FCC ID: XMR2023FCS950U WiFi & Bluetooth Module

RF Layout Application Note Rev. RF_Layout_Application_Note_2.2 Date: 2016-02-26 www.quectel.com RF Layout Application Note Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Mail: info@quectel.com Or our local office, for more information, please visit:

http://www.quectel.com/support/salesupport.aspx For technical support, to report documentation errors, please visit:

http://www.quectel.com/support/techsupport.aspx Or Email: Support@quectel.com GENERAL NOTES QUECTEL OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THIS INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL CO., LTD. TRANSMITTABLE, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THIS CONTENTS ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2016. All rights reserved. RF_Layout_Application_Note Confidential / Released 1 / 10 Quectel Confidential RF Layout Application Note About the Document History Revision Date Author Description 1.0 2.0 2.1 2011-08-08 David WEI Initial 2014-10-16 Frank WANG 1. Used the new technical document template 2. Updated RF reference schematic diagram 2015-04-11 Frank WANG Added applicable modules 2.2 2016-02-26 Frank WANG Updated the example of PCB layout in Figure 6 RF_Layout_Application_Note Confidential / Released 2 / 10 Quectel Confidential RF Layout Application Note Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Figure Index ................................................................................................................................................. 4 1 Introduction .......................................................................................................................................... 5 2 RF Reference Schematic Diagram ..................................................................................................... 6 3 Coplanar Waveguide Structure Design ............................................................................................. 7 4 Coplanar WG PCB Layout Example and Guidelines ........................................................................ 9 RF_Layout_Application_Note Confidential / Released 3 / 10 Quectel Confidential RF Layout Application Note Figure Index FIGURE 1: RF REFERENCE SCHEMATIC DIAGRAM ...................................................................................... 6 FIGURE 2: STRUCTURE OF COPLANAR WG .................................................................................................. 7 FIGURE 3: TWO LAYERS PCB LAYOUT ........................................................................................................... 8 FIGURE 4: FOUR LAYERS PCB LAYOUT (THIRD LAYER AS REFERENCE GROUND) ................................ 8 FIGURE 5: FOUR LAYERS PCB LAYOUT (FOURTH LAYER AS REFERENCE GROUND) ............................ 8 FIGURE 6: AN EXAMPLE OF PCB LAYOUT...................................................................................................... 9 RF_Layout_Application_Note Confidential / Released 4 / 10 Quectel Confidential RF Layout Application Note 1 Introduction The aim of this document is to offer some design rules for RF PCB layout, which will be helpful for achieving good RF performance and minimizing design period. This document is applicable to all Quectel GSM, WCDMA and LTE modules. RF_Layout_Application_Note Confidential / Released 5 / 10 Quectel Confidential RF Layout Application Note 2 RF Reference Schematic Diagram Figure 1: RF Reference Schematic Diagram C1, R1 and C2 form a PI type matching circuit which is reserved for antenna optimization. By default, R1 is 0ohm while C1 and C2 are both Not Mounted (NM). RF_Layout_Application_Note Confidential / Released 6 / 10 Quectel Confidential RF Layout Application Note 3 Coplanar Waveguide Structure Design The recommended coplanar waveguide structure is shown as Figure 2. Figure 2: Structure of Coplanar WG The factors which influence impedance include dielectric constant (usually 4.2~4.6, here is 4.4), dielectric height (H), RF trace width (W), the space between RF trace, the ground (S) and copper thickness (T). When T=0.035mm, the recommended value of W and S for 50 ohm coplanar WG under different PCB structure is listed in Table 1. Table 1: Recommended Value of W and S for 50 ohm Coplanar WG under Different PCB Structure Dielectric Height (H) RF Trace Width (W) Space between RF Trace and the Ground (S) 0.076mm 0.1mm 0.15mm 0.1188mm 0.1623mm 0.24mm 0.15mm 0.2mm 0.2mm RF_Layout_Application_Note Confidential / Released 7 / 10 Quectel Confidential RF Layout Application Note 0.8mm 1.0mm 1.2mm 1.6mm 2mm 0.8mm 0.8mm 0.8mm 0.8mm 0.8mm 0.18mm 0.17mm 0.16mm 0.15mm 0.14mm If there are two layers, the TOP layer is the signal layer, and the BOTTOM layer is the reference ground, as shown in Figure 3. If there are 4 layers, the reference ground could be the second layer, the third layer or the fourth layer. If third layer is chosen, the second layer should be kept out and the width of keepout area should be at least five times of the trace width, as shown in Figure 4. If the fourth layer is chosen, both the second and third layer should be kept out and the width of keepout area should be at least five times of the trace width, as shown in Figure 5. Same as 6 or more layers. Figure 3: Two Layers PCB Layout Figure 4: Four Layers PCB Layout (Third Layer as Reference Ground) Figure 5: Four Layers PCB Layout (Fourth Layer as Reference Ground) RF_Layout_Application_Note Confidential / Released 8 / 10 Quectel Confidential RF Layout Application Note 4 Coplanar WG PCB Layout Example and Guidelines Figure 6: An example of PCB layout There are 6 guidelines should be taken into account, as marked in the above figure:

1. Control corresponding W and S of 50 ohm coplanar waveguide. Use the common PCB as FR4 medium (dielectric constant is 4.2) and take copper clad of 35 um thickness as an example. Values of W and S for 50 ohm coplanar WG under different PCB structure is shown as Table 1. Keep in mind to remind PCB manufacturers to keep the accuracy of W and S. 2. Do not hot sealing the PIN in this position and make it contacted with the ground closely enough. 3. Keep out pouring copper in the surface layer and reduce parasitic effect. The RF trace line should be as short as possible. It will be better for RF trace line to avoid vertical angle layout. The RF trace line should be kept 135 degree angle around the corner. RF_Layout_Application_Note Confidential / Released 9 / 10 Quectel Confidential RF Layout Application Note 4. Keep a certain distance between signal pad and ground when packaging the device. Refer to Figure 6. If the signal pad is in SMD type, pouring copper on the corresponding signal pad. 5. Ensure the corresponding reference ground of RF trace line is integrated and do not forget to add more ground via to help RF reflow. The ground and RF trace should be kept at least two times of the trace width. Guarantee the contact area which is in the same layer with RF trace is as large as possible and its corresponding reference ground in the opposite layer is as integrated as possible, meanwhile ensure the two layer ground is connected by amount of ground hole. 6. Three components consist of PI type matching circuit shown as Figure 6. Place the pad to antenna as close as possible, as shown in Figure 6. If the distance between SMA and RF PIN is too short to place the three pin of PI type matching circuit, PI type matching circuit can be changed into L matching circuit. RF_Layout_Application_Note Confidential / Released 10 / 10 Quectel Confidential

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6335652.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case FCS950U Hardware Design Wi-Fi&Bluetooth Module Series Version: 0.3 Date: 2022-11-29 Status: Draft Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-

exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. FCS950U_Hardware_Design 1 / 46 Wi-Fi&Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. FCS950U_Hardware_Design 2 / 46 Wi-Fi&Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. FCS950U_Hardware_Design 3 / 46 Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description

0.1 0.2 0.3 2022-09-30 Arrow HUANG Creation of the document 2022-09-30 Arrow HUANG Draft 2022-11-15 Arrow Huang 2022-11-29 Arrow Huang Update Update FCS950U_Hardware_Design 4 / 46 Wi-Fi&Bluetooth Module Series Contents Safety Information ...................................................................................................................................... 3 About the Document .................................................................................................................................. 4 Contents ...................................................................................................................................................... 5 Table Index .................................................................................................................................................. 7 Figure Index ................................................................................................................................................ 8 Introduction ......................................................................................................................................... 9 Special Marks ............................................................................................................................. 9 Product Overview ............................................................................................................................. 10 General Description ................................................................................................................. 10 Key Features ............................................................................................................................ 10 EVB Kit ..................................................................................................................................... 11 Application Interfaces ...................................................................................................................... 13 General Description ................................................................................................................. 13 Pin Assignment ........................................................................................................................ 14 Pin Description ......................................................................................................................... 15 Power Supply ........................................................................................................................... 17 3.4.1. Power Supply Pins Introduction.................................................................................... 17 Wi-Fi Application Interface ....................................................................................................... 18 3.5.1. SDIO Interface .............................................................................................................. 19 3.5.2. WLAN_WAKE ............................................................................................................... 20 Bluetooth Application Interfaces .............................................................................................. 21 3.6.1. Bluetooth UART ............................................................................................................ 21 3.6.2. BT_WAKE_HOST ......................................................................................................... 22 3.6.3. PCM Interface ............................................................................................................... 22 Other Interfaces ....................................................................................................................... 23 3.7.1. CHIP_EN ...................................................................................................................... 23 3.7.2. Coexistence UART* ...................................................................................................... 23 RF Antenna Interface ............................................................................................................... 24 3.8.1. Operating Frequency .................................................................................................... 24 3.8.2. Pin Definition of RF Antenna Interface ......................................................................... 24 3.8.3. Reference Design ......................................................................................................... 24 3.8.4. RF Routing Guidelines .................................................................................................. 25 3.8.5. Antenna Design Requirements ..................................................................................... 27 3.8.6. RF Connector Recommendation .................................................................................. 27 Electrical Characteristics & Reliability ........................................................................................... 30 Absolute Maximum Ratings ..................................................................................................... 30 Digital I/O Characteristics ........................................................................................................ 30 FCS950U_Hardware_Design 5 / 46 Wi-Fi&Bluetooth Module Series RF Performances ..................................................................................................................... 31 4.3.1. Wi-Fi Performance ........................................................................................................ 31 4.3.2. BLE Performance ......................................................................................................... 32 Operating and Storage Temperatures ..................................................................................... 32 Mechanical Information .................................................................................................................... 33 Mechanical Dimensions ........................................................................................................... 33 Recommended Footprint ......................................................................................................... 35 Storage, Manufacturing & Packaging ............................................................................................. 36 Storage Conditions................................................................................................................... 36 Manufacturing and Soldering ................................................................................................... 37 Notification ............................................................................................................................... 39 6.3.1. Coating .......................................................................................................................... 39 6.3.2. Cleaning ........................................................................................................................ 39 Packaging Specifications ......................................................................................................... 39 6.4.1. Carrier Tape .................................................................................................................. 39 6.4.2. Plastic Reel ................................................................................................................... 40 6.4.3. Packaging Process ....................................................................................................... 41 Appendix References ....................................................................................................................... 42 FCS950U_Hardware_Design 6 / 46 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Marks ................................................................................................................................. 9 Table 2: Key Features ................................................................................................................................ 10 Table 3: I/O Parameters Definition ............................................................................................................. 15 Table 4: Pin Description ............................................................................................................................. 15 Table 5: Definition of Power Supply and GND Pins................................................................................... 17 Table 6: Pin Definition of SDIO Interface ................................................................................................... 19 Table 7: Pin Definition of WLAN_WAKE .................................................................................................... 20 Table 8: Pin Definition of Bluetooth UART ................................................................................................. 21 Table 9: Pin Definition of BT_WAKEUP_HOST ........................................................................................ 22 Table 10: Pin Definition of PCM Interface .................................................................................................. 22 Table 11: Pin Definition of CHIP_EN ......................................................................................................... 23 Table 12: FCS950U Operating Frequency (Unit: GHz) ............................................................................. 24 Table 13: Pin Definition of RF Antenna Interfaces..................................................................................... 24 Table 14: Antenna Requirements .............................................................................................................. 27 Table 15: Absolute Maximum Ratings (Unit: V) ......................................................................................... 30 Table 16: Recommended Operating Conditions (Unit: V) ......................................................................... 30 Table 17: Digital I/O Characteristics .......................................................................................................... 30 Table 18: Conducted RF Output Power at 2.4 GHz .................................................................................. 31 Table 19: Conducted RF Output Power at 5 GHz ..................................................................................... 31 Table 20: BLE Transmitting Power ............................................................................................................. 32 Table 21: Operating and Storage Temperatures (Unit: C) ....................................................................... 32 Table 22: Recommended Thermal Profile Parameters ............................................................................. 38 Table 23: Carrier Tape Dimension Table (Unit: mm) ................................................................................. 40 Table 24: Plastic Reel Dimension Table (Unit: mm) .................................................................................. 40 Table 25: Related Documents .................................................................................................................... 42 Table 26: Terms and Abbreviations ........................................................................................................... 42 FCS950U_Hardware_Design 7 / 46 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Pin Assignment (Top View) ........................................................................................................ 14 Figure 2: Reference Circuit for VBAT ........................................................................................................ 18 Figure 3: Timing of Power up/down ........................................................................................................... 18 Figure 4: Wi-Fi Application Interface Connection ...................................................................................... 19 Figure 5: SDIO Interface Connection ......................................................................................................... 20 Figure 6: Bluetooth Application Interfaces Connection .............................................................................. 21 Figure 7: Reference Design for UART Interface Connection .................................................................... 22 Figure 8: PCM Interface Connection .......................................................................................................... 23 Figure 9: Reference Circuit for RF Antenna Interface ............................................................................... 25 Figure 10: Microstrip Design on a 2-layer PCB ......................................................................................... 25 Figure 11: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 26 Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 26 Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 26 Figure 14: Dimensions of the Receptacle (Unit: mm) ................................................................................ 28 Figure 15: Specifications of Mated Plugs .................................................................................................. 29 Figure 16: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 29 Figure 17: Top and Side Dimensions ......................................................................................................... 33 Figure 18: Bottom Dimension (Top View) .................................................................................................. 34 Figure 19: Recommended Footprint (Top View) ........................................................................................ 35 Figure 20: Recommended Reflow Soldering Thermal Profile ................................................................... 37 Figure 21: Carrier Tape Dimension Drawing ......................................................................................... 39 Figure 22: Plastic Reel Dimension Drawing .......................................................................................... 40 Figure 23: Packaging Process ................................................................................................................... 41 FCS950U_Hardware_Design 8 / 46 Wi-Fi&Bluetooth Module Series Introduction This document defines the FCS950U and describes its air interface and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to designFCS950U and set up mobile applications with the module. Special Marks Table 1: Special Marks Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. FCS950U_Hardware_Design 9 / 46 Wi-Fi&Bluetooth Module Series Product Overview General Description The FCS950U is a low-power and cost-effective Wi-Fi & Bluetooth module that supports the 1 1 IEEE 802.11a/b/g/n/ac WLAN standard and Bluetooth 5.0 standard protocols, and it provides a low-power SDIO 3.0 interface for Wi-Fi, UART and PCM interfaces for Bluetooth. FCS950U is a patch module with 44 LCC pins. The module package is compact in only 12.0 mm 12.0 mm 2.45 mm. Key Features The following table describes the key features of FCS950U. Table 2: Key Features Features Description Power Supply Wi-Fi Transmission Data Rates VBAT power supply:

Supply voltage range: 3.23.4 V Typical supply voltage: 3.3 V VIO power supply:

Supply voltage range: 1.71.98 V Typical supply voltage: 1.8 V 2.4 GHz:

802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) 5 GHz:

802.11a: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 07), HT40 (MCS 07) FCS950U_Hardware_Design 10 / 46 Wi-Fi&Bluetooth Module Series 802.11ac: VHT20 (MCS 08), VHT40 (MCS 09), VHT80 (MCS 09) Wi-Fi Protocol IEEE 802.11a/b/g/n/ac Wi-Fi Modulation Modes DBPSK, DQPSK, CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM Wi-Fi Operating Modes STA Bluetooth Operating Modes BR + EDR BLE Bluetooth Modulation Modes GFSK, /4-DQPSK, 8-DPSK Wi-Fi Application Interface SDIO 3.0 Bluetooth Application Interface UART and PCM RF Antenna Interface ANT_WIFI0/BT 50 impedance Physical Characteristics Temperature Range Size: (12.0 0.15) mm (12.0 0.15) mm (2.45 0.2) mm Package: LCC Weight: TBD Operating temperature range: -40C to +85 C 1 Storage temperature range: -40 C to +95 C RoHS All hardware components are fully compliant with EU RoHS directive EVB Kit 1 Within the operating temperature range, the modules related performance meets IEEE and Bluetooth specifications. FCS950U_Hardware_Design 11 / 46 Wi-Fi&Bluetooth Module Series To help you develop applications with the module, Quectel supplies an evaluation board (FCS950U-M.2) with accessories to control or test the module FCS950U FCS950U_Hardware_Design 12 / 46 Wi-Fi&Bluetooth Module Series Application Interfaces General Description FCS950U is equipped with 44 LCC pins. The following interfaces are described in detail in subsequent chapters:

Power supply Wi-Fi application interface

- SDIO interface

- WLAN_WAKE Bluetooth application interfaces

- Bluetooth UART

- BT_WAKE_HOST

- PCM interface RF antenna interface

- ANT_WIFI0/BT Other interfaces

- CHIP_EN

- COEX_RXD

- COEX_TXD FCS950U_Hardware_Design 13 / 46 Wi-Fi&Bluetooth Module Series Pin Assignment Figure 1: Pin Assignment (Top View) NOTE Keep all RESERVED pins open. FCS950U_Hardware_Design 14 / 46 SDIO_DATA3PCM_SYNCRESERVEDPCM_DINCOEX_TXD RESERVEDPCM_DOUTPCM_CLKRESERVEDSDIO_DATA1GNDRESERVEDCHIP_ENWLAN_WAKESDIO_DATA2151718161920212213141211109768543212324252728262930313233SDIO_DATA0SDIO_CLKSDIO_CMDVIOGNDGNDRESERVED4139384037363534434244RESERVEDRESERVEDGNDRESERVEDGPIO2GPIO3BT_CTSGPIO1BT_TXDBT_RTSBT_RXDGNDGNDANT_WIFI0/BTCOEX_RXD RESERVEDRESERVEDBT_WAKE_HOSTRESERVEDVBATRESERVEDRESERVEDFCS950UGND PowerWLANBluetoothRFOthers signalsRESERVEDGPIO Wi-Fi&Bluetooth Module Series Pin Description The following tables show the pin description of FCS950U. Table 3: I/O Parameters Definition Type AIO DI DO DIO PI Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description Comment VBAT VIO GND 9 22 PI PI 1, 3, 20, 31, 33, 36 Wi-Fi Application Interface Power supply for the module It must be provided with sufficient current up to 1.0 A. Power supply for modules I/O pins VIO only supports 1.8 V. Pin Name Pin No. I/O Description Comment WLAN_WAKE 13 DO Wake up the host by an external Wi-Fi module VIO power domain. Active high. SDIO_DATA2 14 DIO SDIO data bit 2/NC VIO power domain. Need to be pulled up to 1.8 V via external 10 k resistors. SDIO_DATA3 15 DIO SDIO data bit 3/NC VIO power domain. FCS950U_Hardware_Design 15 / 46 Wi-Fi&Bluetooth Module Series SDIO_CMD SDIO_CLK SDIO_DATA0 SDIO_DATA1 16 17 18 19 DIO SDIO command DI SDIO clock DIO SDIO data bit 0 DIO SDIO data bit 1/IRQ Bluetooth Application Interface Pin Name Pin No. I/O Description Comment BT_WAKE_HOST 7 DO Bluetooth wake up the host PCM_DOUT PCM_CLK PCM_DIN PCM_SYNC BT_RTS BT_TXD BT_RXD BT_CTS 25 26 27 28 41 42 43 44 RF Antenna Interfaces DO PCM data output DI DI DI DO PCM clock PCM data input PCM data frame sync Bluetooth UART request to send DO Bluetooth UART transmit DI DI Bluetooth UART receive Bluetooth UART clear to send VIO power domain. If unused, keep them open. Pin Name Pin No. I/O Description Comment ANT_WIFI0/BT 2 AIO Wi-Fi0/Bluetooth antenna interface 50 impedance. Other Interface Pin Name Pin No. I/O Description Comment CHIP_EN 12 COEX_RXD*

4 DI DI COEX_TXD*

29 DO RESERVED Module enable pin LTE & Wi-Fi/Bluetooth coexistence receive LTE & Wi-Fi/Bluetooth coexistence transmit VIO power domain. High level by default. VIO power domain. VIO power domain. FCS950U_Hardware_Design 16 / 46 Wi-Fi&Bluetooth Module Series Pin Name Pin No. Comment RESERVED 5, 6, 8, 10, 11, 21, 23, 24, 30, 32, 34, 35, 37 Keep them open. GPIO Pin Name Pin No. I/O Description Comment GPIO3 GPIO2 GPIO1 38 39 40 DIO DIO DIO RFCTL, Boot mode selection Keep them open. Power Supply 3.4.1. Power Supply Pins Introduction The following table shows the power supply pins and ground pins of FCS950U. Table 5: Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT 9 Power supply for the module 3.2 3.3 3.4 V VIO 22 Power supply for modules I/O pins 1.7 1.8 1.98 V GND 1, 3, 20, 31, 33, 36 Ground The FCS950U is powered by VBAT. It is recommended to use a power chip with a maximum output current of more than 1.0 A. The reference circuit of VBAT input terminal is as shown in the figure below:

FCS950U_Hardware_Design 17 / 46 Wi-Fi&Bluetooth Module Series The time sequences of FCS950U power up and down is shown in the below:

Figure 2: Reference Circuit for VBAT Figure 3: Timing of Power up/down Wi-Fi Application Interface The following figure shows the Wi-Fi application interface connection between FCS950U and the host. FCS950U_Hardware_Design 18 / 46 TPS630242L1L1L2L2VINVINVINVINAGNDENVOUTVOUTVOUTPFM/PWMFBPGNDD2D3E1E2E3E4C4D1B1A1L1L2PGNDPGNDU402D4B2B3A2A3A4B4C1C2C3C406R408C40510 F1ML4011 HR407100K22 FEN_CTRLDC_5VDC_5VVDD_3V3VDD_3V3 0 sModule StatusRunningCHIP_ENPower upPower down 0 sVIO 0 s Wi-Fi&Bluetooth Module Series Figure 4: Wi-Fi Application Interface Connection 3.5.1. SDIO Interface FCS950U SDIO interface definition is as follows:

Table 6: Pin Definition of SDIO Interface Pin Name Pin No. I/O Description Comment SDIO_DATA3 15 DIO SDIO data bit 3/NC VIO power domain. SDIO_DATA2 14 DIO SDIO data bit 2/NC SDIO_DATA1 SDIO_DATA0 SDIO_CLK SDIO_CMD 19 18 17 16 DIO SDIO data bit 1/IRQ DIO SDIO data bit 0 DI SDIO clock DIO SDIO command VIO power domain. Need to pull up to 1.8 V via external 10 k resistors. VIO power domain. The following figure shows the SDIO interface connection between FCS950U and the host. FCS950U_Hardware_Design 19 / 46 HostFCS950USDIOWALN_WAKEWLAN_WAKESDIO Wi-Fi&Bluetooth Module Series Figure 5: SDIO Interface Connection To ensure that the interface design complies with the SDIO 3.0 specification, the following principles are recommended to be adopted:

Route the SDIO traces in inner-layer of the PCB and the impedance is controlled at 50 10 %. SDIO signals need to be keep away from sensitive signals, such as radio frequency, analog signals, clocks, and DC-DC noise signals. SDIO signal traces (SDIO_CLK and SDIO_DATA[0:3]/SDIO_CMD) need to be treated with equal length (the distance between the traces is less than 1 mm). The distance between SDIO signals and other signals must be greater than twice the line width, and the bus load capacitance must be less than 15 pF. The maximum length of the internal wiring of the SDIO module is 7.99 mm. 3.5.2. WLAN_WAKE WLAN_WAKE is used to wake up the host. Table 7: Pin Definition of WLAN_WAKE Pin Name Pin No. I/O Description Comment WLAN_WAKE 13 DO Wake up the host by an external Wi-Fi module VIO power domain. Active high. FCS950U_Hardware_Design 20 / 46 SDIO_CLKSDIO_CMDSDIO_DATA0SDIO_DATA1SDIO_DATA2SDIO_DATA3HostFC950USSDIO_DATA0SDIO_DATA1SDIO_DATA2SDIO_DATA3SDIO_CLKSDIO_CMD10KVIONM_10KNM_10KNM_10KNM_10KNMNMNMNMNMNMNM_10K Wi-Fi&Bluetooth Module Series Bluetooth Application Interfaces The following figure shows the block diagram of Bluetooth application interface connection between FCS950U and the host. Figure 6: Bluetooth Application Interfaces Connection 3.6.1. Bluetooth UART The FCS950U supports Host Controller Interface (HCI) UART defined by Bluetooth. The UART supports hardware flow control, and it is used for data transmission with host. It supports up to 4 Mbps baud rates. Table 8: Pin Definition of Bluetooth UART Pin Name Pin No. I/O Description Comment BT_RTS BT_TXD BT_RXD BT_CTS 41 42 43 44 DO Bluetooth UART request to send DO Bluetooth UART transmit DI DI Bluetooth UART receive Bluetooth UART clear to send VIO power domain. If unused, keep them open. The following figure shows a reference design for UART interface connection between FCS950U and the host. FCS950U_Hardware_Design 21 / 46 PCMUARTFCS950UUART PCM HostInterrupt GPIO1BT_WAKE_HOST Wi-Fi&Bluetooth Module Series Figure 7: Reference Design for UART Interface Connection NOTE Please note that the module CTS is connected to the host CTS, and the module RTS is connected to the host RTS. 3.6.2. BT_WAKE_HOST BT_WAKE_HOST are used to wake up Bluetooth function. Table 9: Pin Definition of BT_WAKEUP_HOST Pin Name Pin No. I/O Description Comment BT_WAKE_HOST 7 DO Bluetooth wake up the host VIO power domain. If unused, keep them open. 3.6.3. PCM Interface PCM interface is used for audio over Bluetooth. The following table shows the pin definition of PCM interface. Table 10: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_DOUT PCM_CLK 25 26 DO PCM data output DI PCM clock VIO power domain. If unused, keep them open. FCS950U_Hardware_Design 22 / 46 BT_CTSBT_RTSBT_RXDBT_TXDFCS950UUART_RXDUART_TXDUART_CTSUART_RTSHost Wi-Fi&Bluetooth Module Series PCM_DIN PCM_SYNC 27 28 DI DI PCM data input PCM data frame sync The following figure shows the PCM interface connection between FCS950U and the host. Figure 8: PCM Interface Connection Other Interfaces 3.7.1. CHIP_EN The module is enabled by CHIP_EN. Table 11: Pin Definition of CHIP_EN Pin Name Pin No. I/O Description Comment CHIP_EN 12 DI Module enable pin VIO power domain. High level by default. 3.7.2. Coexistence UART*

The following table shows the pin definition of FCS950Us coexistence UART. Table 1: Pin Definition of Coexistence UART Pin Name Pin No. I/O Description Comment FCS950U_Hardware_Design 23 / 46 PCM_CLKPCM_INPCM_SYNCPCM_OUTFCS950UPCM_INPCM_SYNCPCM_OUTPCM_CLKHost Wi-Fi&Bluetooth Module Series COEX_RXD COEX_TXD 4 29 DO DI LTE & Wi-Fi/Bluetooth coexistence receive LTE & Wi-Fi/Bluetooth coexistence transmit VIO power domain. RF Antenna Interface ANT_WIFI0/BT is the RF antenna pin, and the RF port requires 50 impedance. 3.8.1. Operating Frequency The operating frequency of FCS950U is shown in the following. Table 12: FCS950U Operating Frequency (Unit: GHz) Feature 2.4 GHz Wi-Fi 5 GHz Wi-Fi BLE 5.0 Frequency 2.4002.4835 5.1505.850 2.4022.480 3.8.2. Pin Definition of RF Antenna Interface Pin definitions of the antenna interface are shown in the following table:

Table 13: Pin Definition of RF Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_WIFI0/BT 2 AIO Wi-Fi0/Bluetooth antenna interface 50 impedance. 3.8.3. Reference Design FCS950U module provides an RF antenna pin for Wi-Fi/Bluetooth antenna connection. The RF trace in host PCB connected to the modules RF antenna pin should be microstrip line or other types of RF trace, with characteristic impendence close to 50 . FCS950U module comes with grounding pins which are next to the antenna pin to give a better grounding. FCS950U_Hardware_Design 24 / 46 Wi-Fi&Bluetooth Module Series A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a -type matching circuit for better RF performance. R1/C1/C2 shall be placed as close to the antenna as possible. Capacitors (C1/C2) are not mounted by default. Figure 9: Reference Circuit for RF Antenna Interface When using the PCB antenna on the module, place the module near the PCB of the mainboard. Ensure that the distance between the PCB of the mainboard and other metal components, connectors, PCB via holes, cabling, and copper coating is at least 16 mm. Ensure that all layers of the PCB area of the mainboard under the PCB antenna are cleared. 3.8.4. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 10: Microstrip Design on a 2-layer PCB FCS950U_Hardware_Design 25 / 46 ANT_WIFI0/BTR1 C1NMC2NMFCS950U0R Wi-Fi&Bluetooth Module Series Figure 11: Coplanar Waveguide Design on a 2-layer PCB Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. FCS950U_Hardware_Design 26 / 46 Wi-Fi&Bluetooth Module Series There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [1]. 3.8.5. Antenna Design Requirements The antenna design requirements are as follows:

Table 14: Antenna Requirements Type Requirements Frequency Range VSWR Gain (dBi) Max Input Power (W) Input Impedance () 2.4002.4835 GHz (cable insertion loss < 1 dB) 5.1505.850 GHz (cable insertion loss < 1 dB) 2 (recommended) 1 (Typ) 50 50 Polarization Type Vertical 3.8.6. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. FCS950U_Hardware_Design 27 / 46 Wi-Fi&Bluetooth Module Series Figure 14: Dimensions of the Receptacle (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. FCS950U_Hardware_Design 28 / 46 Wi-Fi&Bluetooth Module Series Figure 15: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 16: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FCS950U_Hardware_Design 29 / 46 Wi-Fi&Bluetooth Module Series Electrical Characteristics & Reliability FCS950U Absolute Maximum Ratings Table 15: Absolute Maximum Ratings (Unit: V) Parameter VBAT Digital I/O Input Voltage Min.

-0.3

-0.3 Max. 3.6 1.98 The following table shows the recommended operating conditions of the module. Table 16: Recommended Operating Conditions (Unit: V) Parameter VBAT VIO Min. 3.2 1.7 Typ. 3.3 1.8 Max. 3.4 1.98 Digital I/O Characteristics Table 17: Digital I/O Characteristics Symbol Parameter Min. Max. Unit VIH VIL VOH VOL IiL High-level input voltage 0.7 VIO VIO + 0.2 Low-level input voltage

-0.3 0.3 VIO High-level output voltage 0.9 VIO VIO Low-level output voltage Input leakage current 0

-5 0.1 VIO 5 V V V V A FCS950U_Hardware_Design 30 / 46 Wi-Fi&Bluetooth Module Series RF Performances 4.3.1. Wi-Fi Performance Table 18: Conducted RF Output Power at 2.4 GHz Standard 802.11b 802.11b 802.11g 802.11g 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 Data Rate Typ. (dBm) 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7 19 17 18.5 15 18.5 14.5 18.5 14.5 Table 19: Conducted RF Output Power at 5 GHz Standard 802.11a 802.11a 802.11n, HT20 802.11n, HT20 802.11n, HT40 802.11n, HT40 802.11ac, VHT20 802.11ac, VHT20 802.11ac, VHT40 802.11ac, VHT40 Data Rate Typ. (dBm) 6 Mbps 54 Mbps MCS 0 MCS 7 MCS 0 MCS 7 MCS 0 MCS 8 MCS 0 MCS 9 18.5 15 17.5 14 17.5 14 17.5 14 17.5 13 FCS950U_Hardware_Design 31 / 46 Wi-Fi&Bluetooth Module Series 802.11ac, VHT80 802.11ac, VHT80 MCS 0 MCS 9 17.5 13 4.3.2. BLE Performance The following table shows the BLE transmitting of FCS950U module. Table 20: BLE Transmitting Power Channel Transmitting Power 0 19 39 8 dBm 8 dBm 8 dBm Operating and Storage Temperatures Table 21: Operating and Storage Temperatures (Unit: C) Parameter Operating temperature range 2 Storage temperature range Min.

-40

-40 Typ.

+25

Max.

+85

+95 2 Within this temperature range, the modules related indicators can meet IEEE and Bluetooth specifications. FCS950U_Hardware_Design 32 / 46 Wi-Fi&Bluetooth Module Series Mechanical Information This chapter describes the mechanical dimensions of FCS950U. All dimensions are measured in millimeter

(mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. Mechanical Dimensions Figure 17: Top and Side Dimensions FCS950U_Hardware_Design 33 / 46 TOPSidePin 1 Wi-Fi&Bluetooth Module Series Figure 18: Bottom Dimension (Top View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FCS950U_Hardware_Design 34 / 46 BottomPin 1 Wi-Fi&Bluetooth Module Series Recommended Footprint Figure 19: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCS950U_Hardware_Design 35 / 46 Wi-Fi&Bluetooth Module Series Storage, Manufacturing & Packaging Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. FCS950U_Hardware_Design 36 / 46 Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [2]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 20: Recommended Reflow Soldering Thermal Profile FCS950U_Hardware_Design 37 / 46 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Ramp-to-soak slope: 03 C/s Cool-down slope: -30 C/s Ramp-up slope: 03 C/s Wi-Fi&Bluetooth Module Series Table 22: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. FCS950U_Hardware_Design 38 / 46 Wi-Fi&Bluetooth Module Series Notification Please follow the principles below in the module application. 6.3.1. Coating If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 6.3.2. Cleaning Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

6.4.1. Carrier Tape Dimension details are as follow:

Figure 21: Carrier Tape Dimension Drawing FCS950U_Hardware_Design 39 / 46 Wi-Fi&Bluetooth Module Series Table 23: Carrier Tape Dimension Table (Unit: mm) W 24 P 16 T A0 B0 0.35 12.4 12.4 K0 2.6 K1 3.6 F E 11.5 1.75 6.4.2. Plastic Reel Figure 22: Plastic Reel Dimension Drawing Table 24: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 24.5 FCS950U_Hardware_Design 40 / 46 Wi-Fi&Bluetooth Module Series 6.4.3. Packaging Process Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton and seal it. 1 carton can pack 2000 modules. Figure 23: Packaging Process FCS950U_Hardware_Design 41 / 46 Wi-Fi&Bluetooth Module Series Appendix References Table 25: Related Documents Document Name

[1] Quectel_RF_Layout_Application_Note

[2] Quectel_Module_Secondary_SMT_Application_Note Table 26: Terms and Abbreviations Abbreviation Description AP BLE BPSK BT CCK CTS DQPSK GATT GND HT IEEE IiL I/O Access Point Bluetooth Low Energy Binary Phase Shift Keying Bluetooth Complementary Code Keying Clear To Send Differential Quadrature Reference Phase Shift Keying Generic Attribute Profile Ground High Throughput Institute of Electrical and Electronics Engineers Input Leakage Current Input/Output FCS950U_Hardware_Design 42 / 46 Wi-Fi&Bluetooth Module Series Mbps QAM QPSK RF RoHS STA RTS RXD TBD TXD UART USB VIH VIL Vmax Vmin VOH VOL Vnom VSWR Million Bits Per Second Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Station Request to Send Receive Data To Be Determined Transmit Data Universal Asynchronous Receiver/Transmitter Universal Serial Bus High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Minimum High-level Output Voltage Low-level Output Voltage Normal Voltage Voltage Standing Wave Ratio FCS950U_Hardware_Design 43 / 46 Wi-Fi&Bluetooth Module Series FCC OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change antenna trace design. In this case, a Class II permissive change application is required to be filed by the Quectel, or the host manufacturer can take responsibility through the change in FCC ID (new procedure followed by a Class II permissive change application. the application) End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2023FCS950U Contains IC: 10224A-2023FCS950U The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for FCS950U_Hardware_Design 44 / 46 Wi-Fi&Bluetooth Module Series operation. Antenna type 2.4GHz band 5.2GHz band 5.3GHz band 5.5GHz band 5.8GHz band Peak Gain (dBi) Peak Gain (dBi) Peak Gain (dBi) Peak Gain (dBi) Peak Gain (dBi) Dipole 0.73 1.14 1.00 0.60 0.95 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 15.247 and 15.407 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed FCS950U_Hardware_Design 45 / 46 Wi-Fi&Bluetooth Module Series on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body. FCS950U_Hardware_Design 46 / 46 Wi-Fi&Bluetooth Module Series IC Industry Canada Statement This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."

Radiation Exposure Statement This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz) The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology. The device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

The maximum antenna gain permitted for devices in the bands 52505350 MHz and 54705725 MHz shall comply with the e.i.r.p. limit; and The maximum antenna gain permitted for devices in the band 57255825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate. L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations transmettre ou de panne oprationnelle. Notez que ceci n'est pas destin interdire la transmission d'informations de contrle ou de signalisation ou l'utilisation de codes rptitifs lorsque cela est requis par FCS950U_Hardware_Design 47 / 46 Wi-Fi&Bluetooth Module Series la technologie. Le dispositif utilis dans la bande 5150-5250 MHz est rserv une utilisation en intrieur afin de rduire le risque de brouillage prjudiciable aux systmes mobiles par satellite dans le mme canal;

Le gain d'antenne maximal autoris pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit tre conforme la norme e.r.p. limite; et Le gain d'antenne maximal autoris pour les appareils de la bande 5725-5825 MHz doit tre conforme la norme e.i.r.p. les limites spcifies pour un fonctionnement point point et non point point, selon le cas. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-

evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada FCS950U_Hardware_Design 48 / 46 Wi-Fi&Bluetooth Module Series n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 10224A-2023FCS950U. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-

2023FCS950U". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. CE Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [FCS950U] is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm The device could be used with a separation distance of 20cm to the human body. The device is restricted to indoor use only when operating in the 5250-5350 MHz frequency range. FCS950U_Hardware_Design 49 / 46