FCC ID: XMR2023FGH100M Wi-Fi HaLow Module

FGH100M Hardware Design Wi-Fi Module Series Version: 1.0.0 Date: 2023-03-22 Status: Preliminary Wi-Fi Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FGH100M_Hardware_Design 1 / 41 Wi-Fi Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. FGH100M_Hardware_Design 2 / 41 Wi-Fi Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FGH100M_Hardware_Design 3 / 41 Wi-Fi Module Series About the Document Revision History Version Date Author Description

2023-03-22 1.0.0 2023-03-22 Paul YU/James XIONG/

Adam ZENG Paul YU/James XIONG/

Adam ZENG Creation of the document Preliminary FGH100M_Hardware_Design 4 / 41 Wi-Fi Module Series Contents Safety Information ...................................................................................................................................... 3 About the Document .................................................................................................................................. 4 Contents ...................................................................................................................................................... 5 Table Index .................................................................................................................................................. 7 Figure Index ................................................................................................................................................ 8 1 Introduction ......................................................................................................................................... 9 1.1. Special Mark .............................................................................................................................. 9 2 Product Overview ............................................................................................................................. 10 2.1. Key Features ............................................................................................................................ 11 2.2. Functional Diagram .................................................................................................................. 12 3 RF Performances .............................................................................................................................. 13 3.1. Wi-Fi Performances ................................................................................................................. 13 4 Application Interfaces ...................................................................................................................... 15 4.1. Pin Assignment ........................................................................................................................ 15 4.2. Pin Description ......................................................................................................................... 16 4.3. Power Supply ........................................................................................................................... 19 4.4. Wi-Fi Application Interface ....................................................................................................... 20 4.4.1. SDIO Interface .............................................................................................................. 20 4.5. JTAG Interface ......................................................................................................................... 21 4.6. RF Antenna Interface ............................................................................................................... 21 4.6.1. Reference Design ......................................................................................................... 22 4.6.2. RF Routing Guidelines .................................................................................................. 22 4.6.3. RF Connector Recommendation .................................................................................. 24 5 Electrical Characteristics & Reliability ........................................................................................... 26 5.1. Absolute Maximum Ratings ..................................................................................................... 26 5.2. Power Supply Ratings .............................................................................................................. 26 5.3. ESD Protection ......................................................................................................................... 27 5.4. Digital I/O Characteristics ........................................................................................................ 27 5.5. Thermal Dissipation ................................................................................................................. 27 6 Mechanical Information .................................................................................................................... 29 6.1. Mechanical Dimensions ........................................................................................................... 29 6.2. Recommended Footprint ......................................................................................................... 31 6.3. Top and Bottom Views ............................................................................................................. 32 7 Storage, Manufacturing & Packaging ............................................................................................. 33 7.1. Storage Conditions................................................................................................................... 33 7.2. Manufacturing and Soldering ................................................................................................... 34 7.3. Packaging Specifications ......................................................................................................... 36 7.3.1. Carrier Tape .................................................................................................................. 36 FGH100M_Hardware_Design 5 / 41 Wi-Fi Module Series 7.3.2. Plastic Reel ................................................................................................................... 37 7.3.3. Mounting Direction ........................................................................................................ 37 7.3.4. Packaging Process ....................................................................................................... 38 8 Appendix References ....................................................................................................................... 39 FGH100M_Hardware_Design 6 / 41 Wi-Fi Module Series Table Index Table 1: Special Mark................................................................................................................................... 9 Table 2: Basic Information ......................................................................................................................... 10 Table 3: Key Features ................................................................................................................................ 11 Table 4: Wi-Fi Performances ..................................................................................................................... 13 Table 5: Wi-Fi Power Consumption ........................................................................................................... 14 Table 6: I/O Parameters Definition ............................................................................................................. 16 Table 7: Pin Description ............................................................................................................................. 16 Table 8: Antenna Design Requirements .................................................................................................... 21 Table 9: Absolute Maximum Ratings (Unit: V) ........................................................................................... 26 Table 10: Module Power Supply Ratings (Unit: V) .................................................................................... 26 Table 11: Electrostatics Discharge Characteristics (Unit: kV) ................................................................... 27 Table 12: VDDIO I/O Characteristics (Unit: V) ........................................................................................... 27 Table 13: Recommended Thermal Profile Parameters ............................................................................. 35 Table 14: Carrier Tape Dimension Table (Unit: mm) ................................................................................. 36 Table 15: Plastic Reel Dimension Table (Unit: mm) .................................................................................. 37 Table 16: Related Documents .................................................................................................................... 39 Table 17: Terms and Abbreviations ........................................................................................................... 39 FGH100M_Hardware_Design 7 / 41 Wi-Fi Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 12 Figure 2: Pin Assignment (Top View) ........................................................................................................ 15 Figure 3: Reference Circuit of Power Supply ............................................................................................. 19 Figure 4: SDIO Interface Connection ......................................................................................................... 20 Figure 5: Reference Circuit for RF Antenna Interface ............................................................................... 22 Figure 6: Microstrip Design on a 2-layer PCB ........................................................................................... 22 Figure 7: Coplanar Waveguide Design on a 2-layer PCB ......................................................................... 23 Figure 8: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ...................... 23 Figure 9: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ...................... 23 Figure 10: Dimensions of the Receptacle (Unit: mm) ................................................................................ 24 Figure 11: Specifications of Mated Plugs .................................................................................................. 25 Figure 12: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 25 Figure 13: Placement and Fixing of the Heatsink ...................................................................................... 28 Figure 14: Top and Side Dimensions ......................................................................................................... 29 Figure 15: Bottom Dimensions (Bottom View) ........................................................................................... 30 Figure 16: Recommended Footprint .......................................................................................................... 31 Figure 17: Top and Bottom Views .............................................................................................................. 32 Figure 18: Recommended Reflow Soldering Thermal Profile ................................................................... 34 Figure 19: Carrier Tape Dimension Drawing ............................................................................................. 36 Figure 20: Plastic Reel Dimension Drawing .............................................................................................. 37 Figure 21: Mounting Direction .................................................................................................................... 37 Figure 22: Packaging Process ................................................................................................................... 38 FGH100M_Hardware_Design 8 / 41 Wi-Fi Module Series 1 Introduction This document defines the FGH100M and describes its air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. 1.1. Special Mark Table 1: Special Mark Mark Definition

Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. to all FGH100M_Hardware_Design 9 / 41 Wi-Fi Module Series 2 Product Overview FGH100M is a long-range and low power Wi-Fi HaLow module compliant with IEEE 802.11ah Wi-Fi standard. It operates in Sub-1 GHz frequency band and features 32.5 Mbps maximum transmission rate. It provides SDIO 2.0 interface for Wi-Fi function. It is an SMD module with compact packaging. Related information is listed in the table below:

Table 2: Basic Information FCU760C Packaging type Pin counts Dimensions Weight LGA 40

(13.0 0.2) mm (13.0 0.2) mm (2.2 0.2) mm Approx. 0.72 g FGH100M_Hardware_Design 10 / 41 Wi-Fi Module Series 2.1. Key Features Table 3: Key Features Basic Information Protocols and Standards Wi-Fi Protocol: IEEE 802.11ah All hardware components are fully compliant with EU RoHS directive VBAT Power Supply:

3.03.6 V Typ.: 3.3 V VDD_FEM Power Supply:

3.03.6 V Typ.: 3.3 V VDDIO Power Supply 1:

1.83.6 V Typ.: 3.3 V Operating temperature 2: -30 to +85 C Storage temperature: -40 to +95 C Power Supply Temperature Ranges EVB Kit FGH100M-M.2 3 RF Antenna Interface Antenna Interface Application Interface ANT_WIFI 50 impedance Application Interfaces SDIO 2.0, JTAG 1 The VDDIO power supply should not exceed VBAT. 2 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules indicators comply with IEEE requirements. 3 For more details about the EVB, see document [1]. FGH100M_Hardware_Design 11 / 41 Wi-Fi Module Series 3 RF Performances 3.1. Wi-Fi Performances Table 4: Wi-Fi Performances Operating Frequency Sub-1 GHz: 902 ~ 928 MHz Modulation OFDM, BPSK, QPSK, 16QAM, 64QAM Operating Mode AP STA Transmission Data Rate 1 MHz: MCS 07, MCS 10 2 MHz: MCS 07 4 MHz: MCS 07 8 MHz: MCS 07 TTransmission Power ransmission Data Rate 18 ~ 22 dBm FGH100M_Hardware_Design 13 / 41 Wi-Fi Module Series Table 5: Wi-Fi Power Consumption Condition IVDD_FEM IVBAT Unit 802.11ah, Tx

@ 915 MHz 802.11ah, Rx

@ 915 MHz 1 MHz @ MCS 0 2 MHz @ MCS 0 4 MHz @ MCS 0 8 MHz @ MCS 0 1 MHz @ MCS 7 2 MHz @ MCS 7 4 MHz @ MCS 7 8 MHz @ MCS 7 120 114 104 93 72 58 45 35 1 MHz @ MCS 10 119 1 MHz @ MCS 0 2 MHz @ MCS 0 4 MHz @ MCS 0 8 MHz @ MCS 0 1 MHz @ MCS 7 2 MHz @ MCS 7 4 MHz @ MCS 7 8 MHz @ MCS 7 1 MHz @ MCS 10 5 5 5 5 5 5 5 5 5 58 60 64 72 49 48 49 54 58 27 29 36 42 29 31 36 43 28 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA FGH100M_Hardware_Design 14 / 41 Wi-Fi Module Series 4 Application Interfaces 4.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE 1. Keep all RESERVED or unused pins unconnected. 2. All GND pins should be connected to ground. FGH100M_Hardware_Design 15 / 41 23456789101112131415161718192021313029282726252423224039383736353433321GNDVDD_FEMWAKEUP_INRESET_NGNDGNDGNDGNDRESERVEDGPIO0GPIO1GPIO2GPIO3GPIO4GPIO5GPIO6VBATGNDJTAG_TDOSDIO_DATA2SDIO_DATA3VDDIOGNDSDIO_CMDSDIO_CLKSDIO_DATA0SDIO_DATA1GPIO10GPIO7GPIO8GPIO9JTAG_TMSJTAG_TDIJTAG_TRSTJTAG_TCKANT_WIFIGNDGNDRESERVEDGNDPowerGNDSDIOJTAGGPIORFCTLRESERVED Wi-Fi Module Series 4.2. Pin Description Table 6: I/O Parameters Definition Type AIO DI DO DIO PI Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 7: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment It must be provided with sufficient current up to 1.5 A. VBAT 17 PI VDD_FEM 4 PI VDDIO 22 PI Power supply for the module Power supply for the FEM Power supply for the I/O pins Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V Vmax = 3.6 V Vmin = 1.8 V Vnom = 3.3 V GND 13, 5, 7, 18, 21, 31, 38, 39 Wi-Fi Application Interface 4 Pin Name Pin No. I/O Description DC Characteristics Comment SDIO_CLK 24 DI SDIO clock VDDIO Require differential impedance of 50 . 4 The SDIO interface can be multiplexed into SPI. For more details, please contact Quectel Technical Support. FGH100M_Hardware_Design 16 / 41 Wi-Fi Module Series SDIO 2.0 compliant. Reserve 10100 k resistors to pull each of them up to VDDIO. SDIO_CMD 23 DIO SDIO command SDIO_DATA0 25 DIO SDIO data bit 0 SDIO_DATA1 26 DIO SDIO data bit 1 SDIO_DATA2 19 DIO SDIO data bit 2 SDIO_DATA3 20 DIO SDIO data bit 3 JTAG Interface Pin Name Pin No. I/O Description DC Characteristics Comment JTAG_TDO 32 DO JTAG test data out JTAG_TMS 33 JTAG_TDI 34 JTAG_TCK 36 JTAG_TRST 35 GPIO Interfaces DI DI DI DI JTAG test mode select JTAG test data in VDDIO JTAG test clock JTAG test reset Pull them down to GND with 10 k resistors. Pin Name Pin No. I/O Description DC Characteristics Comment Being multiplexed into BUSY interface to indicate Wi-Fi status. If needed, please contact Quectel Technical Support. VDDIO If unused, keep them open. GPIO0 10 DIO GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 11 12 13 14 15 DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output FGH100M_Hardware_Design 17 / 41 Wi-Fi Module Series GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 16 30 29 28 27 RF Antenna Interface DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output Pin Name Pin No. I/O Description ANT_WIFI 40 AIO Wi-Fi antenna interface Control Signals DC Characteristics Comment 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment WAKEUP_IN 6 DI Wakes the module RESET_N 8 DI Resets the module VBAT RESERVED Pins Pin Name Pin No. RESERVED 9, 37 Active low. A test point is recommended to be reserved if unused. Comment Keep them open. FGH100M_Hardware_Design 18 / 41 Wi-Fi Module Series 4.3. Power Supply The module is powered by VBAT. It is recommended to use a power supply chip with sufficient up to 1.5 A. For better power supply performance, it is recommended to parallel a 47 F decoupling capacitor, and 1 F and 100 nF filter capacitors near the modules VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module.In principle, the longer the VBAT trace is, the wider it should be. VBAT reference circuit is shown below:

Figure 3: Reference Circuit of Power Supply The VDD_FEM is the power supply for FEM whose reference circuit is the same as VBAT. The power domains of I/O pins are determined by VDDIO which is connected to the same power as the host. There are no timing requirements among VBAT, VDD_FEM and VDDIO, but the VDDIO power supply should not exceed VBAT. FGH100M_Hardware_Design 19 / 41 ModuleVBATVBATD1C2C3C4NMC147 F1 F100 nFR10R Wi-Fi Module Series 4.4. Wi-Fi Application Interface The module provides SDIO 2.0 interface for Wi-Fi function. If power saving mode is used, a GPIO of the host is needed to be set as a CMOS input pin to receive the BUSY signal from the pin 10 (GPIO0) of the module. If needed, please contact Quectel Technical Support. 4.4.1. SDIO Interface SDIO interface connection between the module and the host is illustrated in the following figure. Figure 4: SDIO Interface Connection To ensure compliance of interface design with the SDIO 2.0 specification, it is recommended to adopt the following principles:

To avoid jitter of bus, pull up SDIO_CMD and SDIO_DATA_[0:3]/SDIO_CMD to VDDIO with resistors respectively. Value range of these resistors should be 10100 k and the recommended value is 10 k. The impedance of SDIO signal traces is 50 10 %. Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits and analog signals, as well as noise signals such as clock signals and DC-DC signals. The distance between SDIO signals and other signals must be greater than twice the trace width, and the bus load capacitance must be less than 15 pF. FGH100M_Hardware_Design 20 / 41 SDIO_CLKSDIO_CMDSDIO_DATA0SDIO_DATA1SDIO_DATA2SDIO_DATA3HostModuleSDIO_DATA0SDIO_DATA1SDIO_DATA2SDIO_DATA3SDIO_CLKSDIO_CMDNM_10KVDDIONM_10KNM_10KNM_10KNM_10KNMNMNMNMNMNMNM_10K Wi-Fi Module Series 4.5. JTAG Interface The module provides a JTAG interface for module debugging and testing. Its circuit will only be reset by JTAG_TRST pin. Ensure the pin 35 (JTAG_TRST) is pulled down to GND with a 10 k resistor during power-up. The JTAG interface supports:

Custom internal test logic enabling (scan mode, MBIST mode). RISC-V debug logic for CPU and system debug. Custom JTAG block registers. The data rate of JTAG interface will be constrained to 50 MHz in mission/functional and scan modes. 4.6. RF Antenna Interface Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. The module supports one antenna interface (ANT_WIFI). The impedance of antenna port is 50 . Table 8: Antenna Design Requirements Parameter Requirement 5 Frequency Ranges (MHz) 850950 Cable Insertion Loss (dB) VSWR Gain (dBi) Max Input Power (W) Input Impedance ()

< 1 2 1 (Typ) 50 50 Polarization Type Vertical 5 For more details about the RF performances, see Chapter 3. FGH100M_Hardware_Design 21 / 41 Wi-Fi Module Series 4.6.1. Reference Design A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a -type matching circuit and add ESD protection components for better RF performance. Reserved matching components (R1, C1, C2, and D1) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 . Figure 5: Reference Circuit for RF Antenna Interface 4.6.2. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 6: Microstrip Design on a 2-layer PCB FGH100M_Hardware_Design 22 / 41 ANT_WIFI/BTR1 C1NMC2NMModule0RD1NM Wi-Fi Module Series Figure 7: Coplanar Waveguide Design on a 2-layer PCB Figure 8: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 9: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) FGH100M_Hardware_Design 23 / 41 Wi-Fi Module Series To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [2]. 4.6.3. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 10: Dimensions of the Receptacle (Unit: mm) FGH100M_Hardware_Design 24 / 41 Wi-Fi Module Series U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 11: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 12: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FGH100M_Hardware_Design 25 / 41 Wi-Fi Module Series 5 Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 9: Absolute Maximum Ratings (Unit: V) Parameter VBAT VDD_FEM VDDIO Min.

-0.3

-0.3

-0.3 Max. 4.3 4.3 4.3 5.2. Power Supply Ratings Table 10: Module Power Supply Ratings (Unit: V) Parameter VBAT VDD_FEM VDDIO Min. Typ. Max. 3.0 3.0 1.8 3.3 3.3 3.3 3.6 3.6 3.6 FGH100M_Hardware_Design 26 / 41 Wi-Fi Module Series 5.3. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 11: Electrostatics Discharge Characteristics (Unit: kV) Model Test Result Standard Human Body Model (HBM) 1.5 ESDA/JEDEC JS-001-2017 Charge Device Model (CDM) 0.25 ESDA/JEDEC JS-002-2018 5.4. Digital I/O Characteristics Table 12: VDDIO I/O Characteristics (Unit: V) Parameter Description Min. Max. VIH VIL VOH VOL High-level Input Voltage 0.7 VDDIO VDDIO + 0.2 Low-level Input Voltage

-0.3 0.3 VDDIO High-level Output Voltage 0.9 VDDIO

Low-level Output Voltage

0.1 VDDIO 5.5. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

FGH100M_Hardware_Design 27 / 41 Wi-Fi Module Series Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:

- Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.

- Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

- Choose the heatsink with adequate fins to dissipate heat;

- Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

- Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 13: Placement and Fixing of the Heatsink FGH100M_Hardware_Design 28 / 41 PCBHeatsinkTIMModuleScrewTIMModuleHeatsinkPCB Wi-Fi Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 14: Top and Side Dimensions FGH100M_Hardware_Design 29 / 41 Wi-Fi Module Series Figure 15: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FGH100M_Hardware_Design 30 / 41 6.2. Recommended Footprint Wi-Fi Module Series Figure 16: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FGH100M_Hardware_Design 31 / 41 6.3. Top and Bottom Views Wi-Fi Module Series Figure 17: Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FGH100M_Hardware_Design 32 / 41 Wi-Fi Module Series 7 Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 6 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 6 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. FGH100M_Hardware_Design 33 / 41 Wi-Fi Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [3]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 18: Recommended Reflow Soldering Thermal Profile FGH100M_Hardware_Design 34 / 41 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100Ramp-to-soak slope: 03 C/sCool-down slope: -30 C/sRamp-up slope: 03 C/s Wi-Fi Module Series Table 13: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3]. FGH100M_Hardware_Design 35 / 41 Wi-Fi Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape Dimension details are as follow:

Figure 19: Carrier Tape Dimension Drawing Table 14: Carrier Tape Dimension Table (Unit: mm) W 24 P 20 T A0 B0 K0 0.4 13.4 13.4 2.95 K1 5.6 F E 11.5 1.75 FGH100M_Hardware_Design 36 / 41 Wi-Fi Module Series 7.3.2. Plastic Reel Figure 20: Plastic Reel Dimension Drawing Table 15: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 24.5 7.3.3. Mounting Direction Figure 21: Mounting Direction FGH100M_Hardware_Design 37 / 41 Wi-Fi Module Series 7.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 22: Packaging Process FGH100M_Hardware_Design 38 / 41 Wi-Fi Module Series 8 Appendix References Table 16: Related Documents Document Name

[1] Quectel_FGH100M-M.2_User_Guide

[2] Quectel_RF_Layout_Application_Note

[3] Quectel_Module_SMT_Application_Note Table 17: Terms and Abbreviations Abbreviation Description AP BPSK CCK CDM COMS CPU ESD EVM FEM GND GPIO HBM Access Point Binary Phase Shift Keying Complementary Code Keying Charge Device Model Complementary Metal Oxide Semiconductor Central Processing Unit Electrostatic Discharge Error Vector Magnitude Front-End Module Ground General-Purpose Input/Output Human Body Model FGH100M_Hardware_Design 39 / 41 Wi-Fi Module Series IEEE I/O JTAG LGA MBIST Mbps MCS MSL OFDM PCB QAM QPSK RF Institute of Electrical and Electronics Engineers Input/Output Joint Test Action Group Land Grid Array Memory Build-In-Self Test Million Bits Per Second Modulation and Coding Scheme Moisture Sensitivity Levels Orthogonal Frequency-Division Multiplexing Printed Circuit Board Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency RISC-V Reduced Instruction Set Computer Five RoHS Rx SDIO SPDT SPI SMT STA TBD TVS VBAT Tx Restriction of Hazardous Substances Receive Secure Digital Input/Output Single Pole Double Throw Serial Peripheral Interface Surface Mount Technology Station To Be Determined Transient Voltage Suppressor Voltage at Battery (Pin) Transmit FGH100M_Hardware_Design 40 / 41 Wi-Fi Module Series VIH VIL Vmax Vmin Vnom VOH VOL VSWR Wi-Fi High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Nominal Voltage High-level Output Voltage Low-level Output Voltage Voltage Standing Wave Ratio Wireless Fidelity FGH100M_Hardware_Design 41 / 41 OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2023FGH100M Contains IC: 10224A-2023FGH100M. The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. Antenna

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed Technology Frequency Range (MHz) Antenna Type Max Peak Gain (dBi) 802.11ah 902 ~ 928MHz Dipole 2.5 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27, part 90 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-

radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body. Industry Canada Statement This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."

Radiation Exposure Statement This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions cannot be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 10224A-2023FGH100M. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-2023FGH100M ". Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel.

CO QUELTEL FGHIOQM = Qi-AXxxx FGH100MAAMD SN:E1A17KM1 AXXXXxX1 C FCC ID:XMR2023FGH100M 1C:10224A-2023FGH100M 7 SAU AA AN AAA LAE HY 53 4 5a ae 2 oor i VF es Ui is Caco | nee ang ee fae el Tal 12 PY aoegmems 6 slvahvsivtitiahntiaalalietialudodntiedilin wii

Quectel Wireless Solutions Co., Ltd Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 11-30-2023 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing and Part 2.911(d)(5)(ii) Filing FCC ID: XMR2023FGH100M 1. Quectel Wireless Solutions Co., Ltd (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. 2. Quectel Wireless Solutions Co., Ltd (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List (as a specifically named entity or any of its subsidiaries of affiliates) as an entity producing covered equipment. Sincerely, Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/11/30

Quectel Wireless Solutions Co., Ltd Confidentiality Request Letter Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR2023FGH100M Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

1. Block Diagram 2. Schematics 3. Operational Description The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Rule 0.457, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, _________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/11/30

Quectel Wireless Solutions Co., Ltd Declaration of Conformity Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR2023FGH100M Please be notified that we, the undersigned, Quectel Wireless Solutions Co., Ltd declares that the product which bears the above FCC ID is also compliant with the FCC requirements for sDOC. And the sDOC procedure shall be carried out prior to marketing the device in the US. Sincerely, _________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/11/30

Quectel Wireless Solutions Co., Ltd Request for Modular/Limited Modular Approval Date: 2023.11.30 Subject: Manufacturers Declaration for

- Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval Confidentiality Request for: XMR2023FGH100M 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i) Requirement Met

- YES - NO(*) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>

2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)

- YES - NO(*) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>

3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)

- YES - NO(*) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>

4. The modular transmitter must comply with the antenna and transmission system 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna requirements of must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)

- YES - NO(*) Details: <example The module connects to its antenna using an UFL connector which is considered a non-

standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>

5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v)

- YES - NO(*) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>

6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see KDB Publication 784748). Modular Approval Requirement Requirement Met If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:

XMR2023FGH100M or Contains FCC ID: XMR2023FGH100M Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi)

- YES - NO(*) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>

7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)

- YES - NO(*) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>

8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: < The module meets RF exposure in mobile configuration.>

- YES - NO(*) 070920-02b Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval

(LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>

Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met

- Provided in Separate Cover Letter

- N/A Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >

2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: <example N/A>

Split Modular Requirements Requirement 1. For split modular transmitters, specific descriptions for secure communications Provided in Manual between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained.

- Provided in Separate Cover Letter

- N/A Details: <example N/A >

070920-02b OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 point systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. _____________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/11/30 070920-02b

Quectel Wireless Solutions Co., Ltd Declaration of Authorization We Name: Quectel Wireless Solutions Co., Ltd Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declare that:

Name Representative of agent: Marlin Chen Agent Company name:

Address:

MRT Technology (Suzhou) Co., Ltd D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone Suzhou China City:

Country:

is authorized to apply for Certification of the following product(s):

Product:

FCC ID:

Model No.:

Sincerely, Wi-Fi HaLow Module XMR2023FGH100M FGH100M ________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/11/30

QUECCTEL Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject: Certification designating a U.S. agent for service of process pursuant to Part 2.911(d)(7) To whom it may concern, Quectel Wireless Solutions Company Limited, FRN: 0018988279, Grantee Code: XMR (the applicant) certifies that, as of the date of the filing of application, Ikotek USA, Inc., FRN: 0033350331 (the agent) is designated as the U.S. agent for the purpose of accepting service of process on behalf of the applicant. The physical U.S. address and email for the designated agent are:

Physical U.S. address: 9920 Pacific Heights Blvd., Ste. 150, #7025, San Diego, CA 92121 Email: compliance@ikotek.com The applicant accepts to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The agent accepts the designation by (the applicant) as the U.S. agent to accept service of process includes, but is not limited to, delivery of any correspondence, notices, orders, decisions, and requirements of administrative, legal, or judicial process related to Commission proceedings. Signed by the Applicant Signed by the Agent (if different from the Applicant) 7 he! Jean Hu Name: eterson Title Certification Manager Title: CEO. Email: Jean.hu@quectel.com Email: joe.peterson@ikotek.com Date: 07 July, 2023 Date: 07 July, 2023