all | frequencies |
|
|
|
|
exhibits | applications |
---|---|---|---|---|---|---|---|
manual | photos | label |
app s | submitted / available | |||||||
---|---|---|---|---|---|---|---|---|
1 2 3 |
|
User manual | Users Manual | 980.67 KiB | July 22 2021 / July 28 2021 | |||
1 2 3 |
|
Internal photos | Internal Photos | 220.32 KiB | July 22 2021 / July 28 2021 | |||
1 2 3 |
|
External photos | External Photos | 973.32 KiB | July 22 2021 / July 28 2021 | |||
1 2 3 |
|
ID label and location | ID Label/Location Info | 49.45 KiB | July 22 2021 / July 28 2021 | |||
1 2 3 |
|
Confidentiality | Cover Letter(s) | 22.01 KiB | July 22 2021 / July 28 2021 | |||
1 2 3 |
|
Letter Authorization | Cover Letter(s) | 16.83 KiB | July 22 2021 / July 28 2021 | |||
1 2 3 |
|
Module Approval Request | Cover Letter(s) | 125.91 KiB | July 22 2021 / July 28 2021 | |||
1 2 3 | RF Exposure Info | 348.09 KiB | July 22 2021 / July 28 2021 | |||||
1 2 3 |
|
Test reports | Test Report | 1.82 MiB | July 22 2021 / July 28 2021 | |||
1 2 3 |
|
Test setup photos | Test Setup Photos | 186.06 KiB | July 22 2021 / July 28 2021 |
1 2 3 | User manual | Users Manual | 980.67 KiB | July 22 2021 / July 28 2021 |
AF50T Hardware Design
Wi-Fi&BT Module Series
Version: 1.0.1
Date: 2020-12-17
Status: Preliminary
www.quectel.com
Wi-Fi&BT Module Series
AF50T Hardware Design
Our aim is to provide customers with timely and comprehensive service. For any assistance,
please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
200233, China
Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local office. For more information, please visit:
http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm
Or email to support@quectel.com.
General Notes
Quectel offers the information as a service to its customers. The information provided is based upon
customers’ requirements. Quectel makes every effort to ensure the quality of the information it makes
available. Quectel does not make any warranty as to the information contained herein, and does not
accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the
information. All information supplied herein is subject to change without prior notice.
Disclaimer
While Quectel has made efforts to ensure that the functions and features under development are free
from errors, it is possible that these functions and features could contain errors, inaccuracies and
omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind,
implied or express, with respect to the use of features and functions under development. To the maximum
extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with
the use of the functions and features under development, regardless of whether such loss or damage
may have been foreseeable.
Duty of Confidentiality
The Receiving Party shall keep confidential all documentation and information provided by Quectel,
except when the specific permission has been granted by Quectel. The Receiving Party shall not access
or use Quectel’s documentation and information for any purpose except as expressly provided herein.
Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information
to any third party without the prior written consent by Quectel. For any noncompliance to the above
requirements, unauthorized use, or other illegal or malicious use of the documentation and information,
Quectel will reserve the right to take legal action.
AF50T_Hardware_Design 1 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Copyright
The information contained here is proprietary technical information of Quectel wireless solutions co., ltd.
Transmitting, reproducing, disseminating and editing this document as well as using the content without
permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in
the event of a patent grant or registration of a utility model or design.
Copyright © Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved.
AF50T_Hardware_Design 2 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
About the Document
Revision History
Version Date
Author
Description
-
2019-11-25
Creation of the document
1.0.0
2019-11-25
Preliminary
Jone CHEN/
Felix FU
Jone CHEN/
Felix FU
1.0.1
2020-12-17
Jone CHEN/
Michael DU
3. Updated the pin description (Table 3).
4. Updated the recommended operating power supply
Preliminary:
1. Updated the key features (Table 1).
2. Changed the name of pin 48, pin 60, pin 61, pin 3,
pin 21 and pin 65 to RESERVED, pin 22 from
BT_DBG_RXD to BT_WAKEUP_HOST, pin 23 from
BT_DBG_TXD to HOST_WAKEUP_BT.
range (Table 4 and Table 19).
5. Deleted Chapter 3.5.3.
6. Updated the reference circuit for RF antenna
interfaces (Figure 12).
7. Added data of current consumption (Chapter 4.4).
8. Updated data of RF performance (Chapter 4.5).
9. Added data of electrostatic discharge (Table 28).
AF50T_Hardware_Design 3 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Contents
About the Document .................................................................................................................................. 3
Contents ...................................................................................................................................................... 4
Table Index .................................................................................................................................................. 6
Figure Index ................................................................................................................................................ 7
1
Introduction ......................................................................................................................................... 8
1.1. Safety Information ...................................................................................................................... 9
2 Product Concept ............................................................................................................................... 10
2.1. General Description ................................................................................................................. 10
2.2. Key Features ............................................................................................................................ 10
2.3. Functional Diagram .................................................................................................................. 12
2.4. Evaluation Board ...................................................................................................................... 12
3 Application Interfaces ...................................................................................................................... 13
3.1. General Description ................................................................................................................. 13
3.2. Pin Assignment ........................................................................................................................ 14
3.3. Pin Description ......................................................................................................................... 15
3.4. Power Supply ........................................................................................................................... 19
3.5. WLAN Interface ........................................................................................................................ 20
3.5.1. WLAN_EN ..................................................................................................................... 21
3.5.2. PCIe Interface ............................................................................................................... 21
3.6. BT Interface .............................................................................................................................. 22
3.6.1. BT_EN ........................................................................................................................... 23
3.6.2. PCM Interface* .............................................................................................................. 23
3.6.3. UART Interface .............................................................................................................. 24
3.7. Control Signal Pins* ................................................................................................................. 25
3.7.1. SW_CTRL ..................................................................................................................... 25
3.7.2. HOST_WAKEUP_BT and BT_WAKEUP_HOST .......................................................... 25
3.8. Coexistence Interfaces ............................................................................................................ 26
3.8.1. UART Coexistence Interface ......................................................................................... 26
3.8.2. Other Coexistence Interfaces* ...................................................................................... 27
3.9. WLAN_SLP_CLK Interface ...................................................................................................... 27
RF Antenna Interfaces .......................................................................................................... 28
3.10.
3.10.1. Operating Frequency .................................................................................................... 28
3.10.2. Reference Design of RF Antenna Interfaces ................................................................ 28
3.10.3. Reference Design of RF Layout ................................................................................... 29
3.10.4. Antenna Requirements ................................................................................................. 31
3.10.5. Recommended RF Connector for Antenna Installation ................................................ 32
4 Reliability, Radio and Electrical Characteristics ........................................................................... 34
4.1. General Description ................................................................................................................. 34
AF50T_Hardware_Design 4 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
4.2. Electrical Characteristics .......................................................................................................... 34
4.3.
