FCC ID: XMR2023FCS950R Wi-Fi & Bluetooth Module

FCS950R Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-06-13 Status: Preliminary Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FCS950R_Hardware_Design 1 / 49 Wi-Fi&Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. FCS950R_Hardware_Design 2 / 49 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal shall notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it shall be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FCS950R_Hardware_Design 3 / 49 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description

2023-06-13 Jason YI Creation of the document 1.0.0 2023-06-13 Jason YI Preliminary FCS950R_Hardware_Design 4 / 49 Wi-Fi&Bluetooth Module Series Contents Safety Information ................................................................................................................................................... 3 About the Document .............................................................................................................................................. 4 Contents .................................................................................................................................................................... 5 Table Index ................................................................................................................................................................ 7 Figure Index .............................................................................................................................................................. 8 1 Introduction ...................................................................................................................................................... 9 1.1. Special Mark ........................................................................................................................................... 9 2 Product Overview .......................................................................................................................................... 10 2.1. Key Features ........................................................................................................................................ 11 2.2. Functional Diagram ............................................................................................................................. 12 3 RF Performances ........................................................................................................................................... 13 3.1. Wi-Fi Performances ............................................................................................................................. 13 3.2. Bluetooth Performances ..................................................................................................................... 15 4.4.1. 4 Application Interfaces .................................................................................................................................. 16 4.1. Pin Assignment .................................................................................................................................... 16 4.2. Pin Description ..................................................................................................................................... 17 4.3. Power Supply ....................................................................................................................................... 20 4.4. Wi-Fi Application Interfaces ................................................................................................................ 21 SDIO Interface ......................................................................................................................... 21 4.5. Bluetooth Application Interfaces ........................................................................................................ 23 4.5.1. PCM Interface .......................................................................................................................... 23 4.5.2. UART ........................................................................................................................................ 25 4.6. RF Antenna Interface .......................................................................................................................... 27 4.6.1. Reference Design ................................................................................................................... 27 Antenna Design Requirements ............................................................................................. 28 4.6.2. 4.6.3. RF Routing Guidelines ........................................................................................................... 28 4.6.4. RF Connector Recommendation ........................................................................................... 30 5 Electrical Characteristics & Reliability ..................................................................................................... 32 5.1. Absolute Maximum Ratings ................................................................................................................ 32 5.2. Power Supply Ratings ......................................................................................................................... 32 5.3. Power Consumption ............................................................................................................................ 33 5.3.1. Wi-Fi Power Consumption ..................................................................................................... 33 Bluetooth Power Consumption .............................................................................................. 34 5.3.2. 5.4. Digital I/O Characteristics ................................................................................................................... 34 5.5. ESD Protection .................................................................................................................................... 35 5.6. Thermal Dissipation ............................................................................................................................. 35 6 Mechanical Information ............................................................................................................................... 37 6.1. Mechanical Dimensions ...................................................................................................................... 37 6.2. Recommended Footprint .................................................................................................................... 39 FCS950R_Hardware_Design 5 / 49 Wi-Fi&Bluetooth Module Series 6.3. Top and Bottom Views ........................................................................................................................ 40 7 Storage, Manufacturing & Packaging ....................................................................................................... 41 7.1. Storage Conditions .............................................................................................................................. 41 7.2. Manufacturing and Soldering ............................................................................................................. 42 7.3. Packaging Specifications .................................................................................................................... 44 7.3.1. Carrier Tape ............................................................................................................................. 44 7.3.2. Plastic Reel .............................................................................................................................. 45 7.3.3. Mounting Direction ................................................................................................................... 45 Packaging Process ................................................................................................................. 46 7.3.4. 8 Appendix References ................................................................................................................................... 