FCC ID: XMR2023FCS945R Wi-Fi & Bluetooth Module

FCS945R Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-04-14 Status: Preliminary Wi-Fi&Bluetooth Module At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. FCS945R_Hardware_Design 2 / 50 Wi-Fi&Bluetooth Module Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FCS945R_Hardware_Design 3 / 50 Wi-Fi&Bluetooth Module About the Document Revision History Version Date Author Description

2023-04-14 Wain ZHAO Creation of the document 1.0.0 2023-04-14 Wain ZHAO Preliminary FCS945R_Hardware_Design 4 / 50 Wi-Fi&Bluetooth Module Contents Safety Information ........................................................................................................................................3 About the Document ....................................................................................................................................4 Contents ........................................................................................................................................................ 5 Table Index ....................................................................................................................................................7 Figure Index .................................................................................................................................................. 8 1 Introduction ........................................................................................................................................... 9 Special Marks .............................................................................................................................. 9 1.1. 2 Product Overview ............................................................................................................................... 10 Key Features ..............................................................................................................................11 2.1. Functional Diagram ....................................................................................................................12 2.2. 3 RF Performances ................................................................................................................................ 13 3.1. Wi-Fi Performances ................................................................................................................... 13 Bluetooth Performances ............................................................................................................ 15 3.2. 4.5. 4.4.1. 4 Application Interfaces ........................................................................................................................ 16 Pin Assignment .......................................................................................................................... 16 4.1. Pin Description ...........................................................................................................................17 4.2. Power Supply .............................................................................................................................19 4.3. 4.4. Wi-Fi Application Interface ........................................................................................................ 21 SDIO Interface ................................................................................................................21 Bluetooth Application Interfaces ................................................................................................22 PCM Interface .................................................................................................................23 UART .............................................................................................................................. 24 4.6. RF Antenna Interface ................................................................................................................ 25 Antenna Design Requirements ...................................................................................... 25 Reference Design ...........................................................................................................25 RF Routing Guidelines ................................................................................................... 26 RF Connector Recommendation ................................................................................... 28 4.6.1. 4.6.2. 4.6.3. 4.6.4. 4.5.1. 4.5.2. 5 Electrical Characteristics & Reliability ............................................................................................ 30 Absolute Maximum Ratings .......................................................................................................30 5.1. Power Supply Ratings ............................................................................................................... 30 5.2. Power Consumption .................................................................................................................. 31 5.3. 5.4. ESD Protection .......................................................................................................................... 32 5.5. Digital I/O Characteristics .......................................................................................................... 33 Thermal Dissipation ................................................................................................................... 34 5.6. 6 Mechanical Information ..................................................................................................................... 35 6.1. Mechanical Dimensions .............................................................................................................35 6.2. Recommended Footprint ........................................................................................................... 37 Top and Bottom Views .............................................................................................................. 38 6.3. 7 Storage, Manufacturing & Packaging .............................................................................................. 39 Storage Conditions .................................................................................................................... 39 7.1. 7.2. Manufacturing and Soldering .................................................................................................... 40 Packaging Specifications ...........................................................................................................42 7.3. FCS945R_Hardware_Design 5 / 50 Wi-Fi&Bluetooth Module Carrier Tape ................................................................................................................... 42 7.3.1. 7.3.2. Plastic Reel .....................................................................................................................43 7.3.3. Mounting Direction ......................................................................................................... 43 Packaging Process .........................................................................................................44 7.3.4. 