I/O Interface Characteristics .................................................................................................... 35
4.4. Current Consumption ............................................................................................................... 36
4.5. RF Performances ..................................................................................................................... 37
4.5.1. Conducted RF Performance of Wi-Fi ............................................................................ 37
4.5.2. Conducted RF Performance of Bluetooth ..................................................................... 41
4.6. Electrostatic Discharge ............................................................................................................ 42
5 Mechanical Dimensions ................................................................................................................... 43
5.1. Mechanical Dimensions of the Module .................................................................................... 43
5.2. Recommended Footprint ......................................................................................................... 45
5.3. Top and Bottom Views of the Module ...................................................................................... 46
6 Storage, Manufacturing and Packaging ......................................................................................... 47
6.1. Storage ..................................................................................................................................... 47
6.2. Manufacturing and Soldering ................................................................................................... 48
6.3. Packaging ................................................................................................................................ 49
7 Appendix A References .................................................................................................................... 51
AF50T_Hardware_Design 5 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Table Index
Table 1: Key Features ................................................................................................................................ 10
Table 2: I/O Parameters Definition ............................................................................................................. 15
Table 3: Pin Description ............................................................................................................................. 15
Table 4: Definition of Power Supply and GND Pins ................................................................................... 19
Table 5: Pin Definition of WLAN_EN .......................................................................................................... 21
Table 6: Pin Definition of PCIe Interface .................................................................................................... 21
Table 7: Pin Definition of BT_EN ................................................................................................................ 23
Table 8: Pin Definition of PCM Interface .................................................................................................... 23
Table 9: Pin Definition of UART Interface .................................................................................................. 24
Table 10: Pin Definition of SW_CTRL ........................................................................................................ 25
Table 11: Pin Definition of HOST_WAKEUP_BT and BT_WAKEUP_HOST ............................................. 26
Table 12: Pin Definition of UART Coexistence Interface ........................................................................... 26
Table 13: Pin Definition of Other Coexistence Interface ............................................................................ 27
Table 14: Pin Definition of WLAN_SLP_CLK Interface .............................................................................. 27
Table 15: Pin Definition of RF Antenna Interfaces ..................................................................................... 28
Table 16: Operating Frequency of the Module ........................................................................................... 28
Table 17: Antenna Cable Requirements .................................................................................................... 31
Table 18: Antenna Requirements ............................................................................................................... 31
Table 19: Absolute Maximum Ratings ........................................................................................................ 34
Table 20: Recommended Operating Conditions ........................................................................................ 35
Table 21: General DC Electrical Characteristics ........................................................................................ 35
Table 22: Current Consumption of the Module (Normal Operation) .......................................................... 36
Table 23: Conducted RF Output Power at 2.4 GHz (SISO) ....................................................................... 37
Table 24: Conducted RF Output Power at 2.4 GHz (MIMO) ..................................................................... 38
Table 25: Conducted RF Output Power at 5 GHz (SISO) .......................................................................... 38
Table 26: Conducted RF Output Power at 5 GHz (MIMO) ........................................................................ 39
Table 27: Conducted RF Receiving Sensitivity at 2.4 GHz ........................................................................ 40
Table 28: Conducted RF Receiving Sensitivity at 5 GHz ........................................................................... 40
Table 29: Conducted RF Performance of Bluetooth .................................................................................. 41
Table 30: Electrostatic Discharge Characteristics ...................................................................................... 42
Table 31: Recommended Thermal Profile Parameters .............................................................................. 49
Table 32: Reel Packaging .......................................................................................................................... 50
Table 33: Related Documents .................................................................................................................... 51
Table 34: Terms and Abbreviations ............................................................................................................ 51
AF50T_Hardware_Design 6 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Figure Index
Figure 1: Functional Diagram of AF50T Module ........................................................................................ 12
Figure 2: Pin Assignment (Top View) ......................................................................................................... 14
Figure 3: Reference Circuit for VDD_CORE_VL, VDD_CORE_VM, VDD_CORE_VH, and VDD_IO ..... 19
Figure 4: Reference Circuit for VDD_RF ................................................................................................... 20
Figure 5: WLAN Interface Connection ....................................................................................................... 20
Figure 6: PCIe Interface Connection .......................................................................................................... 22
Figure 7: Block Diagram of BT Interface Connection ................................................................................ 23
Figure 8: PCM Interface Connection .......................................................................................................... 24
Figure 9: UART Interface Connection ........................................................................................................ 25
Figure 10: SW_CTRL Connection .............................................................................................................. 25
Figure 11: UART Coexistence Interface Connection ................................................................................. 26
Figure 12: Reference Circuit for RF Antenna Interfaces ............................................................................ 29
Figure 13: Microstrip Design on a 2-layer PCB ......................................................................................... 29
Figure 14: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 29
Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 30
Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 30
Figure 17: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 32
Figure 18: Mechanicals of UF.L-LP Connectors (Unit: mm) ...................................................................... 32
Figure 19: Space Factor of Mated Connector (Unit: mm) .......................................................................... 33
Figure 20: AF50T Top and Side Dimensions ............................................................................................. 43
Figure 21: AF50T Bottom Dimension (Bottom View) ................................................................................. 44
Figure 22: Recommended Footprint (Bottom View) .................................................................................. 45
Figure 23: Top View of the Module ............................................................................................................. 46
Figure 24: Bottom View of the Module ....................................................................................................... 46
Figure 25: Recommended Reflow Soldering Thermal Profile ................................................................... 48
AF50T_Hardware_Design 7 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
1 Introduction
This document defines the AF50T module and describes its air interface and hardware interfaces which
are connected with customers’ applications.
The document helps customers quickly understand module interface specifications, as well as the
electrical and mechanical details. Associated with application notes and user guides, customers can use
AF50T module to design and set up automotive industry mobile applications easily.
AF50T_Hardware_Design 8 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.
AF50T_Hardware_Design 9 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
2 Product Concept
2.1. General Description
AF50T is an automotive grade Wi-Fi and Bluetooth (BT) module with low power consumption. It is a
single-die WLAN (Wireless Local Area Network) and BT combo solution supporting IEEE 802.11
a/b/g/n/ac/ax 2.4/5 GHz WLAN standards and BT5.1 standard, which enables seamless integration of
WLAN and BT Low Energy technologies.
AF50T supports a low-power PCIe Gen 2 interface for WLAN and a UART/PCM interface for BT, and also
supports LTE & WLAN/BT coexistence interface. It is designed to be used in conjunction with Quectel 5G
V2X module AG55xQ series to provide it with WLAN and BT functions.
2.2. Key Features
The following table describes the key features of AF50T module.
Table 1: Key Features
Features
Details
Power Supply
Operating Frequency
Core supply voltage: 0.95 V, 1.35 V, 1.9 V
I/O supply voltage: 1.8 V
RF supply voltage: 3.85 V
2.4 GHz WLAN: 2.412–2.472 GHz
5 GHz WLAN: 5.180–5.825 GHz
BT: 2.402–2.480 GHz
802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps
802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps,
Transmission Data
Rates
48 Mbps, 54 Mbps
802.11n: HT20 (MCS0-7), HT40 (MCS0-7)
802.11ac: VHT20 (MCS0-8), VHT40 (MCS0-9), VHT80 (MCS0-9)
802.11ax: HE20 (MCS0-11), HE40 (MCS0-11), HE80 (MCS0-11)
AF50T_Hardware_Design 10 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Transmitting Power
2.4 GHz
802.11b/11 Mbps: 20 dBm
802.11g/54 Mbps: 16 dBm
802.11n/HT20 MCS7: 16 dBm
802.11n/HT40 MCS7: 16 dBm
802.11ax/HE20 MCS11: 14 dBm
802.11ax/HE40 MCS11: 14 dBm
5 GHz
802.11a/54 Mbps: 15 dBm
802.11n/HT20 MCS7: 15 dBm
802.11n/HT40 MCS7: 15 dBm
802.11ac/VHT20 MCS8: 14 dBm
802.11ac/VHT40 MCS9: 13 dBm
802.11ac/VHT80 MCS9: 13 dBm
802.11ax/HE20 MCS11: 12 dBm
802.11ax/HE40 MCS11: 12 dBm
802.11ax/HE80 MCS11: 12 dBm
IEEE 802.11 a/b/g/n/ac/ax
Bluetooth 5.1
Modulation
CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM, 1024QAM
Protocol Features
Operation Mode
AP, STA
WLAN Interface
PCIe
BT Interface
UART and PCM
Antenna Interface
Wi-Fi/BT antenna interface
50 Ω impedance
Physical Characteristics
Size: (19.5 ±0.2) mm × (21.5 ±0.2) mm × (2.3 ±0.2) mm
Package: LGA
Weight: 2.1 g
Temperature Range
Operating temperature range: -40 °C to +85 °C
Storage temperature range: -40 °C to +95 °C
RoHS
All hardware components are fully compliant with EU RoHS directive
AF50T_Hardware_Design 11 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
2.3. Functional Diagram
The following figure shows a block diagram of AF50T module.
Figure 1: Functional Diagram of AF50T Module
2.4. Evaluation Board
To help customers develop applications with AF50T module conveniently, Quectel supplies the evaluation
board (EVB), USB to RS232 converter cable, USB data cable, power adapter, antenna and other
peripherals to control or test the module. For more details, see document [1] and/or document [2].
AF50T_Hardware_Design 12 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
3 Application Interfaces
3.1. General Description
AF50T module is equipped with 108 LGA pins that can be connected to the cellular application platform.