47 FCS950R_Hardware_Design 6 / 49 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark ............................................................................................................................................... 9 Table 2: Basic Information ...................................................................................................................................... 10 Table 3: Key Features............................................................................................................................................. 11 Table 4: Wi-Fi Performances ................................................................................................................................. 13 Table 5: Bluetooth Performances .......................................................................................................................... 15 Table 6: I/O Parameter Definition .......................................................................................................................... 17 Table 7: Pin Description ......................................................................................................................................... 17 Table 8: SDIO Interface Trace Length Inside the Module (Unit: mm) .............................................................. 23 Table 9: PCM Interface Clock Specifications ....................................................................................................... 25 Table 10: PCM Interface Timing ............................................................................................................................ 25 Table 11: Antenna Design Requirements ............................................................................................................ 28 Table 12: Absolute Maximum Ratings (Unit: V) .................................................................................................. 32 Table 13: Module Power Supply Ratings (Unit: V) ............................................................................................. 32 Table 14: Power Consumption in Low Power Modes ......................................................................................... 33 Table 15: Power Consumption in Non-signalling Mode (Unit: mA) .................................................................. 33 Table 16: Power Consumption in Non-signalling Mode ..................................................................................... 34 Table 17: VDD_IO High Level I/O Requirements (Unit: V) ................................................................................ 34 Table 18: VDD_IO Low Level I/O Requirements (Unit: V) ................................................................................. 35 Table 19: Recommended Thermal Profile Parameters ...................................................................................... 43 Table 20: Carrier Tape Dimension Table (Unit: mm) .......................................................................................... 44 Table 21: Plastic Reel Dimension Table (Unit: mm) ........................................................................................... 45 Table 22: Related Documents ............................................................................................................................... 47 Table 23: Terms and Abbreviations ...................................................................................................................... 47 FCS950R_Hardware_Design 7 / 49 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ................................................................................................................................ 12 Figure 2: Pin Assignment (Top View) ................................................................................................................... 16 Figure 3: Reference Design for Power Supply .................................................................................................... 20 Figure 4: Power-up Timing ..................................................................................................................................... 20 Figure 5: Wi-Fi Application Interface Connection ................................................................................................ 21 Figure 6: SDIO Interface Connection (1-bit Mode) ............................................................................................. 21 Figure 7: SDIO Interface Connection (4-bit Mode) ............................................................................................. 22 Figure 8: Bluetooth Application Interface Connection ........................................................................................ 23 Figure 9: PCM interface Timing (Long Frame Sync) .......................................................................................... 24 Figure 10: PCM interface Timing (Short Frame Sync) ....................................................................................... 24 Figure 11: UART Connection with Host Supporting Software Flow Control ................................................... 26 Figure 12: UART Connection with Host Supporting Hardware Flow Control .................................................. 26 Figure 13: UART Connection with Host Not Supporting Flow Control ............................................................. 26 Figure 14: Reference Design of RF Antenna Interface ....................................................................................... 27 Figure 15: Microstrip Design on a 2-layer PCB ................................................................................................... 28 Figure 16: Coplanar Waveguide Design on a 2-layer PCB ............................................................................... 29 Figure 17: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ....................... 29 Figure 18: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ....................... 29 Figure 19: Dimensions of the Receptacle (Unit: mm) ......................................................................................... 30 Figure 20: Specifications of Mated Plugs ............................................................................................................. 31 Figure 21: Space Factor of Mated Connectors (Unit: mm) ................................................................................ 31 Figure 22: Placement and Fixing of the Heatsink ............................................................................................... 36 Figure 23: Top and Side Dimensions .................................................................................................................... 37 Figure 24: Bottom Dimensions (Bottom View) ..................................................................................................... 38 Figure 25: Recommended Footprint ..................................................................................................................... 39 Figure 26: Top and Bottom Views ......................................................................................................................... 40 Figure 27: Recommended Reflow Soldering Thermal Profile ............................................................................ 42 Figure 28: Carrier Tape Dimension Drawing ....................................................................................................... 44 Figure 29: Plastic Reel Dimension Drawing ........................................................................................................ 45 Figure 30: Mounting Direction ................................................................................................................................ 45 Figure 31: Packaging Process ............................................................................................................................... 46 FCS950R_Hardware_Design 8 / 49 Wi-Fi&Bluetooth Module Series 1 Introduction This document defines the FCS950R and describes its air interfaces and hardware interfaces, which are connected with your application. The document provides a quickly insight into interface specifications, RF performance, electrical and mechanical details, as well as other related information of the module. 1.1. Special Mark Table 1: Special Mark Mark Definition

Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. FCS950R_Hardware_Design 9 / 49 Wi-Fi&Bluetooth Module Series 2 Product Overview FCS950R is a low-energy and high-performance IEEE 802.11a/b/g/n/ac Wi-Fi 5 and Bluetooth 4.2 module supporting 2.4 GHz&5 GHz dual-band and 1T1R mode with maximum data transmission rate up to 433.3 Mbps. It provides Wi-Fi functions with an SDIO 3.0 interface, and Bluetooth functions with a UART and a PCM interface. It is an SMD module with compact packaging. Related information is listed in the table below:

Table 2: Basic Information FCS950R Packaging type Pin counts Dimensions Weight LCC 44

(12.0 0.15) mm (12.0 0.15) mm (2.35 0.2) mm Approx. 0.58 g FCS950R_Hardware_Design 10 / 49 Wi-Fi&Bluetooth Module Series 2.1. Key Features Table 3: Key Features Basic Information Protocol and Standard Power Supplies Temperature Ranges Wi-Fi protocols: IEEE 802.11a/b/g/n/ac Bluetooth protocol: Bluetooth 4.2 All hardware components are fully compliant with EU RoHS directive VBAT Power Supply:

3.03.6 V Typ.: 3.3 V VDD_IO Power Supply:

1.623.6 V Typ.: 1.8/3.3 V Operating temperature 1: 0 C to +70 C Storage temperature: -55 C to +125 C EVB Kit FCS950R-M.2 RF Antenna Interface Wi-Fi/Bluetooth Antenna Interface ANT_WIFI/BT 50 characteristic impedance Application Interface Wi-Fi Application Interface SDIO 3.0 Bluetooth Application Interfaces UART, PCM 1 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules indicators comply with IEEE and Bluetooth specification requirements. FCS950R_Hardware_Design 11 / 49 Wi-Fi&Bluetooth Module Series 2.2. Functional Diagram The main components of the block diagram are explained below. 1. Main chip 2. Radio frequency 3.Peripheral interfaces FCS950R_Hardware_Design 12 / 49 Wi-Fi&Bluetooth Module Series 3 RF Performances 3.1. Wi-Fi Performances Table 4: Wi-Fi Performances Operating Frequency 2.4 GHz: 2.4002.4835 GHz 5 GHz: 5.1505.850 GHz Modulation DBPSK, DQPSK, CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM Operating Mode AP STA Transmission Data Rate 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) 802.11ac: VHT20 (MCS 08), VHT40 (MCS 09), VHT80 (MCS 09) Condition (VBAT = 3.3 V; Temp.: 25 C) EVM Typ.; Unit: dBm; Tolerance: 2 dB Transmitting Power Receiving Sensitivity 2.4 GHz 802.11b @ 1 Mbps 802.11b @ 11 Mbps 35%

21.5 18 802.11g @ 6 Mbps

-5 dB 21.5 802.11g @ 54 Mbps

-27 dB 15 802.11n, HT20 @ MCS 0

-5 dB 21.5 802.11n, HT20 @ MCS 7

-28 dB 14

-97

-89

-92.5

-75

-91.5

-72 FCS950R_Hardware_Design 13 / 49 Wi-Fi&Bluetooth Module Series 802.11n, HT40 @ MCS 0

-5 dB 21.5 802.11n, HT40 @ MCS 7

-28 dB 14 802.11a @ 6 Mbps

-5 dB 16.5 802.11a @ 54 Mbps

-25 dB 14 802.11n, HT20 @ MCS 0

-5 dB 16.5 802.11n, HT20 @ MCS 7

-27 dB 13 802.11n, HT40 @ MCS 0

-5 dB 16.5 802.11n, HT40 @ MCS 7

-27 dB 13 802.11ac, VHT20 MCS 0

-5 dB 16.5 802.11ac, VHT20 MCS 8

-30 dB 12 802.11ac, VHT40 @ MCS 0

-5 dB 16.5 802.11ac, VHT40 @ MCS 9

-32 dB 11 802.11ac, VHT80 @ MCS 0

-5 dB 16.5 802.11ac, VHT80 @ MCS 9

-32 dB 11 5 GHz

-89

-70

-90

-72

-89

-70

-86.5

-68

-89

-65

-86.5

-62.5

-83

-59 FCS950R_Hardware_Design 14 / 49 Wi-Fi&Bluetooth Module Series 3.2. Bluetooth Performances Table 5: Bluetooth Performances Operating Frequency 2.4002.4835 GHz Modulation GFSK, /4-DQPSK, 8-DPSK Operating Mode Classic Bluetooth (BR + EDR) Bluetooth Low Energy (BLE) Condition (VBAT = 3.3 V; Temp.: 25 C) Typ.; Unit: dBm; Tolerance: 2 dB Transmitting Power Receiving Sensitivity BR EDR (/4-DQPSK) EDR (8-DPSK) BLE (1 Mbps) 8.5 8.5 8.5 5