8 Appendix References ......................................................................................................................... 45 FCS945R_Hardware_Design 6 / 50 Wi-Fi&Bluetooth Module Table Index Table 1: Special Marks .................................................................................................................................. 9 Table 2: Basic Information ........................................................................................................................... 10 Table 3: Key Features ................................................................................................................................. 11 Table 4: Wi-Fi Performances .......................................................................................................................13 Table 5: Bluetooth Performances ................................................................................................................15 Table 6: I/O Parameters Definition .............................................................................................................. 17 Table 7: Pin Description ...............................................................................................................................17 Table 8:Power-on Timing Parameters .........................................................................................................20 Table 9: Antenna Design Requirements ..................................................................................................... 25 Table 10: Absolute Maximum Ratings (Unit: V) .......................................................................................... 30 Table 11: Module Power Supply Ratings (Unit: V) ..................................................................................... 30 Table 12: Wi-Fi Power Consumption ...........................................................................................................31 Table 13: Bluetooth Power Consumption in Non-signalling Modes ........................................................... 32 Table 14: Electrostatics Discharge Characteristics (Unit: kV) .................................................................... 32 Table 15: VDD_IO Low-level I/O Requirements (Unit: V) ...........................................................................33 Table 16: VDD_IO High-level I/O Requirements (Unit: V) ..........................................................................33 Table 17: Recommended Thermal Profile Parameters .............................................................................. 41 Table 18: Carrier Tape Dimension Table (Unit: mm) ..................................................................................42 Table 19: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 43 Table 20: Related Documents ..................................................................................................................... 45 Table 21: Terms and Abbreviations ............................................................................................................ 45 FCS945R_Hardware_Design 7 / 50 Wi-Fi&Bluetooth Module Figure Index Figure 1: FCS945R Functional Diagram ..................................................................................................... 12 Figure 2: Pin Assignment (Top View) ..........................................................................................................16 Figure 3: Reference Circuit of Power Supply ..............................................................................................19 Figure 4: Power-up Timing .......................................................................................................................... 20 Figure 5: Wi-Fi Application Interface Connection ........................................................................................21 Figure 6: SDIO Interface Connection .......................................................................................................... 21 Figure 7: Bluetooth Application Interface Connection .................................................................................22 Figure 8: PCM Interface (Long Frame Sync) .............................................................................................. 23 Figure 9: PCM Interface (Short Frame Sync) ............................................................................................. 23 Figure 10: UART Connection with Host Supporting Hardware Flow Control .............................................24 Figure 11: UART Connection with Host Not Supporting Hardware Flow Control ...................................... 24 Figure 12: Reference Circuit for RF Antenna Interface .............................................................................. 26 Figure 13: Microstrip Design on a 2-layer PCB ...........................................................................................26 Figure 14: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 26 Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 27 Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 27 Figure 17: Dimensions of the Receptacle (Unit: mm) ................................................................................. 28 Figure 18: Specifications of Mated Plugs ....................................................................................................28 Figure 19: Space Factor of Mated Connectors (Unit: mm) .........................................................................29 Figure 20: Placement and Fixing of the Heatsink ....................................................................................... 34 Figure 21: Top and Side Dimensions .......................................................................................................... 35 Figure 22: Bottom Dimensions (Bottom View) ............................................................................................ 36 Figure 23: Recommended Footprint ............................................................................................................37 Figure 24: FCS945R Top and Bottom Views ..............................................................................................38 Figure 25: Recommended Reflow Soldering Thermal Profile .................................................................... 40 Figure 26: Carrier Tape Dimension Drawing .............................................................................................. 42 Figure 27: Plastic Reel Dimension Drawing ................................................................................................43 Figure 28: Mounting Direction ..................................................................................................................... 43 Figure 29: Packaging Process .....................................................................................................................44 FCS945R_Hardware_Design 8 / 50 Wi-Fi&Bluetooth Module 1 Introduction This document defines the FCS945R and describes its air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. 1.1. Special Marks Table 1: Special Marks Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same four SDIO pins: SDIO_DATA0, type. For example, SDIO_DATA[0:3]

SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. refers to all FCS945R_Hardware_Design 9 / 50 Wi-Fi&Bluetooth Module 2 Product Overview FCS945R is a small and high performance IEEE 802.11a/b/g/n Wi-Fi and Bluetooth 5.2 module which supports 1T1R. It provides a SDIO 2.0 interface for Wi-Fi functions and a UART and a PCM interface for Bluetooth functions. Wi-Fi 1T1R has a theoretical throughput of up to 150 Mbps. It is an SMD module with compact packaging. Related information is listed in the table below:

Table 2: Basic Information FCS945R Packaging type Pin counts Dimensions Weight Variants LCC 44

(12.0 0.15) mm (12.0 0.15) mm (2.15 0.2) mm 0.62g FCS945R FCS945R_Hardware_Design 10 / 50 Wi-Fi&Bluetooth Module 2.1. Key Features Table 3: Key Features Basic Information Protocol and Standard Wi-Fi protocols: IEEE 802.11 a/b/g/n Bluetooth protocol: Bluetooth 5.2 All hardware components are fully compliant with EU RoHS directive Power Supply Temperature Ranges VBAT Power Supply:

3.03.6 V Typ.: 3.3 V VDD_IO Power Supply:

1.623.6 V Typ.: 1.8/3.3 V Operating temperature 1 : 0 C to +70 C Storage temperature: -40 C to +85 C EVB Kit FCS945R-M.2 RF Antenna Interface Wi-Fi/Bluetooth antenna interface ANT_WIFI/BT 50 characteristic impedance Application Interface Wi-Fi Application Interface Bluetooth Application Interfaces SDIO 2.0 UART PCM 1 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules indicators comply with IEEE and Bluetooth specification requirements. FCS945R_Hardware_Design 11 / 50 Wi-Fi&Bluetooth Module 2.2. Functional Diagram Figure 1: FCS945R Functional Diagram FCS945R_Hardware_Design 12 / 50 Wi-Fi&Bluetooth Module 3 RF Performances 3.1. Wi-Fi Performances Table 4: Wi-Fi Performances Operating Frequency 2.4 GHz: 2.4002.4835 GHz 5 GHz: 5.1505.850 GHz Modulation CCK, BPSK, QPSK, DQPSK, 16QAM, 64QAM Operating Mode AP STA Transmission Data Rate 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) Condition 802.11b @ 1 Mbps 802.11b @ 11 Mbps EVM 35%

802.11g @ 6 Mbps

-5 dB 2.4 GHz 802.11g @ 54 Mbps

-25 dB 802.11n, HT20 @ MCS 0

-5 dB 802.11n, HT20 @ MCS 7

-27 dB 802.11n, HT40 @ MCS 0

-5 dB Unit: dBm, Tolerance: 2 dB Transmitting Power

@ Typ. Receiving Sensitivity

@ Typ. 18 18 18 17 17 16 17

-94

-87

-91

-73

-91

-71

-90 FCS945R_Hardware_Design 13 / 50 Wi-Fi&Bluetooth Module 802.11n, HT40 @ MCS 7

-27 dB 802.11a @ 6 Mbps

-15 dB 802.11a @ 54 Mbps

-25 dB 5 GHz 802.11n, HT20 @ MCS 0

-15 dB 802.11n, HT20 @ MCS 7

-28 dB 802.11n, HT40 @ MCS 0

-15 dB 802.11n, HT40 @ MCS 7

-28 dB 16 18 17 17 16 17 16

-70

-90

-72

-90

-71

-87

-68 FCS945R_Hardware_Design 14 / 50 Wi-Fi&Bluetooth Module 3.2. Bluetooth Performances Table 5: Bluetooth Performances Operating Frequency 2.4002.4835 GHz Modulation GFSK, /4-DQPSK, 8-DPSK Operating Mode Classic Bluetooth (BR + EDR) Bluetooth Low Energy (BLE) Condition BR EDR (/4-DQPSK) EDR (8-DPSK) BLE (1 Mbps) BLE (2 Mbps) BLE (S=2) BLE (S=8) Unit: dBm, Tolerance: 2dB Transmitting Power @ Typ. Receiving Sensitivity @ Typ. 5 5 5 5 5 5 5