The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the
module:
Power supply
WLAN interface
BT interface
Control signal pins*
Coexistence interfaces
WLAN_SLP_CLK interface
RF antenna interfaces
AF50T_Hardware_Design 13 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
3.2. Pin Assignment
108
GND
35
PCM_SYNC
36
PCM_DOUT
37
PCM_CLK
38
BT_CTS
39
BT_TXD
40
RESERVED
41
LAA_TXEN
42
WLAN_TXE
N
43
VDD_IO
44
GND
45
VDD_CORE
_VM
46
VDD_CORE
_VH
105
GND
76
PCM_DIN
77
BT_RTS
78
BT_RXD
79
RESERVED
80
PA_MUTE
81
LAA_RX
82
LAA_AS_EN
83
BT_EN
84
WLAN_EN
95
GND
94
GND
93
GND
92
GND
96
GND
97
GND
103
GND
104
GND
102
GND
91
GND
101
GND
90
GND
98
GND
99
GND
100
GND
89
GND
85
GND
86
GND
87
GND
88
GND
65
RESERVED
64
RESERVED
63
VDD_RF
62
RESERVED
61
RESERVED
60
RESERVED
59
COEX_TXD
58
RESERVED
57
SW_CTRL
107
GND
23
HOST_
WAKEUP_
BT
22
BT_
WAKEUP_
HOST
21
RESERVED
20
VDD_RF
19
VDD_RF
18
RESERVED
17
RESERVED
16
COEX_RXD
15
WLAN_SLP
_CLK
14
PCIE_RST_
N
13
PCIE_WAK
E_N
12
PCIE_CLKR
EQ_N
106
GND
Power Pins
GND Pins
PCIe Pins
PCM Pins
UART Pins
ANT Pins
Signal Pins
RESERVED Pins
Figure 2: Pin Assignment (Top View)
NOTE
Please keep all RESERVED pins open.
AF50T_Hardware_Design 14 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
3.3. Pin Description
The following tables show the pin description of AF50T module.
Table 2: I/O Parameters Definition
Description
Analog Input
Analog Output
Digital Input
Digital Output
Bidirectional
Power Input
Type
AI
AO
DI
DO
IO
PI
Table 3: Pin Description
Power Supply
Pin
No.
Pin Name
I/O Description
DC Characteristics Comment
VDD_CORE_
VL
1, 2,
47
PI
Voltage for core, low
voltage
VDD_CORE_
VM
45
PI
Voltage for core, mid
voltage
VDD_CORE_
VH
46
PI
Voltage for core,
high voltage
VDD_IO
43
PI
Power supply for the
module’s I/O pins
VDD_RF
19, 20,
63
PI
Power supply for the
module’s RF part
Vmin = 0.9 V
Vnorm = 0.95 V
Vmax = 1.05 V
Vmin = 1.28 V
Vnorm = 1.35 V
Vmax = 1.42 V
Vmin = 1.85 V
Vnorm = 1.9 V
Vmax = 2.0 V
Vmin = 1.71 V
Vnorm = 1.8 V
Vmax = 1.89 V
Vmin = 3.3 V
Vnorm = 3.85 V
Vmax = 4.25 V
It must be provided
with sufficient current
up to 1.7 A.
It must be provided
with sufficient current
up to 0.4 A.
It must be provided
with sufficient current
up to 0.4 A.
It must be provided
with sufficient current
up to 50 mA.
It must be provided
with sufficient current
up to 1.3 A.
GND
6, 24, 26, 27, 29, 30, 31, 32, 34, 44, 51, 66, 67, 69, 70, 74, 75, 85–108
AF50T_Hardware_Design 15 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
WLAN Interface
Pin
No.
Pin Name
I/O Description
DC Characteristics Comment
WLAN_EN
84
DI
WLAN function
enable control
1.8 V power domain.
Active high.
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
PCIE_
REFCLK_P
PCIE_
REFCLK_M
54
9
AI
AI
PCIe reference clock
(+)
PCIe reference clock
(-)
PCIE_TX_P
52
AO PCIe transmit (+)
PCIE_TX_M
7
AO PCIe transmit (-)
PCIE_RX_P
56
AI
PCIe receive (+)
PCIE_RX_M
11
AI
PCIe receive (-)
Require differential
impedance of 85 Ω.
12
DO PCIe clock request
1.8 V power domain
PCIE_RST_N
14
DI
PCIe reset
1.8 V power domain
13
DO PCIe wakes up host
1.8 V power domain
PCIE_
CLKREQ_N
PCIE_
WAKE_N
BT Interface
Pin Name
I/O Description
DC Characteristics Comment
Pin
No.
BT_EN
83
DI
BT enable control
1.8 V power domain.
Active high.
PCM_DIN*
76
DI
PCM data input
1.8 V power domain.
PCM_SYNC*
35
DI
1.8 V power domain.
PCM data frame
sync
VOLmax = 0.45 V
VOHmin = 1.35 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
VOLmax = 0.45 V
VOHmin = 1.35 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
AF50T_Hardware_Design 16 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
PCM_CLK*
37
DI
PCM clock
1.8 V power domain.
PCM_DOUT*
36
DO PCM data output
1.8 V power domain.
BT_RTS
77
DO
1.8 V power domain.
BT UART request to
send
VOLmax = 0.45 V
VOHmin = 1.35 V
BT_CTS
38
DI
1.8 V power domain.
BT UART clear to
send
BT_TXD
39
DO BT UART transmit
1.8 V power domain.
BT_RXD
78
DI
BT UART receive
1.8 V power domain.
Pin Name
I/O Description
DC Characteristics Comment
Control Signal Pins*
Pin
No.
SW_CTRL
57
DO
Control PMIC
outputs
HOST_
WAKEUP_
23
DI Host wakes up BT
BT_WAKEUP_
HOST
22
DO
BT wakes up the
host
VOLmax = 0.45 V
VOHmin = 1.35 V
1.8 V power domain.
1.8 V power domain.
If unused, keep this
pin open.
1.8 V power domain.
If unused, keep this
pin open.
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
VOLmax = 0.45 V
VOHmin = 1.35 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
VOLmax = 0.45 V
VOHmin = 1.35 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
VOLmax = 0.45 V
VOHmin = 1.35 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
Pin Name
I/O Description
DC Characteristics Comment
Coexistence Interfaces
Pin
No.
COEX_TXD
59
DO
COEX_RXD
16
DI
LTE/WLAN & BT
coexistence
transmit
LTE/WLAN & BT
coexistence
receive
VOLmax = 0.45 V
VOHmin = 1.35 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
If unused, keep this
pin open.
1.8 V power domain.
If unused, keep this
pin open.
LAA_AS_EN*
82
DI
Allow LAA to control VILmin = -0.3 V
1.8 V power domain.
AF50T_Hardware_Design 17 / 52
Pin Name
I/O Description
DC Characteristics Comment
Wi-Fi&BT Module Series
AF50T Hardware Design
WLAN FEM during
WLAN sleep mode
LAA_TXEN*
41
DI
WLAN XFEM control
LAA TX enable
LAA_RX*
81
DI
WLAN XFEM control
for LAA receiver
WLAN_TXEN*
42
DO
WLAN XFEM control
for WLAN TX enable
VOLmax = 0.45 V
VOHmin = 1.35 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
PA_MUTE*
80
DI
WLAN XFEM control
to disable WLAN PA
RF Antenna Interfaces
ANT_WIFI0
28
IO
ANT_WIFI1
33
ANT_BT
25
WLAN_SLP_CLK Interface
BT and 2.4/5 GHz
WLAN antenna
interface 0
IO
IO
2.4/5 GHz WLAN
antenna interface 1
Reserved dedicated
BT antenna interface
Pin
No.
Pin
No.
If unused, keep this
pin open.
1.8 V power domain.
If unused, keep this
pin open.
1.8 V power domain.
If unused, keep this
pin open.
1.8 V power domain.
If unused, keep this
pin open.
1.8 V power domain.
If unused, keep this
pin open.
50 Ω impedance
50 Ω impedance
50 Ω impedance
Pin Name
I/O Description
DC Characteristics Comment
WLAN_SLP_C
LK
15
DI
External 32.768 kHz
sleep clock input
1.8 V power domain.
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
RESERVED Interfaces
Pin Name
Pin No.
RESERVED
3, 4, 5, 8, 10, 17, 18, 21, 40, 48, 49, 50, 53, 55, 58, 60, 61,62,
64, 65, 68, 71–73, 79
Keep these pins
open.
Comment
AF50T_Hardware_Design 18 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
NOTES
1. Please keep all RESERVED and unused pins open.
2.
“*” means under development.
3.4. Power Supply
The following table shows the power supply pins and ground pins of AF50T module.
Table 4: Definition of Power Supply and GND Pins
Pin Name Pin No.
Description
Min.
Typ.
Max.