-91

-96.5

-97

-95 FCS950R_Hardware_Design 15 / 49 Wi-Fi&Bluetooth Module Series 4 Application Interfaces 4.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE 1. Keep all RESERVED and unused pins unconnected. 2. All GND pins should be connected to ground. FCS950R_Hardware_Design 16 / 49 Wi-Fi&Bluetooth Module Series 4.2. Pin Description Table 6: I/O Parameter Definition Type AIO DI DO DIO PI Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 7: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT 9 PI VDD_IO 22 PI Main power supply for the module Vmin = 3.0 V Vnom = 3.3 V Vmax = 3.6 V Power supply for modules I/O pins Vmin = 1.62 V Vnom = 1.8/3.3 V Vmax = 3.6 V It must be provided with sufficient current of at least 0.6 A. It must be provided with sufficient current of at least 0.2 A. GND 1, 3, 20, 31, 33, 36 Wi-Fi Application Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_EN 12 DI Wi-Fi function enable control VDD_IO Active high. If unused, pull it up to VDD_IO with a 100 k resistor. FCS950R_Hardware_Design 17 / 49 WLAN_WAKE 13 DO Wi-Fi wakes up host Active high. Wi-Fi&Bluetooth Module Series SDIO_DATA2 14 SDIO_DATA3 15 SDIO_CMD SDIO_CLK SDIO_DATA0 16 17 18 SDIO_DATA1 19

NC (1-bit mode) DIO SDIO data bit 2

(4-bit mode)

NC (1-bit mode) DIO SDIO data bit 3

(4-bit mode) DIO SDIO command DI SDIO clock DIO SDIO data bit 0 DO IRQ (1-bit mode) DIO SDIO data bit 1

(4-bit mode) Supports 1-bit or 4-bit mode. Bluetooth Application Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment Active high. If unused, pull it up to VDD_IO with a 100 k resistor. Active high. BT_EN 34 DI Bluetooth enable control HOST_WAKE_BT 6 BT_WAKE_HOST 7 PCM_DOUT PCM_CLK PCM_DIN PCM_SYNC 25 26 27 28 DI DO Host wakes up Bluetooth Bluetooth wakes up host DO PCM data output DI DI DI PCM clock PCM data input PCM data frame sync BT_RTS 41 DO BT_TXD 42 DO Request to send signal from the module Bluetooth UART transmit VDD_IO FCS950R_Hardware_Design 18 / 49 Wi-Fi&Bluetooth Module Series BT_RXD BT_CTS 43 44 DI DI Bluetooth UART receive Clear to send signal to the module RF Antenna Interface Pin Name Pin No. I/O Description ANT_WIFI/BT 2 AIO Wi-Fi/Bluetooth antenna interface DC Characteristics Comment 50 characteristic impedance. Other Interface Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_SLP_CLK 24 DI Wi-Fi sleep clock VDD_IO External 32.768 kHz clock input. If unused, keep it open. RESERVED Pins Pin Name Pin No. Comment RESERVED 4, 5, 8, 10, 11, 21, 23, 29, 30, 32, 35, 3740 Keep them open. FCS950R_Hardware_Design 19 / 49 Wi-Fi&Bluetooth Module Series 4.3. Power Supply The module is powered by VBAT, and it should use a power supply chip that can provide sufficient current of at least 0.6 A. To ensure better power supply performance, it is recommended to parallel a 22 F decoupling capacitor and three filter capacitors (100 nF, 33 pF and 10 pF) near the modules VBAT pin. Meanwhile, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace, the wider it should be. The reference circuit for modules power supply is shown in the figure below:

Figure 3: Reference Design for Power Supply The following figure shows the recommended power-up timing of the module. Figure 4: Power-up Timing FCS950R_Hardware_Design 20 / 49 Wi-Fi&Bluetooth Module Series 4.4. Wi-Fi Application Interfaces Wi-Fi application interface connection between the module and the host is illustrated in the figure below. Figure 5: Wi-Fi Application Interface Connection 4.4.1. SDIO Interface The module supports 1-bit or 4-bit SDIO 3.0 interface. It can detect the SDIO mode of the host automatically when it is connected. SDIO interface connection between the module and the host is illustrated in the following figure. Figure 6: SDIO Interface Connection (1-bit Mode) FCS950R_Hardware_Design 21 / 49 Wi-Fi&Bluetooth Module Series Figure 7: SDIO Interface Connection (4-bit Mode) To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles:

