FCC ID: XMR202211KG100S Wireless Module for Amazon Sidewalk (900MHz & Bluetooth)

Quectel KG100S Hardware Design Wireless Module for Amazon Sidewalk Version: 1.0.0 Date: 2022-11-04 Status: Preliminary Sidewalk Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be trademarks, or service mark rights. To avoid granted or conveyed under any patents, copyrights, ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. Quectel_KG100S_Hardware_Design 1 / 45 Quectel Confidential Sidewalk Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness information, advertising, commercial offers, products, services, and materials on third-party of websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. Quectel_KG100S_Hardware_Design 2 / 45 Quectel Confidential Sidewalk Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal shall notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it shall be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or Quectel_KG100S_Hardware_Design 3 / 45 Quectel Confidential metal powders. Sidewalk Module Series Quectel_KG100S_Hardware_Design 4 / 45 Sidewalk Module Series About the Document Revision History Version Date Author Description

2022-08-24 Wain ZHAO/Soni RAO Creation of the document 1.0.0 2022-11-04 Wain ZHAO/Soni RAO Preliminary Quectel_KG100S_Hardware_Design 5 / 45 Sidewalk Module Series Contents Safety Information ........................................................................................................................................ 3 About the Document .................................................................................................................................... 5 Contents .........................................................................................................................................................6 Table Index .................................................................................................................................................... 8 Figure Index ...................................................................................................................................................9 1 2 3 4 Introduction ..........................................................................................................................................10 Special Mark ...............................................................................................................................10 1.1. Product Overview ................................................................................................................................11 2.1. General Description ....................................................................................................................11 Key Features .............................................................................................................................. 11 2.2. Functional Diagram .................................................................................................................... 13 2.3. EVB Kit ....................................................................................................................................... 13 2.4. Application Interfaces .........................................................................................................................14 3.1. General Description ....................................................................................................................14 Pin Assignment ...........................................................................................................................15 3.2. Pin Description ........................................................................................................................... 16 3.3. 3.4. Power Supply ............................................................................................................................. 18 3.5. Reset .......................................................................................................................................... 19 3.6. UART Interface ...........................................................................................................................21 I2C Interface* ..............................................................................................................................22 3.7. 3.8. Jlink Interface ............................................................................................................................. 22 3.9. GPIOs ......................................................................................................................................... 23 3.10. RF Antenna Interfaces ............................................................................................................... 24 3.10.1. RF Antenna Pin Description ............................................................................................24 3.10.2. Operating Frequency ...................................................................................................... 24 3.10.3. RF Antenna Reference Design .......................................................................................24 3.10.4. RF Routing Guidelines .................................................................................................... 25 3.11. RF Connector Recommendation ............................................................................................... 27 Electrical Characteristics & Reliability ............................................................................................. 29 4.1. Absolute Maximum Ratings ....................................................................................................... 29 4.2. Digital I/O Characteristics ...........................................................................................................30 4.3. Power Consumption ................................................................................................................... 30 4.4. RF Performance ......................................................................................................................... 31 LoRa & FSK Performance .............................................................................................. 31 BLE Performance ............................................................................................................ 31 4.5. ESD Protection ........................................................................................................................... 32 4.6. Operating and Storage Temperatures .......................................................................................32 Thermal Dissipation ....................................................................................................................32 4.7. 4.4.1. 4.4.2. 5 Mechanical Information ...................................................................................................................... 34 Quectel_KG100S_Hardware_Design 6 / 45 Sidewalk Module Series 5.1. Mechanical Dimensions ............................................................................................................. 34 5.2. Recommended Footprint ............................................................................................................36 Top and Bottom Views ............................................................................................................... 37 5.3. 6 Storage, Manufacturing & Packaging ...............................................................................................38 6.1. Storage Conditions .....................................................................................................................38 6.2. Manufacturing and Soldering ..................................................................................................... 39 Packaging Specification ............................................................................................................. 41 6.3. Carrier Tape .................................................................................................................... 41 Plastic Reel ......................................................................................................................42 Packaging Process ..........................................................................................................42 6.3.1. 6.3.2. 6.3.3. 7 Appendix References ......................................................................................................................... 44 Quectel_KG100S_Hardware_Design 7 / 45 Sidewalk Module Series Table Index Table 1: Special Mark .................................................................................................................................. 10 Table 2: Key Features ..................................................................................................................................11 Table 3: I/O Parameters Description ........................................................................................................... 16 Table 4: Pin Description ...............................................................................................................................16 Table 5: Definition of Power Supply and GND Pins ....................................................................................19 Table 6: Definition of Power Supply and GND Pins ....................................................................................19 Table 7: UART Interface Pin Definition ....................................................................................................... 21 Table 8: PTI Interface Pin Definition ............................................................................................................21 Table 9: I2C Pin Definition ........................................................................................................................... 22 Table 10: GPIOs Pin Definition ....................................................................................................................23 Table 11: Antenna Pin Definition ................................................................................................................. 24 Table 12: Operating Frequency ...................................................................................................................24 Table 13: Absolute Maximum Ratings (Unit: V) .......................................................................................... 29 Table 14: Recommended Operating Conditions (Unit: V) .......................................................................... 29 Table 15: General DC Electrical Characteristics (Unit: V) .......................................................................... 30 Table 16: Power Consumption .................................................................................................................... 30 Table 17: LoRa Conducted Mode Output Power/Receive Sensitivity (Unit: dBm) .................................... 31 Table 18: FSK Conducted Mode Output Power/Receive Sensitivity (Unit: dBm) ...................................... 31 Table 19: BLE Conducted Mode Output Power/Receive Sensitivity (Unit: dBm) ...................................... 31 Table 20: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 45 %, Unit: kV) .........32 Table 21: Operating and Storage Temperatures (Unit: C) ........................................................................ 32 Table 22: Recommended Thermal Profile Parameters .............................................................................. 40 Table 23: Carrier Tape Dimension Table (Unit: mm) ..................................................................................41 Table 24: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 42 Table 25: Reference Documents .................................................................................................................44 Table 26: Terms and Abbreviations ............................................................................................................ 44 Quectel_KG100S_Hardware_Design 8 / 45 Sidewalk Module Series Figure Index Figure 1: Functional Diagram ...................................................................................................................... 13 Figure 2: Pin Assignment (Top View) ..........................................................................................................15 Figure 3: Reference Circuit of Power Supply .............................................................................................. 19 Figure 4: Reference Circuit of RESET by Using Driving Circuit ................................................................. 20 Figure 5: Reference Circuit of RESET by Using Button ............................................................................. 20 Figure 6: Reset Timing .................................................................................................................................21 Figure 7: UART Connection Diagram ..........................................................................................................22 Figure 8: JLINK Connection Diagram ..........................................................................................................23 Figure 9: Reference Circuit of RF Antenna ................................................................................................. 25 Figure 10: Microstrip Design on a 2-layer PCB ...........................................................................................25 Figure 11: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 25 Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 26 Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 26 Figure 14: Dimensions of the Receptacle (Unit: mm) ................................................................................. 27 Figure 15: Specifications of Mated Plugs ....................................................................................................27 Figure 16: Space Factor of the Mated Connectors (Unit: mm) ...................................................................28 Figure 17: Placement and Fixing of the Heatsink ....................................................................................... 33 Figure 18: Top and Side Dimensions .......................................................................................................... 34 Figure 19: Bottom Dimensions (Bottom View) ............................................................................................ 35 Figure 20: Recommended Footprint (Top View) .........................................................................................36 Figure 21: Top and Bottom Views of the Module ........................................................................................37 Figure 22: Recommended Reflow Soldering Thermal Profile .................................................................... 39 Figure 23: Carrier Tape Dimension Drawing ...............................................................................................41 Figure 24: Plastic Reel Dimension Drawing ................................................................................................42 Figure 25: Packaging Process .....................................................................................................................43 Quectel_KG100S_Hardware_Design 9 / 45 Sidewalk Module Series 1 Introduction This document defines the Quectel KG100S and describes its air interface and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. 1.1. Special Mark Table 1: Special Mark Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. Quectel_KG100S_Hardware_Design 10 / 45 Sidewalk Module Series 2 Product Overview 2.1. General Description Quectel KG100S is a low-power, cost-effective wireless module for Amazon Sidewalk, which integrates the hardware and software resources required for Amazon Sidewalk applications. It is suitable for low flow control and data acquisition applications such as home intelligent terminal, industrial application and so on. Quectel KG100S has an energy-friendly micro controller with a high performance 2.4 GHz radio transiever for Bluetooth Low Energy (BLE), and a built-in long-range low power LoRa transceiver, the module includes:

80 MHz ARM Cortex-M33 core 96K Byte RAM 1M Byte Flash Built-in LoRa transceiver A controller that supports BLE 5.1 standards With a compact profile of 15.0 mm 15.0 mm 2.25 mm, the module, powered by 3.3 V and 1.8 V power supply can be embedded in applications through its 49 LGA pins. 2.2. Key Features The following table describes the key features of Quectel KG100S. Table 2: Key Features Features Details Power Supply VSYS Power Supply:

Supply voltage range: 3.03.6 V Typical supply voltage: 3.3 V VMCU Power Supply:

Quectel_KG100S_Hardware_Design 11 / 45 Operating Frequency LoRa/FSK Features Sidewalk Module Series Supply voltage range: 1.713.6 V Typical supply voltage: 1.8/3.3 V LoRa/FSK: 863928 MHz BLE: 2.4022.480 GHz

+22 dBm efficient PA Integrated DC-DC converter and LDO FSK,GFSK and LoRa CSS modem Sidewalk LoRa CSS raw bit rate 2.4 kbps @ BW 500 kHZ, SF11 and Sidewalk GFSK 50 kbps raw data rate High sensitivity: down to -128 dBm @ BW 500 kHz, SF11 Built-in clock recovery synchronizer Bluetooth Protocol BLE 5.1 Bluetooth Operation Mode BLE Bluetooth Modulation GFSK Wireless Application Interfaces UART, JLINK, SPI, I2C*

Antenna Interfaces Physical Characteristics Temperature Range LoRa/FSK antenna interface (ANT_LORA) BLE antenna interface (ANT_BT) 50 impedance Size: (15.0 0.2) mm (15.0 0.2) mm (2.25 0.2) mm Package: LGA Weight: approx 0.94 g Operating temperature range: -40 C 1 to +85 C Storage temperature range: -40 C to +95C RoHS All hardware components are fully compliant with EU RoHS directive 1 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. Quectel_KG100S_Hardware_Design 12 / 45 Sidewalk Module Series 2.3. Functional Diagram The following figure shows a block diagram of Quectel KG100S. Figure 1: Functional Diagram 2.4. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (Quectel KG100S TE-B) with accessories to control or test the module. For more details, see document [1]. Quectel_KG100S_Hardware_Design 13 / 45 Sidewalk Module Series 3 Application Interfaces 3.1. General Description Quectel KG100S has 49 LGA pins. The following interfaces and functions are described in detail subsequent chapters:

in Power supply Reset UART interface I2C interface*

JLINK interface GPIOs RF antenna interfaces Quectel_KG100S_Hardware_Design 14 / 45 3.2. Pin Assignment Sidewalk Module Series Figure 2: Pin Assignment (Top View) Quectel_KG100S_Hardware_Design 15 / 45 Sidewalk Module Series 3.3. Pin Description The following tables show the pin description of module:

Table 3: I/O Parameters Description Type AIO DI DO DIO OD PI Description Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VSYS VMCU 19 21 PI PI Power supply for the LoRa part Power supply for the MCU part Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V Vmax = 3.6 V Vmin = 1.71 V Vnom = 1.8 V It must be provided with sufficient current up to 0.3 A. It must be provided with sufficient current up to 0.2 A.

[WPS_1668050945]:

[WPS_1668050945]:

GND 1, 5, 8, 10, 11, 1418, 20, 22, 25, 28, 30, 31, 3338, 40, 41, 4346, 52, 5456 RESET Pin Name Pin No. I/O Description DC Characteristics Comment RESET 29 DI Resets the module VMCU power domain Active low. UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment VCOM_TX 6 DO UART transmit VMCU power domain Quectel_KG100S_Hardware_Design 16 / 45 Sidewalk Module Series VCOM_RX 7 DI UART receive JLINK Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_SWCLK DBG_SWDIO DBG_SWO I2C Interface 2 3 4 DI SWD clock Mandatory DIO SWD data VMCU power domain Mandatory DIO SWD state Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL I2C_SDA 27 26 OD OD I2C serial clock I2C serial data VMCU power domain GPIO Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment GPIO0 9 DIO GPIO1 13 DIO RF Antenna Interface General-purpose input/output General-purpose input/output VMCU power domain Needs to cooperate with LoRa Tx & Rx state. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_BLE 32 ANT_LORA 39 SX1262 Debug Interface AIO AIO Bluetooth antenna interface LoRa antenna interface 50 impedence Pin Name Pin No. I/O Description DC Characteristics Comment SX_DIO2 12 DIO Other Interfaces Multi-purpose digital input/output VMCU power domain Quectel_KG100S_Hardware_Design 17 / 45 Sidewalk Module Series Pin Name Pin No. I/O Description DC Characteristics Comment PTI_DATA PTI_SYNC 23 24 DIO PTI data DI PTI sync VMCU power domain 3.4. Power Supply The following table shows the power supply pin and ground pin of Quectel KG100S. Quectel_KG100S_Hardware_Design 18 / 45 Sidewalk Module Series Table 5: Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VSYS VMCU 19 21 Power supply for the LoRa part 3.0 3.3 3.6 Power supply for the MCU part 1.71 1.8/3.3 3.6 V V GND 1, 5, 8, 10, 11, 1418, 20, 22, 25, 28, 30, 31, 3338, 40, 41, 4346, 52, 5456 Quectel KG100S is powered by VSYS and VMCU, and it is recommended to use a power supply chip with sufficient current of at least 0.3 A. In order to achieve For better power supply performance, it is recommended to parallel a 10 F decoupling capacitor for VSYS and VMCU respectively and 100 nF, 33 pF, 10 pF filter capacitors near the modules power pins. At the same time, it is suggested to add a TVS on each power rail to improve the surge voltage bearing capacity of the module. In principle, the longer the power supply trace is, the wider it shall be. Reference circuit of power supply is shown as below:

Figure 3: Reference Circuit of Power Supply 3.5. Reset Drive RESET low for at least 100 ms and then release it to reset the module. Table 6: Definition of Power Supply and GND Pins Pin Name Pin No. Description Comment Quectel_KG100S_Hardware_Design 19 / 45 Sidewalk Module Series RESET 29 Resets the module Active low. The reference design for resetting the module are shown below. An open drain/collector driving circuit or a button can be used to control the RESET pin. Figure 4: Reference Circuit of RESET by Using Driving Circuit Another way to control the RESET is using a button directly through. A TVS shall be placed near the button for ESD protection. The reference circuit is as follows:

Figure 5: Reference Circuit of RESET by Using Button The reset timing is illustrated in the following figure. Quectel_KG100S_Hardware_Design 20 / 45 Sidewalk Module Series Figure 6: Reset Timing 3.6. UART Interface The module provides one UART interface which is used as DCE, and is connected in the traditional DCE-DTE mode. Table 7: UART Interface Pin Definition Pin Name Pin No. Description VCOM_TX VCOM_RX 6 7 UART transmit UART receive SPI MOSI MISO Table 8: PTI Interface Pin Definition Pin Name Pin No. Description UART PTI_DATA PTI_SYNC 23 24 PTI data PTI sync RTS CTS SPI SCS SCLK Through debug tools, the UART interface can be used to output logs for software debugging. Its baud rate is 115200 bps by default. The following is a reference design of UART. Quectel_KG100S_Hardware_Design 21 / 45 Sidewalk Module Series Figure 7: UART Connection Diagram 3.7. I2C Interface*

Quectel KG100S provides an I2C interface that supports standard-mode, fast-mode and fast-mode plus, allowing transmission rates from 10 kbps up to 1 Mbps. Table 9: I2C Pin Definition Pin Name Pin No. I/O Description Comment I2C_SCL I2C_SDA 27 26 OD OD I2C serial clock I2C serial data Requires external pull-up resistor to VMCU. 3.8. JLINK Interface Quectel KG100S provides one JLINK interface for developers to program/debug the module. To use JLINK, developers can download and install the JLINK tools and the reference connection diagram is as below. Quectel_KG100S_Hardware_Design 22 / 45 Sidewalk Module Series Figure 8: JLINK Connection Diagram 3.9. GPIOs Quectel KG100S provides two GPIOs by default. Any GPIO can be configured as an interrupt to wake the module from low power consumption mode. Table 10: GPIOs Pin Definition Pin Name Pin No. I/O Description Comment GPIO0 GPIO1 9 13 DIO General-purpose input/output VMCU voltage domain. GPIO0 is internally used to determine the transmitting and receiving of the gating module. When GPIO0

= 0, the gating module receives US band. When GPIO0 = 1, the gating module transmits and receives EU band. GPIO1 is not used internally. Users can define it by themselves. Quectel_KG100S_Hardware_Design 23 / 45 Sidewalk Module Series 3.10. RF Antenna Interfaces 3.10.1. RF Antenna Pin Description RF Antenna pin description is as below:

Table 11: Antenna Pin Definition Pin Name Pin No. I/O Description Comment ANT_BLE ANT_LORA 32 39 AIO AIO Bluetooth antenna interface LoRa antenna interface 50 impedence 3.10.2. Operating Frequency The operating frequency of Quectel KG100S is shown in the table below:

Table 12: Operating Frequency Mode LoRa/FSK BLE Frequency 863928 2.4022.480 Unit MHz GHz 3.10.3. RF Antenna Reference Design Quectel KG100S is equipped with RF antenna pad for connecting LoRa & BLE antennas. The GND pins of Quectel KG100S is close to the antenna solder pad for better grounding effect. The circuit of RF antenna interface is shown below. For better RF performance, it is necessary to reserve a -type matching circuit. Matching components such as R1, C1, C2 shall be placed as close to the antenna as possible, C1, C2 are not mounted by default. Quectel_KG100S_Hardware_Design 24 / 45 Sidewalk Module Series Figure 9: Reference Circuit of RF Antenna 3.10.4. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 10: Microstrip Design on a 2-layer PCB Figure 11: Coplanar Waveguide Design on a 2-layer PCB Quectel_KG100S_Hardware_Design 25 / 45 Sidewalk Module Series Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [1]. Quectel_KG100S_Hardware_Design 26 / 45 Sidewalk Module Series 3.11. RF Connector Recommendation If the RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 14: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 15: Specifications of Mated Plugs Quectel_KG100S_Hardware_Design 27 / 45 The following figure describes the space factor of the mated connectors. Sidewalk Module Series Figure 16: Space Factor of the Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. Quectel_KG100S_Hardware_Design 28 / 45 Sidewalk Module Series 4 Electrical Characteristics & Reliability 4.1. Absolute Maximum Ratings Absolute maximum ratings and recommended operating condition for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 13: Absolute Maximum Ratings (Unit: V) Parameter VSYS VMCU Voltage at Digital Pins Min.

-0.5

-0.3

-0.3 Max. 3.9 3.8 VMCU + 0.3 Table 14: Recommended Operating Conditions (Unit: V) Parameter VSYS VMCU Min. 3.0 1.71 Typ. 3.3 1.8/3.3 Max. 3.6 3.6 Quectel_KG100S_Hardware_Design 29 / 45 Sidewalk Module Series 4.2. Digital I/O Characteristics Table 15: General DC Electrical Characteristics (Unit: V) Parameter Description Min. Max. VIH VIL VOH VOL High-Level Input Voltage 0.7 VMCU VMCU + 0.2 Low-level Input Voltage

-0.3 0.3 VMCU High-level Output Voltage 0.9 VMCU

Low-level Output Voltage

0.1 VMCU 4.3. Power Consumption Table 16: Power Consumption Operating Mode VMCU (+1.8 V) VSYS (+3.3 V) Unit LoRa FSK BLE Idle Mode Sleep Tx @ 22 dBm Rx Idle Mode Sleep Tx @ 22 dBm Rx Idle Mode Sleep Tx @ 10 dBm Rx

TBD TBD 10 12 0.6 20 115 5 0.6 20 85 5

mA uA mA mA mA uA mA mA mA mA mA mA Quectel_KG100S_Hardware_Design 30 / 45 Sidewalk Module Series 4.4. RF Performance 4.4.1. LoRa & FSK Performance The following tables summarize the transmitting and receiving performances of the module. Table 17: LoRa Conducted Mode Output Power/Receive Sensitivity (Unit: dBm) Operating Mode Output Power (Typ.) Receive Sensitivity (Typ.) 863928 MHz 20 BW_L = 500 kHz, SF = 7 BW_L = 125 kHz, SF = 7 BW_L = 500 kHz, SF = 11 Table 18: FSK Conducted Mode Output Power/Receive Sensitivity (Unit: dBm) Operating Mode Output Power (Typ.) Receive Sensitivity (Typ.) 863928 MHz 20 4.4.2. BLE Performance 50 kbps 150 kbps 250 kbps

-122

-115

-128

-104

-98

-95 The following tables summarize the transmitting and receiving performances of the module. Table 19: BLE Conducted Mode Output Power/Receive Sensitivity (Unit: dBm) Operating Mode Output Power (Typ.) Receive Sensitivity (Typ.) BLE (1 Mbps) BLE (2 Mbps) 10.0 10.0

-93

-93 Quectel_KG100S_Hardware_Design 31 / 45 Sidewalk Module Series 4.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 20: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 45 %, Unit: kV) Tested Interfaces Contact Discharge Air Discharge VSYS, VMCU GND Antenna interfaces 8 8 5 12 12 10 4.6. Operating and Storage Temperatures Table 21: Operating and Storage Temperatures (Unit: C) Parameter Operating Temperature Range 2 Storage Temperature Range Min.

-40

-40 Typ.

Max.

+85

+95 4.7. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

2 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. Quectel_KG100S_Hardware_Design 32 / 45 Sidewalk Module Series Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:

Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation. Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

Choose the heatsink with adequate fins to dissipate heat;

Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 17: Placement and Fixing of the Heatsink Quectel_KG100S_Hardware_Design 33 / 45 Sidewalk Module Series 5 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions Pin 1 Figure 18: Top and Side Dimensions Quectel_KG100S_Hardware_Design 34 / 45 Sidewalk Module Series Pin 1 Figure 19: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. Quectel_KG100S_Hardware_Design 35 / 45 Sidewalk Module Series 5.2. Recommended Footprint Pin 1 Figure 20: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. Quectel_KG100S_Hardware_Design 36 / 45 5.3. Top and Bottom Views Sidewalk Module Series Figure 21: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, refer to the module received from Quectel. Quectel_KG100S_Hardware_Design 37 / 45 Sidewalk Module Series 6 Storage, Manufacturing & Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. Quectel_KG100S_Hardware_Design 38 / 45 Sidewalk Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 6.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [2]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute is maximum reflow temperature. To avoid damage to the module caused by repeated heating, recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. it Figure 22: Recommended Reflow Soldering Thermal Profile Quectel_KG100S_Hardware_Design 39 / 45 Sidewalk Module Series Table 22: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 information on the shielding can is still hours Neutral Salt Spray test, the laser engraved label clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2]. Quectel_KG100S_Hardware_Design 40 / 45 Sidewalk Module Series 6.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

6.3.1. Carrier Tape Dimension details are as follow:

Figure 23: Carrier Tape Dimension Drawing Table 23: Carrier Tape Dimension Table (Unit: mm) W 32 P 24 T 0.4 A0 B0 K0 15.4 15.4 2.75 K1 4.6 F E 14.2 1.75 Quectel_KG100S_Hardware_Design 41 / 45 6.3.2. Plastic Reel Sidewalk Module Series Figure 24: Plastic Reel Dimension Drawing Table 24: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 32.5 6.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Quectel_KG100S_Hardware_Design 42 / 45 Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Sidewalk Module Series Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 25: Packaging Process Quectel_KG100S_Hardware_Design 43 / 45 Sidewalk Module Series 7 Appendix References Table 25: Reference Documents Document Name

[1] Quectel_KG100S_TE-B_User_Guide

[2] Quectel_RF_Layout_Application_Note

[3] Quectel_Module_SMT_Application_Note Table 26: Terms and Abbreviations Abbreviation Description ARM BLE BT CTS DCE DTE ESD FSK GFSK GND IEEE I2C Advanced RISC Machine Bluetooth Low Energy Bluetooth Clear To Send Data Communication Equipment Data Terminal Equipment Electrostatic Discharge Frequency Shift Keying Gauss Frequency Shift Keying Ground Institute of Electrical and Electronics Engineers Inter-Integrated Circuit Quectel_KG100S_Hardware_Design 44 / 45 Sidewalk Module Series I/O LDO LGA LoRa MCU Mbps MISO MOSI PA PCB RAM RF RoHS Rx SCLK SCS SF SPI SWD TBD TVS Tx UART VIH VIL Input/Output Low-dropout Regulator Land Grid Array Long Range Microcontroller Unit Million Bits Per Second Multiple Input Multiple Output Master Out Slave In Power Amplifier Printed Circuit Board Random Access Memory Radio Frequency Restriction of Hazardous Substances Receive Serial Clock Sub-Carrier Space Spreading Factor Serial Peripheral Interface Serial Wire Debug To Be Determined Transient Voltage Suppressor Transmit Universal Asynchronous Receiver/Transmitter High-level Input Voltage Low-level Input Voltage Quectel_KG100S_Hardware_Design 45 / 45 Sidewalk Module Series Vmax Vmin Vnom VOH VOL VSWR Maximum Voltage Minimum Voltage Normal Voltage High-level Output Voltage Low-level Output Voltage Voltage Standing Wave Ratio Quectel_KG100S_Hardware_Design 46 / 45 FCC Statement:

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-

located or operating in conjunction with any other antenna or transmitter. This device meets all the other requirements specified in Part15C, Section 15.247 of the FCC Rules. 1 Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. The module is tested for standalone mobile RF exposure use condition. Any other usage conditions such as co-location with other transmitter(s) or being used in a portable condition will need a separate reassessment through a class II permissive change application or new certification. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID: XMR202211KG100S. The grantee's FCC ID can be used only when all FCC compliance requirements are met. The end product shall bear the following 15.19 statement: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) This device must accept any interference received, including interference that may cause undesired operation. 2 Antennas The following antennas have been certified for use with this module; antennas of the same type with equal or lower gain may also be used with this module. The antenna must be installed such that 20cm can be maintained between the antenna and users. Antenna Specification list below:

Part 15 Subpart B disclaimer This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B rule requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rule requirements if applicable. As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. The host integrator must follow the integration instructions provided in this document and ensure that the composite-system end product complies with the requirements by a technical assessment or evaluation to the rules and to KDB Publication 996369. The host integrator installing this module into their product must ensure that the final composite product complies with the requirements by a technical assessment or evaluation to the rules, including the transmitter operation and should refer to guidance in KDB 996369. OEM/Host manufacturer responsibilities Must use the device only in host devices that meet the FCC/ISED RF exposure category of mobile, which means the device is installed and used at distances of at least 20cm from persons. OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. Additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). 3 ISED Statement:

This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de classe B est conforme la norme canadienne ICES-003. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:

1) This device may not cause interference, and 2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables auxappareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

1) 2) l'appareil ne doit pas produire de brouillage, et l'utilisateur de l'appareil doit accepter tout brouillage adiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. RF Radiation Exposure Statement:

This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. Dclaration d'exposition aux radiations:

Cet appareil est conforme aux limites d'exposition aux rayonnements dfinies pour un environnement non contrl. Cet quipement doit tre install et utilis une distance minimale de 20 centimtres entre le radiateur et votre corps. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. 4 Required end product labeling:

This transmitter module is authorized only for use in device where the antenna may be installed and operated with greater than 20cm between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 10224A-202211KG100S. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un appareil o lantenne peut tre installe et utilise plus de 20 cm entre lantenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-202211KG100S". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. The following text, or an equivalent notice, that shall be displayed in a conspicuous location, either in the user manual or on the device, or both:

This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:

1) This device may not cause interference. 2) This device must accept any interference, including interference that may cause undesired operation of the device. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. lnonc qui suit, ou lquivalent, un endroit bien en vue dans le manuel dutilisation ou sur lappareil, ou encore aux deux endroits :

Lmetteur/rcepteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1. Lappareil ne doit pas produire de brouillage;

2. Lappareil doit accepter toute interfrence, y compris toute interfrence pouvant entraner un fonctionnement indsirable du dispositif. 5 Antennas The following antennas have been certified for use with this module; antennas of the same type with equal or lower gain may also be used with this module. The antenna must be installed such that 20 cm can be maintained between the antenna and users. This radio transmitter has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Antenna Specification list below:

ANTENNE Les antennes suivantes ont t certifies pour une utilisation avec ce module; des antennes du mme type gain gal ou infrieur peuvent galement tre utilises avec ce module. L'antenne doit tre installe de telle sorte que 20 cm puissent tre maintenus entre l'antenne et les utilisateurs. Cet metteur radio a t approuv par Innovation, Sciences et Dveloppement conomique Canada pour fonctionner avec les types d'antenne numrs ci-dessous, avec le gain maximal autoris indiqu. Les types d'antenne non inclus dans cette liste qui ont un gain suprieur au gain maximum indiqu pour tout type rpertori sont strictement interdits pour l'utilisation avec cet appareil. 6

QUECCTEL KG100S = ai-axxx KG100SAAMD SN:MPA7301 730XXXXX hy FCC ID:XMR202211KG100S IC ID:10224A-202211KG100S

QIECCTEL Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject: Certification designating a U.S. agent for service of process pursuant to Part 2.911(d)(7) To whom it may concern, Quectel Wireless Solutions Company Limited, Grantee Code: XMR (the applicant) certifies that, as of the date of the filing of application, Ikotek USA, Inc., FRN: 0033350331 (the agent) is designated as the U.S. agent for the purpose of accepting service of process on behalf of the applicant. The physical U.S. address and email for the designated agent are:

Physical U.S. address: 9920 Pacific Heights Blvd., Ste. 150, #7025, San Diego, CA 92121 Email: compliance@ikotek.com The applicant accepts to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The agent accepts the designation by (the applicant) as the U.S. agent to accept service of process includes, but is not limited to, delivery of any correspondence, notices, orders, decisions, and requirements of administrative, legal, or judicial process related to Commission proceedings. Signed by the Applicant Signed by the Agent (if different from the Applicant) Name: Jean Hu C Name-dseph M. Peterson Title: Certification Manager Title: President and CEO Email: Jean.hu@quectel.com Email: joe.peterson@ikotek.com Date: 16 February 2023 Date: February 17%, 2023

Quectel Wireless Solutions Company Limited Declaration of Authorization We Name: Quectel Wireless Solutions Company Limited Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declare that:

Name Representative of agent: Marlin Chen Agent Company name: MRT Technology (Suzhou) Co., Ltd Address: D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone City: Suzhou Country: China is authorized to apply for Certification of the following product(s):

Product: Wireless Module for Amazon Sidewalk (Q00MHz &

Bluetooth) FCC ID: XMR202211KG100S Model No.: KG100S Sincerely,

(Name: Jean Hu Email: Jean.Hu@Quectel.com Date: 2023-03-22