Unit
1, 2, 47
Voltage for core, low voltage
0.9
0.95
1.05
V
VDD_
CORE_VL
VDD_
CORE_VM
VDD_
CORE_VH
45
46
VDD_IO
43
Voltage for core, mid voltage
1.28
1.35
1.42
V
Voltage for core, high voltage
1.85
1.9
2.0
V
Power supply for the module’s I/O
pins
Power supply for the module’s RF
part
1.71
1.8
1.89
V
VDD_RF
19, 20, 63
3.3
3.85
4.25
V
GND
6, 24, 26, 27, 29, 30, 31, 32, 34, 44, 51, 66, 67, 69,
70, 74, 75, 85–108
The VDD_CORE_VL, VDD_CORE_VM, VDD_CORE_VH, and VDD_IO can be powered by AG55xQ
series module, as the following figure shows.
Figure 3: Reference Circuit for VDD_CORE_VL, VDD_CORE_VM, VDD_CORE_VH, and VDD_IO
AF50T_Hardware_Design 19 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
AF50T module is powered by VDD_RF, and it is recommended to use a power supply chip, which is able
to output a current of 1.3 A at least.
The following figure shows a reference design for VDD_RF which is controlled by WLAN_PWR_EN1 of
AG55xQ series. WLAN_PWR_EN1 of TPS62130A-Q1 should be connected
the pin 222
(WLAN_PWR_EN1) of AG55xQ series module. For more details, see document [3].
to
Figure 4: Reference Circuit for VDD_RF
3.5. WLAN Interface
The following figure shows the WLAN interface connection between AF50T and AG55xQ series modules.
Figure 5: WLAN Interface Connection
AF50T_Hardware_Design 20 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
3.5.1. WLAN_EN
WLAN_EN is used to control the WLAN function of AF50T module. WLAN function will be enabled when
WLAN_EN is at high level.
Table 5: Pin Definition of WLAN_EN
Pin Name
Pin No.
I/O
Description
Comment
WLAN_EN
84
DI
WLAN function enable control
Active high
NOTE
WLAN_EN is a sensitive signal, and it should be ground shielded and be routed as close to AF50T as
possible.
3.5.2. PCIe Interface
The following table shows the pin definition of the PCIe interface of AF50T.
Table 6: Pin Definition of PCIe Interface
Pin Name Pin No. I/O Description Comment
PCIE_REFCLK_P 54
PCIe reference clock (+)
PCIE_REFCLK_M 9
PCIe reference clock (-)
AI
AI
AO
AO
AI
AI
PCIe transmit (+)
PCIe transmit (-)
PCIe receive (+)
PCIe receive (-)
DO
PCIe clock request
PCIE_TX_P
PCIE_TX_M
PCIE_RX_P
PCIE_RX_M
PCIE_CLKREQ_
N
52
7
56
11
12
14
Require differential
impedance of 85 Ω.
PCIE_RST_N
DI
PCIe reset
1.8 V power domain.
PCIE_WAKE_N
13
DO
PCIe wakes up host
The following figure shows the PCIe interface connection between AF50T and AG55xQ series modules.
AF50T_Hardware_Design 21 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Figure 6: PCIe Interface Connection
To ensure the signal integrity of PCIe interface, C1 and C2 should be placed close to the AG55xQ series
module, and C3 and C4 should be placed close to the AF50T. The extra stubs of traces must be as short
as possible.
The following principles of PCIe interface design should be complied with, so as to meet PCIe Gen2
specifications.
It is important to route the PCIe signal traces as differential pairs with total grounding. And the
differential impedance is 85 Ω ±10 %.
For PCIe signal traces, the maximum length of each differential data pair (TX/RX/REFCLK) is
recommended to be less than 300 mm, and each differential data pair matching should be less than
0.7 mm (5 ps).
Spacing to all other signals (inter-interface) is four times of trace width.
Do not route signal traces under crystals, oscillators, magnetic devices, or RF signal traces. It is
important to route the PCIe differential traces in inner-layer of the PCB and surround the traces with
ground on that layer and with ground planes above and below.
3.6. BT Interface
The following figure shows the block diagram of BT interface connection between AF50T and AG55xQ
series modules.
AF50T_Hardware_Design 22 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
If BT function of AF50T module is used, the UART and PCM interfaces of AF50T must be connected to
that of AG55xQ series module.
Figure 7: Block Diagram of BT Interface Connection
3.6.1. BT_EN
BT_EN is used to control the BT function of AF50T module. BT function will be enabled when BT_EN is at
high level.
Table 7: Pin Definition of BT_EN
Pin Name
Pin No.
I/O
Description
Comment
BT_EN
83
DI
BT enable control
Active high.
3.6.2. PCM Interface*
The following table shows the pin definition of PCM interface.
Table 8: Pin Definition of PCM Interface
Pin Name
Pin No.
I/O
Description
Comment
PCM_DIN
PCM_SYNC
PCM_CLK
76
35
37
36
DI
DI
DI
PCM data input
1.8 V power domain
PCM data frame sync
1.8 V power domain
PCM clock
1.8 V power domain
PCM_DOUT
DO
PCM data output
1.8 V power domain
The following figure shows the PCM interface connection between AF50T and AG55xQ series modules.
AF50T_Hardware_Design 23 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Figure 8: PCM Interface Connection
NOTE
“*” means BT PCM interface of AF50T is still under development.
3.6.3. UART Interface
The following table shows the pin definition of UART interface.
Table 9: Pin Definition of UART Interface
Pin Name
Pin No.
I/O
Description
Comment
BT_RTS
BT_CTS
BT_TXD
BT_RXD
77
38
39
78
DO
BT UART request to send
1.8 V power domain
DI
BT UART clear to send
1.8 V power domain
DO
BT UART transmit
1.8 V power domain
DI
BT UART receive
1.8 V power domain
The following figure shows the reference design for UART interface connection between AF50T and
AG55xQ series modules.
AF50T_Hardware_Design 24 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
BT_TXD
BT_UART_RXD
BT_RXD
BT_UART_TXD
BT_RTS
BT_UART_RTS
BT_CTS
BT_UART_CTS
AG55xQ
series
AF50T
Figure 9: UART Interface Connection
3.7. Control Signal Pins*
3.7.1. SW_CTRL
The following table shows the pin definition of SW_CTRL.
Table 10: Pin Definition of SW_CTRL
Pin Name
Pin No.
I/O
Description
Comment
SW_CTRL
57
DO
Control PMIC outputs
Active high.
Under development.
The following figure shows the reference design for SW_CTRL connection between AF50T and AG55xQ
series modules.
Figure 10: SW_CTRL Connection
3.7.2. HOST_WAKEUP_BT and BT_WAKEUP_HOST
The following table shows the pin definition of HOST_WAKEUP_BT and BT_WAKEUP_HOST.
AF50T_Hardware_Design 25 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
These two pins are only used for AF50T + third-part host application. For AF50T + AG55xQ series
application, they are not needed.
Table 11: Pin Definition of HOST_WAKEUP_BT and BT_WAKEUP_HOST
Pin Name
Pin No.
I/O Description
Comment
HOST_WAKEUP_BT 23
DI
Host wakes up BT
BT_WAKEUP_HOST 22
DO BT wakes up the host
1.8 V power domain.
Under development.
1.8 V power domain.
Under development.
NOTE
“*” means under development.
3.8. Coexistence Interfaces
3.8.1. UART Coexistence Interface
The following table shows the pin definition of UART coexistence interface.
Table 12: Pin Definition of UART Coexistence Interface
Pin Name
Pin No.
I/O
Description
Comment
COEX_TXD
59
DO
LTE/WLAN & BT coexistence transmit
COEX_RXD
16
DI
LTE/WLAN & BT coexistence receive
The module supports LTE & WLAN coexistence and LTE & BT coexistence. The following figure shows
the UART coexistence interface connection between AF50T and AG55xQ series modules.
If unused, keep this pin
open.
If unused, keep this pin
open.
Figure 11: UART Coexistence Interface Connection
AF50T_Hardware_Design 26 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
3.8.2. Other Coexistence Interfaces*
The following table shows the pin definition of other coexistence interfaces.
Table 13: Pin Definition of Other Coexistence Interface
Pin Name
Pin No.
I/O Description
Comment
LAA_AS_EN
82
DI
Allow LAA to control WLAN FEM during
WLAN sleep mode
If unused, keep this pin
open.
LAA_TXEN
41
DI WLAN XFEM control LAA TX enable
LAA_RX
81
DI WLAN XFEM control for LAA receiver
WLAN_TXEN 42
DO WLAN XFEM control for WLAN TX enable
PA_MUTE
80
DI WLAN XFEM control to disable WLAN PA
If unused, keep this pin
open.
If unused, keep this pin
open.
If unused, keep this pin
open.
If unused, keep this pin
open.
NOTE
“*” means under development.