Add 0 resistors in series and 5.6 pF capacitors (not mounted by default) between the module and the host. All resistors and capacitors should be placed close to the module. To avoid the impact of jitter, pull up SDIO signal traces (SDIO_CLK, SDIO_CMD, and SDIO_DATA[0:3]) to VDD_IO with 2.2 k resistors. The impedance of SDIO signal trace is 50 10 %. Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. And the SDIO_CLK signal trace should be routed with ground surrounded separately. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals. SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be equal in length (less than 2.5 mm distance between the traces) and the total routing length of each signal trace is less than 63.5 mm. The total trace inside the module is 11 mm, so the exterior total trace length should be less than 52.5 mm. Ensure the SDIO signal traces a complete reference ground and keep them free of stubs. Keep the adjacent trace clearance twice the trace width and the load capacitance of SDIO bus less than 15 pF. The vias of SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) should be less than 4. FCS950R_Hardware_Design 22 / 49 Wi-Fi&Bluetooth Module Series Table 8: SDIO Interface Trace Length Inside the Module (Unit: mm) Pin No. Pin Name Length 16 17 15 14 18 19 SDIO_CMD SDIO_CLK SDIO_DATA3 SDIO_DATA2 SDIO_DATA0 SDIO_DATA1 10.90 10.87 10.92 10.77 10.85 10.89 4.5. Bluetooth Application Interfaces Bluetooth application interface connection between the module and the host is illustrated in the figure below. Figure 8: Bluetooth Application Interface Connection 4.5.1. PCM Interface The module provides a PCM interface for Bluetooth audio application. It supports the following features:

Both master and slave modes Programmable long/short frame synchronization 8-bit A-law/-law, 13/16-bit linear PCM format Symbol expansion and zero padding for 8-bit and 13-bit samples FCS950R_Hardware_Design 23 / 49 Wi-Fi&Bluetooth Module Series Fill audio gain to 13-bit sampling PCM master clock output: 64 kHz, 128 kHz, 256 kHz or 512 kHz SCO/eSCO link PCM interface timing is shown below:

Figure 9: PCM interface Timing (Long Frame Sync) Figure 10: PCM interface Timing (Short Frame Sync) FCS950R_Hardware_Design 24 / 49 Wi-Fi&Bluetooth Module Series Table 9: PCM Interface Clock Specifications Parameter Description Min. Typ. Max. Unit FPCM_CLK Frequency of PCM_CLK (master) FPCM_SYNC Frequency of PCM_SYNC (master) FPCM_CLK Frequency of PCM_CLK (slave) FPCM_SYNC Frequency of PCM_SYNC (slave) D N Data size Number of slots per frame 64

64

8 1

8

8 8 1 512

kHz kHz 512 kHz

16 1 kHz bits slots Table 10: PCM Interface Timing Parameter Description Min. Typ. Max. Unit TPCM_CLKH High period of PCM_CLK TPCM_CLKL Low period of PCM_CLK TPCM_SYNC_DELAY TPCM_CLK_DELAY TSETUPIN THOLDIN Delay time from PCM_CLK high to PCM_SYNC high Delay time from PCM_CLK high to valid PCM_DOUT Set-up time for PCM_DIN valid to PCM_CLK low Hold time for PCM_CLK low to PCM_DIN invalid 980 970

10 125

75 125

ns ns ns ns ns ns 4.5.2. UART The module supports a Bluetooth HCI (Host Controller Interface) UART defined by Bluetooth 4.2 protocol. It supports hardware flow control (RTS/CTS), and can be used for data transmission with the host. The baud rate, which is 115200 bps by default, can be up to 4 Mbps. The voltage range of the Bluetooth UART is determined by VDD_IO. It is necessary to monitor the consistency of the voltage range between the host and Bluetooth UART. If necessary, adopt a voltage-level translator. The UART connection between the module and the host supporting software flow control is as below:

FCS950R_Hardware_Design 25 / 49 Wi-Fi&Bluetooth Module Series Figure 11: UART Connection with Host Supporting Software Flow Control The UART connection between the module and the host supporting hardware flow control is as below:

Figure 12: UART Connection with Host Supporting Hardware Flow Control The UART connection between the module and the host not supporting flow control is as below:

Figure 13: UART Connection with Host Not Supporting Flow Control FCS950R_Hardware_Design 26 / 49 Wi-Fi&Bluetooth Module Series NOTE 1. When paired with Quectel's LTE modules, you need to pay attention to the input and output of BT_CTS and BT_RTS. 2. Reserve 0 resistors between the module and host for Bluetooth signaling test. 4.6. RF Antenna Interface Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. The module provides one RF antenna interface (ANT_WIFI/BT), and the RF port requires 50 characteristic impedance. 4.6.1. Reference Design A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a -type matching circuit and add an ESD protection component for better RF performance. Reserved matching components (C1, R1, C2 and D1) should be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 . Figure 14: Reference Design of RF Antenna Interface FCS950R_Hardware_Design 27 / 49 Wi-Fi&Bluetooth Module Series 4.6.2. Antenna Design Requirements Table 11: Antenna Design Requirements Parameter Frequency Ranges (GHz) Requirement 2 2.4002.4835 5.1505.850 Cable Insertion Loss (dB)

< 1 VSWR 2 (Typ.) MAX Gain (dBi) Max Input Power (W) Input Impedance () 1.14 50 50 Polarization Type Vertical 4.6.3. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 15: Microstrip Design on a 2-layer PCB 2 For more details about the RF performances, see Chapter 3. FCS950R_Hardware_Design 28 / 49 Wi-Fi&Bluetooth Module Series Figure 16: Coplanar Waveguide Design on a 2-layer PCB Figure 17: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 18: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the FCS950R_Hardware_Design 29 / 49 Wi-Fi&Bluetooth Module Series right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [1]. 4.6.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 19: Dimensions of the Receptacle (Unit: mm) FCS950R_Hardware_Design 30 / 49 U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Wi-Fi&Bluetooth Module Series Figure 20: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 21: Space Factor of Mated Connectors (Unit: mm) For more details, please visit https://www.hirose.com. FCS950R_Hardware_Design 31 / 49 Wi-Fi&Bluetooth Module Series 5 Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 12: Absolute Maximum Ratings (Unit: V) Parameter VBAT VDD_IO Voltage at Digital Pins Min. 0 0 0 5.2. Power Supply Ratings Table 13: Module Power Supply Ratings (Unit: V) Max. 3.6 3.6 3.6 Parameter Description Condition Min. Typ. Max. VBAT VDD_IO Main power supply for the module The actual input voltages must be kept between the minimum and maximum values. Power supply for modules I/O pins

3.0 3.3 3.6 1.62 1.8/3.3 3.6 FCS950R_Hardware_Design 32 / 49 Wi-Fi&Bluetooth Module Series 5.3. Power Consumption 5.3.1. Wi-Fi Power Consumption Table 14: Power Consumption in Low Power Modes Mode Light Sleep Deep Sleep DTIM1 DTIM3 OFF Typ. TBD TBD TBD TBD TBD Table 15: Power Consumption in Non-signalling Mode (Unit: mA) Condition 2.4 GHz 802.11b 802.11g 802.11n Tx @ 1 Mbps Tx @ 11 Mbps Tx @ 6 Mbps Tx @ 54 Mbps Tx HT20 @ MCS 0 Tx HT20 @ MCS 7 Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 802.11a Tx @ 6 Mbps Tx @ 54 Mbps 5 GHz Tx HT20 @ MCS 0 802.11n Tx HT20 @ MCS 7 Tx HT40 @ MCS 0 IVBAT 355 340 279 212 270 200 268 177 375 269 345 244 334 Unit TBD TBD TBD TBD TBD IVDD_IO 0.06 0.101 0.086 0.25 0.12 0.263 0.12 0.348 0.082 0.244 0.85 0.26 0.117 FCS950R_Hardware_Design 33 / 49 Wi-Fi&Bluetooth Module Series Tx HT40 @ MCS 7 Tx VHT20 @ MCS 0 Tx VHT20 @ MCS 8 Tx VHT40 @ MCS 0 Tx VHT40 @ MCS 9 Tx VHT80 @ MCS 0 Tx VHT80 @ MCS 9 215 345 237 333 203 307 176 802.11ac 0.34 0.085 0.272 0.117 0.365 0.17 0.407 5.3.2. Bluetooth Power Consumption Table 16: Power Consumption in Non-signalling Mode Tx Power (Typ.) IVDD_IO Mode BR 4 dBm EDR (/4-DQPSK) 4 dBm EDR (8-DPSK) 4 dBm BLE (1 Mbps) 4 dBm 112 mA 110 mA 110 mA 115 mA 5.4. Digital I/O Characteristics Table 17: VDD_IO High Level I/O Requirements (Unit: V) Parameter Description VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Min. 2.0

2.97 0 IVBAT TBD TBD TBD TBD Max. 3.6 0.9 3.3 0.33 FCS950R_Hardware_Design 34 / 49 Wi-Fi&Bluetooth Module Series Table 18: VDD_IO Low Level I/O Requirements (Unit: V) Parameter Description VIH VIL VOH VOL High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Min. 1.3

1.62 0 Max. 2.0 0.8 1.8 0.18 5.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. 5.6. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:

- Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.

- Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

- Choose the heatsink with adequate fins to dissipate heat;

- Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

FCS950R_Hardware_Design 35 / 49

Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Wi-Fi&Bluetooth Module Series Figure 22: Placement and Fixing of the Heatsink FCS950R_Hardware_Design 36 / 49 Wi-Fi&Bluetooth Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 23: Top and Side Dimensions FCS950R_Hardware_Design 37 / 49 Wi-Fi&Bluetooth Module Series Figure 24: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. FCS950R_Hardware_Design 38 / 49 6.2. Recommended Footprint Wi-Fi&Bluetooth Module Series Figure 25: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCS950R_Hardware_Design 39 / 49 6.3. Top and Bottom Views Wi-Fi&Bluetooth Module Series Figure 26: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCS950R_Hardware_Design 40 / 49 Wi-Fi&Bluetooth Module Series 7 Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. FCS950R_Hardware_Design 41 / 49 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [2]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 27: Recommended Reflow Soldering Thermal Profile FCS950R_Hardware_Design 42 / 49 Wi-Fi&Bluetooth Module Series Table 19: Recommended Thermal Profile Parameters Factor Soak Zone Recommendation Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max. temperature Cool-down slope Reflow Cycle Max. reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2]. FCS950R_Hardware_Design 43 / 49 Wi-Fi&Bluetooth Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape Dimension details are as follow:

Figure 28: Carrier Tape Dimension Drawing Table 20: Carrier Tape Dimension Table (Unit: mm) W 24 P 16 T A0 B0 0.35 12.4 12.4 K0 2.6 K1 3.6 F E 11.5 1.75 FCS950R_Hardware_Design 44 / 49 7.3.2. Plastic Reel Wi-Fi&Bluetooth Module Series Figure 29: Plastic Reel Dimension Drawing Table 21: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 24.5 7.3.3. Mounting Direction Figure 30: Mounting Direction FCS950R_Hardware_Design 45 / 49 7.3.4. Packaging Process Wi-Fi&Bluetooth Module Series Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 31: Packaging Process FCS950R_Hardware_Design 46 / 49 Wi-Fi&Bluetooth Module Series 8 Appendix References Table 22: Related Documents Document Name

[1] Quectel_RF_Layout_Application_Note

[2] Quectel_Module_SMT_Application_Note Table 23: Terms and Abbreviations Abbreviation Description 1T1R AP BLE BPSK BR CCK CTS DBPSK DPSK DQPSK DTIM EDR eSCO ESD One Transmit One Receive Access Point Bluetooth Low Energy Binary Phase Shift Keying Basic Rate Complementary Code Keying Clear To Send Differential Binary Phase Shift Keying Differential Phase Shift Keying Differential Quadrature Phase Shift Keying Delivery Traffic Indication Message Enhanced Date Rate Extended Synchronous Connection-Oriented Electrostatic Discharge FCS950R_Hardware_Design 47 / 49 Wi-Fi&Bluetooth Module Series EVM GFSK GND GPIO HCI HT IEEE I/O IRQ LCC LSB LTE Mbps MCS MSB MSL NC PCB PCM QAM QPSK RF RoHS RTS Rx Error Vector Magnitude Gaussian Frequency Shift Keying Ground General-Purpose Input/Output Host Controller Interface High Throughput Institute of Electrical and Electronics Engineers Input/Output Interrupt Request Leadless Chip Carrier (package) Least Significant Bit Long-Term Evolution Million Bits Per Second Modulation and Coding Scheme Most Significant Bit Moisture Sensitivity Levels Not Connected Printed Circuit Board Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Request to Send Receive FCS950R_Hardware_Design 48 / 49 Wi-Fi&Bluetooth Module Series RXD SCO SDIO SMD SMT STA TBD Tx TXD TVS UART VBAT VHT VIH VIL Vmax Vmin Vnom VOH VOL Receive Data Synchronous Connection-Oriented Secure Digital Input/Output Surface Mount Device Surface Mount Technology Station To Be Determined Transmit Transmit Data Transient Voltage Suppressor Universal Asynchronous Receiver/Transmitter Voltage at Battery (Pin) Very High Throughput High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Nominal Voltage High-level Output Voltage Low-level Output Voltage VSWR Voltage Standing Wave Ratio 9 Worning 9.1. Important Notice to OEM integrators Product Marketing NameQuectel FCS950R 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in fixed applications, according to Part 2.1091(b). 3. This module has been tested and found to comply with the limits for Part 15.247 & 15.407 of the FCC Rules. FCS950R_Hardware_Design 49 / 49 4. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd.. that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product LabelingWhen the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2023FCS950R The FCC ID can be used only when all FCC mpliance requirements are met. Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with thismodule. Operating Band Bluetooth 2.4G WiFi 5G WiFi Frequency

(MHz) 2400~2483.5 5150~5850 Antenna Type Antenna P/N Antenna Gain (dBi) Dipole YE0038AA 0.73 dBi 0.73 dBi 5150~5250 MHz: 1.14 dBi 5250~5350 MHz: 1.14 dBi 5470~5725 MHz: 1.14 dBi 5725~5850 MHz: 1.14 dBi Other types of antennas and/or higher gain antennas may require additional authorization for operation. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 9.2. FCC Statement Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following conditions:

(For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. 9.3. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. Radio frequency radiation exposure statement The other one used for the transmitter must be installed at a distance of at least 20 cm from all personnel and must not be shared or operated together with any other antenna or transmitter. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-2023FCS950R or where: 10224A-2023FCS950R is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-2023FCS950R" ou "o: 10224A-2023FCS950R est le numro de certification du module". i. the device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;

iii.for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;

iv.Omnidirectional antenna is recommended

arereg Fee FCSS50R = Q1-AXXxx FCS950RAAMD SN:C1149065G2XXXXX FCC ID:XMR2023FCS950R, 1C:10224A-2023FCS950R label location

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Federal Communication Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA 2023/7/17 Attestation Statement according to 2.911(d)(5)(i) and 2.911(d)(5)(ii) FCC ID: XMR2023FCS950R TO WHOM IT MAY CONCERN:

Hereby we certify that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Further we certify that, as of the date of the filing of the application, Quectel Wireless Solutions Co., Ltd. is not identified on the Covered List as an entity producing covered equipment. Sincerely, __

(signature & company stamp) _____________

< Quectel Wireless Solutions Co., Ltd.>

<FCC Registration Number 0018988279>

< Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233>

< Jean Hu >

<+8602150086326>

< jean.hu@quectel.com >

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

City:

Country SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd. South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone Suzhou China is authorized to apply for Certification of the following product(s):

Product description: Wi-Fi & Bluetooth Module Type designation:

Trademark:

FCC ID:

FCS950R Quectel XMR2023FCS950R on our behalf. Date:

City:

Name:

Email:

2023/07/17 Shanghai .. Jean hu .. jean.hu@quectel.com. Signature:

CONFIDENTIALITY REQUEST for Certification Service in USA Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048

<2023-07-17>

TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b) (4) of the Freedom of Information Act, we requests confidentiality for the following products:

FCC ID: XMR2023FCS950R Model name: FCS950R For the product stated above, we request that the following information be held confidential;

Exhibits Long-Term Confidentiality Short-Term Confidentiality External Photos Internal Photos Block Diagram Schematics Test Setup Photos Users Manual Parts List Tune Up Operational Description The long-term confidentiality exhibits contain our trade secrets and proprietary information that could be of benefit to our competitors. The short-term confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device, which is planned for confidentiality for 180 days If you have any questions, please feel free to contact me at the address shown below. Sincerely, Name / Title: Jean Hu/Certification Manager Company: Quectel Wireless Solutions Company Limited Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Phone: +8602150086326 Fax: +862153253668 E-Mail: jean.hu@quectel.com

RF_734_02 04 April 16 Quectel Wireless Solutions Co., Ltd. Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR2023FCS950R Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. Answer from applicant Yes, please see exhibition external photos Yes, the modular has buffer modulation /data inputs 3. The modular transmitter must have its own power supply regulation. Yes, please see the SCH.pdf 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. there are very strict operational and 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Yes, the requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, please refer to the setup photo exhibition for the stand-alone configuration Yes, the module will be label with its own FCC ID, and the instruction on the labelling rule of the end product has been stated in the user manual of this module. Please refer to the label and user manual exhibition. Yes, the required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):

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2023/07/17.. Shanghai .. Jean hu .. jean.hu@quectel.com. Signature: