guidelines the characteristic impedance of all RF traces should be controlled to 50 . The For users PCB, impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 13: Microstrip Design on a 2-layer PCB Figure 14: Coplanar Waveguide Design on a 2-layer PCB FCS940R_Hardware_Design 26 / 47 Wi-Fi&Bluetooth Module Series Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:
Use an impedance simulation tool to control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [1]. FCS940R_Hardware_Design 27 / 47 Wi-Fi&Bluetooth Module Series 4.6.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 17: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 18: Specifications of Mated Plugs FCS940R_Hardware_Design 28 / 47 The following figure describes the space factor of mated connectors. Wi-Fi&Bluetooth Module Series Figure 19: Space Factor of Mated Connectors (Unit: mm) For more details, please visit https://www.hirose.com. FCS940R_Hardware_Design 29 / 47 Wi-Fi&Bluetooth Module Series 5 Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 10: Absolute Maximum Ratings (Unit: V) Parameter VBAT VDD_IO Min. 3.0
5.2. Power Supply Ratings Table 11: Module Power Supply Ratings (Unit: V) Max. 3.6 3.6 Parameter VBAT VDD_IO Min. 3.0 1.62 Typ. 3.3 1.8/3.3 Max. 3.6 3.6 FCS940R_Hardware_Design 30 / 47 Wi-Fi&Bluetooth Module Series 5.3. Power Consumption Table 12: Wi-Fi Power Consumption (Unit: mA) Condition 802.11b 802.11g 802.11n 2.4 GHz Tx @ 1 Mbps Tx @ 11 Mbps Rx @ 1 Mbps Rx @ 11 Mbps Tx @ 6 Mbps Tx @ 54 Mbps Rx @ 6 Mbps Rx @ 54 Mbps Tx HT20 @ MCS 0 Tx HT20 @ MCS 7 Rx HT20 @ MCS 0 Rx HT20 @ MCS 7 Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 Rx HT40 @ MCS 0 Rx HT40 @ MCS 7 IVBAT 359.3 339.1 TBD TBD 364.6 252.2 TBD TBD 323.2 242.2 TBD TBD 303.9 211.7 TBD TBD IVDD_IO 23.1 23.4 TBD TBD 23.3 25.3 TBD TBD 23.4 25.4 TBD TBD 24.1 26.6 TBD TBD Table 13: Bluetooth Power Consumption (Unit: mA) Condition BR (DH5) EDR (2-DH5) IVBAT 119.6 119.3 IVDD_IO 26.1 25.8 FCS940R_Hardware_Design 31 / 47 Wi-Fi&Bluetooth Module Series EDR (3-DH5) BLE (1 Mbps) 118.9 116.1 26.2 26.5 5.4. Digital I/O Characteristics Table 14: VDD_IO Low-voltage I/O Requirements (Unit: V) Parameter Description VIH VIL VOH VOL High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage Min. 1.3
1.62 0 Table 15: VDD_IO High-voltage I/O Requirements (Unit: V) Parameter Description VIH VIL VOH VOL High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage Min. 2
2.97 0 Max. 2.0 0.8 1.8 0.18 Max. 3.6 0.9 3.3 0.33 FCS940R_Hardware_Design 32 / 47 Wi-Fi&Bluetooth Module Series 5.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. 5.6. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:
Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:
Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation. Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
Choose the heatsink with adequate fins to dissipate heat;
Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. FCS940R_Hardware_Design 33 / 47 Wi-Fi&Bluetooth Module Series Figure 20: Placement and Fixing of the Heatsink FCS940R_Hardware_Design 34 / 47 Wi-Fi&Bluetooth Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 21: Top and Side Dimensions FCS940R_Hardware_Design 35 / 47 Wi-Fi&Bluetooth Module Series Figure 22: Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. FCS940R_Hardware_Design 36 / 47 6.2. Recommended Footprint Wi-Fi&Bluetooth Module Series Figure 23: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCS940R_Hardware_Design 37 / 47 6.3. Top and Bottom Views Wi-Fi&Bluetooth Module Series Figure 24: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCS940R_Hardware_Design 38 / 47 Wi-Fi&Bluetooth Module Series 7 Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition;
Violation of the third requirement mentioned above;
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
Before module repairing. 5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 5 C;
The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. FCS940R_Hardware_Design 39 / 47 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [2]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute is maximum reflow temperature. To avoid damage to the module caused by repeated heating, recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. it Figure 25: Recommended Reflow Soldering Thermal Profile FCS940R_Hardware_Design 40 / 47 Wi-Fi&Bluetooth Module Series Table 16: Recommended Thermal Profile Parameters Factor Soak Zone Recommendation Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max. temperature Cool-down slope Reflow Cycle Max. reflow cycle NOTE 03 C/s 4070 s 235246 C
-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2]. FCS940R_Hardware_Design 41 / 47 Wi-Fi&Bluetooth Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:
7.3.1. Carrier Tape Dimension details are as follow:
Figure 26: Carrier Tape Dimension Drawing Table 17: Carrier Tape Dimension Table (Unit: mm) W 24 P 16 T A0 B0 0.35 12.4 12.4 K0 2.6 K1 3.6 F E 11.5 1.75 FCS940R_Hardware_Design 42 / 47 7.3.2. Plastic Reel Wi-Fi&Bluetooth Module Series Figure 27: Plastic Reel Dimension Drawing Table 18: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 24.5 7.3.3. Mounting Direction Figure 28: Mounting Direction FCS940R_Hardware_Design 43 / 47 7.3.4. Packaging Process Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Wi-Fi&Bluetooth Module Series Place the module into the carrier tape and use the cover tape to cover it;
then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 29: Packaging Process FCS940R_Hardware_Design 44 / 47 Wi-Fi&Bluetooth Module Series 8 Appendix References Table 19: Related Documents Document Name
[1] Quectel_RF_Layout_Application_Note
[2] Quectel_Module_SMT_Application_Note Table 20: Terms and Abbreviations Abbreviation Description AP BLE BPSK BR CCK CS CTS DBPSK DPSK DQPSK EDR eSCO ESD EVB Access Point Bluetooth Low Energy Binary Phase Shift Keying Basic Rate Complementary Code Keying Chip Select Clear To Send Differential Binary Phase Shift Keying Differential Phase Shift Keying Differential Quadrature Phase Shift Keying Enhanced Date Rate Extended Synchronous Connection-Oriented Electrostaic Discharge Evaluation Board FCS940R_Hardware_Design 45 / 47 Wi-Fi&Bluetooth Module Series GFSK GND GPIO HCI HT IEEE I/O IRQ LCC LTE Mbps MCS MSL OFDM PCB PCM QAM QPSK RoHS RTS RF Rx SCO SDIO SMD Gaussian Frequency Shift Keying Ground General-Purpose Input/Output Host Controller Interface High Throughput Institute of Electrical and Electronics Engineers Input/Output Interrupt Request Leadless Chip Carrier (package) Long-Term Evolution Million Bits Per Second Modulation and Coding Scheme Moisture Sensitivity Levels Orthogonal Frequency-Division Multiplexing Printed Circuit Board Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Restriction of Hazardous Substances Request to Send Radio Frequency Receive Synchronous Connection-Oriented Secure Digital Input/Output Surface Mount Device FCS940R_Hardware_Design 46 / 47 Wi-Fi&Bluetooth Module Series SMT STA TBD Tx TVS UART UMTS VIH VIL Vmax Vmin Vnom VOH VOL VSWR WLAN Surface Mount Technology Station To Be Determined Transmit Transient Voltage Suppressor Universal Asynchronous Receiver/Transmitter Universal Mobile Telecommunications System High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Nominal Voltage High-level Output Voltage Low-level Output Voltage Voltage Standing Wave Ratio Wireless Local Area Network FCS940R_Hardware_Design 47 / 47 Wi-Fi&Bluetooth Module Series FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-
averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023FCS940R. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:
Wi-Fi 2.4GHz:0.73 dBi Bluetooth:0.73 dBi Bluetooth (Low Energy) :0.73 dBi NB LTE Band66:4.30dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 FCS940R_Hardware_Design 48 / 47 Wi-Fi&Bluetooth Module Series If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR2023FCS940R or Contains FCC ID: XMR2023FCS940R must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
FCS940R_Hardware_Design 49 / 47 Wi-Fi&Bluetooth Module Series
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. IC Statement IRSS-GEN
"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."
Dclaration sur l'exposition aux rayonnements RF The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:
Wi-Fi 2.4GHz:0.73 dBi Bluetooth:0.73 dBi Bluetooth (Low Energy) :0.73 dBi FCS940R_Hardware_Design 50 / 47 Wi-Fi&Bluetooth Module Series The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:
Contains IC: 10224A-2023FCS940R or where: 10224A-2023FCS940R is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:"Contient IC: 10224A-2023FCS940R " ou "o: 10224A-2023FCS940R est le numro de certification du module. FCS940R_Hardware_Design 51 / 47 Wi-Fi&Bluetooth Module Series FCS940R_Hardware_Design 52 / 47
1 | TestSetupPhotos | Test Setup Photos | 478.59 KiB | May 18 2023 / November 15 2023 | delayed release |
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2023-05-19 | 2412 ~ 2462 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2023-05-19
|
||||
1 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
1 | FCC Registration Number (FRN) |
0018988279
|
||||
1 | Physical Address |
Building 5, Shanghai Business Park PhaseIII
|
||||
1 |
Shanghai, N/A 200233
|
|||||
1 |
China
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
b******@phoenix-testlab.de
|
||||
1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
XMR
|
||||
1 | Equipment Product Code |
2023FCS940R
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
J******** H******
|
||||
1 | Telephone Number |
+8602******** Extension:
|
||||
1 | Fax Number |
+8621********
|
||||
1 |
j******@quectel.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 11/15/2023 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DTS - Digital Transmission System | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Wi-Fi & Bluetooth Module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Output power is maximum average conducted.<br> This device has integrated DSS and DTS transmitters certified under the same FCC ID.<br> This device supports IEEE 802.11 b/g/n 20 and 40 MHz channel bandwidths. Modular Approval for mobile RF Exposure conditions, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Approval is limited to OEM installation only. OEM integrators must be provided with antenna installation instructions. OEM integrators and end-users must be provided with transmitter operating conditions for satisfying RF exposure compliance. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. Only the antenna(s) listed in this filing can be used with this device. Use of additional antenna(s) are subject to the requirements of 15.204(c)(4). | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
TA Technology (Shanghai) Co., Ltd.
|
||||
1 | Name |
M****** L******
|
||||
1 | Telephone Number |
86-21********
|
||||
1 |
l******@ta-shanghai.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | CC | 2402 | 2480 | 0.004 | |||||||||||||||||||||||||||||||||||
1 | 2 | 15C | CC | 2412 | 2462 | 0.077 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC