FCC ID: XMR202102FC21 Wi-Fi&BT module

 

FC21 Hardware Design

Wi-Fi&BT Module Series

Version: 1.0

Date: 2020-08-13

Status: Preliminary

www.quectel.com

 Wi-Fi&BT Module Series

FC21 Hardware Design

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FC21_Hardware_Design 1 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

About the Document

1.0

Revision History

Version Date

Author

Description

2020-08-13

Power JIN/Kris ZHANG

Initial

FC21_Hardware_Design 2 / 52

 Wi-Fi&BT Module Series

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Contents

About the Document .............................................................................................................................. 2

Contents ................................................................................................................................................. 3

Table Index ............................................................................................................................................. 5

Figure Index ............................................................................................................................................ 6

1

Introduction ..................................................................................................................................... 7

1.1. Safety Information ................................................................................................................... 8

2 Product Concept ............................................................................................................................. 9

2.1 General Description ................................................................................................................ 9

Key Features .......................................................................................................................... 9

2.2

Functional Diagram ............................................................................................................... 11

2.3

Evaluation Board .................................................................................................................. 12

2.4

3 Application Interfaces ................................................................................................................... 13

3.1. General Description .............................................................................................................. 13

3.2. Pin Assignment ..................................................................................................................... 14

3.3. Pin Description ..................................................................................................................... 15

3.4. Power Supply ....................................................................................................................... 19

3.4.1. Pin Introduction .......................................................................................................... 19

3.5. Wireless Connectivity Interfaces ........................................................................................... 20

3.5.1. Wi-Fi Interface ............................................................................................................ 20

3.5.1.1. WAKE_ON_WIRELESS .................................................................................... 21

3.5.1.2. WAKE_EN ........................................................................................................ 21

3.5.1.3. SDIO Interface .................................................................................................. 22

3.5.2. BT Interface* .............................................................................................................. 23

3.5.2.1. BT_EN .............................................................................................................. 23

3.5.2.2. BT_WAKE_HOST ............................................................................................. 24

3.5.2.3. PCM Interface ................................................................................................... 24

3.5.2.4. BT_UART Interface ........................................................................................... 25

3.5.3. Coexistence Interface ................................................................................................. 26

3.6. Other Interfaces .................................................................................................................... 27

3.6.1. DBG_TXD Interface ................................................................................................... 27

32KHz_IN Interface .................................................................................................... 27

3.6.2.

3.7. Antenna Interface ................................................................................................................. 28

3.7.1. Pin Definition of RF Antenna Interface ........................................................................ 28

3.7.2. Operating Frequency .................................................................................................. 28

3.7.3. Reference Designs ..................................................................................................... 28

3.7.4. Reference Design of RF Layout ................................................................................. 29

3.7.5. Antenna Requirements ............................................................................................... 31

3.7.6. Recommended RF Connector for Antenna Installation ............................................... 32

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 Wi-Fi&BT Module Series

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4 Electrical, Reliability and Radio Characteristics ......................................................................... 34

4.1. General Description .............................................................................................................. 34

4.2. Electrical Characteristics ....................................................................................................... 34

I/O Interface Characteristics .................................................................................................. 35

4.3.

4.4. Current Consumption ............................................................................................................ 35

4.4.1. Wi-Fi Current Consumption ........................................................................................ 35

4.4.2. BLE Current Consumption .......................................................................................... 37

4.5. RF Performance ................................................................................................................... 37

4.5.1. Wi-Fi Performance ..................................................................................................... 37

4.5.2. BLE Performance ....................................................................................................... 39

4.6. Electrostatic Discharge ......................................................................................................... 40

5 Mechanical Dimensions ................................................................................................................ 41

5.1. Mechanical Dimensions of the Module .................................................................................. 41

5.2. Recommended Footprint and Stencil Design......................................................................... 43

5.3. Top and Bottom Views of the Module .................................................................................... 45

6 Storage, Manufacturing and Packaging ....................................................................................... 46

6.1. Storage ................................................................................................................................. 46

6.2. Manufacturing and Soldering ................................................................................................ 47

6.3. Packaging ............................................................................................................................. 49

7 Appendix A References ................................................................................................................ 50

FC21_Hardware_Design 4 / 52

 Wi-Fi&BT Module Series

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Table Index

Table 1: FC21 Module ............................................................................................................................. 7

Table 2: Key Features ............................................................................................................................. 9

Table 3: I/O Parameters Definition ......................................................................................................... 15

Table 4: Pin Description of FC21 Module ............................................................................................... 15

Table 5: Power Supply Pins and GND Pins ............................................................................................ 19

Table 6: Pin Definition of WAKE_ON_WIRELESS ................................................................................. 21

Table 7: Pin Definition of WLAN_EN ...................................................................................................... 21

Table 8: Pin Definition of SDIO Interface ................................................................................................ 22

Table 9: Pin Definition of BT_EN............................................................................................................ 23

Table 10: Pin Definition of BT_WAKE_HOST ......................................................................................... 24

Table 11: Pin Definition of PCM Interface ............................................................................................... 24

Table 12: Pin Definition of UART Interface ............................................................................................. 25

Table 13: Pin Definition of Coexistence Interface ................................................................................... 26

Table 14: Pin Definition of DBG_TXD Interface ...................................................................................... 27

Table 15: Pin Definition of 32KHz_IN Interface ...................................................................................... 27

Table 16: Pin Definition of RF Antenna Interface .................................................................................... 28

Table 17: Operating Frequency ............................................................................................................. 28

Table 18: Antenna Cable Requirements ................................................................................................. 31

Table 19: Antenna Requirements ........................................................................................................... 32

Table 20: Absolute Maximum Ratings .................................................................................................... 34

Table 21: Recommended Operating Conditions ..................................................................................... 35

Table 22: General DC Electrical Characteristics ..................................................................................... 35

Table 23: Wi-Fi Current Consumption .................................................................................................... 35

Table 24: BLE Current Consumption During Non-signaling .................................................................... 37

Table 25: Conducted RF Output Power at 2.4GHz ................................................................................. 37

Table 26: Conducted RF Output Power at 5GHz .................................................................................... 38

Table 27: Conducted RF Receiving Sensitivity at 2.4GHz ...................................................................... 38

Table 28: Conducted RF Receiving Sensitivity at 5GHz ......................................................................... 39

Table 29: BLE Transmitting and Receiving Performance........................................................................ 39

Table 30: Electrostatic Discharge Characteristics (25ºC, 45% Relative Humidity) .................................. 40

Table 31: Recommended Thermal Profile Parameters ........................................................................... 48

Table 32: Related Documents ................................................................................................................ 50

Table 33: Terms and Abbreviations ........................................................................................................ 50

FC21_Hardware_Design 5 / 52

 Wi-Fi&BT Module Series

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Figure Index

Figure 1: Functional Diagram of FC21 Module....................................................................................... 11

Figure 2: Pin Assignment of FC21 Module ............................................................................................. 14

Figure 3: Reference Circuit for VDD_3V3 .............................................................................................. 19

Figure 4: Timing of Turning on/off FC21 Module .................................................................................... 20

Figure 5: Wi-Fi Interface Connection ..................................................................................................... 20

Figure 6: SDIO Interface Connection ..................................................................................................... 22

Figure 7: Block Diagram of BT Interface Connection ............................................................................. 23

Figure 8: Reference Design for PCM Interface ...................................................................................... 25

Figure 9: Reference Design for UART Interface Connection .................................................................. 25

Figure 10: Coexistence Interface Connection ........................................................................................ 26

Figure 11: Reference Circuit for RF Antenna Interface ........................................................................... 29

Figure 12: Reference Circuit for RF Antenna Interface (Vehicle Applications) ........................................ 29

Figure 13: Microstrip Design on a 2-layer PCB ...................................................................................... 30

Figure 14: Coplanar Waveguide Design on a 2-layer PCB ..................................................................... 30

Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 30

Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 31

Figure 17: Dimensions of the U.FL-R-SMT Connector (Unit: mm) .......................................................... 32

Figure 18: Mechanicals of U.FL-LP Connectors ..................................................................................... 33

Figure 19: Space Factor of Mated Connector (Unit: mm) ....................................................................... 33

Figure 20: Top and Side Dimensions ..................................................................................................... 41

Figure 21: Bottom Dimensions .............................................................................................................. 42

Figure 22: Recommended Footprint ...................................................................................................... 43

Figure 23: Recommended Stencil Design .............................................................................................. 44

Figure 24: Top View of the Module ......................................................................................................... 45

Figure 25: Bottom View of the Module ................................................................................................... 45

Figure 26: Recommended Reflow Soldering Thermal Profile ................................................................. 47

Figure 27: Tape Dimensions .................................................................................................................. 49

Figure 28: Reel Dimensions .................................................................................................................. 49

FC21_Hardware_Design 6 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

1 Introduction

This document defines the FC21 module and describes its air interface and hardware interfaces which

are connected to the customers’ applications.

The document can help customers quickly understand module interface specifications, electrical and

mechanical details, as well as other related information of the module. In combination with Quectel

EC2x&EG2X-G1) modules, FC21 module can help customers to design and set up LTE+Wi-Fi/BT

applications easily.

Table 1: FC21 Module

Wi-Fi

2.4GHz and 5GHz

BT

BT 4.2

1) In this document, EC2x refers to Quectel EC25, EC21 and EC20 R2.1 modules and EG2x-G refers to

Quectel EG21-G and EG25-G modules.

Module

FC21

NOTE

FC21_Hardware_Design 7 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service

or repair of any cellular terminal or mobile incorporating FC21 module. Manufacturers of the cellular

terminal should notify users and operating personnel of the following safety information by incorporating

these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’

failure to comply with these precautions.

Full attention must be paid to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. Please comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation

of wireless appliances in an aircraft is forbidden to prevent interference with

communication systems. If there is an Airplane Mode, it should be enabled prior to

boarding an aircraft. Please consult the airline staff for more restrictions on the use

of wireless devices on an aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in

hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signal and cellular network

cannot be guaranteed to connect in certain conditions, such as when the mobile bill

is unpaid or the (U)SIM card is invalid. When emergent help is needed in such

conditions, use emergency call if the device supports it. In order to make or receive

a call, the cellular terminal or mobile must be switched on in a service area with

adequate cellular signal strength. In an emergency, the device with emergency call

function cannot be used as the only contact method considering network

connection cannot be guaranteed under all circumstances.

The cellular terminal or mobile contains a transceiver. When it is ON, it receives

and transmits radio frequency signals. RF interference can occur if it is used close

to TV sets, radios, computers or other electric equipment.

In locations with explosive or potentially explosive atmospheres, obey all posted

signs and turn off wireless devices such as mobile phone or other cellular

terminals. Areas with explosive or potentially explosive atmospheres include

fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,

and areas where the air contains chemicals or particles such as grain, dust or

metal powders.

FC21_Hardware_Design 8 / 52

批注 [RL1]: 这里面不要加上

FC21 模块为贴片式模块，共

有 38 个 LCC 引脚和 14 个 LGA

引脚；模块封装紧凑，尺寸仅

为 16.6 mm × 13 mm × 2.1

mm。

批注 [RL2]: 中文这里没加星

号，中文是否要加上

批注 [RL3]: 中文这里没有这一

条，中文是否要加上

Wi-Fi&BT Module Series

FC21 Hardware Design

2 Product Concept

2.1 General Description

FC21 is a low-power cost-effective Wi-Fi/BT module based on QCA1023. FC21 supports 1×1 IEEE

802.11a/b/g/n/ac WLAN standards and BT 4.2 (BLE and SPP) and provides a low-power SDIO 3.0

interface for Wi-Fi and UART&PCM interfaces for BT*, and also supports LTE/WLAN coexistence.

FC21 module is a SMT module, with 38 LCC pins and 14 LGA pins. The module package is compact and

the size is only 16.6mm × 13mm × 2.1mm.

1. “*” means under development.

2. BLE function of FC21 module is available.

NOTES

2.2 Key Features

The following table describes the detailed features of FC21 module.

Table 2: Key Features

Features

Description

Power Supply

VDD_3V3 Power Supply:

Voltage Range: 3.14V~3.46V

Typical voltage: 3.3V

I/O supply voltage:

Voltage Range: 1.71V~3.46V

Typical voltage: 1.8V

54Mbps

Wi-Fi Data Rates

 802.11b: 1Mbps, 2Mbps, 5.5Mbps, 11Mbps

 802.11g: 6Mbps, 9Mbps, 12Mbps, 18Mbps, 24Mbps, 36Mbps, 48Mbps,

FC21_Hardware_Design 9 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

 802.11n

(20MHz): 7.2Mbps, 14.2Mbps, 21.7Mbps, 28.9Mbps,

43.3Mbps, 57.8Mbps, 65Mbps, 72.2Mbps

 802.11n (40MHz): 15Mbps, 30Mbps, 45Mbps, 60Mbps, 90Mbps,

 802.11a: 6Mbps, 9Mbps, 12Mbps, 18Mbps, 24Mbps, 36Mbps, 48Mbps,

 802.11ac: VHT20 (MCS0~MCS8), VHT40 (MCS0~MCS9), VHT80

120Mbps, 150Mbps

54Mbps

(MCS0~MCS9)

Wi-Fi Transmitting

Power

 TBD

Wi-Fi Protocol Features 

IEEE 802.11a/b/g/n/ac

Wi-Fi Modulation

 BPSK, QPSK, CCK, 16QAM, 64QAM, 256QAM

Wi-Fi Operation Modes

BT Protocol Features

 AP

 STA

 GATT*

 SPP*

BT Operation Modes

 BT* BLE

BT Modulation

 GFSK, 8-DPSK,π/4-DQPSK

Wireless Connectivity

Interfaces

 Wi-Fi：SDIO 3.0

 BT：UART and PCM

Antenna Interface

Wi-Fi/BT antenna interface, 50Ω impedance

Physical Characteristics

Temperature Ranges

Dimensions: (16.6 ±0.15) mm × (13.0 ±0.15) mm × (2.1±0.2) mm

Package: LCC

Weight: TBD

Extended temperature range: -40 to +85°C1)

Storage temperature range: -45 to +95°C

RoHS

All hardware components are fully compliant with EU RoHS directive

1.

2.

1) Within extended temperature range, the module remains the ability for data transmission. There

is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio

network. Only one or more parameters like Pout might reduce in their value and exceed the specified

tolerances. When the temperature returns to the normal operating temperature levels, the module

will meet IEEE compliant again.

“*” means under development.

NOTES

FC21_Hardware_Design 10 / 52

批注 [RL4]: 中文里没有这个，

中文是否要加上

 Wi-Fi&BT Module Series

FC21 Hardware Design

The following figure shows a block diagram of FC21 module and illustrates the major functional parts:

2.3 Functional Diagram

 Power supply

 Wireless Connectivity Interfaces

- Wi-Fi interface

- BT interface

- Coexistence interface

 Antenna interface

 Other interfaces

- DBG_TXD

- 32KHz_IN interface

Figure 1: Functional Diagram of FC21 Module

NOTE

FC21_SA version has 2.4G Filter, FC21_SD version does not have 2.4G Filter.

批注 [RL5]:

FC21_SA 版本带 2.4G Filter，

FC21_SD 版本不带 2.4G Filter.

要不要加这个备注

批注 [RL6R5]:

FC21_Hardware_Design 11 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

2.4 Evaluation Board

In order to help customers to develop applications with FC21 module, Quectel supplies an evaluation

board (UMTS&LTE EVB), an RS-232 to USB converter cable, a USB data cable, a power adapter, 4

antennas and other peripherals to control or test the module. For details, please refer to document [1].

FC21_Hardware_Design 12 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

3 Application Interfaces

3.1. General Description

FC21 module is equipped with 38 LCC pads and 14 LGA pads that can be connected to cellular

application platform. The subsequent chapters will provide detailed descriptions of the following

interfaces:

 Power supply

 Wireless Connectivity Interfaces

- Wi-Fi interface

- BT interface

- Coexistence interface

 Other interfaces

- DBG_TXD interface

- 32KHz_IN interface

 Antenna interface

FC21_Hardware_Design 13 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

3.2. Pin Assignment

GND

RESERVED

RESERVED

DBG_TXD

LTE_UART_TXD

LTE_UART_RXD

BT_UART_RTS 1)

BT_UART_CTS 1)

1

2

3

4

5

6

7

8

9

WLAN_EN

BT_EN 1)

10

11

12

VIO

GND

39

40

41

42

D

E

V

R

E

S

E

R

D

N

G

D

N

G

D

E

V

R

E

S

E

R

D

E

V

R

E

S

E

R

D

E

V

R

E

S

E

R

8

3

7

3

6

3

5

3

4

3

3

3

2

3

52

51 50

S

S

E

L

E

R

WI

_

N

O

_

E

K

A

W

49

48

47

461)

43

44

45

3

1

4

1

5

1

6

1

7

1

8

1

9

1

)

1

N

I

_

M

C

P

)

1

C

N

Y

S

_

M

C

P

)

1

)

1

)

1

K

L

C

_

M

C

P

T

U

O

_

M

C

P

)

1

D

X

R

_

T

R

A

U

_

T

B

D

X

T

_

T

R

A

U

_

T

B

)

2

N

I

_

z

H

K

2

3

31

30

29

28

27

26

25

24

23

22

21

20

GND

RF_ANT

GND

GND

SDIO_CMD

SDIO_CLK

SDIO_D0

SDIO_D1

SDIO_D2

SDIO_D3

VDD_3V3

GND

Power

GND

WLAN

BT

Other signals

RF

Reserved

Figure 2: Pin Assignment of FC21 Module

NOTES

development.

1. Please keep all RESERVED pins open.

2. 1) indicates that pins 7, 8, 10, 13~18 and 46 are BT function pins. BT function is under development.

3. 2) indicates that 32KHz_IN is reserved on FC21 module since the sleep function is under

FC21_Hardware_Design 14 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

3.3. Pin Description

The following tables show the pin definition of FC21 module.

Table 3: I/O Parameters Definition

Description

Digital input

Digital output

Bidirectional

Power input

Type

DI

DO

IO

PI

Table 4: Pin Description of FC21 Module

Power Supply

Pin Name

Pin No.

I/O Description

DC Characteristics Comment

VDD_3V3

21

PI

Main power supply

for module

VIO

11

PI

Power supply for

module’s I/O pins

Vmax=3.46V

Vmin=3.14V

Vnorm=3.3V

Vmax=3.46V

Vmin=1.71V

Vnorm=1.8V

It must be provided

with sufficient current

up to 0.6A.

It is suggested to be

powered by

EC2x&EG2x-G

module.

GND

Ground

1, 12, 20,

28, 29,

31, 36,

38~40,

43~45,

48~52

Wi-Fi Interface

Pin Name

Pin No.

I/O Description

DC Characteristics Comment

WAKE_ON_

WIRELESS

32

OD

Wi-Fi wake up the

host

VOLmax=0.18V

VOHmin=1.62V

1.8V power domain.

Active low.

Require external

pull-up to 1.8V.

If unused, keep this

FC21_Hardware_Design 15 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

WLAN_EN

9

DI

Wi-Fi function

control

pin open.

1.8V power domain.

Active high.

SDIO_D3

22

IO

SDIO data bus D3

1.8V power domain

SDIO_D2 1)

23

IO

SDIO data bus D2

1.8V power domain.

Require external

pull-up to 1.8V.

SDIO_D1

24

IO

SDIO data bus D1

1.8V power domain

SDIO_D0

25

IO

SDIO data bus D0

1.8V power domain

SDIO_CLK

26

DI

SDIO bus clock

1.8V power domain

SDIO_CMD

27

IO

SDIO bus command

1.8V power domain

BT Interface

Pin Name

Pin No.

I/O Description

DC Characteristics Comment

FC21_Hardware_Design 16 / 52

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VOLmax=0.18V

VOHmin=1.62V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VOLmax=0.18V

VOHmin=1.62V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VOLmax=0.18V

VOHmin=1.62V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VOLmax=0.18V

VOHmin=1.62V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VOLmax=0.18V

VOHmin=1.62V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

 Wi-Fi&BT Module Series

FC21 Hardware Design

BT_EN

10

DI

BT function control

BT_WAKE_

HOST

46

OD BT wake up the host

PCM_IN

13

DI

BT PCM data input

PCM_SYNC 14

DI

BT PCM data frame

synchronization

signal

PCM_CLK

15

DI

BT PCM data bit

clock

PCM_OUT

16

DO BT PCM data output

BT_UART_

RTS

BT_UART_

CTS

7

8

DO

BT UART request to

send

VOLmax=0.18V

VOHmin=1.62V

DI

BT UART clear to

send

BT_UART_

TXD

17

DO

BT UART transmit

data

VOLmax=0.18V

VOHmin=1.62V

BT_UART_

RXD

18

DI

BT UART receive

data

Coexistence Interface

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VOLmax=0.18V

VOHmin=1.62V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VOLmax=0.18V

VOHmin=1.62V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

1.8V power domain.

Active high.

If unused, keep this

pin open.

1.8V power domain.

Active low.

Pulled up internally.

If unused, keep this

pin open.

1.8V power domain.

If unused, keep this

pin open.

1.8V power domain.

If unused, keep this

pin open.

1.8V power domain.

If unused, keep this

pin open.

1.8V power domain.

If unused, keep this

pin open.

1.8V power domain.

If unused, keep this

pin open.

1.8V power domain.

If unused, keep this

pin open.

1.8V power domain.

If unused, keep this

pin open.

1.8V power domain.

If unused, keep this

pin open.

Pin Name

Pin No.

I/O Description

DC Characteristics Comment

LTE_UART_

TXD

5

DO

LTE/Wi-Fi&BT

coexistence signal

VOLmax=0.18V

VOHmin=1.62V

1.8V power domain.

If unused, keep this

FC21_Hardware_Design 17 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

LTE_UART_

RXD

6

DI

LTE/Wi-Fi&BT

coexistence signal

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

pin open.

1.8V power domain.

If unused, keep this

pin open.

RF Interface

Other Interfaces

Pin Name

Pin No.

I/O Description

DC Characteristics Comment

RF_ANT

30

IO

50Ω impedance.

Wi-Fi/BT antenna

interface

Pin Name

Pin No.

I/O Description

DC Characteristics Comment

DBG_TXD

4

OD

Used for software

debugging

VOLmax=0.18V

VOHmin=1.62V

32KHz_IN 2) 19

DI

RESERVED Pins

Low power.

External 32.768kHz

clock input.

VILmin=-0.3V

VILmax=0.54V

VIHmin=1.26V

VIHmax=2.0V

1.8V power domain.

Require external pull-

up to 1.8V.

If unused, keep this pin

open.

1.8V power domain.

If unused, keep this pin

open.

Pin Name

Pin No.

I/O Description

DC Characteristics Comment

RESERVED

Reserved

Keep these pins

open.

1. 1) indicates that SDIO_D2 is a boot strap signal, which must be kept at high level for normal

2. 2) indicates that 32KHz_IN is reserved on FC21 module since the sleep function is still to be

operation during power on.

developed.

2, 3,

33~35,

37, 41,

42, 47

NOTES

FC21_Hardware_Design 18 / 52

批注 [RL7]: 中文下面有个单独

的 3.4.1 引脚介绍，是否要加上

Wi-Fi&BT Module Series

FC21 Hardware Design

3.4. Power Supply

3.4.1. Pin Introduction

The following table shows the power supply pins and the ground pins of FC21. The VIO power supply is

recommended to be powered by VDD_EXT of EC2x&EG2x-G modules.

Table 5: Power Supply Pins and GND Pins

Pin Name

Pin No.

Description

Min.

Typ.

Max.

Unit

VDD_3V3

21

VIO

11

Main power supply for the

module

Power supply for the module’s

I/O pins

3.14

3.3

3.46

V

1.71

1.8

3.46

V

1, 12, 20, 28,

29, 31, 36,

38~40,

43~45,

48~52

GND

Ground

FC21 is powered by VDD_3V3, and it is recommended to use a power supply chip with maximum output

current more than 0.6A.

The following figure shows a reference design for VDD_3V3. Pulling PM_ENABLE to a high voltage level

will enable VDD_3V3 power output. And this pin should be connected to pin 127 of EC2x&EG2x-G. For

more details, please refer to document [2], [3], [4], [5] or [6].

L401

1 µH

U402

D1

D2

D3

E1

E2

E3

E4

L1

L1

L1

VI N

VI N

VI N

VI NA

D4

EN

L2

L2

L2

B1

B2

B3

VOUT

VOUT

VO UT

FB

PG ND

PG ND

PG ND

A1

A2

A3

A4

B4

C1

C2

C3

R407

100K

C4

GND

TPS630242

DC_5V

C405

10 µF

PM_ENABLE

C406

22 µF

C407

22 µF

R408

1M

PFM/PWM

DC_5V

VDD_3V3

Figure 3: Reference Circuit for VDD_3V3

FC21_Hardware_Design 19 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

The following figure shows the recommended power on/off sequences for FC21 module.

> 0

≥ 5 µs

≥ 10 µs

≥0

VIO

>0

PM_ENABL E

VDD_3V3

WLAN_EN

Module

Status

Power up

Runnin g

Power down

Figure 4: Timing of Turning on/off FC21 Module

FC21 support a low-power SDIO 3.0 interface for WLAN, and UART&PCM interfaces for BT function.

3.5. Wireless Connectivity Interfaces

3.5.1. Wi-Fi Interface

The following figure shows the WLAN interface connection between FC21 and EC2x&EG2x-G.

FC21

SDIO

WLAN_EN

EC2x&EG2x-G

SDIO

WLAN_EN

WAKE_ON_WIRELESS

WAKE_ON_WIRELESS

Figure 5: Wi-Fi Interface Connection

FC21_Hardware_Design 20 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

3.5.1.1. WAKE_ON_WIRELESS

WAKE_ON_WIRELESS is used to wake up the EC2x&EG2x-G module. When the pin is pulled down,

EC2x&EG2x-G can be woken up.

Table 6: Pin Definition of WAKE_ON_WIRELESS

Pin Name

Pin No.

I/O

Description

Comment

WAKE_ON_WIRELESS

32

OD

Wi-Fi wake up the

host

1.8V power domain.

Active low.

Require external pull-up

to 1.8V.

If unused, keep this pin

open.

3.5.1.2. WAKE_EN

WLAN_EN is used to control the WLAN function of FC21. When WLAN_EN is at high level voltage, Wi-Fi

function will be enabled.

Table 7: Pin Definition of WLAN_EN

Pin Name

Pin No.

I/O

Description

Comment

WLAN_EN

9

DI

Wi-Fi function control

1.8V power domain.

Active high.

WLAN_EN is a sensitive signal, and therefore, WLAN_EN should be ground-shielded and routed as

close as possible to FC21 module.

NOTE

FC21_Hardware_Design 21 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

3.5.1.3. SDIO Interface

The following table shows the pin definition of SDIO interface.

Table 8: Pin Definition of SDIO Interface

Pin Name

Pin No. I/O

Description

Comment

SDIO_D3

SDIO_D2

SDIO_D1

SDIO_D0

22

23

24

25

26

IO

IO

IO

IO

DI

IO

SDIO data bus D3

1.8V power domain.

SDIO data bus D2

1.8V power domain.

Require external pull-up to 1.8V.

SDIO data bus D1

1.8V power domain.

SDIO data bus D0

1.8V power domain.

SDIO_CLK

SDIO bus clock

1.8V power domain.

SDIO_CMD

27

SDIO bus command

1.8V power domain.

The following figure shows the SDIO interface connection between FC21 and EC2x&EG2x-G.

VIO VIO VIO VIO VIO

N

M

_

1

0

p

F

N

M

_

1

0

K

N

M

_

1

0

K

N

M

_

1

0

K

1

0

K

N

M

_

1

0

K

FC21

EC2x&EG2x-G

SDIO_CLK

SDIO_CMD

SDIO_D0

SDIO_D1

SDIO_D2

SDIO_D3

SD1_CLK

SD1_CMD

SD1_D0

SD1_D1

SD1_D2

SD1_D3

Figure 6: SDIO Interface Connection

In order to ensure the performance of SDIO, please comply with the following principles:

signals.

 SDIO signals are very high-speed signals. Please prevent crosstalk among them and other sensitive

 Keep SDIO traces as parallel as possible in the same layer. Make sure SDIO lines are guarded by

ground vias and not crossed.

FC21_Hardware_Design 22 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

 Do not route SDIO signal traces under crystals, oscillators, magnetic devices and RF signal traces.

 SDIO_D2 is a boot strap signal, which must be kept at high level for normal operation during power

on. The pull-up resistor on SDIO_D2 line must be mounted.

 Keep SDIO traces as short as possible with equal length, and impedance control as 50Ω.

 The spacing to all other signals is greater than 2 times of the trace width.

3.5.2. BT Interface*

The following figure shows the block diagram of BT interface connection between FC21 and

EC2x&EG2x-G.

批注 [RL8]: 中文这里没有加星

号，中文是否要加上

Figure 7: Block Diagram of BT Interface Connection

NOTES

3.5.2.1. BT_EN

1. “*” means under development.

2. PIN3 of EC2x / EG2x-G can be used as an interrupt GPIO.

BT_EN is used to control the BT function of FC21. When BT_EN is at high level voltage, BT function will

be enabled.

Table 9: Pin Definition of BT_EN

Pin Name

Pin No.

I/O

Description

Comment

BT_EN

10

DI

BT function control

1.8V power domain.

Active high. If unused,

keep this pin open.

FC21_Hardware_Design 23 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

3.5.2.2. BT_WAKE_HOST

BT_WAKE_HOST is used to wake up the EC2x&EG2x-G module. When the pin is pulled down,

EC2x&EG2x-G can be woken up.

Table 10: Pin Definition of BT_WAKE_HOST

Pin Name

Pin No.

I/O

Description

Comment

BT_WAKE_HOST

46

OD

BT wake up the host

3.5.2.3. PCM Interface

1.8V power domain.

Active Low.

Pulled up internally.

If unused, keep this pin

open.

FC21 provides a PCM interface for BT application. The following table shows the pin definition of PCM

interface. The PCM interface is not needed when a BLE function is used.

Table 11: Pin Definition of PCM Interface

Pin Name

Pin No.

I/O

Description

Comment

PCM_IN

13

BT PCM data input

DI

DI

DI

PCM_SYNC

14

PCM_CLK

15

16

BT PCM data frame

synchronization signal

BT PCM data bit clock

1.8V power domain.

If unused, keep these pins open.

PCM_OUT

DO

BT PCM data output

The following figure shows a reference design for PCM interface connection between FC21 and

EC2x&EG2x-G.

FC21_Hardware_Design 24 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

Figure 8: Reference Design for PCM Interface

3.5.2.4. BT_UART Interface

Table 12: Pin Definition of UART Interface

FC21 provides a dedicated UART interface for BT application. The following table shows the pin definition

of UART interface.

批注 [RL10R9]:

批注 [RL9]: 中文是

BT_UART，这里是否需要改为

一致

Pin Name

Pin No.

Description

Comment

BT_UART_RTS

BT_UART_CTS

7

8

BT UART request to send

BT UART clear to send

BT_UART_TXD

17

BT UART transmit data

BT_UART_RXD

18

BT UART receive data

1.8V power domain.

If unused, keep these

pins open.

The following figure shows a reference design for UART interface connection between FC21 and

EC2x&EG2x-G.

I/O

DO

DI

DO

DI

Figure 9: Reference Design for UART Interface Connection

FC21_Hardware_Design 25 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

3.5.3. Coexistence Interface

The following table shows the pin definition of coexistence interface 1).

Table 13: Pin Definition of Coexistence Interface

Pin Name

Pin No.

I/O

Description

Comment

LTE_UART_TXD

5

DO

LTE_UART_RXD

6

DI

LTE/Wi-Fi&BT

coexistence signal

LTE/Wi-Fi&BT

coexistence signal

1.8V power domain.

If unused, keep these pins open.

The following figure shows the coexistence interface connection between FC21 and EC2x&EG2x-G.

Figure 10: Coexistence Interface Connection

FC21_Hardware_Design 26 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

3.6. Other Interfaces

3.6.1. DBG_TXD Interface

DBG_TXD interface can be used for log output.

Table 14: Pin Definition of DBG_TXD Interface

Pin Name

Pin No.

I/O

Description

Comment

DBG_TXD

4

OD

Used for software

debugging

1.8V power domain.

Require external pull-up to 1.8V.

If unused, keep this pin open.

3.6.2. 32KHz_IN Interface

The 32KHz clock is used in low power mode such as IEEE power saving mode and sleep mode. It serves

as a timer to determine when to wake up FC21 module to receive beacons in various power saving

schemes, and to maintain basic logic operations in sleep mode.

Table 15: Pin Definition of 32KHz_IN Interface

Pin Name

Pin No.

I/O

Description

Comment

32KHz_IN

19

DI

Low power.

External 32.768kHz clock

input.

1.8V power domain.

If unused, keep this pin

open.

32KHz_IN pin is reserved on FC21 module since the sleep function is still to be developed.

NOTE

FC21_Hardware_Design 27 / 52

批注 [RL11]: 休眠时钟，默认由

EC2x 和 EG2x-G 模块提供。中

文里的引脚描述章节是这样表

述的。要以哪个为准

 Wi-Fi&BT Module Series

FC21 Hardware Design

3.7. Antenna Interface

Pin 30 is the RF antenna pad. And the RF port has an impedance of 50Ω.

3.7.1. Pin Definition of RF Antenna Interface

Table 16: Pin Definition of RF Antenna Interface

批注 [RL12]: 中文里有这个射

频天线 Layout 参考指导章节，

是否需要添加

Pin Name

Pin No.

I/O

Description

Comment

GND

GND

GND

28

29

30

31

Ground

Ground

Ground

RF_ANT

IO

Wi-Fi/BT antenna pad

50Ω impedance

批注 [RL13R12]:

3.7.2. Operating Frequency

Operating frequency is as bellow.

Table 17: Operating Frequency

Feature

Frequency

2.4GHz WLAN

2.412~2.472

5GHz WLAN

5.180~5.825

BT 4.2

2.402~2.48

3.7.3. Reference Designs

Unit

GHz

GHz

GHz

FC21 module provides an RF antenna pad for Wi-Fi/BT antenna connection. The RF trace in host PCB

connected to the module’s RF antenna pad should be microstrip line or other types of RF trace, with

characteristic impendence close to 50Ω. FC21 module comes with grounding pads which are next to the

antenna pad in order to give a better grounding.

A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a π-type

matching circuit for better RF performance. The capacitors are not mounted by default.

FC21_Hardware_Design 28 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

FC21

RF_ANT

R1

0R

C1

NM

C2

NM

Figure 11: Reference Circuit for RF Antenna Interface

Another type of reference circuit for the RF antenna interface is shown below. It is designed for vehicle

applications. It is recommended to reserve two notch filter circuits and a π-type matching circuit for better

RF performance. C2/L1 and L3/C3 comprise two notch filter circuits for filtering out interference caused by

a particular frequency. When L3/C2/L1/C3 is NC, C1/L2/C4 comprise a π-type matching circuit.

Capacitors C1/C2/C3/C4 and inductors L1/L3 are not mounted by default, and L2 is 0Ω by default.

Figure 12: Reference Circuit for RF Antenna Interface (Vehicle Applications)

3.7.4. Reference Design of RF Layout

For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The

impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,

the height from the reference ground to the signal layer (H), and the spacing between RF traces and

grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic

impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB

structures.

FC21_Hardware_Design 29 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

Figure 13: Microstrip Design on a 2-layer PCB

Figure 14: Coplanar Waveguide Design on a 2-layer PCB

Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

FC21_Hardware_Design 30 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)

In order to ensure RF performance and reliability, the following principles should be complied with in RF

layout design:

 Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to

 The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully

50 Ω.

connected to ground.

 The distance between the RF pins and the RF connector should be as short as possible, and all the

right-angle traces should be changed to curved ones. The recommended trace angle is 135°.

 There should be clearance under the signal pin of the antenna connector or solder joint.

 The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around

RF traces and the reference ground could help to improve RF performance. The distance between

the ground vias and RF traces should be no less than two times the width of RF signal traces (2 x W).

 Keep RF traces away from interference sources, and avoid intersection and paralleling between

traces on adjacent layers.

For more details about RF layout, See document [7].

3.7.5. Antenna Requirements

The following table shows the requirements on RF antenna.

Table 18: Antenna Cable Requirements

Type

Requirements

2.412GHz~2.472GHz

Cable insertion loss <1dB

5.180GHz~5.825GHz

Cable insertion loss <1dB

FC21_Hardware_Design 31 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

Table 19: Antenna Requirements

Type

Requirements

Frequency Range

VSWR

Gain (dBi)

Max Input Power (W)

Input Impedance (Ω)

2.412GHz~2.472GHz

5.180GHz~5.825GHz

< 2:1 recommended

Typically 1

50

50

Polarization Type

Vertical

3.7.6. Recommended RF Connector for Antenna Installation

If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector

provided by Hirose.

Figure 17: Dimensions of the U.FL-R-SMT Connector (Unit: mm)

U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.

批注 [RL14]: 这个是连接器

吧，中文里写的是连接线，要不

要改为连接器

FC21_Hardware_Design 32 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

Figure 18: Mechanicals of U.FL-LP Connectors

The following figure describes the space factor of mated connector.

Figure 19: Space Factor of Mated Connector (Unit: mm)

For more details, please visit http://www.hirose.com.

FC21_Hardware_Design 33 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

4 Electrical, Reliability and Radio

Characteristics

4.1. General Description

This chapter mainly introduces the electrical and the radio frequency characteristics of FC21 module,

which are listed in detail in the following chapters:

 Electrical characteristics



 Current consumption

 RF performance

 Electrostatic discharge

I/O interface characteristics

4.2. Electrical Characteristics

The following table shows the absolute maximum ratings.

Table 20: Absolute Maximum Ratings

Parameter

VDD_3V3

VIO

Min.

-0.3

-0.3

Max.

3.46

3.46

Digital I/O input voltage

-0.3

VIO+0.2

Unit

V

V

V

The following table shows the recommended operating conditions for FC21 module.

FC21_Hardware_Design 34 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

Table 21: Recommended Operating Conditions

Parameter

VDD_3V3

VIO

Min.

3.14

1.71

Typ.

3.3

1.8

Max. Unit

3.46

3.46

V

V

4.3. I/O Interface Characteristics

The following table shows the general DC electrical characteristics over recommended operating

conditions (unless otherwise specified).

VIH

VIL

VOH

VOL

IIL

Table 22: General DC Electrical Characteristics

Symbol

Parameter

Min.

Max. Unit

High Level Input Voltage

0.7 x VIO

VIO+0.2

Low Level Input Voltage

-0.3

0.3 x VIO

High Level Output Voltage

0.9 x VIO

VIO

Low Level Output Voltage

0.1 x VIO

V

V

V

V

Input Leakage Current

5

μA

0

-5

4.4. Current Consumption

4.4.1. Wi-Fi Current Consumption

Table 23: Wi-Fi Current Consumption

Description Condition

IWLAN3V3

OFF state 1) AT+QWIFI=0

Idel state 2)

AT+QWIFI=1

802.11b

TX 1 Mbps

0

TBD

TBD

IVIO

TBD

TBD

TBD

Unit

µA

mA

mA

FC21_Hardware_Design 35 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

TX 11 Mbps

RX 1 Mbps

RX 11 Mbps

TX 6 Mbps

TX 54 Mbps

RX 6 Mbps

RX 54 Mbps

TX HT20-MCS0

TX HT20-MCS7

TX HT40-MCS0

TX HT40-MCS7

RX HT20-MCS0

RX HT20-MCS7

RX HT40-MCS0

RX HT40-MCS7

TX HT20 MCS0

TX HT20 MCS7

RX HT20 MCS0

RX HT20 MCS7

802.11g

802.11n

802.11a

TX VHT20 MCS0

802.11ac

TX VHT40 MCS9

TX VHT20 MCS8

TX VHT40 MCS0

TX VHT80 MCS0

TX VHT80 MCS9

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

FC21_Hardware_Design 36 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

RX VHT20 MCS0

RX VHT20 MCS8

RX VHT40 MCS0

RX VHT40 MCS9

RX VHT80 MCS8

RX VHT80 MCS9

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

mA

mA

mA

mA

mA

mA

NOTES

1. 1) OFF state: Executing AT+QWIFI=0 command will make the module enter this state. Under the

state, the sleep clock is disabled and no data is saved.

2. 2) Idle state: Wi-Fi function enabled via AT+QWIFI=1, but without any device connected to the AP.

4.4.2. BLE Current Consumption

Table 24: BLE Current Consumption During Non-signaling

Description

Power

Power Supply

Consumed Current

Unit

Non-signaling

-2±2.5dBm

3.3V

1.8V

22.0

3.0

mA

4.5. RF Performance

4.5.1. Wi-Fi Performance

The following tables summarize the transmitter and receiver characteristics of FC20 series.

Table 25: Conducted RF Output Power at 2.4GHz

Standard

Data Rate

802.11b

802.11b

1Mbps

11Mbps

Typ.

TBD

TBD

Unit

dBm

dBm

FC21_Hardware_Design 37 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

802.11g

802.11g

802.11n, HT20

802.11n, HT20

802.11n, HT40

802.11n, HT40

6Mbps

54Mbps

MCS0

MCS7

MCS0

MCS7

TBD

TBD

TBD

TBD

TBD

TBD

Table 26: Conducted RF Output Power at 5GHz

Standard

802.11a

802.11a

802.11n，HT20

802.11n，HT20

802.11n，HT40

802.11n，HT40

802.11ac，VHT20

802.11ac，VHT20

802.11ac，VHT40

802.11ac，VHT40

802.11ac，VHT80

802.11ac，VHT80

Data Rate

6 Mbps

54 Mbps

MCS0

MCS7

MCS0

MCS7

MCS0

MCS8

MCS0

MCS9

MCS0

MCS9

Typ.

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

dBm

dBm

dBm

dBm

dBm

dBm

Unit

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

Unit

dBm

dBm

Table 27: Conducted RF Receiving Sensitivity at 2.4GHz

Standard

Data Rate

802.11b

802.11b

1Mbps

11Mbps

Typ.

TBD

TBD

FC21_Hardware_Design 38 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

TBD

TBD

TBD

TBD

TBD

TBD

Typ.

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

Table 28: Conducted RF Receiving Sensitivity at 5GHz

Standard

Data Rate

6Mbps

54Mbps

MCS0

MCS7

MCS0

MCS7

6 Mbps

54 Mbps

MCS0

MCS7

MCS0

MCS7

802.11g

802.11g

802.11n, HT20

802.11n, HT20

802.11n, HT40

802.11n, HT40

802.11a

802.11a

802.11n，HT20

802.11n，HT20

802.11n，HT40

802.11n，HT40

802.11ac，VHT20

MCS0

802.11ac，VHT20

MCS8

802.11ac，VHT40

MCS0

802.11ac，VHT40

MCS9

4.5.2. BLE Performance

dBm

dBm

dBm

dBm

dBm

dBm

Unit

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

The following table shows the BLE transmitting and receiving performance of FC21 module.

Table 29: BLE Transmitting and Receiving Performance

Channel

0

Transmitting Power

Receiving Sensitivity

TBD

TBD

FC21_Hardware_Design 39 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

TBD

TBD

TBD

TBD

4.6. Electrostatic Discharge

The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject

to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and

packaging procedures must be followed throughout the processing, handling and operation of any

application that involves the module.

The following table shows the module’s electrostatic discharge characteristics.

Table 30: Electrostatic Discharge Characteristics (25ºC, 45% Relative Humidity)

Tested Interfaces

Contact Discharge

Air Discharge

Unit

TBD

TBD

TBD

TBD

TBD

TBD

kV

kV

kV

19

39

VDD_3V3

GND

RF

FC21_Hardware_Design 40 / 52

 Wi-Fi&BT Module Series

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5 Mechanical Dimensions

This chapter describes the mechanical dimensions of FC21 module. All dimensions are measured in

millimeter (mm), and the dimensional tolerances are ±0.05mm unless otherwise specified.

5.1. Mechanical Dimensions of the Module

Figure 20: Top and Side Dimensions

FC21_Hardware_Design 41 / 52

Pin 1

 Wi-Fi&BT Module Series

FC21 Hardware Design

Figure 21: Bottom Dimensions

The package warpage level of the module conforms to JEITA ED-7306 standard.

NOTE

FC21_Hardware_Design 42 / 52

 Wi-Fi&BT Module Series

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5.2. Recommended Footprint and Stencil Design

批注 [RL15]: 中文分开的两章

结，是否需要分开

Figure 22: Recommended Footprint

FC21_Hardware_Design 43 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

The recommended stencil design for FC21 is shown below. To ensure the module soldering quality, the

thickness of stencil for the module is recommended to be 0.18mm.

Figure 23: Recommended Stencil Design

NOTE

For easy maintenance of the module, please keep about 3mm between the module and other

components on host PCB.

FC21_Hardware_Design 44 / 52

 Wi-Fi&BT Module Series

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5.3. Top and Bottom Views of the Module

Figure 24: Top View of the Module

Figure 25: Bottom View of the Module

NOTE

These are renderings of FC21 modules. For authentic appearance, please refer to the module provided

by Quectel.

FC21_Hardware_Design 45 / 52

 Wi-Fi&BT Module Series

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6 Storage, Manufacturing and

Packaging

6.1. Storage

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage

requirements are shown below.

1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity

should be 35%–60%.

2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.

3. The floor life of the module is 168 hours 1) in a plant where the temperature is 23 ±5 °C and relative

humidity is below 60%. After the vacuum-sealed packaging is removed, the module must be

processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the

module should be stored in an environment where the relative humidity is less than 10% (e.g. a drying

cabinet).

4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under

the following circumstances:

 The module is not stored in Recommended Storage Condition;

 Violation of the third requirement above occurs;

 Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

 Before module repairing.

If needed, the pre-baking should follow the requirements below:

 The module should be baked for 8 hours at 120 ±5 °C;

 All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be

put in a dry environment such as in a drying oven.

5.

FC21_Hardware_Design 46 / 52

 Wi-Fi&BT Module Series

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NOTES

1. 1) This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033.

2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules

to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or

the relative moisture is over 60%, It is recommended to start the solder reflow process within 24 hours

after the package is removed. And do not remove the packages of tremendous modules if they are not

ready for soldering.

3. Please take the module out of the packaging and put it on high-temperature resistant fixtures before

the baking. If shorter baking time is desired, please refer to IPC/JEDEC J-STD-033 for baking

procedure.

6.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the

stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly

so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the

thickness of stencil for the module is recommended to be 0.15–0.18 mm. For more details, please refer to

document [8].

It is suggested that the peak reflow temperature is 238–246 ºC, and the absolute maximum reflow

temperature is 246 ºC. To avoid damage to the module caused by repeated heating, it is strongly

recommended that the module should be mounted after reflow soldering for the other side of PCB has

been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and

related parameters are shown below.

Temp. (°C)

246

238

220

200

150

100

Soak Zone

A

Max slope: 1 to 3°C/s

Reflow Zone

Max slope:

2 to 3°C/s

C

Cooling down slope:

-1.5 to -3°C/s

B

D

Figure 26: Recommended Reflow Soldering Thermal Profile

FC21_Hardware_Design 47 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

Table 31: Recommended Thermal Profile Parameters

Soak time (between A and B: 150 °C and 200 °C)

70–120 s

Recommendation

1–3 °C/s

2–3 °C/s

45–70 s

238 °C to 246 °C

-1.5 to -3 °C/s

1

During manufacturing and soldering, or any other processes that may contact the module directly,

NEVER wipe the module label with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol,

trichloroethylene, etc. Otherwise, the label information may become unclear.

Factor

Soak Zone

Max slope

Reflow Zone

Max slope

Reflow time (D: over 220°C)

Max temperature

Cooling down slope

Reflow Cycle

Max reflow cycle

NOTE

FC21_Hardware_Design 48 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

6.3. Packaging

FC21 module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be

opened until the devices are ready to be soldered onto the application.

Figure 27: Tape Dimensions

Figure 28: Reel Dimensions

FC21_Hardware_Design 49 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

7 Appendix A References

Table 32: Related Documents

SN

Document Name

Remark

Quectel_UMTS&LTE_EVB_User_Guide

UMTS&LTE EVB user guide

Quectel_EC25_Reference_Design

EC25 reference design

Quectel_EC21_Reference_Design

EC21 reference design

Quectel_EC20_R2.1_Reference_Design

EC20 R2.1 reference design

Quectel_EG25-G_Reference_Design

EC25-G reference design

Quectel_EG21-G_Reference_Design

EC21-G reference design

Quectel_RF_Layout_Application_Note

RF layout application note

Quectel_Module_Secondary_SMT_User_Guide

Module secondary SMT user guide

Table 33: Terms and Abbreviations

Abbreviation

Description

Access Point

Binary Phase Shift Keying

Bluetooth Low Energy

Bluetooth

Complementary Code Keying

Electrostatic Discharge

Ground

High Throughput

[1]

[2]

[3]

[4]

[5]

[6]

[7]

[8]

AP

BPSK

BLE

BT

CCK

ESD

GND

HT

FC21_Hardware_Design 50 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

I/O

IEEE

IIL

LTE

Mbps

MCS

MOQ

MP

PCB

QAM

QPSK

RF

RH

RoHS

RX

SDIO

STA

TX

USB

VDD

VHT

VIHmax

VIHmin

VILmax

VILmin

Institute of Electrical and Electronics Engineers

Input/Output

Input Leakage Current

Long Term Evolution

Million Bits Per Second

Modulation and Coding Scheme

Minimum Order Quantity

Manufacture Product

Printed Circuit Board

Quadrature Amplitude Modulation

Quadrature Phase Shift Keying

Restriction of Hazardous Substances

Secure Digital Input and Output Card

Radio Frequency

Relative Humidity

Receive Direction

Station

Transmitting Direction

Universal Serial Bus

Voltage Power for Digital Device

Very High Throughput

Maximum Input High Level Voltage Value

Minimum Input High Level Voltage Value

Maximum Input Low Level Voltage Value

Minimum Input Low Level Voltage Value

FC21_Hardware_Design 51 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

VIO

VOHmin

VOLmax

VSWR

WLAN

Voltage for Input/Output Port

Minimum Output High Level Voltage Value

Maximum Output Low Level Voltage Value

Voltage Standing Wave Ratio

Wireless Local Area Network

Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [FC21] is in

compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity is available at the following internet address:

http://www.quectel.com.

The device could be used with a separation distance of 20cm to the human body.

Frequency bands

Maximum output power

Bluetooth/ LE

WIFI 2.4G

WIFI 5G

External antenna gain :

15 dbm(rate conducted power)

19 dbm(rate conducted power)

17 dbm(rate conducted power)

Band

Antenna Gain

(dBi)

Wi-Fi

2.4G

Wi-Fi 5G

U-NII-1

Wi-Fi 5G

U-NII-2A

Wi-Fi 5G

U-NII-2C

802.11b

802.11g

802.11n HT20

802.11n HT40

802.11a

802.11n HT20

802.11n HT40

802.11ac HT20

802.11ac HT40

802.11ac HT80

802.11a

802.11n HT20

802.11n HT40

802.11ac HT20

802.11ac HT40

802.11ac HT80

802.11a

802.11n HT20

802.11n HT40

5.16

5.16

5.16

5.16

4.48

4.48

4.48

4.48

4.48

4.48

4.48

4.48

4.48

4.48

4.48

4.48

5.05

5.05

5.05

FC21_Hardware_Design 52 / 52

 Wi-Fi&BT Module Series

FC21 Hardware Design

802.11ac HT20

802.11ac HT40

802.11ac HT80

802.11a

802.11n HT20

802.11n HT40

802.11ac HT20

802.11ac HT40

802.11ac HT80

Bluetooth

Wi-Fi 5G

U-NII-3

5.05

5.05

5.05

4.54

4.54

4.54

4.54

4.54

4.54

3.00

The use for 5GHz WLAN band is restricted to indoor use. This restriction will be applied to all Member States of European Union listed in the label.

FCC Certification Requirements.

According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device.

And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna

installation and operating configurations of this transmitter, including any applicable source-based timeaveraging

duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.

2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and

must not transmit simultaneously with any other antenna or transmitter.

3. A label with the following statements must be attached to the host end product: This device contains FCC ID:

XMR202102FC21

4. This module must not transmit simultaneously with any other antenna or transmitter

5. The host end product must include a user manual that clearly defines operating requirements and conditions that

must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to

satisfy the SAR requirements of FCC Part 2.1093

If the device is used for other equipment that separate approval is required for all other operating configurations,

including portable configurations with respect to 2.1093 and different antenna configurations.

For this device, OEM integrators must be provided with labeling instructions of finished products.

Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently

FC21_Hardware_Design 53 / 52

 Wi-Fi&BT Module Series

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affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling

requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling

requirements, options and OEM user manual instructions that are required (see next paragraph).

For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when

installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used

methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent

label referring to the enclosed module: “Contains Transmitter Module FCC ID: XMR202102FC21 ” or “Contains

FCC ID: XMR202102FC21 ” must be used. The host OEM user manual must also contain clear instructions on

how end users can find and/or access the module and the FCC ID.

The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for

unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.

The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that

changes or modifications not expressly approved by the party responsible for compliance could void the user's

authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as

on a computer disk or over the Internet, the information required by this section may be included in the manual in

that alternative form, provided the user can reasonably be expected to have the capability to access information in

that form.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received,

including interference that may cause undesired operation.

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the

equipment.

To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring

compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as

an unintentional radiator under the Supplier’s Declaration of Conformity procedure without a transmitter certified

module and a module is added, the host manufacturer is responsible for ensuring that the after the module is

installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove

this RF module in the user’s manual of the end product which integrates this module. The end user manual shall

include all required regulatory information/warning as show in this manual.

Wireless Access Systems including Radio Local Area Networks (WAS/RLANs) frequency range 5150 – 5350

MHz is Restricted to indoor use in EU, this device contains 5150-5250 MHz.

FC21_Hardware_Design 54 / 52



 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited Model Number: FC20 Product Name: Wi-Fi&BT module FCC ID: XMR202102FC21 , date of grant :07/15/2021 The equipment is updated as follows:

The difference between R1.0 and R1.1 is as below The RF chip is different, for further description please refer to the explanation letter of the difference between QCA9377-3 and QCA1023-0. FC21 is a Wi-Fi & BT Module with single antenna and doesnt support MIMO TXBF function. The report changes are as follows :

WIFI2.4G BLE R2108A0712-R1 report:

There is only verified Maximum output power and tested Unwanted Emissions, and did not worsen, so they were not recorded in the report. Bluetooth R2108A0712-R2 report:

There is only verified Peak Power Output and tested Unwanted Emissions, and did not worsen, so they were not recorded in the report. WIFI 5G R2108A0712-R3 report ;

There is only verified Average output power and tested Unwanted Emissions, and did not worsen, so they were not recorded in the report. DFS R2108A0712-R4 report :

There is no tested in the report.Test values duplicated from Original for variant. There is no test for variant in this report. Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited

 

 

C5266091_X8_Ed.1 Letter of Authorization Quectel Wireless Solutions Co., Ltd Company:

Quectel Wireless Solutions Co., Ltd Building 5, Shanghai Business Park Phase III Address:

(Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 Product Name: Wi-Fi&BT module Model Number: FC21 FCC Identifier: XMR202102FC21 We authorize LGAI Technological Center S.A., Ronda de la Font del Carme, s/n, 08193 Bellaterra, Spain, to act on our behalf on all matters concerning the above named equipment. Any individual within LGAI Technological Center S.A. is authorized to act on our behalf and take action on the application. We declare that authorize LGAI Technological Center S.A., Ronda de la Font del Carme, s/n, 08193 Bellaterra, Spain, information related to the approval project to the Federal Communication Commission and to discuss any issues concerning the approval application. Any and all acts carried out by LGAI Technological Center S.A. on our behalf shall have the same effect as acts of our own. is allowed to forward all Name:Jean Hu Date: 2021/09/08 Title: Project Manager Signature of applicant:

1/1

 

 

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

Quectel Wireless Solutions Company Limited XMR202102FC21 FC21 The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

Modular approval requirement

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. EUT Condition The radio elements of the modular transmitter have their own shielding. Comply YES

(b) The modular transmitter have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. must

(c)The modular transmitter must have its own power supply regulation.

(d) the The antenna modular transmitter must transmission comply system and with requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(e)The be must modular transmitter tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES YES YES All power lines derived from the host device are regulated before energizing other circuits internal to SMART MODULE . Please see schematic.pdf Device uses a micro-strip trace on the hosts printed circuit board to an antenna connector on the host circuit board. YES SMART MODULE was tested in a standalone configuration via a PCMCIA extender. Please see spurious setup Quectel Wireless Solutions Company Limited least 10 centimeters to insure that lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, there is no at coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available

(see Section 15.31(i)) must not be in side another device during testing.

(f)The modular be transmitter equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. must

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedon theintendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. YES YES YES The label position of SMART MODULE is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID:

XMR202102FC21. Please see the label.pdf SMART MODULE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. SMART MODULE is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. Quectel Wireless Solutions Company Limited Dated By:

2021/09/08 Jean Hu Signature Printed Title: Project Manager On behalf of :

Quectel Wireless Solutions Company Limited Telephone:

+86-21-51086236 ext 6511

 

 

Quectel Wireless Solutions Company Limited POWER OF ATTORNEY DATE:September 8, 2021 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Jinnan Han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR202102FC21. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Jinnan Han on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company:

Quectel Wireless Solutions Company Limited

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited

Request for Confidentiality

Date: _2021/06/05_

Subject: Confidentiality Request for: _____ FCC ID: XMR202102FC21 ______

Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the

subject FCC application be held confidential.

Type of Confidentiality Requested

Short Term

Short Term

Short Term

Short Term

Short Term

Short Term

Short Term

Short Term

Short Term

Permanent

Permanent*1

Permanent

Permanent

Permanent

Permanent

Permanent*

Exhibit

Block Diagrams

External Photos

Internal Photos

Operation Description/Theory of Operation

Parts List & Placement/BOM

Tune-Up Procedure

Schematics

Test Setup Photos

User’s Manual

*Note: ______(Insert Explanation as Necessary)______

______ FCC ID: XMR202102FC21 _____ has spent substantial effort in developing this product and it is

one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the

advantage they have achieved by developing this product. Not protecting the details of the design will result in financial

hardship.

Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public

review due to materials that contain trade secrets and proprietary information not customarily released to the public.

Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period

of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid

premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also

aware that they are responsible to notify TCB in the event information regarding the product or the product is made

available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public

Notice DA 04-1705.

NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality,

either type of marked exhibit above will simply be marked Confidential when submitted to IC.

Sincerely,

By:

(Signature/Title2)

Jean Hu

(Print name)



 

 

Quectel Wireless Solutions Company Limited

Declaration of the Modular Approval

Applicant / Grantee

FCC ID:

Model:

The single module transmitter has been evaluated then tested meeting the

requirements under Part 15C Section 212 as below:

Quectel Wireless Solutions Company Limited

XMR202102FC21

FC21

Modular approval requirement

(a) The radio elements of the modular transmitter

must have their own shielding. The physical

crystal and tuning capacitors may be located

external to the shielded radio elements.

EUT Condition

The radio elements of the

modular transmitter have their

own shielding.

Comply

YES

(b)

The modular

transmitter must

have

buffered modulation/data inputs (if such inputs are

provided) to ensure that the module will comply

with part 15 requirements under conditions of

excessive data rates or over-modulation.

(c)The modular transmitter must have its

own power supply regulation.

(d)

The modular

antenna must

transmitter must

the antenna and

comply

with

transmission system

requirements of Sections 15.203, 15.204(b) and

15.204(c). The

be

“unique”

permanently attached or employ a

antenna coupler (at all connections between the

module and the antenna, including the cable). The

installation” provision of Section

“professional

15.203 is not applicable to modules but can apply

to limited modular approvals under paragraph (b)

of this section.

either

(e)The modular

be

transmitter must

tested

in a stand-alone configuration, i.e., the module

must not be inside another device during testing for

compliance with part 15 requirements. Unless

the transmitter module will be battery powered, it

must comply with

line conducted

requirements found in Section 15.207. AC or DC

the AC

The modular has buffered data

inputs, it is integrated in chip.

Please see schematic.pdf

YES

All power lines derived from the

host device are regulated before

energizing other circuits internal

to SMART MODULE . Please

see schematic.pdf

Device uses a micro-strip trace

on the host’s printed circuit

board to an antenna connector

on the host circuit board.

YES

YES

SMART MODULE was tested in

a stand‐alone configuration via

a PCMCIA extender. Please see

spurious set‐up

YES

Quectel Wireless Solutions Company Limited

power lines and data input/output lines connected

to the module must not contain ferrites, unless they

will be marketed with the module (see Section

15.27(a)). The length of these lines shall be the

length typical of actual use or, if that length is

unknown, at least 10 centimeters to insure that

there is no coupling between the case of the

module

Any

accessories, peripherals, or support equipment

connected to the module during testing shall be

unmodified and commercially available

(see

Section 15.31(i)) must not be in side another

device during testing.

equipment.

supporting

and

(f)The

modular

be

transmitter

equipped with either a permanently affixed label

or must be capable of electronically displaying

its FCC identification number.

must

(g) The modular transmitter must comply

with any specific rules or operating requirements

that ordinarily apply to a complete transmitter and

the manufacturer must provide adequate

instructions along with the module to explain any

suchrequirements. A copy of these instructions

must be included in the application for

equipmentauthorizationrequirements,whicharebas

edon theintendeduse/configurations.

(h)The modular transmitter must comply

with any applicable RF exposure requirements in

its final configuration.

The label position of SMART

MODULE is clearly indicated. If

the FCC ID of the module

cannot be seen when it is

installed, then the host label

must include the text: Contains

FCC ID: XMR202102FC21.

Please see the label.pdf

SMART MODULE is compliant

with all applicable FCC rules.

Detail instructions are given in

the User Manual.

YES

YES

SMART MODULE is approved

to comply with the applicable RF

exposure requirement, please

see the MPE evaluation with

20cm as the distance restriction.

YES

Quectel Wireless Solutions Company Limited

Quectel Wireless Solutions Company Limited

2021/05/31

2021/0

Signature

Signature

Title: Project Manager

Dated

By:

Jean Hu

Printed

Printed

On behalf of :

Quectel Wireless Solutions Company Limited

Quectel Wireless Solutions Company Limited

Telephone:

+86-21

21-51086236 ext 6511