FCC ID: XMR201703FC20N WiFi Module

FC20-N Series Hardware Design Wi-Fi Module Series Rev. FC20-N_Series_Hardware_Design_V1.0 Date: 2016-11-02 www.quectel.com FC20-N Series Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/salesupport.aspx For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/techsupport.aspx Or email to: Support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2016. All rights reserved. FC20-N_Series_Hardware_Design Confidential / Released 1 /

47 FC20-N Series Hardware Design About the Document History Revision Date Author Description 1.0 2016-11-02 Power JIN Initial FC20-N_Series_Hardware_Design Confidential / Released 2 /

47 FC20-N Series Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 5 Figure Index ................................................................................................................................................. 6 1 Introduction .......................................................................................................................................... 7 Safety Information ................................................................................................................... 7 1.1. 2.1. 2.2. 2 Product Concept .................................................................................................................................. 9 General Description ................................................................................................................. 9 Directives and Standards ........................................................................................................ 9 FCC Statement ................................................................................................................. 9 FCC Radiation Exposure Statement ................................................................................ 9 Key Features ......................................................................................................................... 10 Functional Diagram ............................................................................................................... 11 Evaluation Board ................................................................................................................... 12 2.3. 2.4. 2.5. 2.2.1. 2.2.2. 3.1. 3.2. 3.3. 3.4. 3.5. 3 Application Interfaces ....................................................................................................................... 13 General Description ............................................................................................................... 13 Pin Assignment ...................................................................................................................... 14 Pin Description ...................................................................................................................... 15 Power Supply ........................................................................................................................ 18 WLAN Interface ..................................................................................................................... 20 3.5.1. WAKE_ON_WIRELESS Interface ................................................................................. 21 3.5.2. WLAN_EN ...................................................................................................................... 21 3.5.3. SDIO Interface ............................................................................................................... 21 Coexistence Interface ............................................................................................................ 23 Other Interfaces ..................................................................................................................... 23 3.7.1. DBG_TXD Interface ....................................................................................................... 23 3.7.2. 32KHz_IN Interface ........................................................................................................ 24 Antenna Interface .................................................................................................................. 24 3.8.1. Pin Definition of the RF Antenna .................................................................................... 24 3.8.2. Operating Frequency ..................................................................................................... 25 3.8.3. Reference Design .......................................................................................................... 25 3.8.4. Antenna Requirements .................................................................................................. 25 3.8.5. Install the Antenna with RF Connector .......................................................................... 26 3.6. 3.7. 3.8. 4 Electrical, Reliability and Radio Characteristics ............................................................................ 29 General Description ............................................................................................................... 29 Electrical Characteristics ....................................................................................................... 29 I/O Interface Characteristics .................................................................................................. 30 Current Consumption ............................................................................................................ 30 4.1. 4.2. 4.3. 4.4. FC20-N_Series_Hardware_Design Confidential / Released 3 /

47 FC20-N Series Hardware Design 4.5. 4.6. RF Performance .................................................................................................................... 32 Electrostatic Discharge .......................................................................................................... 34 5 Mechanical Dimensions .................................................................................................................... 35 Mechanical Dimensions of the Module ................................................................................. 35 Recommended Footprint and Stencil .................................................................................... 37 Top and Bottom View of the Module ..................................................................................... 39 5.1. 5.2. 5.3. 6 Storage, Manufacturing and Packaging .......................................................................................... 40 Storage .................................................................................................................................. 40 Soldering ............................................................................................................................... 41 Packaging .............................................................................................................................. 42 Tape and Reel Packaging .............................................................................................. 42 6.1. 6.2. 6.3. 6.3.1. 7 Appendix A References ..................................................................................................................... 44 FC20-N_Series_Hardware_Design Confidential / Released 4 /

47 FC20-N Series Hardware Design Table Index TABLE 1: FC20 SERIES PRODUCTS ................................................................................................................ 7 TABLE 2: KEY FEATURES ............................................................................................................................... 10 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 15 TABLE 5: POWER SUPPLY PINS AND GND PINS .......................................................................................... 18 TABLE 6: PIN DEFINITION OF WAKE_ON_WIRELESS ................................................................................. 21 TABLE 7: PIN DEFINITION OF WLAN_EN ....................................................................................................... 21 TABLE 8: PIN DEFINITION OF THE SDIO INTERFACE .................................................................................. 21 TABLE 9: PIN DEFINITION OF COEXISTENCE INTERFACE ......................................................................... 23 TABLE 10: PIN DEFINITION OF DBG_TXD INTERFACE ................................................................................ 24 TABLE 11: PIN DEFINITION OF 32KHZ_IN INTERFACE ................................................................................ 24 TABLE 12: PIN DEFINITION OF THE RF ANTENNA ....................................................................................... 24 TABLE 13: OPERATING FREQUENCY OF THE MODULE ............................................................................. 25 TABLE 14: ANTENNA CABLE REQUIREMENTS ............................................................................................. 26 TABLE 15: ANTENNA REQUIREMENTS .......................................................................................................... 26 TABLE 16: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 29 TABLE 17: RECOMMENDED OPERATING CONDITIONS .............................................................................. 30 TABLE 18: GENERAL DC ELECTRICAL CHARACTERISTICS ....................................................................... 30 TABLE 19: CURRENT CONSUMPTION OF THE MODULE IN LOW POWER MODE .................................... 30 TABLE 20: CURRENT CONSUMPTION OF THE MODULE ............................................................................ 31 TABLE 21: CONDUCTED RF OUTPUT POWER AT 2.4GHZ .......................................................................... 32 TABLE 22: CONDUCTED RF OUTPUT POWER AT 5GHZ ............................................................................. 33 TABLE 23: CONDUCTED RF RECEIVING SENSITIVITY AT 2.4GHZ ............................................................. 33 TABLE 24: CONDUCTED RF RECEIVING SENSITIVITY AT 5GHZ ................................................................ 34 TABLE 25: REEL PACKAGING ......................................................................................................................... 43 TABLE 26: RELATED DOCUMENTS ................................................................................................................ 44 TABLE 27: TERMS AND ABBREVIATIONS ...................................................................................................... 44 FC20-N_Series_Hardware_Design Confidential / Released 5 /

47 FC20-N Series Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM OF FC20-N MODULE ............................................................................ 11 FIGURE 2: PIN ASSIGNMENT OF FC20 SERIES MODULE ........................................................................... 14 FIGURE 3: REFERENCE CIRCUIT FOR VDD_3V3 ........................................................................................ 19 FIGURE 4: TIMING OF POWER ON/OFF THE FC20 SERIES MODULE ....................................................... 20 FIGURE 5: WLAN INTERFACE CONNECTION ............................................................................................... 20 FIGURE 6: SDIO INTERFACE CONNECTION ................................................................................................. 22 FIGURE 7: COEXISTENCE INTERFACE CONNECTION ................................................................................ 23 FIGURE 8: REFERENCE CIRCUIT FOR RF ANTENNA INTERFACE ............................................................ 25 FIGURE 9: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) .................................................. 26 FIGURE 10: MECHANICALS OF UF.L-LP CONNECTORS (UNIT: MM) .......................................................... 27 FIGURE 11: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ............................................................ 27 FIGURE 12: FC20 TOP AND SIDE DIMENSIONS (UNIT: MM) ........................................................................ 35 FIGURE 13: FC20 BOTTOM DIMENSIONS (UNIT: MM) ................................................................................. 36 FIGURE 14: RECOMMENDED FOOTPRINT (UNIT: MM) ................................................................................ 37 FIGURE 15: RECOMMENDED STENCIL (UNIT: MM) ..................................................................................... 38 FIGURE 16: TOP VIEW OF THE MODULE ...................................................................................................... 39 FIGURE 17: BOTTOM VIEW OF THE MODULE .............................................................................................. 39 FIGURE 18: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 41 FIGURE 19: TAPE DIMENSIONS (UNIT: MM) .................................................................................................. 42 FIGURE 20: REEL DIMENSIONS (UNIT: MM) ................................................................................................. 43 FC20-N_Series_Hardware_Design Confidential / Released 6 /

47 FC20-N Series Hardware Design 1 Introduction This document defines the FC20 series module and describes its hardware interface which is connected with the customers application as well as its air interface. The document can help customers quickly understand module interface specifications, as well as the electrical and mechanical details. Associated with application note and user guide, customers can use FC20 series module to design and set up mobile applications easily. FC20 series module contains two variants: FC20 and FC20-N. Customers can choose the dedicated type basing on their requirements. The following table shows the entire models of FC20 series. Table 1: FC20 Series Products Module FC20-N Wi-Fi 2.4GHz BT Not Supported 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating FC20 series module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. FC20-N_Series_Hardware_Design Confidential / Released 7 /

47 FC20-N Series Hardware Design Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals, clinics or other health care facilities. These requests are desinged to prevent possible interference with sensitive medical equipment. Cellular terminals or mobiles operating over radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. FC20-N_Series_Hardware_Design Confidential / Released 8 /

47 FC20-N Series Hardware Design 2 Product Concept 2.1. General Description FC20-N module is a low-power and low-cost wireless module based on QCA9377-3. FC20-N module only supports 11 IEEE 802.11 b/g/n WLAN standards. 2.2. Directives and Standards The FC20-N module is designed to comply with the FCC statements. FCC ID: XMR201703FC20N The Host system using FC20-N should have label contains FCC ID: XMR201701FC20N 2.2.1. FCC Statement Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. 2.2.2. FCC Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this module usage. This module should NOT be installed and operating simultaneously with other radio. The manual of the host system, which uses FC20-N, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of FC20-N module depending on the Mobile status. Note: If a portable device (such as PDA) uses FC20-N module, the device needs to do permissive change and SAR testing. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful FC20-N_Series_Hardware_Design Confidential / Released 9 /

47 FC20-N Series Hardware Design interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between theequipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help. 2.3. Key Features The following table describes the detailed features of FC20-N module. Table 2: Key Features Features Implementation Power Supply Main supply voltage: 3.3V, 400mA IO supply voltage: 1.8V FC20-N: 802.11b: 1, 2, 5.5, 11Mbps Transmission Data 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Transmitting Power FC20-N: 802.11b/11Mbps: 17dBm 802.11g/54Mbps: 15dBm 802.11n/HT20 MCS7: 14dBm 802.11n/HT40 MCS7: 13dBm Protocol Features FC20-N: IEEE 802.11b/g/n Operator Mode Modulation AP STA*

802.11b: DSSS 802.11g/n20/n40: OFDM WLAN Interface SDIO 3.0 Antenna Interface Wi-Fi antenna, 50 Physical Characteristics Interface: LCC+LGA Size: 16.60.15 130.15 2.10.2mm Temperature Range Weight: about 0.81g Operating temperature range: -35C~+75C 1) Extended temperature range : -40C~+85C 2) FC20-N_Series_Hardware_Design Confidential / Released 10 /

47 FC20-N Series Hardware Design All hardware components are fully compliant with EU RoHS directive RoHS NOTES 1. 2. 1) Within operation temperature range, the module is IEEE compliant. 2) Within extended temperature range, the module remains the ability for data transmission. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet IEEE compliant again. 2.4. Functional Diagram The following figure shows a block diagram of FC20-N module and illustrates the major functional parts. Power supply SDIO PCM and UART RF antenna NOTE Figure 1: Functional Diagram of FC20-N Module FC20-N_Series_Hardware_Design Confidential / Released 11 /

47 WLAN_EN RF_ANTVDD_3V3VIODiplexer48MHzXOTX/RXSDIOMAC/BB/Radio2.4G FilterCOEX_UARTWAKE_ON_WIRELESS FC20-N Series Hardware Design Please keep these pins open in FC20-N. 2.5. Evaluation Board In order to help customers to develop applications with FC20-N module, Quectel supplies an evaluation board (EVB), a RS-232 to USB cable, a USB data cable, a power adapter, 4 antennas and other peripherals to control or test the module. For details, please refer to document [1]. FC20-N_Series_Hardware_Design Confidential / Released 12 /

47 FC20-N Series Hardware Design 3 Application Interfaces 3.1. General Description FC20-N module is equipped with 38 LCC pads and 14 LGA pads that can be connected to the cellular application platform. Sub-interfaces included in these pads are described in details in following chapters:

Power supply WLAN interface Coexistence interface Antenna interface FC20-N_Series_Hardware_Design Confidential / Released 13 /

47 FC20-N Series Hardware Design 3.2. Pin Assignment Figure 2: Pin Assignment of FC20 Series Module NOTE Please keep all RESERVED pins open. FC20-N_Series_Hardware_Design Confidential / Released 14 /

47 323435333637382928303127262423252221201917161815141347484946WLAN_ENGNDRF_ANTGNDGNDSDIO_CMDSDIO_CLKSDIO_D0SDIO_D1SDIO_D2SDIO_D3VDD_3V3GNDGNDRESERVEDDBG_TXDBT_UART_CTSBT_ENVIORESERVEDGND PinsLTE_UART_TXDLTE_UART_RXDBT_UART_RTS34215689710111251505240394142444543PCM_INPCM_SYNCPCM_CLKPCM_OUTBT_UART_TXDBT_UART_RXD32KHz_INGNDGNDRESERVEDRESERVEDRESERVEDRESERVEDWAKE_ON_WIRELESSPower PinsGNDSignal PinsReserved Pins FC20-N Series Hardware Design 3.3. Pin Description The following tables show the pin definition of FC20 series. Table 3: I/O Parameters Definition Type Description Bidirectional input/output Digital input Digital output Power input IO DI DO PI Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VDD_3V3 21 PI VIO 11 PI Main power supply for module Power supply for module IO pin Vmax=3.46V Vmin=3.14V Vnorm=3.3V Vmax=1.89V Vmin=1.71V Vnorm=1.8V It must be able to provide sufficient current up to 0.9A. It is powered by EC20 R2.0/EC21/EC25 module. GND 1, 12, 20, 28, 29, 31, 36, 38~40, 43~45, 48~52 WLAN Interface Ground Pin Name Pin No. I/O Description DC Characteristics Comment WAKE_ON_ WIRELESS 32 DO Wake up host WLAN_EN 9 DI WLAN enabled VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V 1.8V power domain. Active low. If unused, keep this pin open. 1.8V power domain. Active high. FC20-N_Series_Hardware_Design Confidential / Released 15 /

47 FC20-N Series Hardware Design SDIO_D3 22 IO SDIO data pin bit 3 SDIO_D2 23 IO SDIO data pin bit 2 SDIO_D1 24 IO SDIO data pin bit 1 SDIO_D0 25 IO SDIO data pin bit 0 SDIO_CLK 26 DI SDIO clock SDIO_CMD 27 IO SDIO command VIHmin=1.26V VIHmax=2.0V VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain 1.8V power domain. Require external pull-up to 1.8V. 1.8V power domain 1.8V power domain 1.8V power domain 1.8V power domain BT Interface Pin Name Pin No. I/O Description DC Characteristics Comment BT_EN 10 DI Bluetooth enabled VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. Active high. FC20-N_Series_Hardware_Design Confidential / Released 16 /

47 FC20-N Series Hardware Design PCM_IN 13 DI Bluetooth PCM data input PCM_SYNC 14 DI Bluetooth PCM data frame sync signal PCM_CLK 15 DI Bluetooth PCM clock VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V PCM_OUT 16 DO Bluetooth PCM data output VOLmax=0.18V VOHmin=1.62V BT_UART_ RTS BT_UART_ CTS 7 8 DO Request to send DI Clear to send VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V BT_UART_ TXD 17 DO Bluetooth transmits data VOLmax=0.18V VOHmin=1.62V BT_UART_ RXD 18 DI Bluetooth receives data Coexistence Interface VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. 1.8V power domain. If unused, keep this pin open. 1.8V power domain. If unused, keep this pin open. 1.8V power domain. If unused, keep this pin open. 1.8V power domain. If unused, keep this pin open. 1.8V power domain. If unused, keep this pin open. 1.8V power domain. If unused, keep this pin open. 1.8V power domain. If unused, keep this pin open. Pin Name Pin No. I/O Description DC Characteristics Comment 5 6 LTE_UART_ TXD LTE_UART_ RXD RF Interface DO DI LTE coexistence signal VOLmax=0.18V VOHmin=1.62V LTE coexistence signal VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. 1.8V power domain. If unused, keep this pin open. Pin Name Pin No. I/O Description DC Characteristics Comment FC20-N_Series_Hardware_Design Confidential / Released 17 /

47 FC20-N Series Hardware Design RF_ANT 30 IO WLAN and BT antenna 50 impedance. Other Pins Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 4 DO Software debugging Low power. External 32.768KHz 32KHz_IN 19 DI clock input is required in sleep mode. RESERVED Pins VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. 1.8V power domain. If unused, keep this pin open. Pin Name Pin No. I/O Description DC Characteristics Comment Reserved Keep these pins unconnected. 2, 3, 33~35, 37, 41, 42, 46, 47 RESERVED NOTE FC20-N module does not support BT interface and coexistence interface. 3.4. Power Supply The following table shows the power supply pins and the ground pins of FC20 series. The VIO is powered by EC20 R2.0/EC21/EC25. Table 5: Power Supply Pins and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VDD_3V3 21 Main power supply for module 3.14 3.3 3.46 V VIO 11 Power supply for module IO 1.71 1.8 1.89 V GND 1, 12, 20, Ground FC20-N_Series_Hardware_Design Confidential / Released 18 /

47 FC20-N Series Hardware Design 28, 29, 31, 36, 38~40, 43~45, 48~52 FC20 series is powered by VDD_3V3, and it is recommended to use power supply chip whose maximum output current is more than 1.2A. The following figure shows a reference design for VDD_3V3, which is controlled by PM_ENABLE. And PM_ENABLE should be connected to pin 127 of EC20 R2.0/EC21/EC25. For more details, please refer to document [2], [3] or [4]. Figure 3: Reference Circuit for VDD_3V3 FC20-N_Series_Hardware_Design Confidential / Released 19 /

47 TPS630242L1L1L2L2VINVINVINVINAGNDENVOUTVOUTVOUTPFM/PWMFBPGNDD2D3E1E2E3E4C4D1B1A1L1L2PGNDPGNDU402D4B2B3A2A3A4B4C1C2C3C406R408C40510uF1ML4011uHR407100K22uFC40722uFPM_ENABLEDC_5VDC_5VVDD_3V3 FC20-N Series Hardware Design The following figure shows the recommended power on/off sequences for FC20 series. Figure 4: Timing of Power ON/OFF the FC20 Series Module Execute AT command AT+QWIFI=1 to open VDD_3V3 and WLAN. 3.5. WLAN Interface The following figure shows the WLAN interface connection between FC20 series and EC20 R2.0/EC21/EC25. Figure 5: WLAN Interface Connection FC20-N_Series_Hardware_Design Confidential / Released 20 /

47 VDD_3V3 5usModule StatusRunnigWLAN_ENPower upPower downTBDPM_ENABLE>0> 0VIOBT_ENEC20 R2.0/EC21/EC25FC20 SeriesSDIOWLAN_ENWLAN_ENWAKE_ON_WIRELESSWAKE_ON_WIRELESSSDIO FC20-N Series Hardware Design 3.5.1. WAKE_ON_WIRELESS Interface WAKE_ON_WIRELESS interface is used to wake up the EC20 R2.0/EC21/EC25. When WAKE_ON_WIRELESS is pulled down, EC20 R2.0/EC21/EC25 can be woken up. Table 6: Pin Definition of WAKE_ON_WIRELESS Pin Name Pin No. I/O Description Comment WAKE_ON_WIRELESS 32 DO Wake up host If unused, keep this pin Active low. open. 3.5.2. WLAN_EN WLAN_EN is used to control the WLAN function of FC20 series. When WLAN_EN is at high level voltage, WLAN function will be enabled. Table 7: Pin Definition of WLAN_EN Pin Name Pin No. I/O Description Comment WLAN_EN 9 DI WLAN enabled Active high NOTE WLAN_EN is a sensitive signal, which should be guarded by ground and routed as close as possible to FC20 series module. 3.5.3. SDIO Interface The following table shows the pin definition of the SDIO interface of FC20 series. Table 8: Pin Definition of the SDIO Interface Pin Name Pin No. I/O Description Comment SDIO_D3 SDIO_D2 22 23 IO IO SDIO data pin bit 3 1.8V power domain SDIO data pin bit 2 1.8V power domain. Require external pull-up to FC20-N_Series_Hardware_Design Confidential / Released 21 /

47 FC20-N Series Hardware Design SDIO_D1 SDIO_D0 SDIO_CLK SDIO_CMD 24 25 26 27 1.8V. IO IO DI IO SDIO data pin bit 1 1.8V power domain SDIO data pin bit 0 1.8V power domain SDIO clock 1.8V power domain SDIO command 1.8V power domain The following figure shows the SDIO interface connection between FC20 series and EC20 R2.0/EC21/EC25. Figure 6: SDIO Interface Connection In order to ensure the performance of SDIO, please comply with the following principles:

SDIO signals are very high-speed signals. Please prevent crosstalk between them and other sensitive signals. Keep SDIO traces as parallel as possible in the same layer. Make sure SDIO lines are guarded by ground vias and not crossed. Do not route SDIO signal traces under crystals, oscillators, magnetic devices and RF signal traces. The pull-up resistor on SDIO_D2 line must be mounted. Keep SDIO traces as short as possible with equal length, and impedance control as 50. The spacing to all other signals is greater than 2 times of the line width. FC20-N_Series_Hardware_Design Confidential / Released 22 /

47 SDIO_CLKSDIO_CMDSDIO_D0SDIO_D1SDIO_D2SDIO_D3EC20 R2.0/EC21/EC25FC20 SeriesSD1_D0SD1_D1SD1_D2SD1_D3SD1_CLKSD1_CMD10KNM_10KVIOVIOVIOVIOVIOVIONM_10KNM_10KNM_10KNM_10KNM_10nF FC20-N Series Hardware Design 3.6. Coexistence Interface Coexistence function is only supported by FC20. Please keep these pins open in FC20-N. The following table shows the pin definition of FC20s coexistence interface. Table 9: Pin Definition of Coexistence Interface Pin Name Pin No. I/O Description Comment LTE_UART_TXD LTE_UART_RXD 5 6 DO LTE coexistence signal DI LTE coexistence signal If unused, keep this pin open. If unused, keep this pin open. FC20 module supports LTE-WLAN coexistence and LTE-BT coexistence. The following figure shows the coexistence interface connection between FC20 and EC20 R2.0/EC21/EC25. Figure 7: Coexistence Interface Connection NOTE LTE-BT coexistence function is under development. 3.7. Other Interfaces 3.7.1. DBG_TXD Interface DBG_TXD interface can be used for log output. FC20-N_Series_Hardware_Design Confidential / Released 23 /

47 LTE_UART_RXDLTE_UART_TXDFC20 COEX_UART_RXCOEX_UART_TXEC2 R2.0/EC21/EC25 FC20-N Series Hardware Design Table 10: Pin Definition of DBG_TXD Interface Pin Name Pin No. I/O Description Comment DBG_TXD 4 DO Software debugging If unused, keep this pin open. 3.7.2. 32KHz_IN Interface The 32KHz clock is used in low power mode such as IEEE power saving mode and sleep mode. It serves as a timer to determine when to wake up FC20 series module to receive beacons in various power saving schemes, and to maintain basic logic operations when in sleep mode. The sleep clock signal is transferred from EC20 R2.0/EC21/EC25 module. Table 11: Pin Definition of 32KHz_IN Interface Pin Name Pin No. I/O Description Comment 32KHz_IN 19 DI Low power. External 32.768KHz If unused, keep this pin clock input is required open. in sleep mode. 3.8. Antenna Interface The pin 30 is the RF antenna pad. And the RF interface has an impedance of 50. 3.8.1. Pin Definition of the RF Antenna Table 12: Pin Definition of the RF Antenna Pin Name Pin No. I/O Description Comment GND GND 28 29 Ground Ground FC20-N_Series_Hardware_Design Confidential / Released 24 /

47 FC20-N Series Hardware Design RF_ANT GND 30 31 IO 3.8.2. Operating Frequency RF antenna pad 50 impedance Ground Table 13: Operating Frequency of the Module Feature Frequency WLAN-2.4GHz 2.412~2.462 Unit GHz 3.8.3. Reference Design FC20 series module provides an RF antenna pad for antenna connection. The RF trace in host PCB connected to the modules RF antenna pad should be microstrip line or other types of RF trace, whose characteristic impendence should be close to 50. FC20 series module comes with grounding pads which are next to the antenna pad in order to give a better grounding. The RF external circuit is recommended as following figure. And a -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 8: Reference Circuit for RF Antenna Interface 3.8.4. Antenna Requirements The following table shows the requirements on RF antenna. FC20-N_Series_Hardware_Design Confidential / Released 25 /

47 RF_ANTR1 C1NMC2NMFC20 Series0R FC20-N Series Hardware Design Table 14: Antenna Cable Requirements Type Requirements 2.412~2.462GHz Cable insertion loss <1dB Table 15: Antenna Requirements Type Requirements Frequency Range 2.412~2.462GHz VSWR Gain (dBi) Max Input Power (W) Input Impedance ()

<2:1 recommended 1 typical 50 50 Polarization Type Vertical 3.8.5. Install the Antenna with RF Connector The following figure is the antenna installation with RF connector provided by HIROSE. The recommended RF connector is UF.L-R-SMT. Figure 9: Dimensions of the UF.L-R-SMT Connector (Unit: mm) FC20-N_Series_Hardware_Design Confidential / Released 26 /

47 FC20-N Series Hardware Design Customers can use U.FL-LP serial connector listed in the following figure to match the UF.L-R-SMT. Figure 10: Mechanicals of UF.L-LP Connectors (Unit: mm) The following figure describes the space factor of mated connector Figure 11: Space Factor of Mated Connector (Unit: mm) FC20-N_Series_Hardware_Design Confidential / Released 27 /

47 FC20-N Series Hardware Design For more details, please visit http://www.hirose.com. FC20-N_Series_Hardware_Design Confidential / Released 28 /

47 FC20-N Series Hardware Design 4 Electrical, Reliability and Radio Characteristics 4.1. General Description This chapter mainly introduces the electrical and the radio frequency characteristics of FC20 series module, which are listed in detail in the following chapters:

Electrical characteristics I/O interface characteristics Current consumption RF performance Electrostatic discharge 4.2. Electrical Characteristics The following table shows the absolute maximum ratings. Table 16: Absolute Maximum Ratings Parameter VDD_3V3 VIO Digital I/O input voltage Min.

-0.3

-0.3

-0.3 Max. 4.0 1.89 VIO+0.2 Unit V V V FC20-N_Series_Hardware_Design Confidential / Released 29 /

47 FC20-N Series Hardware Design The following table shows the recommended operating conditions for FC20 series module. Table 17: Recommended Operating Conditions Parameter VDD_3V3 VIO Min. 3.14 1.71 Typ. Max. Unit 3.3 1.8 3.46 1.89 V V 4.3. I/O Interface Characteristics The following table shows the general DC electrical characteristics over recommended operating conditions (unless otherwise specified). Table 18: General DC Electrical Characteristics Symbol Parameter Min. Max. Unit VIH VIL VOH VOL IIL High Level Input Voltage 0.7*VIO VIO+0.2 Low Level Input Voltage

-0.3 0.3*VIO High Level Output Voltage 0.9*VIO VIO Low Level Output Voltage Input Leakage Current 0

-5 0.1*VIO 5 uA V V V V 4.4. Current Consumption The values of current consumption are shown as below. Table 19: Current Consumption of the Module in Low Power Mode Description Conditions IWLAN_3V3 OFF State AT+QWIFI=0 0 IVIO 554 Unit uA FC20-N_Series_Hardware_Design Confidential / Released 30 /

47 FC20-N Series Hardware Design Description Conditions IWLAN_3V3 Idle AT+QWIFI=1 66 Table 20: Current Consumption of the Module IVIO 6.5 Unit mA Description Conditions IWLAN_3V3 Unit 802.11b 802.11g 802.11n 802.11a TX 1Mbps @17.5dBm TX 11Mbps @17.2dBm RX 1Mbps RX 11Mbps TX 6Mbps @16dBm TX 54Mbps @14.8dBm RX 6Mbps RX 54Mbps TX HT20-MCS0 @15.8dBm TX HT20-MCS7 @13.5dBm TX HT40-MCS0 @14.5dBm TX HT40-MCS7 @12.5dBm RX HT20-MCS0 RX HT20-MCS7 RX HT40-MCS0 RX HT40-MCS7 TX HT20 MCS0 @dBm TX HT20 MCS7 @dBm RX HT20 MCS0 RX HT20 MCS7 370 357 48 49 328 245 49 50 322 234 291 194 49 50 54 52 TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA FC20-N_Series_Hardware_Design Confidential / Released 31 /

47 FC20-N Series Hardware Design Description Conditions IWLAN_3V3 Unit TX VHT20 MCS0 @13.2dBm TX VHT20 MCS8 @12.5dBm TX VHT40 MCS0 @13.5dBm TX VHT40 MCS9 @10.5dBm TX VHT80 MCS0 @13dBm TX VHT80 MCS9 @10dBm 802.11ac RX VHT20 MCS0 RX VHT20 MCS8 RX VHT40 MCS0 RX VHT40 MCS9 RX VHT80 MCS8 RX VHT80 MCS9 NOTE 378 289 372 244 355 220 78 78 85 84 92 91 mA mA mA mA mA mA mA mA mA mA mA mA OFF state: Execute AT+QWIFI=0 to bring the module to this state. Under the state, the sleep clock is disabled and no data is saved. 4.5. RF Performance The following tables summarize the transmitter and receiver characteristics of FC20 series. Table 21: Conducted RF Output Power at 2.4GHz Frequency 802.11b @1Mbps 802.11b @11Mbps Min. 16.8 16.5 Typ. 17.5 17 Unit dBm dBm FC20-N_Series_Hardware_Design Confidential / Released 32 /

47 FC20-N Series Hardware Design dBm dBm dBm dBm Unit dBm dBm dBm dBm dBm dBm dBm dBm 802.11g @6Mbps 802.11g @54Mbps 802.11n, HT20 @MCS0 802.11n, HT20 @MCS7 15 14.5 15 13.5 Table 22: Conducted RF Output Power at 5GHz Frequency 802.11a @6Mbps 802.11a @54Mbps 802.11ac, HT20 @MCS0 802.11ac, HT20 @MCS7 802.11ac, HT40 @MCS0 802.11ac, HT40 @MCS7 802.11ac, HT80 @MCS0 802.11ac, HT80 @MCS7 Min. 13 12.5 13 12.5 13 10.5 13 10 15.5 15 15.5 14 Typ. 13.5 13 13.5 13 13.5 11 13.5 10.5 Table 23: Conducted RF Receiving Sensitivity at 2.4GHz Frequency 802.11b, 1Mbps 802.11b, 11 Mbps 802.11g, 6Mbps 802.11g, 54Mbps 802.11n, HT20, MCS0 802.11n, HT20, MCS7 802.11n, HT40, MCS0 Receive Sensitivity (Typ.) TBD

-85 TBD

-73 TBD

-70 TBD FC20-N_Series_Hardware_Design Confidential / Released 33 /

47 FC20-N Series Hardware Design 802.11n, HT40, MCS7

-68 Table 24: Conducted RF Receiving Sensitivity at 5GHz Frequency 802.11a, 6Mbps 802.11a, 54Mbps 802.11ac,VHT20, MCS0 802.11ac,VHT20, MCS8 802.11ac, VHT40, MCS0 802.11ac, VHT40, MCS9 802.11ac, VHT80, MCS0 802.11ac, VHT80, MCS9 Receive Sensitivity (Typ.) TBD

-68 TBD

-68 TBD

-62 TBD

-57 4.6. Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. FC20-N_Series_Hardware_Design Confidential / Released 34 /

47 FC20-N Series Hardware Design 5 Mechanical Dimensions This chapter describes the mechanical dimensions of FC20 series module. 5.1. Mechanical Dimensions of the Module Figure 12: FC20 Top and Side Dimensions (Unit: mm) FC20-N_Series_Hardware_Design Confidential / Released 35 /

47 FC20-N Series Hardware Design Figure 13: FC20 Bottom Dimensions (Unit: mm) FC20-N_Series_Hardware_Design Confidential / Released 36 /

47 FC20-N Series Hardware Design 5.2. Recommended Footprint and Stencil Figure 14: Recommended Footprint (Unit: mm) FC20-N_Series_Hardware_Design Confidential / Released 37 /

47 FC20-N Series Hardware Design The recommended stencil design for FC20 series is shown as below. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm. Figure 15: Recommended Stencil (Unit: mm) NOTES 1. For easy maintenance of the module, please keep about 3mm between the module and other components in host PCB. 2. Keep the RESERVED pins unconnected. FC20-N_Series_Hardware_Design Confidential / Released 38 /

47 FC20-N Series Hardware Design 5.3. Top and Bottom View of the Module Figure 16: Top View of the Module Figure 17: Bottom View of the Module NOTE These are design effect drawings of FC20 series module. For more accurate pictures, please refer to the module that you get from Quectel. FC20-N_Series_Hardware_Design Confidential / Released 39 /

47 FC20-N Series Hardware Design 6 Storage, Manufacturing and Packaging 6.1. Storage FC20 series module is stored in a vacuum-sealed bag. The storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40C and <90% RH. 2. After the vacuum-sealed bag is opened, devices that need to be mounted directly must be:

Mounted within 72 hours at the factory environment of 30C and <60%RH. Stored at <10% RH. 3. Devices require baking before mounting, if any circumstance below occurs. When the ambient temperature is 23C5C and the humidity indication card shows the humidity is >10% before opening the vacuum-sealed bag. Device mounting cannot be finished within 72 hours when the ambient temperature is <30C and the humidity is <60%. Stored at >10% RH. 4. If baking is required, devices should be baked for 48 hours at 125C5C. NOTE As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (125C) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. FC20-N_Series_Hardware_Design Confidential / Released 40 /

47 FC20-N Series Hardware Design 6.2. Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm. For more details, please refer to document [5]. It is suggested that the peak reflow temperature is from 235C to 245C (for SnAg3.0Cu0.5 alloy). The absolute maximum reflow temperature is 260C. To avoid damage to the module caused by repeated heating, it is suggested that the module should be mounted after reflow soldering for the other side of PCB has been completed. Recommended reflow soldering thermal profile is shown below:

Figure 18: Reflow Soldering Thermal Profile FC20-N_Series_Hardware_Design Confidential / Released 41 /

47 Time (s)5010015020025030050100150200250 160 200217070s~120s40s~60sBetween 1~3/SPreheatHeatingCoolingsLiquids Temperature FC20-N Series Hardware Design 6.3. Packaging FC20 module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. 6.3.1. Tape and Reel Packaging FC20 is packaged in tape and reel carriers. The figures below show the packaging details. Figure 19: Tape Dimensions (Unit: mm) FC20-N_Series_Hardware_Design Confidential / Released 42 /

47 FC20-N Series Hardware Design Figure 20: Reel Dimensions (Unit: mm) Table 25: Reel Packaging Model Name MOQ for MP Minimum Package: 250pcs Minimum Package 4=1000pcs FC20-N 250pcs N.W: 0.203kg G.W: 0.945kg N.W: 0.81kg G.W: 4.33kg Size: 370mm 350mm 56mm Size: 380mm 250mm 365mm FC20-N_Series_Hardware_Design Confidential / Released 43 /

47 FC20-N Series Hardware Design 7 Appendix A References Table 26: Related Documents SN Document Name Remark Quectel_FC20_EVB_User_Guide FC20 EVB user guide Quectel_EC25_Reference_Design EC25 reference design Quectel_EC21_Reference_Design EC21 reference design Quectel_EC20_R2.0_Reference_Design EC20 R2.0 reference design Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide

[1]

[2]

[3]

[4]

[5]

Table 27: Terms and Abbreviations Abbreviation Description AP BPSK BT CCK CTS ESD GND HT IEEE IIL I/O Access Point Binary Phase Shift Keying Bluetooth Complementary Code Keying Clear To Send Electrostatic Discharge Ground High Throughput Institute of Electrical and Electronics Engineers Input Leakage Current Input/Output FC20-N_Series_Hardware_Design Confidential / Released 44 /

47 FC20-N Series Hardware Design LTE Mbps MCS MOQ MP PCB PCM QAM QPSK RF RH RoHS RTS RX SDIO TBD TX UART USB VDD VHT VIHmax VIHmin VILmax VILmin Long Term Evolution Million Bits Per Second Modulation and Coding Scheme Minimum Order Quantity Manufacture Product Printed Circuit Board Pulse Code Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Relative Humidity Restriction of Hazardous Substances Request To Send Receive Direction Secure Digital Input and Output Card To Be Determined Transmitting Direction Universal Asynchronous Receiver Transmitter Universal Serial Bus Voltage Power for Digital Device Very High Throughput Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value FC20-N_Series_Hardware_Design Confidential / Released 45 /

47 FC20-N Series Hardware Design Voltage for Input/Output Port Maximum Output Low Level Voltage Value Minimum Output High Level Voltage Value Voltage Standing Wave Ratio Wireless-Fidelity Wireless Local Area Networks VIO VOLmax VOHmin VSWR Wi-Fi WLAN FC20-N_Series_Hardware_Design Confidential / Released 46 /

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