FCC ID: XMR2023EG915QNA LTE Cat 1 bis Module

EG915Q-NA Hardware Design LTE Standard Module Series Version: 1.0 Date: 2023-02-07 Status: Released LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. EG915Q-NA_Hardware_Design 2 / 72 LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EG915Q-NA_Hardware_Design 3 / 72 LTE Standard Module Series About the Document Revision History Version Date Author Description

1.0 2022-11-28 Lex LI/Lena HUANG Creation of the document 2023-02-07 Lex LI/Barry DENG First official release EG915Q-NA_Hardware_Design 4 / 72 LTE Standard Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 7 Figure Index ................................................................................................................................................. 9 1 Introduction ......................................................................................................................................... 11 Special Marks .......................................................................................................................... 11 1.1. 2 Product Overview ............................................................................................................................... 12 Frequency Bands .................................................................................................................... 12 Key Features ............................................................................................................................ 13 Functional Diagram .................................................................................................................. 15 Pin Assignment .........................................................................................................................16 Pin Description ......................................................................................................................... 17 EVB Kit..................................................................................................................................... 21 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 3.1. 3.2. 3 Operating Characteristics .................................................................................................................. 22 Operating Modes ..................................................................................................................... 22 Sleep Mode .............................................................................................................................. 23 3.2.1. UART Application Scenario ............................................................................................ 23 3.2.2. USB Application Scenarios* ............................................................................................ 24 3.2.2.1. USB Application with USB Suspend/Resume and Remote Wakeup Function 24 3.2.2.2. USB Application with USB Suspend/Resume and MAIN_RI Function .................. 24 3.2.2.3. USB Application without USB Suspend Function .................................................. 25 Airplane Mode .......................................................................................................................... 26 Power Supply........................................................................................................................... 26 3.4.1. Power Supply Pins.......................................................................................................... 26 3.4.2. Reference Design for Power Supply .............................................................................. 27 3.4.3. Voltage Stability Requirements ....................................................................................... 27 Turn On .................................................................................................................................... 28 Turn On with PWRKEY................................................................................................... 28 Turn Off .................................................................................................................................... 30 Turn Off with PWRKEY ................................................................................................... 30 Turn Off with AT Command ............................................................................................ 31 Reset ........................................................................................................................................ 31 3.6.1. 3.6.2. 3.5.1. 3.3. 3.4. 3.5. 3.6. 3.7. 4 Application Interfaces ........................................................................................................................ 34 USB Interface .......................................................................................................................... 34 USB_BOOT ............................................................................................................................. 35 USIM Interface ......................................................................................................................... 37 UART Interfaces ...................................................................................................................... 39 PCM and I2C Interfaces* ......................................................................................................... 41 4.1. 4.2. 4.3. 4.4. 4.5. EG915Q-NA_Hardware_Design 5 / 72 LTE Standard Module Series ADC Interfaces ........................................................................................................................ 42 4.6. SPI Interface* ........................................................................................................................... 43 4.7. Camera SPI Interface* ............................................................................................................. 43 4.8. 4.9. GRFC Interfaces* .................................................................................................................... 44 4.10. Control Signals ........................................................................................................................ 44 4.10.1. W_DISABLE#* ................................................................................................................ 45 Indication Signals ..................................................................................................................... 45 4.11.1. Network Status Indication ............................................................................................... 46 4.11.2. STATUS ......................................................................................................................... 46 4.11.3. MAIN_RI ......................................................................................................................... 47 4.11. 5.1. 5 RF Specifications ............................................................................................................................... 48 Cellular Network ....................................................................................................................... 48 5.1.1. Antenna Interface & Frequency Bands ........................................................................... 48 Tx Power ........................................................................................................................ 49 5.1.2. 5.1.3. Rx Sensitivity ................................................................................................................... 49 5.1.4. Reference Design ........................................................................................................... 50 RF Routing Guidelines ............................................................................................................. 50 Antenna Design Requirements ................................................................................................ 53 RF Connector Recommendation ............................................................................................. 53 5.2. 5.3. 5.4. 6 Electrical Characteristics & Reliability ............................................................................................. 55 Absolute Maximum Ratings ..................................................................................................... 55 Power Supply Ratings ............................................................................................................. 55 Power Consumption .................................................................................................................56 Digital I/O Characteristics ........................................................................................................ 57 ESD Protection ........................................................................................................................ 58 Operating and Storage Temperatures ..................................................................................... 58 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 7 Mechanical Information ..................................................................................................................... 59 7.1. Mechanical Dimensions ........................................................................................................... 59 Recommended Footprint ......................................................................................................... 61 7.2. Top and Bottom Views ..............................................................................................................62 7.3. 8 Storage, Manufacturing & Packaging ............................................................................................... 63 Storage Conditions .................................................................................................................. 63 8.1. 8.2. Manufacturing and Soldering ................................................................................................... 64 Packaging Specification ........................................................................................................... 66 8.3. 8.3.1. Carrier Tape .................................................................................................................... 66 8.3.2. Plastic Reel ..................................................................................................................... 67 8.3.3. Mounting Direction .......................................................................................................... 67 8.3.4. Packaging Process ......................................................................................................... 68 9 Appendix References .......................................................................................................................... 69 EG915Q-NA_Hardware_Design 6 / 72 LTE Standard Module Series Table Index Table 1: Special Marks ................................................................................................................................. 11 Table 2: Basic Information .......................................................................................................................... 12 Table 3: Frequency Bands and Functions .................................................................................................. 12 Table 4: Key Features ................................................................................................................................. 13 Table 5: Parameter Definition ..................................................................................................................... 17 Table 6: Pin Description .............................................................................................................................. 17 Table 7: Operating Modes Overview ........................................................................................................... 22 Table 8: Pin Description of Power Supply Interface .................................................................................... 26 Table 9: Pin Description of PWRKEY ......................................................................................................... 28 Table 10: Pin Description of RESET_N ...................................................................................................... 32 Table 11: Pin Description of USB Interface ................................................................................................. 34 Table 12: Pin Description of USB_BOOT ................................................................................................... 35 Table 13: Pin Description of USIM Interface ............................................................................................... 37 Table 14: UART Information (Unit: bps) ...................................................................................................... 39 Table 15: Pin Description of UART ............................................................................................................. 39 Table 16: Pin Description of PCM and I2C Interfaces ................................................................................ 41 Table 17: Pin Description of ADC Interfaces ............................................................................................... 42 Table 18: Characteristics of ADC Interfaces ............................................................................................... 42 Table 19: Pin Description of SPI Interface .................................................................................................. 43 Table 20: Pin Description of Camera SPI Interface .................................................................................... 44 Table 21: Pin Description of GRFC Interfaces ............................................................................................ 44 Table 22: Pin Description of Control Signals ............................................................................................... 44 Table 23: W_DISABLE# AT Command Configuration Information.............................................................. 45 Table 24: Pin Description of Indication Signals ........................................................................................... 45 Table 25: Network Status Indication Pin Level and Module Network Status .............................................. 46 Table 26: MAIN_RI Level and Module Status ............................................................................................. 47 Table 27: Pin Description of Cellular Antenna Interface.............................................................................. 48 Table 28: Operating Frequency of EG915Q-NA (Unit: MHz) ...................................................................... 48 Table 29: RF Transmitting Power ................................................................................................................ 49 Table 30: Conducted RF Receiver Sensitivity of EG915Q-NA (Unit: dBm) ................................................ 49 Table 31: Requirements for Antenna Design .............................................................................................. 53 Table 32: Absolute Maximum Ratings ........................................................................................................ 55 Table 33: Modules Power Supply Ratings ........................................................................................................... 55 Table 34: Power Consumption .................................................................................................................... 56 Table 35: 1.8 V I/O Characteristics (Unit: V) ............................................................................................... 57 Table 36: USIM Low-voltage I/O Characteristics (Unit: V) .......................................................................... 57 Table 37: USIM High-voltage I/O Characteristics (Unit: V) ......................................................................... 57 Table 38: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %; Unit: kV) ............................. 58 Table 39: Operating and Storage Temperatures (Unit: C) ......................................................................... 58 Table 40: Recommended Thermal Profile Parameters ............................................................................... 65 Table 41: Carrier Tape Dimension Table (Unit: mm) ................................................................................... 66 EG915Q-NA_Hardware_Design 7 / 72 Table 42: Plastic Reel Dimension Table (Unit: mm) .....................................................................................67 Table 43: Related Documents......................................................................................................................69 Table 44: Terms and Abbreviations ..............................................................................................................69 LTE Standard Module Series EG915Q-NA_Hardware_Design 8 / 72 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 15 Figure 2: Pins Assignment (Top View) ........................................................................................................ 16 Figure 3: Power Consumption During Sleep Mode .................................................................................... 23 Figure 4: Block Diagram of UART Application in Sleep Mode .................................................................... 23 Figure 5: Block Diagram of Application with USB Remote Wakeup Function in Sleep Mode .................... 24 Figure 6: Block Diagram of Application with MAIN_RI Function in Sleep Mode ......................................... 25 Figure 7: Block Diagram of Application without USB Suspend Function in Sleep Mode ............................ 25 Figure 8: Reference Design of Power Input................................................................................................ 27 Figure 9: Reference Design of Power Supply............................................................................................. 28 Figure 10: Reference Design of Turn On with Driving Circuit ..................................................................... 29 Figure 11: Reference Design of Turn On with Keystroke............................................................................ 29 Figure 12: Power-up Timing with PWRKEY ............................................................................................... 30 Figure 13: Power-down Timing with PWRKEY ........................................................................................... 31 Figure 14: Reference Design of Reset with Driving Circuit......................................................................... 32 Figure 15: Reference Design of PWRKEY with Driving Circuit .................................................................. 32 Figure 16: Reset Timing ............................................................................................................................. 33 Figure 17: Reference Design of USB 2.0 Interface .................................................................................... 34 Figure 18: Reference Design of USB_BOOT ............................................................................................. 36 Figure 19: Timing of Entering Emergency Download Mode ....................................................................... 36 Figure 20: Reference Design of USIM Interface with an 8-pin USIM Card Connector ............................... 37 Figure 21: Reference Design of USIM Interface with a 6-pin USIM Card Connector ................................. 38 Figure 22: Reference Design of UART with Level-shifting Chip ................................................................. 40 Figure 23: Reference Design of UART with Transistor Level-shifting Circuit ............................................. 40 Figure 24: Reference Design of PCM and I2C Interfaces .......................................................................... 41 Figure 25: Reference Design of SPI with a Level-Shifting Chip ................................................................. 43 Figure 26: Reference Design of NET_STATUS Indication ......................................................................... 46 Figure 27: Reference Design of STATUS .................................................................................................. 47 Figure 28: Reference Design of Main Antenna ........................................................................................... 50 Figure 29: Microstrip Design on a 2-layer PCB .......................................................................................... 51 Figure 30: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 51 Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ..................... 51 Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ..................... 52 Figure 33: Dimensions of the Receptacle (Unit: mm) ................................................................................. 53 Figure 34: Specifications of Mated Plugs ................................................................................................... 54 Figure 35: Space Factor of Mated Connectors (Unit: mm) ......................................................................... 54 Figure 36: Top and Side Dimensions (Unit: mm) ........................................................................................ 59 Figure 37: Bottom Dimensions (Bottom View, Unit: mm) ............................................................................ 60 Figure 38: Recommended Footprint (Unit: mm) ......................................................................................... 61 Figure 39: Top and Bottom Views of the Module ........................................................................................ 62 Figure 40: Recommended Reflow Soldering Thermal Profile..................................................................... 64 Figure 41: Carrier Tape Dimension Drawing ............................................................................................... 66 EG915Q-NA_Hardware_Design 9 / 72 Figure 42: Plastic Reel Dimension Drawing ................................................................................................67 Figure 43: Mounting Direction ......................................................................................................................67 Figure 44: Packaging Process .....................................................................................................................68 LTE Standard Module Series EG915Q-NA_Hardware_Design 10 / 72 LTE Standard Module Series 1 Introduction This document describes the EG915Q-NA features, performance, and air interfaces and hardware interfaces connected to your applications. The document provides a quick insight into interface specifications, RF performance, electrical and mechanical specifications, and other module information, as well. 1.1. Special Marks Table 1: Special Marks Marks Definitions

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. EG915Q-NA_Hardware_Design 11 / 72 LTE Standard Module Series 2 Product Overview EG915Q-NA is an SMD module with compact packaging, which is engineered to meet most of the demands of M2M and IoT applications, such as asset management, commercial telematics, payment, RMAC (Remote Monitoring and Control applications), security and automation, smart metering and smart grid. Table 2: Basic Information EG915Q-NA Packaging type Pin counts Dimensions Weight 2.1. Frequency Bands Table 3: Frequency Bands Network Type LTE-FDD LGA 126

(23.6 0.2) mm (19.9 0.2) mm (2.4 0.2) mm Approx. 2.3 g EG915Q-NA B2/B4/B5/B12/B13/B66 EG915Q-NA_Hardware_Design 12 / 72 LTE Standard Module Series 2.2. Key Features Table 4: Key Features Categories Supply Voltage Descriptions 3.34.3 V SMS Typ.: 3.8 V Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default USIM Interface 1.8 V and 3.0 V PCM Interface*

I2C Interface*

SPI Interface*

Camera SPI Interface*

USB Interface UART Interfaces Network Indication Supports one digital audio interface: PCM interface Used for audio function with external Codec One I2C interface Comply with I2C-bus specification One SPI 1.8 V voltage domain Clock rate: up to 25.6 MHz Supports one camera SPI Interface Supports the 2-data-line transmission of SPI Compliant with USB 2.0 specifications (only supports slave mode) Data rate up to 480 Mbps Used for AT command communication, data transmission, software debugging, firmware upgrade and the output of partial logs USB serial driver: supports USB serial driver for Windows 7/8/8.1/10/11, Linux 2.65.18*, Android 4.x12.x* systems Main UART:

Used for AT command communication and data transmission Baud rate: 115200 bps by default RTS and CTS hardware flow control Debug UART:

Used for the output of partial logs Baud rate: up to 3 Mbps, 115200 bps by default NET_STATUS:

Use: network connectivity status indication Complies with the AT commands defined in 3GPP TS 27.007 and AT Commands 3GPP TS 27.005 Complies with Quectel enhanced AT commands Antenna Interface Main antenna interface (ANT_MAIN) 50 characteristic impedance EG915Q-NA_Hardware_Design 13 / 72 LTE Standard Module Series Transmitting Power LTE-FDD: Class 3 (23 dBm 2 dB) LTE Features Complies with 3GPP Rel-14 FDD Max. LTE category: Cat 1 bis 1.4/3/5/10/15/20 MHz RF bandwidth DL modulations: QPSK, 16QAM and 64QAM UL modulations: QPSK, 16QAM LTE-FDD max. data rates:

DL: 10 Mbps UL: 5 Mbps Internet Protocol Features Temperature Ranges Complies with TCP, UDP, PPP, NTP, NITZ, FTP, HTTP, PING, CMUX*, HTTPS, FTPS, SSL, FILE, MQTT protocols Complies with PPP protocols PAP and CHAP authentication Normal operating temperature 1: -35 C to +75 C Extended operating temperature 2: -40 C to +85 C Storage temperature: -40 C to +90 C Firmware Upgrade Via USB 2.0 interface or DFOTA RoHS All hardware components fully comply with EU RoHS directive 1 Within the operating temperature range, the module meets 3GPP specifications. 2 Within the extended temperature range, the module remains the ability to establish and maintain functions such as SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG915Q-NA_Hardware_Design 14 / 72 LTE Standard Module Series 2.3. Functional Diagram The functional diagram illustrates the following major functional parts:

Power management Baseband part Radio frequency part Peripheral interfaces VBAT_RF VBAT_BB PWRKEY RESET_N ANT_MAIN Switch Duplex PA Tx PRx 26 MHz VIO PMIC RF Transceiver and Subsystem Baseband RAM Flash VDD_EXT USIM GRFCs Figure 1: Functional Diagram USB UARTs ADC I2C PCM SPI Camera SPI EG915Q-NA_Hardware_Design 15 / 72 2.4. Pin Assignment LTE Standard Module Series 2 6 D N G 1 6 D N G 0 6 I N A M _ T N A 9 5 D N G 8 5 D N G 7 5 D E V R E S E R 6 5 D E V R E S E R D N G 5 5 D N G 4 5 3 5 F R _ T A B V 2 5 F R _ T A B V 1 5 D E V R E S E R 0 5 D N G 103 RESERVED 114 RESER VED 82 GND 81 GND 80 GND 79 GND 113 RESER VED 112 RESER VED 104 RESERVED 115 CAM_PWDN 102 GND 101 GND 100 GND 99 RESER VED 118 RESER VED 111 RESER VED 63 RESERVED 83 RESER VED 98 78 CAM_SPI_DATA1 CAM_SPI_CLK 64 RESER VED 84 RESERVED 119 RESER VED 126 RESER VED 97 CAM_SPI_DATA0 77 GRFC2 65 RESER VED 85 RESERVED 120 RESER VED 125 RESER VED 96 PSM_INT 76 GRFC1 66 RESER VED 86 RESER VED 121 RESER VED 124 RESER VED 95 CAM_MCLK 75 USB_BOOT 67 GND 68 GND 87 RESER VED 88 RESER VED 122 RESER VED 123 RESER VED 94 CAM_VDD 93 CAM_VDDI O 74 GND 73 GND 105 RESER VED 116 RESER VED 106 RESER VED 107 RESER VED 89 GND 69 GND 90 GND 70 GND 91 GND 71 GND 92 RESER VED 117 RESER VED 110 RESER VED 72 GND 108 RESER VED 109 RESER VED 49 RESER VED 48 GND 47 GND 46 USIM_CLK 45 USIM_DATA 44 USIM_RST 43 USIM_VDD 42 USIM_DET 41 I2C_SDA 40 I2C_SCL 39 MAIN_RI 38 MAIN_DCD 37 MAIN_RTS 36 MAIN_CTS 35 MAIN_TXD 34 MAIN_RXD 33 VBAT_BB 32 VBAT_BB 1 PSM_IND 2 ADC1 3 GND 4 PCM_CL K 5 PCM_SYNC 6 PCM_DIN 7 PCM_DOUT 8 USB_VBUS 9 USB_DP 10 USB_DM 11 RESER VED 12 RESER VED 13 RESER VED 14 RESER VED 15 PWRKEY 16 R ESER VED 17 RESET_N 18 W_DISABLE#

Y D A E R _ P A 9 1 0 2 S U T A T S 1 2 S U T A T S _ T E N 2 2 D X R _ G B D 3 2 D X T _ G B D 4 2 0 C D A 5 2

S C _ P S I 6 2 K L C _ P S I 7 2 I S O M _ P S I 8 2 I O S M _ P S I 9 2 T X E _ D D V 0 3 R T D _ N A M I 1 3 D N G GND Pins USB Pins Signal Pins Power Pins I2C Pins

(U)SIM Pins ADC Pins PCM Pins RESERVED Pins UART Pins Figure 2: Pins Assignment (Top View) NOTE 1. 2. If the module does not need to enter emergency download mode, USB_BOOT (pin 75) should not be pulled up to VDD_EXT before the module successfully starts up. In sleep mode, some pins of the main UART interface (pins 3437), debug UART interface (pins 22, 23), USB_BOOT (pin 75), PCM interface* (pins 47), I2C interface* (pins 40, 41), and SPI interface*

(pins 25-28) are powered down. The driving capacity will be lost and the functions of status indication and data transmission are disabled. Pay attention to it when designing circuits. 3. Keep all RESERVED pins and unused pins unconnected. EG915Q-NA_Hardware_Design 16 / 72 LTE Standard Module Series 2.5. Pin Description The following table shows the pin descriptions. DC characteristics include power domain, rate current, etc. Table 5: Parameter Definition Parameters AI AIO DI DO DIO PI PO Descriptions Analog Input Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input Power Output Table 6: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristic Comment VBAT_BB 32, 33 PI VBAT_RF 52, 53 PI Power supply for the modules BB part Power supply for the modules RF part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V VDD_EXT 29 PO Provides 1.8 V for external circuit Vnom = 1.8 V I max = 50 mA O It must be provided with sufficient current of 0.5 A at least. It must be provided with sufficient current up to 1.5 A. Power supply for external GPIOs pull-up circuits. It is recommended to reserve test points. GND 3, 31, 47, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 Turn On/Off EG915Q-NA_Hardware_Design 17 / 72 Pin Name Pin No. I/O Description PWRKEY 15 DI Turns on/off the module RESET_N 17 DI Resets the module Indication Signals Pin Name Pin No. I/O Description STATUS 20 DO NET_STATUS 21 DO Indicates the module's operation status Indicates the module's network activity status USB Interface Pin Name Pin No. I/O Description USB_VBUS 8 AI USB connection detect USB_DP 9 AIO USB differential data (+) USB_DM 10 AIO USB differential data (-) USIM Interface Pin Name Pin No. I/O Description USIM_VDD 43 PO USIM card power supply USIM_DATA USIM_CLK 45 46 DIO USIM card data DO USIM card clock LTE Standard Module Series DC Characteristic Comment Active low. VILmax = 0.5 V Active low. Test points are recommended to be reserved if unused. DC Characteristic Comment VDD_EXT If unused, keep them open. Comment Test points must be reserved. USB 2.0 compliant. Requires differential impedance of 90 . Test points must be reserved. Comment Either 1.8 V or 3.0 V USIM card is supported and can be identified automatically by the module. DC Characteristic Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V DC Characteristic IOmax = 50 mA Low-voltage:

Vmax = 1.85 V Vmin = 1.75 V High-voltage:

Vmax = 3.05 V Vmin = 2.95 V USIM_VDD EG915Q-NA_Hardware_Design 18 / 72 LTE Standard Module Series USIM_RST USIM_DET 44 42 Main UART DO USIM card reset DI USIM card hot-plug detect Pin Name Pin No. I/O Description VDD_EXT If unused, keep it open. DC Characteristic Comment MAIN_CTS 36 DO DTE clear to send signal from DCE MAIN_RTS 37 DI DTE request to send signal to DCE MAIN_RXD MAIN_DCD MAIN_TXD MAIN_RI 34 38 35 39 DI Main UART receive VDD_EXT DO Main UART data carrier detect DO Main UART transmit DO Main UART ring indication MAIN_DTR 30 DI Main UART data terminal ready Debug UART Connect to DTEs CTS. If unused, keep it open. Connect to DTEs RTS. If unused, keep it open. If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristic Comment DBG_RXD DBG_TXD 22 23 I2C Interface*

DI Debug UART receive DO Debug UART transmit VDD_EXT Test points must be reserved. Pin Name Pin No. I/O Description DC Characteristic Comment I2C_SCL I2C_SDA 40 41 PCM Interface*

DO I2C serial clock DIO I2C serial data VDD_EXT External pull-up resistor is required. If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristic Comment EG915Q-NA_Hardware_Design 19 / 72 LTE Standard Module Series VDD_EXT If unused, keep them open. PCM_SYNC PCM_CLK PCM_DIN PCM_DOUT 5 4 6 7 RF Antenna Interface DO PCM data frame sync DO PCM clock DI PCM data input DO PCM data output Pin Name Pin No. I/O Description DC Characteristic Comment ANT_MAIN 3 60 AIO Main antenna interface 50 impedance. GRFC Interfaces*

Pin Name Pin No. I/O Description DC Characteristic Comment GRFC1 GRFC2 76 77 Camera SPI Interface*

DO Generic RF controller DO Generic RF controller VDD_EXT If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristic Comment CAM_MCLK 95 DO Master clock of the camera Camera SPI clock Camera SPI data bit 0 VDD_EXT DI DI If unused, keep them open. DI Camera SPI data bit 1 DO PO PO Power down of the camera Camera analog power supply Camera digital power supply Vnom = 2.8 V VDD_EXT CAM_SPI_CLK 78 CAM_SPI_ DATA0 CAM_SPI_ DATA1 97 98 CAM_PWDN 115 CAM_VDD 94 CAM_VDDIO 93 SPI Interface*

Pin Name Pin No. I/O Description DC Characteristic Comment SPI_CLK 26 DO SPI clock VDD_EXT If unused, keep them 3 ANT_MAIN only supports passive antennas. EG915Q-NA_Hardware_Design 20 / 72 SPI_CS SPI_MISO SPI_MOSI 25 28 27 ADC Interfaces DO SPI chip selection DI SPI master-in slave-out DO SPI master-out slave-in Pin Name Pin No. I/O Description ADC0 ADC1 24 2 AI AI General-purpose ADC interface General-purpose ADC interface Other Interfaces LTE Standard Module Series open. DC Characteristic Comment Voltage range:

If unused, keep them 01.2 V open. Pin Name Pin No. I/O Description DC Characteristic Comment USB_BOOT 75 DI emergency download Forces the module into mode W_DISABLE#* 18 DI Airplane mode control PSM_IND*

1 DO Indicates the modules power saving mode External interrupt; wakes VDD_EXT DI DI up the module from power saving mode Application processor ready PSM_INT*

96 AP_READY*

19 RESERVED Pins Pin Name Pin No. Active high before power-up. Test points must be reserved. If unused, keep them open. I/O RESERVED 1114, 16, 49, 51, 56, 57, 6366, 8388, 92, 99, 103114, 116126 Keep these pins open. 2.6. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (UMTS&LTE EVB) with accessories to control or test the module. For more details, see document [1]. EG915Q-NA_Hardware_Design 21 / 72 LTE Standard Module Series 3 Operating Characteristics 3.1. Operating Modes Table 7: Operating Modes Overview Modes Descriptions Full Functionality Mode Idle Data Software is active. The module is registered on the network but has no data interaction with the network. Network connection is ongoing. Power consumption is decided by network setting and data rate. Minimum Functionality Mode AT+CFUN=0 can set the module to the minimum functionality mode when the power is on. Both RF function and USIM card will be invalid. AT+CFUN=4 or driving W_DISABLE#* low can set the module to airplane Airplane Mode mode. RF function will be invalid. Sleep Mode Power consumption of the module will be reduced to a minimal level. The module can still receive paging, SMS and TCP/UDP data from the network. Power Down Mode The VBAT_BB and VBAT_RF pins are constantly turned on and the software stops working. NOTE For more details about AT+CFUN, see document [2]. EG915Q-NA_Hardware_Design 22 / 72 LTE Standard Module Series 3.2. Sleep Mode With DRX technology, power consumption of the module will be reduced to a minimal level. t n e r r u C DRX OFF ON OFF ON OFF ON OFF ON OFF Run Time Figure 3: Power Consumption During Sleep Mode 3.2.1. UART Application Scenario If the module communicates with the host via main UART, both the following preconditions should be met to set the module to sleep mode:

Execute AT+QSCLK=1. For more details, see document [2]. Ensure MAIN_DTR is held high or is kept unconnected. Module Host MAIN_RXD MAIN_TXD MAIN_RI MAIN_DTR AP_READY GND TXD RXD EINT GPIO GPIO GND Figure 4: Sleep Mode Application via UART Driving MAIN_DTR low with the host will wake up the module. When the module has a URC to report, MAIN_RI signal will wake up the host. See Chapter 4.11.3 for details about MAIN_RI. EG915Q-NA_Hardware_Design 23 / 72 LTE Standard Module Series 3.2.2. USB Application Scenarios*

For the two situations (USB application with USB remote wakeup function and USB application with USB suspend/resume and MAIN_RI function) below, three preconditions must be met to set the module to sleep mode:

Execute AT+QSCLK=1. Ensure MAIN_DTR is held high or is kept unconnected. Ensure the hosts USB bus, which is connected to the modules USB interface, enters suspend state. 3.2.2.1. USB Application with USB Suspend/Resume and Remote Wakeup Function The following figure illustrates the connection between the module and the host when the host supports USB suspend, resume and remote wakeup function. Module USB_VBUS USB_DP USB_DM AP_READY GND Host VDD USB_DP USB_DM GPIO GND Figure 5:Sleep Mode Application with USB Suspend/Resume and Remote Wakeup Sending data to the module through USB will wake up the module. When the module has a URC to report, the module will send remote wake-up signals through USB bus to wake up the host. 3.2.2.2. USB Application with USB Suspend/Resume and MAIN_RI Function If the host supports USB suspend/resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. EG915Q-NA_Hardware_Design 24 / 72 LTE Standard Module Series Module USB_VBUS USB_DP USB_DM AP_READY MAIN_RI GND Host VDD USB_DP USB_DM GPIO EINT GND Figure 6: Sleep Mode Application with USB Suspend/Resume and MAIN_RI Sending data to the module through USB will wake up the module. When the module has a URC to report, the module will wake up the host through MAIN_RI signal. See Chapter 4.11.3 for details about MAIN_RI behavior. 3.2.2.3. USB Application without USB Suspend Function If the host does not support USB suspend function, the following three preconditions must be met to set the module to sleep mode:

Execute AT+QSCLK=1. Ensure MAIN_DTR is held high or is kept unconnected. Ensure USB_VBUS is disconnected via the external control circuit. Module Host External Control Circuit USB_VBUS USB_DP USB_DM MAIN_RI AP_READY GND GPIO VDD USB_DP USB_DM EINT GPIO GND Figure 7: Sleep Mode Application without USB Suspend Restore the power supply of USB_VBUS will wake up the module. EG915Q-NA_Hardware_Design 25 / 72 LTE Standard Module Series NOTE Pay attention to the level match shown in the dotted line between the module and the host. 3.3. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following methods. Hardware:

W_DISABLE#* is pulled up by default. Driving it low makes the module enter airplane mode. Software:

AT+CFUN=<fun> provides choice of the functionality level via setting <fun> to 0, 1 or 4. For more details, see document [2]. AT+CFUN=0: Minimum functionality mode. (Both USIM and RF functions are disabled.) AT+CFUN=1: Full functionality mode. (By default.) AT+CFUN=4: Airplane mode. (RF function is disabled.) 3.4. Power Supply 3.4.1. Power Supply Pins The module provides four VBAT pins dedicate to connecting with the external power supply:

Table 8: Pin Description of Power Supply Interface Pin Name Pin No. I/O Description Min. Typ. Max. Units VBAT_BB 32, 33 PI Power supply for the modules BB part 3.3 3.8 4.3 VBAT_RF 52, 53 PI Power supply for the modules RF part 3.3 3.8 4.3 VDD_EXT 29 PO Provide 1.8 V for external circuit

1.8

GND 3, 31, 47, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 V V V EG915Q-NA_Hardware_Design 26 / 72 LTE Standard Module Series 3.4.2. Reference Design for Power Supply Power design for the module is essential. The power supply of the module should be able to provide sufficient current of 2 A at least. If the voltage difference between input voltage and the supply voltage is small, it is suggested to use an LDO; if the voltage difference is big, a buck converter is recommended. The following figure shows a reference design for +5 V input power supply. The circuit is designed using the LDO of Microchips MIC29302WU. MIC29302WU 2 IN N E 1 OUT 4 D N G J D A 3 5 DC_IN 51K 4.7K 470 F 100 nF VBAT_EN 47K 100K 1%

47K 1%

VBAT 330R 470 F 100 nF Figure 8: Reference Design of Power Input NOTE To avoid corrupting the data in the internal flash, do not switch off the power supply when the module works normally. Only after turning off the module with PWRKEY or AT command can you cut off the power supply. 3.4.3. Voltage Stability Requirements The power supply range of the module is 3.34.3 V. Ensure the input voltage never drops below 3.3 V. To decrease the voltage drop, use a bypass capacitor of about 100 F with low ESR for VBAT_BB and VBAT_RF respectively and reserve a multi-layer ceramic chip (MLCC) capacitor array with ultra-low ESR. Use three ceramic capacitors (100 nF, 33 pF and 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT pins. The main power supply from an external application should be a single voltage source and can be expanded to two sub paths with the star configuration. The width of VBAT_BB trace and VBAT_RF trace should be at least 1 mm and 2 mm respectively. In principle, the longer the VBAT trace is, the wider it should be. To avoid the ripple and surge and to ensure the stability of the power supply to the module, it is EG915Q-NA_Hardware_Design 27 / 72 LTE Standard Module Series recommended to add a TVS with VRWM = 4.7 V, low clamping voltage and high reverse peak pulse current Ipp at the front end of the power supply. VBAT

D1 C1 C2 C3 C4 C5 C6 C7 C8

TVS 100 F 100 nF 33 pF 10 pF 100 F 100 nF 33 pF 10 pF Figure 9: Reference Design of Power Supply VBAT_RF VBAT_BB Module 3.5. Turn On 3.5.1. Turn On with PWRKEY Table 9: Pin Description of PWRKEY Pin Name Pin No. PWRKEY 15 I/O DI Description Comment Turn on/off the module Active low. When the module is in power-down mode, it can be turned on by driving the PWRKEY low for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. EG915Q-NA_Hardware_Design 28 / 72 LTE Standard Module Series 500 ms Turn on pulse 4.7K 47K Q1 GPIO MCU PWRKEY Module Figure 10: Reference Design of Turn On with Driving Circuit Another way to control the PWRKEY is using a keystroke directly. When pressing the keystroke, an electrostatic strike may be generated from finger. Therefore, you should place a TVS component near the keystroke for ESD protection. S1 R1 1K PWRKEY TVS 500ms Close to S1 Module Figure 11: Reference Design of Turn On with Keystroke The power-up timing is illustrated in the following figure. EG915Q-NA_Hardware_Design 29 / 72 LTE Standard Module Series NOTE 1 10 ms VBAT V 0.1 V 500 ms PWRKEY VDD_EXT USB_BOOT RESET_N STATUS UART USB VIL 0.5 V About 40 ms Connect USB_BOOT to VDD_EXT before the module is turned o n , and then the module will enter the emergency download mode when it is turned on. 2 s 10 s Inactive 10 s Inactive Active Active Figure 12: Power-up Timing with PWRKEY

. NOTE 1. Ensure the voltage of VBAT is stable for at least 30 ms before driving the PWRKEY low. 2. If the module needs to turn on automatically but does not need the turn-off function, PWRKEY can be driven low directly to ground with a recommended 4.7 k resistor. 3.6. Turn Off The following procedures can be used to turn off the module normally. 3.6.1. Turn Off with PWRKEY Drive the PWRKEY low for at least 650 ms and then release it. Then, the module will execute the turn-off procedure. EG915Q-NA_Hardware_Design 30 / 72 LTE Standard Module Series VBAT PWRKEY STATUS Module Status 650 ms 2 s Running Power-down procedure Off Figure 13: Power-down Timing with PWRKEY 3.6.2. Turn Off with AT Command For proper shutdown procedure, execute AT+QPOWD, which has similar timing and effect as turning off the module through driving PWRKEY low. See document [2] for details about AT+QPOWD. NOTE 1. To avoid corrupting the data in the internal flash, do not switch off the power supply when the module works normally. Only after turning off the module with PWRKEY or AT command can you cut off the power supply. 2. When turning off the module with the AT command, keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on automatically again after successful turn-off. 3.7. Reset The reset function requires the PWRKEY and RESET_N pins to work together to complete. Pulling down PWRKEY when RESET_N is at low level can reset the module. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. EG915Q-NA_Hardware_Design 31 / 72 LTE Standard Module Series Table 10: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 17 DI Reset the module Active low. Test points are recommended to be reserved if unused. The recommended circuit for reset function is similar to the PWRKEY control circuit. You can use an open drain/collector driver or a button to control RESET_N and PWRKEY pins. 300 ms Reset pulse GPIO 4.7K 47K Q1 RESET_N MCU Module Figure 14: Reference Design of Reset with Driving Circuit 500 ms Turn on pulse 4.7K 47K Q1 GPIO MCU PWRKEY Module Figure 15: Reference Design of PWRKEY with Driving Circuit EG915Q-NA_Hardware_Design 32 / 72 LTE Standard Module Series VBAT PWRKEY RESET_N Module Status 500 ms VIL 0.5 V 300 ms VIL 0.5 V Running Resetting Restart Figure 16: Reset Timing NOTE In reset timing, pull down PWRKEY when RESET_N is at low level. 1. 2. Ensure the capacitance on PWRKEY and RESET_N is not more than 10 nF. EG915Q-NA_Hardware_Design 33 / 72 LTE Standard Module Series 4 Application Interfaces 4.1. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specifications and supports high-speed (480 Mbps) and full-speed (12 Mbps) for USB 2.0. The module only supports USB slave mode. The USB interface can be used for AT command communication, data transmission, software debugging, firmware upgrade and the output of partial logs. Table 11: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS 8 AI USB connection detect Test points must be reserved. USB_DP 9 AIO USB differential data (+) USB 2.0 compliant. USB_DM 10 AIO USB differential data (-) Requires differential impedance of 90 . Test points must be reserved. Test points of USB 2.0 interface must be reserved, which can be used for firmware upgrading and debugging. Minimize these stubs Test Points Module VDD USB_VBUS USB_DM USB_DP GND NM_0 R NM_0 R R1 R2 L1 TVS Array Close to module MCU USB_DM USB_DP GND Figure 17: Reference Design of USB 2.0 Interface EG915Q-NA_Hardware_Design 34 / 72 LTE Standard Module Series It is recommended to add a common-mode choke L1 in series between MCU and the module to suppress EMI spurious transmission. Meanwhile, it is also suggested to add R1 and R2 in series between the module and test points for debugging. These resistors are not mounted by default. To ensure the signal integrity of USB 2.0 data transmission, you should place L1, R1 and R2 close to the module, and keep these resistors close to each other. Moreover, keep extra stubs of trace as short as possible. To ensure performance, you should follow the following principles when designing USB interface:

Route USB signal traces as differential pairs with surrounded ground. The impedance of USB 2.0 differential trace is 90 . Route USB differential traces at the inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. For signal traces, provide clearance from VBAT traces, crystal-oscillators, magnetic devices, sensitive signals like RF signals, analog signals, and noise signals generated by clock, DC-DC, etc. Pay attention to the impact caused by stray capacitance of the ESD protection component on USB data lines. Typically, the stray capacitance should be less than 2 pF for USB 2.0. Keep the ESD protection components as close to the USB port as possible. For more details about the USB specifications, visit http://www.usb.org/home. 4.2. USB_BOOT The module provides a USB_BOOT pin for emergency download. Pulling up USB_BOOT to VDD_EXT before turning on the module, and then the module will enter emergency download mode. In this mode, the module supports firmware upgrade over USB 2.0 interface. Table 12: Pin Description of USB_BOOT Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Forces the module into emergency download mode Active high before power-up. Test points must be reserved. EG915Q-NA_Hardware_Design 35 / 72 LTE Standard Module Series Module USB_BOOT Test points 2 1 4.7K VDD_EXT 3 GND TVS TVS should be placed close to test points. Figure 18: Reference Design of USB_BOOT NOTE 1 VBAT 500 ms VIL 0.5 V About 40ms USB_BOOT can be pulled up to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is turned on. PWRKEY VDD_EXT USB_BOOT RESET_N Figure 19: Timing of Entering Emergency Download Mode NOTE 1. Ensure VBAT is stable before driving PWRKEY low. 2. Follow the above timing when using MCU control the module to enter the emergency download mode. If you need to manually force the module to enter emergency download mode, directly connect the 3. test points shown in Figure 18. EG915Q-NA_Hardware_Design 36 / 72 LTE Standard Module Series 4.3. USIM Interface The USIM interface meets ETSI and IMT-2000 requirements. Either 1.8 V or 3.0 V USIM card is supported. Table 13: Pin Description of USIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD 43 PO USIM card power supply USIM_DATA 45 DIO USIM card data USIM_CLK 46 DO USIM card clock USIM_RST 44 DO USIM card reset Either 1.8 V or 3.0 V USIM card is supported and can be identified automatically by the module. USIM_DET 42 DI USIM card hot-plug detect If unused, keep it open. The module supports USIM card hot-plug via the USIM_DET, and both high-level and low-level detections are supported. Hot-plug function is disabled by default and you can use AT+QSIMDET to configure this function. See document [2] for more details. The following figure illustrates a reference design for USIM card interface with an 8-pin USIM card connector. VDD_EXT USIM_VDD 51K 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 0 R 0 R 0 R 100 nF USIM Card Connector VCC RST CLK GND VPP IO Switch 33 pF 33 pF 33 pF GND TVS Array GND GND Figure 20: Reference Design of USIM Interface with an 8-pin USIM Card Connector EG915Q-NA_Hardware_Design 37 / 72 If the function of USIM card hot-plug is not needed, keep USIM_DET disconnected. A reference design for USIM interface with a 6-pin USIM card connector is illustrated in the following figure. LTE Standard Module Series USIM_VDD GND USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 0 R 0 R 0 R Module 100 nF USIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF TVS Array GND GND Figure 21: Reference Design of USIM Interface with a 6-pin USIM Card Connector To enhance the reliability and availability of the USIM card in applications, follow the principles below in the USIM circuit design:

Place the USIM card connector close to the module. Keep the trace length as short as possible and at most 200 mm. Route USIM card differential traces at the inner-layer of the PCB, and surround the traces with ground on that layer and ground planes above and below. For signal traces, provide clearance from VBAT traces, crystal-oscillators, magnetic devices, sensitive signals like RF signals, analog signals, and noise signals generated by clock, DC-DC, etc. Ensure the tracing between the USIM card connector and the module is short and wide. Keep the trace width of ground and USIM_VDD at least 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep the traces away from each other and shield them with surrounded ground. To offer good ESD protection, it is recommended to add a TVS array of which parasitic capacitance should be less than 15 pF. Add 0 resistors in series between the module and the USIM card connector to facilitate debugging. The 33 pF capacitors are used for filtering out RF interference. Additionally, keep the USIM peripheral circuit close to the USIM card connector. The pull-up resistor on USIM_DATA trace can improve anti-jamming capability when long layout trace and sensitive occasions are applied, and should be placed close to the USIM card connector. EG915Q-NA_Hardware_Design 38 / 74 LTE Standard Module Series 4.4. UART Interfaces The module serves as DCE (Data Communication Equipment), which is connected in the traditional DCE-DTE (Data Terminal Equipment) mode. The module provides two UART Interfaces. Table 14: UART Information (Unit: bps) UART Types Supported Baud Rates Default Baud Rates Functions Main UART 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600 115200 AT command communication and data transmission Debug UART 115200, 3000000 115200 The output of partial logs Table 15: Pin Description of UART Pin Name Pin No. I/O Description Comment MAIN_CTS 36 DO MAIN_RTS MAIN_RXD MAIN_DCD MAIN_TXD MAIN_RI MAIN_DTR DBG_RXD DBG_TXD 37 34 38 35 39 30 22 23 DTE clear to send signal from DCE Connect to DTEs CTS. If unused, keep it open. DTE request to send signal to DCE Connect to DTEs RTS. If unused, keep it open. Main UART receive DI DI DO Main UART data carrier detect DO Main UART transmit DO Main UART ring indication DI DI Main UART data terminal ready Debug UART receive DO Debug UART transmit If unused, keep them open. Test points must be reserved. The module provides 1.8 V UART interfaces. You can use a level-shifting chip between the module and hosts UART if the host is equipped with a 3.3 V UART. EG915Q-NA_Hardware_Design 39 / 74 LTE Standard Module Series VDD_EXT 0.1 F 1 0 K 120K MAIN_RI MAIN_DCD MAIN_CTS MAIN_RTS MAIN_DTR MAIN_TXD MAIN_RXD 51K VCCA VCCB 0.1 F VDD_MCU OE A1 A2 A3 A4 A5 A6 A7 A8 GND Level-shifting Chip B1 B2 B3 B4 B5 B6 B7 B8 51K RI_MCU DCD_MCU CTS_MCU RTS_MCU DTR_MCU RXD_MCU TXD_MCU Figure 22: Reference Design of UART with Level-shifting Chip Another example of level-shifting circuit is shown as below. For the design of circuits in dotted lines, see that shown in solid lines, but pay attention to the direction of the connection. MCU/ARM VDD_EXT 4.7K 1 nF VDD_EXT 10K 10K 1 nF VCC_MCU 4.7K VDD_EXT TXD RXD RTS CTS GPIO EINT GPIO GND Module MAIN_RXD MAIN_TXD MAIN_RTS MAIN_CTS MAIN_DTR MAIN_RI MAIN_DCD GND Figure 23: Reference Design of UART with Transistor Level-shifting Circuit NOTE 1. Transistor circuit solution above is not suitable for applications with baud rates exceeding 460 kbps. 2. Note that the modules CTS is connected to the host CTS, and the modules RTS is connected to the host RTS. EG915Q-NA_Hardware_Design 40 / 74 LTE Standard Module Series 4.5. PCM and I2C Interfaces*

The module provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. Table 16: Pin Description of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_SYNC 5 DO PCM data frame sync PCM_CLK PCM_DIN 4 6 DO PCM clock DI PCM data input PCM_DOUT 7 DO PCM data output If unused, keep them open. I2C_SCL I2C_SDA 40 41 DO I2C serial clock DIO I2C serial data External pull-up resistor is required. If unused, keep them open. The reference design is illustrated as follows. PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN I2C_SCL I2C_SDA S A B I MICBIAS INP INN LOUTP LOUTN BCLK LRCK DAC ADC SCL SDA Module K 7 4

. K 7 4

. 1.8 V Codec Figure 24: Reference Design of PCM and I2C Interfaces EG915Q-NA_Hardware_Design 41 / 74 LTE Standard Module Series 4.6. ADC Interfaces The module provides two Analog-to-Digital Converter (ADC) interfaces. To improve the accuracy of ADC, surround the trace of ADC with ground. Table 17: Pin Description of ADC Interfaces Pin Name Pin No. I/O Description Comment ADC0 ADC1 24 2 AI AI General-purpose ADC interface General-purpose ADC interface If unused, keep them open. With AT+QADC=<port>, you can:

AT+QADC=0: read the voltage value on ADC0 AT+QADC=1: read the voltage value on ADC1 For more details about the AT command, see document [2]. Table 18: Characteristics of ADC Interfaces Parameters ADC0 voltage range ADC input resistance ADC resolution NOTE Min. 0 0.26

Typ.

12 Max. 1.2 0.75

Units V M bits 1. The input voltage of every ADC interface should not exceed 1.2 V. 2. It is prohibited to directly supply any voltage to ADC Interfaces when the module is not powered by the VBAT. It is recommended to use resistor divider circuit for ADC interface application. Resistance of the external resistor divider should not exceed 100 k, or the measurement accuracy of ADC would be significantly reduced. 3. EG915Q-NA_Hardware_Design 42 / 74 LTE Standard Module Series 4.7. SPI Interface*

The module provides one SPI interface with a maximum clock frequency up to 25.6 MHz. Table 19: Pin Description of SPI Interface Pin Name Pin No. SPI_CLK SPI_CS SPI_MISO SPI_MOSI 26 25 28 27 I/O DO DO DI Description Comment SPI clock SPI chip selection SPI master-in slave-out If unused, keep them open. DO SPI master-out slave-in The voltage domain of the modules SPI is 1.8 V. Use a level-shifting chip between the module and the host if the voltage domain of the external host system is 3.3 V. A level-shifting chip that supports SPI data rate is recommended. The following figure shows a reference design:

VDD_EXT VCCA 0.1 F SPI_CS SPI_CLK SPI_MOSI SPI_MISO OE A1 A2 A3 A4 NC VCCB GND 0.1 F VDD_MCU Level-shifting Chip B1 B2 B3 B4 NC SPI_CS_N_MCU SPI_CLK_MCU SPI_MOSI_MCU SPI_MISO_MCU Figure 25: Reference Design of SPI with a Level-Shifting Chip 4.8. Camera SPI Interface*

The module provides one camera SPI interface supporting 2-bit data transmission of SPI. EG915Q-NA_Hardware_Design 43 / 74 LTE Standard Module Series Table 20: Pin Description of Camera SPI Interface Pin Name Pin No. CAM_MCLK CAM_SPI_CLK 95 78 CAM_SPI_DATA0 97 CAM_SPI_DATA1 98 I/O DO DI DI DI Description Comment Master clock of the camera Camera SPI clock Camera SPI data bit 0 Camera SPI data bit 1 If unused, keep them open. CAM_PWDN 115 DO Power down of the camera CAM_VDD CAM_VDDIO 94 93 PO PO Camera analog power supply Camera digital power supply 4.9. GRFC Interfaces*

The module provides two GRFC (generic RF control) interfaces for the control of external antenna tuners. Table 21: Pin Description of GRFC Interfaces Pin Name Pin No. GRFC1 GRFC2 76 77 I/O DO DO Description Comment Generic RF controller Generic RF controller If unused, keep them open. 4.10. Control Signals Table 22: Pin Description of Control Signals Pin Name Pin No. I/O Description W_DISABLE#* 18 DI Airplane mode control PSM_IND*

1 DO Indicate the modules power saving mode Comment If unused, keep them open. EG915Q-NA_Hardware_Design 44 / 74 LTE Standard Module Series PSM_INT*

96 DI External interrupt; wake up the module from power saving mode AP_READY*

19 DI Application processor ready 4.10.1. W_DISABLE#*

The module provides W_DISABLE# to enable or disable RF function. When the voltage level of W_DISABLE# is high, you can send AT+CFUN=<fun> to set the modules operating mode. Driving W_DISABLE# low will set the module to airplane mode. Table 23: W_DISABLE# AT Command Configuration Information Level Status AT Command RF Function Operating Mode AT+CFUN=1 Enabled Full functionality mode High level AT+CFUN=0 AT+CFUN=4 AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Low level NOTE Disabled Disabled Minimum functionality mode Airplane mode Disabled Airplane mode W_DISABLE# is a control function for airplane mode, which is disabled in software by default. It can be enabled through AT+QCFG="airplanecontrol",1. For the details of this command, please contact Quectel Technical Support. 4.11. Indication Signals Table 24: Pin Description of Indication Signals Pin Name Pin No. I/O Description Comment STATUS NET_STATUS 20 21 DO DO Indicate the module's operation status Indicate the module's network activity status If unused, keep them open. EG915Q-NA_Hardware_Design 45 / 74 LTE Standard Module Series 4.11.1. Network Status Indication The module provides one network status indication pins: the NET_STATUS for the modules network operation status indication, which can drive corresponding LEDs. Table 25: Network Status Indication Pin Level and Module Network Status Pin Name NET_STATUS Level Status Module Network Status Flicker slowly (200 ms High/1800 ms Low) Network searching NET_STATUS Flicker slowly (1800 ms High/200 ms Low) Idle Flicker quickly (125 ms High/125 ms Low) Data transmission is ongoing Module NET_STATUS 4.7K VBAT 2.2K 47K Figure 26: Reference Design of NET_STATUS Indication 4.11.2. STATUS The STATUS is used for indicating the modules operation status. It will output high level when the module is turned on. EG915Q-NA_Hardware_Design 46 / 74 LTE Standard Module Series Module STATUS 4.7K VBAT 2.2K 47K Figure 27: Reference Design of STATUS 4.11.3. MAIN_RI AT+QCFG= risignaltype, physical can be used to configure MAIN_RI behavior. No matter on which port a URC information is presented, the URC information will trigger the behavior of the MAIN_RI. For the details of AT+QCFG, please contact Quectel Technical Support. NOTE The AT+QURCCFG allows you to set the main UART, USB AT port or USB modem port as the URC information output port. The USB AT port is the URC output port by default. For more details about AT+QURCCFG, see document [2]. You can configure MAIN_RI behaviors flexibly. The default behaviors of the MAIN_RI are shown as below. Table 26: MAIN_RI Level and Module Status Module Status MAIN_RI Level Status Idle High level When a new URC information returns MAIN_RI outputs at least 120 ms low level. After the module outputs the data, the level status will then become high. Indication behavior for MAIN_RI can be configured via AT+QCFG="urc/ri/ring". EG915Q-NA_Hardware_Design 47 / 74 LTE Standard Module Series 5 RF Specifications 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. Table 27: Pin Description of Cellular Antenna Interface Pin Name Pin No. I/O Description Comment ANT_MAIN 4 60 AIO Main antenna interface 50 impedance. Table 28: Operating Frequency of EG915Q-NA (Unit: MHz) Operating Frequency Transmit LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B12 LTE-FDD B13 LTE-FDD B66 18501910 17101755 824849 699716 777787 Receive 19301990 21102155 869894 729746 746756 17101780 21102180 4 ANT_MAIN only supports passive antennas. EG915Q-NA_Hardware_Design 48 / 74 LTE Standard Module Series 5.1.2. Tx Power Table 29: RF Transmitting Power Frequency Bands Max. RF Output Power Min. RF Output Power LTE-FDD bands 23 dBm 2 dB

< -39 dBm 5.1.3. Rx Sensitivity Table 30: Conducted RF Receiver Sensitivity of EG915Q-NA (Unit: dBm) Frequency Bands 3GPP (SIMO) Receiver Sensitivity (Typ.) Primary LTE-FDD B2 (10 MHz)

-98 dBm LTE-FDD B4 (10 MHz)

-98.5 dBm LTE-FDD B5 (10 MHz)

-99 dBm LTE-FDD B12 (10 MHz)

-98.5 dBm LTE-FDD B13 (10 MHz)

-98.5dBm LTE-FDD B66 (10 MHz)

-98.5 dBm

-94.3 dBm

-96.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-95.8 dBm EG915Q-NA_Hardware_Design 49 / 74 5.1.4. Reference Design LTE Standard Module Series ANT_MAIN R1 0R Main Antenna C1 NM C2 NM Module Figure 28: Reference Design of Main Antenna NOTE 1. Use a -type matching circuit for the antenna interface for better cellular performance and for the ease of debugging. 2. Capacitors are not mounted by default. 3. Place the -type matching components (R1 & C1 & C2) to the antenna as close as possible. 5.2. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. EG915Q-NA_Hardware_Design 50 / 74 LTE Standard Module Series Figure 29: Microstrip Design on a 2-layer PCB Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EG915Q-NA_Hardware_Design 51 / 74 LTE Standard Module Series Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. EG915Q-NA_Hardware_Design 52 / 74 LTE Standard Module Series 5.3. Antenna Design Requirements Table 31: Requirements for Antenna Design Antenna Types Requirements LTE VSWR: 2 Efficiency: > 30 %

Gain: 1 dBi Max. input power: 50 W Input impedance: 50 Vertical polarization Cable insertion loss:

< 1 dB: LB (< 1 GHz)

< 1.5 dB: MB (12.3 GHz) 5.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 33: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. EG915Q-NA_Hardware_Design 53 / 74 LTE Standard Module Series Figure 34: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 35: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. EG915Q-NA_Hardware_Design 54 / 74 LTE Standard Module Series 6 Electrical Characteristics &

Reliability 6.1. Absolute Maximum Ratings Table 32: Absolute Maximum Ratings Parameters Voltage at VBAT_RF & VBAT_BB Voltage at USB_VBUS Voltage at digital pins Min.

-0.3

-0.3

-0.3 6.2. Power Supply Ratings Table 33: Power Supply Ratings Max. 5 5.25 2.3 Unit V V V Parameters Descriptions Conditions Min. Typ. Max. Units VBAT VBAT_BB & VBAT_RF IVBAT Peak power consumption The actual input voltages must be kept between the minimum and maximum values. At maximum power control level USB_VBUS USB connection detection

3.3 3.8 4.3 V

1.5 2 A 3.0 5.0 5.25 V EG915Q-NA_Hardware_Design 55 / 74 LTE Standard Module Series 6.3. Power Consumption Table 34: Power Consumption Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) AT+CFUN=4 (USB disconnected) Typ. 0.4 54 130 Sleep state LTE-FDD @ PF = 32 (USB disconnected) 1.24 LTE-FDD @ PF = 64 (USB disconnected) 0.68 LTE-FDD @ PF = 128 (USB disconnected) 0.41 LTE-FDD @ PF = 256 (USB disconnected) 0.3 LTE-FDD @ PF = 64 (USB disconnected) 4.55 LTE-FDD @ PF = 64 (USB connected) 28.22 Idle state LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B12 LTE-FDD B13 LTE-FDD B66 629 570 544 571 657 543 LTE data transfer NOTE Units A uA uA mA mA mA mA mA mA mA mA mA mA mA mA The power consumption data above is for reference only, which may vary among different modules. For detailed information, contact Quectel Technical Support for the power consumption test report of the specific module. EG915Q-NA_Hardware_Design 56 / 74 6.4. Digital I/O Characteristics Table 35: VDD_EXT I/O Characteristics (Unit: V) Parameters Descriptions High-level input voltage Low-level input voltage High-level output voltage 1.35 Low-level output voltage

Table 36: USIM Low-voltage I/O Characteristics (Unit: V) Parameters Descriptions High-level input voltage Low-level input voltage High-level output voltage 1.35 Low-level output voltage

Table 37: USIM High-voltage I/O Characteristics (Unit: V) Parameters Descriptions High-level input voltage Low-level input voltage

High-level output voltage 2.55 Low-level output voltage

Min. 1.2

-0.3 Min. 1.2

Min. 1.95 VIH VIL VOH VOL VIH VIL VOH VOL VIH VIL VOH VOL LTE Standard Module Series Max. 2 0.6

0.45 Max.

0.6

0.45 Max.

1.0

0.45 EG915Q-NA_Hardware_Design 57 / 74 LTE Standard Module Series 6.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 38: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %; Unit: kV) Test Points VBAT & GND Antenna interface Other interfaces Contact Discharge Air Discharge 8 5 0.5 12 10 1 6.6. Operating and Storage Temperatures Table 39: Operating and Storage Temperatures (Unit: C) Parameters Normal Operating Temperature 5 Extended Operating Temperature 6 Storage Temperature Min.

-35

-40

-40 Typ.

+25

Max.

+75

+85

+90 5 Within the operating temperature range, the module meets 3GPP specifications. 6 Within the extended temperature range, the module remains the ability to establish and maintain functions such as SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG915Q-NA_Hardware_Design 58 / 74 LTE Standard Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 36: Top and Side Dimensions (Unit: mm) EG915Q-NA_Hardware_Design 59 / 74 LTE Standard Module Series Figure 37: Bottom Dimensions (Bottom View, Unit: mm) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG915Q-NA_Hardware_Design 60 / 74 7.2. Recommended Footprint LTE Standard Module Series Figure 38: Recommended Footprint (Unit: mm)

. NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG915Q-NA_Hardware_Design 61 / 74 7.3. Top and Bottom Views LTE Standard Module Series Figure 39: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG915Q-NA_Hardware_Design 62 / 74 LTE Standard Module Series 8 Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 7 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 7 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. EG915Q-NA_Hardware_Design 63 / 74 LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.130.15 mm. For more details, see document [4]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Temp. (C) 246 235 217 200 150 100 Soak Zone A Ramp-to-soak slope:

03 C/s Reflow Zone Ramp-up slope: Cool-down slope:

03 C/s C

-30 C/s B D Figure 40: Recommended Reflow Soldering Thermal Profile EG915Q-NA_Hardware_Design 64 / 74 LTE Standard Module Series Table 40: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, never wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do not use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective wave soldering, ultrasonic soldering) that is not mentioned in document [4]. EG915Q-NA_Hardware_Design 65 / 74 LTE Standard Module Series 8.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

8.3.1. Carrier Tape Dimension details are as follow:

Figure 41: Carrier Tape Dimension Drawing Table 41: Carrier Tape Dimension Table (Unit: mm) W 44 P 32 T A0 0.35 20.2 B0 24 K0 K1 F E 3.15 6.65 20.2 1.75 EG915Q-NA_Hardware_Design 66 / 74 8.3.2. Plastic Reel LTE Standard Module Series Figure 42: Plastic Reel Dimension Drawing Table 42: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 8.3.3. Mounting Direction Figure 43: Mounting Direction EG915Q-NA_Hardware_Design 67 / 74 8.3.4. Packaging Process LTE Standard Module Series Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules. Figure 44: Packaging Process EG915Q-NA_Hardware_Design 68 / 74 LTE Standard Module Series 9 Appendix References Table 43: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_EG800Q-EU&EG915Q-NA_AT_Commands_Manual

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_SMT_Application_Note Table 44: Terms and Abbreviations Abbreviation Description 3GPP ADC bps CHAP CMUX CTS DCE 3rd Generation Partnership Project Analog-to-Digital Converter Bits Per Second Challenge Handshake Authentication Protocol Connection MUX Clear To Send Data Communications Equipment DFOTA Delta Firmware Upgrade Over the Air DL DRX DTE DTR Downlink Discontinuous Reception Data Terminal Equipment Data Terminal Ready EG915Q-NA_Hardware_Design 69 / 74 LTE Standard Module Series ESD FDD FILE FTP FTPS GRFC HB HTTP Electrostatic Discharge Frequency Division Duplex File Protocol File Transfer Protocol FTP over SSL General RF Control High Band Hypertext Transfer Protocol HTTPS Hypertext Transfer Protocol Secure I2C I/O Inter-Integrated Circuit Input/Output IMT-2000 International Mobile Telecommunications 2000 LB LED LGA LTE MB MCU MO MQTT MT NITZ NTP PAP PCB Low Band Light Emitting Diode Land Grid Array Long Term Evolution Middle Band Microcontroller Unit Mobile Originated Message Queuing Telemetry Transport Mobile Terminated Network Identity and Time Zone Network Time Protocol Password Authentication Protocol Printed Circuit Board EG915Q-NA_Hardware_Design 70 / 74 LTE Standard Module Series PCM PDA PDU PING PPP QAM Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Packet Internet Groper Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RI RF Rx SMD SMS SSL SPI TCP Tx UART UDP UL UMTS URC USB USIM VBAT VIH Ring Indicator Radio Frequency Receive Surface Mount Device Short Message Service Secure Sockets Layer Serial Peripheral Interface Transmission Control Protocol Transmit Universal Asynchronous Receiver/Transmitter User Datagram Protocol Uplink Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus Universal Subscriber Identity Module Voltage at Battery (Pin) High-level input voltage EG915Q-NA_Hardware_Design 71 / 74 LTE Standard Module Series VIL VOH VOL Vmax Vnom Vmin VILmax VRWM VSWR Low-level input voltage High-level output voltage Low-level output voltage Maximum Voltage Nominal Voltage Minimum Voltage Maximum Low-level Input Voltage Working Peak Reverse Voltage Voltage Standing Wave Ratio Product Marketing NameQuectel EG915Q-NA FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID:

XMR2023EG915QNA 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

radiation, maximum antenna gain

(including cable loss) must not exceed:

Operating Band LTE Band 2 LTE Band 4 LTE Band 5 LTE Band 12 LTE Band 13 LTE Band 66 FCC Max Antenna Gain dBi 8.00 5.00 9.41 8.70 9.16 5.00 EG915Q-NA_Hardware_Design 72 / 74 LTE Standard Module Series 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2023EG915QNA or Contains FCC ID:

XMR2023EG915QNA must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

(1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-023EG915QNA or where: 10224A-023EG915QNA is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre EG915Q-NA_Hardware_Design 73 / 74 clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-023EG915QNA " ou "o: 10224A-023EG915QNA est le numro de certification du module". LTE Standard Module Series EG915Q-NA_Hardware_Design 74 / 74

EG915Q-NA Hardware Design LTE Standard Module Series Version: 1.0 Date: 2023-02-07 Status: Released LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. EG915Q-NA_Hardware_Design 1 / 72 LTE Standard Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. EG915Q-NA_Hardware_Design 2 / 72 LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EG915Q-NA_Hardware_Design 3 / 72 LTE Standard Module Series About the Document Revision History Version Date Author Description

1.0 2022-11-28 Lex LI/Lena HUANG Creation of the document 2023-02-07 Lex LI/Barry DENG First official release EG915Q-NA_Hardware_Design 4 / 72 LTE Standard Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 7 Figure Index ................................................................................................................................................. 9 1 Introduction ......................................................................................................................................... 11 Special Marks .......................................................................................................................... 11 1.1. 2 Product Overview ............................................................................................................................... 12 Frequency Bands .................................................................................................................... 12 Key Features ............................................................................................................................ 13 Functional Diagram .................................................................................................................. 15 Pin Assignment .........................................................................................................................16 Pin Description ......................................................................................................................... 17 EVB Kit..................................................................................................................................... 21 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 3.1. 3.2. 3 Operating Characteristics .................................................................................................................. 22 Operating Modes ..................................................................................................................... 22 Sleep Mode .............................................................................................................................. 23 3.2.1. UART Application Scenario ............................................................................................ 23 3.2.2. USB Application Scenarios* ............................................................................................ 24 3.2.2.1. USB Application with USB Suspend/Resume and Remote Wakeup Function 24 3.2.2.2. USB Application with USB Suspend/Resume and MAIN_RI Function .................. 24 3.2.2.3. USB Application without USB Suspend Function .................................................. 25 Airplane Mode .......................................................................................................................... 26 Power Supply........................................................................................................................... 26 3.4.1. Power Supply Pins.......................................................................................................... 26 3.4.2. Reference Design for Power Supply .............................................................................. 27 3.4.3. Voltage Stability Requirements ....................................................................................... 27 Turn On .................................................................................................................................... 28 Turn On with PWRKEY................................................................................................... 28 Turn Off .................................................................................................................................... 30 Turn Off with PWRKEY ................................................................................................... 30 Turn Off with AT Command ............................................................................................ 31 Reset ........................................................................................................................................ 31 3.6.1. 3.6.2. 3.5.1. 3.3. 3.4. 3.5. 3.6. 3.7. 4 Application Interfaces ........................................................................................................................ 34 USB Interface .......................................................................................................................... 34 USB_BOOT ............................................................................................................................. 35 USIM Interface ......................................................................................................................... 37 UART Interfaces ...................................................................................................................... 39 PCM and I2C Interfaces* ......................................................................................................... 41 4.1. 4.2. 4.3. 4.4. 4.5. EG915Q-NA_Hardware_Design 5 / 72 LTE Standard Module Series ADC Interfaces ........................................................................................................................ 42 4.6. SPI Interface* ........................................................................................................................... 43 4.7. Camera SPI Interface* ............................................................................................................. 43 4.8. 4.9. GRFC Interfaces* .................................................................................................................... 44 4.10. Control Signals ........................................................................................................................ 44 4.10.1. W_DISABLE#* ................................................................................................................ 45 Indication Signals ..................................................................................................................... 45 4.11.1. Network Status Indication ............................................................................................... 46 4.11.2. STATUS ......................................................................................................................... 46 4.11.3. MAIN_RI ......................................................................................................................... 47 4.11. 5.1. 5 RF Specifications ............................................................................................................................... 48 Cellular Network ....................................................................................................................... 48 5.1.1. Antenna Interface & Frequency Bands ........................................................................... 48 Tx Power ........................................................................................................................ 49 5.1.2. 5.1.3. Rx Sensitivity ................................................................................................................... 49 5.1.4. Reference Design ........................................................................................................... 50 RF Routing Guidelines ............................................................................................................. 50 Antenna Design Requirements ................................................................................................ 53 RF Connector Recommendation ............................................................................................. 53 5.2. 5.3. 5.4. 6 Electrical Characteristics & Reliability ............................................................................................. 55 Absolute Maximum Ratings ..................................................................................................... 55 Power Supply Ratings ............................................................................................................. 55 Power Consumption .................................................................................................................56 Digital I/O Characteristics ........................................................................................................ 57 ESD Protection ........................................................................................................................ 58 Operating and Storage Temperatures ..................................................................................... 58 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 7 Mechanical Information ..................................................................................................................... 59 7.1. Mechanical Dimensions ........................................................................................................... 59 Recommended Footprint ......................................................................................................... 61 7.2. Top and Bottom Views ..............................................................................................................62 7.3. 8 Storage, Manufacturing & Packaging ............................................................................................... 63 Storage Conditions .................................................................................................................. 63 8.1. 8.2. Manufacturing and Soldering ................................................................................................... 64 Packaging Specification ........................................................................................................... 66 8.3. 8.3.1. Carrier Tape .................................................................................................................... 66 8.3.2. Plastic Reel ..................................................................................................................... 67 8.3.3. Mounting Direction .......................................................................................................... 67 8.3.4. Packaging Process ......................................................................................................... 68 9 Appendix References .......................................................................................................................... 69 EG915Q-NA_Hardware_Design 6 / 72 LTE Standard Module Series Table Index Table 1: Special Marks ................................................................................................................................. 11 Table 2: Basic Information .......................................................................................................................... 12 Table 3: Frequency Bands and Functions .................................................................................................. 12 Table 4: Key Features ................................................................................................................................. 13 Table 5: Parameter Definition ..................................................................................................................... 17 Table 6: Pin Description .............................................................................................................................. 17 Table 7: Operating Modes Overview ........................................................................................................... 22 Table 8: Pin Description of Power Supply Interface .................................................................................... 26 Table 9: Pin Description of PWRKEY ......................................................................................................... 28 Table 10: Pin Description of RESET_N ...................................................................................................... 32 Table 11: Pin Description of USB Interface ................................................................................................. 34 Table 12: Pin Description of USB_BOOT ................................................................................................... 35 Table 13: Pin Description of USIM Interface ............................................................................................... 37 Table 14: UART Information (Unit: bps) ...................................................................................................... 39 Table 15: Pin Description of UART ............................................................................................................. 39 Table 16: Pin Description of PCM and I2C Interfaces ................................................................................ 41 Table 17: Pin Description of ADC Interfaces ............................................................................................... 42 Table 18: Characteristics of ADC Interfaces ............................................................................................... 42 Table 19: Pin Description of SPI Interface .................................................................................................. 43 Table 20: Pin Description of Camera SPI Interface .................................................................................... 44 Table 21: Pin Description of GRFC Interfaces ............................................................................................ 44 Table 22: Pin Description of Control Signals ............................................................................................... 44 Table 23: W_DISABLE# AT Command Configuration Information.............................................................. 45 Table 24: Pin Description of Indication Signals ........................................................................................... 45 Table 25: Network Status Indication Pin Level and Module Network Status .............................................. 46 Table 26: MAIN_RI Level and Module Status ............................................................................................. 47 Table 27: Pin Description of Cellular Antenna Interface.............................................................................. 48 Table 28: Operating Frequency of EG915Q-NA (Unit: MHz) ...................................................................... 48 Table 29: RF Transmitting Power ................................................................................................................ 49 Table 30: Conducted RF Receiver Sensitivity of EG915Q-NA (Unit: dBm) ................................................ 49 Table 31: Requirements for Antenna Design .............................................................................................. 53 Table 32: Absolute Maximum Ratings ........................................................................................................ 55 Table 33: Modules Power Supply Ratings ........................................................................................................... 55 Table 34: Power Consumption .................................................................................................................... 56 Table 35: 1.8 V I/O Characteristics (Unit: V) ............................................................................................... 57 Table 36: USIM Low-voltage I/O Characteristics (Unit: V) .......................................................................... 57 Table 37: USIM High-voltage I/O Characteristics (Unit: V) ......................................................................... 57 Table 38: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %; Unit: kV) ............................. 58 Table 39: Operating and Storage Temperatures (Unit: C) ......................................................................... 58 Table 40: Recommended Thermal Profile Parameters ............................................................................... 65 Table 41: Carrier Tape Dimension Table (Unit: mm) ................................................................................... 66 EG915Q-NA_Hardware_Design 7 / 72 Table 42: Plastic Reel Dimension Table (Unit: mm) .....................................................................................67 Table 43: Related Documents......................................................................................................................69 Table 44: Terms and Abbreviations ..............................................................................................................69 LTE Standard Module Series EG915Q-NA_Hardware_Design 8 / 72 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 15 Figure 2: Pins Assignment (Top View) ........................................................................................................ 16 Figure 3: Power Consumption During Sleep Mode .................................................................................... 23 Figure 4: Block Diagram of UART Application in Sleep Mode .................................................................... 23 Figure 5: Block Diagram of Application with USB Remote Wakeup Function in Sleep Mode .................... 24 Figure 6: Block Diagram of Application with MAIN_RI Function in Sleep Mode ......................................... 25 Figure 7: Block Diagram of Application without USB Suspend Function in Sleep Mode ............................ 25 Figure 8: Reference Design of Power Input................................................................................................ 27 Figure 9: Reference Design of Power Supply............................................................................................. 28 Figure 10: Reference Design of Turn On with Driving Circuit ..................................................................... 29 Figure 11: Reference Design of Turn On with Keystroke............................................................................ 29 Figure 12: Power-up Timing with PWRKEY ............................................................................................... 30 Figure 13: Power-down Timing with PWRKEY ........................................................................................... 31 Figure 14: Reference Design of Reset with Driving Circuit......................................................................... 32 Figure 15: Reference Design of PWRKEY with Driving Circuit .................................................................. 32 Figure 16: Reset Timing ............................................................................................................................. 33 Figure 17: Reference Design of USB 2.0 Interface .................................................................................... 34 Figure 18: Reference Design of USB_BOOT ............................................................................................. 36 Figure 19: Timing of Entering Emergency Download Mode ....................................................................... 36 Figure 20: Reference Design of USIM Interface with an 8-pin USIM Card Connector ............................... 37 Figure 21: Reference Design of USIM Interface with a 6-pin USIM Card Connector ................................. 38 Figure 22: Reference Design of UART with Level-shifting Chip ................................................................. 40 Figure 23: Reference Design of UART with Transistor Level-shifting Circuit ............................................. 40 Figure 24: Reference Design of PCM and I2C Interfaces .......................................................................... 41 Figure 25: Reference Design of SPI with a Level-Shifting Chip ................................................................. 43 Figure 26: Reference Design of NET_STATUS Indication ......................................................................... 46 Figure 27: Reference Design of STATUS .................................................................................................. 47 Figure 28: Reference Design of Main Antenna ........................................................................................... 50 Figure 29: Microstrip Design on a 2-layer PCB .......................................................................................... 51 Figure 30: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 51 Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ..................... 51 Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ..................... 52 Figure 33: Dimensions of the Receptacle (Unit: mm) ................................................................................. 53 Figure 34: Specifications of Mated Plugs ................................................................................................... 54 Figure 35: Space Factor of Mated Connectors (Unit: mm) ......................................................................... 54 Figure 36: Top and Side Dimensions (Unit: mm) ........................................................................................ 59 Figure 37: Bottom Dimensions (Bottom View, Unit: mm) ............................................................................ 60 Figure 38: Recommended Footprint (Unit: mm) ......................................................................................... 61 Figure 39: Top and Bottom Views of the Module ........................................................................................ 62 Figure 40: Recommended Reflow Soldering Thermal Profile..................................................................... 64 Figure 41: Carrier Tape Dimension Drawing ............................................................................................... 66 EG915Q-NA_Hardware_Design 9 / 72 Figure 42: Plastic Reel Dimension Drawing ................................................................................................67 Figure 43: Mounting Direction ......................................................................................................................67 Figure 44: Packaging Process .....................................................................................................................68 LTE Standard Module Series EG915Q-NA_Hardware_Design 10 / 72 LTE Standard Module Series 1 Introduction This document describes the EG915Q-NA features, performance, and air interfaces and hardware interfaces connected to your applications. The document provides a quick insight into interface specifications, RF performance, electrical and mechanical specifications, and other module information, as well. 1.1. Special Marks Table 1: Special Marks Marks Definitions

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. EG915Q-NA_Hardware_Design 11 / 72 LTE Standard Module Series 2 Product Overview EG915Q-NA is an SMD module with compact packaging, which is engineered to meet most of the demands of M2M and IoT applications, such as asset management, commercial telematics, payment, RMAC (Remote Monitoring and Control applications), security and automation, smart metering and smart grid. Table 2: Basic Information EG915Q-NA Packaging type Pin counts Dimensions Weight 2.1. Frequency Bands Table 3: Frequency Bands Network Type LTE-FDD LGA 126

(23.6 0.2) mm (19.9 0.2) mm (2.4 0.2) mm Approx. 2.3 g EG915Q-NA B2/B4/B5/B12/B13/B14/B66/B71 EG915Q-NA_Hardware_Design 12 / 72 LTE Standard Module Series 2.2. Key Features Table 4: Key Features Categories Supply Voltage Descriptions 3.34.3 V SMS Typ.: 3.8 V Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default USIM Interface 1.8 V and 3.0 V PCM Interface*

I2C Interface*

SPI Interface*

Camera SPI Interface*

USB Interface UART Interfaces Network Indication Supports one digital audio interface: PCM interface Used for audio function with external Codec One I2C interface Comply with I2C-bus specification One SPI 1.8 V voltage domain Clock rate: up to 25.6 MHz Supports one camera SPI Interface Supports the 2-data-line transmission of SPI Compliant with USB 2.0 specifications (only supports slave mode) Data rate up to 480 Mbps Used for AT command communication, data transmission, software debugging, firmware upgrade and the output of partial logs USB serial driver: supports USB serial driver for Windows 7/8/8.1/10/11, Linux 2.65.18*, Android 4.x12.x* systems Main UART:

Used for AT command communication and data transmission Baud rate: 115200 bps by default RTS and CTS hardware flow control Debug UART:

Used for the output of partial logs Baud rate: up to 3 Mbps, 115200 bps by default NET_STATUS:

Use: network connectivity status indication Complies with the AT commands defined in 3GPP TS 27.007 and AT Commands 3GPP TS 27.005 Complies with Quectel enhanced AT commands Antenna Interface Main antenna interface (ANT_MAIN) 50 characteristic impedance EG915Q-NA_Hardware_Design 13 / 72 LTE Standard Module Series Transmitting Power LTE-FDD: Class 3 (23 dBm 2 dB) LTE Features Complies with 3GPP Rel-14 FDD Max. LTE category: Cat 1 bis 1.4/3/5/10/15/20 MHz RF bandwidth DL modulations: QPSK, 16QAM and 64QAM UL modulations: QPSK, 16QAM LTE-FDD max. data rates:

DL: 10 Mbps UL: 5 Mbps Internet Protocol Features Temperature Ranges Complies with TCP, UDP, PPP, NTP, NITZ, FTP, HTTP, PING, CMUX*, HTTPS, FTPS, SSL, FILE, MQTT protocols Complies with PPP protocols PAP and CHAP authentication Normal operating temperature 1: -35 C to +75 C Extended operating temperature 2: -40 C to +85 C Storage temperature: -40 C to +90 C Firmware Upgrade Via USB 2.0 interface or DFOTA RoHS All hardware components fully comply with EU RoHS directive 1 Within the operating temperature range, the module meets 3GPP specifications. 2 Within the extended temperature range, the module remains the ability to establish and maintain functions such as SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG915Q-NA_Hardware_Design 14 / 72 LTE Standard Module Series 2.3. Functional Diagram The functional diagram illustrates the following major functional parts:

Power management Baseband part Radio frequency part Peripheral interfaces VBAT_RF VBAT_BB PWRKEY RESET_N ANT_MAIN Switch Duplex PA Tx PRx 26 MHz VIO PMIC RF Transceiver and Subsystem Baseband RAM Flash VDD_EXT USIM GRFCs Figure 1: Functional Diagram USB UARTs ADC I2C PCM SPI Camera SPI EG915Q-NA_Hardware_Design 15 / 72 2.4. Pin Assignment LTE Standard Module Series 2 6 D N G 1 6 D N G 0 6 I N A M _ T N A 9 5 D N G 8 5 D N G 7 5 D E V R E S E R 6 5 D E V R E S E R D N G 5 5 D N G 4 5 3 5 F R _ T A B V 2 5 F R _ T A B V 1 5 D E V R E S E R 0 5 D N G 103 RESERVED 114 RESER VED 82 GND 81 GND 80 GND 79 GND 113 RESER VED 112 RESER VED 104 RESERVED 115 CAM_PWDN 102 GND 101 GND 100 GND 99 RESER VED 118 RESER VED 111 RESER VED 63 RESERVED 83 RESER VED 98 78 CAM_SPI_DATA1 CAM_SPI_CLK 64 RESER VED 84 RESERVED 119 RESER VED 126 RESER VED 97 CAM_SPI_DATA0 77 GRFC2 65 RESER VED 85 RESERVED 120 RESER VED 125 RESER VED 96 PSM_INT 76 GRFC1 66 RESER VED 86 RESER VED 121 RESER VED 124 RESER VED 95 CAM_MCLK 75 USB_BOOT 67 GND 68 GND 87 RESER VED 88 RESER VED 122 RESER VED 123 RESER VED 94 CAM_VDD 93 CAM_VDDI O 74 GND 73 GND 105 RESER VED 116 RESER VED 106 RESER VED 107 RESER VED 89 GND 69 GND 90 GND 70 GND 91 GND 71 GND 92 RESER VED 117 RESER VED 110 RESER VED 72 GND 108 RESER VED 109 RESER VED 49 RESER VED 48 GND 47 GND 46 USIM_CLK 45 USIM_DATA 44 USIM_RST 43 USIM_VDD 42 USIM_DET 41 I2C_SDA 40 I2C_SCL 39 MAIN_RI 38 MAIN_DCD 37 MAIN_RTS 36 MAIN_CTS 35 MAIN_TXD 34 MAIN_RXD 33 VBAT_BB 32 VBAT_BB 1 PSM_IND 2 ADC1 3 GND 4 PCM_CL K 5 PCM_SYNC 6 PCM_DIN 7 PCM_DOUT 8 USB_VBUS 9 USB_DP 10 USB_DM 11 RESER VED 12 RESER VED 13 RESER VED 14 RESER VED 15 PWRKEY 16 R ESER VED 17 RESET_N 18 W_DISABLE#

Y D A E R _ P A 9 1 0 2 S U T A T S 1 2 S U T A T S _ T E N 2 2 D X R _ G B D 3 2 D X T _ G B D 4 2 0 C D A 5 2

S C _ P S I 6 2 K L C _ P S I 7 2 I S O M _ P S I 8 2 I O S M _ P S I 9 2 T X E _ D D V 0 3 R T D _ N A M I 1 3 D N G GND Pins USB Pins Signal Pins Power Pins I2C Pins

(U)SIM Pins ADC Pins PCM Pins RESERVED Pins UART Pins Figure 2: Pins Assignment (Top View) NOTE 1. 2. If the module does not need to enter emergency download mode, USB_BOOT (pin 75) should not be pulled up to VDD_EXT before the module successfully starts up. In sleep mode, some pins of the main UART interface (pins 3437), debug UART interface (pins 22, 23), USB_BOOT (pin 75), PCM interface* (pins 47), I2C interface* (pins 40, 41), and SPI interface*

(pins 25-28) are powered down. The driving capacity will be lost and the functions of status indication and data transmission are disabled. Pay attention to it when designing circuits. 3. Keep all RESERVED pins and unused pins unconnected. EG915Q-NA_Hardware_Design 16 / 72 LTE Standard Module Series 2.5. Pin Description The following table shows the pin descriptions. DC characteristics include power domain, rate current, etc. Table 5: Parameter Definition Parameters AI AIO DI DO DIO PI PO Descriptions Analog Input Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input Power Output Table 6: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristic Comment VBAT_BB 32, 33 PI VBAT_RF 52, 53 PI Power supply for the modules BB part Power supply for the modules RF part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V VDD_EXT 29 PO Provides 1.8 V for external circuit Vnom = 1.8 V I max = 50 mA O It must be provided with sufficient current of 0.5 A at least. It must be provided with sufficient current up to 1.5 A. Power supply for external GPIOs pull-up circuits. It is recommended to reserve test points. GND 3, 31, 47, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 Turn On/Off EG915Q-NA_Hardware_Design 17 / 72 Pin Name Pin No. I/O Description PWRKEY 15 DI Turns on/off the module RESET_N 17 DI Resets the module Indication Signals Pin Name Pin No. I/O Description STATUS 20 DO NET_STATUS 21 DO Indicates the module's operation status Indicates the module's network activity status USB Interface Pin Name Pin No. I/O Description USB_VBUS 8 AI USB connection detect USB_DP 9 AIO USB differential data (+) USB_DM 10 AIO USB differential data (-) USIM Interface Pin Name Pin No. I/O Description USIM_VDD 43 PO USIM card power supply USIM_DATA USIM_CLK 45 46 DIO USIM card data DO USIM card clock LTE Standard Module Series DC Characteristic Comment Active low. VILmax = 0.5 V Active low. Test points are recommended to be reserved if unused. DC Characteristic Comment VDD_EXT If unused, keep them open. Comment Test points must be reserved. USB 2.0 compliant. Requires differential impedance of 90 . Test points must be reserved. Comment Either 1.8 V or 3.0 V USIM card is supported and can be identified automatically by the module. DC Characteristic Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V DC Characteristic IOmax = 50 mA Low-voltage:

Vmax = 1.85 V Vmin = 1.75 V High-voltage:

Vmax = 3.05 V Vmin = 2.95 V USIM_VDD EG915Q-NA_Hardware_Design 18 / 72 LTE Standard Module Series USIM_RST USIM_DET 44 42 Main UART DO USIM card reset DI USIM card hot-plug detect Pin Name Pin No. I/O Description VDD_EXT If unused, keep it open. DC Characteristic Comment MAIN_CTS 36 DO DTE clear to send signal from DCE MAIN_RTS 37 DI DTE request to send signal to DCE MAIN_RXD MAIN_DCD MAIN_TXD MAIN_RI 34 38 35 39 DI Main UART receive VDD_EXT DO Main UART data carrier detect DO Main UART transmit DO Main UART ring indication MAIN_DTR 30 DI Main UART data terminal ready Debug UART Connect to DTEs CTS. If unused, keep it open. Connect to DTEs RTS. If unused, keep it open. If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristic Comment DBG_RXD DBG_TXD 22 23 I2C Interface*

DI Debug UART receive DO Debug UART transmit VDD_EXT Test points must be reserved. Pin Name Pin No. I/O Description DC Characteristic Comment I2C_SCL I2C_SDA 40 41 PCM Interface*

DO I2C serial clock DIO I2C serial data VDD_EXT External pull-up resistor is required. If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristic Comment EG915Q-NA_Hardware_Design 19 / 72 LTE Standard Module Series VDD_EXT If unused, keep them open. PCM_SYNC PCM_CLK PCM_DIN PCM_DOUT 5 4 6 7 RF Antenna Interface DO PCM data frame sync DO PCM clock DI PCM data input DO PCM data output Pin Name Pin No. I/O Description DC Characteristic Comment ANT_MAIN 3 60 AIO Main antenna interface 50 impedance. GRFC Interfaces*

Pin Name Pin No. I/O Description DC Characteristic Comment GRFC1 GRFC2 76 77 Camera SPI Interface*

DO Generic RF controller DO Generic RF controller VDD_EXT If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristic Comment CAM_MCLK 95 DO Master clock of the camera Camera SPI clock Camera SPI data bit 0 VDD_EXT DI DI If unused, keep them open. DI Camera SPI data bit 1 DO PO PO Power down of the camera Camera analog power supply Camera digital power supply Vnom = 2.8 V VDD_EXT CAM_SPI_CLK 78 CAM_SPI_ DATA0 CAM_SPI_ DATA1 97 98 CAM_PWDN 115 CAM_VDD 94 CAM_VDDIO 93 SPI Interface*

Pin Name Pin No. I/O Description DC Characteristic Comment SPI_CLK 26 DO SPI clock VDD_EXT If unused, keep them 3 ANT_MAIN only supports passive antennas. EG915Q-NA_Hardware_Design 20 / 72 SPI_CS SPI_MISO SPI_MOSI 25 28 27 ADC Interfaces DO SPI chip selection DI SPI master-in slave-out DO SPI master-out slave-in Pin Name Pin No. I/O Description ADC0 ADC1 24 2 AI AI General-purpose ADC interface General-purpose ADC interface Other Interfaces LTE Standard Module Series open. DC Characteristic Comment Voltage range:

If unused, keep them 01.2 V open. Pin Name Pin No. I/O Description DC Characteristic Comment USB_BOOT 75 DI emergency download Forces the module into mode W_DISABLE#* 18 DI Airplane mode control PSM_IND*

1 DO Indicates the modules power saving mode External interrupt; wakes VDD_EXT DI DI up the module from power saving mode Application processor ready PSM_INT*

96 AP_READY*

19 RESERVED Pins Pin Name Pin No. Active high before power-up. Test points must be reserved. If unused, keep them open. I/O RESERVED 1114, 16, 49, 51, 56, 57, 6366, 8388, 92, 99, 103114, 116126 Keep these pins open. 2.6. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (UMTS&LTE EVB) with accessories to control or test the module. For more details, see document [1]. EG915Q-NA_Hardware_Design 21 / 72 LTE Standard Module Series 3 Operating Characteristics 3.1. Operating Modes Table 7: Operating Modes Overview Modes Descriptions Full Functionality Mode Idle Data Software is active. The module is registered on the network but has no data interaction with the network. Network connection is ongoing. Power consumption is decided by network setting and data rate. Minimum Functionality Mode AT+CFUN=0 can set the module to the minimum functionality mode when the power is on. Both RF function and USIM card will be invalid. AT+CFUN=4 or driving W_DISABLE#* low can set the module to airplane Airplane Mode mode. RF function will be invalid. Sleep Mode Power consumption of the module will be reduced to a minimal level. The module can still receive paging, SMS and TCP/UDP data from the network. Power Down Mode The VBAT_BB and VBAT_RF pins are constantly turned on and the software stops working. NOTE For more details about AT+CFUN, see document [2]. EG915Q-NA_Hardware_Design 22 / 72 LTE Standard Module Series 3.2. Sleep Mode With DRX technology, power consumption of the module will be reduced to a minimal level. t n e r r u C DRX OFF ON OFF ON OFF ON OFF ON OFF Run Time Figure 3: Power Consumption During Sleep Mode 3.2.1. UART Application Scenario If the module communicates with the host via main UART, both the following preconditions should be met to set the module to sleep mode:

Execute AT+QSCLK=1. For more details, see document [2]. Ensure MAIN_DTR is held high or is kept unconnected. Module Host MAIN_RXD MAIN_TXD MAIN_RI MAIN_DTR AP_READY GND TXD RXD EINT GPIO GPIO GND Figure 4: Sleep Mode Application via UART Driving MAIN_DTR low with the host will wake up the module. When the module has a URC to report, MAIN_RI signal will wake up the host. See Chapter 4.11.3 for details about MAIN_RI. EG915Q-NA_Hardware_Design 23 / 72 LTE Standard Module Series 3.2.2. USB Application Scenarios*

For the two situations (USB application with USB remote wakeup function and USB application with USB suspend/resume and MAIN_RI function) below, three preconditions must be met to set the module to sleep mode:

Execute AT+QSCLK=1. Ensure MAIN_DTR is held high or is kept unconnected. Ensure the hosts USB bus, which is connected to the modules USB interface, enters suspend state. 3.2.2.1. USB Application with USB Suspend/Resume and Remote Wakeup Function The following figure illustrates the connection between the module and the host when the host supports USB suspend, resume and remote wakeup function. Module USB_VBUS USB_DP USB_DM AP_READY GND Host VDD USB_DP USB_DM GPIO GND Figure 5:Sleep Mode Application with USB Suspend/Resume and Remote Wakeup Sending data to the module through USB will wake up the module. When the module has a URC to report, the module will send remote wake-up signals through USB bus to wake up the host. 3.2.2.2. USB Application with USB Suspend/Resume and MAIN_RI Function If the host supports USB suspend/resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. EG915Q-NA_Hardware_Design 24 / 72 LTE Standard Module Series Module USB_VBUS USB_DP USB_DM AP_READY MAIN_RI GND Host VDD USB_DP USB_DM GPIO EINT GND Figure 6: Sleep Mode Application with USB Suspend/Resume and MAIN_RI Sending data to the module through USB will wake up the module. When the module has a URC to report, the module will wake up the host through MAIN_RI signal. See Chapter 4.11.3 for details about MAIN_RI behavior. 3.2.2.3. USB Application without USB Suspend Function If the host does not support USB suspend function, the following three preconditions must be met to set the module to sleep mode:

Execute AT+QSCLK=1. Ensure MAIN_DTR is held high or is kept unconnected. Ensure USB_VBUS is disconnected via the external control circuit. Module Host External Control Circuit USB_VBUS USB_DP USB_DM MAIN_RI AP_READY GND GPIO VDD USB_DP USB_DM EINT GPIO GND Figure 7: Sleep Mode Application without USB Suspend Restore the power supply of USB_VBUS will wake up the module. EG915Q-NA_Hardware_Design 25 / 72 LTE Standard Module Series NOTE Pay attention to the level match shown in the dotted line between the module and the host. 3.3. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following methods. Hardware:

W_DISABLE#* is pulled up by default. Driving it low makes the module enter airplane mode. Software:

AT+CFUN=<fun> provides choice of the functionality level via setting <fun> to 0, 1 or 4. For more details, see document [2]. AT+CFUN=0: Minimum functionality mode. (Both USIM and RF functions are disabled.) AT+CFUN=1: Full functionality mode. (By default.) AT+CFUN=4: Airplane mode. (RF function is disabled.) 3.4. Power Supply 3.4.1. Power Supply Pins The module provides four VBAT pins dedicate to connecting with the external power supply:

Table 8: Pin Description of Power Supply Interface Pin Name Pin No. I/O Description Min. Typ. Max. Units VBAT_BB 32, 33 PI Power supply for the modules BB part 3.3 3.8 4.3 VBAT_RF 52, 53 PI Power supply for the modules RF part 3.3 3.8 4.3 VDD_EXT 29 PO Provide 1.8 V for external circuit

1.8

GND 3, 31, 47, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 V V V EG915Q-NA_Hardware_Design 26 / 72 LTE Standard Module Series 3.4.2. Reference Design for Power Supply Power design for the module is essential. The power supply of the module should be able to provide sufficient current of 2 A at least. If the voltage difference between input voltage and the supply voltage is small, it is suggested to use an LDO; if the voltage difference is big, a buck converter is recommended. The following figure shows a reference design for +5 V input power supply. The circuit is designed using the LDO of Microchips MIC29302WU. MIC29302WU 2 IN N E 1 OUT 4 D N G J D A 3 5 DC_IN 51K 4.7K 470 F 100 nF VBAT_EN 47K 100K 1%

47K 1%

VBAT 330R 470 F 100 nF Figure 8: Reference Design of Power Input NOTE To avoid corrupting the data in the internal flash, do not switch off the power supply when the module works normally. Only after turning off the module with PWRKEY or AT command can you cut off the power supply. 3.4.3. Voltage Stability Requirements The power supply range of the module is 3.34.3 V. Ensure the input voltage never drops below 3.3 V. To decrease the voltage drop, use a bypass capacitor of about 100 F with low ESR for VBAT_BB and VBAT_RF respectively and reserve a multi-layer ceramic chip (MLCC) capacitor array with ultra-low ESR. Use three ceramic capacitors (100 nF, 33 pF and 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT pins. The main power supply from an external application should be a single voltage source and can be expanded to two sub paths with the star configuration. The width of VBAT_BB trace and VBAT_RF trace should be at least 1 mm and 2 mm respectively. In principle, the longer the VBAT trace is, the wider it should be. To avoid the ripple and surge and to ensure the stability of the power supply to the module, it is EG915Q-NA_Hardware_Design 27 / 72 LTE Standard Module Series recommended to add a TVS with VRWM = 4.7 V, low clamping voltage and high reverse peak pulse current Ipp at the front end of the power supply. VBAT

D1 C1 C2 C3 C4 C5 C6 C7 C8

TVS 100 F 100 nF 33 pF 10 pF 100 F 100 nF 33 pF 10 pF Figure 9: Reference Design of Power Supply VBAT_RF VBAT_BB Module 3.5. Turn On 3.5.1. Turn On with PWRKEY Table 9: Pin Description of PWRKEY Pin Name Pin No. PWRKEY 15 I/O DI Description Comment Turn on/off the module Active low. When the module is in power-down mode, it can be turned on by driving the PWRKEY low for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. EG915Q-NA_Hardware_Design 28 / 72 LTE Standard Module Series 500 ms Turn on pulse 4.7K 47K Q1 GPIO MCU PWRKEY Module Figure 10: Reference Design of Turn On with Driving Circuit Another way to control the PWRKEY is using a keystroke directly. When pressing the keystroke, an electrostatic strike may be generated from finger. Therefore, you should place a TVS component near the keystroke for ESD protection. S1 R1 1K PWRKEY TVS 500ms Close to S1 Module Figure 11: Reference Design of Turn On with Keystroke The power-up timing is illustrated in the following figure. EG915Q-NA_Hardware_Design 29 / 72 LTE Standard Module Series NOTE 1 10 ms VBAT V 0.1 V 500 ms PWRKEY VDD_EXT USB_BOOT RESET_N STATUS UART USB VIL 0.5 V About 40 ms Connect USB_BOOT to VDD_EXT before the module is turned o n , and then the module will enter the emergency download mode when it is turned on. 2 s 10 s Inactive 10 s Inactive Active Active Figure 12: Power-up Timing with PWRKEY

. NOTE 1. Ensure the voltage of VBAT is stable for at least 30 ms before driving the PWRKEY low. 2. If the module needs to turn on automatically but does not need the turn-off function, PWRKEY can be driven low directly to ground with a recommended 4.7 k resistor. 3.6. Turn Off The following procedures can be used to turn off the module normally. 3.6.1. Turn Off with PWRKEY Drive the PWRKEY low for at least 650 ms and then release it. Then, the module will execute the turn-off procedure. EG915Q-NA_Hardware_Design 30 / 72 LTE Standard Module Series VBAT PWRKEY STATUS Module Status 650 ms 2 s Running Power-down procedure Off Figure 13: Power-down Timing with PWRKEY 3.6.2. Turn Off with AT Command For proper shutdown procedure, execute AT+QPOWD, which has similar timing and effect as turning off the module through driving PWRKEY low. See document [2] for details about AT+QPOWD. NOTE 1. To avoid corrupting the data in the internal flash, do not switch off the power supply when the module works normally. Only after turning off the module with PWRKEY or AT command can you cut off the power supply. 2. When turning off the module with the AT command, keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on automatically again after successful turn-off. 3.7. Reset The reset function requires the PWRKEY and RESET_N pins to work together to complete. Pulling down PWRKEY when RESET_N is at low level can reset the module. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. EG915Q-NA_Hardware_Design 31 / 72 LTE Standard Module Series Table 10: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 17 DI Reset the module Active low. Test points are recommended to be reserved if unused. The recommended circuit for reset function is similar to the PWRKEY control circuit. You can use an open drain/collector driver or a button to control RESET_N and PWRKEY pins. 300 ms Reset pulse GPIO 4.7K 47K Q1 RESET_N MCU Module Figure 14: Reference Design of Reset with Driving Circuit 500 ms Turn on pulse 4.7K 47K Q1 GPIO MCU PWRKEY Module Figure 15: Reference Design of PWRKEY with Driving Circuit EG915Q-NA_Hardware_Design 32 / 72 LTE Standard Module Series VBAT PWRKEY RESET_N Module Status 500 ms VIL 0.5 V 300 ms VIL 0.5 V Running Resetting Restart Figure 16: Reset Timing NOTE In reset timing, pull down PWRKEY when RESET_N is at low level. 1. 2. Ensure the capacitance on PWRKEY and RESET_N is not more than 10 nF. EG915Q-NA_Hardware_Design 33 / 72 LTE Standard Module Series 4 Application Interfaces 4.1. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specifications and supports high-speed (480 Mbps) and full-speed (12 Mbps) for USB 2.0. The module only supports USB slave mode. The USB interface can be used for AT command communication, data transmission, software debugging, firmware upgrade and the output of partial logs. Table 11: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS 8 AI USB connection detect Test points must be reserved. USB_DP 9 AIO USB differential data (+) USB 2.0 compliant. USB_DM 10 AIO USB differential data (-) Requires differential impedance of 90 . Test points must be reserved. Test points of USB 2.0 interface must be reserved, which can be used for firmware upgrading and debugging. Minimize these stubs Test Points Module VDD USB_VBUS USB_DM USB_DP GND NM_0 R NM_0 R R1 R2 L1 TVS Array Close to module MCU USB_DM USB_DP GND Figure 17: Reference Design of USB 2.0 Interface EG915Q-NA_Hardware_Design 34 / 72 LTE Standard Module Series It is recommended to add a common-mode choke L1 in series between MCU and the module to suppress EMI spurious transmission. Meanwhile, it is also suggested to add R1 and R2 in series between the module and test points for debugging. These resistors are not mounted by default. To ensure the signal integrity of USB 2.0 data transmission, you should place L1, R1 and R2 close to the module, and keep these resistors close to each other. Moreover, keep extra stubs of trace as short as possible. To ensure performance, you should follow the following principles when designing USB interface:

Route USB signal traces as differential pairs with surrounded ground. The impedance of USB 2.0 differential trace is 90 . Route USB differential traces at the inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. For signal traces, provide clearance from VBAT traces, crystal-oscillators, magnetic devices, sensitive signals like RF signals, analog signals, and noise signals generated by clock, DC-DC, etc. Pay attention to the impact caused by stray capacitance of the ESD protection component on USB data lines. Typically, the stray capacitance should be less than 2 pF for USB 2.0. Keep the ESD protection components as close to the USB port as possible. For more details about the USB specifications, visit http://www.usb.org/home. 4.2. USB_BOOT The module provides a USB_BOOT pin for emergency download. Pulling up USB_BOOT to VDD_EXT before turning on the module, and then the module will enter emergency download mode. In this mode, the module supports firmware upgrade over USB 2.0 interface. Table 12: Pin Description of USB_BOOT Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Forces the module into emergency download mode Active high before power-up. Test points must be reserved. EG915Q-NA_Hardware_Design 35 / 72 LTE Standard Module Series Module USB_BOOT Test points 2 1 4.7K VDD_EXT 3 GND TVS TVS should be placed close to test points. Figure 18: Reference Design of USB_BOOT NOTE 1 VBAT 500 ms VIL 0.5 V About 40ms USB_BOOT can be pulled up to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is turned on. PWRKEY VDD_EXT USB_BOOT RESET_N Figure 19: Timing of Entering Emergency Download Mode NOTE 1. Ensure VBAT is stable before driving PWRKEY low. 2. Follow the above timing when using MCU control the module to enter the emergency download mode. If you need to manually force the module to enter emergency download mode, directly connect the 3. test points shown in Figure 18. EG915Q-NA_Hardware_Design 36 / 72 LTE Standard Module Series 4.3. USIM Interface The USIM interface meets ETSI and IMT-2000 requirements. Either 1.8 V or 3.0 V USIM card is supported. Table 13: Pin Description of USIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD 43 PO USIM card power supply USIM_DATA 45 DIO USIM card data USIM_CLK 46 DO USIM card clock USIM_RST 44 DO USIM card reset Either 1.8 V or 3.0 V USIM card is supported and can be identified automatically by the module. USIM_DET 42 DI USIM card hot-plug detect If unused, keep it open. The module supports USIM card hot-plug via the USIM_DET, and both high-level and low-level detections are supported. Hot-plug function is disabled by default and you can use AT+QSIMDET to configure this function. See document [2] for more details. The following figure illustrates a reference design for USIM card interface with an 8-pin USIM card connector. VDD_EXT USIM_VDD 51K 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 0 R 0 R 0 R 100 nF USIM Card Connector VCC RST CLK GND VPP IO Switch 33 pF 33 pF 33 pF GND TVS Array GND GND Figure 20: Reference Design of USIM Interface with an 8-pin USIM Card Connector EG915Q-NA_Hardware_Design 37 / 72 If the function of USIM card hot-plug is not needed, keep USIM_DET disconnected. A reference design for USIM interface with a 6-pin USIM card connector is illustrated in the following figure. LTE Standard Module Series USIM_VDD GND USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 0 R 0 R 0 R Module 100 nF USIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF TVS Array GND GND Figure 21: Reference Design of USIM Interface with a 6-pin USIM Card Connector To enhance the reliability and availability of the USIM card in applications, follow the principles below in the USIM circuit design:

Place the USIM card connector close to the module. Keep the trace length as short as possible and at most 200 mm. Route USIM card differential traces at the inner-layer of the PCB, and surround the traces with ground on that layer and ground planes above and below. For signal traces, provide clearance from VBAT traces, crystal-oscillators, magnetic devices, sensitive signals like RF signals, analog signals, and noise signals generated by clock, DC-DC, etc. Ensure the tracing between the USIM card connector and the module is short and wide. Keep the trace width of ground and USIM_VDD at least 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep the traces away from each other and shield them with surrounded ground. To offer good ESD protection, it is recommended to add a TVS array of which parasitic capacitance should be less than 15 pF. Add 0 resistors in series between the module and the USIM card connector to facilitate debugging. The 33 pF capacitors are used for filtering out RF interference. Additionally, keep the USIM peripheral circuit close to the USIM card connector. The pull-up resistor on USIM_DATA trace can improve anti-jamming capability when long layout trace and sensitive occasions are applied, and should be placed close to the USIM card connector. EG915Q-NA_Hardware_Design 38 / 74 LTE Standard Module Series 4.4. UART Interfaces The module serves as DCE (Data Communication Equipment), which is connected in the traditional DCE-DTE (Data Terminal Equipment) mode. The module provides two UART Interfaces. Table 14: UART Information (Unit: bps) UART Types Supported Baud Rates Default Baud Rates Functions Main UART 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600 115200 AT command communication and data transmission Debug UART 115200, 3000000 115200 The output of partial logs Table 15: Pin Description of UART Pin Name Pin No. I/O Description Comment MAIN_CTS 36 DO MAIN_RTS MAIN_RXD MAIN_DCD MAIN_TXD MAIN_RI MAIN_DTR DBG_RXD DBG_TXD 37 34 38 35 39 30 22 23 DTE clear to send signal from DCE Connect to DTEs CTS. If unused, keep it open. DTE request to send signal to DCE Connect to DTEs RTS. If unused, keep it open. Main UART receive DI DI DO Main UART data carrier detect DO Main UART transmit DO Main UART ring indication DI DI Main UART data terminal ready Debug UART receive DO Debug UART transmit If unused, keep them open. Test points must be reserved. The module provides 1.8 V UART interfaces. You can use a level-shifting chip between the module and hosts UART if the host is equipped with a 3.3 V UART. EG915Q-NA_Hardware_Design 39 / 74 LTE Standard Module Series VDD_EXT 0.1 F 1 0 K 120K MAIN_RI MAIN_DCD MAIN_CTS MAIN_RTS MAIN_DTR MAIN_TXD MAIN_RXD 51K VCCA VCCB 0.1 F VDD_MCU OE A1 A2 A3 A4 A5 A6 A7 A8 GND Level-shifting Chip B1 B2 B3 B4 B5 B6 B7 B8 51K RI_MCU DCD_MCU CTS_MCU RTS_MCU DTR_MCU RXD_MCU TXD_MCU Figure 22: Reference Design of UART with Level-shifting Chip Another example of level-shifting circuit is shown as below. For the design of circuits in dotted lines, see that shown in solid lines, but pay attention to the direction of the connection. MCU/ARM VDD_EXT 4.7K 1 nF VDD_EXT 10K 10K 1 nF VCC_MCU 4.7K VDD_EXT TXD RXD RTS CTS GPIO EINT GPIO GND Module MAIN_RXD MAIN_TXD MAIN_RTS MAIN_CTS MAIN_DTR MAIN_RI MAIN_DCD GND Figure 23: Reference Design of UART with Transistor Level-shifting Circuit NOTE 1. Transistor circuit solution above is not suitable for applications with baud rates exceeding 460 kbps. 2. Note that the modules CTS is connected to the host CTS, and the modules RTS is connected to the host RTS. EG915Q-NA_Hardware_Design 40 / 74 LTE Standard Module Series 4.5. PCM and I2C Interfaces*

The module provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. Table 16: Pin Description of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_SYNC 5 DO PCM data frame sync PCM_CLK PCM_DIN 4 6 DO PCM clock DI PCM data input PCM_DOUT 7 DO PCM data output If unused, keep them open. I2C_SCL I2C_SDA 40 41 DO I2C serial clock DIO I2C serial data External pull-up resistor is required. If unused, keep them open. The reference design is illustrated as follows. PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN I2C_SCL I2C_SDA S A B I MICBIAS INP INN LOUTP LOUTN BCLK LRCK DAC ADC SCL SDA Module K 7 4

. K 7 4

. 1.8 V Codec Figure 24: Reference Design of PCM and I2C Interfaces EG915Q-NA_Hardware_Design 41 / 74 LTE Standard Module Series 4.6. ADC Interfaces The module provides two Analog-to-Digital Converter (ADC) interfaces. To improve the accuracy of ADC, surround the trace of ADC with ground. Table 17: Pin Description of ADC Interfaces Pin Name Pin No. I/O Description Comment ADC0 ADC1 24 2 AI AI General-purpose ADC interface General-purpose ADC interface If unused, keep them open. With AT+QADC=<port>, you can:

AT+QADC=0: read the voltage value on ADC0 AT+QADC=1: read the voltage value on ADC1 For more details about the AT command, see document [2]. Table 18: Characteristics of ADC Interfaces Parameters ADC0 voltage range ADC input resistance ADC resolution NOTE Min. 0 0.26

Typ.

12 Max. 1.2 0.75

Units V M bits 1. The input voltage of every ADC interface should not exceed 1.2 V. 2. It is prohibited to directly supply any voltage to ADC Interfaces when the module is not powered by the VBAT. It is recommended to use resistor divider circuit for ADC interface application. Resistance of the external resistor divider should not exceed 100 k, or the measurement accuracy of ADC would be significantly reduced. 3. EG915Q-NA_Hardware_Design 42 / 74 LTE Standard Module Series 4.7. SPI Interface*

The module provides one SPI interface with a maximum clock frequency up to 25.6 MHz. Table 19: Pin Description of SPI Interface Pin Name Pin No. SPI_CLK SPI_CS SPI_MISO SPI_MOSI 26 25 28 27 I/O DO DO DI Description Comment SPI clock SPI chip selection SPI master-in slave-out If unused, keep them open. DO SPI master-out slave-in The voltage domain of the modules SPI is 1.8 V. Use a level-shifting chip between the module and the host if the voltage domain of the external host system is 3.3 V. A level-shifting chip that supports SPI data rate is recommended. The following figure shows a reference design:

VDD_EXT VCCA 0.1 F SPI_CS SPI_CLK SPI_MOSI SPI_MISO OE A1 A2 A3 A4 NC VCCB GND 0.1 F VDD_MCU Level-shifting Chip B1 B2 B3 B4 NC SPI_CS_N_MCU SPI_CLK_MCU SPI_MOSI_MCU SPI_MISO_MCU Figure 25: Reference Design of SPI with a Level-Shifting Chip 4.8. Camera SPI Interface*

The module provides one camera SPI interface supporting 2-bit data transmission of SPI. EG915Q-NA_Hardware_Design 43 / 74 LTE Standard Module Series Table 20: Pin Description of Camera SPI Interface Pin Name Pin No. CAM_MCLK CAM_SPI_CLK 95 78 CAM_SPI_DATA0 97 CAM_SPI_DATA1 98 I/O DO DI DI DI Description Comment Master clock of the camera Camera SPI clock Camera SPI data bit 0 Camera SPI data bit 1 If unused, keep them open. CAM_PWDN 115 DO Power down of the camera CAM_VDD CAM_VDDIO 94 93 PO PO Camera analog power supply Camera digital power supply 4.9. GRFC Interfaces*

The module provides two GRFC (generic RF control) interfaces for the control of external antenna tuners. Table 21: Pin Description of GRFC Interfaces Pin Name Pin No. GRFC1 GRFC2 76 77 I/O DO DO Description Comment Generic RF controller Generic RF controller If unused, keep them open. 4.10. Control Signals Table 22: Pin Description of Control Signals Pin Name Pin No. I/O Description W_DISABLE#* 18 DI Airplane mode control PSM_IND*

1 DO Indicate the modules power saving mode Comment If unused, keep them open. EG915Q-NA_Hardware_Design 44 / 74 LTE Standard Module Series PSM_INT*

96 DI External interrupt; wake up the module from power saving mode AP_READY*

19 DI Application processor ready 4.10.1. W_DISABLE#*

The module provides W_DISABLE# to enable or disable RF function. When the voltage level of W_DISABLE# is high, you can send AT+CFUN=<fun> to set the modules operating mode. Driving W_DISABLE# low will set the module to airplane mode. Table 23: W_DISABLE# AT Command Configuration Information Level Status AT Command RF Function Operating Mode AT+CFUN=1 Enabled Full functionality mode High level AT+CFUN=0 AT+CFUN=4 AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Low level NOTE Disabled Disabled Minimum functionality mode Airplane mode Disabled Airplane mode W_DISABLE# is a control function for airplane mode, which is disabled in software by default. It can be enabled through AT+QCFG="airplanecontrol",1. For the details of this command, please contact Quectel Technical Support. 4.11. Indication Signals Table 24: Pin Description of Indication Signals Pin Name Pin No. I/O Description Comment STATUS NET_STATUS 20 21 DO DO Indicate the module's operation status Indicate the module's network activity status If unused, keep them open. EG915Q-NA_Hardware_Design 45 / 74 LTE Standard Module Series 4.11.1. Network Status Indication The module provides one network status indication pins: the NET_STATUS for the modules network operation status indication, which can drive corresponding LEDs. Table 25: Network Status Indication Pin Level and Module Network Status Pin Name NET_STATUS Level Status Module Network Status Flicker slowly (200 ms High/1800 ms Low) Network searching NET_STATUS Flicker slowly (1800 ms High/200 ms Low) Idle Flicker quickly (125 ms High/125 ms Low) Data transmission is ongoing Module NET_STATUS 4.7K VBAT 2.2K 47K Figure 26: Reference Design of NET_STATUS Indication 4.11.2. STATUS The STATUS is used for indicating the modules operation status. It will output high level when the module is turned on. EG915Q-NA_Hardware_Design 46 / 74 LTE Standard Module Series Module STATUS 4.7K VBAT 2.2K 47K Figure 27: Reference Design of STATUS 4.11.3. MAIN_RI AT+QCFG= risignaltype, physical can be used to configure MAIN_RI behavior. No matter on which port a URC information is presented, the URC information will trigger the behavior of the MAIN_RI. For the details of AT+QCFG, please contact Quectel Technical Support. NOTE The AT+QURCCFG allows you to set the main UART, USB AT port or USB modem port as the URC information output port. The USB AT port is the URC output port by default. For more details about AT+QURCCFG, see document [2]. You can configure MAIN_RI behaviors flexibly. The default behaviors of the MAIN_RI are shown as below. Table 26: MAIN_RI Level and Module Status Module Status MAIN_RI Level Status Idle High level When a new URC information returns MAIN_RI outputs at least 120 ms low level. After the module outputs the data, the level status will then become high. Indication behavior for MAIN_RI can be configured via AT+QCFG="urc/ri/ring". EG915Q-NA_Hardware_Design 47 / 74 LTE Standard Module Series 5 RF Specifications 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. Table 27: Pin Description of Cellular Antenna Interface Pin Name Pin No. I/O Description Comment ANT_MAIN 4 60 AIO Main antenna interface 50 impedance. Table 28: Operating Frequency of EG915Q-NA (Unit: MHz) Operating Frequency Transmit LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B66 LTE-FDD B71 18501910 17101755 824849 699716 777787 788798 17101780 663698 4 ANT_MAIN only supports passive antennas. Receive 19301990 21102155 869894 729746 746756 758768 21102180 617652 EG915Q-NA_Hardware_Design 48 / 74 LTE Standard Module Series 5.1.2. Tx Power Table 29: RF Transmitting Power Frequency Bands Max. RF Output Power Min. RF Output Power LTE-FDD bands 23 dBm 2 dB

< -39 dBm 5.1.3. Rx Sensitivity Table 30: Conducted RF Receiver Sensitivity of EG915Q-NA (Unit: dBm) Frequency Bands 3GPP (SIMO) Receiver Sensitivity (Typ.) Primary LTE-FDD B2 (10 MHz)

-98 dBm LTE-FDD B4 (10 MHz)

-98.5 dBm LTE-FDD B5 (10 MHz)

-99 dBm LTE-FDD B12 (10 MHz)

-98.5 dBm LTE-FDD B13 (10 MHz)

-98.5dBm LTE-FDD B14 (10 MHz)

-98.5 dBm LTE-FDD B66 (10 MHz)

-98.5 dBm LTE-FDD B71 (10 MHz)

-98 dBm

-94.3 dBm

-96.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-93.3 dBm

-95.8 dBm

-93.5 dBm EG915Q-NA_Hardware_Design 49 / 74 5.1.4. Reference Design LTE Standard Module Series ANT_MAIN R1 0R Main Antenna C1 NM C2 NM Module Figure 28: Reference Design of Main Antenna NOTE 1. Use a -type matching circuit for the antenna interface for better cellular performance and for the ease of debugging. 2. Capacitors are not mounted by default. 3. Place the -type matching components (R1 & C1 & C2) to the antenna as close as possible. 5.2. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. EG915Q-NA_Hardware_Design 50 / 74 LTE Standard Module Series Figure 29: Microstrip Design on a 2-layer PCB Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EG915Q-NA_Hardware_Design 51 / 74 LTE Standard Module Series Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. EG915Q-NA_Hardware_Design 52 / 74 LTE Standard Module Series 5.3. Antenna Design Requirements Table 31: Requirements for Antenna Design Antenna Types Requirements LTE VSWR: 2 Efficiency: > 30 %

Gain: 1 dBi Max. input power: 50 W Input impedance: 50 Vertical polarization Cable insertion loss:

< 1 dB: LB (< 1 GHz)

< 1.5 dB: MB (12.3 GHz) 5.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 33: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. EG915Q-NA_Hardware_Design 53 / 74 LTE Standard Module Series Figure 34: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 35: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. EG915Q-NA_Hardware_Design 54 / 74 LTE Standard Module Series 6 Electrical Characteristics &

Reliability 6.1. Absolute Maximum Ratings Table 32: Absolute Maximum Ratings Parameters Voltage at VBAT_RF & VBAT_BB Voltage at USB_VBUS Voltage at digital pins Min.

-0.3

-0.3

-0.3 6.2. Power Supply Ratings Table 33: Power Supply Ratings Max. 5 5.25 2.3 Unit V V V Parameters Descriptions Conditions Min. Typ. Max. Units VBAT VBAT_BB & VBAT_RF IVBAT Peak power consumption The actual input voltages must be kept between the minimum and maximum values. At maximum power control level USB_VBUS USB connection detection

3.3 3.8 4.3 V

1.5 2 A 3.0 5.0 5.25 V EG915Q-NA_Hardware_Design 55 / 74 LTE Standard Module Series 6.3. Power Consumption Table 34: Power Consumption Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) AT+CFUN=4 (USB disconnected) Typ. 0.4 54 130 Sleep state LTE-FDD @ PF = 32 (USB disconnected) 1.24 LTE-FDD @ PF = 64 (USB disconnected) 0.68 LTE-FDD @ PF = 128 (USB disconnected) 0.41 LTE-FDD @ PF = 256 (USB disconnected) 0.3 LTE-FDD @ PF = 64 (USB disconnected) 4.55 LTE-FDD @ PF = 64 (USB connected) 28.22 Idle state LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B66 LTE-FDD B71 LTE data transfer NOTE 629 570 544 571 657 636 543 575 Units A uA uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA The power consumption data above is for reference only, which may vary among different modules. For detailed information, contact Quectel Technical Support for the power consumption test report of the specific module. EG915Q-NA_Hardware_Design 56 / 74 6.4. Digital I/O Characteristics Table 35: VDD_EXT I/O Characteristics (Unit: V) Parameters Descriptions High-level input voltage Low-level input voltage High-level output voltage 1.35 Low-level output voltage

Table 36: USIM Low-voltage I/O Characteristics (Unit: V) Parameters Descriptions High-level input voltage Low-level input voltage High-level output voltage 1.35 Low-level output voltage

Table 37: USIM High-voltage I/O Characteristics (Unit: V) Parameters Descriptions High-level input voltage Low-level input voltage

High-level output voltage 2.55 Low-level output voltage

Min. 1.2

-0.3 Min. 1.2

Min. 1.95 VIH VIL VOH VOL VIH VIL VOH VOL VIH VIL VOH VOL LTE Standard Module Series Max. 2 0.6

0.45 Max.

0.6

0.45 Max.

1.0

0.45 EG915Q-NA_Hardware_Design 57 / 74 LTE Standard Module Series 6.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 38: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %; Unit: kV) Test Points VBAT & GND Antenna interface Other interfaces Contact Discharge Air Discharge 8 5 0.5 12 10 1 6.6. Operating and Storage Temperatures Table 39: Operating and Storage Temperatures (Unit: C) Parameters Normal Operating Temperature 5 Extended Operating Temperature 6 Storage Temperature Min.

-35

-40

-40 Typ.

+25

Max.

+75

+85

+90 5 Within the operating temperature range, the module meets 3GPP specifications. 6 Within the extended temperature range, the module remains the ability to establish and maintain functions such as SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG915Q-NA_Hardware_Design 58 / 74 LTE Standard Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 36: Top and Side Dimensions (Unit: mm) EG915Q-NA_Hardware_Design 59 / 74 LTE Standard Module Series Figure 37: Bottom Dimensions (Bottom View, Unit: mm) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG915Q-NA_Hardware_Design 60 / 74 7.2. Recommended Footprint LTE Standard Module Series Figure 38: Recommended Footprint (Unit: mm)

. NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG915Q-NA_Hardware_Design 61 / 74 7.3. Top and Bottom Views LTE Standard Module Series Figure 39: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG915Q-NA_Hardware_Design 62 / 74 LTE Standard Module Series 8 Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 7 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 7 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. EG915Q-NA_Hardware_Design 63 / 74 LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.130.15 mm. For more details, see document [4]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Temp. (C) 246 235 217 200 150 100 Soak Zone A Ramp-to-soak slope:

03 C/s Reflow Zone Ramp-up slope: Cool-down slope:

03 C/s C

-30 C/s B D Figure 40: Recommended Reflow Soldering Thermal Profile EG915Q-NA_Hardware_Design 64 / 74 LTE Standard Module Series Table 40: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, never wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do not use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective wave soldering, ultrasonic soldering) that is not mentioned in document [4]. EG915Q-NA_Hardware_Design 65 / 74 LTE Standard Module Series 8.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

8.3.1. Carrier Tape Dimension details are as follow:

Figure 41: Carrier Tape Dimension Drawing Table 41: Carrier Tape Dimension Table (Unit: mm) W 44 P 32 T A0 0.35 20.2 B0 24 K0 K1 F E 3.15 6.65 20.2 1.75 EG915Q-NA_Hardware_Design 66 / 74 8.3.2. Plastic Reel LTE Standard Module Series Figure 42: Plastic Reel Dimension Drawing Table 42: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 8.3.3. Mounting Direction Figure 43: Mounting Direction EG915Q-NA_Hardware_Design 67 / 74 8.3.4. Packaging Process LTE Standard Module Series Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules. Figure 44: Packaging Process EG915Q-NA_Hardware_Design 68 / 74 LTE Standard Module Series 9 Appendix References Table 43: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_EG800Q-EU&EG915Q-NA_AT_Commands_Manual

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_SMT_Application_Note Table 44: Terms and Abbreviations Abbreviation Description 3GPP ADC bps CHAP CMUX CTS DCE 3rd Generation Partnership Project Analog-to-Digital Converter Bits Per Second Challenge Handshake Authentication Protocol Connection MUX Clear To Send Data Communications Equipment DFOTA Delta Firmware Upgrade Over the Air DL DRX DTE DTR Downlink Discontinuous Reception Data Terminal Equipment Data Terminal Ready EG915Q-NA_Hardware_Design 69 / 74 LTE Standard Module Series ESD FDD FILE FTP FTPS GRFC HB HTTP Electrostatic Discharge Frequency Division Duplex File Protocol File Transfer Protocol FTP over SSL General RF Control High Band Hypertext Transfer Protocol HTTPS Hypertext Transfer Protocol Secure I2C I/O Inter-Integrated Circuit Input/Output IMT-2000 International Mobile Telecommunications 2000 LB LED LGA LTE MB MCU MO MQTT MT NITZ NTP PAP PCB Low Band Light Emitting Diode Land Grid Array Long Term Evolution Middle Band Microcontroller Unit Mobile Originated Message Queuing Telemetry Transport Mobile Terminated Network Identity and Time Zone Network Time Protocol Password Authentication Protocol Printed Circuit Board EG915Q-NA_Hardware_Design 70 / 74 LTE Standard Module Series PCM PDA PDU PING PPP QAM Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Packet Internet Groper Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RI RF Rx SMD SMS SSL SPI TCP Tx UART UDP UL UMTS URC USB USIM VBAT VIH Ring Indicator Radio Frequency Receive Surface Mount Device Short Message Service Secure Sockets Layer Serial Peripheral Interface Transmission Control Protocol Transmit Universal Asynchronous Receiver/Transmitter User Datagram Protocol Uplink Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus Universal Subscriber Identity Module Voltage at Battery (Pin) High-level input voltage EG915Q-NA_Hardware_Design 71 / 74 LTE Standard Module Series VIL VOH VOL Vmax Vnom Vmin VILmax VRWM VSWR Low-level input voltage High-level output voltage Low-level output voltage Maximum Voltage Nominal Voltage Minimum Voltage Maximum Low-level Input Voltage Working Peak Reverse Voltage Voltage Standing Wave Ratio Product Marketing NameQuectel EG915Q-NA FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID:

XMR2023EG915QNA 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

radiation, maximum antenna gain

(including cable loss) must not exceed:

Operating Band LTE Band 2 LTE Band 4 LTE Band 5 LTE Band 12 LTE Band 13 LTE Band 14 LTE Band 66 LTE Band 71 FCC Max Antenna Gain dBi 8.00 5.00 9.41 8.70 9.16 9.23 5.00 8.48 EG915Q-NA_Hardware_Design 72 / 74 LTE Standard Module Series 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2023EG915QNA or Contains FCC ID:

XMR2023EG915QNA must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

(1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-023EG915QNA or where: 10224A-023EG915QNA is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre EG915Q-NA_Hardware_Design 73 / 74 clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-023EG915QNA " ou "o: 10224A-023EG915QNA est le numro de certification du module". LTE Standard Module Series EG915Q-NA_Hardware_Design 74 / 74

RQUECCTEL, EG915Q-NA ai-axnox Lc EG91 5QNALC-NO3-SNNSA SN!XXXXXXXXXXXKAKK IMEI: XXXXXXXXXXXKAKXX FCC ID: XMR2023EG915QNA IC: 10224A-023EG915QNA label location

Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: July 13, 2023 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID: XMR2023EG915QNA

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincerely, Name:

Email:

Jean hu .. (2) jean.hu@quectel.com. Signature:

. Rev 1/26/2023 Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: July, 2023 Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing FCC ID: XMR2023EG915QNA

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincerely, Name:

Email:

Jean hu .. (2) jean.hu@quectel.com. Signature:

. Rev 1/26/2023

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Date: July 13, 2023 Federal Communications Commission Office of Engineering and Technology Laboratory Division 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Request for Confidentiality FCC ID: XMR2023EG915QNA To Whom It May Concern, Pursuant to the provisions of Sections 0.457 and 0.459 of Commissions rules (47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure indefinitely. Schematic Diagram Block Diagram Part List Operational Description Tune-up Procedure Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In additional to above mentioned documents, pursuant to Public Notice DA 04-1705 of the Commission s policy, in order to comply with the marketing regulations in 47 CFT 2.803 and the importation rules in 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. External Photos Internal Photos Test Setup Photos User Manual It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Best Regards, ___ _ Jean hu jean.hu@quectel.com

RF_734_02 04 April 16 Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR2023EG915QNA Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. Answer from applicant Yes, please see exhibition external photos Yes, The modular has buffer modulation /data inputs 3. The modular transmitter must have its own power supply regulation. Yes, please see the schem.pdf 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. there are very strict operational and 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Yes, The requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, Please refer to the setup photo exhibition for the stand-alone configuration Yes, The Module will be label with its own FCC ID ,and the instruction on the labelling rule of the end product has been stated in the user manual of this module .please refer to the label and user manual exhibition. Yes, The required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, Please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):_ Signature:

Date:

City:

Name:

Email:

2023/7/13 .. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 Request for Class II Permissive Change FCC IDXMR2023EG915QNA Date2023-7-13 Dear Sir/Madam, Subject: FCC Class permission change for FCC ID: XMR2023EG915QNA Original Grant Date: 05/28/2023 This project is a CIIPC submission to our product: LTE Cat 1 bis Module, model: EG915Q-NA, the device is identical to the previous certified except for the changes as below:

1. Due to the addition of USIM2 support, the position of some resistors and capacitors has been adjusted, and a USIM2-related resistor has been added. 2. EG915Q-NA changes B13 DPX supplier and supports dual sim single standby mode, no other HW & SW design change excluding above changes. The test strategy reference is as follows:

Case Part 22/24/27 Remark Retested LTE Band13. Retest power and Check Worse RSE for other frequency bands Copy Part 2.1091 Thank you. Sincerely. Date:

City:

2023/7/13 .. Shanghai .. Name:

Jean hu .. (2) Email:

jean.hu@quectel.com. Signature:

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: LTE Cat 1 bis Module Type designation: EG915Q-NA Trademark:

Quectel on our behalf. Date:

City:

Name:

Email:

2023/7/13.. Shanghai.. Jean hu.. (2) jean.hu@quectel.com. Signature:

. Notes:

(1): Required for FCC application

(2): For FCC it must be the Grantee Code owner or the authorized agent.

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 Request for Class II Permissive Change FCC IDXMR2023EG915QNA Date2023-5-14 Dear Sir/Madam, Subject: FCC Class permission change for FCC ID: XMR2023EG915QNA Original Grant Date: 03/31/2023 This project is a CIIPC submission to our product: LTE Cat 1 bis Module, model: EG915Q-NA, the device is identical to the previous certified except for the changes as below:

Model name EG915Q-NA Original The product supports LTE Band14 and LTE Band 71 Software Version:

EG915QNALCR01A04M04 New Turn off LTE Band14 and Band71 from the software side Software Version:

EG915QNALCR01A05M04 Remark The hardware is exactly the same, without any changes The test strategy reference is as follows:

Case Part 22/24/27 Part 2.1091 Thank you. Sincerely. Remark Delete reports for band14 and band71 and copy other reports Delete band14 and band71 related frequency bands Date:

City:

2023/5/14 .. Shanghai .. Name:

Jean hu .. (2) Email:

jean.hu@quectel.com. Signature:

RF_734_02 04 April 16 Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR2023EG915QNA Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. Answer from applicant Yes, please see exhibition external photos Yes, The modular has buffer modulation /data inputs 3. The modular transmitter must have its own power supply regulation. Yes, please see the schem.pdf 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. there are very strict operational and 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Yes, The requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, Please refer to the setup photo exhibition for the stand-alone configuration Yes, The Module will be label with its own FCC ID ,and the instruction on the labelling rule of the end product has been stated in the user manual of this module .please refer to the label and user manual exhibition. Yes, The required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, Please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):_ Signature:

Date:

City:

Name:

Email:

2023/5/14 .. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature:

Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: March 22, 2023 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID: XMR2023EG915QNA

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincerely, Name:

Email:

Jean hu .. (2) jean.hu@quectel.com. Signature:

. Rev 1/26/2023 Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: March 22, 2023 Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing FCC ID: XMR2023EG915QNA

[Quectel Wireless Solutions Co., Ltd.] (Jean Hu) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincerely, Name:

Email:

Jean hu .. (2) jean.hu@quectel.com. Signature:

. Rev 1/26/2023

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: LTE Cat 1 bis Module Type designation: EG915Q-NA Trademark:

Quectel on our behalf. Date:

City:

Name:

Email:

2023/3/19 .. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature:

. Notes:

(1): Required for FCC application

(2): For FCC it must be the Grantee Code owner or the authorized agent.

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Date: March 19, 2023 Federal Communications Commission Office of Engineering and Technology Laboratory Division 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Request for Confidentiality FCC ID: XMR2023EG915QNA To Whom It May Concern, Pursuant to the provisions of Sections 0.457 and 0.459 of Commissions rules (47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure indefinitely. Schematic Diagram Block Diagram Part List Operational Description Tune-up Procedure Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In additional to above mentioned documents, pursuant to Public Notice DA 04-1705 of the Commission s policy, in order to comply with the marketing regulations in 47 CFT 2.803 and the importation rules in 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. External Photos Internal Photos Test Setup Photos User Manual It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Best Regards, ___ _ Jean hu jean.hu@quectel.com