-93

-87

-87

-99

-96

-102

-105 FCS945R_Hardware_Design 15 / 50 Wi-Fi&Bluetooth Module 4 Application Interfaces 4.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE 1. Keep all RESERVED and unused pins unconnected. 2. Keep all GND pins connected to the ground. FCS945R_Hardware_Design 16 / 50 4.2. Pin Description Table 6: I/O Parameters Definition Type AIO DI DO DIO PI Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 7: Pin Description Power Supply Pin Name Pin No. I/O Description Wi-Fi&Bluetooth Module DC Characteristics Vmin = 3.0 V Vnom = 3.3 V Vmax = 3.6 V Comment It must be provided with sufficient current up to 0.6 A. VBAT VDD_IO 9 22 PI PI Power supply for the module Power supply for the modules I/O pins Vmin = 1.62 V Vnom = 1.8/3.3 V Vmax = 3.6 V It must be provided with sufficient current up to 0.1 A. GND 1, 3, 20, 31, 33, 36 Wi-Fi Application Interfaces Pin Name Pin No. I/O Description WLAN_EN WLAN_WAKE SDIO_DATA2 SDIO_DATA3 12 13 14 15 DI DO WLAN enable control WLAN wakes up host DIO SDIO data bit 2 VDD_IO DIO SDIO data bit 3 DC Characteristics Comment 3.3 V Active high. FCS945R_Hardware_Design 17 / 50 SDIO_CMD SDIO_CLK SDIO_DATA0 SDIO_DATA1 16 17 18 19 DIO SDIO command DI SDIO clock DIO SDIO data bit 0 DIO SDIO data bit 1 Bluetooth Application Interfaces Pin Name Pin No. I/O Description BT_EN 34 HOST_WAKE_BT 6 DI DI BT_WAKE_HOST 7 DO Bluetooth enable control Host wakes up Bluetooth Bluetooth wakes up host PCM_DOUT PCM_CLK PCM_DIN PCM_SYNC BT_RTS BT_TXD BT_RXD BT_CTS 25 26 27 28 41 42 43 44 DO PCM data output DI DI DI DO DO DI DI PCM clock PCM data input PCM data frame sync Request to send signal from the module Bluetooth UART transmit Bluetooth UART receive Clear to send signal to the module Wi-Fi&Bluetooth Module DC Characteristics Comment 3.3 V Active high. VDD_IO If unused, keep them open. Internally connected to GND. VDD_IO If unused, keep them open. RF Antenna Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment ANT_WIFI0/BT 2 AIO Wi-Fi/Bluetooth antenna interface 50 characteristic impedance. Other Interface Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_SLP_CLK 24 DI WLAN sleep clock VDD_IO 32.768 kHz sleep clock input. FCS945R_Hardware_Design 18 / 50 Wi-Fi&Bluetooth Module If unused, keep it open. RESERVED Pins Pin Name Pin No. Comment RESERVED 4, 5, 8, 10, 11, 21, 23, 29, 30, 32, 35, 3740 Keep them open. 4.3. Power Supply The module is powered by VBAT. It is recommended to use a 3.3 V power supply chip with sufficient up to 0.6 A. For better power supply performance, it is recommended to parallel a 100 F decoupling capacitor, and 1 F and 100 nF filter capacitors near the modules VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be. VBAT reference circuit is shown below:

Figure 3: Reference Circuit of Power Supply FCS945R_Hardware_Design 19 / 50 The power-up timing of the module is shown below. Wi-Fi&Bluetooth Module Figure 4: Power-up Timing NOTE Keep PCM_DIN at low level during the module power-up. Table 8:Power-on Timing Parameters Parameter T3V3 ramp T1V8 ramp Tnon-rdy Min. Typ. Max. Unit 0.2 0.2 1 0.5 0.5 2 2.5 2.5 10 ms FCS945R_Hardware_Design 20 / 50 Wi-Fi&Bluetooth Module 4.4. Wi-Fi Application Interface Wi-Fi application interface connection between the module and the host is illustrated in the figure below. Figure 5: Wi-Fi Application Interface Connection 4.4.1. SDIO Interface SDIO interface connection between the module and the host is illustrated in the following figure. Figure 6: SDIO Interface Connection FCS945R_Hardware_Design 21 / 50 Wi-Fi&Bluetooth Module To ensure compliance of interface design with the SDIO 2.0 specification, it is recommended to adopt the following principles:

To avoid jitter of bus, pull up SDIO_CMD and SDIO_DATA_[0:3]/SDIO_CMD to VDD_IO with resistors respectively. Value range of these resistors should be 10100 k and the recommended value is 10 k. The impedance of SDIO signal trace is 50 10 %. Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals. SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be equal in length (the distance between the traces should be less than 1 mm). The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF. 4.5. Bluetooth Application Interfaces Bluetooth application interface connection between the module and the host is illustrated in the figure below. Figure 7: Bluetooth Application Interface Connection FCS945R_Hardware_Design 22 / 50 4.5.1. PCM Interface The module provides a PCM interface for Bluetooth audio application. It supports the following features:

Wi-Fi&Bluetooth Module Supports Master and Slave mode Programmable long/short Frame Sync Supports 8-bit/16-bit linear PCM formats PCM Master Clock Output: 64 kHz, 128 kHz, 256 kHz, or 512 kHz Supports SCO/eSCO link PCM interface timing is shown below:

Figure 8: PCM Interface (Long Frame Sync) Figure 9: PCM Interface (Short Frame Sync) NOTE Keep PCM_DIN at low level during the module power-up. FCS945R_Hardware_Design 23 / 50 Wi-Fi&Bluetooth Module 4.5.2. UART The Module supports Bluetooth HCI (Host Controller Interface) UART defined in Bluetooth Core Specification Version 5.2. It supports hardware flow control, and can be used for data transmission with the host. Pin definitions of the UART interface is shown in the following table The voltage range of the Bluetooth UART is determined by VDD_IO. It is necessary to monitor the consistency of the voltage range of the host and Bluetooth UART. If necessary, adopt a voltage-level translator. The UART connection between the module and the host supporting hardware flow control is as below:

Figure 10: UART Connection with Host Supporting Hardware Flow Control The UART connection between the module and the host not supporting hardware flow control is as below:

Figure 11: UART Connection with Host Not Supporting Hardware Flow Control FCS945R_Hardware_Design 24 / 50 Wi-Fi&Bluetooth Module 4.6. RF Antenna Interface Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. For single-antenna module, ANT_ BT is unconnected. 4.6.1. Antenna Design Requirements Table 9: Antenna Design Requirements Parameter Frequency Ranges (GHz) Requirement 2 2.4002.4835 5.1505.850 Cable Insertion Loss (dB)

< 1 VSWR Gain (dBi) Max Input Power (W) Input Impedance () 2 (Typ.) 1 (Typ.) 50 50 Polarization Type Vertical 4.6.2. Reference Design A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a -type matching circuit and add ESD protection components for better RF performance. Reserved matching components (R1, C1, C2, and D1) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 . The following reference design is based on ANT_WIFI0/BT as an example, the reference design of other RF antenna interfaces is the same. 2 For more details about the RF performances, see Chapter 3. FCS945R_Hardware_Design 25 / 50 Wi-Fi&Bluetooth Module Figure 12: Reference Circuit for RF Antenna Interface 4.6.3. RF Routing Guidelines the characteristic impedance of all RF traces should be controlled to 50 . The For users PCB, impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 13: Microstrip Design on a 2-layer PCB Figure 14: Coplanar Waveguide Design on a 2-layer PCB FCS945R_Hardware_Design 26 / 50 Wi-Fi&Bluetooth Module Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [1]. FCS945R_Hardware_Design 27 / 50 Wi-Fi&Bluetooth Module 4.6.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 17: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 18: Specifications of Mated Plugs FCS945R_Hardware_Design 28 / 50 The following figure describes the space factor of mated connectors. Wi-Fi&Bluetooth Module Figure 19: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FCS945R_Hardware_Design 29 / 50 Wi-Fi&Bluetooth Module 5 Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 10: Absolute Maximum Ratings (Unit: V) Parameter VBAT VDD_IO Min.

-0.3

-0.3 Max. 6 3.63 5.2. Power Supply Ratings Table 11: Module Power Supply Ratings (Unit: V) Parameter Description Condition Min. Typ. Max. VBAT Power supply for the module The actual input voltages must be kept between the minimum and maximum values. VDD_IO Power supply for the modules I/O pins

3.0 3.3 3.6 1.62 1.8/3.3 3.6 FCS945R_Hardware_Design 30 / 50 Wi-Fi&Bluetooth Module 5.3. Power Consumption Table 12: Wi-Fi Power Consumption Condition IVDD_IO 802.11b 802.11g 802.11n 2.4 GHz Tx @ 1 Mbps Tx @ 11 Mbps Rx @ 1 Mbps Rx @ 11 Mbps Tx @ 6 Mbps Tx @ 54 Mbps Rx @ 6 Mbps Rx @ 54 Mbps Tx HT20 @ MCS 0 Tx HT20 @ MCS 7 Rx HT20 @ MCS 0 Rx HT20 @ MCS 7 Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 Rx HT40 @ MCS 0 Rx HT40 @ MCS 7 Tx @ 6 Mbps Tx @ 54 Mbps 802.11a 5 GHz Rx @ 6 Mbps Rx @ 54 Mbps 802.11n Tx HT20 @ MCS 0 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD IVBAT TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA FCS945R_Hardware_Design 31 / 50 Tx HT20 @ MCS 7 Rx HT20 @ MCS 0 Rx HT20 @ MCS 7 Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 Rx HT40 @ MCS 0 Rx HT40 @ MCS 7 TBD TBD TBD TBD TBD TBD TBD Table 13: Bluetooth Power Consumption in Non-signalling Modes Transmitting Power IVDD_IO Mode BR TBD EDR (/4-DQPSK) TBD EDR (8-DPSK) BLE (1 Mbps) BLE (2 Mbps) TBD TBD TBD 5.4. ESD Protection TBD TBD TBD TBD TBD Wi-Fi&Bluetooth Module mA mA mA mA mA mA mA TBD TBD TBD TBD TBD TBD TBD IVBAT TBD TBD TBD TBD TBD Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 14: Electrostatics Discharge Characteristics (Unit: kV) Model Test Result Standard Human Body Model (HBM) TBD ESDA/JEDEC JS-001-2017 Charged Device Model (CDM) TBD ESDA/JEDEC JS-002-2018 FCS945R_Hardware_Design 32 / 50 Wi-Fi&Bluetooth Module 5.5. Digital I/O Characteristics Table 15: VDD_IO Low-level I/O Requirements (Unit: V) Parameter Description VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Min. 2.0

2.97 0 Table 16: VDD_IO High-level I/O Requirements (Unit: V) Parameter Description VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Min. 1.3

1.62 0 Max. 3.6 0.5 3.6 0.33 Max. 2.0 0.3 1.98 0.18 FCS945R_Hardware_Design 33 / 50 Wi-Fi&Bluetooth Module 5.6. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:

Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation. Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

Choose the heatsink with adequate fins to dissipate heat;

Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 20: Placement and Fixing of the Heatsink FCS945R_Hardware_Design 34 / 50 Wi-Fi&Bluetooth Module 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 21: Top and Side Dimensions FCS945R_Hardware_Design 35 / 50 Wi-Fi&Bluetooth Module Figure 22: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FCS945R_Hardware_Design 36 / 50 6.2. Recommended Footprint Wi-Fi&Bluetooth Module Figure 23: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCS945R_Hardware_Design 37 / 50 Wi-Fi&Bluetooth Module 6.3. Top and Bottom Views Figure 24: FCS945R Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCS945R_Hardware_Design 38 / 50 Wi-Fi&Bluetooth Module 7 Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. FCS945R_Hardware_Design 39 / 50 Wi-Fi&Bluetooth Module NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [2]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute is maximum reflow temperature. To avoid damage to the module caused by repeated heating, recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. it Figure 25: Recommended Reflow Soldering Thermal Profile FCS945R_Hardware_Design 40 / 50 Wi-Fi&Bluetooth Module Table 17: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2]. FCS945R_Hardware_Design 41 / 50 Wi-Fi&Bluetooth Module 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape Dimension details are as follow:

Figure 26: Carrier Tape Dimension Drawing Table 18: Carrier Tape Dimension Table (Unit: mm) W 24 P 16 T 0.3 A0 B0 12.4 12.4 K0 2.6 K1 4.0 F E 11.5 1.75 FCS945R_Hardware_Design 42 / 50 7.3.2. Plastic Reel Wi-Fi&Bluetooth Module Figure 27: Plastic Reel Dimension Drawing Table 19: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 32.5 7.3.3. Mounting Direction Figure 28: Mounting Direction FCS945R_Hardware_Design 43 / 50 7.3.4. Packaging Process Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Wi-Fi&Bluetooth Module Place the module into the carrier tape and use the cover tape to cover it;

then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 29: Packaging Process FCS945R_Hardware_Design 44 / 50 Wi-Fi&Bluetooth Module 8 Appendix References Table 20: Related Documents Document Name

[1] Quectel_RF_Layout_Application_Note

[2] Quectel_Module_SMT_Application_Note Table 21: Terms and Abbreviations Abbreviation Description AP BLE BPSK BR CCK CTS CDM DBPSK DPSK DQPSK EDR eSCO ESD EVB Access Point Bluetooth Low Energy Binary Phase Shift Keying Basic Rate Complementary Code Keying Clear To Send Charged Device Model Differential Binary Phase Shift Keying Differential Phase Shift Keying Differential Quadrature Phase Shift Keying Enhanced Data Rate Extended Synchronous Connection-Oriented Electrostatic Discharge Evaluation Board FCS945R_Hardware_Design 45 / 50 Wi-Fi&Bluetooth Module EVM GFSK GND HBM HCI HT IEEE I/O LCC Mbps MCS MSL PCB PCM QAM QPSK RF RoHS RTS Rx RXD SCO SDIO SMT STA Error Vector Magnitude Gauss frequency Shift Keying Ground Human Body Model Host Controller Interface High Throughput Institute of Electrical and Electronics Engineers Input/Output Leadless Chip Carrier (package) Million Bits Per Second Modulation and Coding Scheme Moisture Sensitivity Level Printed Circuit Board Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Request to Send Receive Receive Data Synchronous Connection-Oriented Secure Digital Input/Output Surface Mount Technology Station FCS945R_Hardware_Design 46 / 50 Wi-Fi&Bluetooth Module TBD TVS Tx TXD UART VHT VIH VIL Vmax Vmin Vnom VOH VOL VSWR Wi-Fi To Be Determined Transient Voltage Suppressor Transmit Transmit Data Universal Asynchronous Receiver/Transmitter Very High Throughput High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Nominal Voltage High-level Output Voltage Low-level Output Voltage Voltage Standing Wave Ratio Wireless Fidelity FCS945R_Hardware_Design 47 / 50 Wi-Fi&Bluetooth Module FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023FCS945R. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth/Bluetooth LE/Wi-Fi 2.4G:0.52dBi Wi-Fi 5G:0.66 dBi including portable configurations with respect is required for all other operating to 2.1093 and different antenna 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval configurations, configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR2023FCS945R. or Contains FCC ID: XMR2023FCS945R. must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other FCS945R_Hardware_Design 48 / 50 Wi-Fi&Bluetooth Module than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. IC Certification Requirements. This device contains licence-exempt transmitteris)/receivers) that comply with Innovation, Science and EconomicDevelopment Canada's licence-exempt RSS(s). Operation is subject to the following two conditions:

1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth/Bluetooth LE/Wi-Fi 2.4G:0.52dBi Wi-Fi 5G:0.66 dBi L'appareil contient un metteur / rcepteur exempt de licence conforme au CNR exempt de licence d'innovation, sciences et dveloppement conomique Canada. Les oprations sont soumises aux deux conditions suivantes:

1. Cet appareil peut ne pas causer d'interfrence. L'appareil doit accepter toute interfrence, y compris celles qui peuvent entraner un fonctionnement indsirable de l'appareil. This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. To comply with RSS-102 RF Exposure compliance requirements, this grant is applicable to only Mobile Configurations. The antennas used for the transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. The user manual for LE-LAN devices shall contain instructions related to the restrictions mentioned in the abovesections, namely that:

i. the device for operation in the band 5150-5250 MHz is only for indoor use to reduce the potential for harmfulinterference to co-channel mobile satellite systems;

ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit. FCS945R_Hardware_Design 49 / 50 Wi-Fi&Bluetooth Module iii. for devices with detachable antennals), the maximum antenna gain permitted for devices in the band5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;

iv. where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliantwith the e.iro. elevation mask reauirement set forth in section 6.2.2.3 shall be clearly indicated. The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-2023FCS945R or where: 10224A-2023FCS945R is the modules certification number. FCS945R_Hardware_Design 50 / 50

IC:-1OSSW-SOS3EC2aT26 =

ECC ID:XINBSOS3EC20t2 6 2: WbVA304 ASOXXXXX ECeatebvVvAND ECeaves oX-00K CO @mnexsce hwy TT il il iy)

(Quectel Wireless Solutions Co., Ltd) To: Federal Communications Commission Date: 2023/08/08 7435 Oakland Mills Road Columbia, MD 21046 USA Attestation Section 2.911(d)(5)(i) and Section 2.911(d)(5)(ii)

(KDB 986446 D01 Covered Equipment) Section 2.911(d)(5)(i)

[Quectel Wireless Solutions Co., Ltd] (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Section 2.911(d)(5)(ii)

[Quectel Wireless Solutions Co., Ltd] (the applicant) certifies that, as of the date of the filing of the application, the applicant [is not] identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing covered equipment. Type of Equipment subject to FCC Certification:

FCC ID:XMR2023FCS945R If you have any questions, please feel free to contact me Jean Hu Contact Person:

Position in the Company: Quectel Wireless Solutions Co., Ltd Date of Signature:

2023/08/08 ___________________________ Signatory

(signature of the applicant)

Quectel Wireless Solutions Co., Ltd. LETTER OF AGENCY Date:2023/8/18 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 FCC ID:XMR2023FCS945R To Whom It May Concern:

We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse ACT of 1988, U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002(b), to the application, is subject to denial of federal benefits, that includes FCC benefits. Thank you for your attention to this matter. Sincerely yours, Signature Printed Name:Jean Hu Company:Quectel Wireless Solutions Co., Ltd. Job Title:Project Manager Email:jean.hu@quectel.com Telephone: 0018988279

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

Quectel Wireless Solutions Co., Ltd. XMR2023FCS945R FCS945R The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

Modular approval requirement The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. EUT Condition The radio elements of the modular Comply YES transmitter have their own shielding.

(b) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. The modular has buffered data inputs, it is YES integrated in chip. Please see schematic.pdf All power lines derived from the host device are regulated before energizing other circuits internal to the FCS945R. Please see schematic.pdf A permanently attached antenna or unique antenna connector is not a requirement for unlicensed modules. YES YES The FCS945R was tested in a stand alone configuration via a PCMCIA extender. Please see spurious setup YES

(c)The modular transmitter must have its own powersupply regulation.

(d) The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(e)The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that Quectel Wireless Solutions Company Limited there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see Section 15.31(i))mustnotbeinsideanotherdeviceduringtesting.

(f)The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedonthei ntendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. The label position of FCS945R is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID:

XMR2023FCS945R. Please see the label.pdf The FCS945R is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. YES YES The FCS945R is approved to comply with YES the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. Dated 2023/08/08 By:

Signature Title:

Project Manager Jean Hu Printed

Quectel Wireless Solutions Company Limited Request for Confidentiality Date: _2023/08/08_ Subject: Confidentiality Request for: _____ FCC ID: XMR2023FCS945R IC Number:10224A-2023FCS945R Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100 Issue 12 / 12.4, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Permanent Permanent*1 Permanent Permanent Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term ______(Insert Explanation as Necessary)______ Permanent*

Permanent

*Note:

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement Schematics Test Setup Photos Users Manual ___Quectel Wireless Solutions Company Limited _has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ____ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Co., Ltd