3.9. WLAN_SLP_CLK Interface
An external 32.768 kHz sleep clock connecting to WLAN_SLP_CLK is necessary. AF50T is unable to
boot up and work without sleep clock.
Table 14: Pin Definition of WLAN_SLP_CLK Interface
Pin Name
Pin No.
I/O Description
Comment
WLAN_SLP_CLK 15
DI External 32.768 kHz sleep clock input
1.8 V power domain.
AF50T_Hardware_Design 27 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
3.10. RF Antenna Interfaces
The following table shows the pin definition of RF antenna interfaces.
Table 15: Pin Definition of RF Antenna Interfaces
Pin Name
Pin No.
I/O Description
Comment
ANT_WIFI0
28
IO
BT and 2.4/5 GHz WLAN antenna interface 0 50 Ω impedance
ANT_WIFI1
33
IO
2.4/5 GHz WLAN antenna interface 1
50 Ω impedance
ANT_BT
25
IO Reserved dedicated BT antenna interface
50 Ω impedance
BT
3.10.1. Operating Frequency
Table 16: Operating Frequency of the Module
Feature
Frequency
2.4 GHz WLAN
2.412–2.472
5 GHz WLAN
5.180–5.825
2.402–2.480
Unit
GHz
GHz
GHz
3.10.2. Reference Design of RF Antenna Interfaces
AF50T module provides three RF antenna interfaces for antenna connection. A reference circuit design
for an RF antenna interface is shown below.
It is recommended to reserve a π-type and LCs matching circuit for better RF performance, and add a
TVS for ESD protection. the π-type matching components (C3, C4, and R1), the LCs (C1, C2, L1 and L2)
and TVS (D1) should be placed as close to the antenna as possible. The capacitors and inductors are not
mounted by default. the parasitic capacitance of TVS should be less than 0.05 pF
AF50T_Hardware_Design 28 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Figure 12: Reference Circuit for RF Antenna Interfaces
3.10.3. Reference Design of RF Layout
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The
impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,
the height from the reference ground to the signal layer (H), and the spacing between RF traces and
grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic
impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB
structures.
Figure 13: Microstrip Design on a 2-layer PCB
Figure 14: Coplanar Waveguide Design on a 2-layer PCB
AF50T_Hardware_Design 29 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
To ensure RF performance and reliability, the following principles should be complied with in RF layout
design:
Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to
50 Ω.
connected to ground.
The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
The distance between the RF pins and the RF connector should be as short as possible, and all the
right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
There should be clearance under the signal pin of the antenna connector or solder joint.
The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times the width of RF signal traces (2 × W).
Keep RF traces away from interference sources, and avoid intersection and paralleling between
traces on adjacent layers.
For more details about RF layout, see document [4].
AF50T_Hardware_Design 30 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
3.10.4. Antenna Requirements
The following tables show the requirements on antenna cables and antennas.
Table 17: Antenna Cable Requirements
Type
Requirements
2.412–2.472 GHz
Cable insertion loss <1 dB
5.180–5.825 GHz
Cable insertion loss <1 dB
Type
Table 18: Antenna Requirements
Frequency Range
VSWR
Gain (dBi)
Max Input Power (W)
Input Impedance (Ω)
Requirements
2.412–2.472 GHz
5.180–5.825 GHz
< 2:1 recommended
Typical 3
50
50
Polarization Type
Vertical
AF50T_Hardware_Design 31 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
3.10.5. Recommended RF Connector for Antenna Installation
If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector
provided by Hirose.
Figure 17: Dimensions of the U.FL-R-SMT Connector (Unit: mm)
U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.
Figure 18: Mechanicals of UF.L-LP Connectors (Unit: mm)
AF50T_Hardware_Design 32 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
The following figure describes the space factor of mated connector
Figure 19: Space Factor of Mated Connector (Unit: mm)
For more details, please visit http://www.hirose.com.
AF50T_Hardware_Design 33 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
4 Reliability, Radio and Electrical
Characteristics
4.1. General Description
This chapter mainly introduces electrical and radio frequency characteristics of AF50T module. The
details are listed in the subsequent chapters.
Parameter
VDD_CORE_VL
VDD_CORE_VM
VDD_CORE_VH
VDD_IO
VDD_RF
NOTE
4.2. Electrical Characteristics
The following table shows the absolute maximum ratings.
Table 19: Absolute Maximum Ratings
Min.
-0.3
-0.3
-0.3
-0.3
3.0
-0.3
Max.
Unit
VDDX + 0.2
VDDX + 0.2
VDDX + 0.2
VDDX + 0.2
4.8
V
V
V
V
V
V
Digital I/O Input Voltage
VDD_IO + 0.2
VDDX is the supply voltage associated with the input pin to which the test voltage is applied.
AF50T_Hardware_Design 34 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
The following table shows the recommended operating conditions of AF50T module.
Table 20: Recommended Operating Conditions
Max.
Unit
Typ.
0.95
1.35
1.9
1.8
3.85
1.05
1.42
2.0
1.89
4.25
Parameter
VDD_CORE_VL
VDD_CORE_VM
VDD_CORE_VH
VDD_IO
VDD_RF
Min.
0.9
1.28
1.85
1.71
3.3
4.3. I/O Interface Characteristics
The following table shows the general DC electrical characteristics over recommended operating
conditions (unless otherwise specified).
Table 21: General DC Electrical Characteristics
Symbol
Parameter
Min.
Max.
Unit
High Level Input Voltage
0.65 × VDD_IO
VDD_IO + 0.3
Low Level Input Voltage
-0.3
0.35 × VDD_IO
High Level Output Voltage
VDD_IO-0.45
VDD_IO
Low Level Output Voltage
0
Input Leakage Current
TBD
0.45
TBD
V
V
V
V
V
V
V
V
V
μA
VIH
VIL
VOH
VOL
IIL
AF50T_Hardware_Design 35 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
4.4. Current Consumption
The values of current consumption are shown as below.
Table 22: Current Consumption of the Module (Normal Operation)
Description Conditions
IVDD_
CORE_VL
IVDD_
CORE_VM
IVDD_
CORE_VH
IVDD_IO
IVDD_RF Unit
TX 1 Mbps @ 20 dBm
217.67
108.08
68.87
3.54
264.02 mA
802.11b
802.11g
802.11n
802.11a
(5 GHz)
802.11n
(5 GHz)
802.11ac
(5 GHz)
TX 11 Mbps @ 20 dBm
233.00
105.72
67.09
3.57
241.41 mA
TX 6 Mbps @ 19 dBm
213.63
108.56
69.03
3.57
260.45 mA
TX 54 Mbps @ 16 dBm
210.15
104.86
66.24
3.57
205.70 mA
TX HT20-MCS0 @ 19 dBm
211.14
108.69
69.10
3.57
259.55 mA
TX HT20-MCS7 @ 16 dBm
212.25
108.73
68.73
3.57
233.53 mA
TX HT40-MCS0 @ 19 dBm
231.78
108.56
69.23
3.54
271.37 mA
TX HT40-MCS7 @ 16 dBm
231.08
108.32
68.80
3.57
238.83 mA
TX 6 Mbps @ 17 dBm
229.91
126.78
69.15
3.79
252.32 mA
TX 54 Mbps @ 15 dBm
224.22
122.03
66.44
3.75
198.96 mA
TX HT20-MCS0 @ 17 dBm
217.62
129.90
69.17
3.79
251.08 mA
TX HT20-MCS7 @ 15 dBm
219.53
126.77
68.88
3.79
224.83 mA
TX HT40-MCS0 @ 17 dBm
234.52
126.83
69.18
3.79
254.55 mA
TX HT40-MCS7 @ 15 dBm
234.52
126.81
68.92
3.79
226.08 mA
TX VHT20 MCS0 @ 17 dBm
221.39
126.93
69.12
3.79
250.87 mA
TX VHT20 MCS8 @ 14 dBm
220.38
126.61
68.85
3.79
215.73 mA
TX VHT40 MCS0 @ 17 dBm
235.04
127.06
68.83
3.78
254.31 mA
TX VHT40 MCS9 @ 13 dBm
234.20
126.71
68.71
3.77
207.46 mA
TX VHT80 MCS0 @ 17 dBm
291.13
129.01
69.18
3.79
254.92 mA
TX VHT80 MCS9 @ 13 dBm
291.01
128.36
68.80
3.79
206.90 mA
802.11ax
TX HE20-MCS0 @ 19 dBm
221.40
131.58
68.68
3.52
259.90 mA
AF50T_Hardware_Design 36 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
(2.4 GHz)
TX HE20-MCS11 @ 14 dBm
222.32
131.51
68.60
3.57
222.00 mA
TX HE40-MCS0 @ 19 dBm
237.86
133.69
69.10
3.58
269.26 mA
TX HE40-MCS11 @ 14 dBm
238.90
133.92
68.70
3.58
224.56 mA
TX HE20-MCS0 @ 17 dBm
235.56
138.64
77.94
3.78
251.82 mA
TX HE20-MCS11 @ 12 dBm
234.59
138.54
77.64
3.79
199.67 mA
TX HE40-MCS0 @ 17 dBm
248.84
140.28
78.11
3.79
252.54 mA
TX HE40-MCS11 @ 12 dBm
248.43
139.83
77.72
3.79
200.42 mA
TX HE80-MCS0 @ 17 dBm
299.44
143.77
78.14
3.79
253.93 mA
TX HE80-MCS11 @ 12 dBm
306.87
143.34
77.80
3.79
198.52 mA
802.11ax
(5 GHz)
4.5. RF Performances
The following tables summarize the transmitting and receiving performances of AF50T.
4.5.1. Conducted RF Performance of Wi-Fi
Table 23: Conducted RF Output Power at 2.4 GHz (SISO)
Frequency
Min.
Typ.
Max.
802.11b @ 1 Mbps
802.11b @ 11 Mbps
802.11g @ 6 Mbps
802.11g @ 54 Mbps
802.11n, HT20 @ MCS0
802.11n, HT20 @ MCS7
802.11n, HT40 @ MCS0
802.11n, HT40 @ MCS7
802.11ax, HE20 @ MCS0
18
18
17
14
17
14
17
14
17
20
20
19
16
19
16
19
16
19
22
22
21
18
21
18
21
18
21
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
AF50T_Hardware_Design 37 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Table 24: Conducted RF Output Power at 2.4 GHz (MIMO)
Frequency
Min.
Typ.
Max.
802.11ax, HE20 @ MCS11
802.11ax, HE40 @ MCS0
802.11ax, HE40 @ MCS11
12
17
12
802.11n, HT20 @ MCS0
802.11n, HT20 @ MCS7
802.11n, HT40 @ MCS0
802.11n, HT40 @ MCS7
802.11ax, HE20 @ MCS0
802.11ax, HE20 @ MCS11
802.11ax, HE40 @ MCS0
802.11ax, HE40 @ MCS11
802.11a @ 6 Mbps
802.11a @ 54 Mbps
802.11n, HT20 @ MCS0
802.11n, HT20 @ MCS7
802.11n, HT40 @ MCS0
802.11n, HT40 @ MCS7
802.11ac, VHT20 @ MCS0
802.11ac, VHT20 @ MCS8
20
17
20
17
20
15
20
15
15
13
15
13
15
13
15
12
14
19
14
22
19
22
19
22
17
22
17
17
15
17
15
17
15
17
14
16
21
16
24
21
24
21
24
19
24
19
19
17
19
17
19
17
19
16
dBm
dBm
dBm
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Table 25: Conducted RF Output Power at 5 GHz (SISO)
Frequency
Min.
Typ.
Max.
AF50T_Hardware_Design 38 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
802.11ac, VHT40 @ MCS0
802.11ac, VHT40 @ MCS9
802.11ac, VHT80 @ MCS0
802.11ac, VHT80 @ MCS9
802.11ax, HE20 @ MCS0
802.11ax, HE20 @ MCS11
802.11ax, HE40 @ MCS0
802.11ax, HE40 @ MCS11
802.11ax, HE80 @ MCS0
802.11ax, HE80 @ MCS11
802.11n, HT20 @ MCS0
802.11n, HT20 @ MCS7
802.11n, HT40 @ MCS0
802.11n, HT40 @ MCS7
802.11ac, VHT20 @ MCS0
802.11ac, VHT20 @ MCS8
802.11ac, VHT40 @ MCS0
802.11ac, VHT40 @ MCS9
802.11ac, VHT80 @ MCS0
802.11ac, VHT80 @ MCS9
802.11ax, HE20 @ MCS0
802.11ax, HE20 @ MCS11
15
11
15
11
15
10
15
10
15
10
18
16
18
16
18
15
18
14
18
14
18
13
17
13
17
13
17
12
17
12
17
12
20
18
20
18
20
17
20
16
20
16
20
15
19
15
19
15
19
14
19
14
19
14
22
20
22
20
22
19
22
18
22
18
22
17
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Table 26: Conducted RF Output Power at 5 GHz (MIMO)
Frequency
Min.
Typ.
Max.
AF50T_Hardware_Design 39 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
802.11ax, HE40 @ MCS0
802.11ax, HE40 @ MCS11
802.11ax, HE80 @ MCS0
802.11ax, HE80 @ MCS11
18
13
18
13
22
17
22
17
dBm
dBm
dBm
dBm
Table 27: Conducted RF Receiving Sensitivity at 2.4 GHz
Frequency
Receiving Sensitivity (Typ.)
20
15
20
15
-96 dBm
-87 dBm
-92 dBm
-74 dBm
-92 dBm
-73 dBm
-89 dBm
-71 dBm
-92 dBm
-62 dBm
-89 dBm
-60 dBm
-92 dBm
-75 dBm
-92 dBm
802.11b @ 1 Mbps
802.11b @ 11 Mbps
802.11g @ 6 Mbps
802.11g @ 54 Mbps
802.11n, HT20 @ MCS0
802.11n, HT20 @ MCS7
802.11n, HT40 @ MCS0
802.11n, HT40 @ MCS7
802.11ax, HE20 @ MCS0
802.11ax, HE20 @ MCS11
802.11ax, HE40 @ MCS0
802.11ax, HE40 @ MCS11
802.11a @ 6 Mbps
802.11a @ 54 Mbps
802.11n, HT20 @ MCS0
Table 28: Conducted RF Receiving Sensitivity at 5 GHz
Frequency
Receiving Sensitivity (Typ.)
AF50T_Hardware_Design 40 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
802.11n, HT20 @ MCS7
802.11n, HT40 @ MCS0
802.11n, HT40 @ MCS7
802.11ac, VHT20 @ MCS0
802.11ac, VHT20 @ MCS8
802.11ac, VHT40 @ MCS0
802.11ac, VHT40 @ MCS9
802.11ac, VHT80 @ MCS0
802.11ac, VHT80 @ MCS9
802.11ax, HE20 @ MCS0
802.11ax, HE20 @ MCS11
802.11ax, HE40 @ MCS0
802.11ax, HE40 @ MCS11
802.11ax, HE80 @ MCS0
802.11ax, HE80 @ MCS11
-74 dBm
-90 dBm
-72 dBm
-93 dBm
-71 dBm
-90 dBm
-67 dBm
-87 dBm
-62 dBm
-93 dBm
-63 dBm
-90 dBm
-60 dBm
-87 dBm
-56 dBm
4.5.2. Conducted RF Performance of Bluetooth
Table 29: Conducted RF Performance of Bluetooth
Frequency
BR
EDR(π/4-DQPSK)
BLE(1M)
8
6
6
Transmitting
Power (Typ.)
Transmitting
Power (Max.)
Receiving
Sensitivity (Typ.)
10
10
10
-93
-92
-97
Unit
dBm
dBm
dBm
dBm
EDR(8-DPSK)
6
10
-86
AF50T_Hardware_Design 41 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
4.6. Electrostatic Discharge
The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module electrostatic discharge characteristics.
Table 30: Electrostatic Discharge Characteristics
Tested Interfaces
Contact Discharge
Air Discharge
Unit
VDD, GND
All Antenna Interfaces
±5
±6
Other Interfaces
±0.5
±10
±10
±1
kV
kV
kV
AF50T_Hardware_Design 42 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
5 Mechanical Dimensions
This chapter describes the mechanical dimensions of AF50T module. All dimensions are measured in
millimeter (mm), and the dimensional tolerances are ±0.05 mm unless otherwise specified.
5.1. Mechanical Dimensions of the Module
Figure 20: AF50T Top and Side Dimensions
AF50T_Hardware_Design 43 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Figure 21: AF50T Bottom Dimension (Bottom View)
The package warpage level of the module conforms to JEITA ED-7306 standard.
NOTE
AF50T_Hardware_Design 44 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
5.2. Recommended Footprint
Figure 22: Recommended Footprint (Bottom View)
NOTES
other components on host PCB.
2. Keep all RESERVED pins open.
1. For easy maintenance of the module, please keep about 3mm spaces between the module and
AF50T_Hardware_Design 45 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
5.3. Top and Bottom Views of the Module
Figure 23: Top View of the Module
Figure 24: Bottom View of the Module
NOTE
Images above are for illustration purpose only and may differ from the actual module. For authentic
appearance and label, please refer to the module received from Quectel.
AF50T_Hardware_Design 46 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
6 Storage, Manufacturing and
Packaging
6.1. Storage
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity
2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
should be 35 %–60 %.
3. The floor life of the module is 168 hours 1) in a plant where the temperature is 23 ±5 °C and relative
humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the
module should be stored in an environment where the relative humidity is less than 10 % (e.g. a
drying cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
The module is not stored in Recommended Storage Condition;
Violation of the third requirement above occurs;
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
Before module repairing.
If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 ±5 °C;
All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be
put in a dry environment such as in a drying oven.
5.
AF50T_Hardware_Design 47 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
NOTES
1. 1) This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033.
2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules
to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or
the relative moisture is over 60 %, it is recommended to start the solder reflow process within 24
hours after the package is removed. And do not remove the packages of tremendous modules if they
are not ready for soldering.
3. Take the module out of the packaging and put it on high-temperature resistant fixtures before baking.
If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
6.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness
of stencil for the module is recommended to be 0.13–0.15 mm. For more details, see document [5].
It is suggested that the peak reflow temperature is 238 °C to 246 ºC, and the absolute maximum reflow
temperature is 246 ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C)
246
238
220
200
150
100
Soak Zone
A
Max slope: 1 to 3°C/s
Reflow Zone
Max slope:
2 to 3°C/s
C
Cooling down slope:
-1.5 to -3°C/s
B
D
Figure 25: Recommended Reflow Soldering Thermal Profile
AF50T_Hardware_Design 48 / 52
Factor
Soak Zone
Max slope
Reflow Zone
Max slope
Reflow time (D: over 220 °C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTES
Wi-Fi&BT Module Series
AF50T Hardware Design
Table 31: Recommended Thermal Profile Parameters
Soak time (between A and B: 150 °C and 200 °C)
70–120 s
Recommendation
1–3 °C/s
2–3 °C/s
45–70 s
238 °C to 246 °C
-1.5 to -3 °C/s
1
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly
identifiable and the QR code is still readable, although white rust may be found.
If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
3.
6.3. Packaging
AF50T module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be
opened until the devices are ready to be soldered onto the application.
AF50T is packaged in tape and reel carriers.
AF50T_Hardware_Design 49 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Table 32: Reel Packaging
Model Name MOQ for MP Minimum Package: TBD
Minimum Package TBD
AF50T
TBD
Size: TBD
N.W: TBD
G.W: TBD
Size: TBD
N.W: TBD
G.W: TBD
AF50T_Hardware_Design 50 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
7 Appendix A References
Table 33: Related Documents
SN Document Name
Description
[1] Quectel_LTE_OPEN_EVB_User_Guide
EVB user guide for Quectel
LTE-QuecOpen modules
[2] Quectel_UMTS<E_EVB_User_Guide
UMTS<E EVB user guide
[3] Quectel_AG55xQ_Series_QuecOpen_Reference_Design AG55xQ series reference design
[4] Quectel_RF_Layout_Application_Note
RF layout application note
[5] Quectel_Module_Secondary_SMT_User_Guide
Module secondary SMT user guide
Table 34: Terms and Abbreviations
Abbreviation
Description
Access Point
Binary Phase Shift Keying
Bluetooth
Complementary Code Keying
Clear To Send
Electrostatic Discharge
Ground
High Throughput
Input Leakage Current
Input/Output
Institute of Electrical and Electronics Engineers
AP
BPSK
BT
CCK
CTS
ESD
GND
HT
IEEE
IIL
I/O
AF50T_Hardware_Design 51 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
LTE
Mbps
MCS
MOQ
PCB
PCM
QAM
QPSK
RF
RH
RoHS
RTS
RX
SDIO
TBD
TX
UART
USB
VHT
VIHmax
VIHmin
VILmax
VILmin
VOLmax
VOHmin
Long Term Evolution
Megabits per second
Modulation and Coding Scheme
Minimum Order Quantity
Printed Circuit Board
Pulse Code Modulation
Quadrature Amplitude Modulation
Quadrature Phase Shift Keying
Radio Frequency
Relative Humidity
Request To Send
Receive
Secure Digital Input/Output
To Be Determined
Transmit
Universal Serial Bus
Very High Throughput
Restriction of Hazardous Substances
Maximum Input High Level Voltage Value
Minimum Input High Level Voltage Value
Maximum Input Low Level Voltage Value
Minimum Input Low Level Voltage Value
Maximum Output Low Level Voltage Value
Minimum Output High Level Voltage Value
Universal Asynchronous Receiver/Transmitter
AF50T_Hardware_Design 52 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
Voltage Standing Wave Ratio
Wireless-Fidelity
Wireless Local Area Network
VSWR
Wi-Fi
WLAN
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based timeaveraging
duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and
must not transmit simultaneously with any other antenna or transmitter.
3. A label with the following statements must be attached to the host end product: This device contains FCC ID:
XMR202102AF50T
4. This module must not transmit simultaneously with any other antenna or transmitter
5. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to
satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining
to the OEM the labeling requirements, options and OEM user manual instructions that are required (see
next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC
ID: XMR202102AF50T” or “Contains FCC ID: XMR202102AF50T” must be used. The host OEM user
manual must also contain clear instructions on how end users can find and/or access the module and the
FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
AF50T_Hardware_Design 53 / 52
Wi-Fi&BT Module Series
AF50T Hardware Design
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user
that changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment. In cases where the manual is provided only in a form other
than paper, such as on a computer disk or over the Internet, the information required by this section may
be included in the manual in that alternative form, provided the user can reasonably be expected to have
the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously
authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without
a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring
that the after the module is installed and operational the host continues to be compliant with the Part 15B
unintentional radiator requirements.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Wireless Access Systems including Radio Local Area Networks (WAS/RLANs) frequency range 5150 – 5350 MHz is
Restricted to indoor use in EU, this device contains 5150-5250 MHz.
AF50T_Hardware_Design 54 / 52
1 2 3 | Confidentiality | Cover Letter(s) | 22.01 KiB | July 22 2021 / July 28 2021 |
Quectel Wireless Solutions Company Limited
Request for Confidentiality
Date: _2021/06/22_
Subject: Confidentiality Request for: _____ FCC ID: XMR202102AF50T ______
Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the
subject FCC application be held confidential.
Type of Confidentiality Requested
Short Term
Short Term
Short Term
Short Term
Short Term
Short Term
Short Term
Short Term
Short Term
Permanent
Permanent*1
Permanent
Permanent
Permanent
Permanent
Permanent*
Exhibit
Block Diagrams
External Photos
Internal Photos
Operation Description/Theory of Operation
Parts List & Placement/BOM
Tune-Up Procedure
Schematics
Test Setup Photos
User’s Manual
*Note: ______(Insert Explanation as Necessary)______
______ FCC ID: XMR202102AF50T _____ has spent substantial effort in developing this product and it is
one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the
advantage they have achieved by developing this product. Not protecting the details of the design will result in financial
hardship.
Permanent Confidentiality:
The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public
review due to materials that contain trade secrets and proprietary information not customarily released to the public.
Short-Term Confidentiality:
The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period
of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid
premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also
aware that they are responsible to notify TCB in the event information regarding the product or the product is made
available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public
Notice DA 04-1705.
NOTE for Industry Canada Applications:
The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality,
either type of marked exhibit above will simply be marked Confidential when submitted to IC.
Sincerely,
By:
(Signature/Title2)
Jean Hu
(Print name)
1 2 3 | Letter Authorization | Cover Letter(s) | 16.83 KiB | July 22 2021 / July 28 2021 |
C5266091_X8_Ed.1 Letter of Authorization Quectel Wireless Solutions Co., Ltd Company:
Quectel Wireless Solutions Co., Ltd Building 5, Shanghai Business Park Phase III Address:
(Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 Product Name: Wi-Fi&BT module Model Number: AF50T FCC Identifier: XMR202102AF50T We authorize LGAI Technological Center S.A., Ronda de la Font del Carme, s/n, 08193 Bellaterra, Spain, to act on our behalf on all matters concerning the above named equipment. Any individual within LGAI Technological Center S.A. is authorized to act on our behalf and take action on the application. We declare that authorize LGAI Technological Center S.A., Ronda de la Font del Carme, s/n, 08193 Bellaterra, Spain, information related to the approval project to the Federal Communication Commission and to discuss any issues concerning the approval application. Any and all acts carried out by LGAI Technological Center S.A. on our behalf shall have the same effect as acts of our own. is allowed to forward all Name:Jean Hu Date: 2021/06/22 Title: Project Manager Signature of applicant:
1/1
1 2 3 | Module Approval Request | Cover Letter(s) | 125.91 KiB | July 22 2021 / July 28 2021 |
Quectel Wireless Solutions Company Limited
Declaration of the Modular Approval
Applicant / Grantee
FCC ID:
Model:
The single module transmitter has been evaluated then tested meeting the
requirements under Part 15C Section 212 as below:
Quectel Wireless Solutions Company Limited
XMR202102AF50T
AF50T
Modular approval requirement
(a) The radio elements of the modular transmitter
must have their own shielding. The physical
crystal and tuning capacitors may be located
external to the shielded radio elements.
EUT Condition
The radio elements of the
modular transmitter have their
own shielding.
Comply
YES
(b)
The modular
transmitter must
have
buffered modulation/data inputs (if such inputs are
provided) to ensure that the module will comply
with part 15 requirements under conditions of
excessive data rates or over-modulation.
(c)The modular transmitter must have its
own power supply regulation.
(d)
The modular
antenna must
transmitter must
the antenna and
comply
with
transmission system
requirements of Sections 15.203, 15.204(b) and
15.204(c). The
be
“unique”
permanently attached or employ a
antenna coupler (at all connections between the
module and the antenna, including the cable). The
installation” provision of Section
“professional
15.203 is not applicable to modules but can apply
to limited modular approvals under paragraph (b)
of this section.
either
(e)The modular
be
transmitter must
tested
in a stand-alone configuration, i.e., the module
must not be inside another device during testing for
compliance with part 15 requirements. Unless
the transmitter module will be battery powered, it
must comply with
line conducted
requirements found in Section 15.207. AC or DC
the AC
The modular has buffered data
inputs, it is integrated in chip.
Please see schematic.pdf
YES
All power lines derived from the
host device are regulated before
energizing other circuits internal
to SMART MODULE . Please
see schematic.pdf
the modular has specific antenna
with unique antenna connector,
refer to external photos.
YES
YES
SMART MODULE was tested in
a stand‐alone configuration via
a PCMCIA extender. Please see
spurious set‐up
YES
Quectel Wireless Solutions Company Limited
power lines and data input/output lines connected
to the module must not contain ferrites, unless they
will be marketed with the module (see Section
15.27(a)). The length of these lines shall be the
length typical of actual use or, if that length is
unknown, at least 10 centimeters to insure that
there is no coupling between the case of the
module
Any
accessories, peripherals, or support equipment
connected to the module during testing shall be
unmodified and commercially available
(see
Section 15.31(i)) must not be in side another
device during testing.
equipment.
supporting
and
(f)The
modular
be
transmitter
equipped with either a permanently affixed label
or must be capable of electronically displaying
its FCC identification number.
must
(g) The modular transmitter must comply
with any specific rules or operating requirements
that ordinarily apply to a complete transmitter and
the manufacturer must provide adequate
instructions along with the module to explain any
suchrequirements. A copy of these instructions
must be included in the application for
equipmentauthorizationrequirements,whicharebas
edon theintendeduse/configurations.
(h)The modular transmitter must comply
with any applicable RF exposure requirements in
its final configuration.
The label position of SMART
MODULE is clearly indicated. If
the FCC ID of the module cannot
be seen when it is installed, then
the host label must include the
text: Contains FCC ID:
XMR202102AF50T. Please
see the label.pdf
SMART MODULE is compliant
with all applicable FCC rules.
Detail instructions are given in
the User Manual.
YES
YES
SMART MODULE is approved
to comply with the applicable RF
exposure requirement, please
see the MPE evaluation with
20cm as the distance restriction.
YES
Quectel Wireless Solutions Company Limited
Quectel Wireless Solutions Company Limited
2021/06/22
2021/0
Signature
Signature
Title: Project Manager
Dated
By:
Jean Hu
Printed
Printed
On behalf of :
Quectel Wireless Solutions Company Limited
Quectel Wireless Solutions Company Limited
Telephone:
+86-21
21-51086236 ext 6511
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2021-07-28 | 5745 ~ 5825 | NII - Unlicensed National Information Infrastructure TX | Original Equipment |
2 | 2412 ~ 2462 | DTS - Digital Transmission System | ||
3 | 2402 ~ 2480 | DSS - Part 15 Spread Spectrum Transmitter |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 3 | Effective |
2021-07-28
|
||||
1 2 3 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
1 2 3 | FCC Registration Number (FRN) |
0018988279
|
||||
1 2 3 | Physical Address |
Building 5, Shanghai Business Park PhaseIII (Area B),No.1016 Tianlin Road, Minhang District
|
||||
1 2 3 |
Building 5, Shanghai Business Park PhaseIII
|
|||||
1 2 3 |
Shanghai, N/A
|
|||||
1 2 3 |
China
|
|||||
app s | TCB Information | |||||
1 2 3 | TCB Application Email Address |
e******@applus.com
|
||||
1 2 3 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 2 3 | Grantee Code |
XMR
|
||||
1 2 3 | Equipment Product Code |
202102AF50T
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 3 | Name |
J**** H******
|
||||
1 2 3 | Telephone Number |
+8602******** Extension:
|
||||
1 2 3 | Fax Number |
+8621********
|
||||
1 2 3 |
j******@quectel.com
|
|||||
app s | Technical Contact | |||||
1 2 3 | Firm Name |
TA Technology(Shanghai) Company, Limited
|
||||
1 2 3 | Name |
K****** X********
|
||||
1 2 3 | Physical Address |
Shanghai
|
||||
1 2 3 |
China
|
|||||
1 2 3 | Telephone Number |
86-21******** Extension:
|
||||
1 2 3 |
x******@ta-shanghai.com
|
|||||
app s | Non Technical Contact | |||||
1 2 3 | Firm Name |
TA Technology(Shanghai) Company, Limited
|
||||
1 2 3 | Name |
J******** H******
|
||||
1 2 3 | Physical Address |
Shanghai
|
||||
1 2 3 |
China
|
|||||
1 2 3 | Telephone Number |
86-21******** Extension:
|
||||
1 2 3 |
h******@ta-shanghai.com
|
|||||
app s | Confidentiality (long or short term) | |||||
1 2 3 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 3 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 3 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 3 | Equipment Class | NII - Unlicensed National Information Infrastructure TX | ||||
1 2 3 | DTS - Digital Transmission System | |||||
1 2 3 | DSS - Part 15 Spread Spectrum Transmitter | |||||
1 2 3 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Wi-Fi&BT module | ||||
1 2 3 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | Yes | ||||
1 2 3 | Modular Equipment Type | Single Modular Approval | ||||
1 2 3 | Purpose / Application is for | Original Equipment | ||||
1 2 3 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 3 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 3 | Grant Comments | Output power listed is conducted.The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons. End-users must be provided with operating procedures for satisfying RF exposure compliance. Operation of this device is restricted to indoor use only. The device contains 20MHz, 40MHz and 80MHz. | ||||
1 2 3 | Output power listed is conducted. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons. End-users must be provided with operating procedures for satisfying RF exposure compliance.The device contains 20MHz and 40MHz bandwidth. | |||||
1 2 3 | Output power listed is conducted. | |||||
1 2 3 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 3 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 3 | Firm Name |
TA Technology (Shanghai) Co., Ltd.
|
||||
1 2 3 | Name |
M****** L****
|
||||
1 2 3 | Telephone Number |
86-21********
|
||||
1 2 3 |
l******@ta-shanghai.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15E | 38 CC | 5180 | 5240 | 0.1014 | |||||||||||||||||||||||||||||||||||
1 | 2 | 15E | 38 CC ND | 5260 | 5320 | 0.1167 | |||||||||||||||||||||||||||||||||||
1 | 3 | 15E | 38 CC ND | 5500 | 5720 | 0.1047 | |||||||||||||||||||||||||||||||||||
1 | 4 | 15E | 38 CC | 5745 | 5825 | 0.1028 | |||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15C | CC | 2402 | 2480 | 0.1637 | |||||||||||||||||||||||||||||||||||
2 | 2 | 15C | CC | 2412 | 2462 | 0.0084 | |||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
3 | 1 | 15C | CC | 2402.00000000 | 2480.00000000 | 0.0070000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC